CN113840682B - 接合结构体以及包括其的开关、光电传感器及近接传感器 - Google Patents
接合结构体以及包括其的开关、光电传感器及近接传感器 Download PDFInfo
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- CN113840682B CN113840682B CN202080033587.XA CN202080033587A CN113840682B CN 113840682 B CN113840682 B CN 113840682B CN 202080033587 A CN202080033587 A CN 202080033587A CN 113840682 B CN113840682 B CN 113840682B
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Classifications
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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Abstract
本发明提供一种耐热冲击性优异且具有高接合强度的接合结构体,以及包括其的开关、光电传感器及近接传感器。本发明的一实施方式的接合结构体包括:第一构件,为表面形成有开口直径为30μm~100μm的多个穿孔的金属材料;第三构件,为表面形成有开口直径为30μm~100μm的独立的多个穿孔且与所述第一构件相同或不同的金属材料或者热塑性树脂;以及第二构件,为将所述第一构件的形成有穿孔的表面与所述第三构件的形成有穿孔的表面接合的硬化性树脂。
Description
技术领域
本发明涉及一种接合结构体及其用途。
背景技术
在专利文献1中公开有一种复合成形体的制造方法,包括:针对作为第一成形体的金属成形体的接合面,使用连续波激光以200mm/sec以上的照射速度连续照射激光光的工序;在前工序中照射了激光光的金属成形体的接合面形成粘接剂层的工序;以及在前工序中涂布了粘接剂的作为第一成形体的金属成形体的接合面粘接第二成形体的工序。
现有技术文献
专利文献
专利文献1:日本公开专利公报“日本专利特开2015-213961号公报”
发明内容
发明所要解决的问题
根据专利文献1的复合成形体的制造方法,可提供在与接合面平行的方向上拉伸时的拉伸强度及在与接合面垂直的方向上拉伸时的拉伸强度这两拉伸强度优异的复合成形体。
然而,专利文献1的发明中,由于未对第二成形体进行加工,因此在利用热冲击等施加膨胀收缩力时,有无法充分获得第二成形体侧的接合强度的可能性。另外,通过利用连续波激光将第一成形体的接合面粗面化,第一成形体的接合面为不均匀的形状。由此,在利用热冲击等施加膨胀收缩力时,第一成形体具有应力集中点,因此在接合强度的提高方面仍有改善的余地。
因此,本案发明人发现:从前的方法中,即便使用具有耐油性及耐化学品性的粘接剂,也难以获得具有耐热冲击性的接合强度的优异的复合成形体。
本发明在一方面是鉴于此种实际情况而成,其目的为提供一种耐热冲击性优异且显示出高接合强度的接合结构体。
解决问题的技术手段
为了解决所述问题,本发明的一方面的接合结构体包括:第一构件,为表面形成有开口直径为30μm~100μm的多个穿孔的金属材料;第三构件,为表面形成有开口直径为30μm~100μm的独立的多个穿孔且与所述第一构件相同或不同的金属材料或者热塑性树脂;以及第二构件,为将所述第一构件的形成有穿孔的表面与所述第三构件的形成有穿孔的表面接合的硬化性树脂。
