CN113934088A - Image projection device and vehicle lamp - Google Patents
Image projection device and vehicle lamp Download PDFInfo
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- CN113934088A CN113934088A CN202110709790.0A CN202110709790A CN113934088A CN 113934088 A CN113934088 A CN 113934088A CN 202110709790 A CN202110709790 A CN 202110709790A CN 113934088 A CN113934088 A CN 113934088A
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- image projection
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/005—Projectors using an electronic spatial light modulator but not peculiar thereto
- G03B21/008—Projectors using an electronic spatial light modulator but not peculiar thereto using micromirror devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
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- General Physics & Mathematics (AREA)
- Projection Apparatus (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Lighting Device Outwards From Vehicle And Optical Signal (AREA)
Abstract
The invention provides an image projection device and a vehicle lamp, which can protect electronic components from static electricity when a flexible cable is connected and can realize miniaturization of a circuit board. An image projection apparatus projects an image by reflecting light by a digital micromirror device having a plurality of minute mirrors, the image projection apparatus comprising: a mirror mounting substrate (101a) on which a digital micromirror device is mounted; a power supply mounting substrate (101b) formed separately from the mirror mounting substrate (101 a); a flexible cable (108) which electrically connects the mirror mounting substrate (101a) and the power supply mounting substrate (101 b); signal wiring patterns (121b, 121d) electrically connected to a flexible cable (108) are formed on a mirror mounting substrate (101a) and a power supply mounting substrate (101b), and an image projection apparatus is provided with an electrostatic protection element (122) connected to the plurality of signal wiring patterns (121b, 121d) together.
Description
Technical Field
The present invention relates to an image projection apparatus and a vehicle lamp, and more particularly to an image projection apparatus and a vehicle lamp that project an image by reflecting light with a digital micromirror device having a minute mirror.
Background
In recent years, along with the development of driving assistance techniques and automatic driving techniques for vehicles, the necessity of transmitting predetermined motions or information of the vehicle to the outside of the vehicle has been discussed. As a method of presenting information to the outside of a vehicle, a method of mounting an image projection device on a vehicle lamp and projecting an image on a road surface or the like has been proposed (for example, see patent document 1). In the image projection apparatus and the vehicle lamp described in patent document 1, an image is projected by reflecting light with a Digital Micromirror Device (DMD) having a minute Mirror in particular.
Documents of the prior art
Patent document
Patent document 1 (Japanese patent laid-open No. 2020-055519)
In a conventional image projection apparatus, various electronic components including a digital micromirror device are mounted on a circuit board, and the mounting density of the electronic components is increased, which makes it difficult to miniaturize the apparatus. Further, there is a problem that heat generated from each electronic component causes an increase in the ambient temperature of the digital micromirror device. Since the digital micromirror device is a component that drives a minute mirror to reflect light emitted from a light source unit, the usable temperature range is limited. Also, since the digital micromirror device is driven in a high temperature environment, there is a problem that the product life time becomes short and the reliability is lowered.
In order to solve the above problem, if a configuration is made in which electronic components are mounted dispersedly on a plurality of circuit boards and the boards are electrically connected to each other by a flexible cable, there is a possibility that static electricity is generated at the time of connection of the flexible cable to damage the electronic components on the circuit boards. Therefore, wiring on the circuit board is required to connect a protection element for protecting the electronic component from static electricity.
Fig. 9 is a schematic diagram showing a wiring pattern and a protection element on a circuit board. A connector portion to which a flexible cable is connected is mounted on a circuit board, and a wiring pattern on the circuit board and a wiring of the flexible cable are electrically connected via the connector portion. A ground wiring pattern 1 or a signal wiring pattern 2 is formed on a wiring pattern on a circuit board, and an electrostatic protection element 3 is mounted on the signal wiring pattern 2.
In the circuit board including such wiring patterns, even if static electricity flows from the connector portion at the time of connection of the flexible cable, surge current can be discharged from the signal wiring pattern 2 to the ground wiring pattern 1. This prevents damage to the electronic components due to static electricity generated when the flexible cable is connected.
However, in the image projection apparatus, since the number of wiring patterns for driving the digital micromirror device is large, the number of electrostatic protection elements 3 to be mounted is also large. Therefore, it is necessary to reduce the density of the wiring pattern on the circuit board and secure a region for mounting the electrostatic protection element 3, and therefore, it is difficult to miniaturize the circuit board.
Disclosure of Invention
The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide an image projection apparatus and a vehicle lamp that can protect electronic components from static electricity even when a flexible cable is connected, and can achieve miniaturization of a circuit board.
In order to solve the above-described problems, an image projection apparatus according to the present invention projects an image by reflecting light by a digital micromirror device having a plurality of minute mirrors, the image projection apparatus including: a mirror mounting substrate on which the digital micromirror device is mounted; a power supply mounting substrate formed separately from the mirror mounting substrate; a flexible cable electrically connecting the reflector mounting substrate and the power supply mounting substrate; the image projection apparatus includes a mirror mounting substrate, a power supply mounting substrate, a flexible cable, and a signal wiring pattern electrically connected to the flexible cable, and an electrostatic protection element connected to the signal wiring patterns.
In the image projection apparatus according to the present invention, since the electrostatic protection element is connected to the plurality of signal wiring patterns at the same time, the density of the signal wiring patterns can be increased to reduce the size of the mirror-mounted substrate and the power-supply-mounted substrate, and the electronic components mounted on the mirror-mounted substrate and the power-supply-mounted substrate can be protected from static electricity even when the flexible cable is connected.
