CN113836110B - Method for establishing plane putty robot polishing database - Google Patents
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Abstract
The invention provides a method for establishing a plane putty robot polishing database, which comprises the steps of programming a robot plane polishing track program; testing the influence of polishing parameters of the planar putty robot on the quality of the polished surface, and measuring the removal amount of the experimental polished surface by using a measuring tool; and determining the time-varying relation between the polishing parameters and the polishing results by comprehensively considering the surface removal amount and the polishing time, and establishing a polishing database. The method for establishing the planar putty robot polishing database provided by the invention can determine the relationship between the parameters and the polishing quality, and can efficiently perform repeated planar polishing work on the premise of meeting the polishing quality.
Description
Technical Field
The invention relates to the technical field of robot polishing, in particular to a method for establishing a planar putty robot polishing database.
Background
At present, industrial robots in the industrial field are rapidly developed, and with the development of technology, intelligent manufacturing of the industrial robots plays an increasing role, and the industrial robots are subjected to more work. The intellectualization and automation are the necessary trend of production and manufacture, the industrial robot changes the previous production and operation mode, the production automation is realized by introducing the industrial robot, the industrial production efficiency is further improved, and the intelligent adjustment of the industrial structure is promoted.
The current high-speed railway car body putty polishing procedure mainly adopts a manual operation method, is time-consuming and labor-consuming, has low polishing efficiency and cannot guarantee polishing quality, therefore, an effective process method for automatically polishing the high-speed railway car body putty polishing robot is researched, labor cost is effectively reduced, damage of dust to workers in the polishing process is reduced, production efficiency and polishing quality are improved, and reproducibility of polishing parameters can be realized. However, in the prior art, as a mature database of polishing parameters and polishing quality cannot be provided, polishing parameters are required to be polished according to actual working conditions in each polishing operation, the polishing quality is ensured, and polishing work cannot be reproduced and repeated.
Disclosure of Invention
The invention mainly aims to solve the problems and the defects, and provides a method for establishing a polishing database of a planar putty robot, which is used for determining the relationship between parameters and polishing quality of polishing and efficiently carrying out repeated planar polishing work on the premise of meeting the polishing quality.
In order to achieve the above purpose, the invention provides a method for establishing a polishing database of a planar putty robot, which has the technical scheme that:
a method for establishing a planar putty robot polishing database comprises the following steps,
s1, determining a polishing path;
s2, performing experiments on polishing removal amounts which change with time under different polishing parameters according to the determined polishing paths, and recording experimental data;
s3, respectively analyzing the change relation between the polishing removal amount and each polishing parameter in different polishing time periods according to the recorded experimental data;
s4, combining the polishing removal amounts of different polishing time periods and the variation relation among the polishing parameters, carrying out an optimization experiment of a planar putty robot polishing method by taking the polishing removal amounts as a processing purpose, establishing the correlation between the polishing parameters and the polishing results along with the time variation, and establishing a planar putty robot polishing database.
Further, in step S2, one parameter of the polishing parameters is sequentially taken as a variable, the other polishing parameters are taken as constant values, experimental values of the polishing parameters serving as the variable are adjusted, the experimental values are respectively carried out, polishing removal amounts in different polishing time periods are respectively measured in each group of experiments, and each group of data is recorded by taking N adjacent points.
Further, in step S3, the linear relationship between the polishing removal amount and the polishing parameters in different time periods is determined by analyzing the recorded experimental data.
Further, the polishing path interval, the polishing linear speed and the polishing removal amount in the polishing parameters are in a negative correlation, the polishing rotation speed, the polishing pressure and the polishing removal amount are in a positive correlation, and the polishing removal amount gradually decreases along with the increase of polishing time.
Further, a curve of the variation relationship between the polishing removal amount and the polishing path interval in different time periods can be fitted to y Fitting 1 ＝k 1 x 1 +b 1 Wherein y is Fitting 1 Theoretical removal amount x increased along with polishing time under the condition that polishing path interval is variable and other polishing parameters are constant 1 Independent variable k when the polishing path interval is used as variable 1 Is an independent variable coefficient, a negative number, b 1 Is a constant related to the polishing time.
