CN113871336A - Automatic positioning and assembling device for ceramic packaging shell - Google Patents
Automatic positioning and assembling device for ceramic packaging shell Download PDFInfo
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- CN113871336A CN113871336A CN202110920561.3A CN202110920561A CN113871336A CN 113871336 A CN113871336 A CN 113871336A CN 202110920561 A CN202110920561 A CN 202110920561A CN 113871336 A CN113871336 A CN 113871336A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 50
- 238000004806 packaging method and process Methods 0.000 title abstract description 21
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 238000005538 encapsulation Methods 0.000 claims description 6
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims 1
- 238000005245 sintering Methods 0.000 description 21
- 230000006872 improvement Effects 0.000 description 10
- 239000002184 metal Substances 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Furnace Charging Or Discharging (AREA)
Abstract
The invention relates to the technical field of electronic element processing, in particular to an automatic positioning and assembling device for a ceramic packaging shell, which comprises a bottom plate, a central block positioned in the center of the bottom plate and side blocks distributed around the central block, wherein the central block is used for sleeving a bottom shell of the ceramic packaging shell, the side blocks are distributed around the central block in a sliding manner, clamping grooves used for positioning pins of the ceramic packaging shell are formed in the positions, facing the top of the central block, of the side blocks, clamping grooves are formed in the positions, facing the top of the central block, of the side blocks, supporting mechanisms are arranged on the side walls of the central block and used for positioning the bottom shell, an adjusting mechanism used for driving the side blocks to synchronously slide and adjust is arranged on the lower end face of the bottom plate, the supporting mechanisms are arranged on a central seat and used for switching and supporting the inner wall and the outer wall of the ceramic packaging shell, so that when the ceramic packaging shell is fixedly arranged, the ceramic packaging shell can be supported and fixed through an inner supporting plate of the supporting mechanisms, the outer supporting plate can be switched to carry out limit supporting on the outer part of the ceramic packaging shell.
Description
Technical Field
The invention relates to the technical field of electronic component processing, in particular to an automatic positioning and assembling device for a ceramic packaging shell.
Background
The packaging shell of the semiconductor chip is a main component forming the whole integrated circuit, and not only plays a role in mechanical protection and outward transition connection of chip electrodes for the chip, but also plays a fundamental role in correct realization of various functional parameters of the chip, environmental conditions required by the circuit in use and embodying of circuit characteristics.
The package case of the semiconductor chip includes a metal package case, a plastic package case, a ceramic package case, and the like. The ceramic package shell is extremely stable in the aspects of thermal, electrical and mechanical properties and the like, can provide high air tightness protection for a chip, and enables the chip to have high working reliability, so that the ceramic package shell is widely applied to the field of semiconductor chip packaging.
The package shell sintering mainly comprises the sealing of a metal ring frame, a lead and a glass insulator, wherein the glass insulator is sleeved outside the lead, then the glass insulator is sleeved in a first mounting hole formed in the surface of the metal ring frame to form a semi-finished product, then the semi-finished product is horizontally placed in a sintering mold, and then the sintering mold is sent into a sintering furnace to be sintered at high temperature; the sintering mold is generally made of graphite, is not wetted with the glass insulator, is not bonded with the metal ring frame, and is an ideal glass-metal sealing mold.
A method for sintering a microwave metal packaging shell by using a graphite mold is disclosed in a patent with the patent application number of CN201610969273.6, and relates to the field of metal packaging shells. The graphite mould is of an integral structure and is provided with the positioning groove and the groove for positioning the lead, the integral graphite mould is adopted to pre-position the chassis and the lead, the dimensional precision of the lead after the microwave metal packaging shell is sintered is ensured, and the production efficiency of the microwave metal packaging shell sintering is improved.
However, the existing graphite sintering mold is single in structure and limited in function, and cannot meet the requirement for processing the existing ceramic packaging shell.
