CN113970265A - Thermal management device and thermal management system - Google Patents

Abstract

The invention discloses a heat management device and a heat management system, wherein the heat management device comprises a first connecting body and a heat exchange core body, the heat management device comprises a first communicating channel and a second communicating channel, one of the first communicating channel and the second communicating channel is provided with at least two orifices on the outer wall part of the first connecting body, and the other channel comprises at least one orifice, so that the connection with other components of the heat management system is convenient.

Description

Thermal management device and thermal management system

Technical Field

The invention relates to the technical field of thermal management, in particular to a thermal management device and a thermal management system.

Background

When the thermal management system for the vehicle further comprises at least two evaporation units, the intermediate heat exchanger and the at least two evaporation units need a plurality of pipelines to be connected, and the pipeline relationship of the thermal management system is relatively complex.

Disclosure of Invention

It is an object of the present application to provide a thermal management device and a thermal management system that facilitates simplifying the piping connections between the thermal management device and other components within the thermal management system.

In one aspect, an embodiment of the present technical solution provides a thermal management device, where the thermal management device includes a heat exchange core, a first connector, and a second connector, where the heat exchange core includes a plurality of stacked plates, and along a stacking direction of the plates, the plates of the heat exchange core are located between the first connector and the second connector, and the first connector, the second connector, and the heat exchange core are fixed; the first connecting body comprises a first wall part, the heat exchange core body is provided with a first hole channel and a second hole channel, the heat management device is at least provided with a first communication channel and a second communication channel, the first communication channel is provided with a first port on the first wall part, at least part of the first port is arranged opposite to the first hole channel, and the first hole channel is communicated with the first communication channel; the second communicating passage has a second port in the first wall portion, at least a part of the second port is disposed opposite to the second port passage, and the second port passage is communicated with the second communicating passage;

one of the first communication passage and the second communication passage includes at least two orifices formed in an outer wall portion of the first connecting body, and the other passage includes at least one orifice formed in an outer wall portion of the first connecting body.

On the other hand, an embodiment of the technical solution of this application still provides a thermal management system, the thermal management system includes above-mentioned thermal management device, reservoir, compressor and condenser, the thermal management device has first entry, first export, second entry, third export and third entry, the export of compressor with the entry of condenser communicates, the entry of condenser with first entry intercommunication, first export with the entry of compressor communicates, the thermal management system still includes first evaporation unit and second evaporation unit, the third export passes through first evaporation unit with the third entry communicates, the second export passes through the second evaporation unit with the second entry communicates.

By providing the above thermal management device and thermal management system, wherein the thermal management device comprises the heat exchange core, the first connecting body and the second connecting body, the thermal management device comprises the first communicating channel and the second communicating channel, the first communicating channel and the second communicating channel are provided with the hole communicated with the hole of the heat exchange core, one of the first communicating channel and the second communicating channel comprises at least two holes, the other channel comprises at least one hole, and the thermal management device can be used for being connected with other components of the thermal management system through the arrangement of the first communicating channel and the second communicating channel, so that the pipeline connection of the thermal management system is relatively simplified.

Drawings

FIG. 1 is a schematic block diagram of a first connection of a thermal management system;

FIG. 2 is a schematic block diagram of a second connection of a thermal management system;

FIG. 3 is a schematic perspective view of a first embodiment of the thermal management device of FIG. 1;

FIG. 4 is a schematic perspective view of another perspective of the heat management device of FIG. 3;

FIG. 5 is an exploded view from one perspective of the thermal management device of FIG. 3;

FIG. 6 is an exploded view from another perspective of the thermal management device of FIG. 3;

FIG. 7 is a schematic top view of the thermal management device of FIG. 3;

FIG. 8 is a schematic cross-sectional view taken along D-D of FIG. 7;

FIG. 9 is a schematic cross-sectional view taken along C-C of FIG. 7;

FIG. 10 is a schematic cross-sectional view taken along B-B of FIG. 7;

fig. 11 is a schematic structural view of another embodiment of the first plate of fig. 3;

FIG. 12 is a schematic bottom view of the thermal management device of FIG. 3;

FIG. 13 is a schematic cross-sectional view taken along A-A of FIG. 12;

FIG. 14 is a schematic cross-sectional view taken along E-E of FIG. 12;

FIG. 15 is a schematic structural view of a second embodiment of a thermal management device;

fig. 16 is an exploded view from a third perspective of the thermal management device of fig. 3.

Detailed Description

The thermal management system and the thermal management device in the technical scheme of the invention can be implemented in various ways, at least one of which can be applied to a vehicle thermal management system, and at least one of which can be applied to other thermal management systems such as a household thermal management system or a commercial thermal management system, and the following description takes the vehicle thermal management device as an example and is combined with the accompanying drawings.