In one aspect of the present invention, the electrostatic protection element includes a plurality of diodes corresponding to the number of the signal wiring traces.
In one aspect of the present invention, the electrostatic protection element includes a zener diode connected in parallel to the signal wiring pattern.
In one aspect of the present invention, the electrostatic protection element includes a plurality of signal wiring terminals connected to the signal wiring patterns and a ground terminal connected to a ground potential, and the ground terminal is disposed between the signal wiring terminals.
In one aspect of the present invention, the mirror-mounting board and the power-supply-mounting board include a front surface on which the signal wiring pattern is formed and a rear surface on which a ground wiring pattern is formed, and the ground wiring pattern is extended to the front surface through a through hole penetrating from the rear surface to the front surface.
Further, a vehicle lamp according to the present invention includes the image projection device described in any one of the above and a light source unit that irradiates light to the image projection device.
In the present invention, an image projection apparatus and a vehicle lamp are provided, which can protect electronic components from static electricity even when a flexible cable is connected, and can realize miniaturization of a circuit board.
Drawings
Fig. 1 is a schematic perspective view showing an example of the configuration of a vehicle lamp 100 according to a first embodiment.
Fig. 2 is a schematic plan view showing an example of the configuration of the image projection apparatus 10 according to the first embodiment.
Fig. 3 is a block diagram schematically showing power supply lines of the image projection apparatus 10 according to the first embodiment.
Fig. 4 is a schematic diagram showing a configuration example of the flexible cable 108 according to the first embodiment.
Fig. 5 is a schematic diagram showing a case where the electrostatic protection elements 120 are arranged for each of the wiring patterns formed on the mirror-mounting substrate 101a and the power-supply-mounting substrate 101 b.
Fig. 6 is a partially enlarged view showing a countermeasure against surge by using the electrostatic protection element 122 of the image projection apparatus 10 according to the first embodiment.
Fig. 7 is a diagram showing a configuration example of the electrostatic protection element 122 according to the first embodiment, fig. 7(a) is a schematic plan view showing an external appearance of a package and a terminal, and fig. 7(b) is an equivalent circuit diagram.
Fig. 8 is a diagram showing the image projection apparatus 10 according to the second embodiment, fig. 8(a) is a partially enlarged photograph showing a state where the mirror-mounting substrate 101a and the power-supply-mounting substrate 101b are connected by the flexible cable 108, and fig. 8(b) is a partially enlarged view of the periphery of the electrostatic protection element 122 in fig. 8 (a).
Fig. 9 is a schematic diagram showing a wiring pattern and a protection element on a circuit board.
Description of the reference numerals
100 … vehicle lamp
10 … image projection device
20 … light source part
30 … reflector
40 … projection lens
50 … radiator
60 … plane of projection
101a … mirror mounting board
101b … Power supply mounting Board
102 … digital micromirror device
103 … temperature sensor part
104 … mirror control unit
105 … flash memory
106 … power supply unit for mirror control unit
107 … Voltage monitoring Unit
108 … flexible cable
108a … Power Wiring
108b, 108d … single-ended wiring
108c … differential wiring
108e … ground wiring
109 … power supply unit for mirror
110 … control microcomputer
111 … voltage regulation unit
112 … power supply unit for microcomputer
113 … deserializer
114 … Power supply for Cooling
115. 116, 117 … connector section
120 … electrostatic protection element
121a … Power Wiring Pattern
121b, 121d … Signal Wiring traces
122 … electrostatic protection element
Detailed Description
(first embodiment)
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The same or equivalent constituent elements, components, and processes shown in the respective drawings are denoted by the same reference numerals, and overlapping descriptions are appropriately omitted. Fig. 1 is a schematic perspective view showing an example of the configuration of a vehicle lamp 100 according to the present embodiment. The vehicle lamp 100 shown in fig. 1 includes an image projection device 10, a light source unit 20, a reflector 30, a projection lens 40, and a heat sink 50, and projects an image on a projection surface 60.
The image projection apparatus 10 controls the reflection direction of light in a plane based on-information and off-information included in information of a projected image, and reflects light irradiated from the light source unit 20 as projection light Lon and shielding light Loff. The projection light Lon is irradiated to the projection surface 60 via the projection lens 40, and an image is projected by irradiating light to a region corresponding to the on information. The shielding light Loff reaches a shielding portion not shown and is shielded, and does not irradiate the outside.
The Light source unit 20 is a device for irradiating Light to the reflector 30 based on power and signals supplied from the outside, and for example, a Light Emitting Diode (LED) or a semiconductor LASER (LASER) can be used. The light emitted from the light source unit 20 may be Continuous light (CW) or PWM (Pulse Width Modulation) controlled light.
The reflector 30 is an optical member that reflects the light emitted from the light source unit 20 toward the image projection apparatus 10. The shape of the reflecting surface of the reflector 30 is not limited, and a curved surface such as a paraboloid or an elliptic curved surface may be used. The light reflected by the reflector 30 may be a parallel light or an enlarged light path toward the image projection apparatus 10.
The projection lens 40 is an optical member disposed on the optical path of the projection light Lon reflected by the image projection apparatus 10, and magnifies the projection light Lon to irradiate the projection surface 60. Fig. 1 shows an example in which a one-sided lens is used as the projection lens 40, and the projection lens may be configured to include a multi-sided lens. Further, fig. 1 shows an example of a convex lens, and a publicly known lens structure such as a concave lens or an aspherical lens can be used.
