CN113890308A - Power module and power supply system - Google Patents

Power module and power supply system Download PDF

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Publication number
CN113890308A
CN113890308A CN202110989648.6A CN202110989648A CN113890308A CN 113890308 A CN113890308 A CN 113890308A CN 202110989648 A CN202110989648 A CN 202110989648A CN 113890308 A CN113890308 A CN 113890308A
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CN
China
Prior art keywords
power
cover plate
layer
partition wall
height
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Pending
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CN202110989648.6A
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Chinese (zh)
Inventor
肖波
黄朱勇
刘汉华
林臻
杨江其
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Huawei Digital Power Technologies Co Ltd
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Huawei Digital Power Technologies Co Ltd
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Application filed by Huawei Digital Power Technologies Co Ltd filed Critical Huawei Digital Power Technologies Co Ltd
Priority to CN202110989648.6A priority Critical patent/CN113890308A/en
Publication of CN113890308A publication Critical patent/CN113890308A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0213Venting apertures; Constructional details thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

The embodiment of the application discloses power module and electrical power generating system, power module includes: the power supply comprises a shell, an input end, an output end and a plurality of power units which are connected in series; the input end is used for connecting a power supply and the power unit, and the output end is used for outputting the voltage transformed by the power unit; the outer surface of the shell is provided with a conducting layer, a plurality of shielding layers are embedded in the shell, the shielding layers are opposite to the power units one by one, and each power unit is connected with one shielding layer; the inner surface of the shell is provided with a plurality of partition walls, the partition walls are criss-crossed to form a plurality of openings, one power unit is positioned in one opening, the vertical projection of one shielding layer on the shell is positioned in the vertical projection range of one partition wall on the shell, and the height of each partition wall is smaller than that of the power unit. Therefore, the air electric field intensity at the tail end of the shielding layer can be reduced by arranging the partition wall, and meanwhile, the material consumption is saved, and the power density is improved.

Description

Power module and power supply system
Technical Field
The embodiment of the application relates to the technical field of power electronics, in particular to a power module and a power supply system.
Background
At present, with the rapid development of a novel alternating current/direct current power distribution network technology, a transformer needs to convert an input voltage of a kV level into a low voltage of hundreds of volts to supply power for electric equipment.
Fig. 1 is a simplified schematic diagram of a power system architecture. As shown in fig. 1, the power supply system includes: the Power Supply system comprises a Power Supply 01, a Power frequency transformer 02, an Uninterruptible Power Supply (UPS) system 04 and an electric device 03, wherein the Power frequency transformer 02 is used for transforming voltage input by the Power Supply 01 and outputting the transformed voltage to the UPS system 04, and the UPS system 04 is used for stabilizing the voltage of commercial Power and supplying the stabilized voltage to the electric device 03 for use.
However, the industrial frequency transformer 02 and the UPS system 04 occupy a large space, which is not favorable for miniaturization of the equipment.
For this reason, the prior art provides a power electronic transformer which can be used in a power supply system, and is more space-saving. Fig. 2 is a schematic structural diagram of a power electronic transformer. As shown in fig. 2, the power electronic transformer 05 has a two-layer structure, i.e., a first layer 0001 and a second layer 0002. Where first tier 100 includes power cell 001, power cell 002, power cell 003, and power cell 004, and second tier 200 includes power cell 005, power cell 006, power cell 007, and power cell 008.
When the voltage difference between the power units of the first layer 0001 and the second layer 0002 is too large, different power units are easy to break down to cause ignition, and as shown in fig. 2, an insulating shell 051 can be arranged outside each power unit.
However, the insulating housing 051 is a single four-sided closed structure, so that each power unit is large in size, low in utilization rate, high in material space occupation rate, low in insulating material utilization rate and low in power density.
Disclosure of Invention
The embodiment of the application provides a power module and a power supply system, and solves the problem of low power density of the power module.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:
in a first aspect of embodiments of the present application, a power module is provided, including: the power supply comprises a shell, an input end, an output end and a plurality of power units which are connected in series; the input end is used for connecting a power supply and the power unit, and the output end is used for outputting the voltage transformed by the power unit; the outer surface of the shell is provided with a conducting layer, a plurality of shielding layers are embedded in the shell, the shielding layers are in one-to-one correspondence with the power units, and each power unit is connected with one shielding layer. For example, a power cell is connected to a shield via a lead. The inner surface of the shell is provided with a plurality of partition walls, the partition walls are criss-cross to form a plurality of openings, one power unit is positioned in one opening, the vertical projection of the shielding layer on the shell is positioned in the vertical projection range of the partition wall on the shell, and the height of the partition wall is smaller than that of the power unit. Therefore, the insulating partition wall is arranged, the air electric field intensity at the tail end of the shielding layer can be reduced, meanwhile, the insulating partition wall is arranged on the whole plane of the non-shell, the height of the partition wall is smaller than that of the power unit, the using amount of insulating materials can be saved, more height spaces are provided for electronic components inside the power unit, and the power density is improved.
In an alternative implementation, the housing and the dividing wall are made of insulating materials. Therefore, the shell and the partition wall can be made of the same material, and the process is simpler.
In an alternative implementation, the housing and the dividing wall are integrally formed. Therefore, the connection stability of the dividing wall is better.
In an alternative implementation, the plurality of power cells are spatially divided into a first layer and a second layer, each layer including at least one power cell; this casing includes: the first cover plate, the second cover plate and the third cover plate are arranged in a stacked mode, the second cover plate is located between the first cover plate and the third cover plate, the first layer of power units are arranged on one side, close to the second cover plate, of the first cover plate, and the second layer of power units are arranged on one side, close to the second cover plate, of the third cover plate; the first cover plate, the second cover plate and the third cover plate are connected. Therefore, the first cover plate, the second cover plate and the third cover plate are an upper part, a middle part and a lower part, all power units of the first layer can be positioned between the first cover plate and the second cover plate, and all power units of the second layer can be positioned between the second cover plate and the third cover plate. In particular, all power cells of the first layer may be mounted on the first cover plate, and may also be mounted on the second cover plate. All power cells of the second layer may be mounted on the third cover plate, and may also be mounted on the second cover plate. For example, the first cover plate, the second cover plate and the third cover plate can be installed in a buckled mode, the first cover plate, the second cover plate and the third cover plate are assembled together, the power units are packaged in the shell, and the installation mode is simple.