Please refer to fig. 3-14. The thermal management device 1000 includes a heat exchanging core, a first connector and a second connector, in this embodiment, the first connector includes a first plate 1140, the second connector includes a second plate 1210, and the heat exchanging core includes a plurality of stacked plates, and the plates are located between the first plate 1140 and the second plate 1210 along a stacking direction of the plates. The heat exchange core comprises a first heat exchange portion 1100, a connecting plate body 1400 and a second heat exchange portion 1200, wherein the first heat exchange portion 1100 comprises a top plate, and a plurality of plates of the first heat exchange portion 1100 are stacked from a first plate body 1140 to the top plate. The second heat exchanging part 1200 further includes a bottom plate, and a plurality of plates of the second heat exchanging part 1200 are stacked from the bottom plate to the second plate body 1210. The connecting plate 1400 is located between the top plate and the bottom plate and is welded and fixed with the top plate and the bottom plate. In other embodiments, the heat management device may not include a top plate and a bottom plate, and the connection plate 1400 may be directly welded to the plates of the first heat exchanging portion 1100 and the plates of the second heat exchanging portion 1200. Of course, the connecting plate 1400 may not be provided, and the heat exchanging core plate is located between the first plate 1140 and the second plate 1210 along the stacking direction of the plates, and a plurality of plates are stacked from the first plate 1140 to the second plate 1210, or a plurality of plates are stacked from the second plate 1210 to the first plate 1140. It should be noted that, for convenience of description, the second heat exchanging part 1200 is defined to be located above the first heat exchanging part 1100. The first connecting body further includes a first interface portion 1610, a second interface portion 1620 and a third interface portion 1630, and the first interface portion 1610, the second interface portion 1620 and the third interface portion 1630 are fixed to the first plate 1140 by welding. The thermal management device 1000 also includes a first inlet 1001, a first outlet 1002, a second inlet 1008, a second outlet 1007, a third inlet 1006, and a third outlet 1005, wherein the first inlet 1001 and the first outlet 1002 are formed at the first interface portion 1610, the second inlet 1008 and the second outlet 1007 are formed at the second interface portion 1620, and the third inlet 1006 and the third outlet 1005 are formed at the third interface portion 1630. The thermal management device 1000 further has a cooling fluid outlet 1004 and a cooling fluid inlet 1003, and the cooling fluid outlet 1004 and the cooling fluid inlet 1003 are formed in the second connector.

The first heat exchanging part 1100 and the second heat exchanging part 1200 each include a plurality of stacked plates, and the plate structures of the first heat exchanging part 1100 and the second heat exchanging part 1200 may be the same, and the first heat exchanging part 1100 is taken as an example to describe the structure thereof. In the first heat exchanging portion 1100, adjacent plates are stacked to form a first inter-plate flow channel and a second inter-plate flow channel, except for two plates closest to the first plate 1140 and the top plate, one side of the inner plate is a first inter-plate flow channel, and the other side of the inner plate is a second inter-plate flow channel. The fluid of the first plate interspaces may be heat exchangeable with the fluid of the second plate interspaces. It should be noted that the first inter-plate flow channels and the second inter-plate flow channels are not communicated relatively, which means that they are not communicated inside the first heat exchanging part 1100, and there may be a communication situation after the thermal management device 1000 becomes a part of the thermal management system. The thickness of the main body portion of the connecting plate body 1400, the top plate, and the bottom plate is greater than the thickness of the main body portion of the sheet, and thus the mechanical strength of the thermal management device is enhanced.

The heat management device 1000 has a refrigerant flow channel and a coolant flow channel, the refrigerant flow channel includes a first flow channel, a second flow channel, and a third flow channel, the first flow channel and the second flow channel are formed in the first heat exchanging portion 1100, the first inter-plate flow channel of the first heat exchanging portion 1100 is a part of the first flow channel, and the second inter-plate flow channel of the first heat exchanging portion 1100 is a part of the second flow channel. The third flow channel is formed in the second heat exchange portion 1200, the coolant flow channel is formed in the second heat exchange portion 1200, and the refrigerant flowing through the third flow channel and the coolant flowing through the coolant flow channel can exchange heat. The first inlet 1001 is in communication with a first flow passage, in the thermal management system, the first inlet 1001 is a high-pressure refrigerant inlet of the thermal management device 1000, and the first inlet 1001 can be in communication with an outlet of a condenser or an outlet of an accumulator; the first outlet 1002 communicates with the second flow passage, and the first outlet 1002 communicates with the inlet of the compressor or communicates with the inlet of the compressor through a gas-liquid separator. The cooling liquid inlet 1003 and the cooling liquid outlet 1004 are communicated with the cooling liquid flow passage.