发明的效果
根据本发明的一实施例,可提供一种耐热冲击性优异且具有高接合强度的接合结构体。
附图说明
图1示意性例示实施方式的接合结构体的剖面的一例。
图2示意性例示实施方式的接合结构体的剖面的一例。
图3示意性例示实施方式的接合结构体的剖面的一例。
图4示意性例示实施方式的接合结构体的剖面的一例。
图5示意性例示实施方式的接合结构体的剖面的一例。
图6示意性例示实施方式的接合结构体的剖面的一例。
图7示意性例示实施方式的接合结构体的剖面的一例。
图8示意性例示实施方式的接合结构体的剖面的一例。
图9示意性例示实施方式的接合结构体的剖面的一例。
图10示意性例示实施方式的接合结构体的剖面的一例。
图11示意性表示实施例1中的接合结构体的制造工序。
图12示意性表示比较例1中的接合结构体的制造工序。
图13示意性表示实施例5中的接合结构体的制造工序。
图14示意性表示比较例1中的接合结构体的剖面。
图15示意性表示比较例2中的接合结构体的剖面。
[符号的说明]
1:第一构件
2:第二构件
3:第三构件
4:穿孔
具体实施方式
以下,基于附图,对本发明的一方面的实施方式(以下,也表述为“本实施方式”)进行说明。
§1应用例
首先,使用图1对本发明的一实施例的接合结构体的概要进行说明。图1示意性例示实施方式的接合结构体的剖面的一例。
图1中,例示了如下接合结构体,所述接合结构体包括:第一构件1,为表面形成有开口直径为30μm~100μm的多个穿孔的金属材料;第三构件3,为表面形成有开口直径为30μm~100μm的多个穿孔且与所述第一构件相同或不同的金属材料或者热塑性树脂;以及第二构件2,为将所述第一构件的形成有穿孔的表面与所述第三构件的形成有穿孔的表面接合的硬化性树脂。换言之,第一构件1与第三构件3经由第二构件2而接合。此外,图1中,示出了与穿孔的深度方向平行的剖面。
在形成于第一构件1及第三构件3中的穿孔内填充作为硬化性树脂的第二构件2并加以硬化,因此可物理性获得牢固的锚定效果。由此,可获得耐热冲击性优异且显示出高接合强度的接合结构体。另外,通过进行在第一构件1及第三构件3的表面形成穿孔的表面加工,可去除表面的杂质,可提高粘接强度。另外,通过在第一构件1及第三构件3的表面形成有多个穿孔,接合部的应力分散,可提供避免了应力集中的接合结构体。
此外,作为硬化性树脂,也存在容易粘接于金属但难以粘接于树脂的粘接剂。因此,在第一构件及第三构件为不同材料的情况下,若为仅利用化学性键结进行的粘接,则会对粘接剂的选定产生制约。但是,所述接合结构体中,通过进而具有基于所述锚定效果所得的物理性结合,粘接剂的选择项扩大,能够选择具有耐油性及耐化学品性的粘接剂。作为结果,可获得具有耐油性及耐化学品性且耐热冲击性优异并且显示出高接合强度的接合结构体。
§2结构例
<第一构件>
所述第一构件为表面形成有开口直径为30μm~100μm的多个穿孔的金属材料。作为所述金属材料的一例,可列举:铁系金属、不锈钢系金属、铜系金属、铝系金属、镁系金属及它们的合金。另外,金属材料可为金属成形体,也可为锌铸件、铝铸件、粉末冶金等。
<第三构件>
所述第三构件为表面形成有开口直径为30μm~100μm的多个穿孔且与所述第一构件相同或不同的金属材料或者热塑性树脂。作为用作所述第三构件的金属材料的一例,可列举在第一构件中所使用的金属材料中所例示的金属材料。第三构件可为与第一构件相同的金属材料,也可为不同的金属材料。
