CN113883555B

CN113883555B - Temperature detection structure, induction cooker and temperature detection method

Info

Publication number: CN113883555B
Application number: CN202111057763.6A
Authority: CN
Inventors: 李敏
Original assignee: Guangdong Shunde Jingwei Glass Products Co ltd
Current assignee: Guangdong Shunde Jingwei Glass Products Co ltd
Priority date: 2021-09-09
Filing date: 2021-09-09
Publication date: 2023-09-08
Anticipated expiration: 2041-09-09
Also published as: CN113883555A

Abstract

The application discloses a temperature detection structure, an electromagnetic oven and a temperature detection method. The temperature detection structure includes: the panel, support the salient point portion, heat conduction bush and temperature probe, support salient point portion including locating at protruding portion and tube cavity portion that extend downward from protruding portion bottom surface of top; the inside of the tube cavity part is provided with a first cavity, the inside of the heat conduction bush is provided with a second cavity, and the top end surface of the heat conduction bush is provided with a concave part in a downward concave way; the temperature probe is installed to the second cavity, and the temperature probe is attached to the outer wall of the concave part. The induction cooker with the temperature detection structure has the advantages that as the temperature detection structure is added, the probability of the contact between the panel and the cooker is reduced under various cooking conditions, and the temperature detection method is more sensitive to the temperature detection of the cooker, so that the induction cooker can conveniently have different intelligent switching temperature detection control modes of cooking modes; when an abnormal condition is met, accurate judgment can be made more quickly, and the safety performance can be greatly improved.

Description

Temperature detection structure, induction cooker and temperature detection method

Technical Field

The application relates to the field of household appliances, in particular to a temperature detection structure, an electromagnetic oven and a temperature detection method.

Background

The induction cooker has the advantages of rapid heating, no open fire, no smoke dust, safety, convenience and the like, and is increasingly favored and accepted by consumers.

The electromagnetism stove mainly includes among the prior art: the coil disc, the control board and the temperature measuring device are positioned in a space surrounded by the bottom shell and the panel. The mounting structure of the temperature measuring device specifically comprises: the mounting seat is installed in the laminating of the bottom of panel, is equipped with the mounting hole in the mounting seat and is used for inserting fixed mounting temperature probe, still is equipped with heat conduction silicone grease material layer between the bottom surface of mount pad top surface and panel. When placing the pan on the electromagnetism stove, the drum heats the pan, can transmit with the panel region of self contact after the pan temperature rise, and the panel is heated the back and is transmitted the heat conduction silicone grease with the temperature again, and the heat conduction silicone grease is transmitted the temperature to the mount pad then, and final temperature mount pad is with temperature transfer to temperature probe.

In the existing induction cooker products, the temperature detection structure has obvious technical defects:

1. in the existing induction cooker products, the temperature probe is used for detecting temperature data transmitted by the panel, and then indirectly predicting the temperature of the cooker through the temperature data, so that whether the cooker is dry-burned or not is judged; when the pan appears dry combustion method, the pan appears the deformation very easily, leads to the bottom of pan uneven, and when the bottom of pan and panel can't maintain the state of high laminating, even the pan appears dry combustion method this moment, the temperature of panel also probably appears rising unobvious condition, and temperature probe just can't be quick just the temperature information accurate detection pan's of passing through this moment temperature change to can't reach the technical purpose that prevents the pan dry combustion method.

