CN113905520A - Method and system for manufacturing high-bonding-force fine line - Google Patents
Method and system for manufacturing high-bonding-force fine line Download PDFInfo
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- CN113905520A CN113905520A CN202111092196.8A CN202111092196A CN113905520A CN 113905520 A CN113905520 A CN 113905520A CN 202111092196 A CN202111092196 A CN 202111092196A CN 113905520 A CN113905520 A CN 113905520A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
Abstract
The invention relates to a method and a system for manufacturing a high-bonding-force fine circuit, wherein the method is used for processing a circuit board insulating substrate with a mask substrate attached to the surface, and comprises the following steps of utilizing focused energy beams to scratch and penetrate the mask substrate according to a preset circuit manufacturing path to form a fine groove corresponding to the circuit manufacturing path; disposing a conductive material in the fine trench through the mask base material; and stripping the mask substrate from the circuit board insulating substrate, and reserving part or all of the conductive material in the fine grooves to form fine circuits on the circuit board insulating substrate. The method can form super fine lines, and skillfully solves the industrial problem of weak bonding force of the fine lines due to small contact area with the substrate.
Description
Technical Field
The invention relates to the technical field of manufacturing of ultra-fine circuit boards, in particular to a method and a system for manufacturing a high-bonding-force fine circuit.
Background
With the traditional printed circuit board production process, due to the problems of the precision of exposure, development and etching and the stability of materials, the line width and the line distance can not be easily realized to be 30 microns. The fine circuit board manufactured by the additive method and the semi-additive method can achieve fine circuits, such as the line width and the line spacing of 20 microns, but the requirements on materials and processes are extremely high, the yield of finished products is not high, the technical threshold is too high, and the fine circuit board is clamped by foreign suppliers.
At present, in the circuit board industry, cof (chip on film) circuit boards belong to very high-end circuit boards, and the core technology is mainly mastered in foreign companies, and comprises core materials, manufacturing processes and the like, and belongs to the neck clamping technology. At present, COF circuit boards and other fine circuit boards are mainly produced by an addition method and a semi-addition method.
The traditional printed circuit board production process has the problems of high production cost and great technical difficulty, and if a simple high-precision circuit board production method can be found, the import substitution of COF board production and the bend overtaking can be completed, so that the method can make great contribution to the circuit board industry in China.
Disclosure of Invention
The invention aims to provide a method and a system for manufacturing a high-bonding-force fine circuit, which solve the problem of efficient batch manufacturing of micron-scale or nanometer-scale circuit patterns.
In a first aspect, the present invention provides a method for manufacturing a high-bonding fine circuit, which processes an insulating substrate of a circuit board having a mask substrate attached to a surface thereof, comprising the steps of,
scribing on the mask substrate according to a preset circuit manufacturing path by using a focused energy beam and penetrating the mask substrate to form a fine groove corresponding to the circuit manufacturing path; the fine groove is a blind groove with the bottom positioned on the surface of the circuit board insulation base material, or the fine groove is a blind groove with the bottom positioned in the circuit board insulation base material, or the fine groove penetrates through the circuit board insulation base material;
disposing a conductive material in the fine trench through the mask base material;
stripping the mask substrate from the circuit board insulating substrate, and reserving part or all of the conductive material in the fine grooves to form fine circuits on the circuit board insulating substrate;
the fine circuit is a circuit with the line width and the line distance of a micron scale or a nanometer scale;
in addition, when the fine grooves are blind grooves with the bottoms located on the surface of the insulating substrate for the wiring board, a method of baking is used to form firm fine lines on the insulating substrate for the wiring board during or after the peeling of the mask substrate is completed.