作为所述热塑性树脂的一例,可列举:聚氯乙烯(Polyvinyl Chloride,PVC)、聚苯乙烯(Polystyrene,PS)、丙烯腈-苯乙烯共聚物(Acrylonitrile Styrene,AS)、丙烯腈-丁二烯-苯乙烯共聚物(Acrylonitrile Butadiene Styrene,ABS)、聚甲基丙烯酸甲酯(Polymethyl Methacrylate,PMMA)、聚乙烯(Polyethylene,PE)、聚丙烯(Polypropylene,PP)、聚碳酸酯(Polycarbonate,PC)、改性聚苯醚(m-Polyphenylene Ether,m-PPE)、聚酰胺6(Polyamide 6,PA6)、聚酰胺66(Polyamide 66,PA66)、聚缩醛(Polyacetal,POM)、聚对苯二甲酸乙二酯(Polyethylene Terephthalate,PET)、聚对苯二甲酸丁二酯(PolybutyleneTerephthalate,PBT)、聚砜(Polysulfone,PSF)、聚芳酯(Polyarylate,PAR)、聚醚酰亚胺(Polyetherimide,PEI)、聚苯硫醚(Polyphenylene Sulfide,PPS)、聚醚砜(Polyethersulfone,PES)、聚醚醚酮(Polyether Ether Ketone,PEEK)、聚酰胺酰亚胺(Polyamideimide,PAI)、液晶聚合物(Liquid Crystal Polymer,LCP)、聚偏二氯乙烯(Polyvinylidene Chloride,PVDC)、聚四氟乙烯(Polytetrafluorethylene,PTFE)、聚氯三氟乙烯(Polychlorotrifluroehtylene,PCTFE)及聚偏二氟乙烯(PolyvinylideneFluoride,PVDF)。另外,所述热塑性树脂也可为热塑性弹性体(Thermoplastic Elastomer,TPE),作为TPE的一例,可列举:热塑性聚烯烃(Thermoplastic Polyolefin,TPO)(烯烃系)、热塑性聚苯乙烯(Thermoplastic Polystyrene,TPS)(苯乙烯系)、热塑性聚酯弹性体(Thermoplastic Poly Ester Elastomer,TPEE)(酯系)、热塑性聚氨基甲酸酯(Thermoplastic Polyurethane,TPU)(氨基甲酸酯系)、热塑性聚酰胺(ThermoplasticPolyamide,TPA)(尼龙(nylon)系)及热塑性聚氯乙烯(Thermoplastic PolyvinylChloride,TPVC)(氯乙烯系)。
<第二构件>
所述第二构件为将所述第一构件的形成有穿孔的表面及所述第三构件的形成有穿孔的表面接合的硬化性树脂。
所述硬化性树脂可为反应性硬化性树脂。作为所述反应性硬化性树脂,例如可列举通过加热而形成交联结构并加以硬化的热硬化性树脂、及通过照射光而形成交联结构并加以硬化的光硬化性树脂等。
作为所述反应性硬化性树脂的一例,可列举:环氧(Epoxy,EP)树脂、聚氨基甲酸酯(Polyurethane,PUR)树脂、脲醛(Urea Formaldehyde,UF)树脂、三聚氰胺甲醛(MelamineFormaldehyde,MF)树脂、苯酚甲醛(Phenol Formaldehyde,PF)树脂、不饱和聚酯(Unsaturated Polyester,UP)树脂及硅酮(Silicone,SI)树脂、丙烯酸树脂。另外,反应性硬化性树脂也可为纤维强化塑料(Fiber Reinforced Plastic,FRP)。
另外,所述硬化性树脂也可为环氧树脂。就平衡良好地兼顾耐油性、耐化学品性及耐热冲击性的观点而言,所述反应性硬化性树脂优选为环氧树脂。
