CN113809116B - Display substrate, preparation method thereof and display device - Google Patents

Display substrate, preparation method thereof and display device Download PDF

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Publication number
CN113809116B
CN113809116B CN202111087114.0A CN202111087114A CN113809116B CN 113809116 B CN113809116 B CN 113809116B CN 202111087114 A CN202111087114 A CN 202111087114A CN 113809116 B CN113809116 B CN 113809116B
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China
Prior art keywords
substrate
layer
display
color
display substrate
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CN202111087114.0A
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CN113809116A (en
Inventor
吕彤
高栋雨
仝勋飞
聂汉
赵根
黄璟伟
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BOE Technology Group Co Ltd
Chongqing BOE Display Technology Co Ltd
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BOE Technology Group Co Ltd
Chongqing BOE Display Technology Co Ltd
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Priority to CN202111087114.0A priority Critical patent/CN113809116B/en
Publication of CN113809116A publication Critical patent/CN113809116A/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials

Abstract

The application discloses a display substrate, a preparation method thereof and a display device, which are used for improving the display effect and the service life of a display product. The embodiment of the application provides a display substrate, the display substrate includes: a first substrate and a second substrate disposed opposite to each other; the surface of one side of the first substrate, which is away from the second substrate, is a light-emitting surface of the display substrate; the first substrate includes: the LED display device comprises a first substrate, a plurality of color resistors and a plurality of micro inorganic light emitting diodes, wherein the color resistors are positioned on one side of the first substrate facing to the second substrate; the second substrate includes: a second substrate, a pixel defining layer located on one side of the second substrate facing the first substrate and having a recess, and a photoluminescent layer located in at least part of the recess; the luminescent color of the photoluminescent layer is the same as the color of the color resistor.

Description

Display substrate, preparation method thereof and display device
Technical Field
The application relates to the technical field of display, in particular to a display substrate, a preparation method thereof and a display device.
Background
The quantum dot is a nano semiconductor material with a core-shell structure, and can emit light with specific frequency after certain light or voltage is applied, wherein the frequency of the light is related to the size of the quantum dot. The quantum dot has the advantages of narrow emission spectrum, wide color adjustable range, wide color gamut and long fluorescence life, and the solution preparation process of the quantum dot can be processed in liquid-based modes such as ink-jet printing, has high material utilization rate, low manufacturing cost and wide application prospect. At present, quantum dots are generally applied to organic light-emitting diode display products, but are limited by the service life of the organic light-emitting diode, and cannot exert the advantages of long service life, and cannot realize high-color-gamut and long-service-life display.
Disclosure of Invention
The embodiment of the application provides a display substrate, a preparation method thereof and a display device, which are used for improving the display effect and the service life of a display product.
The embodiment of the application provides a display substrate, the display substrate includes: a first substrate and a second substrate disposed opposite to each other; the surface of one side of the first substrate, which is away from the second substrate, is a light-emitting surface of the display substrate;
the first substrate includes: the LED display device comprises a first substrate, a plurality of color resistors and a plurality of micro inorganic light emitting diodes, wherein the color resistors are positioned on one side of the first substrate facing to a second substrate;
the second substrate includes: a second substrate, a pixel defining layer located on one side of the second substrate facing the first substrate and having a recess, and a photoluminescent layer located in at least part of the recess; the luminescent color of the photoluminescent layer is the same as the color of the color resistor.
In some embodiments, the second substrate further comprises: a reflective layer covering the bottom and sides of the recess;
the photoluminescent layer is positioned on one side of the reflective layer facing away from the second substrate.
In some embodiments, the display substrate further comprises: and an adhesive layer between the first substrate and the second substrate.
In some embodiments, the adhesive layer covers the pixel defining layer and the photoluminescent layer;
the first substrate and the second substrate are connected through an adhesive layer in the region of the pixel definition layer outside the groove;
the distance between the micro inorganic light emitting diode and the bonding layer is larger than zero.
In some embodiments, the adhesive layer is a transparent adhesive layer.
In some embodiments, the adhesive layer comprises: acrylate, ultraviolet initiator, epoxy resin, curing agent, filling material, wetting agent, thixotropic imparting agent, anti-aging agent and spacer.