Disclosure of Invention
In order to solve the above problems, the invention provides an automatic positioning and assembling device for a ceramic package shell, which is characterized in that a support mechanism is arranged on a center seat, and the inner wall and the outer wall of the ceramic package shell are switched and supported by the support mechanism, so that the ceramic package shell can be supported and fixed by an inner support plate of the support mechanism when being fixed, and can be switched into an outer support plate to limit and support the outer part of the ceramic package shell when being sintered, thereby avoiding the deformation of the bottom shell caused by excessive thermal expansion.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a pottery encapsulation shell automatic positioning assembly device, includes the bottom plate, is located the central block at bottom plate center and the limit piece that distributes around this central block, the central block is used for registrates the drain pan of pottery encapsulation shell, limit piece sliding distribution in around the central block, this limit piece is just right the draw-in groove that is used for fixing a position pottery encapsulation shell pin is seted up at the top of central block, all install supporting mechanism on the lateral wall of central block, this supporting mechanism is used for the location the drain pan, the lower terminal surface of bottom plate is provided with the drive the adjustment mechanism of limit piece synchronous sliding adjustment.
As an improvement, the support mechanism includes:
the supporting component is arranged in a groove formed in the side wall of the central block and is used for limiting and supporting the inner wall or the outer wall of the bottom shell; and
the switching assembly is arranged on the bottom plate and used for switching the supporting state of the bottom shell by the supporting assembly.
As an improvement, the support assembly comprises:
the inner supporting plate is vertically arranged inside the groove, and positioning grooves which are in one-to-one correspondence with the clamping grooves are arranged at the top of the inner supporting plate; and
the outer supporting plate is vertically arranged outside the groove, the outer supporting plate and the inner supporting plate are hinged to two ends of a lever, and the lever is rotatably arranged on the center block.
As an improvement, when the inner supporting plate swings to the upper side, the inner supporting plate supports the inner side wall of the bottom shell in a limiting mode, and when the outer supporting plate swings to the upper side, the outer supporting plate supports the outer wall of the bottom shell in a limiting mode.
As an improvement, when the outer support plate supports the outer wall of the bottom case in a limiting manner, the distance from the outer support plate to the corresponding outer wall of the bottom case is 0.4 mm.
As an improvement, the switching assembly comprises:
the ejector rods are arranged below the corresponding outer supporting plates and penetrate through the bottom plate in a sliding manner; and
the ejector pins are arranged on the bottom plate and are respectively arranged on four corners of the central block, and the ejector pins are arranged in an L shape.
As an improvement, the bottoms of the grooves are communicated with each other, the edge blocks are provided with guide grooves, and the lower part of the inner supporting plate is provided with a plurality of guide holes.
As an improvement, the adjustment mechanism comprises:
the rotary disc is rotatably arranged on the lower end face of the bottom plate;
the guide blocks penetrate through the bottom plate and are integrally connected with the corresponding edge blocks, and the guide blocks are arranged in guide grooves in the bottom plate;
the two ends of the connecting rod are respectively hinged with the rotary table and the guide block; and
the locking nuts penetrate through the bottom plate and are arranged on the corresponding edge blocks, and the locking nuts are used for locking the edge blocks on the bottom plate.
As an improvement, the top of the edge block is provided with a positioning nail which is correspondingly sleeved with the hexagonal groove on the locking nut.
As an improvement, a supporting foot for supporting is installed on the lower end face of the bottom plate.
The invention has the beneficial effects that:
(1) according to the invention, the supporting mechanism is arranged on the center seat, and the inner wall and the outer wall of the ceramic packaging shell are switched and supported by the supporting mechanism, so that the ceramic packaging shell can be supported and fixed through the inner supporting plate of the supporting mechanism when being fixedly installed, and can be switched into the outer supporting plate to limit and support the outer part of the ceramic packaging shell when being sintered, thereby avoiding deformation caused by excessive thermal expansion of the bottom shell;
(2) according to the invention, through switching the inner supporting plate and the outer supporting plate, the sintering part of the pin and the bottom shell is released without being blocked, so that hot air in the sintering furnace can smoothly circulate at the part, the sintering of the pin and the bottom shell is more sufficient, and the sintering quality is improved;
(3) according to the invention, the distance between the side block and the central block can be adjusted by using the adjusting mechanism, the whole device can be adjusted according to the length of the pin, and the device is suitable for positioning and assembling of packaging shells with various specifications, has good applicability and is wider in application range;
(4) according to the invention, the positioning nails are sleeved with the hexagonal grooves on the locking screws, so that stacking and sleeving among a plurality of groups of positioning and assembling devices are realized, and meanwhile, the positioning and assembling devices of the next group are used for switching the inner supporting plate and the outer supporting plate of the positioning device of the previous group, and no additional driving device is required.