In an optional implementation manner, each of the first layer and the second layer includes a plurality of the power units, and all the power units in the same layer are sequentially connected in series. And one power unit positioned at the end part in the first layer and one power unit positioned at the end part in the second layer are connected in series, so that the voltage difference between the adjacent power units on the same layer is as small as possible, and the problem of sparking caused by easy breakdown between the adjacent power units on the same layer is further reduced.
In an alternative implementation, the plurality of partition walls includes at least one first partition wall disposed on a surface of the first cover plate adjacent to the second cover plate, and a height of the first partition wall is smaller than a height of the first layer of power cells. Therefore, the first partition wall is smaller in height, and the material utilization rate and the power density are improved.
In an optional implementation manner, the plurality of partition walls further include at least one second partition wall disposed on a surface of the second cover plate close to the first cover plate, the at least one second partition wall is opposite to the at least one first partition wall one to one, and a height of the second partition wall is smaller than a height of the first layer of power cells. Therefore, the second partition wall is small in height, and the material utilization rate and the power density are improved.
In an alternative implementation, the sum of the heights of the first partition wall and the second partition wall is less than the height of the first layer of power cells. Therefore, the first partition wall and the second partition wall are smaller in height, and the material utilization rate and the power density are improved.
In an alternative implementation, the plurality of partition walls further includes at least one third partition wall disposed on a surface of the third cover plate adjacent to the second cover plate, and a height of the third partition wall is smaller than a height of the first layer of power cells. Therefore, the third partition wall is smaller in height, and the material utilization rate and the power density are improved.
In an alternative implementation, the plurality of partition walls include at least one fourth partition wall disposed on a surface of the second cover plate adjacent to the third cover plate, the at least one fourth partition wall is opposite to the at least one third partition wall, and the height of the fourth partition wall is less than the height of the second layer of power cells. Therefore, the height of the fourth partition wall is smaller, and the material utilization rate and the power density are improved.
In an alternative implementation, the sum of the heights of the third partition wall and the fourth partition wall is less than the height of the second layer of power cells. Therefore, the third partition wall and the fourth partition wall are small in height, and the material utilization rate and the power density are improved.
In an optional implementation manner, positioning pillars are disposed on the first cover plate and the third cover plate, and positioning holes are disposed on the second cover plate and are opposite to the positioning holes. And the positioning column can be inserted in the positioning hole. From this, through setting up reference column and locating hole, reduced the installation degree of difficulty.
In an optional implementation manner, the mobile phone further comprises a casing, the casing is arranged around the casing, and the casing is detachably connected with the casing. Thus, the housing can protect the power module.
In an alternative implementation, the casing is made of metal. Therefore, the heat dissipation performance of the shell is better, and the stability is higher.
In an optional implementation manner, heat dissipation holes are formed in the casing. Thus, the heat dissipation performance of the power module can be improved.
In a second aspect of the embodiments of the present application, there is provided a power supply system, which includes a power supply, an electrical device, and the power module as described above, wherein the power supply is connected to an input terminal of the power module, and the electrical device is connected to an output terminal of the power module. Therefore, the power supply system adopts the power module, the size is smaller, and the occupied space can be reduced.
Drawings
FIG. 1 is a simplified schematic diagram of a power system architecture;
FIG. 2 is a schematic diagram of a power conversion unit;
fig. 3 is a schematic structural diagram of a power module according to an embodiment of the present disclosure;
fig. 4 is a schematic disassembled structure diagram of a power module according to an embodiment of the present disclosure;
fig. 5 is a front view of a power module provided in an embodiment of the present application;
fig. 6 is a schematic structural diagram of a housing of a power module provided in an embodiment of the present application;
fig. 7 is a schematic disassembled structural diagram of a housing of a power module according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a first cover plate according to an embodiment of the present disclosure;
fig. 9 is a schematic structural diagram of a second cover plate according to an embodiment of the present application;
fig. 10 is a schematic structural diagram of a third cover plate according to an embodiment of the present application;
FIG. 11a is a cross-sectional view A-A of the power module of FIG. 6;
fig. 11b is an internal circuit diagram of a power module according to an embodiment of the present application;
fig. 12 is a diagram illustrating an electric field distribution at a partition wall inside a power module according to an embodiment of the present disclosure;
fig. 13 is a schematic structural diagram of another power module according to an embodiment of the present disclosure;
fig. 14 is a disassembled structural diagram of the power module in fig. 12.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.
In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
Further, in the present application, directional terms such as "upper" and "lower" are defined with respect to a schematically-disposed orientation of components in the drawings, and it is to be understood that these directional terms are relative concepts that are used for descriptive and clarity purposes and that will vary accordingly with respect to the orientation in which the components are disposed in the drawings.
In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.
In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
Further, in the present application, directional terms such as "upper" and "lower" are defined with respect to a schematically-disposed orientation of components in the drawings, and it is to be understood that these directional terms are relative concepts that are used for descriptive and clarity purposes and that will vary accordingly with respect to the orientation in which the components are disposed in the drawings.
In the present application, unless expressly stated or limited otherwise, the term "coupled" is to be construed broadly, e.g., "coupled" may be a fixed connection, a removable connection, or an integral part; may be directly connected or indirectly connected through an intermediate. Furthermore, the term "coupled" may be a manner of making electrical connections that communicate signals. "coupled" may be a direct electrical connection or an indirect electrical connection through intervening media.