In some embodiments, the front projection of the micro-inorganic light emitting diode on the first substrate falls within the front projection of the groove on the first substrate;
the orthographic projection of the groove on the first substrate falls into the orthographic projection of the color resistor on the first substrate.
In some embodiments, the thickness of the photoluminescent layer is less than the depth of the grooves in a direction perpendicular to the second substrate base plate;
the recess accommodates a micro-inorganic light emitting diode.
In some embodiments, the photoluminescent layer comprises quantum dots.
In some embodiments, the plurality of micro-inorganic light emitting diodes are all blue micro-inorganic light emitting diodes;
the plurality of color resists includes: a plurality of red resistors, a plurality of blue resistors, and a plurality of green resistors;
the photoluminescent layer includes: a red photoluminescent layer excited by blue light to emit red light, and a green photoluminescent layer excited by blue light to emit green light;
the red photoluminescent layer is positioned in the groove corresponding to the red color resistor, and the green photoluminescent layer is positioned in the groove corresponding to the green color resistor.
In some embodiments, a surface of the photoluminescent layer facing the first substrate side has a concave-convex shape.
In some embodiments, the first substrate further comprises: and a plurality of binding electrodes between the color resistors and the micro inorganic light emitting diodes, and signal lines electrically connected with the binding electrodes.
In some embodiments, the bonding electrode is a transparent electrode.
In some embodiments, the first substrate further comprises: a light shielding portion located between the color resists;
the signal wire is positioned at one side of the shading part, which is far away from the first substrate, and the orthographic projection of the shading part on the first substrate covers the orthographic projection of the signal wire on the first substrate.
In some embodiments, the front projection of the light shielding portion on the first substrate and the front projection of the signal line on the first substrate are both within the front projection of the first substrate in a region outside the groove of the pixel defining layer.
In some embodiments, the front projection area of the micro inorganic light emitting diode on the first substrate is greater than or equal to 5 micrometers and less than or equal to 20 micrometers, and the front projection area of the color resistance on the first substrate is greater than or equal to 100 micrometers and less than or equal to 200 micrometers.
In some embodiments, the second substrate is a flexible substrate.
The preparation method of the display substrate provided by the embodiment of the application comprises the following steps:
manufacturing a first substrate, specifically including:
forming a plurality of color resists on one side of a first substrate;
a plurality of miniature inorganic light emitting diodes are arranged on one side of the color resistor, which is away from the first substrate;
manufacturing a second substrate, specifically including:
forming a pixel definition layer on one side of the second substrate, and forming grooves corresponding to the color resistances one by one on the pixel definition layer by adopting a patterning process;
forming a photoluminescent layer within at least a portion of the recess;
and bonding the first substrate and the second substrate.
The display device provided by the embodiment of the application comprises the display substrate provided by the embodiment of the application.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a display substrate according to an embodiment of the present application;
FIG. 2 is a schematic diagram of another display substrate according to an embodiment of the present disclosure;
fig. 3 is a flow chart of a method for manufacturing a display substrate according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present application. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present application. And embodiments and features of embodiments in this application may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art without the benefit of the present disclosure, are intended to be within the scope of the present application based on the described embodiments.
Unless otherwise defined, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The terms "first," "second," and the like, as used herein, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.
It should be noted that the dimensions and shapes of the various figures in the drawings do not reflect true proportions, and are intended to illustrate the present application only. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
The embodiment of the application provides a display substrate, as shown in fig. 1, the display substrate specifically includes: a first substrate 1 and a second substrate 2 disposed opposite to each other; the surface of the first substrate 1 on the side away from the second substrate 2 is a light emergent surface 10 of the display substrate;
the first substrate 1 includes: a first substrate 3, a plurality of color resistors 4 positioned on the side of the first substrate 3 facing the second substrate 2, and a plurality of micro-inorganic light emitting diodes 5 positioned on the side of the color resistors 4 facing away from the first substrate 3;
the second substrate 2 includes: a second substrate 6, a pixel defining layer 8 on a side of the second substrate 6 facing the first substrate 1 and having a recess 7, and a photoluminescent layer 9 located at least partially within the recess 7; the grooves 7 are in one-to-one correspondence with the color resistors 4, and the luminous color of the photoluminescent layer 9 is the same as the color of the color resistors 4.
