CN113909484A - W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient and preparation method thereof - Google Patents
W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient and preparation method thereof Download PDFInfo
- Publication number
- CN113909484A CN113909484A CN202111126698.8A CN202111126698A CN113909484A CN 113909484 A CN113909484 A CN 113909484A CN 202111126698 A CN202111126698 A CN 202111126698A CN 113909484 A CN113909484 A CN 113909484A
- Authority
- CN
- China
- Prior art keywords
- composite powder
- thermal conductivity
- expansion coefficient
- thermal expansion
- low thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/20—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
- B22F9/22—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds using gaseous reductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/02—Compacting only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1035—Liquid phase sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/045—Alloys based on refractory metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/04—Alloys based on tungsten or molybdenum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
Abstract
The invention discloses W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient, wherein the thermal conductivity is 200-‑6and/K. The invention also discloses the W-Cu composite with high thermal conductivity and low thermal expansion coefficientThe preparation method of the composite powder comprises the following steps: preparing a W-Cu precursor by a wet chemical method; carrying out pyrolysis reduction on the W-Cu precursor in a hydrogen environment; and (3) pressing and molding the reduced W-Cu composite powder, then heating to 1300 ℃ in a hydrogen atmosphere, preserving the temperature for 140min, and cooling to obtain the W-Cu composite powder. The invention aims to prepare a W-Cu composite precursor by a wet chemical method, obtain W-Cu composite powder with high sintering activity by combining different reduction processes, and prepare the W-Cu composite powder with high density, high thermal conductivity, low thermal expansion coefficient and uniform tissue distribution by subsequent liquid phase sintering.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging materials, in particular to a chemical preparation method of W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient and a composite material thereof.
Background
In integrated circuits, electronic packaging materials function as chip protection, chip support, chip heat dissipation, chip insulation, and chip to external circuit connections, which require packaging materials with excellent electrical and thermal conductivity, good chemical inertness, low thermal expansion coefficient, high hardness, and the like. With the rapid development of microelectronic technology, integrated circuits are being increasingly highly integrated and miniaturized, which means that the packaging material needs to release heat in time, has a low thermal expansion coefficient, and can ensure good thermal matching with semiconductor devices such as Si and GaAs in microelectronic devices, thereby avoiding thermal fatigue failure caused by thermal stress, which cannot be met by conventional packaging materials.
The tungsten-copper (W-Cu) composite material combines the advantages of tungsten (W) and copper (Cu), and has a series of excellent characteristics of high strength, high temperature resistance, arc ablation resistance, good electric and heat conductivity, low thermal expansion coefficient and the like. Therefore, the W-Cu composite material has wide application prospect in the field of electronic packaging. The W-Cu composite material has high thermal conductivity and low thermal expansion coefficient by uniform tissue distribution, special W-Cu network structure and component adjustment of W and Cu, and meets the performance index in the field of electronic packaging.
However, due to the characteristics of W and Cu such as incompatibility and poor wettability, W-Cu composite materials prepared by conventional preparation methods (such as infiltration method and high temperature liquid phase sintering) often have the disadvantages of low density, nonuniform structure and the like. Although the mechanical alloying can prepare the W-Cu composite powder with nano-scale and uniform particle size distribution, the serious powder agglomeration phenomenon can be generated, impurities are easily introduced in the process, the physical properties of the material are not facilitated, and the material is more difficult to be used for batch production.
Disclosure of Invention
The invention aims to provide a chemical preparation method of W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient and a composite material thereof, wherein a wet chemical method is adopted to prepare a W-Cu composite precursor, liquid-liquid doping enables the W source and the Cu source to be mixed at an atomic level, different reduction processes are combined to obtain W-Cu composite powder, the W-Cu composite powder has the characteristics of low oxygen content, ultrafine crystal, controllable granularity and uniform distribution, the sintering activity is high, mass production can be realized, the method is simultaneously suitable for metal injection molding or 3D printing processes, and the W-Cu composite powder with high density, high thermal conductivity, low thermal expansion coefficient and uniform tissue distribution, and the W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient is prepared by post-sequence liquid phase sintering.