In order to make the technical solutions provided by the embodiments of the present application better understood by those skilled in the art, the present invention can be applied to any power unit that needs to be spatially distributed into at least two layers, needs to be connected in series between two adjacent layers, and connects the power units in series to form a certain voltage difference, or connects a power source with a certain voltage difference.
An embodiment of the present application provides a power supply system, which includes: the power supply is connected with the input end of the power module, and the electric equipment is connected with the output end of the power module.
The power module is used for converting input alternating current into direct current.
For example, the alternating current input to the power module may be an alternating current medium voltage, the direct current output may be a direct current low voltage, and the power module may convert the alternating current medium voltage into the direct current low voltage, so as to supply power to the electric device.
For example, when the power grid enters a building, the power supply is three-phase 10kV alternating current (which may be regarded as alternating current input by the power module), and the three-phase 10kV alternating current is converted into 400V direct current after voltage conversion by the power module, and the 400V direct current may supply power to electric equipment (e.g., a server).
The existing power module is large in occupied space and low in power density, and needs to be matched with a UPS system, so that the power module which is small in occupied space and high in power density is provided.
Fig. 3 is a schematic structural diagram of a power module according to an embodiment of the present application. Fig. 4 is a schematic disassembly structure diagram of a power module according to an embodiment of the present application. Fig. 5 is a front view of a power module according to an embodiment of the present disclosure. As shown in fig. 3, 4, and 5, the power module 10 includes: the power unit comprises an input end (not shown in the figure), an output end (not shown in the figure), a shell 100 and a plurality of power units (power unit 1-power unit 8) which are connected in series.
The embodiment of the present application does not specifically limit a specific implementation form of the power unit, and the power unit may be, for example, a power conversion unit or a battery cell.
In some embodiments, the power unit is a power conversion unit, the power conversion unit presents two terminals to the outside, and the two terminals may not be positive or negative, as long as the two terminals are connected in series with the terminals of other power conversion units.
In other embodiments, the power unit is an electric core, each electric core serves as a small power source and has an anode and a cathode, and when a plurality of electric cores are connected in series, attention needs to be paid to the connection relationship between the anode and the cathode of each electric core, for example, the anode of a first electric core serves as the anode of the battery power unit, the cathode of the first electric core is connected to the anode of a second electric core, the cathode of the second electric core is connected to the anode of a third electric core, and so on until the cathode of the last electric core serves as the cathode of the battery power unit.
The input end is used for connecting a power supply and a power unit, and the output end is used for outputting voltage obtained by transforming one or more power units; the plurality of power cells are spatially divided into at least two layers, each layer including at least one power cell.
As shown in fig. 3, in the power module 10 provided in this embodiment, the plurality of power units are spatially divided into at least two layers of the following arrangement: a first layer 1001 and a second layer 1002.
The first layer 1001 and the second layer 1002 each include one or more power cells. The number of the plurality of power units may be two or more, and the specific number of the power units in each layer is not particularly limited.
Adjacent power cells of the first layer 1001 may be connected in series, adjacent power cells of the second layer 1002 may be connected in series, and one power cell of the first layer 1001 is connected in series with one power cell of the second layer 1002.
The series connection of the power cells of the first layer 1001 and the power cells of the second layer 1002 may reduce the voltage difference between some of the power cells of the first layer 1001 and some of the power cells of the second layer 1002.
For example, when the application scenario corresponding to fig. 3 is 10kV high voltage, one power module 10 includes 8 power units, and the 8 power units in fig. 3 are power unit 1-power unit 8, respectively. The power units 1-8 are connected in series in sequence, and the voltage borne by each power unit is 10 kV/8.
For convenience of understanding, the power module 10 includes power cells arranged in two layers as an example. If the voltage class is higher or the voltage stress borne by each power unit is smaller, the number of the power units may also be increased, which is not specifically limited in the embodiment of the present application, and the number of the power units arranged in each layer is only described as 4 in the embodiment, and more or fewer power units may also be provided, specifically considering the size requirement of the power supply cabinet.
In order to effectively utilize the spatial distribution of the power module 10, the number of the power units in each layer may be equal and the power units are symmetrically and uniformly arranged, so that the space may be saved and a larger number of power units may be placed in a limited space.
The series connection of the power cells of the first and second layers is exemplified below.
When the first layer 1001 and the second layer 1002 each include only one power cell, the power cells of the first layer 1001 may be directly connected in series with the power cells of the second layer 1002.
When one of the first layer 1001 and the second layer 1002 includes only one power unit and the other of the first layer 1001 and the second layer 1002 includes two or more power units, taking the example that the first layer 1001 includes two or more power units and the second layer 1002 includes only one power unit, all the power units of the first layer 1001 may be sequentially connected in series and one power unit at a connection end in the first layer 1001 may be connected in series with the power unit of the second layer 1002.
When the first layer 1001 and the second layer 1002 each include a plurality of power cells, some of the power cells in the first layer 1001 may be directly connected in series with some of the power cells in the second layer 1002. When some of the power cells in the first layer 1001 are directly connected in series with some of the power cells in the second layer 1002, the remaining power cells in the first layer 1001 are connected in series within the present layer.
For example, as shown in fig. 3, power cell 4 in first layer 1001 is directly connected in series with power cell 5 in second layer 1002.
That is, in order to make the voltage difference between the power cells in the two layers uniform, the power cells of the first layer 1001 and the power cells of the second layer 1002 may be directly connected in series in sequence, such that the first layer 1001 includes power cell 1-power cell 4, and the second layer 1002 includes power cell 5-power cell 8. It should be noted that the first layer 1001 and the second layer 1002 are for convenience of description, and the positions of the two layers may be interchanged without special representation meaning.