In conclusion, the invention has the advantages of better positioning effect of the electronic element, quick assembly step, good sintering effect and the like, and is particularly suitable for the technical field of sintering and processing of electronic components.
Drawings
FIG. 1 is a first perspective view of the present invention;
FIG. 2 is a schematic perspective view of a ceramic package according to the present invention;
FIG. 3 is a schematic perspective view of the second embodiment of the present invention;
FIG. 4 is a schematic bottom perspective view of the present invention;
FIG. 5 is a schematic perspective view of the supporting mechanism of the present invention;
FIG. 6 is a perspective view of the support assembly of the present invention;
FIG. 7 is a schematic perspective view of a core block according to the present invention;
FIG. 8 is a perspective view of an inner support plate according to the present invention;
FIG. 9 is a schematic perspective view of the edge block of the present invention;
FIG. 10 is a first view illustrating a first usage state of the supporting mechanism of the present invention;
FIG. 11 is a second schematic view of the supporting mechanism of the present invention in a working state;
FIG. 12 is a schematic view of the support mechanism of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Example (b):
as shown in fig. 1 to 12, an automatic positioning and assembling device for a ceramic package housing includes a bottom plate 1, a central block 2 located at the center of the bottom plate 1, and edge blocks 3 distributed around the central block 2, wherein the central block 2 is used for sleeving a bottom case 100 of the ceramic package housing, the edge blocks 3 are slidably distributed around the central block 2, the edge blocks 3 are opposite to the top of the central block 2 and provided with clamping grooves 31 for positioning pins 101 of the ceramic package housing, the side walls of the central block 2 are both provided with supporting mechanisms 4, the supporting mechanisms 4 are used for positioning the bottom case 100, and the lower end surface of the bottom plate 1 is provided with an adjusting mechanism 5 for driving the edge blocks 3 to be adjusted in a synchronous sliding manner.
Wherein the support mechanism 4 includes:
the supporting component 41, the supporting component 41 is installed in the groove 21 formed on the side wall of the central block 2, and the supporting component 41 is used for limiting and supporting the inner wall or the outer wall of the bottom shell 100; and
a switching assembly 42, wherein the switching assembly 42 is mounted on the bottom plate 1, and the switching assembly 42 is used for switching the supporting state of the bottom shell 100 by the supporting assembly 41.
Further, the support assembly 41 includes:
the inner support plate 411 is vertically arranged inside the groove 21, and positioning grooves 412 which are in one-to-one correspondence with the clamping grooves 31 are arranged at the top of the inner support plate 411; and
an outer support plate 413, wherein the outer support plate 413 is vertically installed outside the groove 21, the outer support plate 413 and the inner support plate 411 are hinged to two ends of a lever 414, and the lever 414 is rotatably installed on the center block 2.
Furthermore, when the inner supporting plate 411 swings upward, the inner supporting plate 411 supports the inner side wall of the bottom case 100 in a limited manner, and when the outer supporting plate 413 swings upward, the outer supporting plate 413 supports the outer wall of the bottom case 100 in a limited manner.
In addition, when the outer support plate 413 is used for limiting and supporting the outer wall of the bottom case 100, the distance from the outer support plate 413 to the corresponding outer wall of the bottom case 100 is 0.4 mm.
It should be noted that, when the ceramic package casing is installed on the automatic positioning and assembling device for the ceramic package casing, at this time, the inner supporting plate 411 and the center block 2 are assembled to form a supporting limit for the inner side wall of the bottom case 100, so that the bottom case 100 is exactly sleeved on the center block 2, and the two ends of the pin 101 are exactly clamped on the clamping groove 31 and the positioning groove 412 respectively, thereby realizing the positioning and installation of the ceramic package casing.
It should be further noted that, during sintering, the inner support plate 411 descends, the outer support plate 413 swings and rises to limit and support the outer side wall of the bottom case 100, and it should be emphasized that the outer support plate 413 does not collide with the outer side wall of the bottom case 100, but has a distance of 0.4mm, so that the bottom case 100 collides with the outer support plate 413 after being heated and expanded during sintering, and the expanded bottom case is limited by the outer support plate 413, thereby avoiding the dislocation and movement of the bottom case.
As a preferred embodiment, the switching assembly 42 includes:
the top bar 421 is installed below the corresponding outer support plate 413, and the top bar 421 is slidably inserted into the bottom plate 1; and
the ejector pins 422 are installed on the bottom plate 1, the ejector pins 422 are respectively arranged on four corners of the central block 2, and the ejector pins 422 are arranged in an L shape.
