CN113823185A

CN113823185A - Electronic device

Info

Publication number: CN113823185A
Application number: CN202010565270.2A
Authority: CN
Inventors: 洪文彬
Original assignee: Individual
Current assignee: Innolux Corp
Priority date: 2020-06-19
Filing date: 2020-06-19
Publication date: 2021-12-21
Anticipated expiration: 2040-06-19
Also published as: CN113823185B; CN117055256A

Abstract

The invention discloses an electronic device, which comprises a panel, a circuit board and a light shielding element. The panel comprises a side surface, and the side surface is provided with a first area and a second area. The circuit board is fixed to the first area of the side surface and comprises an upper surface. The light shielding member is fixed to the second region of the side surface and the upper surface of the circuit board.

Description

Electronic device

Technical Field

The present invention relates to an electronic device. More particularly, the present invention relates to an electronic device having a panel.

Background

Nowadays, electronic devices with display panels (such as display screens of televisions, notebook computers or smart phones) are mostly developed towards large screens and narrow frames. However, the electronic device may have a narrow frame, which may cause light leakage at the edge of the electronic device. Therefore, how to solve the above problems is an important issue.

Disclosure of Invention

In order to solve the above-mentioned problems, the present invention provides an electronic device, which includes a panel, a circuit board, and a light shielding element. The panel comprises a side surface, and the side surface is provided with a first area and a second area. The circuit board is fixed to the first area of the side surface and comprises an upper surface. The light shielding member is fixed to the second region of the side surface and the upper surface of the circuit board.

Drawings

FIG. 1 is a diagram of an electronic device according to an embodiment of the invention;

FIG. 2 is a diagram of an electronic device according to another embodiment of the invention;

FIG. 3 is a schematic diagram of the connection of a panel to a circuit board in some embodiments;

FIG. 4 is a schematic diagram of a light-shielding layer in some embodiments of the invention.

Description of the symbols

100 backlight module

110 frame body

111: base plate

112 side wall

120 light emitting element

130 optical film

200 lower polarizer

300: panel

301 upper surface of panel

302 side surface of panel

310 line assembly

311 base plate

312 line layer

312A conductive layer

312B conductive layer

320 filtering component

321 glass substrate

322 color filter layer

323 a light-shielding layer

340 PI layer

350 planarization layer

400 engaging element

500 upper polarizer

501 side of upper polarizer

600: circuit board

601 upper surface of circuit board

602 outer surface of circuit board

610: body

620 pin

700 light shielding element

800 shielding element

900 conductive element

910 conductive adhesive

920 anisotropic conductive film

A1 first region

A2 second region

B barrier element

E electronic device

F1 first filter layer

F2 second filter layer

G is a groove

Detailed Description

The electronic device according to the embodiment of the present invention is described below. It should be appreciated, however, that the embodiments of the invention provide many applicable concepts that can be embodied in a wide variety of specific contexts. The specific embodiments disclosed are merely illustrative of specific ways to make and use the invention, and do not delimit the scope of the invention.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Referring to fig. 1, an electronic device E according to an embodiment of the invention mainly includes a backlight module 100, a lower polarizer 200, a panel 300, a bonding element 400, an upper polarizer 500, a circuit board 600, a light shielding element 700, and a shielding element 800. The backlight module 100 can provide light into the panel 300, and the panel 300 can control the light output amount of the light, so that the electronic device E can display different images. The electronic device E may include, for example, a Thin film transistor liquid crystal display (TFT-LCD), and may be applied to a Public Information Display (PID), a television (television), a display screen (monitor), a notebook computer (notebook PC), a smart phone (smart phone), or a smart watch (smart watch), but is not limited thereto.

As shown in fig. 1, the backlight module 100 is a direct-type backlight (direct-type backlight), and may include, but is not limited to, a frame 110, at least one light emitting element 120, and an optical film 130. Wherein the frame body 110 includes a bottom plate 111 and a sidewall 112 connected to each other. The light emitting element 120 is disposed on the bottom plate 111, and the sidewall 112 surrounds the light emitting element 120. The optical film 130 is disposed on the sidewall 112 and spaced apart from the light emitting device 120 by a distance. The optical film 130 may include one or more optical films, such as a brightness enhancement film (brightness film), a prism sheet (prism film), a diffuser film (diffuser film), a diffuser plate (diffuser plate), and the like, but is not limited thereto. The light emitting element 120 may include, for example, a light-emitting diode (LED), a lamp tube such as a Cold Cathode Fluorescent Lamp (CCFL), or other suitable light source, and the light emitting element 120 may emit light toward the optical film 130, and the light may penetrate through the optical film 130 and enter the panel 300. The Light Emitting Diode may include, for example, an Organic Light-Emitting Diode (OLED), a submillimeter Light-Emitting Diode (mini LED), a micro LED (micro LED), or a Quantum dot Light-Emitting Diode (QLED or QD-LED), but is not limited thereto. It should be noted that the backlight module in the invention can also be a side-light type backlight module (side-light). One of the differences between the edge-type backlight module and the direct-type backlight module is that the edge-type backlight module has an extra light guide plate (light guide plate), and the light emitting elements 120 are disposed in the vicinity of at least one side surface of the light guide plate.