The 1 st to nth power cells are sequentially arranged from the first side of the first layer 1001 to the second side of the first layer 1001. The (n + 1) th to the (2 n) th power units are sequentially arranged from the first side of the second layer 1002 to the second side of the second layer 1002.
As shown in fig. 3, the first layer 1001 includes 4 power units, i.e., power unit 1-power unit 4 from left to right, i.e., from the first side to the second side, respectively, and the second layer 1002 includes 4 power units, i.e., power unit 5-power unit 8 from left to right, i.e., from the first side to the second side, respectively. The above numbering is done for convenience of description only and does not imply any significance, as the numbering may be done in other orders.
Each power unit comprises two ports, the ports can be input and output independently, the first port of the power unit 1 is connected with a power supply, the second port of the power unit 1 is connected with the first port of the power unit 2, the second port of the power unit 2 is connected with the first port of the power unit 3, the second port of the power unit 3 is connected with the first port of the power unit 4, the second port of the power unit 4 is connected with the first port of the power unit 5, the second port of the power unit 5 is connected with the first port of the power unit 6, the second port of the power unit 6 is connected with the first port of the power unit 7, the second port of the power unit 7 is connected with the first port of the power unit 8, and the second port of the power unit 8 is used as an output end.
Because the power units between two adjacent layers of power units in the power module 10 provided by this embodiment are directly connected in series in sequence, effective voltage sharing around each layer of shielding layer is realized, that is, the voltage difference between the adjacent power units of each layer is almost equal on average, so that the adjacent power units can be more effectively protected from being broken down by a higher voltage difference. For example, when the error is ignored, the voltage difference between the power unit 1 and the power unit 2 is equal to the voltage difference between the power unit 2 and the power unit 3, and is also equal to the voltage difference between the power unit 3 and the power unit 4, and so on, the power units in each layer shown in fig. 3 are directly connected in series, and the voltage-sharing effect can be better achieved.
For another example, the 1 st to m th power cells in the first layer 1001 may be connected in series in sequence, where 1 < m < n. Thereafter, the mth power cell in the first layer 1001 is connected in series with the (n + 1) th power cell of the second layer 1002. Then, the (n + 1) th power cell to the(s) th power cell of the second layer 1001 are sequentially connected in series. Wherein n +1 is more than s and less than 2 n. The s-th power cell of the second layer is then connected in series with the m + 1-th power cell of the first layer. Then, the (m + 1) th power unit to the nth power unit of the first layer are connected in series in sequence. Thereafter, the nth power cell of the first layer is connected in series with the (s + 1) th power cell of the second layer. And finally, the (s + 1) th power unit to the (2 n) th power unit of the second layer are sequentially connected in series. The voltage difference between adjacent two power units in the 1 st to the mth power units in the first layer, the n +1 th to the s-th power units in the second layer, the m +1 th to the nth power units in the first layer, and the s +1 th to the 2 nth power units in the second layer is small.
As shown in fig. 3, the power cell 1 of the first layer 1001 may be connected in series with the power cell 2, and then the power cell 2 of the first layer 1001 is connected in series with the power cell 8 of the second layer 1002. Then, the power cell 8 of the second layer 1002 is connected in series with the power cell 7, and the power cell 7 of the second layer 1002 is connected in series with the power cell 3 of the first layer 1001. Thereafter, power cell 3 of first layer 1001 is connected in series with power cell 4, and power cell 4 is connected in series with power cell 6 of second layer 1002. Finally, power cell 6 of second layer 1002 is in series with power cell 5.
The first port of the power unit 1 of the first layer 1001 is connected to a power supply, the second port of the power unit 1 is connected to the first port of the power unit 2, and the second port of the power unit 2 is connected to the first port of the power unit 8. The second port of the power unit 8 is connected to the first port of the power unit 7, and the second port of the power unit 7 is connected to the first port of the power unit 3. The second port of the power unit 3 is connected to the first port of the power unit 4, and the second port of the power unit 4 is connected to the first port of the power unit 6. The second port of the power unit 6 is connected to the first port of the power unit 5, and the second port of the power unit 5 serves as an output terminal.
It should be noted that, of course, some of the power units in the power module 10 may not be used as transformers. For example, the first port of the power unit 1 is used as an input terminal for connecting a power supply, and the second port of the power unit 7 is directly used as an output terminal after the power units 1 to 7 are connected in series via the ports.
The structure of the case 100 will be described in detail below.
The housing 100 is disposed outside the power unit, for example. The housing 100 includes at least: the cover plate comprises a first cover plate 101, a second cover plate 102 and a third cover plate 103 which are arranged in a stacked mode, wherein the second cover plate 102 is located between the first cover plate 101 and the third cover plate 103.
The power units (power unit 1-power unit 4) of the first layer 1001 are arranged on one side of the first cover plate 101 close to the second cover plate 102, and the power units of the second layer 1002 are arranged on one side of the third cover plate 103 close to the second cover plate 102. All power cells of the first layer 1001 may be mounted on the first cover 101 or may be mounted on the second cover 102. All power cells of the second layer 1002 may be mounted on the third cover plate 103 or may be mounted on the second cover plate 102. The following description will be given taking an example in which all the power cells of the first layer 1001 are mounted on the first cover 101 and all the power cells of the second layer 1002 are mounted on the third cover 103.
The first cover plate 101, the second cover plate 102 and the third cover plate 103 are connected. The first cover plate 101, the second cover plate 102 and the third cover plate 103 may be fixedly connected by welding, or may be detachably connected by a connecting member (e.g., a bolt or a screw).
Therefore, the first cover plate, the second cover plate and the third cover plate are an upper part, a middle part and a lower part, the first cover plate and the third cover plate are provided with the plurality of power units, the first cover plate, the second cover plate and the third cover plate can be assembled together in a buckling installation mode, and therefore the plurality of power units are packaged in the shell, and the installation mode is simple. Meanwhile, an insulating structure does not need to be arranged between adjacent power units on the same layer, so that the material utilization rate and the power density are improved, and the cover plate material is saved.