在所述第二构件中也可还添加填充剂。作为所述填充剂的一例,可列举:无机系填充剂(玻璃纤维、无机盐类等)、金属系填充剂、有机系填充剂及碳纤维等。
所述硬化性树脂的硬化前的粘度在25℃下优选为10,000mPa·s~300,000mPa·s,更优选为25,000mPa·s~90,000mPa·s,进而优选为50,000mPa·s~75,000mPa·s。在硬化性树脂的硬化前的粘度为所述范围内的情况下,硬化性树脂容易填充于穿孔中,因此容易发挥锚定效果且起到提高接合强度的效果。所述粘度(mPa·s)例如能够通过在25℃下使用旋转粘度计(布氏粘度计)(英弘精机公司制造)来测定。
所述硬化性树脂的硬化后的肖氏D硬度优选为30~90,更优选为50~90,进而优选为70~90。在硬化性树脂的硬化后的肖氏D硬度为所述范围内的情况下,除耐热冲击性以外,也可确保耐油性及耐化学品性。此外,肖氏D硬度可依据日本工业标准(JapaneseIndustrial Standards,JIS)K6253来测定。
<穿孔>
所述穿孔的开口直径优选为30μm~100μm。
所述穿孔相互独立。即,在自与形成有穿孔的表面垂直的方向观察时,穿孔的开口部不重叠,穿孔彼此的边界线明确。因此,所述穿孔与连续的槽不同。通过所述穿孔相互独立,第一构件及第三构件的表面积扩大。由此,第一构件及第三构件与第二构件相接的面积扩大,因此起到提高物理性接合强度的效果。
所述穿孔的开口部的形状并无特别限定,例如可为圆形,也可为多边形。若开口部的形状为圆形,则容易形成穿孔。另外,例如,与所述穿孔的深度方向垂直的剖面的直径可为自开口部朝向深度方向一定,也可为自开口部朝向深度方向变大、然后变小,或者还可为自开口部朝向深度方向变小。优选为与所述穿孔的深度方向垂直的剖面的直径自开口部朝向深度方向变大、然后变小。换言之,穿孔的形状优选为在深度方向上具有缩颈。通过所述结构,显现出将第二构件锁定的效果。即,在与穿孔的深度方向平行的力发挥作用的情况下,在穿孔内部硬化而成的第二构件难以被拉出至穿孔外部,起到提高物理性接合强度的效果。与穿孔的深度方向垂直的剖面的直径的自开口部朝向深度方向的变化可为曲线性,也可为直线性。
所述穿孔的间距并无特别限定,可根据穿孔的开口直径、第一构件及第三构件的体积等来适宜变更。但是,所述穿孔的间距的下限值设为穿孔不重叠的距离。例如,穿孔的间距优选为50μm~200μm,更优选为50μm~150μm,进而优选为50μm~80μm。所述穿孔的间距例如能够通过控制激光照射的照射间隔来调整。
穿孔的深度并无特别限定,可根据穿孔的开口直径、第一构件及第三构件的体积等来适宜变更。例如,穿孔的深度优选为30μm~100μm。
第一构件与第三构件中的穿孔的形状可相同。例如,如所述图1所示,也可使第一构件1与第三构件3经由第二构件2接合,所述第一构件1形成有开口部为圆形且与深度方向垂直的剖面的直径朝向深度方向曲线性变小的形状的穿孔,所述第三构件3与第一构件1同样地形成有开口部为圆形且与深度方向垂直的剖面的直径朝向深度方向曲线性变小的形状的穿孔。
穿孔也可为图2~图10所示的形状。图2~图10分别示意性表示实施方式的接合结构体的、与穿孔的深度方向平行的剖面的一例。
关于穿孔的形状,可如图2所示那样为开口部是圆形且与深度方向垂直的剖面的直径朝向深度方向曲线性变大、然后变小的形状,也可如图3所示那样为圆锥形状。
或者,第一构件与第三构件中的穿孔的形状也可不同。例如,如图4所示,也可使形成有圆锥形状的穿孔的第一构件1与第三构件3经由第二构件2接合,所述第三构件3形成有开口部为圆形且与深度方向垂直的剖面的直径朝向深度方向曲线性变大、然后变小的形状的穿孔。