In this embodiment, referring to fig. 5 and 6, the first heat exchanging portion 1100 at least includes a first porthole 1160, a second porthole 1120, a third porthole 1130, and a fourth porthole 1150, which extend along the plate stacking direction of the first heat exchanging portion 1100. The first flow channel includes a second port channel 1120, a first interplate channel between the plates, and a third port channel 1130, and the first interplate channel of the first heat exchanging portion 1100 communicates with the second port channel 1120 and the third port channel 1130. In this embodiment, the first inlet 1001 is communicated with the third hole passage 1130, the refrigerant enters the third hole passage 1160 from the first inlet 1001, then enters the first inter-plate channels of the first heat exchanging portion 1100, exchanges heat with the refrigerant in the second inter-plate channels of the first heat exchanging portion 1100, and then enters the second hole passage 1120, the second hole passage 1120 has an opening on the top plate of the first heat exchanging portion, and the refrigerant can leave the first heat exchanging portion 1100 from the opening on the top plate of the first heat exchanging portion 1100 and enter the third channel located in the second heat exchanging portion 1200. The second heat exchange portion 1200 comprises at least a fifth hole 1240, a sixth hole 1230, a seventh hole 1260 and an eighth hole 1270, wherein the third flow channel comprises the fifth hole 1240, the first inter-plate flow channels and the sixth hole 1230 of the second heat exchange portion 1200, and the cooling liquid flow channel comprises the seventh hole 1260, the eighth hole 1270 and the second inter-plate flow channels of the second heat exchange portion 1200. In this embodiment, the cooling liquid inlet 1003 is communicated with the seventh bore 1260, the cooling liquid outlet 1004 is communicated with the eighth bore 1270, and the cooling liquid enters the seventh bore 1260 from the cooling liquid inlet 1003, then enters the second inter-plate channel of the second heat exchanging part 1200, exchanges heat with the refrigerant of the third flow channel, enters the eighth bore 1270, and is discharged out of the heat management device from the cooling liquid outlet 1004. The second flow channel comprises a first porthole 1160, second plate-to-plate channels between the plates and a fourth porthole 1150, and the second plate-to-plate channels of the first heat exchanging part 1100 are communicated with the first porthole 1160 and the fourth porthole 1150. The first outlet 1002 communicates with a first orifice 1160. The refrigerant in the second flow channel enters the second inter-plate channels of the first heat exchange portion 1100 through the fourth channel 1150, exchanges heat with the refrigerant in the first inter-plate channels of the first heat exchange portion 1100, then enters the first channel 1160, and the refrigerant in the first channel 1160 is discharged out of the heat management device through the first outlet 1002. In the present embodiment, the first outlet port 1002 and the first inlet port 1001 are formed in the first connection port portion 1610.

Referring to fig. 6, 13 and 14, the thermal management device has a first communicating passage 1010, a second communicating passage 1020, a third communicating passage 1030 and a fourth communicating passage 1040, a first port 1160 communicates with the first communicating passage 1010, a second port 1120 communicates with the second communicating passage 1020, a third port 1130 communicates with the third communicating passage 1030, and a fourth port 1150 communicates with the fourth communicating passage 1040. Specifically, the first plate body 1140 includes a first wall portion 1141 and a second wall portion 1142, the first communication channel 1010 has a first port 1015 on the first wall portion 1141, the first channel has a channel opening on the bottom plate, the first port 1015 is at least partially disposed opposite to the channel opening of the first channel 1160, or at least a portion of the channel opening of the first channel faces the first port 1015, and the first channel 1160 is communicated with the first communication channel 1010; first communication channel 1010 forms a first aperture in an outer wall portion of first interface portion 1610, and first communication channel 1010 forms a second aperture in an outer wall portion of third interface portion 1630, which in this embodiment is first outlet 1002 and which is third inlet 1006. In a specific embodiment, first communication channel 1010 includes first recess 1011, first hole portion 1012, and second hole portion 1013 formed in first plate 1140, and first channel 1601 formed in first interface portion 1610 and fifth channel 1605 formed in third interface portion 1630. Specifically, the first groove 1011 forms a first port 1015 in the first wall portion 1141, and the first port 1015 is disposed opposite or partially opposite to the first hole 1160, such that the first communicating channel 1010 communicates with the first hole 1160. Specifically, referring to fig. 6 and 16, the first wall portion 11411 includes a first connecting wall 11411, the first connecting wall 11411 is distributed around the first port 1015, and the first connecting wall 11411 and the bottom plate are disposed in a sealing manner. The bottom plate of the heat exchanger core comprises a first wall 1101, the first wall 1101 facing the first port, it being understood that the walls forming the first communication channel comprise the first wall 1101. The first and second hole portions 1012, 1013 have apertures formed in the bottom wall forming the first recess 1011, the first and second hole portions 1012, 1013 have respective apertures in the second wall portion 1142, the aperture formed by the connecting wall of the first interface portion 1610 by the first channel 1601 is arranged opposite to at least part of the first hole portion 1012, the first channel 1601 communicates with the first hole portion 1012, and the first channel 1601 forms a first aperture, i.e. the first outlet 1002, in the outer wall portion of the first interface portion 1610. Wherein, the connecting wall of the first interface portion 1610 is welded and fixed with the first plate 1140; the port formed by the fifth passage 1605 at the connecting wall of the third interface portion 1630 is disposed opposite at least part of the second bore portion 1013, the fifth passage 1605 communicates with the second bore portion 1013, and the fifth passage 1605 forms a second orifice, i.e., the third inlet 1006, at the outer wall portion of the third interface portion 1630. The connecting wall of the third interface 1630 is welded and fixed to the first plate 1140. When the thermal management device is applied, the first communicating channel 1010 forms two ports for communicating with other components of the thermal management system on the first connecting body, so that the number of the interfaces of the thermal management device is increased, connecting pipes and tee joints of the thermal management system are relatively reduced, and the leakage point of the thermal management system is also reduced.