As shown in fig. 1, the panel 300 may be fixed to the backlight module 100 by the joint element 400, and the lower polarizer 200 may be disposed between the panel 300 and the backlight module 100. The bonding element 400 may be, for example, a sticky adhesive, but is not limited thereto. The light provided by the light emitting device 120 can enter the panel 300 after passing through the light film 130 and/or the lower polarizer 200.

The panel 300 includes a wiring assembly 310 and a filter assembly 320. The circuit assembly 310 is disposed between the filter assembly 320 and the backlight module 100, and includes a substrate 311 and a circuit layer 312, wherein the substrate 311 may be a glass substrate, a sapphire substrate or other suitable substrate, the circuit layer 312 is disposed on a surface of the glass substrate 311 facing the filter assembly 320, and the circuit layer 312 may include conductive wires made of a metal material (e.g., aluminum, copper or alloy thereof) and/or a transparent conductive material (e.g., indium tin oxide). The filter element 320 includes a glass substrate 321, a color filter layer 322, and a light-shielding layer 323, wherein the color filter layer 322 and the light-shielding layer 323 are disposed on a surface of the glass substrate 321 facing the circuit element 310. In the present embodiment, the light-shielding layer 323 is a black matrix (black matrix) having a grid structure, and the color filter layer 322 is surrounded by the light-shielding layer 323. More specifically, the color filter layer 322 may include a plurality of small filter layers (not shown) corresponding to a plurality of colors, respectively, and the positions of the different small filter layers correspond to different grids within the black matrix layer, respectively.

The upper polarizer 500 is also disposed on the glass substrate 321 of the filter assembly 320, except that the upper polarizer 500 is disposed on a surface opposite to the surface on which the color filter layer 322 and the light-shielding layer 323 are disposed. In other words, as shown in FIG. 1, the upper polarizer 500 is disposed on the upper surface 301 of the panel 300.

The circuit board 600 is fixed to the side surface 302 of the panel 300 and electrically connected to the wiring layer 312 of the panel 300. The side surface 302 is connected to the upper surface 301 and may be divided into a first area a1 and a second area a2, and in detail, a portion of the side surface 302 of the panel 300 that overlaps the circuit board 600 in a normal direction of the side surface 302 (e.g., in the X direction of fig. 1) is divided into a first area a1, and a portion that does not overlap the circuit board 600 in the normal direction is divided into a second area a 2. Since the second area a2 is not shielded by the circuit board 600 and there is a gap between the connection point of the upper surface 301 and the side surface 302 and the upper polarizer 500, part of the light entering the panel 300 leaves the electronic device E from the second area a2 or the gap after multiple reflections, resulting in light leakage at the edge of the electronic device E.

To improve the above, light shielding element 700 may be fixed to upper surface 601 of circuit board 600 and second area a2 of side surface 302 of panel 300 and extended to upper polarizer 500 (more specifically, to side 501 of upper polarizer 500) to shield second area a2 and the gap between edges of upper polarizer 500 and panel 300. Thus, the phenomenon that the light leaves the electronic device E from the position can be reduced.

In the present embodiment, the circuit board 600 is not completely opaque, and therefore the light shielding element 700 may be extended and fixed to the outer surface 602 of the circuit board 600, so the outer surface 602 refers to the surface of the circuit board 600 in the direction away from the panel 300. It should be noted that, by extending and fixing the light shielding element 700 to the outer surface 602 of the circuit board 600, the contact area between the light shielding element 700 and the circuit board 600 can be increased, and the light shielding element 700 can be fixed more firmly. It should be noted that, in some embodiments of the invention, the circuit board 600 may be a Flexible Printed Circuit (FPC) used in a Chip On Film (COF) structure, but is not limited thereto. In some embodiments, the circuit board 600 may be a Printed Circuit Board (PCB) generally including epoxy (epoxy) and having high hardness, or a combination of a flexible circuit board and a PCB.

In the present embodiment, the light shielding element 700 may include a photo-curing adhesive or a thermal curing adhesive, such as an ultraviolet curing adhesive (UV adhesive) based on acryl, but is not limited thereto.