另外,第一构件及第三构件中的穿孔的间距可相同,也可相互不同。例如,如图5所示,第一构件1与第三构件3的线膨胀系数大致相同,但在第一构件1的体积大于第三构件3的体积的情况下,第一构件1中的穿孔的间距也可小于第三构件3中的穿孔的间距。即便是线膨胀系数接近的材料彼此的粘接,若这些材料的体积不同,则由热冲击引起的膨胀收缩量的差也会变大。根据所述结构,可减小由热冲击引起的膨胀收缩量的差,进而,可获得兼顾了耐油性、耐化学品性及耐热冲击性的接合结构体。
另外,第一构件及第三构件中的穿孔的深度可相同,也可相互不同。例如,如图6所示,第一构件1与第三构件3的线膨胀系数大致相同,但在第一构件1的体积大于第三构件3的体积的情况下,第一构件1中的穿孔的深度也可深于第三构件3中的穿孔的深度。通过所述结构,可减小由热冲击引起的膨胀收缩量的差,进而,可获得兼顾了耐油性、耐化学品性及耐热冲击性的接合结构体。
进而,第一构件及第三构件中的穿孔的间距及穿孔的深度这两者在第一构件与第三构件中也可不同。例如,如图7所示,在第一构件1的体积大于第三构件3的体积的情况下,第一构件1中的穿孔的间距也可小于第三构件3中的穿孔的间距,第一构件1中的穿孔的深度也可深于第三构件3中的穿孔的深度。
或者,如图8所示,即便是形成有穿孔的表面以外的面,第一构件1及第三构件3也可经由第二构件2接合。另外,如图9所示,除第三构件3以外,其他构件7也可经由第二构件2而与第一构件1接合。在所述其他构件7的表面也可形成所述穿孔。另外,其他构件7可为作为第一构件或第三构件所例示的金属材料或者热塑性树脂。进而,如图10所示,第三构件3也可在与和第一构件1接合的面不同的面中经由其他粘接剂8而与其他构件7接合。在与第三构件3的和第一构件1接合的面不同的面也可形成所述穿孔。其他粘接剂8也可为作为第二构件所例示的硬化性树脂。
<接合结构体的制造方法>
所述接合结构体例如可通过如下制造方法来制造,所述制造方法包括将所述第一构件的形成有穿孔的表面与所述第三构件的形成有穿孔的表面经由所述第二构件接合的工序。
所述穿孔优选为通过激光照射而形成。作为用以形成所述穿孔的激光的种类,可选择光纤激光、钇铝石榴石(Yttrium Aluminum Garnet,YAG)激光、YVO4激光、半导体激光、二氧化碳激光、准分子激光等,当考虑激光的波长时,优选为光纤激光等。
例如,在第一构件的形成有穿孔的表面、第三构件的形成有穿孔的表面或所述两表面涂布第二构件,继而,以第三构件的形成有穿孔的表面与第一构件的形成有穿孔的表面相接的方式重合。此处,也可对第一构件与第三构件重合的区域进行加压。然后,通过使第二构件硬化,可获得接合结构体。
另外,也可在涂布第二构件之前,通过紫外线照射等来进行处理,以使第二构件中的OH基露出。或者,也可在涂布第二构件的过程中和/或涂布了第二构件之后进行加热或抽真空。通过这些处理,可减低第二构件填充于穿孔中时的表面张力,第二构件容易填充于穿孔中。关于第二构件的硬化的方法,只要第二构件充分硬化,则并无特别限定。
<接合结构体的利用>
所述接合结构体例如可用于开关、光电传感器及近接传感器中。
通常而言,光电传感器为基板等内部零件由金属框体密封的结构。从前,在由金属框体密封的情况下,进行焊接或不对表面进行加工而利用粘接剂进行接合。但是,焊接中,有基板等内部零件因热而受到损伤的担忧。另外,不对表面进行加工而利用粘接剂进行接合的方法中,容易剥落且接合强度有改善的余地。另外,开关、光电传感器及近接传感器中,除金属彼此的接合以外,也有需要进行金属与树脂的接合的部分,从前,将金属与树脂直接接合。但是,此种方法中,有金属与树脂容易剥落的倾向。