Further, a curve of the change relation between the polishing removal amount and the polishing rotation speed in different time periods can be fitted to y Fitting 2 ＝k 2 x 2 +b 2 Wherein y is Fitting 2 Theoretical removal amount x increased along with polishing time under the condition that polishing rotational speed is variable and other polishing parameters are constant 2 For independent variable k when the polishing rotational speed is used as variable 2 Is an independent variable coefficient, a positive number, b 2 Is a constant related to the polishing time.
Further, the change relation curve between the polishing removal amount and the polishing linear speed in different time periods can be fitted into y Fitting 3 ＝k 3 x 3 +b 3 Wherein y is pseudoAnd 3 is the theoretical removal quantity x which is increased along with the polishing time under the condition that the polishing linear speed is variable and other polishing parameters are constant values 3 For independent variable k when linear speed of polishing is used as variable 3 Is an independent variable coefficient, a negative number, b 3 Is a constant number related to the polishing time.
Further, a curve of the variation relationship between the polishing removal amount and the polishing line pressure in different time periods can be fitted to y Fitting 4 ＝k 4 x 4 +b 4 Wherein y is Fitting 4 Theoretical removal amount x increased along with polishing time under the condition that polishing pressure is variable and other polishing parameters are constant 4 K is the independent variable when polishing pressure is used as variable 4 Is an independent variable coefficient, a positive number, b 4 Is a constant related to the polishing time.
Further, in step S3, the influence of the polishing parameters on the polishing removal amounts in different polishing time periods is analyzed by using the recorded experimental data.
Further, in step S4, according to the obtained polishing parameters, the influence of the polishing removal amounts in different polishing time periods is only considered, and the optimization experiment is performed by considering the polishing parameters which have no influence on the polishing efficiency.
In summary, the method for establishing the planar putty robot polishing database provided by the invention has the following technical advantages compared with the prior art:
1. the relation between the polishing parameters and the polishing quality can be determined, so that the work of repeatedly polishing the high-speed rail car body plane putty can be efficiently performed on the premise of meeting the polishing quality;
2. the variable parameters are few, the database establishment method is simple and convenient, and the application range is wide;
3. in the turning section of the polishing path, the polishing head is lifted at a certain angle, and the necessary centripetal force of the polishing head rotating at a high speed is provided when the polishing head turns, so that the polishing head does not need to be decelerated when turning;
4. the turning paths have a certain overlapping amount, and the polishing areas at the turning positions are repeatedly polished, so that the polishing quality is improved;
5. the polishing head is lifted at a certain angle, so that the polishing amounts of the two sides of the polishing head are different, the light and heavy polishing amounts of the two polishing at the overlapped part are reversely overlapped, excessive polishing is avoided, and the polishing quality is further improved.
Description of the drawings:
fig. 1: the polishing path schematic diagram in the method provided by the invention;
fig. 2: the polishing head lifting angle schematic diagram in the method provided by the invention;
fig. 3: according to the method provided by the invention, the polishing removal amount in different time periods and the change relation curve between the horizontal path intervals are provided;
fig. 4: according to the method provided by the invention, the polishing removal amount and the polishing rotating speed in different time periods are changed in relation to each other;
fig. 5: according to the method provided by the invention, the polishing removal amount and the polishing linear speed in different time periods are changed in relation to each other;
fig. 6: according to the method provided by the invention, the polishing removal amount and polishing pressure in different time periods are changed in relation to each other;
fig. 7: the method provided by the invention optimizes the experimental result curve;
fig. 8: according to the method provided by the invention, the rough degree schematic diagram is polished at different lifting angles alpha in the turning road section;
fig. 9: according to the method provided by the invention, two groups of experimental data graphs of polishing pressure and polishing rotating speed gradually change along with polishing time;
Detailed Description
The invention is described in further detail below with reference to the drawings and the detailed description.