According to the display substrate provided by the embodiment of the application, the photoluminescence layer corresponds to the micro inorganic light emitting diode and the color resistor, and the photoluminescence layer is excited by the light emitted by the micro inorganic light emitting diode to emit light with the same color as the color resistor, so that the color gamut of the display substrate can be improved. And the light emitted by the photoluminescence layer is emitted through the color resistor, so that the light with the wave band in the required range can be accurately selected through the color resistor, and the light is further improved.
In some embodiments, as shown in fig. 1, the second substrate 2 further comprises: a reflective layer 15 covering at least the bottom of the recess 7;
the photoluminescent layer 9 is located on the side of the reflective layer 15 facing away from the second substrate 6.
According to the display substrate provided by the embodiment of the application, the reflecting layer at least covers the bottom of the groove, and the photoluminescent layer is arranged on one side, deviating from the second substrate, of the reflecting layer, so that the reflecting layer can reflect light emitted by the photoluminescent layer to the light emitting side of the display substrate, and the light utilization rate and the display effect of the display substrate can be improved.
It should be noted that fig. 1 illustrates an example in which the reflective layer covers only the bottom of the groove.
Alternatively, in some embodiments, as shown in fig. 2, the second substrate 2 further includes: a reflective layer 15 covering the bottom and sides of the recess 7;
the photoluminescent layer 9 is located on the side of the reflective layer 15 facing away from the second substrate 6.
According to the display substrate provided by the embodiment of the application, the reflecting layer covers the bottom and the side face of the groove, and the photoluminescent layer is arranged on one side, deviating from the second substrate, of the reflecting layer, so that the reflecting layer can reflect light emitted by the photoluminescent layer and the first substrate towards one side of the second substrate to the light emitting side of the display substrate, the light utilization rate can be improved, and the display effect of the display substrate is further improved.
In some embodiments, as shown in fig. 1 and 2, the display substrate further includes: an adhesive layer 14 between the first substrate 1 and the second substrate 2. I.e. the first substrate and the second substrate are connected by means of an adhesive layer.
In some embodiments, as shown in fig. 1, 2, the adhesive layer 14 covers the pixel defining layer 8 and the photoluminescent layer 9;
the first substrate 1 and the second substrate 2 are connected by an adhesive layer 14 at the region of the pixel defining layer 8 outside the recess 7;
the distance between the micro-inorganic light emitting diode 5 and the bonding layer 14 is greater than zero.
According to the display substrate provided by the embodiment of the application, the bonding layer covers the pixel definition layer, so that the first substrate and the second substrate are connected through the bonding layer in the area of the pixel definition layer. The adhesive layer covers the photoluminescent layer so that a surface of the photoluminescent layer facing the first substrate can be protected. And the distance between the micro inorganic light emitting diode and the bonding layer is larger than zero, so that the micro inorganic light emitting diode can be prevented from being extruded and scratched in the bonding process of the first substrate and the second substrate.
In a specific implementation, the surface of the second substrate facing the first substrate may be coated with an adhesive layer.
In some embodiments, the adhesive layer is a transparent adhesive layer. Thus, the surface of the photoluminescent layer can be protected, and the light transmittance is prevented from being influenced.
In some embodiments, the adhesive layer comprises: acrylate, ultraviolet (UV) initiator, epoxy resin, curing agent, filler, wetting agent, thixotropic imparting agent, anti-aging agent and spacer.
In particular, the adhesive layer is generally formed by a coating and curing process. The epoxy resin is used to absorb energy to produce a polymerization reaction when heated, completing the final cure. The UV initiator is used to generate free radicals under UV light to initiate polymerization of the acrylate. The curing agent is used to initiate the ring-opening polymerization of the epoxy resin. The filler material is used to counteract shrinkage during hardening, increase adhesion, and is non-reactive. The wetting agent may be, for example, an organosilane coupling agent/wetting agent for improving the adhesion. The thixotropic agent is used for thickening and providing thixotropic properties and preventing stringing and sagging in use. The anti-aging agent has polymerization inhibiting effect and increases storage stability. The spacer is used for supporting the peripheral gap of the first substrate and the second substrate.