The invention provides a preparation method of W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient, which comprises the following steps:
step 1: precursor preparation
Respectively mixing ammonium metatungstate (AMT, Aladdin, purity is more than or equal to 99.95%) and copper nitrate (Cu (NO)3)2·3H2Dissolving O, Aladdin with purity more than or equal to 99.5%) in deionized water, heating and stirring to obtain mixed solution, adding oxalic acid (C) after the mixed solution is transparent2H2O4·2H2O, analytically pure), and the precipitate obtained after the mixed solution is stirred and evaporated to dryness is the W-Cu precursor.
In step 1, the addition amounts of copper nitrate and oxalic acid are 31.29-120.70% and 38-40% of the mass of ammonium metatungstate, respectively, by a stoichiometric method.
Step 2: step-by-step hydrogen pyrolysis reduction
Fully grinding the massive precursor obtained in the step 1 in a mortar to obtain fine powder, and putting the burning boat containing the fine powder into a hydrogen (the purity of the hydrogen is more than or equal to 99.999%) reduction furnace to carry out three-step reduction: firstly, raising the temperature to 380-420 ℃, and preserving the temperature for 20-40min to fully decompose and volatilize the residual organic matters; then raising the temperature to 550-650 ℃, and preserving the heat for 50-70 min; then the temperature is increased to 900 ℃ at 800 ℃ and the temperature is maintained for 240min at 100 ℃ and the temperature is finally decreased to the room temperature.
And step 3: low temperature liquid phase sintering
And (3) pressing the reduced W-Cu composite powder obtained in the step (2) into a green body by adopting a steel die, wherein the pressing force is 500MPa, then placing the green body into a tube furnace, raising the temperature to 1300 ℃ at 1100 ℃ under the atmosphere of hydrogen (the hydrogen purity is more than or equal to 99.999%), preserving the temperature for 140min at 1300 ℃ for 100 ℃ and 140min, and then cooling to room temperature to obtain the W-Cu composite material.
In the prior art, tungsten powder and copper powder are directly mixed to prepare a tungsten-copper composite material, so that the uniformity is poor, more closed gaps exist, and the compactness is generally lower than 98%.
In the prior art, a infiltration method is adopted, tungsten powder is firstly cold-pressed into a blank, is primarily sintered to form a tungsten framework, then pressed copper powder or copper blocks are placed on the framework, and the framework is heated to high temperature, so that copper is melted and infiltrated into gaps of the tungsten blank, and the tungsten-copper material is prepared. Since closed pores (1-3%) are easily formed during the sintering of the tungsten skeleton, a highly dense tungsten-copper alloy cannot be obtained, and at the same time, when the tungsten content is low, it is difficult to form a stable skeleton, limiting the application range of the method.
In the prior art, liquid phase sintering is mainly adopted, namely tungsten powder and copper powder are uniformly mixed, an adhesive is added to the mixture to be cold-pressed into a blank, and then the tungsten-copper composite material is directly obtained through liquid phase sintering at the high temperature of over 1200 ℃. Because of poor wettability of tungsten and copper, a small amount of elements such as Ni and Co are often added in the liquid phase sintering process for densification to improve the wettability, but the elements can reduce the thermal conductivity and the electrical conductivity of the tungsten-copper alloy.
And the nanocrystalline tungsten-copper composite powder is prepared by high-energy wet milling, however, in the process of high-energy wet milling, due to the addition of a ball milling medium and a surfactant, on one hand, the powder is easily polluted, and on the other hand, the reagents form a liquid film on the particle surface to prevent the mechanical alloying of tungsten and copper.