The second communication channel 1020 has a second opening 1025 in the first wall portion 1141, the second hole has an opening in the bottom plate, the second opening 1025 is at least partially opposite to the opening of the second hole 1120, or at least a portion of the opening of the second hole faces the second opening 1025, and the second hole 1120 is communicated with the second communication channel 1020. The second communication passage 1020 has a third hole part 1022 and a fourth hole part 1023, and the third hole part 1022 and the fourth hole part 1023 are formed with hole part openings, respectively, in the second wall part 1142. Second communication channel 1020 also has a second channel 1602 and a sixth channel 1606, where second channel 1602 is formed at second interface portion 1620, and second channel 1602 forms a third orifice, i.e., second outlet 1007, at second interface portion 1620. Sixth channel 1606 is formed at third interface portion 1630, and sixth channel 1606 forms a fourth aperture at third interface portion 1630, i.e., third outlet 1005. In one specific embodiment, the second communicating channel 1020 includes a second groove 1021, a third hole 1022, and a fourth hole 1023 formed on the first plate body 1140, and a second channel 1602 formed on the second interface portion 1620 and a sixth channel 1606 formed on the third interface portion 1630, the second groove 1021 forms a second opening 1025 on the first wall portion 1141, and the second opening 1025 is disposed opposite to or partially opposite to the second hole 1120, so that the second communicating channel 1020 communicates with the second hole 1120. The third hole 1022 and the fourth hole 1023 form hole openings in the bottom wall forming the second recess 1021, the third hole 1022 and the fourth hole 1023 form hole openings in the second wall portion respectively, the second channel 1602 is disposed opposite to at least a portion of the third hole 1022 in a channel opening formed in the connecting wall of the second interface portion 1620, and the second channel 1602 is communicated with the third hole, wherein the connecting wall of the second interface portion 1620 is welded and fixed to the first plate body, specifically, referring to fig. 6 and 16, the first wall portion 1141 includes a second connecting wall 11412, the second connecting wall 11412 is distributed around the second opening 1025, and the second connecting wall 11412 is disposed in a sealing manner with the bottom plate. The bottom plate of the heat exchange core comprises a second wall 1102, the second wall 1102 facing the second port 1025, it being understood that the walls forming the second communication channel comprise the second wall 1102; a channel opening formed by the sixth channel 1606 at the connecting wall of the third interface portion 1630 is opposite to at least a part of the fourth hole 1023, and the sixth channel 1606 is communicated with the fourth hole, wherein the connecting wall of the third interface portion 1630 is welded and fixed with the first plate 1140. Please refer to fig. 11. In other embodiments, the first plate 1140 includes a first sub-portion 1041 and a second sub-portion 1042, the first sub-portion 1041 and the second sub-portion 1042 are welded and fixed, the first hole portion 1012 and the second hole portion 1013 are formed in the first sub-portion 1041, the second sub-portion 1042 has a first through hole 1011 ', the first through hole 1011 ' forms a sidewall of the first recess 1011, the first sub-portion 1041 forms a bottom wall of the first recess 1011 relative to a wall adjacent to the second sub-portion 1042, of course, the first hole portion 1012 and the second hole portion 1013 have hole openings in the bottom wall of the first recess 1011, at least part of the hole openings of the first hole portion 1012 and at least part of the hole openings of the second hole portion 1013 are disposed opposite to the first through hole 1011 ', and it is understood that the bottom wall forming the first recess 1011 is located in the first sub-portion. Similarly, the third hole 1022 and the fourth hole 1023 are formed in the first sub-portion 1041, the second sub-portion 1042 has a second through hole 1021 ', the second through hole 1021 ' forms a sidewall of the second recess 1012, the first sub-portion 1041 forms a bottom wall of the first recess 1011 relative to the wall adjacent to the second sub-portion 1042, of course, the third hole 1022 and the fourth hole 1023 have hole openings in the bottom wall of the first recess 1011, and at least part of the hole openings of the third hole and at least part of the hole openings of the fourth hole are disposed opposite to the second through hole 1021 ', and it can be understood that the bottom wall forming the second recess is located in the first sub-portion 1041.

In other embodiments, one of the first communicating channel 1010 and the second communicating channel 1020 has at least two ports connected with an external device, and the other has one port connected with an external device.

The third communication passage 1030 and the fourth communication passage 1040 have hole portions at both the first wall portion and the second wall portion, wherein the third communication passage 1030 is disposed opposite or partially opposite to the third hole passage 1130 at the hole portion of the first wall portion, so that the third communication passage 1030 communicates with the third hole passage 1130; the fourth communication passage 1040 is disposed opposite or partially opposite the fourth orifice 1150 at the hole portion of the first wall portion, so that the fourth communication passage 1040 communicates with the fourth orifice 1150. Third communication passage 1030 forms first inlet 1001 at first interface portion 1610, and fourth communication passage 1040 forms second inlet 1008 at second interface portion 1620.

