CN113941473A - Slice tearing adhesive tape for semiconductor wafer cutting - Google Patents

Slice tearing adhesive tape for semiconductor wafer cutting Download PDF

Info

Publication number
CN113941473A
CN113941473A CN202111277615.5A CN202111277615A CN113941473A CN 113941473 A CN113941473 A CN 113941473A CN 202111277615 A CN202111277615 A CN 202111277615A CN 113941473 A CN113941473 A CN 113941473A
Authority
CN
China
Prior art keywords
coating
coating solution
base film
roll
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111277615.5A
Other languages
Chinese (zh)
Inventor
刘杰
万中梁
梁龙
李奎
李俊生
方超超
夏金明
芮鹏程
宋世杰
张东星
乐海霞
朱润雨
李鑫
刘伟
汪峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhu Huishi New Material Technology Co ltd
Original Assignee
Wuhu Huishi New Material Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhu Huishi New Material Technology Co ltd filed Critical Wuhu Huishi New Material Technology Co ltd
Priority to CN202111277615.5A priority Critical patent/CN113941473A/en
Publication of CN113941473A publication Critical patent/CN113941473A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/08Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
    • B05C1/0826Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets
    • B05C1/0834Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets the coating roller co-operating with other rollers, e.g. dosing, transfer rollers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/08Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
    • B05C1/0813Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line characterised by means for supplying liquid or other fluent material to the roller
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/04Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with blades
    • B05C11/048Scrapers, i.e. metering blades having their edge oriented in the upstream direction in order to provide a reverse angle of attack
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1042Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/11Vats or other containers for liquids or other fluent materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/14Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0406Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
    • B05D3/0413Heating with air

Landscapes

  • Adhesive Tapes (AREA)

Abstract

The invention discloses a stripping adhesive tape for cutting a semiconductor wafer, which comprises an adhesive tape base film, an adhesive layer arranged on the adhesive tape base film and an antistatic layer, wherein the adhesive layer is arranged on one side of the adhesive tape base film, the antistatic layer is arranged on the other side of the adhesive tape base film, and the antistatic layer is formed by coating an antistatic coating solution on the adhesive tape base film and drying the adhesive tape base film. The treatment process comprises the following steps: putting various substances forming the coating solution into a coating solution stirring barrel, covering a cover plate on the coating solution stirring barrel, and stirring and mixing through a stirring structure arranged below the cover plate; conveying the uniformly stirred coating solution from the coating solution stirring barrel to a cooling box through a pipeline to cool the coating solution; and directly conveying the cooled coating solution to a glue coating groove, coating the coating solution on a rubber belt base film through a coating roller arranged in the glue coating groove, and conveying the rubber belt base film to a rubber belt drying box for drying. The liquid adding is automatically and continuously completed, the volatilization is less, and the product quality is stable.

