CN113848459B - Probe for test socket - Google Patents
Probe for test socket Download PDFInfo
- Publication number
- CN113848459B CN113848459B CN202111169130.4A CN202111169130A CN113848459B CN 113848459 B CN113848459 B CN 113848459B CN 202111169130 A CN202111169130 A CN 202111169130A CN 113848459 B CN113848459 B CN 113848459B
- Authority
- CN
- China
- Prior art keywords
- probe
- insulating piece
- test socket
- test
- rigid insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 66
- 239000000523 sample Substances 0.000 title claims abstract description 54
- 239000000853 adhesive Substances 0.000 claims abstract description 25
- 230000001070 adhesive effect Effects 0.000 claims abstract description 25
- 229920006351 engineering plastic Polymers 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 238000004378 air conditioning Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Abstract
The invention discloses a probe for a test socket, which comprises: the conductive adhesive structure comprises an elastic insulating piece and a plurality of connecting wire structures which are arranged in the elastic insulating piece and are arranged along the thickness direction; a rigid insulating member fixed to one end of the conductive adhesive structure in the thickness direction; the probe head structure comprises a plurality of probe heads which are fixed on the rigid insulating piece and correspondingly attached to the plurality of connecting wire structures; in a test state, when the conductive adhesive structure is stressed and compressed, the connecting wire structure is compressed into a saw-tooth-shaped passage. The probe for the test socket provided by the invention meets the high-frequency and high-speed test requirements and can improve the service life.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a probe for a test socket.
Background
Chip test sockets, usually QFN, BGA, LGA, etc. are used for testing packaged chips, and probes for testing connection in the test sockets are usually spring pins and conductive adhesives. Because of the influence of the coil-like structure in the spring needle, for high-frequency and high-speed testing, larger parasitic loop inductance can be introduced, and the test attenuation is large. The whole electrical length of the conductive adhesive is short, the parasitic parameter is small, and the signal integrity problem can be effectively avoided. However, when the conductive adhesive is tested, surface contact is adopted, and a large force needs to be applied, so that metal particles in the conductive adhesive are tightly connected to form a test path. Under the test condition of long-time repeatability, the silicone rubber medium of the conductive adhesive generates irreversible deformation and is even scrapped, so that the service life of the conductive adhesive is greatly reduced. Similarly, when testing small pin space chips, the space between each test path is necessarily close, and when the conductive adhesive metal particles are compressed under stress, the thickness of the test paths is thinned, and even the problems of breakage and short circuit occur.
Disclosure of Invention
The invention aims to provide a probe for a test socket, which meets the high-speed signal test requirement and prolongs the service life.
Based on the problems, the technical scheme provided by the invention is as follows:
a probe for a test socket, comprising:
the conductive adhesive structure comprises an elastic insulating piece and a plurality of connecting wire structures which are arranged in the elastic insulating piece and are arranged along the thickness direction;
a rigid insulating member fixed to one end of the conductive adhesive structure in the thickness direction; a kind of electronic device with high-pressure air-conditioning system
The probe head structure comprises a plurality of probe heads which are arranged on the rigid insulating piece and correspondingly attached to the plurality of connecting wire structures;
in a test state, when the conductive adhesive structure is stressed and compressed, the connecting wire structure is compressed into a saw-tooth-shaped passage.
In some embodiments, the connecting wire structure comprises a columnar channel arranged along the thickness direction of the elastic insulating piece, a plurality of conductive particles filled in the columnar channel, and at least one rigid insulating limiting sleeve fixed on the circumferential direction of the columnar channel.
In some embodiments, rigid insulating spacers at adjacent columnar channels are staggered.
In some embodiments, the rigid insulating stop collar is made of engineering plastic.
In some embodiments, the probe head includes a base having an outer diameter greater than a needle end secured to an upper end of the base.
In some embodiments, the rigid insulating member is provided with a limiting penetrating groove matched with the probe head, the limiting penetrating groove comprises a first groove part and a second groove part which are communicated up and down, the inner diameter of the first groove part is smaller than that of the second groove part, and a limiting table matched with the base is formed between the first groove part and the second groove part.