2. In the existing induction cooker products, as the temperature probe is arranged below the panel and the pan is arranged above the panel, the temperature detected by the temperature probe is required to be sequentially transmitted to the panel, the heat-conducting silicone grease material layer and the mounting seat through the pan, and as the temperature transmission path is too long and complicated, the temperature detection operation of the temperature probe has serious hysteresis, and the temperature can be transmitted in different materials and can be scattered and changed, the temperature value detected by the temperature probe cannot be equal to the temperature detected by the pan, and a certain temperature range difference value is required to be set in the temperature detection control of the induction cooker to compensate the temperature scattered by the transmission; however, in practical application, the induction cooker has various cooking modes, various surrounding environments of the induction cooker, and the cookware can be deformed to change the fitting degree and the position of the induction cooker with the panel, so that the temperature range difference value must be properly adjusted according to the scene to ensure that the temperature detected by the temperature probe is equal to the actual temperature of the cookware; in practical application, the difference value of the temperature range of the induction cooker in control cannot be correspondingly adjusted according to the real time of the application scenes, so that the temperature detection error cannot be necessarily eliminated between the temperature value detected by the temperature probe in practical application of the existing induction cooker product and the actual temperature of the cooker, the error cannot be predicted and controlled, and the temperature detected by the temperature probe in practical application of the induction cooker is caused, the temperature of the cooker is different, and accurate real-time feedback of the temperature of the cooker cannot be realized.

Disclosure of Invention

In view of the above drawbacks, an object of the present application is to provide a temperature detecting structure and an induction cooker, wherein the temperature of a pot can be detected by a temperature probe more quickly.

Another object of the present application is to provide a method for detecting temperature of an electromagnetic oven, which can quickly and accurately detect abnormal conditions of a pot during cooking according to differences of detection parameters among a plurality of temperature detection structures.

To achieve the purpose, the application adopts the following technical scheme:

a temperature sensing structure, comprising: and the panel is provided with a through hole along the vertical direction. A supporting bump portion including a boss portion at a tip end and a lumen portion extending downward from a bottom surface of the boss portion; the inside of the tube cavity part is provided with a first cavity, the top of the first cavity extends into the protruding part, and the bottom of the cavity is communicated with the outside; the supporting salient points are arranged on the through holes from top to bottom, the tube cavity parts penetrate through the through holes and extend to the lower part of the panel, and the protruding parts are at least partially and limitedly arranged above the panel; the boss is made of a thermally conductive material. The heat conduction lining is internally provided with a second cavity, and the top end surface of the heat conduction lining is provided with a concave part in a downward concave way; the heat conduction lining is arranged in the first cavity, and the concave part and the top of the first cavity are spliced to form a heat conduction cavity; and a heat conducting material is filled in the heat conducting cavity. The temperature probe is installed in the second cavity and is attached to the outer wall of the concave part.

More preferably, the protruding part comprises an annular edge part and a middle top plate part; an extension cavity is arranged in the middle of the annular edge part and is communicated with the top end of the first cavity; the top plate part is plugged at the top end of the extension cavity, so that the thickness of the annular part is larger than that of the top plate part in a vertical plane; the concave part is positioned in the extension and spliced with the bottom surface of the top plate part to form the heat conducting cavity.

More preferably, the thickness dimension range of the annular edge part is: 0.5mm-20mm; the thickness dimension range of the top plate part is as follows: 0.1mm-5mm.

More preferably, the heat conducting bush is tubular, the second cavity is arranged in the heat conducting bush, the top end of the first cavity is a blind end, and the top of the first cavity passes through the through end; the blind end of the second cavity is provided with the concave part in a downward concave manner; a heat conduction bottom wall is arranged between the bottom of the concave part and the top end of the first cavity; the temperature probe is in contact with the bottom surface of the heat conducting bottom wall.

More preferably, the concave part is of a downward concave hemispherical structure, the cross section in the vertical plane is semicircular, and the heat conduction bottom wall is positioned at the bottommost part of the cambered surface; the second cavity extends in a radial direction vertically downward in the semi-circular shape.

More preferably, the thickness dimension range of the heat conducting bottom wall is: 1mm-3mm.

More preferably, a limiting mounting piece is arranged below the supporting protruding point part, and the limiting mounting piece is provided with a limiting hole; the limiting mounting piece is attached to the bottom surface of the panel in a limiting manner; the pipe cavity part passes through the limiting hole, and the limiting mounting piece fixedly mounts the supporting protruding point part and the panel.