The heat sink 50 is a member that is mounted with the light source unit 20 and is disposed to improve heat dissipation. The material constituting the heat sink 50 is not limited, and for example, copper or aluminum having high thermal conductivity, high thermal conductivity resin, or the like can be used. The structure and shape of the heat sink 50 are not limited, and a plurality of fins can be erected on the rear surface side to further improve the heat radiation performance.
The projection surface 60 is a surface that is provided outside the vehicle lamp 100 and is irradiated with the projection light Lon to project an image. Examples of the projection surface 60 include a road surface, a wall surface of a structure, a body of another vehicle, and a body of a host vehicle. Although a plane is shown as the projection surface 60 in fig. 1, the projection surface may be a curved surface or a surface having irregularities as long as the display image can be projected by being irradiated with the projection light Lon.
Fig. 2 is a schematic plan view showing an example of the configuration of the image projection apparatus 10 according to the present embodiment. The image projection apparatus 10 shown in fig. 3 includes: a mirror mounting substrate 101a, a power supply mounting substrate 101b, a digital micromirror device 102, a temperature sensor unit 103, a mirror control unit 104, a flash memory 105, a power supply unit 106 for the mirror control unit, a voltage monitoring unit 107, a flexible cable 108, a power supply unit 109 for the mirror, a control microcomputer 110, a voltage adjusting unit 111, a power supply unit 112 for the microcomputer, a deserializer 113, a power supply unit 114 for cooling, and connector units 115 and 116.
The mirror mounting substrate 101a and the power supply mounting substrate 101b are the following components: a circuit board for mounting electronic components formed separately has a wiring pattern, not shown, formed on a surface thereof, and the electronic components mounted on the surface are electrically connected to each other to form a circuit. Fig. 2 shows an example in which the electronic component is mounted only on the front surface side, but the electronic component may be mounted by forming a wiring pattern on the back surface side. The material constituting the mirror mounting substrate 101a and the power supply mounting substrate 101b is not limited, and publicly known printed circuit boards and the like can be used. In order to improve heat dissipation from the mirror-mounting substrate 101a and the power-supply-mounting substrate 101b, a composite substrate in which an insulating layer and a wiring pattern are formed on a substrate made of a high-thermal-conductivity material such as metal or ceramic may be used. The mirror-mounted substrate 101a and the power-supply-mounted substrate 101b may be formed of the same material and have the same structure, or may be formed of different materials and have different structures.
As shown in fig. 2, a mirror mounting substrate 101a mounts a digital micromirror device 102, a temperature sensor unit 103, a mirror control unit 104, a flash memory 105, a power supply unit 106 for the mirror control unit, and a voltage monitoring unit 107. The power supply mounting board 101b mounts thereon a power supply unit 109 for the mirror, a control microcomputer 110, a voltage adjustment unit 111, a power supply unit 112 for the microcomputer, a deserializer 113, a power supply unit 114 for cooling, and connector units 115 and 116.
The digital micromirror device 102 is an electronic component in which micromirrors are arranged in a matrix and can change tilt angles in an on state and an off state. The projection light Lon reflected in the on state and the shielding light Loff reflected in the off state are separated from each other in the mirror, and an image is projected by being irradiated with the projection light Lon.
The temperature sensor unit 103 is an electronic component disposed in the vicinity of the digital micromirror device 102 and measuring the temperature of the digital micromirror device. The temperature measured by the temperature sensor unit 103 is transmitted as temperature information to the mirror control unit 104 and the control microcomputer 110. The specific configuration of the temperature sensor unit 103 is not limited, and a thermistor, a thermocouple, a digital temperature sensor, or the like can be used.
The mirror control unit 104 is an electronic component that transmits a control signal to the digital micromirror device 102 based on information and off information included in an image, and controls the on state and off state of the mirror in a switching manner. The mirror control unit 104 is connected to a control microcomputer 110 via a flexible cable 108, and is controlled to be driven by a control signal from the control microcomputer 110. The mirror control unit 104 and the digital micromirror device 102 are arranged close to each other on the mirror mounting substrate 101a because they need to operate at a high speed to the extent necessary for image writing (for example, 600MHz or more).
The flash memory 105 is a storage unit for holding information necessary for driving the mirror control unit 104. Examples of the information stored in the flash memory 105 include a program executed by the mirror control unit 104, various setting information, and image data.
The power supply unit 106 for the mirror control unit is a power supply circuit to which power is supplied from the voltage adjustment unit 111 via the flexible cable 108 and which supplies power to the mirror control unit 104. Since the power supply unit 106 for the mirror control unit supplies a relatively large voltage from the voltage adjustment unit 111 via the flexible cable 108, the power supply unit 106 for the mirror control unit uses a plurality of DC/DC converters and steps down the voltage to a voltage suitable for driving the mirror control unit 104 to output electric power. As an example of voltage conversion of the power supply unit 106 for the mirror control unit, DC6V is supplied and outputs DC3.3V, 1.8V, 1.1V, and the like are output.
The voltage monitoring unit 107 is an electronic component that monitors a mirror driving voltage supplied from the power supply unit for mirror 109 to the digital micromirror device via the flexible cable 108. The voltage monitoring unit 107 is electrically connected to the mirror control unit 104 and the control microcomputer 110, and transmits the measured value of the monitored voltage. For example, when the voltage on the mirror mounting substrate 101a supplied from the flexible cable 108 is lower than a predetermined value, the mirror control unit 104 stops the operation of the digital micromirror device 102. This makes it possible to detect disconnection or contact failure of the flexible cable 108, failure of the power supply unit 109 for the mirror, and the like, and prevent malfunction of the digital micromirror device 102.