In some embodiments, the probe head is in clearance fit with the limit penetration groove.
In some of these embodiments, the serrated pathway has a length of no more than 1mm in the test state.
In some embodiments, the elastic insulating member is a silicone rubber member and the rigid insulating member is an engineering plastic member.
In some embodiments, the rigid insulating member is adhered to the elastic insulating member, and a roughness of an end surface of the rigid insulating member, which is attached to the elastic insulating member, is N10 or more.
Compared with the prior art, the invention has the advantages that:
1. by adopting the technical scheme of the invention, through the combination of the probe head structure and the conductive adhesive structure, larger force is not needed during testing, and the service life of the probe structure is prolonged;
2. under the condition of smaller chip pin spacing, the extrusion deformation amount of conductive particles in adjacent test channels is small, deformation parts are distributed in a staggered manner, the test channels are guaranteed to form a sawtooth-like shape, the inductance characteristics of the adjacent test channels are kept unchanged, the capacitance characteristics of the adjacent test channels are increased, and a higher test bandwidth is obtained.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, in which the drawings are only some embodiments of the present invention, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a test socket probe according to an embodiment 1 of the present invention;
FIG. 2 is a schematic diagram of the structure of embodiment 1 in a testing state;
FIG. 3 is a schematic view of the structure of a probe head in embodiment 1 of the present invention;
FIG. 4 is a schematic structural diagram of embodiment 2 of the present invention;
FIG. 5 is a schematic diagram of the structure of embodiment 2 in a testing state;
FIG. 6 is a graph showing the high frequency performance of the probe structure of example 1 of the present invention;
wherein:
1. an elastic insulating member; 1-1, columnar channels;
2. a rigid insulator; 2-1, a first groove portion; 2-2, a second groove part;
3. a probe head; 3-1, a base; 3-2, needle end;
4. conductive particles;
5. rigid insulating spacing sleeve.
Detailed Description
The above-described aspects are further described below in conjunction with specific embodiments. It should be understood that these examples are illustrative of the present invention and are not intended to limit the scope of the present invention. The implementation conditions used in the examples may be further adjusted according to the conditions of the specific manufacturer, and the implementation conditions not specified are generally those in routine experiments.
Referring to fig. 1, for an embodiment of the present invention, there is provided a probe for a test socket, including a conductive adhesive structure, a rigid insulating member 2 fixed at one end in a thickness direction of the conductive adhesive, and a probe head structure disposed on the rigid insulating member 2, wherein the conductive adhesive structure includes an elastic insulating member 1, and a plurality of connection wire structures disposed in the elastic insulating member 1 and arranged in the thickness direction, the probe head structure includes a plurality of probe heads 3 having a number consistent with that of the connection wire structures, and each probe head 3 is attached to a corresponding connection wire structure. The elastic insulating member 1 can be a silicon rubber member, and the rigid insulating member 2 is a plate made of engineering plastic.
During testing, the conductive adhesive structure is arranged on the circuit board, the pins of the chip to be tested are contacted with the probe head 3, and when the conductive adhesive structure is stressed and compressed, the connecting wire structure is compressed into a zigzag passage.
Specifically, the connecting wire structure comprises a columnar channel 1-1 arranged along the thickness direction of the elastic insulating piece 1, a plurality of conductive particles 4 filled in the columnar channel 1-1, and a rigid insulating limiting sleeve 5 fixed on the circumference of the columnar channel 1-1, wherein the rigid insulating limiting sleeve 5 is made of engineering plastics, and the length of the rigid insulating limiting sleeve 5 is one half of the thickness of the elastic insulating piece 1. Preferably, the rigid insulation limiting sleeves at the adjacent columnar channels 1-1 are arranged in a staggered manner, as shown in fig. 2, so that when the elastic insulating piece 1 is compressed, the columnar channels 1-1 are compressed into a saw-tooth shape, the inductance characteristic of the adjacent test channels is kept unchanged, the capacitance characteristic of the adjacent test channels is increased, the impedance can be effectively controlled, the far-end crosstalk is reduced, and a higher test bandwidth is obtained.