Description

Slice tearing adhesive tape for semiconductor wafer cutting
Technical Field
The invention relates to the technical field of semiconductors, in particular to a piece tearing tape for cutting a semiconductor wafer.
Background
The tearing tape for cutting the semiconductor wafer is used for cutting and covering the wafer, so that the cutting quality of the wafer is ensured; the existing slice tearing adhesive tape for cutting the semiconductor wafer comprises a base film and an adhesive layer arranged on the base film, static electricity is generated in the using process and dust is easily adsorbed, an antistatic layer is formed by gluing and drying at present, a coating solution is very easy to volatilize, and the concentration is easily volatilized in the process of adding liquid into a gluing groove to influence the concentration; and the coating solution is not mixed uniformly, which affects the product quality.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a piece tearing adhesive tape for cutting a semiconductor wafer so as to achieve the purposes of automatic and continuous liquid adding and less volatilization.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
the utility model provides a semiconductor wafer cutting is with tearing piece sticky tape, includes the sticky tape base film and establishes the tie coat on the sticky tape base film, still includes the antistatic layer, the tie coat is established in the one side of sticky tape base film, and the opposite side at the sticky tape base film is established to the antistatic layer, the antistatic layer is through the coating of antistatic coating solution stoving formation on the sticky tape base film.
The thickness range of the antistatic layer is 7-12 um.
A treatment process of the tearing tape for cutting the semiconductor wafer comprises the following steps:
1) putting various substances forming the coating solution into a coating solution stirring barrel, covering a cover plate on the coating solution stirring barrel, and stirring and mixing through a stirring structure arranged below the cover plate;
2) conveying the uniformly stirred coating solution from the coating solution stirring barrel to a cooling box through a pipeline to cool the coating solution;
3) and directly conveying the cooled coating solution to a glue coating groove, coating the coating solution on a rubber belt base film through a coating roller arranged in the glue coating groove, and conveying the rubber belt base film to a rubber belt drying box for drying.
The temperature range of the coating solution output from the cooling box is 16-20 ℃, a cooling pipe used for conveying the coating solution is arranged in the cooling box, cooling liquid is arranged in the cooling box, and the cooling pipe is arranged in the cooling liquid in a bending mode.
The device also comprises a base plate, a movable cylinder, a movable seat and a lifting frame; the movable cylinder, the movable seat and the coating solution stirring barrel are arranged on the base plate, the movable seat is arranged on the base plate through a rail, the end part of a piston rod of the movable cylinder is connected with the movable seat, the lifting frame is arranged on the movable seat, the cover plate is arranged at the top of the lifting frame, an annular groove is formed in the lower portion of the cover plate corresponding to the opening edge of the coating solution stirring barrel, and a rubber pad is arranged in the annular groove.
The apron is erected at the top of crane through erecting, and the top of crane is equipped with the motor and the drive gear that links to each other with the motor, is located to be equipped with driven gear and lower driven gear on the perpendicular frame of apron below, and drive gear and last driven gear and lower driven gear pass through the cingulum and link to each other, and it has last (mixing) shaft to go up driven gear even, is equipped with the lower driven gear with lower driven gear engaged with on erecting the frame, and lower driven gear even has lower (mixing) shaft, upward all be equipped with a set of stirring vane on (mixing) shaft and the lower (mixing) shaft.
The coating roll is arranged in the glue coating groove, the lower portion of the coating roll is soaked in a coating solution, a press roll is arranged right above the coating roll, one side of the coating roll is provided with a side guide roll, the other side of the coating roll is provided with an opposite side guide roll, the adhesive tape base film sequentially passes through the position between the coating roll and the side guide roll, the position between the press roll and the coating roll and the position between the coating roll and the opposite side guide roll according to the running direction, a scraper is arranged below the opposite side guide roll, and the scraper is vertically arranged.
The edge of the front part of the opening of the glue coating groove is provided with a leading-in roller, the edge of the rear part of the opening of the glue coating groove is provided with a leading-out roller, and the lower surface of the adhesive tape base film is in contact with the upper edges of the leading-in roller and the leading-out roller.