More preferably, the limit mounting piece is a limit mounting plate, and the limit mounting plate is formed by splicing a plurality of plates.

The electromagnetic oven comprises a panel and a controller, wherein at least three through holes are formed in the panel, and the positions of the through holes are provided with the temperature detection structures; the controller is electrically coupled to each of the temperature sensing structures.

A temperature detection method comprising the steps of:

threshold parameters and early warning settings are set according to the cooking operation of the induction cooker.

And acquiring a specified temperature parameter difference range of a temperature probe in the specified temperature detection structure.

The controller compares and analyzes the difference range between the specified temperature parameters with the threshold parameters, and when the difference range of the specified temperature parameters does not exceed the threshold parameters, the controller controls the induction cooker to normally perform cooking operation; when the difference range of the specified temperature parameter exceeds the threshold parameter, the controller sends out alarm information or stops the cooking operation of the induction cooker according to the early warning setting according to the analysis result.

The embodiment of the application has the beneficial effects that:

because the temperature detection structure can make the pan only contact with the supporting convex point part, the pan is in a suspended state, the pan can not contact with the panel, the temperature of the pan can not be transferred to the panel, the energy loss can be reduced by about 80 percent relative to the traditional induction cooker, and the cooking energy efficiency is higher.

The temperature detection structure is greatly increased, so that the probability of the contact between the panel and the cooker is reduced under various cooking conditions, and the temperature detection method is more sensitive to the temperature detection of the cooker, so that the induction cooker is more convenient to switch between different intelligent temperature detection control modes in a cooking mode; meanwhile, when an abnormal condition is met, accurate judgment can be made with higher probability and higher speed, and the safety performance can be greatly improved.

Because the cooker does not contact the panel and does not depend on the panel as a carrier, the heat received by the furnace body of the electromagnetic oven is greatly reduced, so that microcrystalline glass can be omitted from the panel, and cheaper borosilicate glass or common toughened glass can be used. The panel can also be directly encapsulated and protected in other modes, such as encapsulation and solidification of glue, and the production cost is lower.

More preferably, after the induction cooker is applied to the temperature detection structure, the temperature of the cooker does not need to be transferred to the panel in the cooking process, the temperature probe directly passes through the temperature of the cooker is detected by the supporting convex point part, the cooker is directly contacted with the supporting convex point part, the hysteresis quality of the temperature in the transfer process is smaller, the temperature transfer is more concentrated, the loss is smaller, and then the temperature probe can accurately detect the temperature of the cooker in real time, so that the electromagnetic temperature detection control is more accurate and safer to use.

Drawings

FIG. 1 is a schematic diagram of a temperature sensing structure according to an embodiment of the present application;

FIG. 2 is a schematic diagram of the structure of the embodiment of FIG. 1 from another perspective;

FIG. 3 is a schematic cross-sectional view of the embodiment of FIG. 1;

FIG. 4 is an exploded view of the embodiment of FIG. 1;

FIG. 5 is an exploded view of the embodiment of FIG. 1 from another perspective;

FIG. 6 is a schematic view of the temperature sensing structure with the panel removed in one embodiment of the application;

FIG. 7 is an exploded view of the embodiment of FIG. 6;

FIG. 8 is a schematic view of the assembly of the support bump portion, the heat conductive bushing, and the block nut and the temperature probe according to one embodiment of the application;

FIG. 9 is a schematic cross-sectional view of an alternative embodiment of the application with the support bump, thermally conductive sleeve and block nut and temperature probe assembled;

FIG. 10 is a schematic cross-sectional view of the embodiment of FIG. 8;

FIG. 11 is an exploded view of the embodiment of FIG. 8;

FIG. 12 is an exploded view of the embodiment of FIG. 10;

FIG. 13 is an exploded view of the embodiment of FIG. 10 from a perspective;

fig. 14 is a schematic view of a structure of the supporting bump portion, the heat conducting bush, the blocking nut and the temperature probe when assembled in another embodiment of the present application.