As can be seen from the above, the thermal management device includes an interface portion, the interface portion includes a first interface portion 1610, a second interface portion 1620 and a third interface portion 1630, the interface portion includes a connecting wall, the connecting wall of the interface portion is welded and fixed to the first plate body, the interface portion has a channel, the channel of the interface portion has an aperture on the connecting wall thereof, the aperture formed by the channel of the interface portion on the connecting wall thereof faces to a corresponding aperture of the first plate body, so as to enable the channel of the interface portion to communicate with the corresponding hole portion of the first plate body; the connecting part and the first plate body can also be of an integral structure, such as formed by machining a section bar. The channel of the interface portion also has an aperture in an outer wall of the interface portion for communicating with other components within the thermal management system. Of course, the interface portion may include at least one of first interface portion 1610, second interface portion 1620, and third interface portion 1630, e.g., if the thermal management device does not have a first interface portion, then the first inlet and first outlet are formed in first plate body 1140. These interface parts may be separately arranged, for example, the first interface part 1610, the second interface part 1620 and the third interface part 1630 are three separate parts, and are respectively welded and fixed with the first plate; two of the first interface portion, the second interface portion and the third interface portion are structure as an organic whole, and another and first plate body welded fastening. First interface portion 1610, second interface portion 1620, and third interface portion 1630 may be provided integrally, and will not be described in detail. The shape of the interface part may be a block shape or a tube shape. It is understood that the first inlet 1001 and the first outlet 1002 are located at the first interface portion 1610, and the first inlet 1001 and the first outlet 1002 can be located at the same side wall for facilitating installation with other devices of the thermal management system, so that interfaces of other components of the thermal management system are easily integrated and assembled.

The thermal management device includes a first throttle unit 1700 comprising a first valve spool, a second interface 1620 comprising a first chamber, at least a portion of the first throttle unit 1700 being located in the first chamber, the thermal management device comprising a first valve port, the first valve port being part of the second passage 1602. The second channel 1602 includes a first sub-channel having a port in an inner wall of the first interface portion and a second sub-channel communicating with the third aperture portion; the second sub-channel forms a second outlet on the outer wall of the second connecting part, the first valve core can adjust the opening degree of the first valve port, and the first sub-channel can be communicated with the second sub-channel through the first valve port. First throttling element 1700 is secured to second interface portion 1620 to provide a more integrated thermal management device.

Referring to fig. 5 and 6, along the plate stacking direction, the connection plate 1400 is located between the first heat exchanging portion 1100 and the second heat exchanging portion 1200, specifically, the first heat exchanging portion 1100 includes a first connection wall 1110, and the second heat exchanging portion 1200 includes a second connection wall 1220, in this embodiment, the first connection wall 1110 is formed on a top plate of the first heat exchanging portion 1100, the second connection wall 1220 is formed on a bottom plate of the second heat exchanging portion 1200, a lower wall of the connection plate 1400 is welded and fixed to the first connection wall 1110, and an upper wall of the connection plate 1400 is welded and fixed to the second connection wall 1220. The first connecting wall 1110 and the second connecting wall 1220 are oppositely disposed, and the relative disposition described herein includes an indirect relative disposition and a direct relative disposition, and the indirect relative disposition means that there are other objects between the first connecting wall 1110 and the second connecting wall 1220, such as the connecting plate body 1400, and the connecting plate body 1400 may not be disposed between the first connecting wall 1110 and the second connecting wall 1220, that is, the first connecting wall 1110 and the second connecting wall 1220 are directly oppositely disposed, and are welded and fixed. The thermal management device comprises a first through hole 1410 and a second through hole 1420, in this embodiment, the first through hole 1410 and the second through hole 1420 are formed in the connecting plate body 1400, the first through hole 1410 and the second through hole 1420 penetrate the connecting plate body 1400, and openings are respectively formed in the upper wall and the lower wall of the connecting plate body 1400, and the second through hole 1420 communicates the sixth hole 1230 with the first hole 1160, that is, the second through hole 1420 communicates the third flow passage with the second flow passage. The refrigerant in the third flow channel and the cooling liquid in the cooling liquid flow channel enter the first channel 1160 of the first heat exchanging part through the second through hole 1420 after heat exchange in the second heat exchanging part 1200, and since the first channel 1160 is an outflow channel of the second flow channel, the refrigerant entering the first channel 1160 from the second heat exchanging part is discharged out of the heat management device 1000 through the first outlet 1002, it can be known that, in the present embodiment, the refrigerant flowing out of the second heat exchanging part 1200 does not participate in heat exchange in the first heat exchanging part 1100, but enters the compressor through the first channel 1160.

Referring to fig. 8, the thermal management device includes a second throttling unit 1300 and a pipe body 1500, the second throttling unit 1300 includes a valve port 1350 and a valve body 1310, the valve body 1310 is fixed to the first plate body 1210, and the valve port 1350 has a second valve port 1351; at least a portion of the tube 1500 is located in the fifth hole 1240, a first end of the tube 1500 is fixed to the valve port 1350 of the second throttling unit 1300, the cavity of the tube 1500 is communicated with the second valve port 1351, a second end of the tube 1500 is engaged with the first through hole 1410, for example, the second end is located in the first through hole 1410 and is sealed with the wall of the first through hole 1410, such that the second hole 1120 is communicated with the cavity of the tube 1500, and the refrigerant in the second hole 1120 enters the second valve port 1351 through the cavity of the tube 1500; the second heat exchanging portion 1200 includes a first partition plate, the first partition plate and one of the plates of the second heat exchanging portion are an integral structure, the first partition plate forms a bottom wall of the fifth duct 1240 along the axial direction of the fifth duct 1240, the first partition plate has an opening for accommodating the tube 1500, and a sealing arrangement is provided between a wall forming the opening of the first partition plate and a wall of the tube 1500.

