CN113986042A - Electronic equipment and interaction method and device thereof - Google Patents
Electronic equipment and interaction method and device thereof Download PDFInfo
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- CN113986042A CN113986042A CN202111259470.6A CN202111259470A CN113986042A CN 113986042 A CN113986042 A CN 113986042A CN 202111259470 A CN202111259470 A CN 202111259470A CN 113986042 A CN113986042 A CN 113986042A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
- G06F3/04144—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position using an array of force sensing means
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Abstract
The application discloses an electronic device and an interaction method and device thereof, wherein the electronic device comprises: the shell comprises a front cover, a rear cover and a frame body arranged between the front cover and the rear cover; a sensor array disposed within the housing; the mainboard is arranged in the shell and is electrically connected with the sensor array through a flexible circuit board; when the sensor array collects pressure information, the mainboard receives the pressure information and generates a corresponding preset instruction according to the pressure information, wherein the pressure information comprises the stress size and the position information of the sensor array.
Description
Technical Field
The application belongs to the technical field of interaction of electronic equipment, and particularly relates to electronic equipment and an interaction method and device thereof.
Background
In the related art, the interaction modes of the electronic device such as the smart terminal are limited to touch, slide, and physical keys, that is, the physical interface for interaction of the smart terminal is limited to the screen and the physical keys.
The existing intelligent terminal has too single interaction mode, can only execute single touch or key function, and cannot meet more and more complex interaction requirements.
Disclosure of Invention
The application aims to provide electronic equipment, the electronic equipment and an interaction method and device thereof, and can solve the problem of single interaction mode in the prior art.
In a first aspect, an embodiment of the present application provides an electronic device, including: the shell comprises a front cover, a rear cover and a frame body arranged between the front cover and the rear cover; a sensor array disposed within the housing; the mainboard is arranged in the shell and is electrically connected with the sensor array through a flexible circuit board; when the sensor array collects pressure information, the mainboard receives the pressure information and generates a corresponding preset instruction according to the pressure information, wherein the pressure information comprises the stress size and the position information of the sensor array.
Further, the sensor array comprises a first piezoelectric array and a second piezoelectric array, the first piezoelectric array comprises a first flexible circuit board and a first connector, and the first piezoelectric array is connected to the main board through the first connector; the second piezoelectric array comprises a second flexible circuit board and a second connector, and the second piezoelectric array is connected to the main board through the second connector.
In a second aspect, an embodiment of the present application provides an interaction method for an electronic device, where the electronic device is the electronic device in the first aspect, and the method includes: receiving current pressure information acquired by the sensor array, wherein the pressure information comprises the stress size and the position information of the sensor array; determining a target piezoelectric ceramic piece according to the current pressure information; determining a preset instruction according to the target piezoelectric ceramic piece; and controlling the electronic equipment to execute the preset instruction.
In a third aspect, an embodiment of the present application provides an interaction apparatus for an electronic device, where the apparatus includes: the receiving module is used for receiving current pressure information acquired by the sensor array, and the pressure information comprises stress size and position information of the sensor array; the target determining module is used for determining a target piezoelectric ceramic piece according to the current pressure information; the instruction generating module is used for determining a preset instruction according to the target piezoelectric ceramic piece; and the execution module is used for controlling the electronic equipment to execute the preset instruction.
In a fourth aspect, an embodiment of the present application provides an electronic device, including:
the apparatus of the third aspect; or
A processor, a memory, and a program or instructions stored on the memory and executable on the processor, which when executed by the processor, implements the method of any of the second aspects.
In the embodiment of the application, the sensor array is arranged to collect the pressure information applied to the surface of the electronic equipment by the user, the preset instruction is executed according to the pressure information, other fingers except the thumb of the user can participate in game interaction, a brand-new interaction mode is provided, and the intelligent terminal can have more interaction modes and better interaction experience.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the application;
FIG. 2 is a schematic diagram of a sensor array according to an embodiment of the present application;
FIG. 3 is a cross-sectional view of a sensor array according to an embodiment of the present application;
FIG. 4 is a schematic diagram of an arrangement of a sensor array according to an embodiment of the present application;
FIG. 5 is a diagram of interactive method steps of an electronic device according to an embodiment of the application;
FIG. 6 is a schematic structural diagram of an interaction device of an electronic device according to an embodiment of the present application;
FIG. 7 is a schematic structural diagram of another electronic device according to an embodiment of the present application;
fig. 8 is a hardware configuration diagram of an electronic device according to an embodiment of the present application.