Wherein: panel 100, through hole 110, supporting bump 210, boss 211, lumen 212, first cavity 213, annular rim 2111, top plate 2112, extension 2113, heat conducting bush 220, recess 221, second cavity 222, heat conducting material 223, heat conducting bottom wall 2221, temperature probe 230, wire 231, limit mounting plate 240, limit hole 241, clip groove 242, clip boss 243, blocking nut 250, and wire hole 251.

Detailed Description

The technical scheme of the application is further described below by the specific embodiments with reference to the accompanying drawings.

Example 1

As shown in fig. 1 to 7, a temperature detecting structure includes: a panel 100, wherein a through hole 110 is formed in the panel 100 along a vertical direction; a supporting bump portion 210, the supporting bump portion 210 including a protrusion portion 211 at a top end and a lumen portion 212 extending downward from a bottom surface of the protrusion portion 211; a first cavity 213 is arranged in the lumen part 212, the top of the first cavity 213 extends into the protruding part 211, and the bottom of the cavity is communicated with the outside; the supporting bumps 210 are mounted on the through holes 110 from top to bottom, the lumen portions 212 extend to the lower side of the panel 100 through the through holes 110, and the protruding portions 211 are at least partially and limitedly mounted above the panel 100; the boss 211 is made of a thermally conductive material; a heat conducting bush 220, wherein a second cavity 222 is arranged in the heat conducting bush 220, and a concave part 221 is arranged on the top end surface of the heat conducting bush 220 in a downward concave manner; the heat conducting bush 220 is installed in the first cavity 213, and the concave part 221 and the top of the first cavity 213 are spliced to form a heat conducting cavity; the heat conduction cavity is filled with a heat conduction material 223; the temperature probe 230 is installed in the second cavity 222, and the temperature probe 230 is attached to the outer wall of the recess 221.

Specifically, the boss 211 includes an annular rim portion 2111 and a middle top plate portion 2112; an extension cavity 2113 is arranged in the middle of the annular edge portion 2111, and the extension cavity 2113 is communicated with the top end of the first cavity 213; the top plate portion 2112 is sealed off from the top end of the extension chamber 2113, so that the thickness of the annular portion in the vertical plane is greater than the thickness of the top plate portion 2112; the recess 221 is located in the extension, and is spliced with the bottom surface of the top plate 2112 to form the heat conducting cavity. As shown in fig. 9 and 10, the supporting bump portion 210 is in a vertical plane, the periphery of the protruding portion 211 is the annular rim portion 2111, and the middle portion is the top plate portion 2112 and the extension cavity 2113; in practical application, the peripheral surface or the fixed surface of the protruding portion 211 contacts with a pot, the protruding portion 211 is used for supporting the pot, the temperature of the pot changes after the pot is heated, the pot transfers the temperature to the protruding portion 211 made of a heat conducting material, after the protruding portion 211 is heated, the protruding portion 211 transfers the temperature to the top plate portion 2112 rapidly due to the fact that the thickness of the annular edge portion 2111 located at the periphery is larger than that of the top plate portion 2112, and the temperature is transferred to the extension cavity 2113 rapidly after passing through the top plate portion 2112. More preferably, the heat conducting cavity is provided with a heat conducting material 223, the heat conducting material 223 prevents the temperature probe 230 from affecting heat conducting precision due to the fact that an air gap is reserved between the top plate portion 2112, the heat conducting material 223 further rapidly transfers the temperature of the top plate portion 2112 into the first extension cavity 2113, and then the temperature probe 230 can more rapidly and accurately detect and collect the temperature of the pot.

As shown in fig. 9, the heat conductive bushing 220 may not be provided with the recess 221, and the molding cavity may be formed by the top surface of the heat conductive bushing and the top space of the extension cavity 2113.

