CN113917803B - Optical direct writing imaging device - Google Patents

Optical direct writing imaging device Download PDF

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Publication number
CN113917803B
CN113917803B CN202111203672.9A CN202111203672A CN113917803B CN 113917803 B CN113917803 B CN 113917803B CN 202111203672 A CN202111203672 A CN 202111203672A CN 113917803 B CN113917803 B CN 113917803B
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light
modulation device
digital
target image
image information
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CN113917803A (en
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陈东
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Hefei Xinqi Microelectronics Equipment Co ltd
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Hefei Xinqi Microelectronics Equipment Co ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2051Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention discloses an optical direct writing imaging device, which comprises: a first digital optical spatial modulation device and a second digital optical spatial modulation device; the first light source emits a direct writing light beam with a first wavelength and projects the direct writing light beam to the first digital light space modulation device, and the direct writing light beam is reflected to an imaging surface coated with a photosensitive material by the first digital light space modulation device through the imaging system; the second light source emits a suppressed light beam with a second wavelength and projects the suppressed light beam to the second digital light space modulation device, and the suppressed light beam is reflected to an imaging surface coated with a photosensitive material by the second digital light space modulation device through an imaging system; the control module controls the first digital light space modulation device and the second digital light space modulation device to act so as to reflect light carrying target image information and reflect light carrying inhibition image information; the imaging system converges and images the light rays at the light sensitive surface, and suppresses the image to be a contour image of the target image. The device provided by the embodiment of the invention can reach the resolution capability of the super diffraction limit.

Description

Optical direct writing imaging device
Technical Field
The invention relates to the technical field of imaging equipment, in particular to an optical direct writing imaging device.
Background
In optical direct-write lithography, resolution is limited by the diffraction limit of light, which is typically only half the wavelength of light. In the confocal microscopy, as shown in fig. 1, a super diffraction limit technique has been applied, in which a dual beam is used to perform direct writing lithography on a target image, the dual beam includes a suppression beam and an excitation beam, the suppression beam is focused into a ring shape, the excitation beam is focused in the ring-shaped center of the suppression beam and forms a focused spot, and since the ring-shaped suppression beam can raise the threshold value of the photochemical reaction of the photosensitive material to the excitation light, and the photosensitive material on the substrate surface only reacts with the excitation beam, only the photosensitive material in the center of the ring-shaped suppression beam can be subjected to laser direct writing by the excitation beam, and an optical direct writing imaging apparatus 100 'as shown in fig. 2 can be used to perform laser direct writing, the dual beam emitted from the light source K is modulated by the light spatial modulation device Q, and the modulated light is projected to the substrate surface coated with the photosensitive material on the exposure stage 8' through the beam splitting element 7 'and the imaging system 6', so that the resolution of the photosensitive material can be made much smaller than the limit of the diffraction limit. The resolution of the existing optical direct-writing exposure system is related to the numerical aperture of the system, wherein the larger the numerical aperture is, the higher the resolution is, but the smaller the area of lens exposure is. In some schemes, a technology of using a micro lens array device to perform secondary imaging is proposed, for example, the technology can be described with reference to fig. 3, light emitted by a light source K irradiates onto a reflector M through a collimating lens a, the reflector M reflects the light and projects the light into a light space modulation device Q, such as a DMD device, the light space modulation device Q modulates the light and projects the modulated light to a micro lens array module N through a collimating lens b and a collimating lens c, the micro lens array module N processes the light, and the processed light is finally projected onto an exposure surface substrate P through a collimating lens d and a collimating lens e, so that direct writing of a target image on a substrate surface coated with a photosensitive material is realized. When the micro-lens array device is used for secondary imaging, a larger lens exposure area can be kept, and meanwhile, the system is ensured to have a larger numerical aperture and higher resolution.
In the related art, when a scheme of performing secondary imaging using a microlens array device is adopted, resolution is still limited by the diffraction limit, and the resolution capability exceeding the diffraction limit cannot be achieved.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present invention is to provide an optical direct-write imaging apparatus capable of limiting a direct-write beam to exposure in a region smaller than a diffraction limit and ensuring a high resolution of the optical direct-write imaging apparatus.