The rear of rubber coating groove is equipped with sticky tape stoving case, and sticky tape stoving case is vertical stoving case, and sticky tape after the rubber coating gets into from the bottom of vertical stoving case, and the sticky tape after the stoving comes out from the top of vertical stoving case to be equipped with the exhaust chamber at the top of sticky tape stoving case, follow supreme temperature from down in the vertical stoving incasement and lower more and more.
Compared with the prior art, the invention has the following advantages:
the coating solution of the slice tearing adhesive tape for cutting the semiconductor wafer is mixed and stirred uniformly, then is directly cooled and conveyed to a coating tank, the coating tank is relatively closed, the coating solution is relatively less volatile, the concentration change of the coating solution is small, and the product quality stability is good; and the operation from solution coating to glue coating is automatically completed, the labor intensity of workers is low, and the production efficiency is improved.
Drawings
The contents of the description and the references in the drawings are briefly described as follows:
FIG. 1 is a schematic view of a processing apparatus according to the present invention.
In the figure:
1. the device comprises a movable cylinder, a movable base, a lifting frame, a motor, a vertical frame, a cover plate, an upper stirring shaft, a lower stirring shaft, a coating solution stirring barrel, a coating solution cooling box, a guide roller, a press roller, a coating roller, a guide roller, a scraper, a glue coating groove, a guide roller, a glue tape drying box, a glue coating roller, a glue coating and a glue coating machine.
Detailed Description
The following description of the embodiments of the present invention will be made in detail with reference to the accompanying drawings.
As shown in fig. 1, the stripping tape for cutting the semiconductor wafer comprises a tape base film, and an adhesive layer and an antistatic layer arranged on the tape base film; the tie coat is established in the one side of sticky tape base film, and the opposite side at the sticky tape base film is established to the antistatic layer, and the antistatic layer is dried through antistatic coating solution coating and is formed on the sticky tape base film, and production is high-efficient.
The thickness range of the base film of the adhesive tape is 40-60um, the thickness range of the antistatic layer is 7-12um, the thickness is set reasonably, and the coating, drying and rapid forming are facilitated.
The processing technology of the tearing tape for cutting the semiconductor wafer is very critical, and determines the product quality and the product stability of the tape.
The invention relates to a processing technology of a tearing tape for cutting a semiconductor wafer, which comprises the following steps:
putting various substances forming the coating solution into a coating solution stirring barrel, covering a cover plate on the coating solution stirring barrel, and stirring and mixing through a stirring structure arranged below the cover plate;
conveying the uniformly stirred coating solution from the coating solution stirring barrel to a cooling box through a pipeline to cool the coating solution;
and directly conveying the cooled coating solution to a glue coating groove, coating the coating solution on a rubber belt base film through a coating roller arranged in the glue coating groove, conveying the rubber belt base film to a rubber belt drying box for drying, and slitting and winding the dried rubber belt.
The invention also comprises a base plate, a movable cylinder 1, a movable base 2 and a lifting frame 3; the base plate is of a flat plate structure, the moving cylinder, the moving seat and the coating solution stirring barrel 9 are arranged on the base plate, and the moving seat is arranged on the base plate through a rail, so that the stability of moving adjustment is ensured; the end part of a piston rod of the moving cylinder is connected with the moving seat, the lifting frame is arranged on the moving seat, the cover plate 6 is arranged at the top of the lifting frame, the lower part of the cover plate is provided with an annular groove corresponding to the opening edge of the coating solution stirring barrel, and a rubber pad is arranged in the annular groove; when needs are stirred, will lap through the traveling cylinder and remove to the top of coating solution agitator, but crane machinery crane or cylinder crane descend through the crane and cover the apron on the coating solution agitator, block on the coating solution agitator upper shed through the ring channel, and the rubber pad can play buffering and sealed effect.
The coating solution is uniformly mixed and stirred by a stirring structure arranged below the cover plate, so that the subsequent coating quality is ensured; and an openable window is arranged on the cover plate, so that the coating solution sampling and inspection operation is facilitated.