Further, the bottoms of the grooves 21 are communicated with each other, the edge block 3 is provided with a guide groove 30, and the lower portion of the inner support plate 411 is provided with a plurality of guide holes 415.
It should be noted that, after the ceramic package shells are assembled, the automatic positioning and assembling devices of the ceramic package shells are stacked, the ejector pins 422 of the lower automatic positioning and assembling device of the ceramic package shells lift up and lift the ejector pins 421 of the upper automatic positioning and assembling device of the ceramic package shells, so that the upper group of the inner support plates 411 and the upper group of the outer support plates 413 are switched, and since the ceramic package shells are already placed in the sintering furnace at this time, the supporting and limiting of the inner support plates 411 are released, so that the bottom case 100 does not have movement deviation.
It is further noted that, in the sintering process, heat in the sintering furnace enters the groove 21 through the diversion trench 30 via the diversion hole 415, and since the inner support plate 411 is evacuated at this time, the fitting installation part of the pin 101 and the bottom case 100 is not blocked, the heat directly heats the fitting installation part of the pin 101 and the bottom case 100, thereby effectively improving the sintering quality of the sintering part, and in addition, the grooves 21 are communicated with each other, so that the heat balance inside the groove 21 can be ensured.
As a preferred embodiment, the adjusting mechanism 5 includes:
the turntable 51 is rotatably arranged on the lower end surface of the bottom plate 1;
a guide block 52, wherein the guide block 52 penetrates through the bottom plate 1 and is integrally connected with the corresponding side block 3, and the guide block 52 is arranged in a guide groove 11 on the bottom plate 1;
the two ends of the connecting rod 53 are respectively hinged with the rotating disc 51 and the guide block 52; and
and the locking nut 54 penetrates through the bottom plate 1 and is installed on the corresponding edge block 3, and the locking nut 54 is used for locking the edge block 3 on the bottom plate 1.
It should be noted that, the ceramic package shells of different specifications have the condition that the bottom shells are consistent, and the pin lengths are different, and the adjusting mechanism 5 is used for adjusting the side block 3, so that the ceramic package shell processing tool can be suitable for processing ceramic package shells of different pin lengths.
Furthermore, the adjustment mechanism 5 can be used to synchronously adjust all the edge blocks 3.
In a preferred embodiment, the top of the side block 3 is provided with a positioning pin 32 which is correspondingly sleeved with a hexagonal groove 541 on the locking nut 54.
Further, a supporting leg 12 for supporting is installed on the lower end surface of the bottom plate 1.
It should be noted that, when the stacked ceramic package housing automatic positioning and assembling devices are used, the positioning nails 32 of the two sets of ceramic package housing automatic positioning and assembling devices are sleeved with the hexagonal grooves 541 on the lock nuts 54, so as to position the ceramic package housing automatic positioning and assembling devices.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The utility model provides a pottery encapsulation shell automatic positioning assembly device, its characterized in that, includes bottom plate (1), is located center block (2) at bottom plate (1) center and around limit piece (3) that this center block (2) distributes, center block (2) are used for registrates ceramic encapsulation shell's drain pan (100), limit piece (3) sliding distribution in around center block (2), this limit piece (3) are just right draw-in groove (31) that are used for fixing a position ceramic encapsulation shell pin (101) are seted up at the top of center block (2), all install supporting mechanism (4) on the lateral wall of center block (2), this supporting mechanism (4) are used for the location drain pan (100), the lower terminal surface of bottom plate (1) is provided with the drive regulating mechanism (5) that limit piece (3) synchronous sliding adjusted.
2. The ceramic package housing automatic positioning and assembling device according to claim 1, wherein the supporting mechanism (4) comprises:
the supporting component (41), the supporting component (41) is installed in a groove (21) formed in the side wall of the central block (2), and the supporting component (41) is used for limiting and supporting the inner wall or the outer wall of the bottom shell (100); and
the switching assembly (42), switch over the assembly (42) and install on the bottom plate (1), this switching assembly (42) is used for switching over the supporting state of the bottom shell (100) of the supporting component (41).