The flexible cable 108 is a wiring cable that protects a plurality of wires together with a flexible resin or the like, and electrically connects the mirror-mounted substrate 101a and the power-mounted substrate 101 b. The connection method between the flexible cable 108 and the mirror-mounting substrate 101a and the power-mounting substrate 101b is not particularly limited, and a form of inserting connectors mounted on both substrates may be used. Since the flexible cable 108 has flexibility, electrical connection between the two substrates can be secured by bending without depending on the arrangement of the two substrates.
The power supply unit 109 for the mirror is a power supply circuit that is supplied with power from the outside of the image projection apparatus 10 via the connector unit 115 and supplies power to the digital micromirror device 102 via the flexible cable 108. The power supply unit 109 for the mirror is configured by a plurality of electronic components, and includes a series regulator and a DC/DC converter. Examples of the output of the power supply unit 109 for a mirror include DC16V, 8.5V, and-10V.
The control microcomputer 110 is an electronic component that controls the driving of the entire image projection apparatus 10 based on the control signal and various measurement values. The control microcomputer 110 is capable of communicating information with the outside via the connector unit 116, and is supplied with image information and control signals from the outside. The measurement values of the mirror control unit 104, the temperature sensor unit 103, and the voltage monitoring unit 107 are transmitted to the control microcomputer 110.
When image information is transmitted from the outside, the control microcomputer 110 transmits the image information to the mirror control unit 104 via the flexible cable 108 to control the on state and the off state of the mirror. The control microcomputer 110 controls the driving of a cooling unit, not shown, based on the temperature information of the temperature sensor unit 103, and controls the temperature of the digital micromirror device 102. Here, as the cooling unit, publicly known articles such as a cooling fan, a liquid cooling device, and a peltier element can be used. The control microcomputer 110 controls the driving of the image projection apparatus 10 based on the measurement value of the voltage monitoring unit 107, and can determine that the flexible cable 108 is disconnected or disconnected and stop the output of the power supply unit for mirror 109, for example, when the signal of the voltage monitoring unit 107 is lost.
Here, the control microcomputer 110 controls the cooling power supply unit 114 and the cooling unit by executing a program recorded in advance, and also constitutes a cooling control unit in the present invention in order to cool the image projection apparatus 10. Here, an example is shown in which a part of the functions of the control microcomputer 110 functions as a cooling control unit, and a dedicated electronic component may be mounted on the power supply mounting board 101b to function as a cooling control unit.
The voltage adjustment unit 111 is a circuit that is composed of a series regulator and a DC/DC converter, and adjusts a voltage by being used in combination with the power supply unit 109 for a mirror. As an example of voltage conversion by the voltage adjustment unit 111, DC12V is supplied, and DC6V, 3.3V, and the like are output.
The microcomputer power supply unit 112 is a power supply circuit that is supplied with power from the outside of the image projection apparatus 10 via the connector unit 115 and supplies power to the control microcomputer 110. The microcomputer power supply unit 112 is composed of a series regulator, and examples of the output include DC3.3V and 5V.
The deserializer 113 is an electronic component that receives external image information via the connector 116 as serial data, converts the serial data into parallel data, and transmits the parallel data to the mirror control unit 104.
The cooling power supply unit 114 is a power supply circuit that is supplied with power from the outside of the image projection apparatus 10 via the connector unit 115 and supplies power to an unillustrated cooling unit. The cooling power supply unit 114 is composed of a series regulator, and examples of the output include DC 5V.
The connector portions 115 and 116 are electronic components that are inserted by a cable or the like to ensure electrical connection with the outside of the image projection apparatus 10. In the image projection apparatus 10, power is supplied from the outside to the power supply unit 109 for the mirror, the power supply unit 112 for the microcomputer, and the power supply unit 114 for cooling through the connector unit 115. Control signals and information are transmitted between the mirror control unit 104, the control microcomputer 110, and the outside via the connector unit 116.
As shown in fig. 2, in the image projection apparatus 10 of the present embodiment, the mirror-mounted substrate 101a and the power-supply-mounted substrate 101b are electrically connected to each other by a flexible cable 108, and power and control signals can be transmitted therebetween. However, since the flexible cable 108 has a structure in which the periphery of the electric wiring is covered with a flexible resin, the thermal conductivity is low, and therefore, the thermal conduction between the mirror-mounting substrate 101a and the power-supply-mounting substrate 101b is suppressed. This prevents heat generated by the electronic components mounted on the power supply mounting substrate 101b from being conducted to the mirror mounting substrate 101a side, thereby suppressing a temperature rise of the digital micromirror device 102.
Further, since the mirror mounting substrate 101a and the power supply mounting substrate 101b are formed separately, by mounting the electronic component having a relatively small amount of heat generation on the mirror mounting substrate 101a and mounting the electronic component having a relatively large amount of heat generation on the power supply mounting substrate 101b, it is possible to suppress a temperature rise of the digital micromirror device 102 without increasing the size of the circuit board, and to achieve downsizing and weight saving.
Here, the power supply unit 106 for the mirror control unit can be cited as an electronic component having a relatively small amount of heat generation. As described above, the power supply unit 106 for the mirror control unit is formed of a DC/DC converter, and has high conversion efficiency and a small amount of heat generation. The DC/DC converter has characteristics of large current capacity and excellent response to load (current) variation, but on the contrary, the number of electronic components constituting the circuit is large and the mounting area is large. However, in the image projection apparatus 10 of the present embodiment, since the electronic components are also mounted on the power supply mounting substrate 101b, it is easy to secure a region where the power supply unit 106 for the mirror control unit is disposed on the mirror mounting substrate 101 a.