In order to achieve the above object, an optical direct writing imaging device according to an embodiment of a first aspect of the present invention includes: a first digital optical spatial modulation device and a second digital optical spatial modulation device; a first light source for emitting a direct write beam having a first wavelength, the direct write beam being projected to the first digital light spatial modulation device, wherein the direct write beam is capable of generating a photosensitive reaction with a photosensitive material on a surface of a substrate; a second light source for emitting a suppressing light beam having a second wavelength, the suppressing light beam being projected to the second digital light spatial modulation device, wherein the suppressing light beam does not generate a photosensitive reaction with a photosensitive material of the substrate surface, is for suppressing an effect of the direct writing light beam on the photosensitive reaction with the photosensitive material, and the second wavelength is not equal to the first wavelength; the control module is connected with the first digital light space modulation device and the second digital light space modulation device and is used for controlling the first digital light space modulation device to act according to target image information so that the first digital light space modulation device modulates the projected direct writing light beam and emits light carrying the target image information, and controlling the second digital light space modulation device to act according to the suppressed image information so that the second digital light space modulation device modulates the projected suppressed light beam and emits light carrying the suppressed image information; the imaging system is used for superposing and projecting the light carrying the target image information and the light carrying the inhibition image information on the surface of the substrate coated with the smooth material so as to form a superposed image on the surface of the substrate coated with the smooth material, wherein the superposed image comprises a target image, and the inhibition image is a contour image of the target image.
According to the optical direct-writing imaging device provided by the embodiment of the invention, the first digital light space modulation device and the second digital light space modulation device are adopted, the inhibition light beam is added to inhibit the direct-writing light beam, so that the direct-writing light beam is limited in a smaller range, the target image taking the inhibition image as a contour is projected on the photosensitive material on the surface of the substrate, the target image formed by the projection of the direct-writing light beam is ensured not to be limited by the diffraction limit, and therefore, the pattern line characteristic smaller than the diffraction limit can be formed, the photochemical reaction threshold value of the photosensitive material to the direct-writing light beam can be improved, and the optical direct-writing imaging device is ensured to have higher resolution.
In some embodiments of the invention, the first digital light spatial modulation device is disposed in a vertical direction with respect to the second digital light spatial modulation device.
In some embodiments of the invention, the optical direct write imaging apparatus further comprises: the light splitting element is arranged on the emergent light paths of the first digital light space modulation device and the second digital light space modulation device and is used for transmitting light carrying the target image information and reflecting light carrying the inhibition image information.
In some embodiments of the invention, the light splitting element is at a first angle to an outgoing light path of the first digital light spatial modulation device and at a second angle to an outgoing light path of the second digital light spatial modulation device, the sum of the first angle and the second angle being 90 °.
In some embodiments of the invention, the first wavelength is less than the second wavelength.
In some embodiments of the invention, the first wavelength of the direct write beam comprises ultraviolet light.
In some embodiments of the invention, the second wavelength of the suppression beam comprises red or infrared light.
In some embodiments of the invention, the optical direct write imaging apparatus further comprises an exposure stage for placing the substrate coated with photosensitive material.
In some embodiments of the present invention, the first light source includes a plurality of first sub-light sources having different first wavelengths, and the first sub-light sources of the corresponding wavelengths in the first light source are controlled to be activated according to a photosensitive band of light by the photosensitive material on the surface of the substrate.
In some embodiments of the present invention, the second light source includes a plurality of second sub-light sources having different second wavelengths, and the second sub-light sources of the second light source, the wavelengths of which do not belong to the photosensitive wavelength band, are controlled to be activated according to the photosensitive wavelength band of the light by the photosensitive material on the surface of the substrate.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic diagram of a dual beam in the related art;
FIG. 2 is a schematic diagram of an optical direct-write imaging apparatus in the related art;
FIG. 3 is a schematic diagram of a related art technique for performing secondary imaging using a microlens array device;
FIG. 4 is a schematic diagram of an optical direct write imaging apparatus according to one embodiment of the invention;
FIG. 5 is a schematic illustration of a target image according to one embodiment of the invention;
FIG. 6 is a schematic illustration of a contour image according to one embodiment of the invention;
FIG. 7 is a schematic illustration of a target image and contour image combination in accordance with an embodiment of the invention;
FIG. 8 (1) is a schematic diagram of an exposure linewidth of a direct write beam according to one embodiment of the present invention;
FIG. 8 (2) is a schematic diagram of the exposure linewidth of the write-through beam after increasing the suppression beam according to one embodiment of the present invention;
FIG. 9 is a schematic illustration of a target image and contour image combination in accordance with another embodiment of the invention;
Fig. 10 is a schematic diagram of an optical direct write imaging apparatus according to another embodiment of the present invention.