In a second aspect, the present invention provides a system for manufacturing a high-bonding-force fine circuit, which is used for processing a circuit board insulating substrate with a mask substrate attached to a surface thereof, and comprises the following devices,
a focused energy beam notching device for notching and penetrating the mask substrate with a focused energy beam according to a predetermined line-making path to form a fine groove corresponding to the line-making path; the fine groove is a blind groove with the bottom positioned on the surface of the circuit board insulation base material, or the fine groove is a blind groove with the bottom positioned in the circuit board insulation base material, or the fine groove penetrates through the circuit board insulation base material;
a conductive material disposing device for disposing a conductive material in the fine trench through the mask base material;
a mask substrate stripping device for stripping the mask substrate from the wiring board insulating substrate, leaving part or all of the conductive material in the fine trenches, and forming fine lines on the wiring board insulating substrate;
the fine circuit is a circuit with the line width and the line distance of a micron scale or a nanometer scale;
in addition, when the fine groove is a blind groove with the groove bottom positioned on the surface of the circuit board insulating base material, the fine groove further comprises a baking device or the mask base material stripping device is specifically the baking device;
the baking apparatus is used for forming a firm fine line using a baking method during or after the peeling of the mask substrate.
The invention has the beneficial effects that: the method and the system for manufacturing the high-bonding-force fine line adopt the focused energy beams, particularly the focused laser beams and/or the focused ion beams, which can be focused to the focusing sizes of micron and submicron (nanometer), so that micron and even submicron grooves can be engraved; the adoption of the mask substrate provides conditions for arranging the conductive material in the groove, so that the conductive material in the groove can form a circuit; when the fine groove is a blind groove with the bottom positioned in the circuit board insulation base material or penetrates through the circuit board insulation base material, the circuit board insulation base material forms a wrapping effect for a conductive material, and the industrial problem that the bonding force of the fine circuit is weak due to small contact area with the circuit board insulation base material is solved skillfully; if the high-temperature-resistant circuit board insulation base material is involved, the fine groove can also be a blind groove with the bottom of the groove positioned on the surface of the circuit board insulation base material, then the fine groove is used for arranging a conductive material and sintering the conductive material to the circuit board insulation base material, and the mask base material is burnt out due to temperature resistance, so that the high-adhesion fine circuit is skillfully manufactured, and is skillfully and perfectly. The invention has great influence on the manufacture of high-bonding force fine lines, and has great technical milestone significance and great economic value.
Drawings
FIG. 1 is a flow chart of a method for fabricating a high-bonding-force fine line according to the present invention;
FIG. 2(a) is a cross-sectional view of a fine trench having a trench bottom located within an insulating substrate of a wiring board;
FIG. 2(b) is a cross-sectional view formed after disposing the conductive material in FIG. 2 (a);
FIG. 2(c) is a cross-sectional view of the fine line formed after the mask base material is stripped in FIG. 2 (b);
FIG. 2(d) is a cross-sectional view after electroplating of the fine line of FIG. 2 (c);
FIG. 2(e) is another cross-sectional view after electroplating of the fine line of FIG. 2 (c);
FIG. 3(a) is a sectional view of a fine trench penetrating an insulating substrate of a wiring board;
FIG. 3(b) is a cross-sectional view formed after disposing the conductive material in FIG. 3 (a);
FIG. 3(c) is a cross-sectional view of the fine line formed after the mask base material is stripped in FIG. 3 (b);
FIG. 3(d) is a cross-sectional view after electroplating of the fine line of FIG. 3 (c);
FIG. 3(e) is a cross-sectional view of the fine line formed after the mask substrate and the auxiliary substrate are peeled off in FIG. 3 (b);
FIG. 3(f) is a cross-sectional view after electroplating of the fine line of FIG. 3 (e);
FIG. 4(a) is a sectional view of a fine groove having a groove bottom on the surface of an insulating substrate of a wiring board;
FIG. 4(b) is a cross-sectional view formed after disposing the conductive material in FIG. 4 (a);
fig. 4(c) is a cross-sectional view of the fine line formed after the mask base material is peeled off in fig. 4 (b).