The thickness dimension range of the annular rim portion 2111 is: 0.5mm-20mm; the thickness dimension range of the top plate portion 2112 is: 0.1mm-5mm. Preferably, the thickness dimension of the annular rim portion 2111 ranges from: 0.5mm-10mm; the thickness dimension range of the top plate portion 2112 is: 0.1mm-3mm; the thicknesses of the annular edge portion 2111 and the top plate portion 2112 are set in the above range, so that the thickness of the annular edge portion 2111 is larger than that of the top plate portion 2112, and on the basis that the protruding portion 211 has a stable supporting structure for the cooker, the temperature transmitted by the contact of the protruding portion 211 can be preferentially and rapidly transmitted to the inside of the extending portion through the top plate portion 2112, and therefore the temperature of the cooker can be rapidly and accurately transmitted to the inside of the extending cavity 2113 in real time, and the stability of the structure and the accurate real-time performance of temperature detection are further guaranteed.

The heat conducting bush 220 is tubular, the second cavity 222 is arranged in the heat conducting bush, the top end of the first cavity 213 is a blind end, and the top of the first cavity passes through the through end; the blind end of the second cavity 222 is provided with the concave part 221 in a downward concave manner; a heat conducting bottom wall 2221 is arranged between the bottom of the concave part 221 and the top end of the first cavity 213; the temperature probe is disposed in contact with the bottom surface of the heat conductive bottom wall 2221. The heat conducting bush 220 is inserted into the first cavity 213 from bottom to top from the bottom of the first cavity 213; and the concave part 221 at the top end of the heat conducting bush 220 is spliced with the extension cavity 2113 to form the heat conducting cavity, the top of the concave part 221 is contacted with the heat conducting bottom wall 2221, so that the convex part 211 can be quickly and accurately transferred to the top plate 2112 after being heated, the bottom heat conducting material 223 of the top plate 2112 is fully contacted, the heat conducting material 223 is used for collecting and transferring the heat of the top plate 2112 to the bottom of the concave part 221, so that the heat of the top plate 2112 can be intensively transferred to the temperature probe 230 through the heat conducting bottom wall 2221, and the temperature probe 230 can quickly and accurately detect the temperature of a pot, thereby greatly reducing the hysteresis of temperature transfer.

As shown in fig. 10, the recess 221 has a hemispherical structure, a cross-section in a vertical plane is semi-circular, and the heat-conducting bottom wall 2221 is located at the bottommost part of the cambered surface; the second cavity 222 extends in a radial direction vertically downward in the semi-circular shape. The concave part 221 is in a hemispherical structure, the top annular edge of the hemispherical structure is in contact with the bottom surface of the top plate 2112, so that the concave part 221 and the bottom surface of the top plate 2112 are spliced to form a hemispherical space structure, the hemispherical space structure is filled with a heat conducting material 223, and after the temperature of the pot is transferred to the top plate 2112, the heat conducting material 223 of the hemispherical structure can collect and transfer the temperature of the top plate 2112 to the position of the heat conducting bottom wall 2221 most rapidly; meanwhile, more preferably, the heat-conducting material 223 is in a hemispherical space-like structure, so that, on one hand, the heat-conducting material 223 can be stably arranged in the top space of the first wall, and on the other hand, after the temperature of the top plate 2112 is transferred to the heat-conducting material 223, compared with the embodiment shown in fig. 9, the heat cannot be easily dissipated from the concave part 221 to the first cavity 213, but is more intensively and rapidly transferred to the second cavity 222, and on the premise that the temperature probe 230 can rapidly collect the temperature of the pot in real time, the loss amount in the temperature transfer process can be further reduced, thereby further improving the real-time and accuracy of the temperature data detected by the temperature probe 230.

The thickness dimension of the heat conductive bottom wall 2221 ranges from: 1mm-3mm. By further defining the thickness of the heat-conducting bottom wall 2221, on one hand, the heat-conducting bottom wall 2221 can ensure the structural stability of the recess 221, so that the structure of the molding cavity is stable; on the other hand, the heat conducting material 223 will deform after being heated, and the heat conducting cavity will change spatially, so that the heat conducting bottom wall 2221 changes downwards, and the heat conducting bottom wall 2221 can also fully contact with the temperature probe 230 in the changing process, so that the structure of the temperature detection structure is more stable and the detection parameters are more accurate.