Referring to fig. 1, 5, and 6, the operation of the thermal management device 1000 will be described with reference to the thermal management system illustrated in fig. 1. The thermal management system comprises a compressor 100, a condenser 200 and a thermal management device 1000, wherein an outlet of the compressor 100 is communicated with a first inlet 1001 of the thermal management device through the condenser 200, and a first outlet 1002 of the thermal management device is communicated with an inlet of the compressor 100. The thermal management system further comprises a first evaporation unit, a second evaporation unit, a first heat exchanger 400 and a pump 300, wherein a coolant inlet 1003 of the thermal management device 1000 is communicated with a coolant outlet 1004 through the first heat exchanger 400 and the pump 300, or further, a coolant flow channel of the thermal management device 1000, the first heat exchanger 400 and the pump 300 form a coolant system or a part of the coolant system, and coolant of the coolant system flows in the coolant system under the driving of the pump 300. The third outlet 1005 of the thermal management device 1000 communicates with the third inlet 1006 through a first evaporation unit comprising the first throttle device 500 and the second heat exchanger 600. The second outlet 1007 of the thermal management device 1000 communicates with the second inlet 1008 through a second evaporation unit comprising a third heat exchanger 800. When the thermal management system works, high-temperature and high-pressure refrigerant releases heat in the condenser 200, relatively low-temperature and high-pressure refrigerant enters a refrigerant flow channel of the thermal management device 1000 from the first inlet 1001, namely a first flow channel of the first heat exchange portion 1100, the refrigerant in the second hole channel enters a cavity of the tube body 1500 from the second hole channel, the refrigerant enters the fifth hole channel 1240, namely the third flow channel after being throttled and depressurized through the first valve port 1351, and the refrigerant absorbs heat of cooling liquid in the third flow channel, reduces the temperature of the cooling liquid and then enters the sixth hole channel 1230. The refrigerant of the sixth hole 1230 enters the second flow passage, specifically, the first hole 1160 through the second through hole 1420 of the connection plate body 1400, and the first hole 1160 is an outlet passage of the second flow passage, so that the refrigerant of the second heat exchange portion 1200 does not participate in or participates in a small amount in the heat exchange of the first heat exchange portion 1100, and then enters the first communication passage 1010, and then is discharged from the first outlet 1002 to enter the inlet of the compressor. The second channel 1120 is also opened toward the first plate, the refrigerant of the second channel 1120 also enters the second communication channel 1020, the refrigerant of the second communication channel 1020 exits the thermal management device through the second outlet 1007 and the third outlet 1005, the third outlet 1005 is communicated with the third inlet 1006 through the first throttling device 500 and the second heat exchanger 600, it can be known that the second heat exchanger 600 is an evaporator, the refrigerant discharged from the second heat exchanger 600 enters the first communication channel 1010 through the third inlet 1006, and then enters the inlet of the compressor through the first outlet 1002. It will be appreciated that refrigerant exiting the second heat exchanger 600 enters the first communication path 1010, exits the thermal management device through the first outlet 1002 and enters the inlet of the compressor 100. The refrigerant throttled by the first throttling unit 1700 flows out through the second outlet 1007, enters the second inlet 1008 through the third heat exchanger 800, and as it can be known that the third heat exchanger 800 is an evaporator, the second inlet 1008 is communicated with the fourth orifice 1150, and then enters the first orifice 1160, and then flows out of the first outlet 1002 through the first communicating channel. The refrigerants of the three evaporation units are collected in the first communication channel 1010 before entering the inlet of the compressor, or the first communication channel 1010 has a flow collecting function, the second communication channel 1020 has a flow dividing function, and the refrigerants in the second communication channel 1020 respectively flow out from the second outlet 1007 and the third outlet 1005. Referring to fig. 2, the thermal management system further includes a second throttling device 700, in this case the thermal management device does not include the first throttling unit 1700, in this case the second evaporation unit includes the second throttling device 700 and the third heat exchanger 800.

It can be known that the refrigerant of the second heat exchange portion 1200 enters the first heat exchange portion 1100 for heat exchange by providing the second through holes 1420. Specifically, the second heat exchanging part includes a sixth hole 1230, the connecting plate body has a second through hole 1420, the second through hole 1420 penetrates the upper wall and the lower wall of the connecting plate body, the opening of the sixth hole 1230 is at least partially opposite to the opening of the second through hole 1420 at the upper wall thereof, the opening of the fourth hole 1150 is at least partially opposite to the opening of the second through hole 1420 at the lower wall thereof, and the sixth hole 1230 can communicate with the fourth hole 1150 through the second through hole 1420. The refrigerant in the sixth channel 1230 enters the fourth channel 1150 through the second through hole 1420 and exchanges heat with the first heat exchange unit 1100, and it is known that the refrigerant flowing from the second heat exchange unit 1200 into the first heat exchange unit 1100 also participates in the heat exchange.