Reference numerals: the electronic device comprises a front cover 110, a frame 120, a rear cover 130, a sensor array 200, a main board 300, a flexible circuit board 310, a main board support 400, a battery 500, a first piezoelectric array 210, a second piezoelectric array 220, a first flexible circuit board 211, a first connector 212, a second flexible circuit board 221, a second connector 222, a first signal terminal 201 and a second signal terminal 202.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
An electronic device according to an embodiment of the present application is described below with reference to fig. 1 to 4, where the electronic device of the present embodiment may be an electronic device such as a mobile terminal, a tablet, a smart watch, and the like.
As shown in fig. 1, fig. 1 shows an electronic device according to some embodiments of the present application, taking the electronic device as a mobile terminal as an example, the electronic device includes: a housing, a sensor array 200, and a motherboard 300.
The housing is a mounting base for other parts in the mobile terminal, and at least a part of the housing can be used as an appearance part of the mobile terminal. In one possible embodiment, the housing may include a front cover 110, a rear cover 130, and a frame 120 disposed between the front cover and the rear cover, wherein the front cover 110 and the rear cover 130 are respectively installed at two opposite sides of the frame 120, i.e., the frame 120 is located between the front cover 110 and the rear cover 130. In addition, the frame body 120 may include a bezel, and the bezel may be disposed along a side of the mobile terminal by one turn. A display screen may be mounted on the front cover 110, and the display screen may be located between the front cover 110 and the frame 120, and the front cover 110 may be a glass cover.
The sensor array 200 is disposed in the housing, and it can be understood that the sensor array 200 is used as a sensor and needs to sense external information, and therefore, the sensor array 200 is specifically disposed at a position attached to the inner side of the housing, so that the acquired pressure data is more accurate.
It should be noted that, when the sensor array of the present embodiment is disposed in an electronic device such as a smart terminal, the pressure applied by the user on the housing of the electronic device is mainly collected, and therefore, the sensor array of the present embodiment may be a pressure sensor array. When the sensor array of the present embodiment is provided in, for example, a weighing apparatus, the sensor array may be a gravity sensor. The sensor array of this embodiment may also be an infrared sensor array, and may be specifically set according to a use scene, which is not limited herein.
In one possible embodiment, the electronic device further comprises a motherboard bracket 400 and a battery 500, the motherboard bracket 400 is used for mounting the motherboard 300, and specifically, the sensor array 200 is located between the rear cover and the motherboard bracket. It will be appreciated that the battery 500 is used to provide voltage for proper operation of the electronics within the electronic device.
In one possible embodiment, the preset instruction may be to perform a click or a slide or double click action. The preset instruction may also be for different scenes, for example, when in a game scene, the preset instruction may be an operation instruction based on view angle switching, sighting telescope opening, muzzle movement, local magnification, and the like of the game operation interface. For another example, in a non-game scene, the preset instruction may be an operation instruction based on zooming of the video recording interface, volume adjustment when playing a video, brightness adjustment, and the like.
In a possible embodiment, in order to adapt to the operation habit of the user, for example, to be suitable for a game playing scene, two hands are generally required to operate, and therefore, referring to fig. 2 and 3, the sensor array of the embodiment includes the first piezoelectric array 210 and the second piezoelectric array 220, although the number of the piezoelectric arrays of the sensor array may also be one, two, three, five, etc., and may be set according to actual requirements, which is not specifically limited herein.
In the case where the sensor array includes the first piezoelectric array 210 and the second piezoelectric array 220, the first piezoelectric array 210 includes a first flexible circuit board 211 and a first connector 212, and the first piezoelectric array 210 is connected to the main board through the first connector 212; the second piezoelectric array 220 includes a second flexible circuit board 221 and a second connector 222, and the second piezoelectric array 220 is connected to the main board 300 through the second connector 222. Wherein the first connector and the second connector may be BTB plugs.
In one possible embodiment, the sensor array is attached to the inside of a front or back cover or frame of the housing. Specifically, the arrangement position of the sensor array can be reasonably arranged according to actual requirements.