However, as shown in fig. 3, the power units 1 to 8 are connected in series in sequence, a first terminal of the power unit 1 is connected to one phase voltage, and a second terminal of the power unit 8 is connected to the other phase voltage, that is, the voltage difference between the power unit 1 and the power unit 8 is the line voltage U between the two phases. Since 8 power units are connected in series, each power unit bears a voltage of U/8, the voltage difference between the power unit 2 and the power unit 7 is 3U/4, and the voltage difference between the power unit 3 and the power unit 6 is U/2. Therefore, the voltage difference between adjacent power units in different layers is large, and breakdown and fire are easily caused.
In the housing provided by the embodiment of the present application, the first cover plate 101, the second cover plate 102, and the third cover plate 103 all use an insulating material, such as epoxy resin.
The second cover plate 102 is located between the power cells of the first layer 1001 and the second layer 1002, so that the voltage difference between the power cells of the upper layer and the lower layer can be reduced, and the power cells of the upper layer and the lower layer can be prevented from being broken down and ignited due to too large voltage difference.
Therefore, in the series connection mode provided by the embodiment of the application, the second cover plate 102 can be arranged between the power units of the first layer 1001 and the power units of the second layer 1002, so that the voltage difference between the power units of the upper layer and the lower layer can be reduced, and the situation that the power units break down and fire because of too large voltage difference is prevented.
The embodiment of the present application does not limit the specific structures of the first cover plate 101, the second cover plate 102, and the third cover plate 103.
Fig. 6 is a schematic structural diagram of a housing of a power module according to an embodiment of the present application. Fig. 7 is a schematic disassembled structure diagram of a housing of a power module according to an embodiment of the present application. As shown in fig. 6 and 7, the first cover plate 101 includes: the top plate 1010 and the two first connecting plates 1011 form a concave structure, and the top plate 1010 and the two first connecting plates 1011 can be integrally formed.
The second cover plate 102 includes: the middle plate 1020 and the two second connecting plates 1021 form an H-shaped structure, and the middle plate 1020 and the two second connecting plates 1021 can be integrally formed together.
The third cover plate 103 includes: a base plate 1030, and two third connecting plates 1031, wherein the base plate 1030 and the two third connecting plates 1031 form a concave structure, and the base plate 1030 and the two third connecting plates 1031 can be integrally formed.
In addition, as shown in fig. 7, a first positioning column 10101 is further disposed on the top plate 1010, and the first positioning column 10101 may divide the top plate 1010 into a plurality of regions, each of which may mount a power unit. A plurality of second positioning columns 10301 are further disposed on the bottom board 1030, and the second positioning columns 10301 can divide the bottom board 1030 into a plurality of areas, and each area can mount one power unit.
As shown in fig. 7, the middle plate 1020 is provided with a connecting hole 10201, the first positioning column 10101 on the top plate 1010, the second positioning column 10301 on the bottom plate 1030, and the positioning hole 10201 on the middle plate 1020 are opposite, so that the first positioning column 10101 on the top plate 1010 and the second positioning column 10301 on the bottom plate 1030 can be inserted into the positioning hole 10201 on the middle plate 1020 during positioning, so as to assemble the first cover plate 101, the second cover plate 102, and the third cover plate 103 together.
During assembly, one layer of power units may be mounted on the third cover plate 103, and another layer of power units may be mounted on the first cover plate 101.
Then, the second cover plate 102 can be covered on the third cover plate 103, so that the positioning posts 10301 on the bottom plate 1030 are inserted into the positioning holes 10201 on the middle plate 1020, at this time, the middle plate 1020 is opposite to the bottom plate 1030, and the second connecting plate 1021 is located inside the third connecting plate 1031. Next, the bottom plate 1030 and the middle plate 1020 may be detachably coupled together by a coupling member.
It should be noted that the connecting member may be a bolt, and the connecting hole may be a bolt hole.
Finally, the first cover 101 can be closed to the second cover 102, so that the positioning posts 10101 on the top plate 1010 are inserted into the positioning holes 10201 of the middle plate 1020, at this time, the middle plate 1020 is opposite to the top plate 1010, and the second connecting plate 1021 is located inside the first connecting plate 1011. Similarly, the middle plate 1020 and the top plate 1010 may be detachably connected by a connector.
Therefore, the insulating material consists of an upper part, a middle part and a lower part, and a plurality of power units can be packaged in one set of insulating material by adopting a buckling installation mode.
The outer surface of the housing 100 is provided with a conductive layer 104, and a plurality of shielding layers (such as a first shielding layer 1013, a second shielding layer 1024, a third shielding layer 1025, and a fourth shielding layer 1033 shown in fig. 11 a) are embedded in the housing 100, the plurality of shielding layers are opposite to the plurality of power units one by one, and each power unit can be connected to one of the shielding layers through a lead.
Specifically, fig. 11b is a circuit diagram of the interior of the power module according to the embodiment of the present application. As shown in fig. 11b, the outer side of the housing 100 is provided with a conductive layer 104, and the conductive layer 104 can be used as a grounding plate. For example, the conductive layer 104 includes: a first conductive layer 1041 disposed on an outer side surface of the first cover plate 101, and a second conductive layer 1042 disposed on an outer side surface of the third cover plate 103.
And a shielding layer is arranged in the cover plate between the power unit and the conductive layer, and the power unit is electrically connected with the shielding layer.
As shown in fig. 11b, the first cover plate 101 is provided with a plurality of first shield layers 1013 ( shield layers 1013a, 1013b, 1013c, and 1013d), the second cover plate 102 is provided with a plurality of second shield layers 1024 ( shield layers 1024a, 1024b, 1024c, and 1024d) and a plurality of third shield layers 1025 ( shield layers 1025a, 1025b, 1025c, and 1025d), and the third cover plate 103 is provided with a plurality of fourth shield layers 1033 ( shield layers 1033a, 1033b, 1033c, and 1033 d).