The invention provides a method for establishing a planar putty robot polishing database, which is suitable for polishing a robot device to perform putty polishing operation in a planar range, such as planar polishing of putty at a large-area side wall of a high-speed railway vehicle body, near a vehicle door and near a vehicle window. When the polishing database is established, the following method can be adopted, and comprises the following steps:
s1, determining a polishing path of plane polishing to be polished by using a programming robot, in the embodiment, determining a transverse distance of single polishing by combining the length of a polishing arm of the polishing robot, dividing the whole polishing interval into polishing intervals, and polishing in each polishing interval, as shown in fig. 1 and 2, performing polishing operation by using a transverse horizontal serpentine path, performing arc turning when the polishing head of the polishing robot horizontally advances to the end of the path, and horizontally advancing polishing in the opposite direction, so that adjacent polishing straight line sections are connected by arc polishing sections. When the arc turning polishing is carried out, one side of the polishing head is lifted at a preset angle alpha, the polishing head leaves the polishing surface, and after the path turns, the polishing head is reset at the same angle and reenters the polishing surface.
The robot control system is internally provided with vehicle body side wall structure parameters, structure diagrams and polishing heads of various specifications which can be used on site, wherein the specifications of the polishing heads comprise, but are not limited to, initial roughness (mesh number) of the polishing heads, diameter of the polishing heads and the like, and the robot control system can plan and generate a polishing route according to the vehicle body side wall structure characteristics to be polished (comprising, but not limited to, the structure of the vehicle body and the thickness, removal amount and final thickness of the putty of the paint) and the specification parameters of the polishing heads to be used, and control a polishing arm of the robot to act according to the polishing route generated by polishing. In practical application, the polishing route can be planned and generated on line and then uploaded to the robot control system, and the robot is controlled by the robot control system to perform polishing operation according to the instruction and the polishing route.
For a railway vehicle, the structural change of the longitudinal direction of the vehicle body (perpendicular to the running direction of the vehicle body) is relatively large, the polishing parameter change is also large, the polishing control is complex, and the polishing quality is not easy to control; in this embodiment, the planned polishing route in each sub-area is mainly horizontal, and is performed with serpentine reciprocating pushing polishing, and the robot drives the AOK polishing system to enter polishing operation from the left edge of the area and to right edge of the area, enter an arc turning section at a predetermined position, enter a next straight line polishing route after arc turning, push polishing to the left, enter the next straight line polishing route through the arc turning section, and circulate to complete all polishing operations of the area. When serpentine reciprocating grinding is performed, the distance between two adjacent straight grinding paths in the longitudinal direction (the distance between the center lines of the two grinding paths) is smaller than or equal to the diameter of the grinding head.
The polishing control system is communicated with the robot control system, the robot control system generates polishing parameters while planning a polishing path, the polishing parameters are transmitted to the sample polishing control system, the polishing control system controls the polishing parameters of the polishing system according to the planned path and polishing requirements, such as polishing pressure, polishing rotating speed and the like, man-machine interaction can be performed, and the polishing parameters can be manually adjusted.
Further, the polishing device further comprises a measuring tool for measuring the roughness of the polishing area and determining the polishing removal amount, and the measuring tool is used for measuring the roughness, namely measuring the thickness of the putty coating, so that the removal amount in the polishing process is determined by comparing the measured roughness with a preset standard value of the thickness of the putty of the vehicle body.
Due to the characteristics of the robot, when the polishing control system controls the polishing system to reduce the walking speed during turning, and when the polishing control system enters a polishing straight line segment after turning, the original polishing speed is restored, and when the polishing speed is reduced during turning, the polishing quality is affected. As shown in fig. 9, a large number of experiments and verification are respectively carried out on different polishing speeds and different lifting angles alpha used in the polishing process, and it is determined that under the common different polishing speeds, the value range of the lifting angle alpha is 10-40 degrees, the lifting direction can be opposite to the centripetal force generated when the polishing head turns so as to balance the centripetal force effect, and smooth transition during turning is realized, so that the selection of the lifting angle alpha is related to the polishing speed and the centripetal force generated during turning at the polishing speed.