A limiting mounting piece is arranged below the supporting bump part 210, and is provided with a limiting hole 241; the limiting mounting piece is attached to the bottom surface of the panel 100 in a limiting manner; the lumen portion 212 passes through the limiting hole 241, and the limiting mount fixedly mounts the supporting bump portion 210 to the panel 100.

The specific implementation manner of the limiting piece is very various, for example, the limiting piece can be a locking nut, external threads can be arranged outside the pipe cavity portion 212, the locking nut is screwed to the top of the pipe cavity portion 212 through the external threads, the locking nut is tightly attached to the bottom of the panel 100, so that the supporting protruding point portion 210 can be fixedly installed on the panel 100 under the action of attaching pressure, the supporting protruding point portion 210 cannot move in the vertical direction and cannot rotate in the horizontal direction, and therefore the supporting protruding point portion 210 is ensured to be in more stable contact with the cooker.

For another example, the limiting mounting member is a limiting mounting plate 240, and the limiting mounting plate 240 is formed by splicing a plurality of plates. As shown in fig. 6 and 7, the limit mounting plate 240 needs to be provided with a corresponding number of limit holes 241 at corresponding positions according to the number and positions of the support bump portions 210 mounted on the panel 100; the limit mounting plate 240 may be an integrally formed fork-shaped structural plate, or may be an annular structure, etc., in this embodiment, if an integrally formed fork-shaped structural plate is adopted, the limit mounting plate 240 is complicated in the production process or the cutting edge material is wasted too much, so as to affect the production cost; in this embodiment, the limit mounting plate 240 is formed by splicing a plurality of strip plates, and the specific strip plates are provided with a clamping groove 242 and a clamping protruding portion 243 that can be mutually clamped and positioned on a horizontal plane, and each strip plate can be attached and fixedly mounted on the bottom surface of the panel 100 through an adhesive or a screw.

As shown in fig. 8 to 13, a blocking nut 250 is disposed at the bottom end of the heat conducting bush 220; the blocking nut 250 is provided with a lead hole 251; the blocking nut 250 is detachably blocked and installed at the lower end of the first cavity 213 through threads; the blocking nut 250 presses the heat conductive bushing 220 into the first cavity 213. The thermally conductive bushing 220 is made of an elastic and thermally conductive material.

Specifically, in order to screw the blocking nut 250 into the first cavity 213 to compress the heat-conducting bush 220, the heat-conducting bush 220 needs to be provided with a length allowance for compression installation according to installation requirements; after the temperature probe 230 is installed in the second cavity 222 of the heat conducting bush 220, the lead wire 231 of the temperature probe 230 is led out from the lead hole 251 and is electrically connected with the outside; the heat conducting bush 220 is completely inserted into the first cavity 213 from top to bottom, and then the blocking nut 250 is mounted to the bottom end of the lumen portion 212, so that the heat conducting bush 220 and the temperature probe 230 can be more firmly mounted in the first cavity 213.

The supporting bump 210 is made of a metal material, the heat conductive bushing 220 is made of a heat conductive silicone rubber, and the heat conductive material is a fillable existing material having heat conductive, curing and elastic properties, such as heat conductive silicone rubber or silicone rubber.

Example two

An induction cooker comprises a panel 100 and a controller, wherein the panel 100 is provided with at least three through holes 110, and the positions of the through holes 110 are provided with the temperature detection structures; the controller is electrically coupled to each of the temperature sensing structures.

Specifically, for more stable contact heat conduction and support with multiple cookers, the supporting protruding points 210 in the multiple temperature detecting structures may be arranged on three vertices of a triangle or arranged in a ring-like shape according to the shape of the cookers, and the top surface of the panel 100 may be arranged on three vertices of a triangle.