The plurality of first shielding layers 1013 are opposite to the plurality of power units of the first layer 1001, and each power unit in the first layer 1001 may be connected to one first shielding layer 1013 through a lead.
As shown in fig. 11b, the power unit 1 is connected to the shield layer 1013a by a lead, the power unit 2 is connected to the shield layer 1013b by a lead, the power unit 3 is connected to the shield layer 1013c by a lead, and the power unit 4 is connected to the shield layer 1013d by a lead.
The third cover plate has a plurality of fourth shielding layers 1033 disposed therein, the plurality of fourth shielding layers are opposite to the plurality of power cells of the second layer 1002 one by one, and each power cell on the second layer 1002 can be connected to one of the fourth shielding layers 1033 through a lead.
Referring next to fig. 11b, power cell 8 is connected to shield layer 1033a by a lead, power cell 7 is connected to shield layer 1033b by a lead, power cell 6 is connected to shield layer 1033c by a lead, and power cell 5 is connected to shield layer 1033d by a lead.
Therefore, the conducting layers on the outer sides of the first cover plate and the third cover plate can be used as grounding plates, the shielding layers are arranged in the first cover plate and the third cover plate, and the power unit and the shielding layers are connected through the leads, wherein the leads can conduct the power unit and the shielding layers, and the shielding layers and the conducting layers are filled with insulating materials, so that the insulating property is improved, and the phenomenon that fire is caused by the fact that air is reserved between the power unit and the grounding plates and is broken down by high voltage is avoided.
A plurality of second shielding layers 1024 are disposed in the second cover plate, as shown in fig. 11b, and the second shielding layers 1024 are located below the power units of the first layer. It will be appreciated that after turning the power module of fig. 11b upside down, the second shielding layer 1024 is located above the power cells of the first layer 1001. The plurality of power cells in the first layer are opposite to the plurality of second shielding layers 1024 one by one, and each power cell in the first layer may be connected to one of the second shielding layers 1024 by a wire.
As shown in fig. 11b, power unit 1 is connected to shielding layer 1024a by a lead, power unit 2 is connected to shielding layer 1024b by a lead, power unit 3 is connected to shielding layer 1024c by a lead, and power unit 4 is connected to shielding layer 1024d by a lead.
Therefore, by arranging the second shielding layer 1024 in the second cover plate and conducting the power units and the second shielding layer 1024 through the leads, the breakdown between the adjacent first layer of power units and the second cover plate due to the existence of the air gap can be prevented, and the insulation performance between the first layer of power units and the second layer of power units is improved.
A plurality of third shielding layers 1025 are disposed in the second cover plate, as shown in fig. 11b, the third shielding layers 1025 are located above the power cells of the second layer and below the second shielding layer 1024. It will be appreciated that after turning the power module of fig. 11b upside down, third shielding layer 1025 is located below the power cells of this second layer and above second shielding layer 1024. The plurality of power cells on the second layer are opposite to the plurality of third shielding layers 1025, and each power cell on the second layer may be connected to one of the third shielding layers 1025 through a wire.
Referring next to fig. 11b, power cell 8 is connected to shield layer 1025a by a wire, power cell 7 is connected to shield layer 1025b by a wire, power cell 6 is connected to shield layer 1025c by a wire, and power cell 5 is connected to shield layer 1025d by a wire.
Therefore, the third shielding layer 1025 is arranged in the second cover plate, and the power units and the third shielding layer 1025 are conducted through the leads, so that the breakdown between the adjacent second layer of power units and the second cover plate due to the existence of air gaps can be prevented, and the insulation performance between the first layer of power units and the second layer of power units is improved.
In summary, the shielding layer is disposed in the cover plate, and the power unit and the shielding layer are connected by the lead, so that the power unit is directly conducted with the shielding layer, and further, the potential on the shielding layer is equal to the potential of the power unit, and the shielding layer and the ground plate are filled with the insulating material, thereby preventing an air gap from being generated between the power unit and the conductive layer to cause discharge.
The shielding layer is made of a conductive material. The conductive layer can be used as a grounding plate, the shielding layer is arranged in the shell 100, and the power unit and the shielding layer are connected through the lead, so that the power unit and the shielding layer are conducted through the lead, and the shielding layer and the conductive layer are filled with insulating materials, thereby improving the insulating property, and avoiding the ignition caused by the breakdown of a higher voltage due to the existence of an air gap between the power unit and the grounding plate.
The air electric field strength at the edge of the shielding layer is relatively high, and in order to prevent the edge of the shielding layer from being broken down by a relatively high voltage to cause ignition, the embodiment of the application provides an improved casing 100.
As shown in fig. 8, 9, 10, and 11a, a plurality of partition walls (e.g., a first partition wall 1012 shown in fig. 8, a second partition wall 1022 shown in fig. 6, 7, and 9, a third partition wall 1032 shown in fig. 6, 7, and 10, and a fourth partition wall 1023 shown in fig. 11 a) are disposed on an inner surface of the housing 100, and the plurality of partition walls are criss-cross to form a plurality of openings, and a power unit is disposed in one of the openings, wherein a vertical projection of one of the shielding layers on the housing is located within a vertical projection range of one of the partition walls on the housing, and a height of the partition wall is smaller than a height of the power unit.
In some embodiments, a perpendicular projection of an end (edge) of one of the shielding layers on the housing coincides with a perpendicular projection range of one of the partition walls on the housing.
The separation wall is arranged at the tail end of the shielding layer, so that the air electric field intensity at the tail end of the shielding layer can be reduced.