包括所述接合结构体的开关、光电传感器或接近传感器中,具有高接合强度,进而可减轻内部零件受到的热损伤。
本发明并不限定于所述各实施方式,能够在权利要求中所示的范围内进行各种变更,关于将不同的实施方式中分别公开的技术手段适宜组合而获得的实施方式,也可包含于本发明的技术范围内。
〔总结〕
本发明的一方面的接合结构体包括:第一构件,为表面形成有开口直径为30μm~100μm的多个穿孔的金属材料;第三构件,为表面形成有开口直径为30μm~100μm的独立的多个穿孔且与所述第一构件相同或不同的金属材料或者热塑性树脂;以及第二构件,为将所述第一构件的形成有穿孔的表面与所述第三构件的形成有穿孔的表面接合的硬化性树脂。
硬化性树脂可通过交联反应而硬化。所述结构中,在形成有穿孔的表面彼此涂布硬化性树脂并加以硬化,由此硬化性树脂填充于穿孔内,物理性获得牢固的锚定效果。由此,可获得耐热冲击性优异且显示出高接合强度的接合结构体。另外,通过进行在表面形成穿孔的表面加工,构件的表面的杂质被去除,可提高粘接强度。另外,通过形成有多个穿孔,接合部的应力分散,可提供避免了应力集中的接合结构体。所述穿孔的开口直径可作为金属材料的表面中的穿孔的开口部的最大直径进行测定。
所述一方面的接合结构体中,所述硬化性树脂可为反应性硬化性树脂。反应性硬化性树脂可通过来自外部的能量来形成交联结构并加以硬化。通过所述结构,可在低于焊接温度的温度下将第一构件与第三构件接合,可减轻对于接合结构体中所含的构件的热损伤。
所述一方面的接合结构体中,所述反应性硬化性树脂可为环氧树脂。根据所述结构,除耐热冲击性以外,也可确保耐油性及耐化学品性。环氧树脂可含有至少一个环氧基。
所述一方面的接合结构体中,所述硬化性树脂的硬化前的粘度在25℃下可为25,000mPas~90,000mPa·s。根据所述结构,硬化性树脂容易填充于穿孔中,因此容易发挥锚定效果,起到提高接合强度的效果。
所述一方面的接合结构体中,所述硬化性树脂的硬化后的肖氏D硬度可为30~90。根据所述结构,除耐热冲击性以外,也可确保耐油性及耐化学品性。
所述一方面的接合结构体中,与所述穿孔的深度方向垂直的剖面的直径可自开口部朝向深度方向变大、然后变小,或者也可自开口部朝向深度方向变小。根据所述结构,容易发挥锚定效果,因此可确保耐热冲击性的稳定性。
所述一方面的接合结构体中,所述穿孔的间距可为50μm~200μm。其中,穿孔的间距的下限设为穿孔不重叠的距离。根据所述结构,穿孔规则性排列,因此接合部的应力均匀地分散,容易避免应力集中。所述穿孔的间距可作为自穿孔的中心至与所述穿孔相邻的穿孔的中心为止的距离进行测定。
本发明的一方面的开关包括所述接合结构体。
本发明的一方面的光电传感器包括所述接合结构体。
本发明的一方面的接近传感器包括所述接合结构体。
实施例
以下,基于实施例,对本发明进行更详细说明,但本发明并不限定于以下的实施例。
〔实施例1〕
图11是表示实施例1中的接合结构体的制造工序的图。图11的工序1001表示在第一构件1及第三构件3的表面形成穿孔4的工序。作为第一构件1,使用SUS304(50mm×25mm、厚度3mm),作为第三构件3,使用SUS304(50mm×25mm、厚度1mm),作为第二构件2,使用热硬化性环氧粘接剂(硬化前的粘度35,000mPa、肖氏D硬度80)。在距第一构件1的长边方向的一端2mm×21mm的范围及距第三构件3的长边方向的一端5mm×21mm的范围内使用光纤激光标识器MX-Z2000H(欧姆龙(Omron)股份有限公司制造)进行脉冲激光照射,由此在各构件的表面以穿孔的间距成为65μm的方式形成多个穿孔4。