The cover plate is arranged at the top of the lifting frame through the vertical frame 5, the top of the lifting frame is provided with the motor 4 and the driving gear connected with the motor, the vertical frame below the cover plate is provided with an upper driven gear and a lower driven gear, the driving gear is connected with the upper driven gear and the lower driven gear through a toothed belt, the upper driven gear is connected with an upper stirring shaft 7, the vertical frame is provided with a lower rotating gear meshed with the lower driven gear, the lower rotating gear is connected with a lower stirring shaft 8, and a group of stirring blades are arranged on the upper stirring shaft and the lower stirring shaft; the stirring directions of the upper stirring shaft and the lower stirring shaft are opposite through novel arrangement, and the coating solution is favorably and uniformly and rapidly mixed.
The temperature range of the coating solution output from the coating solution cooling box 10 is 16-20 ℃, a cooling pipe for conveying the coating solution is arranged in the cooling box, cooling liquid is arranged in the cooling box, and the cooling pipe is arranged in the cooling liquid in a bending mode; the inlet and the outlet corresponding to the cooling pipe are respectively provided with a temperature sensor, so that the temperature stability of the coating solution entering the glue coating groove is ensured, and the volatilization of the coating solution is reduced. At present, the glue spreading liquid is added into a glue spreading groove through a glue barrel and then cooled, the operation is complex, and the temperature change is large.
The coating roller 13 is arranged in the coating groove 17, the lower part of the coating roller is immersed in the coating solution, a press roller 12 is arranged right above the coating roller, one side guide roller 14 is arranged on one side of the coating roller, the other side guide roller 15 is arranged on the other side of the coating roller, the tape base film sequentially passes through the space between the coating roller and the one side guide roller, the space between the press roller and the coating roller and the space between the coating roller and the other side guide roller according to the running direction, the contact area of the tape base film and the upper part of the coating roller is large, and the coating quality can be improved.
Most of the traditional scrapers are horizontally arranged corresponding to the coating roll, and the lower part of the scraper, which is positioned on the coating roll, is positioned in the coating solution, so that the scrapers cannot be vertically arranged, the scrapers are horizontally arranged, the reflux speed of the coating solution is poor, and the coating uniformity is influenced; in the invention, the scraper 16 is arranged below the guide roller on the other side and is vertically arranged, and the coating solution on the adhesive tape has good uniformity.
A leading-in roller 11 is arranged at the edge of the front part of the opening of the glue coating groove, a leading-out roller 18 is arranged at the edge of the rear part of the opening of the glue coating groove, and the lower surface of the adhesive tape base film is contacted with the upper edges of the leading-in roller and the leading-out roller; the glue coating groove is relatively closed, so that the influence of the coating glue in the external environment is reduced; furthermore, the coating roller is a cooling roller, the glue coating groove is a cooling groove, and the temperature range of the coating solution can be effectively controlled.
A rubber belt drying box 19 is arranged behind the rubber coating groove, the rubber belt drying box is a vertical drying box, a rubber belt after rubber coating enters from the bottom of the vertical drying box, the dried rubber belt comes out from the top of the vertical drying box, an exhaust cavity is arranged at the top of the rubber belt drying box, the temperature in the vertical drying box is lower and lower from bottom to top, and the temperature range is controlled to be 60-80 ℃; vertical stoving case and incasement temperature reasonable setting do benefit to antistatic layer uniform curing, and product quality is stable.
The coating solution of the slice tearing adhesive tape for cutting the semiconductor wafer is mixed and stirred uniformly, then is directly cooled and conveyed to the glue coating groove, the glue coating groove is relatively closed, the coating solution is relatively less volatile, the concentration change of the coating solution is small, and the product quality stability is good; and the operation from solution coating to glue coating is automatically completed, the labor intensity of workers is low, and the production efficiency is improved.
The above-mentioned features are merely for describing preferred embodiments of the present invention and may be arbitrarily combined to form a plurality of embodiments of the present invention.
The invention is described above with reference to the accompanying drawings, it is obvious that the specific implementation of the invention is not limited by the above-mentioned manner, and it is within the scope of the invention to adopt various insubstantial modifications of the inventive concept and solution, or to apply the inventive concept and solution directly to other applications without modification.