Because when turning, the first one side of polishing points, make the plane after the bending of bight possess certain gradient, and lift the back pressure of polishing and diminish, the volume of polishing, the removal reduces, in order to improve the effect of polishing of turning road section that brings from this, in this embodiment, in the horizontal direction, possess certain overlap volume between the adjacent subregion, and the snakelike route of polishing of adjacent subregion is relative, the route of polishing of same position is on same horizontal line, the turning road section on the same horizontal line of adjacent subregion has the area of overlapping polishing, make the turning road section department carry out twice and polish, in order to balance the problem of the removal reduction of polishing that results in because the head of polishing lifts. Because the centripetal force direction of the turning road sections at the two overlapped parts is opposite, the lifting angle direction of the polishing head is returned, so that the two inclined surfaces formed by lifting the polishing head during polishing are overlapped reversely, and the plane effect is realized.
The overlapping amount of the two adjacent subareas can be obtained through calculation, and the overlapping amount is related to the diameter of the polishing head and the turning distance, as shown in fig. 1 and 2, the distance from the point of the lifting angle to the turning point when the polishing head turns is D, the diameter of the polishing head is D, and the overlapping amount m=d+d. Through a large number of experiments, in the embodiment, the distance d from the point of the lifting angle of the polishing head to the turning point is 10-60mm, the overlapping amount M is 150-210mm, and the distance d from the point of the lifting angle of the polishing head to the turning point is related to the diameter of the polishing head, so that excessive polishing during turning is avoided.
In the experimental process, the roughness of the polishing head is related to the polishing removal amount, the polishing head has large roughness and large removal amount, and the lifting angle of the polishing head during turning is also related to the removal amount, so that the value of the lifting angle alpha of the polishing head during turning is related to the roughness of the polishing head, and the larger the roughness of the polishing head is, the larger the removal amount during polishing is, and the lifting angle alpha is larger during turning.
S2, performing experiments on polishing removal amounts which change with time under different polishing parameters according to the determined polishing paths, and recording experimental data;
in this embodiment, polishing parameters that can affect polishing results are more, including but not limited to polishing pressure, polishing linear speed, polishing rotational speed, and intervals between polishing paths, taking any one of the polishing parameters as a variable, taking other polishing parameters as a constant value, adjusting experimental values of the polishing parameters as variables, respectively performing experiments, respectively measuring polishing removal amounts in different polishing time periods for each group of experiments, recording data, after the experiments are completed, replacing the polishing parameters as variables, repeating the experiments until all the polishing parameters are taken as variables one by one, and performing the experiments:
the test of the removal amount of polishing was performed using the same polishing pressure, the same polishing linear speed, and the same polishing rotational speed with the interval between the horizontal polishing paths as the test variable, in this embodiment, the intervals between the horizontal polishing paths may be 20mm, 25mm, 30mm, 35mm, 40mm, 45mm, and 50mm, respectively, and the test was performed with the above intervals, in which the sandpaper was 3m 80# ultraviolet cyclone sandpaper, and the sandpaper was replaced every test (hereinafter). After the experiment is completed, each group of experiments respectively measure the removal amount of polishing time at 5min, 10min and 15min, each group of data is recorded by N adjacent points, and the average value is obtained;
the experiment was performed with the same polishing pressure, the same polishing linear speed, and the same horizontal polishing path interval, with the polishing rotational speed as the test variable, and in this embodiment, with the polishing rotational speeds of 8000r/min, 8500r/min, 9000r/min, respectively. After the experiment is finished, each group of experiments respectively measures the removal amount of polishing time at 5min, 10min and 15min, each group of data is recorded by ten adjacent points, and the average value is obtained;
the test of the removal amount of polishing was performed using the same polishing pressure, the same polishing rotational speed, the same horizontal polishing path interval, using the polishing linear velocity as an experimental variable, and in this embodiment, the test was performed at the polishing linear velocity of 300mm/s, 350mm/s, 400mm/s, respectively. After the experiment is completed, each group of experiments respectively measure the removal amount of polishing time at 5min, 10min and 15min, each group of data is recorded by ten adjacent points, and the average value is obtained;
the polishing removal amount experiments were performed using the same polishing rotational speed, the same polishing linear speed, and the same horizontal polishing path interval with polishing pressure as an experimental variable, and in this embodiment, the polishing pressures were 50N, 60N, 70N, 80N, 90N, 100N, 110N, and 120N, respectively. After the experiment is completed, the removal amount of polishing time at 5min, 10min and 15min is measured for each group of experiments, ten adjacent points are recorded for each group of data, and the average value is obtained.