Reference numerals:
in the prior art:
An optical direct-write imaging device 100';
a light source K, a light space modulation device Q, an imaging system 6', a light splitting element 7', an exposure stage 8';
a collimating lens a, a collimating lens b, a collimating lens c, a collimating lens d, a collimating lens e, a micro lens reflecting mirror M, an array module N and an exposure surface substrate P;
In an embodiment of the invention:
An optical direct-write imaging device 100;
the device comprises a first digital light space modulation device 1, a second digital light space modulation device 2, a first light source 3, a second light source 4, a control module 5, an imaging system 6, a light splitting element 7, an exposure stage 8 and an image acquisition module 9.
Detailed Description
Embodiments of the present invention will be described in detail below, by way of example with reference to the accompanying drawings.
An optical direct write imaging apparatus 100 according to an embodiment of the present invention is described below with reference to fig. 4 to 10.
In some embodiments of the present invention, as shown in fig. 4, a schematic diagram of an optical direct-write imaging apparatus according to an embodiment of the present invention, where the optical direct-write imaging apparatus 100 includes a first digital light spatial modulation device 1, a second digital light spatial modulation device 2, a first light source 3, a second light source 4, a control module 5, and an imaging system 6.
In some embodiments, the first digital optical spatial modulation device 1 and the second digital optical spatial modulation device 2 may use a DMD (Digital Micromirror Device ) device or an LCoS (Liquid Crystal on Silicon, liquid crystal silicon surface) or other applicable digital optical spatial modulator, where the DMD device is formed by a plurality of small aluminum reflective mirrors, the number of the mirrors is determined by the display resolution, one small mirror corresponds to one pixel, and the reflectivity of the DMD device is high and the contrast ratio is high.
The first light source 3 is configured to emit a direct writing light beam having a first wavelength, and the direct writing light beam is projected onto the first digital light space modulation device 1, where the direct writing light beam and the photosensitive material on the substrate surface can generate a photosensitive reaction, that is, the direct writing light beam carrying the target image information is projected onto the substrate surface coated with the photosensitive material, and a target image can be formed on the substrate.
Wherein in an embodiment the direct write beam of the first wavelength may comprise ultraviolet light. Ultraviolet light is of a shorter wavelength, and in optical direct-write applications, the direct-write beam uses ultraviolet light to facilitate direct-writing smaller linewidth images on photosensitive materials on the substrate surface.
The second light source 4 is configured to emit a suppression light beam having a second wavelength, where the suppression light beam is projected onto the second digital light spatial modulation device 2, and the suppression light beam does not generate a photosensitive reaction with the photosensitive material on the surface of the substrate, and only plays a role in suppressing the photosensitive reaction between the direct writing light beam and the photosensitive material, and the second wavelength is not equal to the first wavelength. In some embodiments, the second wavelength of the suppression beam may include red or infrared light. The wavelength of the red or infrared light is longer and the difference from the wavelength of the ultraviolet light is larger, i.e. the first wavelength is smaller than the second wavelength. In the optical direct writing application, when red wave light or infrared wave light is used as the inhibiting light, the photosensitive material on the surface of the substrate only generates photosensitive reaction with the direct writing light beam, but does not generate photosensitive reaction with the inhibiting light beam, and the inhibiting light beam only changes the photosensitive reaction threshold value of the photosensitive material on the substrate to the direct writing light beam, so that the photosensitive efficiency of the direct writing light beam to the photosensitive material is inhibited in the light irradiation inhibiting area.