Chinese invention with application number 201110007251.9The patent application (the invention name is a high-tungsten-content high-density fine-grain tungsten copper material and a preparation method thereof, the application is the university of China and south, the application date is 2011, the number is CN102041421A, the publication date is 2011, the number is 05, the number is 04), the high-density fine-grain tungsten copper material is prepared by adopting sol-spray drying, multi-step hydrogen reduction, pressing and two-step sintering, the density is more than 98.5 percent, the grain size is less than 1 mu m, the thermal conductivity is 170-doped 220W/(m.K), and the thermal expansion coefficient is (4.5-7.0) multiplied by 10-6The thermal conductivity of the obtained W-20Cu material is 200--6/K。
The W-Cu composite powder prepared by the wet chemical method is thoroughly reduced, the grain size is controllable (500nm-2 mu m), no obvious agglomeration phenomenon exists, the sintering activity is high, and the density and the physical property of the W-Cu composite material prepared by liquid phase sintering in the follow-up process are obviously improved. Taking a W-20Cu composite material as an example, the compactness of the composite material reaches up to 99.5 percent, the thermal conductivity reaches up to 225W/(m.K), and the thermal expansion coefficient is 7.2 multiplied by 10-6The thermal expansion coefficient is 8.1 multiplied by 10, and the thermal expansion coefficient is superior to that of a commercial W-20Cu composite material (the thermal conductivity is about 210W/(m.K)-6/K)。
The invention has the beneficial effects that:
the W-Cu composite material is prepared by combining a wet chemical method with liquid phase sintering, and the W-Cu precursor prepared by the wet chemical method has good dispersibility and less agglomeration phenomenon. The W-Cu composite powder which is completely reduced can be obtained through subsequent hydrogen pyrolysis reduction, powder with different grain sizes (500nm-2 mu m) can be obtained by controlling reduction process parameters, the purity is high, W phases and Cu phases are uniformly distributed, the density of the composite material obtained by liquid phase sintering at a lower temperature is up to 99%, the thermal conductivity of the W-Cu composite material is obviously improved, and the thermal expansion coefficient is reduced.
Drawings
FIG. 1 is an XRD pattern of the W-Cu composite powder obtained in example 1.
FIG. 2 is a scanning topography of the W-Cu composite powder obtained in example 1.
FIG. 3 is a fracture morphology chart of the W-Cu composite powder obtained in example 1.
Detailed Description
The present invention will be further illustrated with reference to the following specific examples.
Example 1
The preparation method of the W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient comprises the following steps:
step 1: precursor preparation
Respectively mixing ammonium metatungstate (AMT, Aladdin, purity is more than or equal to 99.95%) and copper nitrate (Cu (NO)3)2·3H2Dissolving O, Aladdin with purity more than or equal to 99.5%) in deionized water, heating and stirring to obtain mixed solution, adding oxalic acid (C) after the mixed solution is transparent2H2O4·2H2O, analytically pure), and the precipitate obtained after the mixed solution is stirred and evaporated to dryness is the W-Cu precursor.
Wherein, the addition amounts of the copper nitrate and the oxalic acid are 70.41 percent and 39 percent of the mass of the ammonium metatungstate respectively.
Step 2: reduction of hydrogen
Fully grinding the massive precursor obtained in the step 1 in a mortar to obtain fine powder, and putting the burning boat containing the fine powder into a hydrogen (the purity of the hydrogen is more than or equal to 99.999%) reduction furnace to carry out three-step reduction: firstly, raising the temperature to 400 ℃, and preserving the temperature for 30min to fully decompose and volatilize the residual organic matters; then heating to 600 ℃, and preserving heat for 60 min; then the temperature is increased to 850 ℃, the temperature is preserved for 180min, and finally the temperature is reduced to the room temperature.
And step 3: liquid phase sintering
And (3) pressing the reduced W-20Cu composite powder obtained in the step (2) into a green body by adopting a steel die, wherein the pressing force is 400MPa, then placing the green body into a tubular furnace, raising the temperature to 1200 ℃ under the atmosphere of hydrogen (the purity of the hydrogen is more than or equal to 99.999%), preserving the temperature at 1200 ℃ for 120min, and then cooling to room temperature to obtain the W-20Cu composite material.