Claims (9)

1. The utility model provides a semiconductor wafer cutting is with tearing piece sticky tape, includes the sticky tape basilemma and establishes the tie coat on the sticky tape basilemma, its characterized in that: still include the antistatic layer, the tie coat is established in the one side of sticky tape base film, and the opposite side at the sticky tape base film is established to the antistatic layer, the antistatic layer is through the coating of antistatic coating solution formation of drying on the sticky tape base film.
2. A tape for dicing a semiconductor wafer according to claim 1, wherein: the thickness range of the antistatic layer is 7-12 um.
3. A process for treating a tape for dicing a semiconductor wafer according to claim 1, comprising: the treatment process comprises the following steps:
1) putting various substances forming the coating solution into a coating solution stirring barrel, covering a cover plate on the coating solution stirring barrel, and stirring and mixing through a stirring structure arranged below the cover plate;
2) conveying the uniformly stirred coating solution from the coating solution stirring barrel to a cooling box through a pipeline to cool the coating solution;
3) and directly conveying the cooled coating solution to a glue coating groove, coating the coating solution on a rubber belt base film through a coating roller arranged in the glue coating groove, and conveying the rubber belt base film to a rubber belt drying box for drying.
4. The process of claim 3, wherein: the temperature range of the coating solution output from the cooling box is 16-20 ℃, a cooling pipe used for conveying the coating solution is arranged in the cooling box, cooling liquid is arranged in the cooling box, and the cooling pipe is arranged in the cooling liquid in a bending mode.
5. The process of claim 3, wherein: the device also comprises a base plate, a movable cylinder, a movable seat and a lifting frame; the movable cylinder, the movable seat and the coating solution stirring barrel are arranged on the base plate, the movable seat is arranged on the base plate through a rail, the end part of a piston rod of the movable cylinder is connected with the movable seat, the lifting frame is arranged on the movable seat, the cover plate is arranged at the top of the lifting frame, an annular groove is formed in the lower portion of the cover plate corresponding to the opening edge of the coating solution stirring barrel, and a rubber pad is arranged in the annular groove.
6. The process of claim 5, wherein: the apron is erected at the top of crane through erecting, and the top of crane is equipped with the motor and the drive gear that links to each other with the motor, is located to be equipped with driven gear and lower driven gear on the perpendicular frame of apron below, and drive gear and last driven gear and lower driven gear pass through the cingulum and link to each other, and it has last (mixing) shaft to go up driven gear even, is equipped with the lower driven gear with lower driven gear engaged with on erecting the frame, and lower driven gear even has lower (mixing) shaft, upward all be equipped with a set of stirring vane on (mixing) shaft and the lower (mixing) shaft.
7. The process of claim 3, wherein: the coating roll is arranged in the glue coating groove, the lower portion of the coating roll is soaked in a coating solution, a press roll is arranged right above the coating roll, one side of the coating roll is provided with a side guide roll, the other side of the coating roll is provided with an opposite side guide roll, the adhesive tape base film sequentially passes through the position between the coating roll and the side guide roll, the position between the press roll and the coating roll and the position between the coating roll and the opposite side guide roll according to the running direction, a scraper is arranged below the opposite side guide roll, and the scraper is vertically arranged.
8. The process of claim 7, wherein: the edge of the front part of the opening of the glue coating groove is provided with a leading-in roller, the edge of the rear part of the opening of the glue coating groove is provided with a leading-out roller, and the lower surface of the adhesive tape base film is in contact with the upper edges of the leading-in roller and the leading-out roller.
9. The process of claim 8, wherein: the rear of rubber coating groove is equipped with sticky tape stoving case, and sticky tape stoving case is vertical stoving case, and sticky tape after the rubber coating gets into from the bottom of vertical stoving case, and the sticky tape after the stoving comes out from the top of vertical stoving case to be equipped with the exhaust chamber at the top of sticky tape stoving case, follow supreme temperature from down in the vertical stoving incasement and lower more and more.
CN202111277615.5A 2021-10-30 2021-10-30 Slice tearing adhesive tape for semiconductor wafer cutting Pending CN113941473A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111277615.5A CN113941473A (en) 2021-10-30 2021-10-30 Slice tearing adhesive tape for semiconductor wafer cutting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111277615.5A CN113941473A (en) 2021-10-30 2021-10-30 Slice tearing adhesive tape for semiconductor wafer cutting

Publications (1)

Publication Number Publication Date
CN113941473A true CN113941473A (en) 2022-01-18

Family

ID=79337242

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111277615.5A Pending CN113941473A (en) 2021-10-30 2021-10-30 Slice tearing adhesive tape for semiconductor wafer cutting

Country Status (1)