Referring to fig. 3, the probe head 3 includes a base 3c1, and a needle end 3c2 fixed to the base 3c1, wherein the outer diameter of the base 3-1 is larger than the needle end 3c2.
Correspondingly, in order to fix the probe head 3, a limiting penetrating groove matched with the probe head 3 is formed in the rigid insulating member 2, the limiting penetrating groove comprises a first groove part 2-1 and a second groove part 2-2 which are communicated up and down, wherein the inner diameter of the first groove part 2-1 is smaller than that of the second groove part 2-2, and a limiting table matched with the base 3 is formed between the first groove part 2-1 and the second groove part 2-2, so that the probe head 3 can be clamped and fixed in the rigid insulating member 2. Specifically, the probe head 3 is in clearance fit with the limiting through groove, and a 50um gap is formed between the probe head 3 and the inner wall of the limiting through groove.
In this example, in the test state, the length of the saw-tooth path is not more than 1mm, so that the signal integrity problem caused by excessive parasitic parameters due to the overlong channel can be avoided.
In this example, the roughness of the end surface of the rigid insulating material 2 bonded to the elastic insulating material 1 is N10 or more, and the rigid insulating material 2 is bonded to the elastic insulating material 1 by resin glue.
According to the probe structure, through the cooperation of the probe head 3 and the elastic insulating piece 1, the probe head 3 can ensure that the test channels are in good contact with the tested chip, connection between the test channels can be completed without larger pressure, the problem that the service life of the conductive adhesive structure is short due to large test pressure is avoided, meanwhile, the sawtooth-shaped structure of the test channels can keep the inductance characteristics of the adjacent test channels unchanged, the capacitance characteristics of the adjacent test channels are increased, and higher test bandwidth is obtained.
Referring to fig. 6, a high frequency performance comparison chart of the probe structure of example 1 of the present invention shows that the bandwidth of the novel probe is substantially in the middle for chips with smaller pitches. The mutual inductance is smaller due to the compression of internal particles, and the saw-tooth structure formed by the whole channel is ensured, so that the inductance of a loop perceived by a signal passing through a test channel is kept unchanged. The inductance is smaller than the columnar wiring formed during the test of the common spring needle, the self-inductance is larger due to the spring, and the spring needle is influenced by the chip spacing and the spring needle loading jig, so that the spring needle is required to be ensured to have enough spacing in design, and the mutual inductance of the mutual test paths is smaller. Due to the fact that the self inductance is large and the mutual inductance is small, loop inductance of the whole test path is increased, and accordingly bandwidth of an over-signal is greatly reduced.
The novel probe bandwidth is inferior to that of a conductive adhesive structure, and the main reason is that a conductive adhesive test path can be subjected to larger deformation, so that the loop inductance of a test channel is low. However, the chip design with smaller pin spacing does not allow the deformation of the test channels to be large, which easily causes the problems of medium breakage, service life and the like, and causes short circuit among the channels and the like. The novel probe is small in deformation, reliable contact can be realized, the rationality and the service life of the test are improved, and the saw-tooth structure formed between the channels can well inhibit crosstalk between test paths.
It should be understood that, as required, a larger number of rigid insulating spacers 5 may be provided on the inner wall of the columnar passage 1-1, as shown in fig. 4, and in embodiment 2, two rigid insulating spacers 5 may be provided at intervals up and down in the circumferential direction of the columnar passage 1-1, and in the test state, as shown in fig. 5, the columnar passage 1-1 is compressed into a zigzag shape.