S3, respectively analyzing the change relation between the polishing removal amounts of different polishing time periods and each polishing parameter according to recorded experimental data, wherein the data analysis shows that the polishing removal amounts of different polishing time periods and each polishing parameter can be fitted into a linear relation, the intervals among horizontal polishing paths and the polishing linear speed and the polishing removal amount in the polishing parameters are in negative correlation, the polishing rotation speed and the polishing pressure and the polishing removal amount are in positive correlation, and the removal amount gradually decreases along with the increase of the polishing time.
Further, the curves of the variation relationship between the polishing removal amount and the horizontal polishing path interval in different time periods can be fitted into linear relationship, as shown in FIG. 3, when the polishing pressure is 100N, the polishing rotating speed is 8000r/min, the polishing linear speed is 300mm/s, the horizontal path interval data are adjusted, three curves can be obtained when the time periods are 5mm, 10min and 15min respectively, and the three curves can be fitted into y Fitting 1 ＝k 1 x 1 +b 1 Wherein y is Fitting 1 To the theoretical polishing removal amount x when the horizontal polishing path interval is taken as a variable 1 To confirm the independent variable in the polishing removal amount when the horizontal polishing path interval is used as the experimental variable, k is 1 Is an independent variable coefficient, negative, k is confirmed by data analysis in the embodiment 1 Can take the value of-0.0094, b 1 The values are constant, and when the polishing time is 5min, 10min, 15min, the values of b are 0.78, 0.75, 0.71, respectively, depending on the polishing time. That is, the influence of the change of the polishing time on the constant term value of the linear relation is larger, the influence on the independent variable coefficient is small, and the longer the polishing time is, the smaller the constant term value of the linear relation is, and the smaller the influence of the polishing time on the removal amount is. Wherein the error alpha 1 ＝y Practical 1 -y Fitting 1 ，y Practical 1 For the actual grinding removal amount in the experimental process, the error alpha depends on the comprehensive factors such as the deviation between the actual working condition and the theoretical working condition, the measurement error and the like. R when the change relation curves between the polishing removal amounts in different time periods and the horizontal polishing path intervals can be fitted into a linear relation 2 Near 1, high reliability and high fitting range;
as shown in FIG. 4, when the polishing pressure is 100N, the horizontal path interval is 25mm, and the polishing linear speed is 300mm/s, the polishing rotational speed is adjusted, and when the time periods are 5mm, 10min and 15min respectively, three curves can be obtained, and the three fitting curves can be summarized as y Fitting 2 ＝k 2 x 2 +b 2 Wherein y is Fitting 2 To the theoretical polishing removal amount x when the polishing rotational speed is used as a variable 2 K is an independent variable for confirming the polishing removal amount when the polishing rotational speed is used as a variable 2 The independent variable coefficient is positive, and can take the value of 0.00009 or 0.0001, b 2 Is constant and depends on the polishing time. Since the self-variable value is large, the minor change of the self-variable coefficient cannot be ignored, the k value and the b value are determined by polishing time, and when the polishing time is 5min, 10min and 15min, the b value is-0.21, -0.17 and-0.29 respectively. Wherein the error alpha 2 ＝y Practical 2 -y Fitting 2 ，y Practical 2 For removing the error alpha of the quantity of actual polishing in the experimental process 2 The magnitude depends on the comprehensive factors such as deviation between the actual working condition and the theoretical working condition, measurement error and the like. The change relation curves between the removal amount and the polishing rotating speed in different time periods can be fitted into linear relation, R2 is close to 1, reliability is high, and fitting degree is high;