Referring to fig. 1, the shielding element 800 may be connected to the frame 110 of the backlight module 100 and surround the panel 300 and the backlight module 100. Since the light transmittance of the shielding element 800 is low, light leakage from the area of the circuit board 600 adjacent to the backlight module 100 will be reduced, and therefore the light shielding element 700 does not necessarily need to extend to the area of the circuit board 600 adjacent to the backlight module 100. That is, in the present embodiment, a portion of the outer surface of the circuit board 600 is exposed from the light shielding element 700.

In addition, it should be noted that, in order to reduce the invisible area of the edge of the electronic device E to achieve a narrow frame, the shielding element 800 may not extend above the upper polarizer 500. In other words, the upper polarizer 500 and the shielding member 800 are separated and do not overlap when viewed from the normal direction (Z-axis direction) of the upper polarizer 500.

In the present embodiment, the shielding element 800 includes a flexible soft material, such as a polyester resin (mylar), a light shielding tape (light shielding tape), or a metal or plastic material with high hardness, but is not limited thereto.

Referring to FIG. 2, in another embodiment of the present invention, the upper polarizer 500 has a larger size, and the side 501 of the upper polarizer is substantially aligned with the side surface 302 of the panel 300. In this embodiment, the light shielding element 700 will not extend to the upper surface 301 of the panel 300, but is directly fixed to the side 501 of the upper polarizer 500, the second area a2 of the side surface 302 of the panel 300, and the upper surface 601 and the outer surface 602 of the circuit board 600.

It should be noted that, in the Z-axis direction, the light shielding member 700 is more protruded than the upper surface 301 of the panel 300 to reduce the light leakage from the corners of the panel 300.

Referring to fig. 3 and 4, fig. 3 is a schematic diagram illustrating the connection between the panel 300 and the circuit board 600 according to some embodiments. FIG. 4 illustrates a schematic view of a light-shielding layer in some embodiments of the inventions. As shown in fig. 3, the circuit board 600 has a body 610 and a lead 620, and the conductive member 900 may connect the lead 620 and the wiring layer 312 of the panel 300 so that the circuit board 600 is electrically connected to the panel 300. The conductive element 900 may include, for example, a conductive paste 910, an Anisotropic Conductive Film (ACF) 920, other suitable conductive materials, or a combination thereof.

Near the connection with the conductive element 900, the wiring layer 312 may include a conductive layer or a stack of conductive layers (e.g.,

conductive layers

312A and 312B in fig. 3), both of which may be connected to the conductive element 900. In addition, the panel 300 may further include, but is not limited to, an insulating layer 330, a PI (polyimide layer)340, and a planarization layer 350. Wherein the insulating layer 330 may be disposed between the PI layer 340 and the conductive layer 312B, but is not limited thereto.

The filter assembly 320 of the panel 300 is fixed to the circuit assembly 310 by a paste member H, wherein the paste member H may include, but is not limited to, a sealing adhesive (Sealant) of the panel 300. Between the paste member H and the circuit board 600, a blocking member B may be included to reduce the flow of the paste member H from the side surface 302 of the panel 300. The blocking element B may be, for example, a photo spacer (photo spacer), but is not limited thereto. In some embodiments, the blocking element B may not be present.

As shown in fig. 4, the light-shielding layer 323 in the panel 300 is spaced apart from the side surface 302 of the panel 300 or a groove G extending along the Y-axis direction is formed to reduce the introduction of moisture into the electronic device E by the light-shielding layer 323. Since light may pass through the gap or the groove G between the light-shielding layer 323 and the side surface 302. Therefore, in order to further reduce the edge light leakage of the electronic device E, in some embodiments, one or more filter layers may be disposed between the light shielding layer 323 and the circuit board 600, as shown in fig. 3.

For example, as shown in fig. 3, but not limited to, a first filter layer F1 and a second filter layer F2 may be disposed between the light shielding layer 323 and the circuit board 600 and arranged along the Z-axis direction such that the first filter layer F1 is located between the second filter layer F2 and the circuit component 310. By the arrangement of the first filter layer F1 on the second filter layer F2, most of the light is filtered when passing through the gap between the light shielding layer 323 and the circuit board 600, so that the light leakage at the edge of the electronic device E is reduced. In some embodiments, the first filter layer F1 includes a blue filter, and the second filter layer F2 includes a red filter. However, the combination of the filter layers is merely an example, and the number and the color order of the filter layers are not limited thereto in the present invention.