The partition wall is only arranged at the tail end of the shielding layer, and the insulating partition wall is arranged on the whole plane of the non-shell, so that the using amount of insulating materials can be saved, more height spaces are provided for electronic components in the power unit, and the power density is improved.
Moreover, the height of the partition wall is smaller than that of the power unit, so that the consumption of insulating materials can be further saved, and the power density is further improved.
The material of the partition wall can be one or the combination of at least two of plastic, ceramic, wood, fiber, polymer and other insulating materials. In the embodiment of the present application, the partition wall may be made of epoxy resin.
The material of the housing is not limited in the embodiment of the present application, the housing may be made of the same material as the partition wall, and the material of the housing 100 may be one or a combination of at least two of insulating materials such as plastic, ceramic, wood, fiber, and polymer. In the embodiment of the present application, the housing 100 may be made of epoxy resin.
The process of the housing and the partition wall is not limited in the embodiments of the present application, and in some embodiments, the housing and the partition wall may be formed separately and then connected together.
In other embodiments, the housing and the dividing wall may be integrally formed.
As shown in fig. 8 and 11a, the first partition wall 1012 is provided on the surface of the first cover plate 101 close to the second cover plate 102. The first partition wall 1012 may be one or more. Wherein the height of the first partition wall 1012 (the height direction is a vertical direction in fig. 11 a) is smaller than the height of the power cells of the first floor 1001.
Wherein the first partition wall 1012 includes: a partition wall 1012a is provided around the power unit 1, a partition wall 1012b is provided around the power unit 2, a partition wall 1012c is provided around the power unit 3, and a partition wall 1012d is provided around the power unit 4.
The height of the dividing wall 1012a is less than that of the power unit 1, the height of the dividing wall 1012b is less than that of the power unit 2, the height of the dividing wall 1012c is less than that of the power unit 3, and the height of the dividing wall 1012d is less than that of the power unit 4.
In some embodiments, power cell 1, power cell 2, power cell 3, and power cell 4 are the same height, and dividing wall 1012a, dividing wall 1012b, dividing wall 1012c, and dividing wall 1012d are the same height.
As shown in fig. 9 and 11a, the second partition wall 1022 is disposed on a surface of the second cover plate 102 close to the first cover plate 101. The second partition wall 1022 may be one or more. The height of the second partition walls 1022 is less than the height of the first tier 1001 of power cells.
Wherein, the second partition wall 1022 includes: a partition wall 1022a disposed around the power unit 1, a partition wall 1022b disposed around the power unit 2, a partition wall 1022c disposed around the power unit 3, and a partition wall 1022d disposed around the power unit 4.
The height of the partition wall 1022a is less than that of the power unit 1, the height of the partition wall 1022b is less than that of the power unit 2, the height of the partition wall 1022c is less than that of the power unit 3, and the height of the partition wall 1022d is less than that of the power unit 4.
In some embodiments, the heights of the dividing walls 1022a, 1022b, 1022c, and 1022d are the same.
In addition, the sum of the heights of the first and second partition walls 1012 and 1022 is smaller than the height of the power cells of the first layer 1001.
The dividing wall 1012a and the dividing wall 1022a are oppositely arranged, the dividing wall 1012b and the dividing wall 1022b are oppositely arranged, the dividing wall 1012c and the dividing wall 1022c are oppositely arranged, the dividing wall 1012d and the dividing wall 1022d are oppositely arranged, the sum of the heights of the dividing wall 1012a and the dividing wall 1022a is smaller than the height of the power unit 1, the sum of the heights of the dividing wall 1012b and the dividing wall 1022b is smaller than the height of the power unit 2, the sum of the heights of the dividing wall 1012c and the dividing wall 1022c is smaller than the height of the power unit 3, and the sum of the heights of the dividing wall 1012d and the dividing wall 1022d is smaller than the height of the power unit 4.
As shown in fig. 10 and 11a, the third partition walls 1032 are disposed on the surfaces of the third cover plates 103 close to the second cover plate 102. One or more third partition walls 1032 may be provided. The height of the third partition 1032 is less than the height of the power cells of the second layer 1002.
Wherein the third partition wall 1032 includes: a partition wall 1032a provided around the power cell 8, a partition wall 1032b provided around the power cell 7, a partition wall 1032c provided around the power cell 6, and a partition wall 1032d provided around the power cell 5.
The height of the partition wall 1032a is smaller than that of the power cell 8, the height of the partition wall 1032b is smaller than that of the power cell 7, the height of the partition wall 1032c is smaller than that of the power cell 6, and the height of the partition wall 1032d is smaller than that of the power cell 5.
In some embodiments, dividing wall 1032a, dividing wall 1032b, dividing wall 1032c, and dividing wall 1032d are the same height.
As shown in fig. 11a, a fourth partition 1023 is disposed on a surface of the second cover plate 102 close to the third cover plate 103. One or more fourth partition walls 1023 may be provided. The height of the fourth partition 1023 is less than the height of the power cells of the second tier 1002.
Wherein, the fourth partition wall 1023 includes: a partition wall 1023a disposed around the power unit 8, a partition wall 1023b disposed around the power unit 7, a partition wall 1023c disposed around the power unit 6, and a partition wall 1023d disposed around the power unit 5.
The height of each partition wall 1023a is smaller than the height of the power unit 8, the height of each partition wall 1023b is smaller than the height of the power unit 7, the height of each partition wall 1023c is smaller than the height of the power unit 6, and the height of each partition wall 1023d is smaller than the height of the power unit 5.
In some embodiments, the heights of power cells 5, 6, 7, 8 are the same, and the heights of dividing walls 1023a, 1023b, 1023c, and 1023d are the same.
In addition, the sum of the heights of the third partition wall 1032 and the fourth partition wall 1023 is smaller than the height of the power cells of the second layer 1002. Thereby, the amount of the insulating material can be saved.