the change relation curves between the removal amount and the polishing linear speed in different time periods can be fitted into a linear relation, as shown in fig. 5, when the polishing pressure is 100N, the horizontal path interval is 25mm, the polishing linear speed is adjusted when the rotation speed is 8000r/min, and three curves can be obtained when the time periods are 5mm, 10min and 15min respectively, wherein the three fitting curves can be summarized as follows: y is Fitting 3 ＝k 3 x 3 +b 3 Wherein y is Fitting 3 To the theoretical polishing removal amount x when the linear polishing speed is used as a variable 3 K is an independent variable for confirming the polishing removal amount when the linear polishing speed is used as a variable 3 The independent variable coefficient is negative, and the independent variable coefficient can be respectively-0.001, -0.0011, -0.0012 and b 3 Is constant, depending on the polishing time, b in this embodiment 3 The values were 0.85, 0.86, 0.82, respectively. Wherein the error alpha 3 ＝y Actual 3 -y Fitting 3 ，y Actual 3 For removing the error alpha of the quantity of actual polishing in the experimental process 3 The magnitude depends on the comprehensive factors such as deviation between the actual working condition and the theoretical working condition, measurement error and the like. The change relation curves between the removal amount and the polishing linear speed in different time periods are all fitted into a linear relation, R 2 Near 1, high reliability and high fitting degree;
the curves of the variation relationship between the polishing removal amount and the polishing pressure in different time periods can be fitted into a linear relationship, as shown in FIG. 6, when the linear speed is 300mm/s, the horizontal path interval is 25mm, and the rotating speed is 8000r/min, three curves can be obtained when the time periods are 5mm, 10min and 15min respectively, and the three fitted curves can be summarized as y Fitting 4 ＝k 4 x 4 +b 4 Wherein y is Fitting 4 By grinding pressureTheoretical polishing removal amount at variable, x 4 K is an independent variable for confirming the polishing removal amount when polishing pressure is used as a variable 4 Is an independent variable coefficient, is a positive number, and is k 4 The values can be respectively 0.0041, 0.0042 and 0.0043, and when the polishing time is 5min, 10min and 15min, the values of b are respectively 0.14, 0.10 and 0.01. Wherein the error alpha 4 ＝y Practical 4 -y Fitting 4 ，α 4 The magnitude depends on the comprehensive factors such as deviation between the actual working condition and the theoretical working condition, measurement error and the like. The change relation curve between the polishing removal amount and the polishing linear speed in different time periods can be fitted into a linear relation, R 2 Near 1, high reliability and high fitting degree.
And respectively analyzing the influence of the horizontal polishing path interval, the polishing pressure, the polishing rotating speed and the polishing linear speed on the removal amount of different polishing time periods. And (3) conclusion is drawn: the polishing pressure has the greatest influence on the polishing removal amount and has no influence on polishing efficiency; the linear polishing speed has small influence on the polishing removal amount and has large influence on the polishing efficiency; the polishing rotation speed has little influence on the polishing removal amount and has no influence on polishing efficiency; the polishing path has great influence on the polishing removal amount and the polishing efficiency; as polishing proceeds, the amount of polishing removal under different conditions gradually decreases.
S4, combining the polishing removal amounts of different polishing time periods and the variation relation among the polishing parameters, carrying out an optimization experiment of a planar putty robot polishing method by taking the polishing removal amounts as a processing purpose, establishing the correlation between the polishing parameters and the polishing results along with the time variation, and establishing a planar putty robot polishing database.