The number of the circuit boards 300 disposed on the side surface 302 of the panel 300 may be one or more, when the electronic device E includes a plurality of circuit boards 600, the circuit boards 600 may be disposed at intervals, and one or more sheet-like elements may be disposed between the circuit boards 600, so that the electronic device E can be kept as flat as possible on the side where the circuit boards 600 are disposed.

Features of the foregoing embodiments may be combined in any suitable manner without departing from the spirit or ambit of the invention.

In summary, the present invention provides an electronic device including a panel, a circuit board, and a light shielding element. The panel comprises a side surface, and the side surface is provided with a first area and a second area. The circuit board is fixed to the first area of the side surface and comprises an upper surface. The light shielding member is fixed to the second region of the side surface and the upper surface of the circuit board.

Although the foregoing embodiments and their advantages have been disclosed, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, but it is to be understood that any process, machine, manufacture, composition of matter, means, method and steps, presently existing or later to be developed, that will be obvious to one skilled in the art from this disclosure may be utilized according to the present application as many equivalents of the presently available embodiments of the present application are possible and equivalents may be developed in that the specific embodiments described herein are capable of performing substantially the same function or achieve substantially the same result. Accordingly, the scope of the present application includes the processes, machines, manufacture, compositions of matter, means, methods, and steps described above. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present invention also includes combinations of the respective claims and embodiments.

While the invention has been disclosed in connection with several preferred embodiments, there is no intent to limit it to those embodiments. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the protection scope of the present invention should be subject to the definition of the appended claims. Furthermore, each claim constitutes a separate embodiment, and combinations of various claims and embodiments are within the scope of the invention.

Claims

1. An electronic device, comprising:

a panel including a side surface, the side surface having a first region and a second region;

a circuit board fixed to the first region of the side surface and including an upper surface; and

a light shielding element secured to the second region of the side surface and the upper surface of the circuit board.

2. The electronic device of claim 1, wherein the panel comprises an upper surface, and the light shielding element is affixed to the upper surface of the panel.

3. The electronic device of claim 1, further comprising an upper polarizer disposed on the panel, wherein the light shielding element is secured to the upper polarizer.

4. The electronic device of claim 1, wherein the circuit board includes an outer surface, and the light shielding element is secured to the outer surface of the circuit board.

5. The electronic device of claim 4, wherein the circuit board includes an outer surface, and a portion of the outer surface of the circuit board is exposed from the light shielding element.

6. The electronic device of claim 1, wherein the panel comprises an upper surface, and the first region is coupled to the upper surface of the panel.

7. The electronic device of claim 1, further comprising an upper polarizer disposed on the panel, wherein the upper polarizer has a side surface aligned with the side surface of the panel.

8. The electronic device of claim 7, wherein the panel comprises an upper surface, the upper polarizer is disposed on the upper surface of the panel, and the light shielding element protrudes more than the upper surface of the panel.

9. The electronic device of claim 1, further comprising a shielding element surrounding the panel, the light shielding element being disposed between the panel and the shielding element.

10. The electronic device according to claim 9, further comprising an upper polarizer disposed on the panel, wherein the upper polarizer and the shielding member are separated from each other when viewed in a normal direction of the upper polarizer.

11. The electronic device of claim 1, further comprising a conductive element, wherein the panel comprises a wiring layer, and the circuit board is electrically connected to the wiring layer through the conductive element.

12. The electronic device of claim 11, wherein the circuit layer comprises a plurality of conductive layers.

13. The electronic device of claim 11, wherein the conductive elements comprise conductive glue and anisotropic conductive film.

14. The electronic device of claim 1, wherein the panel comprises:

a line component;

a filter assembly;

the pasting element is arranged between the circuit component and the filtering component and is fixedly connected to the circuit component and the filtering component; and

and the blocking element is arranged between the circuit component and the filtering component and between the pasting element and the circuit board.

15. The electronic device of claim 1, wherein the panel comprises an opacifying layer and a first filter layer, and the first filter layer is disposed between the opacifying layer and the circuit board.

16. The electronic device of claim 15, wherein the panel further comprises a circuit component and a second filter layer, the second filter layer being disposed between the opacifying layer and the circuit board, and the first filter layer being disposed between the second filter layer and the circuit component.

17. The electronic device of claim 1, further comprising a plurality of circuit boards and at least one sheet member disposed between the circuit boards.

18. The electronic device of claim 1, comprising a backlight module and a bonding element, wherein the bonding element is disposed between the backlight module and the panel, and the panel is fixed to the backlight module by the bonding element.

19. The electronic device of claim 1, comprising a lower polarizer disposed between the backlight module and the panel.

20. The electronic device of claim 1, wherein the light shielding element comprises a photo-curable gel or a thermally curable gel.