In a possible embodiment, considering the requirements of the scene, most of the time when the user uses the mobile terminal, the fingers except the thumb are on the outer side of the back cover, therefore, the sensor array in this embodiment is arranged on the inner side of the back cover, wherein the sensor array can be fixed on the inner side of the back cover through an adhesive or injection molding.
In one possible embodiment, the inner side of the back cover is provided with a fitting groove for fitting the sensor array so as to fix the position of the sensor array.
In one possible embodiment, referring to fig. 4, the sensor array comprises at least one row of piezoceramic wafers and at least one column of piezoceramic wafers, each piezoceramic wafer comprising a first signal terminal 201 and a second signal terminal 202; the first signal terminals of the piezoelectric ceramic plates in the same row are connected in series and then connected to a first output terminal, such as the output terminal Y1-Y4 in fig. 4, and the first output terminal is used for outputting a first signal to the main board; the second signal terminals of the piezoceramic wafers in the same row are connected in series to a second output terminal, such as the output terminal X1-X9 in fig. 4, and the second output terminal is used for outputting a second signal to the main board.
In an example, the number of rows and columns of the piezoelectric ceramic plates included in the sensor array may be set according to actual requirements, for example, when the area of the rear cover of the mobile terminal is relatively large, the number of rows and columns of the piezoelectric ceramic plates included in the sensor array may be increased, and when high-precision pressure information needs to be acquired, the number of rows and columns of the piezoelectric ceramic plates included in the sensor array may also be increased.
Alternatively, the embodiment is described by using 5 rows and 9 columns, and referring to fig. 4, the first signal terminals of all the piezoceramic wafers in the same row are connected together to form a signal output, which becomes the ordinate, such as Y1 to Y5 in fig. 2. The second signal terminals of all piezoceramic wafers in the same column are connected in series together as an abscissa, such as X1 to X9 in fig. 2.
The sensor array can be accurate to a specific position of each piezoceramic wafer, so that commands are preset for different piezoceramic wafers, for example, the preset command corresponding to the piezoceramic wafer with the coordinate (X2, Y2) is a downslide command, the preset command corresponding to the piezoceramic wafer with the coordinate (X3, Y2) is an upslide command, and the preset command corresponding to the piezoceramic wafer with the coordinate (X3, Y4) is a focusing command. The specific setting can be factory setting of the system, and can also be self-set according to the preference and the requirement of the user.
In one example, the shape of the piezoceramic wafer may be square, diamond or circular, or a combination of any two or three of the square, diamond or circular, or may be other than square, diamond or circular.
When the electronic device of the embodiment realizes interaction, the existing interaction mode of touching or pressing a key is not affected, for example, when a front cover display screen of the electronic device is frequently touched by using a thumb, a user can also apply pressure to the sensor array of the embodiment by using other fingers, so that pressure information acquired based on the sensor array is generated, a preset instruction is executed, other fingers of the user except the thumb can also participate in game interaction, a brand-new interaction mode is provided, and the intelligent terminal can have more interaction modes and better interaction experience.
The present embodiment provides an interaction method for an electronic device, where the electronic device is the electronic device provided in the foregoing embodiment, and with reference to fig. 1, the electronic device includes: housing 100, sensor array 200, and motherboard 300. The specific structures are described in the above embodiments, and are not described herein again.
Referring to fig. 5, the method includes:
s100, receiving current pressure information collected by the sensor array.
In this embodiment, the current pressure information may be applied to the sensor array by a force applied to the rear cover by a finger of the user, the sensor array collects the force applied to the mobile terminal by the user, the pressure information includes force magnitude and position information of the sensor array, and a preset instruction may be determined according to the force magnitude and position information of the sensor array, for example, when the force of the sensor array is a first pressure value and the force position is (X2, Y2), the preset instruction is a slide-down instruction; for another example, when the force applied to the sensor array is the second pressure value and the coordinates are (X3, Y2), the preset command is a slide-up command, and for another example, when the force applied to the sensor array is the second pressure value and the coordinates are (X4, Y2), the preset command is a slide-left command, which may be specifically configured by the factory of the system, or may be configured by the user according to the preference and the requirement of the user.