The control module 5 is connected to the first digital optical spatial modulation device 1 and the second digital optical spatial modulation device 2, and is configured to control the first digital optical spatial modulation device 1 to operate according to the target image information, so that the first digital optical spatial modulation device 1 modulates the projected direct-write beam and emits light carrying the target image information, and control the second digital optical spatial modulation device 2 to operate according to the suppressed image information, so that the second digital optical spatial modulation device 2 modulates the projected suppressed beam and emits light carrying the suppressed image information.
Specifically, the control module 5 may include a device having a data processing function, such as a data processing chip or a single chip microcomputer, where the control device 5 controls the first digital optical spatial modulation device 1 and the second digital optical spatial modulation device 2 to be turned on according to the target image information, and controls the angles of the respective mirrors in the first digital optical spatial modulation device 1 and the second digital optical spatial modulation device 2, so that the first digital optical spatial modulation device 1 reflects the light carrying the target image information, and the second digital optical spatial modulation device 2 reflects the light carrying the suppressed image information.
The imaging system 6 is configured to superimpose and project light carrying the target image information and light carrying the suppression image information onto the surface of the substrate coated with the photosensitive material to form a superimposed image on the surface of the substrate coated with the photosensitive material, the superimposed image including the target image and the suppression image, the suppression image being a contour image of the target image, that is, the suppression image surrounding the target image, the target image being limited in the center of the suppression image, since the write-through light beam can generate a photosensitive reaction with the photosensitive material on the surface of the substrate, and the suppression light beam does not generate a photosensitive reaction with the photosensitive material on the surface of the substrate, only the write-through light carrying the target image information and the suppression light carrying the suppression image information are superimposed and projected onto the surface of the substrate coated with the photosensitive material at the same time, so that when the write-through light carrying the target image information and the suppression light carrying the suppression image information are superimposed and projected onto the surface of the substrate coated with the photosensitive material at the same time, only the target image can be written directly onto the surface of the substrate coated with the photosensitive material, the suppression image is not written directly, and the suppression image can be suppressed from spreading the contour of the write-through image, and therefore the write-through image can be suppressed, corresponding to a mask forming the target image, and the write-through the suppression image can be limited in a region smaller in the diffraction limit.
Wherein a target image and a contour image converging onto a surface of a substrate coated with a photosensitive material according to an embodiment of the present invention are described with reference to fig. 5 to 7. FIG. 5 is a schematic illustration of a target image according to one embodiment of the invention; FIG. 6 is a schematic illustration of a contour image according to one embodiment of the invention; fig. 7 is a schematic diagram of a target image and contour image combination in accordance with an embodiment of the invention.
Taking the target image shown in fig. 5-7 as a cross, the first digital light spatial modulation device 1 reflects the light carrying the target image information, and the light carrying the target image information is projected on the surface of the substrate coated with the photosensitive material to form the target image shown in fig. 5 after passing through the imaging system 6. The second digital light spatial modulation device 2 reflects the light carrying the suppressed image information, which after passing through the imaging system 6 is projected on the surface of the substrate coated with the photosensitive material to form a suppressed image as shown in fig. 6. The superposition of the two light beams when projected onto the substrate surface coated with the photosensitive material forms an image as shown in fig. 7, and the suppressed image is a contour image of the target image.
Further, according to an embodiment of the present invention, an exposure line width of the write-through beam can be described according to fig. 8, where (1) in fig. 8 is a schematic diagram of an exposure line width of the write-through beam according to an embodiment of the present invention, where curve a represents an intensity distribution of one spot of the write-through beam on the imaging surface, and a1 represents an exposure line width of the write-through beam when the suppression beam is not added, and the exposure line width is relatively wide, and is easy to cause blurring of an edge of the write-through image due to limitation of diffraction limit, resulting in blurring of the image. Fig. 8 (2) is a schematic diagram of an exposure line width of the write-through beam after the addition of the suppression beam according to an embodiment of the present invention, wherein a curve a represents a spot intensity distribution of the write-through beam, a curve B represents a spot intensity distribution of the suppression beam, and the write-through beam is limited to the suppression beam middle area, a2 represents the exposure line width of the write-through beam after the addition of the suppression beam, and a2 is smaller than a1. Therefore, after the inhibition beam is added to inhibit the photosensitive reaction of the direct writing beam and the photosensitive material, the direct writing beam can be limited in a smaller range, the target image formed by the projection of the direct writing beam is ensured not to be limited by the diffraction limit, and the resolution of the direct writing beam on the photosensitive material can be improved.