图11的工序1002表示将第一构件1的形成有穿孔的表面与第三构件3的形成有穿孔的表面接合的工序。在第一构件1的形成有穿孔4的表面涂布第二构件2,如图11的工序1002所示,以第三构件3的形成有穿孔4的表面与第一构件1的形成有穿孔4的表面相接的方式重合加压。继而,在烘箱内,在70℃下加热90分钟,使第二构件2硬化,由此制作接合结构体。将形成穿孔时的脉冲激光照射条件示于表1中。实施例1的接合结构体为图1所示的结构。
〔实施例2~实施例4〕
除分别变更形成穿孔时的脉冲激光照射条件以外,利用与实施例1相同的方法制作三个接合结构体。将形成穿孔时的脉冲激光照射条件示于表1中。实施例2~实施例4的接合结构体分别为图2~图4所示的结构。
[表1]
(表1的续)
〔比较例1〕
图12是表示比较例1中的接合结构体的制造工序的图。图12的工序1003表示在第一构件1及第三构件3的表面形成穿孔的工序。代替实施例1的穿孔形成,而使用YAG激光ML-2150A(米亚基技术(MIYACHI TECHUNOS)制造)进行激光照射,如图12的工序1003所示,以凹部5的宽度成为0.4mm、相邻的凹部5的之间的凸部6的宽度成为0.15mm的方式,通过连续波加工而在构件的接合表面形成凹凸形状。即,形成槽形状。
图2的工序1004表示将第一构件的形成有凹凸形状的表面与第三构件的形成有凹凸形状的表面接合的工序。
在第一构件1的形成有凹凸形状的表面涂布第二构件2,如图12的工序1004所示,以第三构件3的形成有凹凸形状的表面与第一构件1的形成有凹凸形状的表面相接的方式重叠加压。继而,在烘箱内,在70℃下加热90分钟,使第二构件2硬化,由此制作接合结构体。将激光照射的条件示于表2中。比较例1的接合结构体为图14所示的结构。此外,图14表示与凹部的深度方向及凹部的长边方向平行的剖面。
〔比较例2〕
除代替实施例1的穿孔形成而通过喷砂法来进行表面处理以外,利用与实施例1相同的方法制作接合结构体。将喷砂法的条件示于表2中。此处,喷砂法是在表示表面粗糙度的中心线平均粗糙度(Ra)成为5μm~10μm的条件下进行。比较例2的接合结构体为图15所示的结构。此外,图15表示与凹部的深度方向平行的剖面。
[表2]
〔实施例5〕
图13是表示实施例5中的接合结构体的制造工序的图。作为第一构件1,使用SUS304(50mm×25mm、厚度3mm)、作为第三构件3,使用包含30重量%的玻璃填料的PBT板(50mm×25mm、厚度3mm),作为第二构件2,使用热硬化性环氧粘接剂(硬化前的粘度35,000mPa、肖氏D硬度80)。此处,第一构件的线膨胀系数是第二构件及第三构件的二分之一。
在距第一构件1的长边方向的一端2mm×21mm的范围及距第三构件3的长边方向的一端5mm×21mm的范围内使用光纤激光标识器MX-Z2000H(欧姆龙(Omron)股份有限公司制造)进行脉冲激光照射,由此在各构件的表面,第一构件时以穿孔的间距成为65μm的方式,第三构件时以穿孔的间距成为130μm的方式形成多个穿孔4。
图13的工序1006表示将第一构件的形成有穿孔的表面与第三构件的形成有穿孔的表面接合的工序。与实施例1同样地,在第一构件1的形成有穿孔4的表面涂布第二构件2,如图13的工序1006所示,以第三构件3的形成有穿孔4的表面与第一构件1的形成有穿孔4的表面相接的方式重合加压。继而,在烘箱内,在70℃下加热90分钟,使第二构件硬化,由此制作接合结构体。将形成穿孔时的脉冲激光照射条件示于表3中。
〔实施例6〕