In the drawings, the components represented by the respective reference numerals are listed below:
1. mask substrate, 2, circuit board insulating substrate, 3, fine trench, 4, trench barrier layer, 5, conductive material layer, 6, fine circuit, 7, electroplating thickening conductive material, 8, auxiliary substrate.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1, a method for fabricating a high-bonding-force fine circuit by processing an insulating substrate of a circuit board having a mask substrate attached to a surface thereof, comprising the steps of,
scribing on the mask substrate according to a preset circuit manufacturing path by using a focused energy beam and penetrating the mask substrate to form a fine groove corresponding to the circuit manufacturing path; the fine groove is a blind groove with the bottom positioned on the surface of the circuit board insulation base material, or the fine groove is a blind groove with the bottom positioned in the circuit board insulation base material, or the fine groove penetrates through the circuit board insulation base material;
disposing a conductive material in the fine trench through the mask base material;
stripping the mask substrate from the circuit board insulating substrate, and reserving part or all of the conductive material in the fine grooves to form fine circuits on the circuit board insulating substrate;
the fine circuit is a circuit with the line width and the line distance of a micron scale or a nanometer scale;
in addition, when the fine grooves are blind grooves with the bottoms located on the surface of the insulating substrate for the wiring board, a method of baking is used to form firm fine lines on the insulating substrate for the wiring board during or after the peeling of the mask substrate is completed.
The method adopts the technical scheme of 'mask + energy beam grooving + groove conductive material arrangement', can easily manufacture fine circuits with the line width of 30 micrometers or less, theoretically can manufacture fine circuits with the line width and the line distance of 20 micrometers to hundreds of nanometers, and adopts a baking method to sinter the wire material to form firm fine circuits on the circuit board insulating base material when part or all of the fine circuits are planted in the circuit board insulating base material or the fine circuits are not planted in the circuit board insulating base material, so that the bonding force between the fine circuits and the circuit board insulating base material is greatly improved, which cannot be realized by the traditional addition method at present. Once the method is implemented, the manufacturing cost and the quality of the COF circuit board at present can be at least subverted.
Preferably, the mask substrate is attached to one surface or two surfaces of the circuit board insulating substrate; when the mask base material is attached to both surfaces of the wiring board insulating base material, the fine wiring is formed on both surfaces of the wiring board insulating base material.
In the embodiment, the same method is adopted, and the high-bonding-force fine circuit board is designed and manufactured on the two surfaces of the circuit board insulating substrate, so that the design density of the circuit board can be improved.
Preferably, when the mask base material is attached to both surfaces of the insulating base material for a wiring board, the method further comprises the step of,
while scribing the fine groove with the focused energy beam, further performing a drilling process on the mask base material with the focused energy beam to form a through hole for connecting the fine grooves on both surfaces of the wiring board insulating base material on the wiring board insulating base material;
arranging conductive materials in the fine grooves on the two surfaces of the insulating substrate of the circuit board, and arranging the conductive materials in the through holes;
and the conductive materials in the fine grooves on the two surfaces of the circuit board insulating substrate are electrically communicated through the conductive materials in the through holes.
In this embodiment, the through holes filled with the conductive material can electrically connect the fine circuits on the two opposite surfaces of the insulating substrate of the circuit board, thereby forming a spatial electrical interconnection structure.
Preferably, the energy beam comprises a laser beam and/or an ion beam.
In the present embodiment, the laser beam is used to scribe and form the fine trench 3 on the surface of the mask substrate 1 as shown in fig. 2(a), the fine trench 3 needs to penetrate the mask substrate 1, and the bottom of the trench is located in the insulating substrate 2 of the circuit board; between the fine trenches 3 is a trench barrier layer 4, the trench barrier layer 4 determining the line pitch width of the fine lines.
Specifically, the laser beam used in this embodiment is ultraviolet laser with a wavelength of 355 nm, which is focused to 10 microns, and then a 10 micron fine trench 3 is scribed, so as to manufacture a fine line with a line width and a line distance of 10 microns; or the wavelength 266 nm deep ultraviolet laser is adopted to focus to 1 micron, and a 1 micron fine groove 3 is carved, so that the ultra-fine line with the line width and the line distance of 1 micron can be manufactured.