The dividing wall 1032a and the dividing wall 1023a are arranged oppositely, the dividing wall 1032b and the dividing wall 1023b are arranged oppositely, the dividing wall 1032c and the dividing wall 1023c are arranged oppositely, the dividing wall 1032d and the dividing wall 1023d are arranged oppositely, the sum of the heights of the dividing wall 1032a and the dividing wall 1023a is smaller than the height of the power unit 8, the sum of the heights of the dividing wall 1032b and the dividing wall 1023b is smaller than the height of the power unit 7, the sum of the heights of the dividing wall 1032c and the dividing wall 1023c is smaller than the height of the power unit 6, and the sum of the heights of the dividing wall 1032d and the dividing wall 1023d is smaller than the height of the power unit 5.
Fig. 12 is a schematic diagram of electric field intensity at a partition wall inside a power module according to an embodiment of the present application. As shown in fig. 12, the electric field intensity at the partition wall is small.
Therefore, the insulating partition walls are arranged at the edges of the shielding layers, so that the bathtub shape is formed in the shell, and the air electric field at the edges of the shielding layers can be reduced.
As shown in fig. 13 and 14, the power module 10 further includes: a housing 105, the housing 105 being disposed and connected outside the housing 100, the housing 105 being used to protect the power module 10.
Wherein, this casing 105 includes at least: an upper case 1051 and a lower case 1052, wherein the upper case 1051 is disposed outside the first cover 101 and detachably coupled to the first cover 101, the lower case 1052 is disposed outside the third cover 103 and detachably coupled to the third cover 103, and the upper case 1051 and the lower case 1052 are detachably coupled.
The material of the housing 105 is not limited in the embodiments of the present application, and in some embodiments, the housing is made of a metal material, for example. The heat dissipation performance is better, and the stability is higher.
The housing 105 further comprises: the power module comprises a front shell 1053 and a rear shell 1054, wherein a heat dissipation structure is arranged on the front shell 1053, so that the heat dissipation performance of the power module can be improved.
The above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (16)

1. A power module, comprising: the power supply comprises a shell, an input end, an output end and a plurality of power units which are connected in series;
the input end is used for connecting a power supply and the power unit, and the output end is used for outputting the voltage transformed by the power unit;
the outer surface of the shell is provided with a conducting layer, a plurality of shielding layers are embedded in the shell, the shielding layers are opposite to the power units one by one, and each power unit is connected with one shielding layer;
the power unit is characterized in that a plurality of partition walls are arranged on the inner surface of the shell, the partition walls are crisscrossed to form a plurality of openings, one power unit is positioned in one opening, the vertical projection of one shielding layer on the shell is positioned in the vertical projection range of one partition wall on the shell, and the height of each partition wall is smaller than that of the power unit.
2. The power module of claim 1, wherein the housing and the dividing wall are each formed of an insulating material.
3. The power module according to claim 1 or 2, wherein the housing and the partition wall are integrally formed.
4. The power module of any of claims 1-3, wherein the plurality of power cells are spatially divided into a first layer and a second layer, each layer including at least one of the power cells;
the housing includes: the power module comprises a first cover plate, a second cover plate and a third cover plate which are arranged in a stacked mode, wherein the second cover plate is located between the first cover plate and the third cover plate, a first layer of power units are arranged on one side, close to the second cover plate, of the first cover plate, and a second layer of power units are arranged on one side, close to the second cover plate, of the third cover plate;
the first cover plate, the second cover plate and the third cover plate are connected.
5. The power module of claim 4, wherein all power cells of a same layer are connected in series in sequence, and wherein an end one of the power cells in the first layer and an end one of the power cells in the second layer are connected in series.
6. The power module according to claim 4 or 5, wherein the plurality of partition walls includes at least one first partition wall disposed on a surface of the first cover plate adjacent to the second cover plate, and a height of the first partition wall is less than a height of the first layer of power cells.
7. The power module of claim 6, wherein the plurality of dividing walls further comprises at least one second dividing wall disposed on a surface of the second cover plate adjacent to the first cover plate, the at least one second dividing wall being in one-to-one correspondence with the at least one first dividing wall, the second dividing wall having a height less than a height of the first tier of power cells.
8. The power module of claim 7, wherein a sum of heights of the first partition wall and the second partition wall is less than a height of the first tier of power cells.
9. The power module of any of claims 4-8, wherein the plurality of dividing walls further comprises at least one third dividing wall disposed on a surface of the third cover plate adjacent to the second cover plate, the third dividing wall having a height less than a height of the second tier of power cells.
10. The power module as claimed in claim 9, wherein the plurality of partition walls further includes at least one fourth partition wall provided on a surface of the second cover plate adjacent to the third cover plate, the at least one fourth partition wall being one-to-one opposite to the at least one third partition wall, and a height of the fourth partition wall is less than a height of the second layer of power cells.
11. The power module of claim 10, wherein a sum of heights of the third partition and the fourth partition is less than a height of the second tier of power cells.
12. The power module as claimed in any one of claims 1 to 11, wherein the first cover plate and the third cover plate are provided with positioning posts, the second cover plate is provided with positioning holes, the positioning posts are opposite to the positioning holes, and the positioning posts are inserted into the positioning holes.
13. The power module of any of claims 1-12, further comprising a chassis disposed around the housing, the chassis being removably coupled to the housing.
14. The power module of claim 13, wherein the housing is made of metal.
15. The power module as claimed in claim 13 or 14, wherein the casing is provided with heat dissipation holes.
16. A power supply system comprising a power supply, a consumer, and a power module as claimed in any one of claims 1 to 15, the power supply being connected to an input of the power module and the consumer being connected to an output of the power module.
CN202110989648.6A 2021-08-26 2021-08-26 Power module and power supply system Pending CN113890308A (en)

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CN202110989648.6A CN113890308A (en) 2021-08-26 2021-08-26 Power module and power supply system

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