In some embodiments, as shown in fig. 1 and 2, the front projection of the micro inorganic light emitting diode 5 on the first substrate 3 falls within the front projection of the groove 7 on the first substrate 3;
the orthographic projection of the groove 7 on the first substrate 3 falls within the orthographic projection of the color resist 4 on the first substrate 3.
In some embodiments, as shown in fig. 1, 2, the thickness of the photoluminescent layer 9 is less than the depth of the recess 7 in a direction perpendicular to the second substrate 6;
the recess 7 accommodates the micro-inorganic light emitting diode 5.
According to the display substrate provided by the embodiment of the application, the thickness of the photoluminescence layer is smaller than the depth of the groove, the groove can provide the accommodating space of the miniature inorganic light emitting diode, and after the first substrate and the second substrate are connected, the miniature inorganic light emitting diode is arranged in the groove, so that the thickness of the display substrate can be reduced.
In some embodiments, as shown in fig. 1, 2, the recess 7 extends through the thickness of the pixel defining layer 8.
Therefore, the space for accommodating the micro inorganic light emitting diode can be increased, and after the first substrate and the second substrate are connected, the micro inorganic light emitting diode is ensured to be placed in the groove, and the thickness of the display substrate is reduced.
In some embodiments, the photoluminescent layer comprises quantum dots. Thereby, the color gamut of the display substrate can be further widened, and the display lifetime can be also improved.
In some embodiments, as shown in fig. 1 and 2, the plurality of micro-inorganic light emitting diodes 5 are all blue micro-inorganic light emitting diodes;
the plurality of color resists 4 includes: a plurality of red resistors R, a plurality of blue resistors B, and a plurality of green resistors G;
the photoluminescent layer 9 includes: a red photoluminescent layer r excited by blue light to emit red light, and a green photoluminescent layer r excited by blue light to emit green light;
the red photoluminescent layer R is positioned in the groove 7 corresponding to the red color resistor R, and the green photoluminescent layer R is positioned in the groove 7 corresponding to the green color resistor G.
In the implementation, the display substrate is divided into a plurality of sub-pixels, and the colors of the sub-pixels are in one-to-one correspondence with the color resistances. I.e. the red sub-pixel comprises a red color resistance, the blue sub-pixel comprises a blue color resistance, and the green sub-pixel comprises a green color resistance.
That is, according to the display substrate provided by the embodiment of the application, each micro light emitting diode is a blue light micro inorganic light emitting diode, so that the light emitting efficiency and the display service life of the display substrate can be improved. In addition, in the display substrate provided by the embodiment of the application, the photoluminescent layer is not arranged in the groove corresponding to the blue color resistor, so that the luminous efficiency and the display service life among different sub-pixels can be balanced.
In the specific implementation, the red photoluminescence layer is a red light quantum dot layer, and the green photoluminescence layer is a green light quantum dot layer.
Of course, in the implementation, a blue light photoluminescent layer excited by blue light to emit blue red light may be disposed in the groove corresponding to the blue color resistor. I.e. each groove is internally provided with a photoluminescent layer.
Of course, in the implementation, the red sub-pixel may also include a red micro-inorganic light emitting diode, the green sub-pixel includes a green micro-inorganic light emitting diode, and the blue sub-pixel includes a blue micro-inorganic light emitting diode. The red sub-pixel comprises a quantum dot layer excited by red light to emit red light, and the green sub-pixel comprises a quantum dot layer excited by green light to emit red light. The blue sub-pixel may be provided with no photoluminescent layer, or with a blue photoluminescent layer that emits blue red light upon excitation by blue light.
In some embodiments, a surface of the photoluminescent layer facing the first substrate side has a concave-convex shape.
Therefore, the total reflection of light at the interface of the photoluminescence layer can be reduced, and the light extraction rate is further improved, so that the effect of improving the efficiency is achieved.
In the specific implementation, when the photoluminescent layer is a quantum dot layer, the quantum dot layer can be formed by adopting an inkjet printing process, and the surface of the quantum dot layer formed by adopting the process has a concave-convex shape.
In some embodiments, as shown in fig. 1 and 2, the first substrate 1 further includes: a plurality of bonding electrodes 12 between the color resist 4 and the micro inorganic light emitting diode 5, and signal lines 13 electrically connected to the bonding electrodes 12.