In this embodiment, the energy beam may also be an ion beam, and the ion beam may be used to easily scribe a trench with a submicron line width and to manufacture a fine line with a submicron line width and a line pitch.
Preferably, the conductive material includes any one or a combination of a metal material, a rare metal material, a semiconductor material, and graphene.
The metal material includes gold, silver, copper, platinum, indium, tin, etc.
Preferably, when the fine groove is a blind groove with a groove bottom located in the insulating substrate for the circuit board, or the fine groove penetrates through the insulating substrate for the circuit board, the method of disposing the conductive material in the fine groove through the mask substrate is ion sputtering.
The ion sputtering is a process of ionizing gas to form plasma under the action of high voltage, and bombarding a metal target by positive ions under the acceleration of an electric field so that metal atoms are sputtered onto the surface of a sample to form a conductive film. The main types of metal targets are: nickel, chromium, nickel chromite, nickel cuprate, and the like.
In this embodiment, when ion sputtering is performed, ions are sputtered on the surface of the mask substrate 1 and inside the fine trenches 3, and the conductive material layer 5 shown in fig. 2(b) is formed.
The mask substrate 1 is peeled off from the wiring board insulating substrate 2, and the conductive material layer 5 remaining in the grooves of the wiring board insulating substrate 2 forms fine lines 6 as shown in fig. 2 (c).
The conductive material can be bombarded into the groove of the insulating base material 2 of the circuit board by adopting ion sputtering to form atomic force combination, and the combination ensures the combination force of the conductive material and the insulating base material 2 of the circuit board.
Preferably, the method further comprises the following steps before the ion sputtering,
and placing the fine groove in a plasma environment, and activating the inner surface of the fine groove by using plasma.
After the material on the inner surface of the fine groove is activated, the ion sputtering effect is better facilitated, the injection depth of metal conductive ions on the surface of the base material is increased, and the atomic bonding force between the sputtered ions and the base material is increased. Typical activation processes include plasma cleaning.
Preferably, the method further comprises the step of electroplating the fine circuit on the insulating substrate of the circuit board after the fine circuit is formed on the insulating substrate of the circuit board.
Specifically, the fine circuit 6 on the insulating substrate 2 of the wiring board is subjected to electroplating treatment to form an electroplating thickening conductive material 7 as shown in fig. 2(d) on the fine circuit, and the electroplating thickening conductive material 7 covers the surface of the fine circuit 6 to form a thicker circuit structure. If the electroplating filling process is adopted, the grooves on the insulating base material 2 of the circuit board are filled by electroplating to form an electroplating filling structure as shown in figure 2(e), and the electroplating thickened conductive material 7 is wrapped by the fine circuit 6.
Preferably, an auxiliary substrate is attached to the surface of the wiring board insulating substrate opposite to the surface to which the mask substrate is attached; the fine groove is a blind groove which penetrates through the circuit board insulating base material and is formed under the matching of the auxiliary base material.
As shown in fig. 3(a), the fine trenches 3 not only penetrate through the mask substrate 1 but also penetrate through the insulating substrate 2 of the circuit board to expose the auxiliary substrate 8, and corresponding trenches can be scribed on the auxiliary substrate 8.
A conductive material is provided in the fine grooves 3 by means of ion sputtering or plating, and a conductive material layer 5 as shown in fig. 3(b) is formed on the surface of the mask base material 1 and inside the fine grooves 3. The mask substrate 1 is peeled off, and as shown in fig. 3(c), the conductive material layer 5 remaining in the wiring board insulating substrate 2 and the auxiliary substrate 8 forms the fine wiring 6. The fine lines 6 are subjected to hole-filling electroplating to form electroplating thickened conductive materials 7 as shown in fig. 3(d), and the electroplating thickened conductive materials 7 are wrapped by the fine lines 6 to form solid fine lines.