S110, determining a target piezoelectric ceramic piece according to current pressure information;
in one possible example, a force model of the rear cover can be obtained according to pressure information, wherein the pressure information comprises a first signal of each row and a second signal of each column; and determining the piezoelectric ceramic piece with the largest stress in the stress model as a target piezoelectric ceramic piece according to the stress model.
Under the condition that the sensor array has no pressure, all the piezoelectric ceramic plates are in a relaxed state, and no first signal or second signal is output. In the case of pressure on the sensor array, other fingers, such as the user's index or middle finger, press or slide on the cell phone back cover. The method comprises the steps that potential differences are generated on two electrodes of a plurality of piezoelectric ceramic pieces corresponding to pressing positions to generate a first signal and a second signal, the position pressure of a stress central point is maximum, namely the potential difference of a target piezoelectric ceramic piece is maximum, and the potential differences generated by other piezoelectric ceramic pieces around the target piezoelectric ceramic piece are gradually reduced, so that the voltage magnitude on each piezoelectric ceramic piece can be obtained according to current pressure information, and a stress model of a rear cover is built.
S120, determining a preset instruction according to the target piezoelectric ceramic piece;
in a practical example, a preset instruction may be matched for each piezoelectric ceramic piece, or different preset instructions may be matched according to different pressure values of the same piezoelectric ceramic piece.
In one example, a preset mapping model may be obtained, where the mapping model represents a correspondence between pressure information of the sensor array and a preset instruction; and determining a preset instruction according to the mapping model and the stress size and position information of the target piezoelectric ceramic piece. The mapping model can be a comparison table, the comparison table can include information such as the label and the position information of each piezoelectric ceramic piece, preset instructions corresponding to different piezoelectric ceramic pieces, preset instructions corresponding to different pressure values, and the like, and the corresponding relation between the pressure information and the preset instructions can be obtained through table lookup.
And S130, controlling the electronic equipment to execute a preset instruction.
In one example, when the user is in the game operation interface, the preset instruction may be operations of switching the view angle, opening the sighting telescope, moving the muzzle, partially zooming in and the like. In a non-game scene, the preset instruction may be zooming of a video interface, volume and brightness adjustment during video playing, and the like.
According to the embodiment, the preset instruction can be executed according to the pressure information acquired by the sensor array, so that other fingers except the thumb of the user can participate in game interaction, a brand-new interaction mode is provided, and the intelligent terminal has more interaction modes and better interaction experience.
Other configurations, such as a motherboard, a flexible circuit board, etc., and operations of the electronic device according to embodiments of the present application are known to those of ordinary skill in the art and will not be described in detail herein.
It should be noted that, in the interaction method of the electronic device provided in the embodiment of the present application, the execution main body may be an interaction apparatus of the electronic device, or a control module in the interaction apparatus of the electronic device, which is used for executing the interaction method for loading the electronic device. In the embodiment of the present application, an interaction method for an interaction apparatus of an electronic device to execute loading of the electronic device is taken as an example, and the interaction method of the electronic device provided in the embodiment of the present application is described.
Referring to fig. 6, there is provided an interaction apparatus 600 of an electronic device, the apparatus including:
the receiving module 601 is configured to receive current pressure information acquired by a sensor array, where the pressure information includes stress size and position information of the sensor array;
a target determining module 602, configured to determine a target piezoceramic sheet according to the current pressure information;
the instruction generating module 603 is configured to determine a preset instruction according to the target piezoelectric ceramic piece;
the execution module 604 is configured to control the electronic device to execute the preset instruction.
In one example, the target determining module is further configured to obtain a force model of the rear cover according to the pressure information, where the pressure information includes a first signal of each row and a second signal of each column; and determining the piezoelectric ceramic piece with the largest stress in the stress model as the target piezoelectric ceramic piece according to the stress model.
In one example, the instruction generating module is further configured to obtain a preset mapping model, where the mapping model represents a corresponding relationship between pressure information of the sensor array and a preset instruction; and determining a preset instruction according to the mapping model and the stress size and position information of the target piezoelectric ceramic piece.