In some embodiments, the bonding electrode is a transparent electrode. Therefore, the binding electrode can be prevented from blocking the light-emitting path, and the light transmittance of the display substrate is prevented from being influenced.
In some embodiments, the material of the binding electrode comprises indium tin oxide.
In some embodiments, as shown in fig. 1 and 2, the first substrate 1 further includes: a light shielding portion 11 located between the color resists 4;
the signal line 13 is located at a side of the light shielding portion 11 facing away from the first substrate 3, and the orthographic projection of the light shielding portion 11 on the first substrate 3 covers the orthographic projection of the signal line 13 on the first substrate 3.
The display substrate that this application provided still is provided with the shading portion between the look and hinders to can inject the printing opacity district of display substrate through the shading portion, avoid the light colour mixture with adjacent printing opacity district juncture, avoid influencing the display effect.
In a specific implementation, when the orthographic projection of the light shielding part on the first substrate covers the orthographic projection of the signal wire on the first substrate, the signal wire does not cover the color resistance area, so that the light emitting area of the display substrate is not shielded, and therefore, the signal wire can select one or more of silver, aluminum, titanium, molybdenum and other metal materials with smaller resistance, and the signal transmission effect is improved.
Of course, in implementation, the signal line may also be made of a transparent material, for example, the signal line and the bonding electrode are made of the same material, so that the signal line and the bonding electrode may be formed in a patterning process, and the manufacturing process of the display substrate may be simplified. When the signal line includes a transparent material, the signal line does not need to be completely shielded by the light shielding portion.
In some embodiments, as shown in fig. 1 and 2, the front projection of the light shielding portion 11 on the first substrate 3 and the front projection of the signal line 13 on the first substrate 3 are both within the front projection of the first substrate 3 in the region outside the groove 7 of the pixel defining layer 8.
In some embodiments, the front projection area of the micro inorganic light emitting diode on the first substrate is greater than or equal to 5 micrometers and less than or equal to 20 micrometers, and the front projection area of the color resistance on the first substrate is greater than or equal to 100 micrometers and less than or equal to 200 micrometers.
According to the display substrate provided by the embodiment of the application, the micro inorganic light emitting diode and the color resistor have larger order of magnitude difference, the color resistor arranged area corresponds to the sub-pixel opening area of the display substrate, namely, the sub-pixel opening area of the display substrate and the micro inorganic light emitting diode have larger order of magnitude difference, so that the micro inorganic light emitting diode cannot be identified by naked eyes at a very micro level, and the problem that the micro inorganic light emitting diode is arranged in the sub-pixel opening area to generate a dark area can be avoided.
In a specific implementation, the first substrate may be a rigid substrate or a flexible substrate. The second substrate may be a rigid substrate or a flexible substrate. The rigid substrate may be, for example, a glass substrate, and the flexible substrate may be, for example, a Polyimide (PI) substrate.
Based on the same inventive concept, the embodiment of the application also provides a preparation method of the display substrate, as shown in fig. 3, the method includes:
s101, manufacturing a first substrate, which specifically comprises the following steps:
forming a plurality of color resists on one side of a first substrate;
a plurality of miniature inorganic light emitting diodes are arranged on one side of the color resistor, which is away from the first substrate;
s102, manufacturing a second substrate, which specifically comprises the following steps:
forming a pixel definition layer on one side of the second substrate, and forming grooves corresponding to the color resistances one by one on the pixel definition layer by adopting a patterning process;
forming a photoluminescent layer within at least a portion of the recess;
s103, bonding the first substrate and the second substrate.
According to the preparation method of the display substrate, the prepared first substrate comprises the color resistor and the micro inorganic light emitting device, the prepared second substrate comprises the photoluminescent layer arranged in the groove, the photoluminescent layer corresponds to the micro inorganic light emitting diode and the color resistor, and light which is emitted by the micro inorganic light emitting diode and has the same color as the color resistor is excited to emit by the photoluminescent layer, so that the color gamut of the display substrate can be improved. And the light emitted by the photoluminescence layer is emitted through the color resistor, so that the light with the wave band in the required range can be accurately selected through the color resistor, and the light is further improved.
In some embodiments, before disposing the plurality of micro-inorganic light emitting diodes on a side of the color resist facing away from the first substrate, fabricating the first substrate further comprises:
forming a light shielding portion between the color resists;
and forming a binding electrode and a pattern of a signal line electrically connected with the binding electrode on one side of the light shielding part and the color resistor away from the first substrate.