XRD characterization was performed on the W-20Cu composite material obtained in this example, as shown in FIG. 1. From fig. 1, it can be observed that a distinct W peak and Cu peak exist, and no other impurity peak exists, indicating that the W — Cu precursor is completely reduced.
The W-20Cu composite material obtained in this example was subjected to electron microscope scanning, as shown in FIG. 2. As can be seen from fig. 2: the average grain size of the obtained W-20Cu composite material is 800nm, the powder granularity is uniform, and the dispersion degree is higher.
The section of the W-20Cu composite material obtained in this example was subjected to electron microscope scanning, as shown in FIG. 3. As can be seen from fig. 3: the W particles which have no obvious holes and are uniformly distributed form a framework structure with good porosity, so that the Cu phase is uniformly distributed in a network structure in the W framework.
The density of the W-20Cu composite material obtained by the embodiment reaches 99.5 percent, the thermal conductivity reaches 225/(m.K), and the thermal expansion coefficient is 7.2 multiplied by 10-6The thermal expansion coefficient is 8.1 multiplied by 10, and the thermal expansion coefficient is superior to that of a commercial W-20Cu composite material (the thermal conductivity is about 210W/(m.K)-6/K)。
Example 2
The chemical preparation method of the W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient comprises the following steps:
step 1: precursor preparation
Respectively mixing ammonium metatungstate (AMT, Aladdin, purity is more than or equal to 99.95%) and copper nitrate (Cu (NO)3)2·3H2Dissolving O, Aladdin with purity more than or equal to 99.5%) in deionized water, heating and stirring to obtain mixed solution, adding oxalic acid (C) after the mixed solution is transparent2H2O4·2H2O, analytically pure), and the precipitate obtained after the mixed solution is stirred and evaporated to dryness is the W-Cu precursor.
Wherein the addition amounts of the copper nitrate and the oxalic acid are 31.29% and 38% of the mass of the ammonium metatungstate respectively.
Step 2: reduction of hydrogen
Fully grinding the massive precursor obtained in the step 1 in a mortar to obtain fine powder, and putting the burning boat containing the fine powder into a hydrogen (the purity of the hydrogen is more than or equal to 99.999%) reduction furnace to carry out three-step reduction: firstly, raising the temperature to 380 ℃, and preserving the temperature for 20min to fully decompose and volatilize the residual organic matters; then heating to 550 ℃, and preserving heat for 50 min; then the temperature is increased to 800 ℃, the temperature is preserved for 100min, and finally the temperature is reduced to the room temperature.
And step 3: liquid phase sintering
And (3) pressing the reduced W-10Cu composite powder obtained in the step (2) into a green body by adopting a steel die, wherein the pressing force is 300MPa, then placing the green body into a tubular furnace, raising the temperature to 1100 ℃ under the atmosphere of hydrogen (the purity of the hydrogen is more than or equal to 99.999 percent), preserving the temperature at 1100 ℃ for 100min, and then cooling to room temperature to obtain the W-10Cu composite material.
The density of the W-10Cu composite material obtained in the embodiment reaches 96.3%, the thermal conductivity reaches 200W/(m.K), and the thermal expansion coefficient is 5.6 multiplied by 10-6The thermal expansion coefficient of the material is 6.1 multiplied by 10, and the thermal expansion coefficient of the material is 6.1 multiplied by 10-6/K)。
Example 3
The preparation method of the W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient comprises the following steps:
step 1: precursor preparation
Respectively mixing ammonium metatungstate (AMT, Aladdin, purity is more than or equal to 99.95%) and copper nitrate (Cu (NO)3)2·3H2Dissolving O, Aladdin with purity more than or equal to 99.5%) in deionized water, heating and stirring to obtain mixed solution, adding oxalic acid (C) after the mixed solution is transparent2H2O4·2H2O, analytically pure), and the precipitate obtained after the mixed solution is stirred and evaporated to dryness is the W-Cu precursor.