Specifically, in order to avoid scratch and damage when the pot is supported by contacting with the protruding portion 211, an inclined surface is provided at the periphery of the annular edge portion 2111; as shown in fig. 11 and 14, the specific shape of the protruding portion 211 is very various, and it is only necessary to support and contact the pot to conduct heat.

In particular, the temperature probe 230 may be a thermistor; because the protrusions are mounted above the panel 100 when the temperature detecting structure is adopted, the panel 100 can not directly contact with the temperature of the cooker under the normal cooking condition, the panel 100 has lower heat-resistant requirements, materials for manufacturing the panel 100 are more various, and the panel 100 can be specifically microcrystalline glass, black crystal glass or rock plates, artificial stones and the like.

Example III

A temperature detection method, which can be applied to but not limited to an induction cooker as described above, comprises the following steps:

A specified temperature parameter difference range specifying the temperature probe 230 in the temperature detection structure is acquired.

Specifically, a control program is configured in the controller, the threshold parameters can be automatically configured according to the cooking modes of the induction cooker, for example, the cooking modes of dish frying and soup boiling are different, and the corresponding threshold parameters are also set differently; in the cooking process, the controller can compare threshold parameters according to the difference between the specified temperature parameters, and further perform corresponding alarm information sending operation or stop the cooking operation of the induction cooker according to the control operation corresponding to the threshold parameters. The specified temperature probe 230 refers to a temperature probe 230 in contact with the pot, and the temperature probe 230 can be manually input by a user according to a placement position of the pot during cooking, or can be automatically screened according to temperature parameters of each temperature probe 230 in an initial stage of cooking.

In this embodiment, when the temperature detection structure of the induction cooker is three or more, the temperature detection on the bottom surface of the pan can be generally realized by three, and when the pan is placed above the upper panel 100, the pan can at least ensure to be in contact with the three temperature detection structures, and when the induction cooker works, according to the principle of three-point support, the following situations can be specifically distinguished:

during normal operation, the temperatures of the three temperature detection structures are basically consistent, the tolerance can be about 5 degrees celsius (the size of the temperature tolerance can be set according to actual cooking conditions), and the average temperature of the three temperature detection structures is taken as the temperature value of the actual cooker by the controller. The temperature detection means do not directly contact the bottom of the pan (the distance from the bottom of the pan can be adjusted according to the shape of the pan required by the device, preferably 1-5 mm), and the temperature detection method does not allow the temperature of the temperature detection means to be higher than the threshold parameter. Once the temperature exceeds the preset temperature, the dry burning can be judged, and the cooker is likely to deform.

When the dry-fire cooker is deformed, the following several possibilities occur: on the other hand, if a burning or deformation protrusion appears at a certain temperature detection structure position, the temperature at the position is much higher than that at other points, and the system can directly judge in a few seconds. Secondly, the pan is burnt to be red and deformed between the two temperature detection structures, so that the temperatures of the two temperature detection structures are much higher than those of the temperature detection structures without dry heating, and the controller can directly judge that the abnormality occurs according to the temperature contrast of the three temperature detection structures. Third, when the three temperature detecting structures are simultaneously provided with the burning or deformation protrusions, the temperatures of the three temperature detecting structures can be continuously increased. Finally, the controller can judge that the induction cooker has abnormal dry heating when the threshold parameter set by the cooking mode is exceeded.

Because the temperature detection structure can make the pan only contact with the supporting convex point parts 210, the pan is in a suspended state, the pan can not contact with the panel 100, the temperature of the pan can not be transferred to the panel 100, the energy loss can be reduced by about 80 percent relative to the traditional induction cooker, and the cooking energy efficiency is higher.