According to the optical direct-write imaging apparatus 100 provided by the embodiment of the invention, the first digital optical spatial modulation device 1 and the second digital optical spatial modulation device 2 are adopted, so that the direct-write light beam is restrained by adding the restraining light beam, the direct-write light beam is restrained within a smaller range, the target image taking the restraining image as a contour is projected on the surface of the substrate coated with the photosensitive material, the target image formed by the projection of the direct-write light beam is ensured not to be restrained by the diffraction limit, thereby forming a pattern line feature smaller than the diffraction limit, the restraining light beam can improve the photochemical reaction threshold of the substrate surface coated with the photosensitive material on the direct-write light beam, and further the optical direct-write imaging apparatus 100 is ensured to have higher resolution.
In the embodiment of the present invention, the arrangement positions of the first digital optical spatial modulator 1 and the second digital optical spatial modulator 2 are not particularly limited, and the direct writing light beam entering the imaging system 6 can be made to overlap with the suppression light beam. In some embodiments of the present invention, as shown in fig. 4, the first digital optical spatial modulation device 1 and the second digital optical spatial modulation device 2 are disposed in a vertical direction. The light path of the light ray carrying the target image information, which is regulated and sent out by the first digital light space modulation device 1, is mutually perpendicular to the direction of the light path of the light ray carrying the inhibition image information, which is regulated and sent out by the second digital light space modulation device 2, and the light path is simple and easy to construct. Of course, the optical paths may also be changed by adding some light reflecting elements or other light elements to adjust the setting positions of the first digital light spatial modulator 1 and the second digital light spatial modulator 2, and may be specifically set according to the layout of the system.
Further, as shown in fig. 4, the optical direct-writing imaging apparatus 100 further includes a light splitting element 7, where the light splitting element 7 is disposed on the outgoing light paths of the first digital optical spatial modulation device 1 and the second digital optical spatial modulation device 2, and is configured to transmit the light carrying the target image information and reflect the light carrying the suppression image information, so that the light beams emitted by the digital optical spatial modulation device 1 and the second digital optical spatial modulator 2 overlap and are incident on the imaging system 6.
In some embodiments of the invention, the light-splitting element 7 makes a first angle with the outgoing light path of the first digital light space modulation device 1 and a second angle with the outgoing light path of the second digital light space modulation device 2, the sum of the first angle and the second angle being 90 °.
The values of the first angle and the second angle may be set according to properties such as the direct writing light beam and the light wavelength of the suppression light beam, and according to the requirements for the transmittance of different types of light rays, and are not particularly limited herein. Before the light reaches the spectroscopic element 7, the optical path of the light carrying the suppression image information is perpendicular to the optical path of the light carrying the target image information, and after transmission or reflection occurs at the position passing through the spectroscopic element 7, the optical path of the light carrying the suppression image information and the optical path of the light carrying the target image information become identical. For example, when the first digital optical spatial modulation device 1 and the second digital optical spatial modulation device 2 are arranged in the vertical direction, the first angle and the second angle can be set to be 45 °, the light ray carrying the target image information reflected by the first digital optical spatial modulation device 1 can pass through the light splitting element 7, and when the light ray carrying the inhibition image information reflected by the second digital optical spatial modulation device 2 is reflected at the light splitting element 7, the reflection angle is 45 °, so that the light ray after reflection and the light path of the transmitted light ray can be just ensured to be consistent.