Please refer to fig. 15. The thermal management device may also be provided without the second heat exchange portion 1200, with the first port 1160 having ports in the top plate of the first heat exchange portion and the second port 1120 having ports in the top plate of the first heat exchange portion 1100 to communicate with other components of the thermal management system. In this embodiment, the thermal management device is not provided with a connecting port, and the first outlet, the first inlet, the second outlet, the second inlet, the third outlet, and the third inlet are formed in the second wall portion of the first plate 1140, which is the outer wall portion of the first connecting body. The first plate 1140 may include a protrusion, the protrusion of the first plate 1140 may protrude relatively to other portions of the first plate, the protrusion of the first plate 1140 may be block-shaped or tubular, and the first outlet, the first inlet, the second outlet, the second inlet, the third outlet, and the third inlet may be formed on the protrusion of the first plate. When the thermal management device does not include the interface portion, the hole portion opening of the first hole portion is a first outlet, the hole portion opening of the second hole portion is a third inlet, the hole portion opening of the third hole portion is a second outlet, and the hole portion opening of the fourth hole portion is a third outlet. Under the concept of the present invention, it is easily conceived that one of the first and second communication passages 1020 is provided to the first connection body and the other is provided to the second connection body, and thus, detailed description thereof is omitted. The first aperture 1160 may not have an aperture opening in the second plate 1210, and the second aperture 1120 may not have an aperture opening in the second plate 1210.

It should be noted that: although the present invention has been described in detail with reference to the above-mentioned embodiments, it should be understood by those skilled in the art that the present invention may be modified and equivalents may be substituted for those skilled in the art, and all technical solutions and modifications that do not depart from the spirit and scope of the present invention should be covered by the claims of the present invention.

Claims (12)

1. A heat management device comprises a heat exchange core body, a first connecting body and a second connecting body, wherein the heat exchange core body comprises a plurality of stacked plates, the plates of the heat exchange core body are positioned between the first connecting body and the second connecting body along the stacking direction of the plates, and the first connecting body and the second connecting body are fixed with the heat exchange core body; the first connecting body comprises a first wall part, the heat exchange core body is provided with a first hole channel and a second hole channel, the heat management device is at least provided with a first communication channel and a second communication channel, the first communication channel is provided with a first port on the first wall part, at least part of the first port is arranged opposite to the first hole channel, and the first hole channel is communicated with the first communication channel; the second communicating passage has a second port in the first wall portion, at least a part of the second port is disposed opposite to the second port passage, and the second port passage is communicated with the second communicating passage;

one of the first communication passage and the second communication passage includes at least two orifices formed in an outer wall portion of the first connecting body, and the other passage includes at least one orifice formed in an outer wall portion of the first connecting body.

2. The thermal management device of claim 1, wherein said first communication channel comprises a first aperture and a second aperture, said first aperture and said second aperture being formed in an outer wall portion of said first connection body; the heat exchange core body comprises a bottom plate, the first pore canal is provided with a pore canal opening on the bottom plate, at least part of the pore canal opening of the first pore canal faces the first port, the first wall part comprises a first connecting wall, the first connecting wall is distributed on the peripheral side of the first port, and the first connecting wall and the bottom plate are arranged in a sealing way; the floor includes a first wall facing the first port;

and/or the second communication channel comprises a third orifice and a fourth orifice, the third orifice and the fourth orifice are formed on the outer wall part of the first connecting body; the second pore canal is provided with a pore canal opening on the bottom plate, at least part of the pore canal opening of the first pore canal faces the second opening, the first wall part comprises a second connecting wall, the second connecting wall is distributed on the peripheral side of the second opening, and the second connecting wall and the bottom plate are arranged in a sealing way; the floor includes a second wall facing the second port.

3. The thermal management device according to claim 1 or 2, wherein said first connecting body comprises a first plate, said second connecting body comprises a second plate, said first wall portion is located at said first plate, said first plate comprises a second wall portion, said first wall portion is closer to said sheet than said second wall portion;

the first communicating passage includes a first hole portion and a second hole portion, the second communicating passage includes a third hole portion and a fourth hole portion, the first hole portion, the second hole portion, the third hole portion, and the fourth hole portion are formed in the first plate, and hole openings are formed in the second wall portion of the first hole portion, the second hole portion, the third hole portion, and the fourth hole portion.

4. The thermal management device according to claim 3, wherein the first plate body has a first groove that forms the first port in the first wall portion and a second groove that forms the second port in the first wall portion, the first hole portion, the second hole portion have hole portions in walls that form the first groove, and the third hole portion and the fourth hole portion have hole portions in walls that form the second groove.

5. The heat management device according to claim 4, wherein the first plate includes a first sub-portion and a second sub-portion, the first sub-portion and the second sub-portion are fixed by welding, the first hole portion, the second hole portion, the third hole portion, and the fourth hole portion are formed in the first sub-portion, the second sub-portion has a first through hole and a second through hole, at least part of the hole openings of the first hole portion and the second hole portion face the first through hole, at least part of the hole openings of the third hole portion and at least part of the hole openings of the fourth hole portion face the second through hole, a wall forming the first concave groove is located in the first sub-portion, and a wall forming the second concave groove is located in the first sub-portion.