除变更脉冲激光照射的条件以外,利用与实施例5相同的方法制作接合结构体。将形成穿孔时的脉冲激光照射条件示于表3中。
[表3]
〔接合性评价〕
使用所述实施例1~实施例6的接合结构体及比较例1~比较例2的接合结构体,并利用以下的方法进行接合性评价。
在热冲击试验前与热冲击试验100个循环后,进行所获得的接合结构体的拉伸试验,对由此引起的接合部的破坏状态进行评价。此处,热冲击试验是以在-40℃下处理30分钟,然后在70℃下处理30分钟为1个循环,其他条件基于JIS C 60068-2-14来实施。另外,拉伸试验是使用英斯特朗(Instron)公司制造的电机械式万能试验机5900来进行。具体而言,在剪切方向上以拉伸速度5mm/min进行试验,在第二构件断裂的时点,或者第二构件自第一构件和/或第三构件的表面完全剥离的时点(接合界面断裂的时点),结束试验。
将结果示于表4中。表中,○及×分别表示以下的状态。
○:第二构件未自第一构件和/或第三构件的表面剥离而产生第二构件的破坏的情况。
×:第二构件自第一构件和/或第三构件的表面剥离的情况(包括第二构件自第一构件和/或第三构件的表面剥离,进而也产生了第二构件的破坏的状态)。
[表4]
实施例1 | 实施例2 | 实施例3 | 实施例4 | 比较例1 | 比较例2 | 实施例5 | 实施例6 | |
热冲击试验前 | ○ | ○ | ○ | ○ | ○ | × | ○ | ○ |
热冲击试验100个循环后 | ○ | ○ | ○ | ○ | × | × | ○ | ○ |
实施例1~实施例6的接合结构体在热冲击试验前的拉伸试验及热冲击试验100个循环后的拉伸试验中均未观察到接合界面剥离。
另一方面,比较例2的接合结构体在热冲击试验前的拉伸试验及热冲击试验100个循环后的拉伸试验这两拉伸试验中观察到接合界面剥离。比较例1的接合结构体在热冲击试验前的拉伸试验中未观察到接合界面剥离,但在热冲击试验100个循环后的拉伸试验中观察到接合界面剥离。
产业上的可利用性
本发明的一实施例可用于使用粘接剂来密封于金属框体中的所有制品。
Claims (9)
1.一种接合结构体,包括:
第一构件,为表面形成有开口直径为30μm~100μm、深度为40μm~60μm的多个穿孔的金属材料;
第三构件,为表面形成有开口直径为30μm~100μm、深度为40μm~60μm或60μm~80μm的多个穿孔且与所述第一构件相同或不同的金属材料或者热塑性树脂;以及
第二构件,为将所述第一构件的形成有所述多个穿孔的表面与所述第三构件的形成有所述多个穿孔的表面接合的硬化性树脂,
其中,所述硬化性树脂的硬化后的肖氏D硬度为30~90。
2.根据权利要求1所述的接合结构体,其中,所述硬化性树脂为反应性硬化性树脂。
3.根据权利要求1或2所述的接合结构体,其中,所述硬化性树脂为环氧树脂。
4.根据权利要求1或2所述的接合结构体,其中,所述硬化性树脂的硬化前的粘度在25℃下为25,000mPa·s~90,000mPa·s。
5.根据权利要求1或2所述的接合结构体,其中,与所述多个穿孔的深度方向垂直的剖面的直径自开口部朝向深度方向变大、然后变小,或者自开口部向深度方向变小。
6.根据权利要求1或2所述的接合结构体,其中,所述多个穿孔的间距的下限为所述多个穿孔不重叠的距离,上限为200μm。
7.一种开关,包括如权利要求1至6中任一项所述的接合结构体。
8.一种光电传感器,包括如权利要求1至6中任一项所述的接合结构体。
9.一种近接传感器,包括如权利要求1至6中任一项所述的接合结构体。
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