In an embodiment, when the bonding electrode and the signal line are made of the same material, the bonding electrode and the signal line may be formed in one patterning process. When the binding electrode and the signal line are different in material, the binding electrode may be patterned first, then the signal line may be patterned, or the signal line may be patterned first, and then the binding electrode may be patterned.
In some embodiments, prior to forming the photoluminescent layer in at least a portion of the recess, fabricating the second substrate further comprises:
a reflective layer is formed covering at least the bottom of the recess.
In some embodiments, forming the reflective layer to cover at least the bottom of the recess specifically includes:
a reflective layer is formed covering the bottom and sides of the recess.
In some embodiments, forming the photoluminescent layer within at least a portion of the recess specifically includes:
and sequentially forming quantum dot layers with different luminescent colors in at least part of the grooves by adopting an ink-jet printing process.
The surface of the quantum dot layer formed by adopting the ink-jet printing process has concave-convex shapes, so that the total reflection of a quantum dot interface can be reduced, and the light extraction efficiency is improved.
In some embodiments, step S103 is performed by attaching the first substrate and the second substrate, and specifically includes:
coating an adhesive layer material on one side of the pixel definition layer and the photoluminescence layer of the second substrate;
bonding one side of the miniature light-emitting diode of the first substrate with the second substrate through an adhesive layer in a vacuum environment;
ultraviolet irradiation curing is carried out on the area of the bonding layer of the first substrate and the second substrate after bonding;
and then baking the first substrate and the second substrate after ultraviolet irradiation curing.
In a specific implementation, the first substrate and the second substrate coated with the adhesive layer may be aligned and bonded in a vacuum chamber, and uniformly pressed by using atmospheric pressure. For example, alignment marks (marks) are arranged at the center points and four corners of the first substrate and the second substrate, and the alignment accuracy can be controlled within +/-1.5 micrometers by using a Charge-coupled Device (CCD) alignment mode. The curing wavelength ranges from 380 nm to 450 nm. The baking process is, for example, heated by means of heated air circulation, so that the adhesive layer is cured at the process temperature, at 130 ℃ to 80 ℃ for 20 minutes to 40 minutes.
The display device provided by the embodiment of the application comprises the display substrate provided by the embodiment of the application.
In specific implementation, the display substrate provided in the embodiment of the application may be used as a display panel of a display device for displaying. Alternatively, the display device further includes a display panel, and the display substrate is used as a backlight module to provide a light source for the display panel, and the display panel may be a liquid crystal display panel, for example. When the display substrate is used as the backlight module, the color resistor is arranged on the display substrate, so that the color resistor can not only filter light of a specific wave band, but also replace the polaroid, thus the lower polaroid of the liquid crystal display device can be saved, and the thickness of the display device is reduced.
The display device provided by the embodiment of the application is as follows: any product or component with display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Other essential components of the display device are those of ordinary skill in the art, and will not be described in detail herein, nor should they be considered as limiting the application. The implementation of the display device can be referred to the embodiment of the display substrate, and the repetition is not repeated.
In summary, according to the display substrate, the manufacturing method thereof and the display device provided by the embodiment of the application, the photoluminescent layer corresponds to the micro inorganic light emitting diode and the color resistor, and light with the same color as the color resistor is excited to emit by light emitted by the micro inorganic light emitting diode when reaching the photoluminescent layer, so that the color gamut of the display substrate can be improved. And the light emitted by the photoluminescence layer is emitted through the color resistor, so that the light with the wave band in the required range can be accurately selected through the color resistor, and the light is further improved.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the spirit or scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to cover such modifications and variations.

Claims (19)

1. A display substrate, the display substrate comprising: a first substrate and a second substrate disposed opposite to each other; the surface of one side of the first substrate, which is away from the second substrate, is a light-emitting surface of the display substrate;
the first substrate includes: a first substrate, a plurality of color resistors positioned on one side of the first substrate facing the second substrate, and a plurality of micro inorganic light emitting diodes positioned on one side of the color resistors facing away from the first substrate;
the second substrate includes: a second substrate, a pixel defining layer located on one side of the second substrate facing the first substrate and having a groove, and a photoluminescent layer located at least partially within the groove; the luminous color of the photoluminescence layer is the same as the color of the color resistor.