If the auxiliary substrate 8 is peeled off on the basis of fig. 3(c), the fine line 6 is formed as shown in fig. 3 (e). The fine wiring 6 shown in fig. 3(e) is further thickened by plating to produce a plated thickened conductive material 7, and a new fine wiring as shown in fig. 3(f) is formed, and the plated thickened conductive material 7 is sandwiched by the fine wiring 6 to form a solid fine wiring.
In a general circuit board, a protrusion is attached to the surface of an insulating substrate of the circuit board, but by using the method, a conductive circuit embedded in the insulating substrate of the circuit board can be manufactured. The circuit embedded in the substrate has an embedded structure, so that the bonding force between the circuit and the substrate is obviously higher than the adhesive force of the circuit of a traditional circuit board in single-side contact on the surface of the substrate.
Preferably, the ablation temperature of the mask substrate is lower than a preset temperature, and the softening temperature of the circuit board insulating substrate is higher than the preset temperature;
when the fine groove is a blind groove with the groove bottom positioned on the surface of the insulating substrate of the circuit board,
a method of disposing a conductive material in the fine trench through the mask base material is electroplating or ion sputtering;
after the mask substrate is peeled off, a specific process of forming a firm fine wiring on the wiring board insulating substrate using a baking method is,
and baking the circuit board insulating base material with the fine circuit under the condition of being higher than the preset temperature to form a firm fine circuit on the circuit board insulating base material.
Specifically, the mask substrate 1 is ablated by heating, and the ablation temperature is lower than 600 ℃; the circuit board insulating base material 2 is a high-temperature-resistant insulating base material with the softening temperature of more than 600 ℃.
In this embodiment, the fine groove 3 is formed by scribing on the surface of the mask substrate 1 by using a laser beam or an ion beam, as shown in fig. 4(a), and the bottom of the fine groove 3 is the surface of the insulating substrate 2 of the wiring board.
The circuit board insulating substrate 2 is a high-temperature-resistant brittle-hard material such as ceramic. The mask substrate 1 is a film material containing a glue, and is generally ablated at 400 ℃, a conductive material is arranged in the fine groove 3, the mask substrate 1 is stripped from the circuit board insulating substrate 2, and the conductive material remained on the surface of the circuit board insulating substrate 2 or in the fine groove 3 forms a fine circuit 6 as shown in fig. 4 (c); the fine circuit 6 can be further electroplated and thickened in an electroplating mode, and the electroplated and thickened conductive material can be the same as or different from the conductive material filled in the previous electroplating. The fine wiring 6 which is firmly sintered can be formed on the wiring board insulating base material 2 by baking the wiring board insulating base material 2 on which the fine wiring 6 is laid at a temperature of 600 degrees centigrade or higher.
Preferably, the method of disposing the conductive material in the fine trench through the mask base material is electroplating, and further includes, before the electroplating, a step of subjecting the material on the inner surface of the fine trench to pre-electroplating pretreatment.
Preferably, the ablation temperature of the mask substrate is lower than a preset temperature, and the softening temperature of the circuit board insulating substrate is higher than the preset temperature;
when the fine groove is a blind groove with the groove bottom positioned on the surface of the insulating substrate of the circuit board,
the method for arranging the conductive material in the fine trench through the mask substrate is physical filling;
in the stripping process of the mask base material, the specific process of forming the firm fine circuit on the circuit board insulating base material by using a baking method comprises the steps of baking the whole base material filled with the conductive material under the condition of the temperature higher than the preset temperature, ablating and removing the mask base material on the surface of the circuit board insulating base material, and sintering the conductive material filled in the fine groove on the circuit board insulating base material to form the firm fine circuit.
Specifically, the mask base material 1 can be ablated by heating, and the ablation temperature is lower than 600 ℃; the circuit board insulating base material 2 is a high-temperature-resistant insulating base material with the softening temperature of more than 600 ℃. The mask substrate 1 is a film material containing a glue, and is typically ablated at 400 degrees celsius.