Wherein the addition amounts of the copper nitrate and the oxalic acid are 120.70% and 40% of the mass of the ammonium metatungstate respectively.
Step 2: reduction of hydrogen
Fully grinding the massive precursor obtained in the step 1 in a mortar to obtain fine powder, and putting the burning boat containing the fine powder into a hydrogen (the purity of the hydrogen is more than or equal to 99.999%) reduction furnace to carry out three-step reduction: firstly, raising the temperature to 420 ℃, and preserving the temperature for 40min to fully decompose and volatilize the residual organic matters; then heating to 650 ℃, and preserving heat for 70 min; then the temperature is increased to 900 ℃, the temperature is preserved for 240min, and finally the temperature is reduced to the room temperature.
And step 3: liquid phase sintering
And (3) pressing the reduced W-Cu composite powder obtained in the step (2) into a green body by adopting a steel die, wherein the pressing force is 500MPa, then placing the green body into a tubular furnace, raising the temperature to 1300 ℃ under the atmosphere of hydrogen (the purity of the hydrogen is more than or equal to 99.999 percent), preserving the temperature at 1300 ℃ for 140min, and then cooling to room temperature to obtain the W-30Cu composite material.
The density of the W-30Cu composite material obtained in the embodiment reaches 98.5%, the thermal conductivity reaches 235W/(m.K), and the thermal expansion coefficient is 9.3 multiplied by 10-6The thermal expansion coefficient is 10.1 multiplied by 10, and the thermal expansion coefficient is superior to that of a commercial W-30Cu composite material (the thermal conductivity is about 220W/(m.K)-6/K)。
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. A chemical preparation method of W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient and a preparation method of composite material thereof are characterized by comprising the following steps: preparing a W-Cu precursor by a wet chemical method; carrying out pyrolysis reduction on the W-Cu precursor in a hydrogen environment; and (3) pressing and molding the reduced W-Cu composite powder, then heating to 1300 ℃ in a hydrogen atmosphere, preserving the heat for 140min, and cooling to obtain the W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient.
2. The method for preparing W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient according to claim 1, wherein the step of preparing the tungsten-copper precursor by wet chemical method comprises the following steps: and mixing the tungstate aqueous solution and the copper salt aqueous solution, heating and stirring until the system solution is transparent, adding the oxalic acid aqueous solution, and continuously heating and stirring until the solution is completely evaporated to obtain the W-Cu precursor.
3. The method of claim 2, wherein the tungstate is ammonium metatungstate, ammonium paratungstate, or ammonium tungstate, and the copper salt is copper nitrate.
4. The method for preparing W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient according to claim 2, wherein the solute of the tungstate aqueous solution is ammonium metatungstate, the solute of the copper salt aqueous solution is copper nitrate trihydrate, and the solute of the oxalic acid aqueous solution is oxalic acid dihydrate, so that the mass ratio of the copper nitrate trihydrate to the ammonium metatungstate is 31.29-120.70: 100, the mass ratio of oxalic acid dihydrate to ammonium metatungstate is 38-40: 100.
5. the method for preparing W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient according to claim 1, wherein the thermal decomposition reduction is performed by the following steps: pulverizing the W-Cu precursor, heating to 420 ℃ at 380 ℃ in a hydrogen environment, preserving heat for 20-40min, heating to 650 ℃ at 550 ℃, preserving heat for 50-70min, heating to 900 ℃ at 800 ℃, preserving heat for 240min, and finally cooling to room temperature.
6. The method as claimed in claim 1, wherein the pressure for pressing the reduced W-Cu composite powder is 300-500 MPa.
7. A W-Cu composite powder having high thermal conductivity and low thermal expansion coefficient, characterized by being produced by the method for producing a W-Cu composite powder having high thermal conductivity and low thermal expansion coefficient according to any one of claims 1 to 6.