The electronic components having a relatively large amount of heat generation include the power supply section 109 for the mirror, the voltage adjustment section 111, the power supply section 112 for the microcomputer, and the power supply section 114 for cooling. As described above, the power supply unit 109 for the mirror, the voltage adjustment unit 111, the power supply unit 112 for the microcomputer, and the power supply unit 114 for the cooling include series regulators, and the conversion efficiency is low, so that the amount of heat generation is large. The series regulator has a characteristic that the current capacity is small and the response performance to a load (current) variation is lower than that of the DC/DC converter, but can be configured by one chip and the mounting area is small. In the image projection apparatus 10 of the present embodiment, the series regulator is mounted on the power supply mounting substrate 101b different from the mirror mounting substrate 101a, whereby the temperature rise of the digital micromirror device 102 can be suppressed. Further, by mounting the series regulator, which can be formed of one chip, on the power supply mounting board 101b, the mounting density of the electronic components on the power supply mounting board 101b can be reduced, and the temperature rise of the power supply mounting board 101b can be suppressed.
As another electronic component, the mirror control unit 104 operates at a high speed as the digital micromirror device 102, and needs to be mounted on the mirror mounting substrate 101a in the vicinity of the digital micromirror device 102 because of the need for short wiring. The temperature sensor unit 103 measures the temperature of the digital micromirror device 102, and is mounted on the mirror mounting substrate 101a in proximity to the digital micromirror device 102. Further, since it is necessary to transmit information such as image information and a program for quality inspection of the mirror control unit 104, the flash memory 105 is mounted on the mirror-mounting board 101a in proximity to the mirror control unit 104. The voltage monitoring unit 107 is a portion for detecting an abnormality in the voltage supplied to the mirror mounting substrate 101a side, and is therefore mounted on the mirror mounting substrate 101 a.
The control microcomputer 110 is mounted on the power supply mounting substrate 101b because it is not necessary to operate at high speed as in the case of the digital micromirror device 102, it is necessary to communicate information with the outside via the connector 115, and it is necessary to continue the operation even if an error occurs in the flexible cable 108. The deserializer 113 is mounted on the power supply mounting board 101b to convert serial data transmitted through the connector unit 116 into parallel data and transmit the parallel data to the mirror control unit 104.
Fig. 3 is a block diagram schematically showing power supply lines of the image projection apparatus 10 according to the present embodiment. The electric power supplied from the outside via the connector portion 115 is transmitted to the power supply portion 109 for the mirror, the power supply portion 112 for the microcomputer, and the power supply portion 114 for cooling, respectively. The electric power supplied from the outside may be DC12V supplied from a vehicle-mounted battery. In the example shown in fig. 3, the power supply unit 112 for a microcomputer includes two series regulators, and outputs 3.3V for driving the control microcomputer 110 and 5V for driving the interface unit, respectively. The interface power supply is used for controlling input and output signals when an external device (LDM) of the LED driving the light source is controlled. The cooling power supply unit 114 includes a series regulator and outputs 5V for driving a cooling fan or the like serving as a cooling unit.
The power supply unit 109 for the mirror and the voltage adjustment unit 111 include a plurality of DC/DC converters and a plurality of series regulators, and adjust the output voltage via the flexible cable 108. The voltage adjustment unit 111 boosts 12V supplied from the outside to 20V in the DC/DC converter of the first stage, and steps down to 6V output in the DC/DC converter of the second stage. Part of the output of the DC/DC converter in the second stage is supplied to the power supply section 106 for mirror control unit via the flexible cable 108, and part is supplied to the series regulator of the voltage adjustment section 111 and the power supply section 109 for mirror. The series regulator included in the voltage adjustment unit 111 converts 6V to 3.3V and supplies the converted voltage to the power supply unit 109 for the mirror. The power supply unit 109 for the mirror generates 16V, 8.5V, and-10V from the supplied 6V and 3.3V, and supplies the generated voltage to the digital micromirror device 102 via the flexible cable 108.
The power supply unit 109 for the mirror includes three DC/DC converters, and converts the supplied 6V into 1.1V, 1.8V, and 3.3V via the flexible cable 108, respectively, and supplies the converted values to the mirror control unit 104. Also, an output of 1.8V is supplied to the digital micromirror device 102.
Fig. 4 is a schematic diagram showing a structural example of the flexible cable 108 according to the present embodiment. The flexible cable 108 includes a power supply wiring 108a, a single-ended wiring 108b, a differential wiring 108c, a single-ended wiring 108d, and a ground wiring 108 e. The respective wirings are formed extending in the longitudinal direction of the flexible cable 108 and are formed at equal intervals in the lateral direction. In the example shown in fig. 4, the single-ended wirings 108b, 108d and the differential wiring 108c are formed with a thin line width (first line width). The power supply wiring 108a and the ground wiring 108e are formed with a larger line width (second line width) than the first wiring.
The power supply wiring 108a is a wiring formed at one end in the lateral direction of the flexible cable 108, and electrically connects the DC/DC converter at the second stage of the voltage adjustment section 111 and the power supply section 106 for the mirror control section. Since a relatively large current needs to be supplied from the DC/DC converter of the voltage adjustment section 111 to the power supply section 106 for the mirror control section, the line width of the power supply wiring 108a is formed to be thicker than the single-ended wirings 108b, 108d and the differential wiring 108 c. Specifically, in the case where the single-ended wirings 108b, 108d and the differential wiring 108c are formed with a first line width, the power supply wiring 108a is formed with a second line width that is twice or more the first line width. Thus, for example, even when the allowable current of the single- end wirings 108b and 108d and the differential wiring 108c is 500mA, the allowable current of the power supply wiring 108a can be set to 1A or more.