In some embodiments of the present invention, as shown in fig. 4, the optical direct-write imaging apparatus 100 further includes an exposure stage 8, the exposure stage 8 being for placing a substrate coated with a photosensitive material. After the substrate coated with the photosensitive material is placed on the exposure stage 8, the light carrying the inhibition image information and the light carrying the target image information are focused and imaged on the surface of the substrate coated with the photosensitive material after passing through the imaging system 6. Taking the target image as a cross shape for example, the light ray carrying the target image information reflected by the first digital light space modulation device 1 passes through the light splitting element 7 and is converged by the imaging system 6, and then is projected on the surface of the substrate coated with the photosensitive material to form the target image as shown in fig. 5. The light carrying the suppression image information reflected by the second digital light spatial modulation device 2 is reflected at the spectroscopic element 7 and converged by the imaging system 6, and then projected on the surface of the substrate coated with the photosensitive material to form a suppression image as shown in fig. 6. The suppression image is a contour image of the target image, and when the two beams are projected onto the substrate surface coated with the photosensitive material in a superimposed manner, an image is formed as shown in fig. 7, and the direct writing beam is limited to the middle area of the suppression beam, so that the direct writing beam can be limited to be exposed in an area smaller than the diffraction limit, and thus, the pattern line feature smaller than the diffraction limit can be formed. And the substrate coated with the photosensitive material can only write the direct writing light beam, but not write the inhibiting light beam, so that the inhibiting image on the periphery of the target image cannot interfere with the target image, thereby ensuring better direct writing effect when the target image is written on the surface of the substrate coated with the photosensitive material.
As another example, as shown in fig. 9, a schematic diagram of a target image and contour image combination according to another embodiment of the present invention is shown. Taking the target image shown in fig. 9 as an "·" as an example, a black image area in the center of the image is a projected target image, a contour image around the black area is a suppressed image, and the target image is defined inside the suppressed image. Even when the target image to be written directly onto the surface of the substrate coated with the photosensitive material is small, the direct writing beam is limited to exposure in a region smaller than the diffraction limit, thereby ensuring ultra-high resolution of optical direct writing.
In some embodiments of the invention, the first light source 3 comprises a plurality of first sub-light sources having different first wavelengths, the first sub-light sources of the corresponding wavelengths in the first light source being controlled to be activated in accordance with the wavelength band of the direct write light beam that is capable of generating a photoreaction with the photoreactive material on the substrate surface. The second light source 4 comprises a plurality of second sub-light sources having different second wavelengths, and the second sub-light sources of the second light sources having the wavelengths not sensed are controlled to be activated according to the wavelength band of the suppression light beam which is not capable of generating a photosensitive reaction with the photosensitive material on the substrate surface.
For example, the first light source 3 may include a plurality of first sub-light sources with different first wavelengths as a first sub-light source matrix, wherein the plurality of first sub-light sources in the first sub-light source matrix may emit light beams with multiple wavelengths when activated, or the plurality of first sub-light sources may include a plurality of first sub-light source matrices, each of which emits light beams with different wavelengths when activated. And, the plurality of second sub-light sources having different second wavelengths included in the second light source 4 may be a second sub-light source matrix, wherein the plurality of second sub-light sources in the second sub-light source matrix may emit light beams having a plurality of wavelengths when activated, or the plurality of second sub-light sources may include a plurality of second sub-light source matrices, each of which emits light beams having a different wavelength when activated.
Wherein, partial or all sub-light sources in the first light source 3 and the second light source 4 can be controlled to be started, so that the direct writing light beam is adaptively adjusted and the intensity of the light beam is restrained to meet the requirement of the photosensitive material on the photosensitive reaction of light. And the optical direct writing imaging device 100 of the embodiment of the invention can directly write target images on the substrate coated with different types of photosensitive materials by controlling the first light source 3 to emit a light beam with a wavelength band capable of generating photosensitive reaction with the photosensitive material as a direct writing light beam and controlling the second light source 4 to emit a light beam with a wavelength band incapable of generating photosensitive reaction with the photosensitive material as a suppression light beam according to the wavelength band of the direct writing light beam capable of generating photosensitive reaction with the photosensitive material on the substrate surface and the wavelength band of the suppression light beam incapable of generating photosensitive reaction with the photosensitive material on the substrate surface.
In other embodiments of the present invention, as shown in fig. 10, a schematic diagram of an optical direct-write imaging apparatus according to another embodiment of the present invention, where the optical direct-write imaging apparatus 100 may further include an image acquisition module 9, where the image acquisition module 9 is connected to the substrate coated with the photosensitive material, for acquiring and displaying a target image.