In the present embodiment, a physical filling method is adopted to fill the conductive material slurry in the fine trench 3 shown in fig. 4(a) to form a conductive material layer 5 shown in fig. 4 (b); the mask substrate 1 and the wiring board insulating substrate 2 are heated together to 600 degrees centigrade or more, the mask substrate 1 is removed by ablation, and the conductive material 5 on the surface of the wiring board insulating substrate 2 or in the grooves is sintered to form firm fine lines 6 as shown in fig. 4 (c).
Based on the manufacturing method of the high-bonding-force fine circuit, the invention also provides a manufacturing system of the high-bonding-force fine circuit.
A system for manufacturing a high-bonding-force fine circuit is used for processing a circuit board insulating substrate with a mask substrate attached to the surface, and comprises the following equipment,
a focused energy beam notching device for notching and penetrating the mask substrate with a focused energy beam according to a predetermined line-making path to form a fine groove corresponding to the line-making path; the fine groove is a blind groove with the bottom positioned on the surface of the circuit board insulation base material, or the fine groove is a blind groove with the bottom positioned in the circuit board insulation base material, or the fine groove penetrates through the circuit board insulation base material;
a conductive material disposing device for disposing a conductive material in the fine trench through the mask base material;
a mask substrate stripping device for stripping the mask substrate from the wiring board insulating substrate, leaving part or all of the conductive material in the fine trenches, and forming fine lines on the wiring board insulating substrate;
the fine circuit is a circuit with the line width and the line distance of a micron scale or a nanometer scale;
in addition, when the fine groove is a blind groove with the groove bottom positioned on the surface of the circuit board insulating base material, the fine groove further comprises a baking device or the mask base material stripping device is specifically the baking device;
the baking apparatus is used for forming a firm fine line using a baking method during or after the peeling of the mask substrate.
Preferably, the focused energy beam grooving equipment is specifically laser beam etching equipment or ion beam etching equipment.
Preferably, the conductive material setting device is an ion sputtering device and/or an electroplating device; or, the conductive material setting device is a conductive material physical filling device.
The manufacturing method and the system of the high-bonding-force fine line provided by the invention have the following advantages:
1. the invention adopts a mode of engraving grooves by focusing energy beams, cancels the process of manufacturing, developing and exposing the circuit board, and belongs to the revolutionary change of replacing a wet process with a dry process. The traditional developing and exposing process is avoided, so that the line width and line distance limit breakthrough of the fine line is realized;
2. the invention is not only suitable for the production and the manufacture of the high-end flexible COF board, but also can realize the fine circuit board manufacture on the surface of the brittle and hard material, which can not be realized by the traditional circuit board manufacturing method of development exposure;
3. the invention can enable the fine circuit board to be arranged inside the circuit board substrate, thereby forming the wire embedding effect and greatly improving the bonding force between the fine circuit and the substrate;
4. the invention can realize the line width and line distance manufacture from nanometer to submicron level, which can not be realized by the existing fine line manufacturing process.
The reader should understand that in the description of this specification, reference to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example" or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (15)
1. A manufacturing method of a high-bonding-force fine line is characterized by comprising the following steps: the method for processing the insulating substrate of the circuit board with the mask substrate attached on the surface comprises the following steps,
scribing on the mask substrate according to a preset circuit manufacturing path by using a focused energy beam and penetrating the mask substrate to form a fine groove corresponding to the circuit manufacturing path; the fine groove is a blind groove with the bottom positioned on the surface of the circuit board insulation base material, or the fine groove is a blind groove with the bottom positioned in the circuit board insulation base material, or the fine groove penetrates through the circuit board insulation base material;
disposing a conductive material in the fine trench through the mask base material;
stripping the mask substrate from the circuit board insulating substrate, and reserving part or all of the conductive material in the fine grooves to form fine circuits on the circuit board insulating substrate;
the fine circuit is a circuit with the line width and the line distance of a micron scale or a nanometer scale;
in addition, when the fine grooves are blind grooves with the bottoms located on the surface of the insulating substrate for the wiring board, a method of baking is used to form firm fine lines on the insulating substrate for the wiring board during or after the peeling of the mask substrate is completed.