The single-ended wirings 108b and 108d are formed with a line width (first line width) smaller than that of the power supply wiring 108a, and are wirings for transmitting an electrical signal between the mirror-mounting substrate 101a and the power supply-mounting substrate 101 b. And the single-ended wirings 108b, 108d to both end portions of the flexible cable 108 are formed by a first line width.
The differential wiring 108c is formed at the center of the flexible cable 108 in the lateral direction with a line width (first line width) smaller than that of the power supply wiring 108a, and transmits an electric signal between the mirror-mounted substrate 101a and the power supply-mounted substrate 101 b. And the differential wiring 108c is designed in a manner different from the characteristic impedance of the single-ended wirings 108b, 108 d. For example, the characteristic impedance of the single-ended wirings 108b and 108d is 50 Ω, and the characteristic impedance of the differential wiring 108c is 100 Ω.
The ground wiring 108e is a wiring formed at the other end of the flexible cable 108 in the lateral direction, and is a wiring for connecting the ground potential of the mirror-mounted substrate 101a and the power-supply-mounted substrate 101 b. Since a relatively large current needs to be supplied from the DC/DC converter 111 to the power supply unit 106 for the mirror control unit between the mirror mounting substrate 101a and the power supply mounting substrate 101b, the line width of the ground wiring 108e is formed to be the same as that of the power supply wiring 108 a. Thus, for example, even when the allowable current of the single-ended wirings 108b and 108d and the differential wiring 108c is 500mA, the allowable current of the ground wiring 108e can be set to 1A or more.
Fig. 5 is a schematic diagram showing a case where the electrostatic protection elements 120 are arranged for each of wiring patterns (not shown) formed on the mirror-mounting substrate 101a and the power-supply-mounting substrate 101 b. As shown in fig. 5, if the electrostatic protection elements 120 are disposed for each wiring pattern, the number of protection elements mounted on the mirror-mounting substrate 101a and the power-supply-mounting substrate 101b increases, and miniaturization becomes difficult.
Fig. 6 is a partially enlarged view showing surging measures by the electrostatic protection element 122 of the image projection apparatus 10 according to the present embodiment. In the example shown in fig. 6, the differential wiring 108c is not shown. In fig. 6, only the vicinity of the region of the mirror-mounting substrate 101a connected to the flexible cable 108 is shown enlarged. Although the mirror mounting substrate 101a is shown enlarged, the power supply mounting substrate 101b has the same structure.
As shown in fig. 6, in the image projection apparatus 10 of the present embodiment, the connector portion 117 is mounted on the peripheral portion of the mirror-mounting substrate 101a, and the connector portion 117 is electrically connected to the power supply wiring pattern 121a, the signal wiring patterns 121b and 121d, and the ground wiring pattern 121e formed on the mirror-mounting substrate 101 a. Electrostatic protection elements 122 are mounted on the signal wiring patterns 121b and 121d, respectively.
As shown in fig. 6, the power supply wiring 108a, the single-ended wirings 108b, 108d, and the ground wiring 108e are electrically connected to the power supply wiring pattern 121a, the signal wiring patterns 121b, 121d, and the ground wiring pattern 121e, respectively, through the connector portion 117 by inserting and fixing the flexible cable 108 into the connector portion 117.
The power supply wiring pattern 121a is a wiring pattern which is connected to the power supply wiring 108a of the flexible cable 108 and supplies power from the power supply unit 109 for the mirror and the voltage adjustment unit 111 to the power supply unit 106 for the mirror control unit and the digital micromirror device 102 mounted on the mirror mounting substrate 101 a. The signal wiring patterns 121b and 121d are wiring patterns connected to the single-ended wirings 108b and 108d, and transmit electrical signals between the mirror-mounting substrate 101a and the power-supply-mounting substrate 101 b. The ground wiring pattern 121e is a wiring pattern connected to the ground wiring 108e of the flexible cable 108 and supplied with a ground potential, and supplies the ground potential to the electronic components mounted on the mirror-mounting substrate 101 a.
The electrostatic protection element 122 is an electronic component connected to a plurality of wiring patterns included in the signal wiring patterns 121b and 121d at the same time, and when a surge current flows through the signal wiring patterns 121b and 121d, the surge current is discharged to a ground potential to protect the electronic component mounted on the mirror mounting substrate 101 a. Fig. 6 shows an example in which four wiring patterns included as the signal wiring patterns 121b and 121d are protected together in one electrostatic protection element 122, but the number of wiring patterns connected to one electrostatic protection element 122 is not limited.
Fig. 7 is a diagram showing a configuration example of the electrostatic protection element 122 according to the present embodiment, fig. 7(a) is a schematic plan view showing an external appearance of a package and a terminal, and fig. 7(b) is an equivalent circuit diagram. As shown in fig. 7(a), the D1+ terminal, the D1-terminal, the GND terminal, the D2+ terminal, and the D2-terminal are arranged in a row in the electrostatic protection element 122. Also, the GND terminal is disposed between the D1-terminal and the D2+ terminal. The shape and size of the electrostatic protection element 122 are not limited, and for example, a size of about 3 to 4mm in width and about 2 to 3mm in length, in which the D1+ terminal, the D1-terminal, the GND terminal, the D2+ terminal, and the D2-terminal are arranged at an interval of 0.5mm, can be used.