The above examples are provided for illustrating the technical concept and features of the present invention and are intended to enable those skilled in the art to understand the contents of the present invention and to implement the same, and are not intended to limit the scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (8)
1. A probe for a test socket, comprising:
the conductive adhesive structure comprises an elastic insulating piece and a plurality of connecting wire structures which are arranged in the elastic insulating piece and are arranged along the thickness direction;
a rigid insulating member fixed to one end of the conductive adhesive structure in the thickness direction; a kind of electronic device with high-pressure air-conditioning system
The probe head structure comprises a plurality of probe heads which are arranged on the rigid insulating piece and correspondingly attached to the plurality of connecting wire structures;
in a test state, when the conductive adhesive structure is stressed and compressed, the connecting wire structure is compressed into a zigzag passage;
the connecting wire structure comprises columnar channels arranged in the thickness direction of the elastic insulating piece, a plurality of conductive particles filled in the columnar channels, and at least one rigid insulating limiting sleeve fixed on the circumference of the columnar channels, wherein the rigid insulating limiting sleeves at adjacent columnar channels are arranged in a staggered mode.
2. The probe for a test socket according to claim 1, wherein: the rigid insulating limiting sleeve is made of engineering plastics.
3. The probe for a test socket according to claim 1, wherein: the probe head comprises a base and a needle end part fixed at the upper end of the base, wherein the outer diameter of the base is larger than that of the needle end part.
4. A probe for a test socket according to claim 3, wherein: the probe head is characterized in that a limiting penetrating groove matched with the probe head is formed in the rigid insulating piece, the limiting penetrating groove comprises a first groove part and a second groove part which are communicated up and down, the inner diameter of the first groove part is smaller than that of the second groove part, and a limiting table matched with the base is formed between the first groove part and the second groove part.
5. The probe for a test socket according to claim 4, wherein: the probe head is in clearance fit with the limiting through groove.
6. The probe for a test socket according to claim 1, wherein: in the test state, the length of the saw-tooth path is not more than 1mm.
7. The probe for a test socket according to claim 1, wherein: the elastic insulating piece is a silicon rubber piece, and the rigid insulating piece is an engineering plastic piece.
8. The probe for a test socket according to claim 1, wherein: the rigid insulating piece is adhered to the elastic insulating piece, and the roughness of the end face, attached to the elastic insulating piece, of the rigid insulating piece is N10 level or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111169130.4A CN113848459B (en) | 2021-10-08 | 2021-10-08 | Probe for test socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111169130.4A CN113848459B (en) | 2021-10-08 | 2021-10-08 | Probe for test socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113848459A CN113848459A (en) | 2021-12-28 |
| CN113848459B true CN113848459B (en) | 2023-10-24 |
Family
ID=78977711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111169130.4A Active CN113848459B (en) | 2021-10-08 | 2021-10-08 | Probe for test socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113848459B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000243487A (en) * | 1999-02-23 | 2000-09-08 | Jsr Corp | Wiring board and its manufacture plate-like connector and adapter device for circuit device |
| CN202126447U (en) * | 2011-06-30 | 2012-01-25 | 上海韬盛电子科技有限公司 | Testing socket controllable in impedance |
| KR101339167B1 (en) * | 2012-06-18 | 2013-12-09 | 주식회사 아이에스시 | Test socket |
| WO2015102304A1 (en) * | 2013-12-31 | 2015-07-09 | 주식회사 아이에스시 | Sheet-type connector and electrical connector device |
| CN207281124U (en) * | 2017-10-11 | 2018-04-27 | 昆山康信达光电有限公司 | A kind of high power battery probe |