After comprehensively considering four parameters, combining the change relation between the removal quantity and the single independent variable, and confirming to ensure consistent front-back quality:
y＝k 1 x 1 +b 1 +α 1 ＝k 2 x 2 +b 2 +α 2 ＝k 3 x 3 +b 3 +α 3 ＝…，
and k, b and alpha are independent variable coefficients, constant terms and error values of the linear fitting relation corresponding to the time periods respectively. The automatic polishing method of the high-speed railway car body plane putty robot is optimized and verified, a certain polishing efficiency is ensured, meanwhile, a stable polishing removal amount is controlled, and the polishing pressure and the polishing rotating speed have no influence on the polishing efficiency, so that in order to simplify the experimental process, only the combination relation between two independent variables of time and polishing pressure, time and polishing rotating speed is considered in the embodiment, namely, in the polishing process, the same polishing removal amount is ensured to be obtained by adjusting the polishing pressure or the polishing rotating speed, and in the optimization experiment, the consistent polishing removal amount before and after the polishing removal amount is ensured without influencing the processing efficiency. To integrate the above-mentioned relational deduction, in order to guarantee a consistent polishing removal amount, when only the polishing rotational speed is changed:
y＝0.00009x 1 -0.2117＝0.00009x 2 -0.1747+α＝0.0001x 3 -0.2875+α 1 ＝ …，
when only the polishing pressure is changed:
y＝0.0041x 1 +0.1436＝0.0042x 2 +0.1003+α＝0.0043x 3 +0.0099+α 1 = …, where x 1 、x 2 、x 3 … is the independent variable value of different time periods. As shown in FIG. 7, when the polishing time is 0-5 min, the polishing pressure is increased by 0-8N or the polishing rotation speed is increased by 0-300 r/min based on the initial parameters; when the polishing time is 5-10 min, on the basis of initial parameters, the polishing pressure is increased by 8-20N, or the polishing rotating speed is increased by 300-600 r/min; when the polishing time is 10-15 min, the polishing pressure is increased by 20-40N or the polishing rotating speed is increased by 600-1000 r/min on the basis of the initial parameters, and the polishing removal amount is relatively constant.
And taking the polishing removal amount as a reference for processing purposes, dividing polishing quality and polishing efficiency of other comprehensive parameter groups, establishing correlation between polishing conditions and polishing results, and establishing a high-speed railway car body plane putty robot polishing database for meeting different working condition states and processing requirements.
In summary, the method for establishing the planar putty robot polishing database provided by the invention has the following technical advantages compared with the prior art:
1. the relation between the polishing parameters and the polishing quality can be determined, so that the work of repeatedly polishing the high-speed rail car body plane putty can be efficiently performed on the premise of meeting the polishing quality;
2. the variable parameters are few, the database establishment method is simple and convenient, and the application range is wide.
3. In the turning section of the polishing path, the polishing head is lifted at a certain angle, and the necessary centripetal force of the polishing head rotating at a high speed is provided when the polishing head turns, so that the polishing head does not need to be decelerated when turning;
4. the turning paths have a certain overlapping amount, and the polishing areas at the turning positions are repeatedly polished, so that the polishing quality is improved;
5. the polishing head is lifted at a certain angle, so that the polishing amounts of the two sides of the polishing head are different, the light and heavy polishing amounts of the two polishing at the overlapped part are reversely overlapped, excessive polishing is avoided, and the polishing quality is further improved.
As mentioned above, similar technical solutions can be derived in combination with the presented solution content. However, any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present invention still fall within the scope of the technical solution of the present invention.
Claims (10)
1. A method for establishing a plane putty robot polishing database is characterized by comprising the following steps of: comprises the following steps of the method,
s1, determining a polishing path, performing arc turning when a polishing head of a polishing robot horizontally advances to the end of the path, performing reverse horizontal propulsion polishing, lifting one side of the polishing head by a preset angle when performing arc turning polishing, resetting by the same angle after the path turns, and re-entering the polishing surface; the turning sections on the same horizontal line of the adjacent polishing subareas are provided with overlapping areas, so that the turning sections are polished twice;
s2, testing the polishing removal quantity which changes with time under different polishing parameters according to the determined polishing paths, and recording test data;
s3, respectively analyzing the change relation between the polishing removal amount and each polishing parameter in different polishing time periods according to the recorded test data;
s4, combining the polishing removal amounts of different polishing time periods with the change relation between each polishing parameter, carrying out an optimization experiment of a planar putty robot polishing method by taking the polishing removal amounts as a processing purpose, establishing the correlation between the polishing parameters and polishing results along with the change of time, and establishing a planar putty robot polishing database.