8. The W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient according to claim 7, wherein the crystal grain size is 500nm to 2 μm.
9. The W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient as claimed in claim 7, wherein the thermal conductivity is 200--6/K。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111126698.8A CN113909484A (en) | 2021-09-26 | 2021-09-26 | W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111126698.8A CN113909484A (en) | 2021-09-26 | 2021-09-26 | W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113909484A true CN113909484A (en) | 2022-01-11 |
Family
ID=79235917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111126698.8A Pending CN113909484A (en) | 2021-09-26 | 2021-09-26 | W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113909484A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114833348A (en) * | 2022-05-07 | 2022-08-02 | 合肥工业大学 | Large-scale preparation method of controllable high-quality W-Cu composite powder |
| CN114932222A (en) * | 2022-06-17 | 2022-08-23 | 合肥工业大学智能制造技术研究院 | Method for improving density of tungsten-copper alloy |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5956560A (en) * | 1994-12-22 | 1999-09-21 | Osram Sylvania Inc. | Tungsten-copper composite powder |
| US20030124016A1 (en) * | 2001-12-27 | 2003-07-03 | Byoung Kee Kim | Method of producing tungsten-copper based composite powder and sintered alloys for heat-sink using said composite powder |
| CN101078068A (en) * | 2007-07-05 | 2007-11-28 | 北京科技大学 | Method for preparing ultra-fine crystal grain tungsten-copper alloy and tungsten-copper alloy |
| CN102161097A (en) * | 2011-01-29 | 2011-08-24 | 中南大学 | Preparation method of novel fine grained tungsten copper electrode material |
| CN106077695A (en) * | 2016-08-11 | 2016-11-09 | 河南科技大学 | A kind of preparation method of high-copper tungsten copper nano composite powder |
| CN107433334A (en) * | 2017-08-12 | 2017-12-05 | 佛山市诚新泰不锈钢制品有限公司 | A kind of preparation method of tungsten-copper alloy |
| CN110142415A (en) * | 2019-07-01 | 2019-08-20 | 北京工业大学 | The oxide-doped more alloy phase tungsten-rhenium alloy powder of one kind and preparation method |
| CN113278837A (en) * | 2021-05-17 | 2021-08-20 | 合肥工业大学 | High-density Y2O3Preparation method of doped W-Re alloy |
-
2021
- 2021-09-26 CN CN202111126698.8A patent/CN113909484A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5956560A (en) * | 1994-12-22 | 1999-09-21 | Osram Sylvania Inc. | Tungsten-copper composite powder |
| US20030124016A1 (en) * | 2001-12-27 | 2003-07-03 | Byoung Kee Kim | Method of producing tungsten-copper based composite powder and sintered alloys for heat-sink using said composite powder |
| CN101078068A (en) * | 2007-07-05 | 2007-11-28 | 北京科技大学 | Method for preparing ultra-fine crystal grain tungsten-copper alloy and tungsten-copper alloy |
| CN102161097A (en) * | 2011-01-29 | 2011-08-24 | 中南大学 | Preparation method of novel fine grained tungsten copper electrode material |
| CN106077695A (en) * | 2016-08-11 | 2016-11-09 | 河南科技大学 | A kind of preparation method of high-copper tungsten copper nano composite powder |
| CN107433334A (en) * | 2017-08-12 | 2017-12-05 | 佛山市诚新泰不锈钢制品有限公司 | A kind of preparation method of tungsten-copper alloy |
| CN110142415A (en) * | 2019-07-01 | 2019-08-20 | 北京工业大学 | The oxide-doped more alloy phase tungsten-rhenium alloy powder of one kind and preparation method |
| CN113278837A (en) * | 2021-05-17 | 2021-08-20 | 合肥工业大学 | High-density Y2O3Preparation method of doped W-Re alloy |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114833348A (en) * | 2022-05-07 | 2022-08-02 | 合肥工业大学 | Large-scale preparation method of controllable high-quality W-Cu composite powder |
| CN114932222A (en) * | 2022-06-17 | 2022-08-23 | 合肥工业大学智能制造技术研究院 | Method for improving density of tungsten-copper alloy |