The interaction device of the electronic device in the embodiment of the present application may be a device, or may be a component, an integrated circuit, or a chip in a terminal. The device can be mobile electronic equipment or non-mobile electronic equipment. By way of example, the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palm top computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a Personal Digital Assistant (PDA), and the like, and the non-mobile electronic device may be a server, a Network Attached Storage (NAS), a Personal Computer (PC), a Television (TV), a teller machine or a self-service machine, and the like, and the embodiments of the present application are not particularly limited.
The interaction device of the electronic device in the embodiment of the present application may be a device having an operating system. The operating system may be an Android (Android) operating system, an ios operating system, or other possible operating systems, and embodiments of the present application are not limited specifically.
The interaction device of the electronic device provided in the embodiment of the present application can implement each process implemented by the battery health detection device of the electronic device in the method embodiment of fig. 5, and is not described here again to avoid repetition.
According to the embodiment, the preset instruction can be executed according to the pressure information acquired by the sensor array, so that other fingers except the thumb of the user can participate in game interaction, a brand-new interaction mode is provided, and the intelligent terminal has more interaction modes and better interaction experience.
Optionally, an electronic device is further provided in an embodiment of the present application, and includes an interaction apparatus of the electronic device in fig. 6, or, referring to fig. 7, an electronic device includes a processor 701, a memory 702, and a program or an instruction stored in the memory 702 and executable on the processor 701, where the program or the instruction is executed by the processor 701 to implement each process of the embodiment of the battery health detection method for an electronic device, and can achieve the same technical effect, and details are not repeated here to avoid repetition.
It should be noted that the electronic devices in the embodiments of the present application include the mobile electronic devices and the non-mobile electronic devices described above.
Fig. 8 is a schematic diagram of a hardware structure of an electronic device implementing an embodiment of the present application.
The electronic device 1000 includes, but is not limited to: a radio frequency unit 1001, a network module 1002, an audio output unit 1003, an input unit 1004, a sensor 1005, a display unit 1006, a user input unit 1007, an interface unit 1008, a memory 1009, and a processor 1010.
Those skilled in the art will appreciate that the electronic device 1000 may further comprise a power source (e.g., a battery) for supplying power to various components, and the power source may be logically connected to the processor 1010 through a power management system, so as to implement functions of managing charging, discharging, and power consumption through the power management system. The electronic device structure shown in fig. 8 does not constitute a limitation of the electronic device, and the electronic device may include more or less components than those shown, or combine some components, or arrange different components, and thus, the description is omitted here.
In one example, the processor 1010 is configured to receive current pressure information collected by the sensor array, where the pressure information includes force magnitude and position information of the sensor array; determining a target piezoelectric ceramic piece according to the current pressure information; determining a preset instruction according to the target piezoelectric ceramic piece; and controlling the electronic equipment to execute the preset instruction.
In one example, the processor 1010 is configured to obtain a force model of the rear cover according to the pressure information, where the pressure information includes a first signal of each row and a second signal of each column; and determining the piezoelectric ceramic piece with the largest stress in the stress model as the target piezoelectric ceramic piece according to the stress model.
In one example, the processor 1010 is configured to obtain a preset mapping model, where the mapping model represents a corresponding relationship between pressure information of the sensor array and a preset instruction; and determining a preset instruction according to the mapping model and the stress size and position information of the target piezoelectric ceramic piece.
It should be understood that in the embodiment of the present application, the input Unit 1004 may include a Graphics Processing Unit (GPU) 10041 and a microphone 10042, and the Graphics Processing Unit 10041 processes image data of still pictures or videos obtained by an image capturing device (such as a camera) in a video capturing mode or an image capturing mode. The display unit 1006 may include a display panel 10061, and the display panel 10061 may be configured in the form of a liquid crystal display, an organic light emitting diode, or the like. The user input unit 1007 includes a touch panel 10071 and other input devices 10072. The touch panel 10071 is also referred to as a touch screen. The touch panel 10071 may include two parts, a touch detection device and a touch controller. Other input devices 10072 may include, but are not limited to, a physical keyboard, function keys (e.g., volume control keys, switch keys, etc.), a trackball, a mouse, and a joystick, which are not described in detail herein. The memory 1009 may be used to store software programs as well as various data, including but not limited to application programs and operating systems. Processor 1010 may integrate an application processor that handles primarily operating systems, user interfaces, applications, etc. and a modem processor that handles primarily wireless communications. It will be appreciated that the modem processor described above may not be integrated into processor 1010.