The electrostatic protection element 122 includes a plurality of diodes and zener diodes as in the equivalent circuit shown in fig. 7(b), two diodes connected in series are connected in parallel to 4 groups, and one zener diode is also connected in parallel. The cathode side of the diode connected in series is connected to the cathode side of the zener diode, and the anode side is connected to the GND terminal to form the ground potential. The middle of the two diodes connected in series is connected to the D1+ terminal, the D1-terminal, the D2+ terminal, and the D2-terminal, respectively. Here, the D1+ terminal, the D1-terminal, the D2+ terminal, and the D2-terminal are terminals connected to the signal wiring patterns 121b and 121D, and correspond to signal wiring terminals in the present invention.
The anode side of the zener diode is connected to the GND terminal to form a ground potential, and the cathode side is connected to the cathode side of the diodes connected in series. Here, the GND terminal is connected to the ground potential and thus corresponds to the ground terminal in the present invention. Further, it is preferable that the ground wiring pattern connected to the GND terminal and the ground wiring pattern 121e connected to the ground wiring 108e are formed separately.
On the mirror-mounting board 101a and the power-supply-mounting board 101b, a D1+ terminal, a D1-terminal, a D2+ terminal, and a D2-terminal are connected to wiring patterns included in the signal wiring patterns 121b and 121D, respectively, and a GND terminal is connected to a GND1 terminal and a GND2 terminal on the mirror-mounting board 101a, which will be described later. Thus, when the image projection apparatus 10 is used, signals are transmitted to the electronic components via the flexible cable 108, the connector portion 117, and the signal wiring patterns 121b and 121 d. When a surge voltage exceeding the voltage drop of the zener diode is applied to the connector portion 117 side, a surge current flows from the signal wiring patterns 121b and 121D to the ground potential via the D1+ terminal, the D1-terminal, the D2+ terminal, the D2-terminal, the diode, the zener diode, and the GND terminal.
Accordingly, the mirror-mounted substrate 101a and the power-supply-mounted substrate 101b are formed separately and connected to each other by the flexible cable 108, and while suppressing a temperature rise of the digital micromirror device 102, the electronic components can be protected from static electricity or the like at the time of connecting the flexible cable 108, and the circuit board can be miniaturized. Since the electrostatic protection element 122 is connected to the plurality of wiring patterns at the same time, the density of the signal wiring patterns 121b and 121d can be increased, and the mirror-mounting substrate 101a and the power-supply-mounting substrate 101b can be further downsized.
The electrostatic protection element 122 includes a plurality of diodes corresponding to the number of the signal wiring patterns 121b and 121d, and the diodes are connected in parallel to the respective wiring patterns. This can suppress deterioration of the signal waveform as compared with a countermeasure against static electricity using a capacitor, and can be used for electronic equipment such as the image projection apparatus 10 that operates at high speed.
The electrostatic protection element 122 includes zener diodes connected in parallel to the signal wiring patterns 121b and 121d, and the zener diodes are connected in parallel to the plurality of diodes. Accordingly, it is possible to take a countermeasure against static electricity for a plurality of the signal wiring patterns 121b and 121d with one zener diode, and it is possible to reduce the size of the electrostatic protection element 122, reduce the mounting area, and further reduce the size of the mirror mounting substrate 101a and the power supply mounting substrate 101 b.
And, by arranging GND terminals between the D1+ terminal, D1-terminal, D2+ terminal, and D2-terminal) included in the electrostatic protection element 122 so that the terminal arrangement is bilaterally symmetrical, erroneous connection when mounted on the signal wiring patterns 121b and 121D can be prevented.
As described above, in the image projection apparatus 10 according to the present embodiment, since the electrostatic protection element 122 is connected to the plurality of signal wiring patterns 121b and 121d at the same time, the density of the signal wiring patterns 121b and 121d can be increased to reduce the size of the mirror-mounting substrate 101a and the power-supply-mounting substrate 101b, and the electronic components mounted on the mirror-mounting substrate 101a and the power-supply-mounting substrate 101b can be protected when the flexible cable 108 is connected.
(second embodiment)
Next, a second embodiment of the present invention will be described with reference to fig. 8. The description overlapping with the first embodiment is omitted. Fig. 8 is a diagram showing the image projection apparatus 10 according to the present embodiment, fig. 8(a) is a partially enlarged photograph showing a state where the mirror mounting substrate 101a and the power supply mounting substrate 101b are connected by the flexible cable 108, and fig. 8(b) is a partially enlarged view of the periphery of the electrostatic protection element 122 in fig. 8 (a).
In the example shown in fig. 8(a), the flexible cable 108 includes 39 single-ended wirings 108b and 108d, and 30 signal wiring patterns 121b and 121d are formed on the mirror-mounted substrate 101a and the power-supply-mounted substrate 101b, respectively. The elements shown in fig. 7 are used as the electrostatic protection elements 122, and since the electrostatic protection elements 122 are mounted on each of the four wiring patterns, 10 electrostatic protection elements 122 are mounted on the mirror mounting substrate 101a and the power supply mounting substrate 101b, respectively.
In the present embodiment, as shown in fig. 8(b), the signal wiring patterns 121b1, 121b2, 121b3, 121b4 and the ground wiring patterns GND1, GND2 are formed on the mirror mounting substrate 101 a. The ground wiring patterns GND1 and GND2 are formed between the signal wiring patterns 121b2 and 121b3, have a larger line width than the signal wiring pattern 121b, and are formed in a substantially circular shape at the end portions. The D1+ terminal, D1-terminal, GND terminal, D2+ terminal, and D2-terminal of the electrostatic protection element 122 are connected to the signal wiring patterns 121b1, 121b2, ground wiring patterns GND1, GND2, and signal wiring patterns 121b3, 121b4, respectively.
Since the D1+ terminal, the D1-terminal, the GND terminal, the D2+ terminal, and the D2-terminal of the electrostatic protection element 122 are arranged by the same interval, the signal wiring patterns 121b1, 121b2, 121b3, 121b4 are formed as curved patterns so as to avoid the round shape in the end portions of the ground wiring patterns GND1, GND 2.
In the mirror-mounted substrate 101a and the power-supply-mounted substrate 101b, through holes are formed in circular portions at the ends of the ground wiring patterns GND1 and GND2, and the ground wiring patterns GND1 and GND2 formed on the back surface side and the front surface side are electrically connected. In this manner, the ground wiring patterns GND1 and GND2 are extended from the back side to the front side by the through holes, whereby the ground potential can be supplied to the plurality of electrostatic protection elements 122.
In the case where one electrostatic protection element 3 is mounted on one signal wiring pattern 2 as shown in fig. 9, if the width from the ground wiring pattern 1 to the electrostatic protection element 3 is 2mm, a width of 78mm is required for using 39 ground wiring patterns 1 and electrostatic protection elements 3.
However, in the image projection apparatus 10 of the present embodiment, as shown in fig. 8(a) and (b), the ground wiring patterns GND1 and GND2 are provided to the four signal wiring patterns 121b1, 121b2, 121b3, and 121b4 by using the through holes, and the electrostatic protection element 122 is one for electrostatic countermeasure. In this case, 3 to 4mm, which is the same as the width of the electrostatic protection element 122, is sufficient to protect the four signal wiring patterns 121 b. Therefore, since the width required for mounting 10 electrostatic protection elements 122 is 30 to 40mm, the density of the signal wiring patterns 121b and 121d can be increased, and the mirror-mounting substrate 101a and the power-supply-mounting substrate 101b can be downsized.
In the example shown in fig. 8(b), the ground wiring patterns GND1 and GND2 are provided in two upper and lower portions, so that the ground potential can be reliably supplied to the GND terminal and the signal wiring pattern 121b can be protected even when the upper and lower portions of the electrostatic protection element 122 are mistaken.
In the image projection apparatus 10 according to the present embodiment, since the electrostatic protection element 122 is connected to the plurality of signal wiring patterns 121b and 121d at the same time, the density of the signal wiring patterns 121b and 121d can be increased to reduce the size of the mirror-mounting substrate 101a and the power-supply-mounting substrate 101b, and the electronic components mounted on the mirror-mounting substrate 101a and the power-supply-mounting substrate 101b can be protected when the flexible cable 108 is connected. Further, by extending the ground wiring patterns GND1 and GND2 from the back side to the front side by the through holes, the mounting surface of the electrostatic protection element 122 can be reduced in size, and the mirror-mounting substrate 101a and the power-mounting substrate 101b can be further reduced in size.
The present invention is not limited to the above embodiments, and various modifications can be made within the scope of the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments are also intended to be included in the technical scope of the present invention.
Claims (6)
1. An image projection apparatus for projecting an image by reflecting light by a digital micromirror device having a plurality of micro mirrors, comprising:
a mirror mounting substrate on which the digital micromirror device is mounted;
a power supply mounting substrate formed separately from the mirror mounting substrate;
a flexible cable electrically connecting the reflector mounting substrate and the power supply mounting substrate;
a signal wiring pattern electrically connected to the flexible cable is formed on the mirror mounting substrate and the power supply mounting substrate,
the image projection apparatus includes an electrostatic protection element connected to the plurality of signal wiring patterns.
2. An image projection arrangement according to claim 1,
the electrostatic protection element includes a plurality of diodes corresponding to the number of the signal wiring traces.
3. An image projection arrangement according to claim 1 or 2,
the electrostatic protection element includes a zener diode connected in parallel to the signal wiring pattern.
4. An image projection arrangement according to any one of claims 1 to 3,
the electrostatic protection element includes a plurality of signal wiring terminals connected to the signal wiring patterns and a ground terminal connected to a ground potential,
the ground terminal is disposed between the signal wiring terminals.
5. An image projection arrangement according to any one of claims 1 to 4,
the mirror mounting substrate and the power supply mounting substrate have a front surface on which the signal wiring pattern is formed and a back surface on which a ground wiring pattern is formed,
the ground wiring pattern is extended to the front surface by a through hole penetrating from the rear surface to the front surface.
6. A vehicle lamp is characterized by comprising:
an image projection arrangement according to any one of claims 1 to 5;
a light source unit for irradiating light to the image projection device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| JP2020111855A JP7451325B2 (en) | 2020-06-29 | 2020-06-29 | Image projection devices and vehicle lights |
| JP2020-111855 | 2020-06-29 |
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| CN113934088A true CN113934088A (en) | 2022-01-14 |
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| CN202110709790.0A Active CN113934088B (en) | 2020-06-29 | 2021-06-25 | Image projection device and vehicle lamp |
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| JP7451325B2 (en) * | 2020-06-29 | 2024-03-18 | 株式会社小糸製作所 | Image projection devices and vehicle lights |
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| JP2022022603A (en) | 2022-02-07 |
| CN113934088B (en) | 2023-11-24 |
| JP7451325B2 (en) | 2024-03-18 |
| CN215416235U (en) | 2022-01-04 |
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