2. A method of creating a flat putty robot sanding database as set forth in claim 1 and further comprising: in step S2, one of the polishing parameters is sequentially used as a variable, the other polishing parameters are constant, test values of the polishing parameters serving as the variable are adjusted, tests are respectively performed, polishing removal amounts in different polishing time periods are respectively measured in each group of tests, and each group of data is recorded by using N adjacent points.
3. A method of creating a flat putty robot sanding database as set forth in claim 1 and further comprising: in step S3, the linear relation between the polishing removal amount and the polishing parameters in different time periods is respectively analyzed and determined according to the recorded test data.
4. A method of creating a flat putty robot sanding database as set forth in claim 3 and further characterized by: the polishing path interval, the polishing linear speed and the polishing removal amount in the polishing parameters are in a negative correlation, the polishing rotation speed, the polishing pressure and the polishing removal amount are in a positive correlation, and the polishing removal amount is gradually reduced along with the increase of polishing time.
5. A method of creating a flat putty robot sanding database as set forth in claim 3 and further characterized by: variation between sanding removal amount and sanding path spacing for different time periodsThe chemical relationship curve can be fit to y Fitting 1 ＝kx 1 +b 1 Wherein y is Fitting 1 Theoretical removal amount x increased along with polishing time under the condition that polishing path interval is variable and other polishing parameters are constant 1 Independent variable k when the polishing path interval is used as variable 1 Is an independent variable coefficient, a negative number, b 1 Is a constant related to the polishing time.
6. A method of creating a flat putty robot sanding database as set forth in claim 3 and further characterized by: the change relation curve between the polishing removal amount and the polishing rotating speed in different time periods can be fit into y Fitting 2 ＝kx 2 +b 2 Wherein y is Fitting 2 Theoretical removal amount x increased along with polishing time under the condition that polishing rotational speed is variable and other polishing parameters are constant 2 For independent variable k when the polishing rotational speed is used as variable 2 Is an independent variable coefficient, a positive number, b 2 Is a constant related to the polishing time.
7. A method of creating a flat putty robot sanding database as set forth in claim 3 and further characterized by: the change relation curve between the polishing removal amount and the polishing linear speed in different time periods can be fit into y Fitting 3 ＝kx 3 +b 3 Wherein y is Fitting 3 Theoretical removal amount x increased along with polishing time under the condition that polishing linear speed is variable and other polishing parameters are constant 3 For independent variable k when linear speed of polishing is used as variable 3 Is an independent variable coefficient, a negative number, b 3 Is a constant related to the polishing time.
8. A method of creating a flat putty robot sanding database as set forth in claim 3 and further characterized by: the change relation curve between the polishing removal amount and polishing line pressure in different time periods can be fit to y Fitting 4 ＝kx 4 +b 4 Wherein y is Fitting 4 Theoretical removal with polishing time under the condition that polishing pressure is variable and other polishing parameters are constantQuantity of x 4 K is the independent variable when polishing the pressure variable 4 Is an independent variable coefficient, a positive number, b 4 Is a constant related to the polishing time.
9. A method of creating a flat putty robot sanding database as set forth in any one of claims 1 to 8 and further characterized by: in step S3, the influence of polishing parameters on polishing removal amounts in different polishing time periods is analyzed by using recorded experimental data.
10. A method of creating a flat putty robot sanding database as set forth in claim 9 and further comprising: in step S4, according to the obtained influence of the polishing parameters on the polishing removal amounts in different polishing time periods, only the polishing parameters which have no influence on the polishing efficiency are considered for performing an optimization test.
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