According to the embodiment, the preset instruction can be executed according to the pressure information acquired by the sensor array, so that other fingers except the thumb of the user can participate in game interaction, a brand-new interaction mode is provided, and the intelligent terminal has more interaction modes and better interaction experience.
The embodiment of the present application further provides a readable storage medium, where a program or an instruction is stored on the readable storage medium, and when the program or the instruction is executed by a processor, the program or the instruction implements the processes of the foregoing method embodiments, and can achieve the same technical effects, and in order to avoid repetition, details are not repeated here.
The processor is the processor in the electronic device described in the above embodiment. The readable storage medium includes a computer readable storage medium, such as a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and so on.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present application.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. An electronic device, comprising:
the shell comprises a front cover, a rear cover and a frame body arranged between the front cover and the rear cover;
a sensor array disposed within the housing;
the mainboard is arranged in the shell and is electrically connected with the sensor array through a flexible circuit board;
when the sensor array collects pressure information, the mainboard receives the pressure information and generates a corresponding preset instruction according to the pressure information, wherein the pressure information comprises the stress size and the position information of the sensor array.
2. The electronic device of claim 1, wherein the sensor array comprises a first piezo array and a second piezo array, the first piezo array comprising a first flexible circuit board and a first connector, the first piezo array connected to a motherboard by the first connector;
the second piezoelectric array comprises a second flexible circuit board and a second connector, and the second piezoelectric array is connected to the main board through the second connector.
3. The electronic device of claim 1, wherein the sensor array is attached to an inside of a front cover or a back cover or a frame of the housing;
the sensor array is fixed on the inner side of the rear cover through a sticky piece or an injection molding mode under the condition that the sensor array is attached to the inner side of the rear cover of the shell, or an assembling groove is formed in the inner side of the rear cover and used for assembling the sensor array.
4. The electronic device of claim 1, wherein the sensor array comprises at least one row of piezoceramic wafers and at least one column of piezoceramic wafers, each of the piezoceramic wafers comprising a first signal terminal and a second signal terminal;
the first signal ends of the piezoelectric ceramic plates in the same row are connected in series and then connected to a first output end, and the first output end is used for outputting a first signal to the mainboard;
and second signal ends of the piezoelectric ceramic pieces in the same row are connected in series and then connected to a second output end, and the second output end is used for outputting a second signal to the mainboard.
5. The electronic device of claim 4, wherein the piezoceramic wafer is square or diamond-shaped or circular in shape.
6. An interaction method of an electronic device, wherein the electronic device is the electronic device of any one of claims 1-5, the method comprising:
receiving current pressure information acquired by the sensor array, wherein the pressure information comprises the stress size and the position information of the sensor array;
determining a target piezoelectric ceramic piece according to the current pressure information;
determining a preset instruction according to the target piezoelectric ceramic piece;
and controlling the electronic equipment to execute the preset instruction.
7. The method of claim 6, wherein the determining a target piezoceramic wafer from the pressure information comprises:
obtaining a stress model of the rear cover according to the pressure information, wherein the pressure information comprises a first signal of each row and a second signal of each column;
and determining the piezoelectric ceramic piece with the largest stress in the stress model as the target piezoelectric ceramic piece according to the stress model.
8. The method of claim 7, wherein the determining preset instructions according to the target piezoceramic wafer comprises:
acquiring a preset mapping model, wherein the mapping model represents the corresponding relation between the pressure information of the sensor array and a preset instruction;
and determining a preset instruction according to the mapping model and the stress size and position information of the target piezoelectric ceramic piece.
9. An interaction apparatus of an electronic device, the apparatus comprising:
the receiving module is used for receiving current pressure information acquired by the sensor array, and the pressure information comprises stress size and position information of the sensor array;
the target determining module is used for determining a target piezoelectric ceramic piece according to the current pressure information;
the instruction generating module is used for determining a preset instruction according to the target piezoelectric ceramic piece;
and the execution module is used for controlling the electronic equipment to execute the preset instruction.
10. An electronic device, comprising:
the apparatus of claim 9; or
A processor, a memory, and a program or instructions stored on the memory and executable on the processor, which when executed by the processor, implements the method of any of claims 6-8.
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