Country Link
CN (1) CN113941473A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101104780A (en) * 2006-02-28 2008-01-16 日东电工株式会社 Masking tape for board
JP2011210944A (en) * 2010-03-30 2011-10-20 Furukawa Electric Co Ltd:The Antistatic adhesive tape for semiconductor processing
CN104194664A (en) * 2014-08-22 2014-12-10 桐城信邦电子有限公司 Conductive tape
CN104893610A (en) * 2015-06-30 2015-09-09 广西金虹环保包装科技有限公司 Anti-static adhesive tape
CN108949052A (en) * 2018-07-23 2018-12-07 昆山博益鑫成高分子材料有限公司 One kind can antistatic and TPU resistant to high temperature protection membrane adhesive tape and preparation method thereof
CN208583542U (en) * 2018-07-12 2019-03-08 浙江纳鑫胶带制品有限公司 A kind of apparatus for coating of adhesive tape
CN211677438U (en) * 2020-01-09 2020-10-16 常州市白云生物科技有限公司 Automatic guide type dispersing machine for modifying nucleoside
CN213113180U (en) * 2020-05-29 2021-05-04 泰兴市赢兴复合材料有限公司 Ventilative antistatic teflon sticky tape
CN113457943A (en) * 2021-07-09 2021-10-01 芜湖夏鑫新型材料科技有限公司 Antistatic photoelectric protective film

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101104780A (en) * 2006-02-28 2008-01-16 日东电工株式会社 Masking tape for board
JP2011210944A (en) * 2010-03-30 2011-10-20 Furukawa Electric Co Ltd:The Antistatic adhesive tape for semiconductor processing
CN104194664A (en) * 2014-08-22 2014-12-10 桐城信邦电子有限公司 Conductive tape
CN104893610A (en) * 2015-06-30 2015-09-09 广西金虹环保包装科技有限公司 Anti-static adhesive tape
CN208583542U (en) * 2018-07-12 2019-03-08 浙江纳鑫胶带制品有限公司 A kind of apparatus for coating of adhesive tape
CN108949052A (en) * 2018-07-23 2018-12-07 昆山博益鑫成高分子材料有限公司 One kind can antistatic and TPU resistant to high temperature protection membrane adhesive tape and preparation method thereof
CN211677438U (en) * 2020-01-09 2020-10-16 常州市白云生物科技有限公司 Automatic guide type dispersing machine for modifying nucleoside
CN213113180U (en) * 2020-05-29 2021-05-04 泰兴市赢兴复合材料有限公司 Ventilative antistatic teflon sticky tape
CN113457943A (en) * 2021-07-09 2021-10-01 芜湖夏鑫新型材料科技有限公司 Antistatic photoelectric protective film

Similar Documents

Publication Publication Date Title
CN1207105C (en) Multifunctional composite coating machine set
CN214390898U (en) Dull and stereotyped coating equipment of photocuring coating
CN113941473A (en) Slice tearing adhesive tape for semiconductor wafer cutting
CN109137304B (en) Textile fabric spraying device
CN2601752Y (en) Multifunctional heat composite coating devices
CN210729991U (en) Spraying device for automobile lamp production
CN210700831U (en) Glass edge gluing equipment
CN107142632A (en) A kind of weaving face fabric dyeing apparatus
CN110813627A (en) Prevent coating machine for lithium cell processing of waste gas loss
CN109830650A (en) A kind of mixing paste coated plate system of battery
CN213996563U (en) Brushing device for photocureable coating
CN111300900B (en) Plastic bag manufacturing and forming processing technology
CN107313134A (en) A kind of air draft system suitable for high speed high yield carding machine
CN209249585U (en) A kind of mixing paste coated plate system of battery
CN209009567U (en) Feeding device is used in a kind of production of paint vehicle
CN208529914U (en) A kind of double applying hot melt adhesives compounding machines
CN107651580A (en) Self-action carries construction material device
CN103430658B (en) A kind of cotton seed acid solution lint acid seed reaction time controller
CN213704728U (en) Dual-purpose automatic heat seal equipment of drawing of patterns and conveyer belt
CN200957675Y (en) Conveyor for cellular papercore sizing apparatus
CN208632664U (en) High speed grout electroplating mechanism that
CN214183889U (en) Surface chemical residue treatment device for rubber roller of coating machine
CN205553010U (en) Calender with waste recovery device
CN110833971A (en) Three-roller coating machine
CN206678424U (en) A kind of foamed thin sheet shaped device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination