CN113920885B - Micro LED display screen, manufacturing method thereof and Micro LED display equipment - Google Patents
Micro LED display screen, manufacturing method thereof and Micro LED display equipment Download PDFInfo
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- CN113920885B CN113920885B CN202111052897.9A CN202111052897A CN113920885B CN 113920885 B CN113920885 B CN 113920885B CN 202111052897 A CN202111052897 A CN 202111052897A CN 113920885 B CN113920885 B CN 113920885B
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- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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Abstract
The invention discloses a Micro LED display screen, a manufacturing method thereof and Micro LED display equipment, wherein the Micro LED display screen comprises a first substrate, a first chip, a second substrate, a second chip, a third substrate and a third chip, wherein each pixel area is internally provided with the first chip, the second chip and the third chip correspondingly, all first chip arrays are arranged on the first substrate and can be exposed from a first through hole of the second substrate and a second through hole of the third substrate, all second chip arrays are arranged on the second substrate and can be exposed from a third through hole of the third substrate, all third chip arrays are arranged on the third substrate, the three substrates are overlapped, the space between the smaller chips can be realized, the number of the chips on each substrate is smaller, the space is larger, and the production, detection and maintenance difficulty can be reduced.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a Micro LED display screen, a manufacturing method of the Micro LED display screen and Micro LED display equipment.
Background
Micro LED (Micro light emitting diode) is used as a new generation of display technology, and has higher brightness, better luminous efficiency and lower power than the existing OLED (organic light emitting diode), and has higher research and development values and use values. The Micro LED has the advantages that the Micro LED is in micron-scale distance between the chips, the granular sensation degree of the LED display screen is determined by the distance between the pixel points, the Micro LED display screen is an important index of the performance and the basic attribute of the Micro LED display screen, but the smaller the distance between the chips is, the higher the production difficulty is, and the more difficult the detection and the maintenance is.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a Micro LED display screen which can reduce the difficulty of production, detection and maintenance of the Micro LED display screen with small spacing.
The invention also provides a manufacturing method of the Micro LED display screen applied to the Micro LED display screen.
The invention also provides Micro LED display equipment comprising the Micro LED display screen.
The embodiment of the invention provides a Micro LED display screen, which comprises: the array-type liquid crystal display panel comprises a first substrate and a plurality of first chips, wherein a plurality of pixel areas arranged in an array mode are arranged on the surface of the first substrate, the first chips are arranged in the array mode on the surface of the first substrate and correspond to the pixel areas one by one; the second substrate covers the surface of the first substrate, a plurality of first through holes are formed in the second substrate in an array arrangement, so that the first chips are exposed out of the first through holes in a one-to-one correspondence manner, a plurality of second chips are arranged on the surface of the second substrate in an array arrangement manner and correspond to the plurality of pixel regions in a one-to-one correspondence manner; the third substrate covers the surface of the second substrate, a plurality of second through holes are formed in the third substrate in an array arrangement, so that the first chips are exposed from the second through holes in a one-to-one correspondence manner, a plurality of third through holes are formed in the third substrate in an array arrangement manner, so that the second chips are exposed from the third through holes in a one-to-one correspondence manner, a plurality of third chips are arranged on the surface of the third substrate in an array arrangement manner, and the third chips are in one-to-one correspondence with the plurality of pixel regions; wherein the first substrate, the second substrate and the third substrate are electrically connected to each other.
The Micro LED display screen provided by the embodiment of the first aspect of the invention at least has the following beneficial effects: all correspond a first chip, a second chip and a third chip in each pixel area, all first chip arrays arrange in first base plate and can follow the first through-hole department of second base plate and the second through-hole department of third base plate exposes, all second chip arrays arrange in the second base plate and can follow the third through-hole department of third base plate and expose, all third chip arrays arrange in the third base plate, three base plate coincide, can realize the interval between the less chip, the chip quantity on each base plate is less, the interval is great, be favorable to reducing the degree of difficulty of production, detection and maintenance.
In some embodiments of the present invention, a surface of the first substrate close to the second substrate is provided with a plurality of first contacts arranged in an array, a surface of the second substrate close to the first substrate is provided with a plurality of second contacts arranged in an array, the plurality of first contacts are electrically connected to the plurality of second contacts in a one-to-one correspondence, and the plurality of second contacts are electrically connected to the plurality of second chips in a one-to-one correspondence; a plurality of third contacts arranged in an array are arranged on the surface, close to the third substrate, of the second substrate, a plurality of fourth contacts arranged in an array are arranged on the surface, close to the second substrate, of the third substrate, the plurality of third contacts are electrically connected with the plurality of fourth contacts in a one-to-one correspondence manner, and the plurality of fourth contacts are electrically connected with the plurality of third chips in a one-to-one correspondence manner; the surface of the first substrate, which is close to the second substrate, is provided with a plurality of fifth contacts arranged in an array, the surface of the second substrate, which is close to the first substrate, is provided with a plurality of sixth contacts arranged in an array, the plurality of fifth contacts are electrically connected with the plurality of sixth contacts in a one-to-one correspondence manner, and the plurality of sixth contacts are electrically connected with the plurality of third contacts in a one-to-one correspondence manner.
In some embodiments of the present invention, the first contact is aligned with the second contact, the second contact is aligned with the second chip, the third contact is aligned with the fourth contact, the fourth contact is aligned with the third chip, the fifth contact is aligned with the sixth contact, and the sixth contact is aligned with the third contact.
In some embodiments of the invention, the first through hole is aligned with the second through hole.
In some embodiments of the present invention, the first chip, the second chip and the third chip are different in color from each other.
In some embodiments of the present invention, the first chip is red, the second chip is green, and the third chip is blue.
The method for manufacturing the Micro LED display screen provided by the embodiment of the second aspect of the invention is used for manufacturing the Micro LED display screen as set forth in any one of claims 1 to 6, and comprises the following steps:
arranging a plurality of the first chip arrays on the first substrate, simultaneously arranging a plurality of the second chip arrays on the second substrate, and simultaneously arranging a plurality of the third chip arrays on the third substrate;
covering the second substrate on the first substrate to enable the first chips to be exposed out of the first through holes in a one-to-one correspondence manner;
covering the second substrate with the third substrate, so that the first chips are exposed from the second through holes in a one-to-one correspondence manner, and the second chips are exposed from the third through holes in a one-to-one correspondence manner.
The method for manufacturing the Micro LED display screen provided by the embodiment of the second aspect of the invention at least has the following beneficial effects: the first chip is installed on the first substrate, the second chip is installed on the second substrate, the third chip is installed on the third substrate, the first substrate, the second substrate and the third substrate are overlapped with each other, the chip distance on each substrate is large, and installation is conducted respectively, so that the production, detection and maintenance difficulty is reduced.
The Micro LED display device provided by the embodiment of the third aspect of the invention comprises the Micro LED display screen provided by any one of the embodiments.
The Micro LED display device provided by the embodiment of the third aspect of the invention at least has the following beneficial effects: the Micro LED display screen capable of reducing the difficulty of production, detection and maintenance is adopted, and the performance of the Micro LED display equipment is improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention is further described with reference to the following figures and examples, in which:
FIG. 1 is a schematic perspective view of a Micro LED display screen according to some embodiments of the first aspect of the present invention;
FIG. 2 is an exploded view of the Micro LED display screen shown in FIG. 1;
FIG. 3 is a cross-sectional view of the Micro LED display screen shown in FIG. 2;
FIG. 4 is a cross-sectional view of the Micro LED display screen shown in FIG. 1;
FIG. 5 is a flow chart of a method for manufacturing a Micro LED display screen according to some embodiments of the second aspect of the present invention.
Reference numerals:
the liquid crystal display device includes a first substrate 100, a pixel region 110, a first contact 120, a fifth contact 130, a first chip 200, a second substrate 300, a first through hole 310, a second contact 320, a third contact 330, a sixth contact 340, a second chip 400, a third substrate 500, a second through hole 510, a third through hole 520, a fourth contact 530, and a third chip 600.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplicity of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
In the description of the present invention, reference to the description of "one embodiment," "some embodiments," or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The embodiment of the invention provides a Micro LED display screen, which comprises: the display device comprises a first substrate 100 and a plurality of first chips 200, wherein a plurality of pixel regions 110 arranged in an array are arranged on the surface of the first substrate 100, a plurality of first chips 200 are arranged on the surface of the first substrate 100 in an array manner, and the plurality of first chips 200 correspond to the plurality of pixel regions 110 one by one; the second substrate 300 covers the surface of the first substrate 100, the second substrate 300 is provided with a plurality of first through holes 310 arranged in an array manner, so that the first chips 200 are exposed from the first through holes 310 in a one-to-one correspondence manner, the second chips 400 are provided in a plurality, and the plurality of second chips 400 are arranged on the surface of the second substrate 300 in an array manner and correspond to the plurality of pixel regions 110 in a one-to-one correspondence manner; a third substrate 500 and a third chip 600, wherein the third substrate 500 covers the surface of the second substrate 300, the third substrate 500 is provided with a plurality of second through holes 510 arranged in an array, so that the first chips 200 are exposed from the second through holes 510 in a one-to-one correspondence, the third substrate 500 is provided with a plurality of third through holes 520 arranged in an array, so that the second chips 400 are exposed from the third through holes 520 in a one-to-one correspondence, the third chip 600 is provided with a plurality of third chips 600, and the plurality of third chips 600 are arranged on the surface of the third substrate 500 in an array and correspond to the plurality of pixel regions 110 in a one-to-one correspondence; the first substrate 100, the second substrate 300 and the third substrate 500 are electrically connected to each other.
For example, as shown in fig. 1 and 2, the Micro LED display screen includes: the display device comprises a first substrate 100 and a plurality of first chips 200, wherein a plurality of pixel regions 110 arranged in an array are arranged on the surface of the first substrate 100, a plurality of first chips 200 are arranged on the surface of the first substrate 100 in an array manner, and the plurality of first chips 200 correspond to the plurality of pixel regions 110 one by one; the second substrate 300 covers the surface of the first substrate 100, the second substrate 300 is provided with a plurality of first through holes 310 arranged in an array manner, so that the first chips 200 are exposed from the first through holes 310 in a one-to-one correspondence manner, a plurality of second chips 400 are arranged on the surface of the second substrate 300, and the plurality of second chips 400 are arranged in an array manner and correspond to the plurality of pixel regions 110 one by one; a third substrate 500 and a third chip 600, wherein the third substrate 500 covers the surface of the second substrate 300, the third substrate 500 is provided with a plurality of second through holes 510 arranged in an array, so that the first chips 200 are exposed from the second through holes 510 in a one-to-one correspondence, the third substrate 500 is provided with a plurality of third through holes 520 arranged in an array, so that the second chips 400 are exposed from the third through holes 520 in a one-to-one correspondence, the third chip 600 is provided with a plurality of third chips 600, and the plurality of third chips 600 are arranged on the surface of the third substrate 500 in an array and correspond to the plurality of pixel regions 110 in a one-to-one correspondence; the first substrate 100, the second substrate 300, and the third substrate 500 are electrically connected to each other. Each pixel region 110 is internally provided with a first chip 200, a second chip 400 and a third chip 600 correspondingly, all the first chips 200 are arranged on the first substrate 100 in an array manner and can be exposed from the first through holes 310 of the second substrate 300 and the second through holes 510 of the third substrate 500, all the second chips 400 are arranged on the second substrate 300 in an array manner and can be exposed from the third through holes 520 of the third substrate 500, all the third chips 600 are arranged on the third substrate 500 in an array manner, the three substrates are overlapped, the smaller distance between the chips can be realized, the number of the chips on each substrate is small, the distance is large, and the difficulty in production, detection and maintenance can be reduced.
It should be noted that, a surface of the first substrate 100 close to the second substrate 300 is provided with a plurality of first contacts 120 arranged in an array, a surface of the second substrate 300 close to the first substrate 100 is provided with a plurality of second contacts 320 arranged in an array, the plurality of first contacts 120 are electrically connected to the plurality of second contacts 320 in a one-to-one correspondence manner, and the plurality of second contacts 320 are electrically connected to the plurality of second chips 400 in a one-to-one correspondence manner; the surface of the second substrate 300 close to the third substrate 500 is provided with a plurality of third contacts 330 arranged in an array, the surface of the third substrate 500 close to the second substrate 300 is provided with a plurality of fourth contacts 530 arranged in an array, the plurality of third contacts 330 are electrically connected with the plurality of fourth contacts 530 in a one-to-one correspondence manner, and the plurality of fourth contacts 530 are electrically connected with the plurality of third chips 600 in a one-to-one correspondence manner; the surface of the first substrate 100 close to the second substrate 300 is provided with a plurality of fifth contacts 130 arranged in an array, the surface of the second substrate 300 close to the first substrate 100 is provided with a plurality of sixth contacts 340 arranged in an array, the plurality of fifth contacts 130 are electrically connected with the plurality of sixth contacts 340 in a one-to-one correspondence manner, and the plurality of sixth contacts 340 are electrically connected with the plurality of third contacts 330 in a one-to-one correspondence manner.
For example, as shown in fig. 2 and fig. 3, a plurality of first contacts 120 arranged in an array are disposed on a surface of the first substrate 100 close to the second substrate 300, a plurality of second contacts 320 arranged in an array are disposed on a surface of the second substrate 300 close to the first substrate 100, the plurality of first contacts 120 are electrically connected to the plurality of second contacts 320 in a one-to-one correspondence manner, and the plurality of second contacts 320 are electrically connected to the plurality of second chips 400 in a one-to-one correspondence manner; the surface of the second substrate 300 close to the third substrate 500 is provided with a plurality of third contacts 330 arranged in an array, the surface of the third substrate 500 close to the second substrate 300 is provided with a plurality of fourth contacts 530 arranged in an array, the plurality of third contacts 330 are electrically connected with the plurality of fourth contacts 530 in a one-to-one correspondence manner, and the plurality of fourth contacts 530 are electrically connected with the plurality of third chips 600 in a one-to-one correspondence manner; the surface of the first substrate 100 close to the second substrate 300 is provided with a plurality of fifth contacts 130 arranged in an array, the surface of the second substrate 300 close to the first substrate 100 is provided with a plurality of sixth contacts 340 arranged in an array, the plurality of fifth contacts 130 are electrically connected with the plurality of sixth contacts 340 in a one-to-one correspondence manner, and the plurality of sixth contacts 340 are electrically connected with the plurality of third contacts 330 in a one-to-one correspondence manner. After the second substrate 300 is covered on the first substrate 100, the first contact 120 is contacted with the second contact 320, and the fifth contact 130 is contacted with the sixth contact 340; after the third substrate 500 is covered on the second substrate 300, the third contact 330 contacts with the fourth contact 530, so that the first substrate 100, the second substrate 300, and the third substrate 500 can be electrically connected.
It should be noted that the first contact 120 is aligned with the second contact 320, the second contact 320 is aligned with the second chip 400, the third contact 330 is aligned with the fourth contact 530, the fourth contact 530 is aligned with the third chip 600, the fifth contact 130 is aligned with the sixth contact 340, and the sixth contact 340 is aligned with the third contact 330.
For example, as shown in fig. 3, the first contact 120 is aligned with the second contact 320, the second contact 320 is aligned with the second chip 400, the third contact 330 is aligned with the fourth contact 530, the fourth contact 530 is aligned with the third chip 600, the fifth contact 130 is aligned with the sixth contact 340, and the sixth contact 340 is aligned with the third contact 330 to facilitate mounting alignment.
It should be noted that the first through hole 310 is aligned with the second through hole 510.
For example, as shown in fig. 4, the first through hole 310 is aligned with the second through hole 510, so that the first chip 200 can be exposed from the first through hole 310 and the second through hole 510, and the mounting and positioning are facilitated.
It should be noted that the colors of the first chip 200, the second chip 400, and the third chip 600 are different from each other, and the first chip 200 is red, the second chip 400 is green, and the third chip 600 is blue.
For example, as shown in fig. 1 and 2, one red first chip 200, one green second chip 400, and one blue third chip 600 form one pixel in the same pixel region 110, and can display a color screen.
The method for manufacturing the Micro LED display screen provided by the embodiment of the second aspect of the invention is used for manufacturing the Micro LED display screen of any one of claims 1 to 6, and comprises the following steps:
s100, arranging a plurality of first chips 200 in an array on a first substrate 100;
s200, arranging a plurality of second chips 400 on the second substrate 300 in an array;
s300, arranging a plurality of third chips 600 on the third substrate 500 in an array;
s400, covering the first substrate 100 with the second substrate 300, so that the first chips 200 are exposed from the first through holes 310 in a one-to-one correspondence;
s500, the third substrate 500 is covered on the second substrate 300, so that the first chips 200 are exposed from the second through holes 510 in a one-to-one correspondence manner, and the second chips 400 are exposed from the third through holes 520 in a one-to-one correspondence manner.
For example, as shown in fig. 5, the steps S100, S200, and S300 are performed first, the first chips 200 are arranged on the first substrate 100 in an array, the second chips 400 are arranged on the second substrate 300 in an array, the third chips 600 are arranged on the third substrate 500 in an array, and then the steps S400 and S500 are performed to cover the second substrate 300 on the first substrate 100, so that the first chips 200 are exposed from the first through holes 310 in a one-to-one correspondence manner, and the third substrate 500 is covered on the second substrate 300, so that the first chips 200 are exposed from the second through holes 510 in a one-to-one correspondence manner, and the second chips 400 are exposed from the third through holes 520 in a one-to-one correspondence manner. The first chip 200 is firstly mounted on the first substrate 100, the second chip 400 is mounted on the second substrate 300, the third chip 600 is mounted on the third substrate 500, and then the first substrate 100, the second substrate 300 and the third substrate 500 are mutually overlapped, so that the chip spacing on each substrate is large, and the mounting is respectively carried out, which is favorable for reducing the difficulty of production, detection and maintenance.
It should be noted that, in S100, a plurality of first chips 200 are arranged in an array on the first substrate 100; s200, arranging a plurality of second chips 400 on the second substrate 300 in an array; s300, the three steps of arranging the plurality of third chips 600 on the third substrate 500 are performed simultaneously, which can reduce the number of processes and improve the production efficiency.
According to a third aspect of the present invention, the Micro LED display device includes the Micro LED display screen provided in any one of the embodiments.
The Micro LED display screen capable of reducing the difficulty of production, detection and maintenance is adopted, and the performance of the Micro LED display equipment is improved.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention. Furthermore, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.
Claims (8)
- Micro LED display screen, its characterized in that includes:the array-type liquid crystal display panel comprises a first substrate and a plurality of first chips, wherein a plurality of pixel areas arranged in an array mode are arranged on the surface of the first substrate, the first chips are arranged in the array mode on the surface of the first substrate and correspond to the pixel areas one by one;the second substrate covers the surface of the first substrate, a plurality of first through holes are formed in the second substrate in an array arrangement, so that the first chips are exposed out of the first through holes in a one-to-one correspondence manner, a plurality of second chips are arranged on the surface of the second substrate in an array arrangement manner and correspond to the plurality of pixel regions in a one-to-one correspondence manner;the third substrate is covered on the surface of the second substrate and provided with a plurality of second through holes which are arranged in an array manner so that the first chips are exposed from the second through holes in a one-to-one correspondence manner, the third substrate is provided with a plurality of third through holes which are arranged in an array manner so that the second chips are exposed from the third through holes in a one-to-one correspondence manner, the third chips are provided in a plurality, and the third chips are arranged on the surface of the third substrate in an array manner and correspond to the pixel regions in a one-to-one correspondence manner;wherein the first substrate, the second substrate and the third substrate are electrically connected to each other.
- 2. A Micro LED display screen according to claim 1, wherein the surface of the first substrate adjacent to the second substrate is provided with a plurality of first contacts arranged in an array, the surface of the second substrate adjacent to the first substrate is provided with a plurality of second contacts arranged in an array, the plurality of first contacts are electrically connected to the plurality of second contacts in a one-to-one correspondence, and the plurality of second contacts are electrically connected to the plurality of second chips in a one-to-one correspondence; a plurality of third contacts arranged in an array are arranged on the surface, close to the third substrate, of the second substrate, a plurality of fourth contacts arranged in an array are arranged on the surface, close to the second substrate, of the third substrate, the plurality of third contacts are electrically connected with the plurality of fourth contacts in a one-to-one correspondence manner, and the plurality of fourth contacts are electrically connected with the plurality of third chips in a one-to-one correspondence manner; the surface of the first substrate, which is close to the second substrate, is provided with a plurality of fifth contacts arranged in an array, the surface of the second substrate, which is close to the first substrate, is provided with a plurality of sixth contacts arranged in an array, the plurality of fifth contacts are electrically connected with the plurality of sixth contacts in a one-to-one correspondence manner, and the plurality of sixth contacts are electrically connected with the plurality of third contacts in a one-to-one correspondence manner.
- 3. A Micro LED display screen as recited in claim 2, wherein the first contact is aligned with the second contact, the second contact is aligned with the second chip, the third contact is aligned with the fourth contact, the fourth contact is aligned with the third chip, the fifth contact is aligned with the sixth contact, and the sixth contact is aligned with the third contact.
- 4. A Micro LED display screen according to claim 1, wherein the first through hole is aligned with the second through hole.
- 5. A Micro LED display screen according to claim 1, wherein the first chip, the second chip and the third chip are of different colors.
- 6. A Micro LED display screen as recited in claim 5, wherein the first chip is red, the second chip is green, and the third chip is blue.
- A Micro LED display screen manufacturing method for manufacturing a Micro LED display screen according to any one of claims 1 to 6, comprising the steps of:arranging a plurality of first chip arrays on the first substrate, simultaneously arranging a plurality of second chip arrays on the second substrate, and simultaneously arranging a plurality of third chip arrays on the third substrate;covering the second substrate on the first substrate to enable the first chips to be exposed out of the first through holes in a one-to-one correspondence manner;covering the second substrate with the third substrate, so that the first chips are exposed from the second through holes in a one-to-one correspondence manner, and the second chips are exposed from the third through holes in a one-to-one correspondence manner.
- A Micro LED display device, comprising the Micro LED display screen of any one of claims 1 to 6.
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| CN107240356B (en) * | 2017-06-30 | 2024-05-07 | 利亚德光电股份有限公司 | Full-color LED display unit and preparation method thereof |
| CN108172570B (en) * | 2017-12-25 | 2020-07-03 | 维沃移动通信有限公司 | Optical device, preparation method and equipment |
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| TWI703722B (en) * | 2018-08-06 | 2020-09-01 | 友達光電股份有限公司 | Light emitting device |
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| CN204732100U (en) * | 2015-07-14 | 2015-10-28 | 郑泳鑫 | A kind of multiplex LED billboard |
| CN109326580A (en) * | 2018-11-20 | 2019-02-12 | 中国科学院苏州纳米技术与纳米仿生研究所南昌研究院 | A kind of multi-chip package interconnection architecture and multi-chip package interconnected method |
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