3. The ceramic package housing automatic positioning and assembling device of claim 2, wherein the supporting component (41) comprises:
the inner supporting plate (411) is vertically arranged inside the groove (21), and positioning grooves (412) which are in one-to-one correspondence with the clamping grooves (31) are arranged at the top of the inner supporting plate (411); and
the outer supporting plate (413), the outer supporting plate (413) is vertically installed outside the groove (21), the outer supporting plate (413) and the inner supporting plate (411) are hinged to be installed at two ends of a lever (414), and the lever (414) is rotatably installed on the center block (2).
4. The automatic positioning and assembling device for the ceramic package housing as claimed in claim 3, wherein when the inner supporting plate (411) swings to the upper side, the inner supporting plate (411) is limited to support the inner sidewall of the bottom housing (100), and when the outer supporting plate (413) swings to the upper side, the outer supporting plate (413) is limited to support the outer wall of the bottom housing (100).
5. The automatic positioning and assembling device for the ceramic package housing as claimed in claim 4, wherein when the outer support plate (413) is position-limited to support the outer wall of the bottom housing (100), the distance from the outer support plate (413) to the corresponding outer wall of the bottom housing (100) is 0.4 mm.
6. The ceramic package housing automatic positioning and assembling device as recited in claim 3, wherein the switching assembly (42) comprises:
the top rods (421), the top rods (421) are installed below the corresponding outer supporting plates (413), and the top rods (421) are slidably arranged on the bottom plate (1); and
the ejector pins (422) are installed on the base plate (1), the ejector pins (422) are respectively arranged on four corners of the central block (2), and the ejector pins (422) are arranged in an L shape.
7. The automatic positioning and assembling device for the ceramic package housing as claimed in claim 3, wherein the bottoms of the grooves (21) are connected to each other, the edge block (3) is formed with a guiding groove (30), and the lower portion of the inner supporting plate (411) is formed with a plurality of guiding holes (415).
8. The ceramic package housing automatic positioning and assembling device according to claim 1, wherein the adjusting mechanism (5) comprises:
the rotary table (51), the said rotary table (51) is installed on lower end of the said bottom plate (1) rotatably;
the guide blocks (52) penetrate through the bottom plate (1) and are integrally connected with the corresponding side blocks (3), and the guide blocks (52) are arranged in guide grooves (11) on the bottom plate (1);
the two ends of the connecting rod (53) are respectively hinged with the rotary disc (51) and the guide block (52); and
the locking nut (54) penetrates through the bottom plate (1) and is installed on the corresponding edge block (3), and the locking nut (54) is used for locking the edge block (3) on the bottom plate (1).
9. The automatic positioning and assembling device for the ceramic package shell is characterized in that the top of the side block (3) is provided with a positioning nail (32) which is correspondingly sleeved with a hexagonal groove (541) on the locking nut (54).
10. The automatic positioning and assembling device for the ceramic package shell as recited in claim 1, characterized in that the lower end surface of the bottom plate (1) is provided with a supporting leg (12) for supporting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110920561.3A CN113871336A (en) | 2021-08-11 | 2021-08-11 | Automatic positioning and assembling device for ceramic packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110920561.3A CN113871336A (en) | 2021-08-11 | 2021-08-11 | Automatic positioning and assembling device for ceramic packaging shell |
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| Publication Number | Publication Date |
|---|---|
| CN113871336A true CN113871336A (en) | 2021-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110920561.3A Pending CN113871336A (en) | 2021-08-11 | 2021-08-11 | Automatic positioning and assembling device for ceramic packaging shell |
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| CN (1) | CN113871336A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114932514A (en) * | 2022-07-01 | 2022-08-23 | 青岛凯瑞电子有限公司 | Accurate positioning and machining device for anti-cracking die filling of ceramic shell |
| CN118156225A (en) * | 2024-05-09 | 2024-06-07 | 合肥中航天成电子科技有限公司 | Ceramic-metal integrated packaging structure |
-
2021
- 2021-08-11 CN CN202110920561.3A patent/CN113871336A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114932514A (en) * | 2022-07-01 | 2022-08-23 | 青岛凯瑞电子有限公司 | Accurate positioning and machining device for anti-cracking die filling of ceramic shell |
| CN114932514B (en) * | 2022-07-01 | 2023-08-25 | 青岛凯瑞电子有限公司 | Accurate positioning processing device for cracking-preventing die-filling of ceramic shell |
| CN118156225A (en) * | 2024-05-09 | 2024-06-07 | 合肥中航天成电子科技有限公司 | Ceramic-metal integrated packaging structure |
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