Because the cooker does not contact the panel 100, and does not depend on the panel 100 as a carrier, the heat received by the furnace body of the electromagnetic oven is greatly reduced, so that the panel 100 can be free of microcrystalline glass, and cheaper borosilicate glass or common toughened glass can be used. Other manners of packaging protection, such as glue packaging and curing, may also be directly performed on the panel 100, so that the production cost is lower.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

In the description of the present application, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present application; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the application described herein may be implemented in sequences other than those illustrated or otherwise described herein.

The technical principle of the present application is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the application and should not be taken in any way as limiting the scope of the application. Other embodiments of the application will be apparent to those skilled in the art from consideration of this specification without undue burden.

Claims

1. A temperature detection structure, characterized by comprising:

the panel is provided with a through hole along the vertical direction;

a supporting bump portion including a boss portion at a tip end and a lumen portion extending downward from a bottom surface of the boss portion; the inside of the tube cavity part is provided with a first cavity, the top of the first cavity extends into the protruding part, and the bottom of the cavity is communicated with the outside; the supporting salient points are arranged on the through holes from top to bottom, the tube cavity parts penetrate through the through holes and extend to the lower part of the panel, and the protruding parts are at least partially and limitedly arranged above the panel; the protruding portion is made of a heat conducting material;

the heat conduction lining is internally provided with a second cavity, and the top end surface of the heat conduction lining is provided with a concave part in a downward concave way; the heat conduction lining is arranged in the first cavity, and the concave part and the top of the first cavity are spliced to form a heat conduction cavity; a heat conducting material is filled in the heat conducting cavity;

the temperature probe is installed in the second cavity and is attached to the outer wall of the concave part.

2. A temperature sensing structure according to claim 1, wherein the boss includes an annular rim portion and a central top plate portion; an extension cavity is arranged in the middle of the annular edge part and is communicated with the top end of the first cavity; the top plate part is plugged at the top end of the extension cavity, so that the thickness of the annular part is larger than that of the top plate part in a vertical plane; the concave part is positioned in the extension and spliced with the bottom surface of the top plate part to form the heat conducting cavity.

3. A temperature sensing structure according to claim 2, wherein the annular rim portion has a thickness in the range of: 0.5mm-20mm; the thickness dimension range of the top plate part is as follows: 0.1mm-5mm.

4. The temperature detecting structure according to claim 1, wherein the heat conducting bush is tubular, the second cavity is arranged in the heat conducting bush, the top end of the first cavity is a blind end, and the top end of the first cavity passes through the through end; the blind end of the second cavity is provided with the concave part in a downward concave manner; a heat conduction bottom wall is arranged between the bottom of the concave part and the top end of the first cavity; the temperature probe is in contact with the bottom surface of the heat conducting bottom wall.

5. The structure according to claim 4, wherein the recess is a hemispherical structure recessed downward, the cross-sectional shape in the vertical plane is a semicircle, and the heat-conducting bottom wall is located at the bottommost part of the hemispherical structure; the second cavity extends in a radial direction vertically downward in the semi-circular shape.

6. The structure of claim 5, wherein the thickness dimension of the thermally conductive bottom wall ranges from: 1mm-3mm.

7. The temperature detection structure according to claim 2, wherein a limit mounting member is further arranged below the supporting protruding point portion, and the limit mounting member is provided with a limit hole; the limiting mounting piece is attached to the bottom surface of the panel in a limiting manner; the pipe cavity part passes through the limiting hole, and the limiting mounting piece fixedly mounts the supporting protruding point part and the panel.

8. The structure of claim 7, wherein the limit mounting member is a limit mounting plate, and the limit mounting plate is formed by splicing a plurality of plates.

9. An induction cooker, characterized by comprising a panel and a controller, wherein at least three through holes are formed in the panel, and the positions of the through holes are provided with the temperature detection structure as set forth in any one of claims 1-8; the controller is electrically coupled to each of the temperature sensing structures.

10. A temperature detection method applied to the induction cooker of claim 9, comprising the steps of:

setting a threshold parameter and early warning setting according to the cooking operation of the induction cooker;

acquiring a specified temperature parameter of a temperature probe in a specified temperature detection structure;