| CN114932222B (en) * | 2022-06-17 | 2023-11-07 | 合肥工业大学智能制造技术研究院 | Method for improving density of tungsten-copper alloy |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7069314B2 (en) | Bulked boron nitride particles, boron nitride powder, method for producing boron nitride powder, resin composition, and heat dissipation member | |
| CN113909484A (en) | W-Cu composite powder with high thermal conductivity and low thermal expansion coefficient and preparation method thereof | |
| KR100462274B1 (en) | A method of manufacturing tungsten- copper based composite powder and sintered alloy for heat sink using the same | |
| CN109234557B (en) | Superfine high-hardness W-Y2O3Method for preparing composite material | |
| CN106216705B (en) | A kind of preparation method of 3D printing fine grained simple substance globular metallic powder | |
| WO2020244484A1 (en) | High-purity sic ceramic prepared by normal-pressure solid phase sintering and preparation method therefor | |
| CN106521230B (en) | A kind of graphite flakes/carbon/carbon-copper composite material of vertical orientation heat transmission and preparation method thereof | |
| CN111644624B (en) | High-entropy alloy of refractory metal with porous structure and preparation method thereof | |
| CN114231812B (en) | AlN-W-Cu composite material and preparation method thereof | |
| CN112359236B (en) | Process for preparing high-density tungsten-copper alloy metal material by using tungsten powder | |
| CN113634761A (en) | Preparation method of rare earth oxide reinforced tungsten-copper-based composite material | |
| CN106756376A (en) | tungsten-copper alloy and its processing method and application | |
| CN106623915A (en) | Activated sintering method of aluminum or aluminum alloy | |
| CN102161097A (en) | Preparation method of novel fine grained tungsten copper electrode material | |
| CN111041318A (en) | Tungsten-copper alloy and preparation method thereof | |
| CN105132727B (en) | A kind of plasma agglomeration preparation method of the fine grain tungsten-copper alloy with tungsten copper-clad phenomenon | |
| CN107841669B (en) | High-thermal-conductivity active composite packaging material and preparation method thereof | |
| CN116550975B (en) | Preparation method of diamond/copper composite material | |
| CN115612883B (en) | Method for preparing porous molybdenum-copper alloy framework by in-situ decomposition of ammonium molybdate | |
| CN111484330A (en) | Diamond-enhanced silicon carbide substrate, preparation method thereof and electronic product | |
| CN109128143B (en) | Preparation method of nano tungsten-copper powder with core-shell structure | |
| CN113584337B (en) | Preparation method of tungsten-copper composite material with low copper content and product | |
| CN114592138A (en) | Nano alumina particle reinforced copper-based composite material and preparation method thereof | |
| CN106623976A (en) | Preparation method of graphene-metal-based bulk composite material | |
| Guo et al. | Field-assisted solid phase sintering of W-20 wt.% Cu nanocomposites prepared by co-precipitation method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220519 Address after: 230009 No. 193, Tunxi Road, Hefei, Anhui Applicant after: HeFei University of Technology Asset Management Co.,Ltd. Address before: 230009 No. 193, Tunxi Road, Hefei, Anhui Applicant before: Hefei University of Technology |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220705 Address after: 241204 Chungu 3D Printing Industrial Park, Fanchang Economic Development Zone, Fanchang District, Wuhu City, Anhui Province Applicant after: Anhui Yiheng New Material Technology Co.,Ltd. Address before: 230009 No. 193, Tunxi Road, Hefei, Anhui Applicant before: HeFei University of Technology Asset Management Co.,Ltd. |
|
| TA01 | Transfer of patent application right |