2. The method for manufacturing a high-bonding-force fine line according to claim 1, wherein: the mask base material is attached to one surface or two surfaces of the circuit board insulating base material; when the mask base material is attached to both surfaces of the wiring board insulating base material, the fine wiring is formed on both surfaces of the wiring board insulating base material.
3. The method for manufacturing a high-bonding-force fine line according to claim 2, wherein: when the mask base material is attached to both surfaces of the insulating base material for a wiring board, the method further comprises the step of,
while scribing the fine groove with the focused energy beam, further performing a drilling process on the mask base material with the focused energy beam to form a through hole for connecting the fine grooves on both surfaces of the wiring board insulating base material on the wiring board insulating base material;
arranging conductive materials in the fine grooves on the two surfaces of the insulating substrate of the circuit board, and arranging the conductive materials in the through holes;
and the conductive materials in the fine grooves on the two surfaces of the circuit board insulating substrate are electrically communicated through the conductive materials in the through holes.
4. The method for manufacturing a high-bonding-force fine line according to claim 1, wherein: the energy beam comprises a laser beam and/or an ion beam.
5. The method for manufacturing a high-bonding-force fine line according to claim 1, wherein: the conductive material includes any one or a combination of plural kinds of a metal material, a rare metal material, a semiconductor material, and graphene.
6. The method for manufacturing a high-bonding-force fine line according to claim 1, wherein: when the fine groove is a blind groove with a groove bottom positioned in the circuit board insulating base material, or the fine groove penetrates through the circuit board insulating base material, the method for arranging the conductive material in the fine groove through the mask base material is ion sputtering.
7. The method for manufacturing a high-bonding-force fine line according to claim 6, wherein: before the ion sputtering, the method also comprises the following steps of placing the fine groove in a plasma environment, and carrying out activation treatment on the inner surface of the fine groove by using plasma.
8. The method for manufacturing a high-bonding-force fine line according to claim 1, wherein: the method also comprises the following step of electroplating the fine circuit on the circuit board insulating base material after the fine circuit is formed on the circuit board insulating base material.
9. The method for fabricating a high-bonding-force fine line according to any one of claims 1 to 8, wherein: an auxiliary substrate is attached to the surface, opposite to the surface attached with the mask substrate, of the circuit board insulating substrate; the fine groove is a blind groove which penetrates through the circuit board insulating base material and is formed under the matching of the auxiliary base material.
10. The method for fabricating a high-bonding-force fine line according to any one of claims 1 to 8, wherein: the ablation temperature of the mask base material is lower than a preset temperature, and the softening temperature of the circuit board insulating base material is higher than the preset temperature;
when the fine groove is a blind groove with the groove bottom positioned on the surface of the insulating substrate of the circuit board,
a method of disposing a conductive material in the fine trench through the mask base material is electroplating or ion sputtering;
after the mask substrate is peeled off, a specific process of forming a firm fine wiring on the wiring board insulating substrate using a baking method is,
and baking the circuit board insulating base material with the fine circuit under the condition of being higher than the preset temperature to form a firm fine circuit on the circuit board insulating base material.
11. The method for manufacturing a high-bonding-force fine line according to claim 10, wherein: the method of disposing the conductive material in the fine trench through the mask base material is electroplating, and before the electroplating, the method further includes a step of performing pre-electroplating pretreatment on the material on the inner surface of the fine trench.