2. The display substrate of claim 1, wherein the second substrate further comprises: a reflective layer covering the bottom and sides of the recess;
the photoluminescent layer is positioned on one side of the reflective layer away from the second substrate.
3. The display substrate of claim 1, wherein the display substrate further comprises: and an adhesive layer between the first substrate and the second substrate.
4. A display substrate according to claim 3, wherein the adhesive layer covers the pixel defining layer and the photoluminescent layer;
the first substrate and the second substrate are connected through the adhesive layer at the region of the pixel defining layer outside the groove;
the distance between the miniature inorganic light emitting diode and the bonding layer is greater than zero.
5. The display substrate of claim 4, wherein the adhesive layer is a transparent adhesive layer.
6. The display substrate of claim 5, wherein the adhesive layer comprises: acrylate, ultraviolet initiator, epoxy resin, curing agent, filling material, wetting agent, thixotropic imparting agent, anti-aging agent and spacer.
7. The display substrate of any one of claims 1-4, wherein an orthographic projection of the micro-inorganic light emitting diode on the first substrate falls within an orthographic projection of the recess on the first substrate;
the orthographic projection of the groove on the first substrate falls into the orthographic projection of the color resistance on the first substrate.
8. The display substrate of claim 7, wherein a thickness of the photoluminescent layer is less than a depth of the recess in a direction perpendicular to the second substrate;
the recess accommodates the micro inorganic light emitting diode.
9. A display substrate as recited in any one of claims 1, 2, 4-6, 8, wherein the photoluminescent layer comprises quantum dots.
10. The display substrate of claim 9, wherein the plurality of micro-leds are blue micro-leds;
the plurality of color resists includes: a plurality of red resistors, a plurality of blue resistors, and a plurality of green resistors;
the photoluminescent layer includes: a red photoluminescent layer excited by blue light to emit red light, and a green photoluminescent layer excited by blue light to emit green light;
the red photoluminescence layer is positioned in the groove corresponding to the red color resistor, and the green photoluminescence layer is positioned in the groove corresponding to the green color resistor.
11. A display substrate according to any one of claims 1, 2, 4 to 6, 8, wherein a surface of the photoluminescent layer facing the first substrate side has a concave-convex shape.
12. The display substrate according to any one of claims 1, 2, 4 to 6, 8, wherein the first substrate further comprises: and the binding electrodes are positioned between the color resistors and the micro inorganic light emitting diodes, and the signal wires are electrically connected with the binding electrodes.
13. The display substrate of claim 12, wherein the bonding electrode is a transparent electrode.
14. The display substrate of claim 13, wherein the first substrate further comprises: a light shielding portion located between the color resists;
the signal line is located at one side of the shading part, which is away from the first substrate, and the orthographic projection of the shading part on the first substrate covers the orthographic projection of the signal line on the first substrate.
15. The display substrate according to claim 14, wherein the orthographic projection of the light shielding portion on the first substrate and the orthographic projection of the signal line on the first substrate each fall within the orthographic projection of the first substrate in a region outside the groove of the pixel defining layer.
16. The display substrate according to any one of claims 1, 2, 4 to 6, 8, wherein a front projection area of the micro-inorganic light-emitting diode on the first substrate is 5 μm or more and 20 μm or less, and a front projection area of the color resist on the first substrate is 100 μm or more and 200 μm or less.
17. The display substrate according to any one of claims 1, 2, 4 to 6, 8, wherein the second substrate is a flexible substrate.
18. A method for manufacturing a display substrate, the method comprising:
manufacturing a first substrate, specifically including:
forming a plurality of color resists on one side of a first substrate;
a plurality of micro inorganic light emitting diodes are arranged on one side of the color resistor, which is away from the first substrate;
manufacturing a second substrate, specifically including:
forming a pixel definition layer on one side of the second substrate, and forming grooves corresponding to the color resistors one by one on the pixel definition layer by adopting a patterning process;
forming a photoluminescent layer within at least a portion of the recess;
and bonding the first substrate and the second substrate.
19. A display device comprising the display substrate according to any one of claims 1 to 17.
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