| CN110247218A (en) * | 2019-07-03 | 2019-09-17 | 法特迪精密科技（苏州）有限公司 | A kind of hyperfrequency socket for inspection suitable for integrated circuit |
| CN111458541A (en) * | 2020-05-22 | 2020-07-28 | 上海电连旭晟通信技术有限公司 | Test probe and electronic equipment |
| TWI715411B (en) * | 2020-01-13 | 2021-01-01 | 泰可廣科技股份有限公司 | Electrical connection components |
| CN112305395A (en) * | 2020-11-06 | 2021-02-02 | 法特迪精密科技（苏州）有限公司 | Probe structure and installation method, closed circuit method and anti-interference method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7446544B2 (en) * | 2004-03-31 | 2008-11-04 | Jsr Corporation | Probe apparatus, wafer inspecting apparatus provided with the probe apparatus and wafer inspecting method |
| KR101339166B1 (en) * | 2012-06-18 | 2013-12-09 | 주식회사 아이에스시 | Test socket with conductive powder having through-hole and fabrication method thereof |
-
2021
- 2021-10-08 CN CN202111169130.4A patent/CN113848459B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000243487A (en) * | 1999-02-23 | 2000-09-08 | Jsr Corp | Wiring board and its manufacture plate-like connector and adapter device for circuit device |
| CN202126447U (en) * | 2011-06-30 | 2012-01-25 | 上海韬盛电子科技有限公司 | Testing socket controllable in impedance |
| KR101339167B1 (en) * | 2012-06-18 | 2013-12-09 | 주식회사 아이에스시 | Test socket |
| WO2015102304A1 (en) * | 2013-12-31 | 2015-07-09 | 주식회사 아이에스시 | Sheet-type connector and electrical connector device |
| CN207281124U (en) * | 2017-10-11 | 2018-04-27 | 昆山康信达光电有限公司 | A kind of high power battery probe |
| CN110247218A (en) * | 2019-07-03 | 2019-09-17 | 法特迪精密科技（苏州）有限公司 | A kind of hyperfrequency socket for inspection suitable for integrated circuit |
| TWI715411B (en) * | 2020-01-13 | 2021-01-01 | 泰可廣科技股份有限公司 | Electrical connection components |
| CN111458541A (en) * | 2020-05-22 | 2020-07-28 | 上海电连旭晟通信技术有限公司 | Test probe and electronic equipment |
| CN112305395A (en) * | 2020-11-06 | 2021-02-02 | 法特迪精密科技（苏州）有限公司 | Probe structure and installation method, closed circuit method and anti-interference method thereof |
Non-Patent Citations (1)
| Title |
|---|
| AZ31B镁合金/6061铝合金异质金属连接件整体微弧氧化膜的制备及其结构;周吉学 等;机械工程材料;第42卷(第05期);20-26、31 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113848459A (en) | 2021-12-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5289771B2 (en) | Probe card | |
| KR101378505B1 (en) | Contact for semiconductor chip package test | |
| KR100562602B1 (en) | Press contact clamping connector and its connection structure | |
| TWI703329B (en) | Probe card for high-frequency applications | |
| US8556638B2 (en) | Electronic device socket | |
| KR102063761B1 (en) | Data signal transmission connector and manufacturing method for the same | |
| KR20050087300A (en) | Test socket for semiconductor package | |
| US20160216294A1 (en) | Electrical Spring Probe with Stabilization | |
| KR102103746B1 (en) | Device for RF semiconductor test socket | |
| CN113848459B (en) | Probe for test socket | |
| US10658274B2 (en) | Electronic device | |
| KR101261727B1 (en) | Test socket | |
| KR102244246B1 (en) | Test socket in which buffer area is formed around electrically conductive line | |
| KR101299197B1 (en) | Contact for semiconductor chip package test | |
| KR200316878Y1 (en) | Test socket for ball grid array package | |
| TW202133500A (en) | Connector | |
| KR20220052449A (en) | A pogo pin | |
| KR200313240Y1 (en) | Test socket for ball grid array package | |
| KR20070111847A (en) | Semiconductor test socket in last semiconductor process | |
| TWI390211B (en) | Vertical probe card | |
| JP2005337994A (en) | Electronic component inspecting probe, and electronic component inspecting splicer provided with same | |
| KR20200057579A (en) | Elastically contactable by-directional electrically conductive module | |
| CN212514903U (en) | Chip testing device | |
| KR20170125147A (en) | Surface mount type device test connector | |
| KR20200051007A (en) | Interface element for electronic device test apparatus and manufacturing method corresponding thereto |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 200 Xingpu Road, Industrial Park, Suzhou City, Jiangsu Province, 215000, 5 # 101, 102, 201, 202 Patentee after: Suzhou Fatedi Technology Co.,Ltd. Country or region after: China Address before: No. 200 Xingpu Road, Industrial Park, Suzhou City, Jiangsu Province, 215000, 5 # 101, 102, 201, 202 Patentee before: FTDEVICE TECHNOLOGY (SUZHOU) CO.,LTD. Country or region before: China |