12. The method for fabricating a high-bonding-force fine line according to any one of claims 1 to 8, wherein: the ablation temperature of the mask base material is lower than a preset temperature, and the softening temperature of the circuit board insulating base material is higher than the preset temperature;
when the fine groove is a blind groove with the groove bottom positioned on the surface of the insulating substrate of the circuit board,
the method for arranging the conductive material in the fine trench through the mask substrate is physical filling;
in the stripping process of the mask base material, the specific process of forming the firm fine circuit on the circuit board insulating base material by using a baking method comprises the steps of baking the whole base material filled with the conductive material under the condition of the temperature higher than the preset temperature, ablating and removing the mask base material on the surface of the circuit board insulating base material, and sintering the conductive material filled in the fine groove on the circuit board insulating base material to form the firm fine circuit.
13. The utility model provides a system for making fine circuit of high cohesion which characterized in that: the equipment is used for processing the insulating substrate of the circuit board with the mask substrate attached to the surface, and comprises the following equipment,
a focused energy beam notching device for notching and penetrating the mask substrate with a focused energy beam according to a predetermined line-making path to form a fine groove corresponding to the line-making path; the fine groove is a blind groove with the bottom positioned on the surface of the circuit board insulation base material, or the fine groove is a blind groove with the bottom positioned in the circuit board insulation base material, or the fine groove penetrates through the circuit board insulation base material;
a conductive material disposing device for disposing a conductive material in the fine trench through the mask base material;
a mask substrate stripping device for stripping the mask substrate from the wiring board insulating substrate, leaving part or all of the conductive material in the fine trenches, and forming fine lines on the wiring board insulating substrate;
the fine circuit is a circuit with the line width and the line distance of a micron scale or a nanometer scale;
in addition, when the fine groove is a blind groove with the groove bottom positioned on the surface of the circuit board insulating base material, the fine groove further comprises a baking device or the mask base material stripping device is specifically the baking device;
the baking apparatus is used for forming a firm fine line using a baking method during or after the peeling of the mask substrate.
14. The system for fabricating high-bonding-force fine lines according to claim 13, wherein: the focused energy beam grooving equipment is specifically laser beam etching equipment or ion beam etching equipment.
15. The system for fabricating high-bonding-force fine lines according to claim 13, wherein: the conductive material setting equipment is ion sputtering equipment and/or electroplating equipment; or, the conductive material setting device is a conductive material physical filling device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111092196.8A CN113905520A (en) | 2021-09-17 | 2021-09-17 | Method and system for manufacturing high-bonding-force fine line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111092196.8A CN113905520A (en) | 2021-09-17 | 2021-09-17 | Method and system for manufacturing high-bonding-force fine line |
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| CN113905520A true CN113905520A (en) | 2022-01-07 |
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| CN202111092196.8A Pending CN113905520A (en) | 2021-09-17 | 2021-09-17 | Method and system for manufacturing high-bonding-force fine line |
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| US20110003086A1 (en) * | 2007-12-11 | 2011-01-06 | Inktec Co., Ltd. | Method for Fabricating Blackened Conductive Patterns |
| CN102598883A (en) * | 2009-10-30 | 2012-07-18 | 松下电器产业株式会社 | Circuit board, and semiconductor device having component mounted on circuit board |
| US20200288577A1 (en) * | 2017-11-21 | 2020-09-10 | Qualtec Co., Ltd. | Electronic-Component Manufacturing Method and Electronic Components |
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2021
- 2021-09-17 CN CN202111092196.8A patent/CN113905520A/en active Pending
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|---|---|---|---|---|
| US20110003086A1 (en) * | 2007-12-11 | 2011-01-06 | Inktec Co., Ltd. | Method for Fabricating Blackened Conductive Patterns |
| CN102598883A (en) * | 2009-10-30 | 2012-07-18 | 松下电器产业株式会社 | Circuit board, and semiconductor device having component mounted on circuit board |
| US20200288577A1 (en) * | 2017-11-21 | 2020-09-10 | Qualtec Co., Ltd. | Electronic-Component Manufacturing Method and Electronic Components |
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