In an embodiment, the image acquisition module 9 may comprise a computer screen, a liquid crystal display screen, etc., and the target image directly written on the surface of the substrate coated with the photosensitive material may be directly acquired and displayed by the image acquisition module 9. In the optical direct writing imaging process, a technician may perform related operations according to the acquired target image, for example, adjust the working states of the first light source 3 and the second light source 4 and the positions of the spectroscopic element 7 and the imaging system 6, or send a command to the control device 5, so as to adaptively adjust the working states of the first digital optical spatial modulation device 1 and the second digital optical spatial modulation device 2, for example, adjust the angles of a plurality of small aluminum reflecting mirrors in the two digital optical spatial modulation devices, respectively, so as to further set or adjust the target image, thereby ensuring the accuracy of directly writing the target image onto the surface of the substrate coated with the photosensitive material.
The optical direct writing imaging device 100 can be a photoetching machine, laser direct writing equipment or applied to a process experiment instrument or processing process equipment, can be used for manufacturing a plane calculation full graph, a mask, a micro lens array and the like, and has wide application range.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.

Claims (7)

1. An optical direct-write imaging apparatus, comprising:
A first light source for emitting a direct write beam having a first wavelength;
The first digital light space modulation device is used for modulating the projected direct-write light beam to emit light rays carrying target image information, wherein the direct-write light beam and a photosensitive material on the surface of the substrate can generate photosensitive reaction;
A second light source for emitting a suppression light beam having a second wavelength;
The second digital light space modulation device is used for modulating the projected inhibition light beam to emit light carrying inhibition image information, wherein the inhibition light beam does not generate photosensitive reaction with a photosensitive material on the surface of the substrate, is used for inhibiting the effect of the photosensitive reaction of the direct writing light beam and the photosensitive material to change the photosensitive reaction threshold value of the photosensitive material on the substrate on the direct writing light beam, and the first wavelength is smaller than the second wavelength;
the control module is connected with the first digital light space modulation device and the second digital light space modulation device and is used for controlling the first digital light space modulation device to act according to target image information and controlling the second digital light space modulation device to act according to suppressed image information;
The imaging system is used for superposing and projecting the light carrying the target image information and the light carrying the inhibition image information on the surface of the substrate coated with the photosensitive material so as to form a target image on the surface of the substrate coated with the photosensitive material, wherein the light carrying the target image information and the light carrying the inhibition image information are superposed into a target image and an inhibition image, and the inhibition image is a contour image of the target image;
the first light source comprises a plurality of first sub-light sources with different first wavelengths, and the first sub-light sources with corresponding wavelengths in the first light source are controlled to be started according to the photosensitive wave bands of the photosensitive materials on the surface of the substrate;
The second light source comprises a plurality of second sub-light sources with different second wavelengths, and the second sub-light sources, the wavelengths of which do not belong to the photosensitive wave bands, in the second light source are controlled to be started according to the photosensitive wave bands of the photosensitive materials on the surface of the substrate.
2. The optical direct write imaging apparatus of claim 1, wherein the first digital light spatial modulation device is disposed in a perpendicular direction to the second digital light spatial modulation device.
3. The optical direct write imaging apparatus of claim 2, further comprising:
The light splitting element is arranged on the emergent light paths of the first digital light space modulation device and the second digital light space modulation device and is used for transmitting light carrying the target image information and reflecting light carrying the inhibition image information.
4. The optical direct write imaging apparatus of claim 3, wherein the light splitting element is at a first angle to an outgoing light path of the first digital light spatial modulation device and at a second angle to an outgoing light path of the second digital light spatial modulation device, a sum of the first angle and the second angle being 90 °.
5. The optical direct write imaging apparatus of claim 1, wherein the direct write beam of a first wavelength comprises ultraviolet light.
6. The optical direct write imaging apparatus of claim 5, wherein the suppression beam of the second wavelength comprises red or infrared light.
7. The optical direct write imaging apparatus of claims 1-6, further comprising an exposure stage for placing said substrate coated with photosensitive material.
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