6. The thermal management device according to any of claims 1-5, comprising a refrigerant flow passage, said refrigerant flow passage comprising a first flow passage and a second flow passage, said first flow passage comprising a first inter-plate flow passage, a third port passage and said second port passage, said second flow passage comprising a second inter-plate flow passage, a fourth port passage and said first port passage;

the thermal management device has a third communicating passage communicating with the third orifice and a fourth communicating passage communicating with the fourth orifice, and the third communicating passage and the fourth communicating passage have passage ports in the second wall portion of the first connecting body, respectively.

7. The thermal management apparatus of claim 6, wherein the first connector body comprises at least one of a first interface portion, a second interface portion, and a third interface portion, the at least one of the first interface portion, the second interface portion, and the third interface portion being integral with the first plate body or secured to the second wall portion of the first plate body; the first communicating channel comprises a first channel and a fifth channel, the second communicating channel comprises a second channel and a sixth channel, the third communicating channel comprises a third channel, and the fourth communicating channel comprises a fourth channel;

the first passage and the third passage are formed in the first connecting port portion, and the first passage communicates with the first hole portion; the second and fourth channels formed in the second interface portion, the second channel in communication with the third aperture portion; the fifth passage and the sixth passage are formed in the third joint portion, the fifth passage communicates with the second hole portion, and the sixth passage communicates with the fourth hole portion.

8. The thermal management apparatus according to claim 7, wherein the thermal management apparatus comprises a first interface portion, a second interface portion, and a third interface portion, wherein the first interface portion, the second interface portion, and the third interface portion are separately provided, or wherein two of the first interface portion, the second interface portion, and the third interface portion are integrally configured and separately provided from one another;

the first channel has a first outlet on the outer wall of the first interface portion, the third channel has a first inlet on the outer wall of the first interface portion, and the first inlet and the first outlet are located on the same side wall of the first interface portion; the second channel has a second outlet at the outer wall of the second interface portion, the fourth channel has a second inlet at the outer wall of the second interface portion, and the second inlet and the second outlet are located at the same sidewall of the second interface portion; the fifth channel has a third inlet in the outer wall of the third interface portion and the sixth channel has a third outlet in the outer wall of the third interface portion; the third inlet and the third outlet are located in the same side wall of the first interface portion.

9. The thermal management device of claim 8, wherein the thermal management device comprises a first throttling unit comprising a first valve spool; the second interface portion has a first cavity in which at least part of the first throttle unit is located; the thermal management device is provided with a first valve port which is a part of the second channel, and the first valve core can adjust the opening degree of the first valve port; the second passage includes a first sub-passage and a second sub-passage, the first sub-passage communicating with the third port portion, the first sub-passage having a port in an inner wall of the first interface portion; the second sub-channel forms the second outlet on the outer wall of the second interface part, the first valve core can adjust the opening degree of the first valve port, and the first sub-channel can be communicated with the second sub-channel through the first valve port.

10. The thermal management device according to any of claims 7 to 9, wherein said heat exchanging core comprises a first heat exchanging portion and a second heat exchanging portion, said first plate body being fixed to said first heat exchanging portion, said second heat exchanging portion being fixed to said second plate body; the heat management device is provided with a cooling liquid flow passage, the cooling liquid flow passage is formed on the second heat exchanging part, the cooling medium flow passage comprises a third flow passage, the third flow passage is formed on the second heat exchanging part, and the cooling medium of the third flow passage and the cooling liquid of the cooling liquid flow passage can exchange heat in the second heat exchanging part; the second heat exchange core includes fifth and sixth hole passages, which are part of the third flow passage;

the heat management device comprises a second throttling unit and a pipe body, wherein the second throttling unit comprises a first valve port part, at least part of the pipe body is positioned in a fifth hole channel, a first end part of the pipe body is relatively fixed with the first valve port part, a cavity of the pipe body is communicated with the first valve port and a second hole channel, and a sixth hole channel is communicated with the first hole channel or a fourth hole channel.

11. The thermal management device according to claim 10, further comprising a connecting plate body having a first through hole and a second through hole, wherein the first through hole and the second through hole penetrate through an upper wall and a lower wall of the connecting plate body, wherein a port opening of the sixth port is at least partially disposed opposite to an opening formed by the second through hole on the upper wall of the connecting plate body, and at least partially disposed opposite to an opening formed by the second through hole on the lower wall of the connecting plate body, or wherein at least partially disposed opposite to an opening formed by the second through hole on the lower wall of the connecting plate body;

the opening of the fifth pore channel is at least partially opposite to the opening formed by the first through hole on the upper wall of the connecting plate body, and the second pore channel can be communicated with the fifth pore channel through the second through hole.

12. A thermal management system comprising the thermal management device of any of claims 1-11, a compressor, and a condenser, the thermal management device having a first inlet, a first outlet, a second inlet, a third outlet, and a third inlet, the outlet of the compressor being in communication with the inlet of the condenser, the inlet of the condenser being in communication with the first inlet, the first outlet being in communication with the inlet of the compressor, the thermal management system further comprising a first evaporation unit and a second evaporation unit, the third outlet being in communication with the third inlet via the first evaporation unit, and the second outlet being in communication with the second inlet via the second evaporation unit.

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