CN113782452B - Micro-channel structure design and preparation method for efficient enhanced boiling heat transfer surface - Google Patents
Micro-channel structure design and preparation method for efficient enhanced boiling heat transfer surface Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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Abstract
The invention relates to a micro-channel structural design for efficiently enhancing boiling heat transfer surface and a preparation method thereof. According to the invention, the micro-channel structure is cut on the surface of the high-heat-conductivity metal copper by adopting laser, then the copper nano layer is deposited on the micro-channel structure by utilizing a magnetron sputtering method, so that the critical heat flow density of the surface of the high-heat-conductivity metal is improved, the surface overheating temperature of the surface of the high-heat-conductivity metal is reduced, and the critical heat flow density and the heat exchange coefficient are enhanced simultaneously. The number of nucleation sites of the micro-channel structure is increased, the critical heat flow density is increased by 1.61 times compared with the surface of the copper material, the heat exchange coefficient is increased by 2.26 times, and the superheat degree of the metal heat exchange surface contacted with liquid is greatly reduced. The micro-channel structure surface of the invention is provided with the closely packed nano-pillar layer, the diameter of the bubble release is smaller, and the frequency of the bubble release is higher. The critical heat flow density of the high-efficiency enhanced boiling heat transfer surface with the multistage micro-channel structure is as high as 141.3W/cm 2, and the wall superheat degree is only 8.9K.
Description
Technical Field
A microchannel structure design and preparation method for efficiently enhancing boiling heat transfer surface.
Background
The rapid development of high and new technical fields such as integrated circuits, high-performance computers, laser precision machining, aerospace and the like causes continuous surge of heat flux density of electronic components, and if the heat productivity of such high strength cannot be effectively removed, the temperature of the components is rapidly increased, and the performance, stability and safety of the components and the system are seriously reduced. The problem of heat dissipation from devices has become a critical bottleneck affecting the current electronic industry development. The boiling heat transfer is a heat transfer mode that a working medium takes away heat of a heating surface through bubble movement and cools the heating surface, and can obtain a great heat transfer coefficient under the condition of smaller superheat degree, so that the boiling heat transfer technology has been widely applied to key processes in important industrial fields such as thermal power, nuclear power, geothermal energy, solar energy, petrochemical engineering, food engineering, low-temperature engineering and the like.
Recent researches find that the boiling heat transfer performance of the heat exchange surface can be improved by processing the micro-structure or the nano-structure on a common heat exchange plane. The micro-nano porous structure processed on the heat exchange surface by utilizing the micro-nano processing technology has remarkable boiling heat exchange enhancement effect. Compared with the structure with the conventional scale, the micro-nano porous structure can greatly improve the heat exchange area, improve the surface wetting property, improve the capillary suction force, improve the bubble nucleation density and reduce the vapor-liquid flow resistance, thereby enhancing the dynamic process of boiling phase transition and finally improving the heat exchange capability of the boiling surface. Previous studies have focused mainly on developing new structures with different processing techniques, such as milling, polishing, electro-discharge machining and electrochemical deposition, involving multiple manufacturing steps, thus inhibiting cost competitiveness.
Conventional heat transfer systems are limited by Critical Heat Flow (CHF), where the boiling process transitions from nucleate boiling to film boiling, resulting in a sudden rise in heat exchanger surface temperature, with a still greater degree of wall superheat. In addition, the processing means for improving the boiling heat transfer performance in the prior art has high cost (such as a template method), cannot be commercialized on a large scale, cannot obviously change the growth characteristics of bubbles in the micro-channel structure, and cannot greatly improve the surface boiling heat transfer performance.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a micro-channel structure for efficiently strengthening a boiling heat transfer surface and a preparation method thereof. The microchannel structure of the high-efficiency enhanced boiling heat transfer surface is a plurality of mutually communicated multistage microchannels.
According to the preparation method, the micro-channel structure cut on the surface of the high-heat-conductivity metal copper is firstly adopted, and then the copper nano layer is deposited on the micro-channel structure by magnetron sputtering, so that the surface wettability of the micro-channel structure is regulated, solid-liquid interaction of the micro-channel surface is further enhanced, continuous liquid supply is provided for the channel, micro/nano scale pores existing on the surface can effectively improve the nucleation density of bubbles, the size effect of the micro-channel and the surface generate coupling effect, so that the bubbles escape more quickly, and the micro-channel structure of the high-efficiency enhanced boiling heat transfer surface has lower wall superheat degree, higher critical heat flux density and boiling heat exchange coefficient of a far-beyond general enhanced surface, and can realize the reduction of the surface temperature of the high-heat-conductivity metal surface while improving the critical heat flux density of the micro-conductivity metal surface; the preparation method of the invention has simple preparation process and low cost, and is easy for commercial mass production and application.
The technical scheme adopted by the invention is as follows:
A design and preparation method of a microchannel structure for efficiently strengthening a boiling heat transfer surface comprises the following steps:
(1) Forming a micro-channel structure on the surface of the copper material by utilizing laser processing;
(2) And (3) depositing a copper nano layer on the micro-channel structure obtained in the step (1) to obtain the micro-channel structure with the efficient enhanced boiling heat transfer surface.
In the step (1), the copper material is a copper cylinder or other shapes.
The specific conditions of the laser processing are as follows:
A micro-channel structure is designed on a laser platform, and the interval between two laser processing lines closest to the pattern design is 0.03-0.2mm; the laser wavelength is 1064nm, the diameter of a light spot is 50 mu m, and the total power is 15W;
The copper material is placed on a laser platform, the power is adjusted to 60-90%, the frequency is 500kHz, the speed is 100-400mm/s, and the scanning times are 2000-3500.
In the step (1), the cross section of the micro-channel structure is rectangular, trapezoidal or triangular.
The cross section of the micro-channel structure is rectangular, and the width of the rectangle is 0.03-0.2mm.
The channel width of the micro-channel structure is 0.03-0.2mm, and the depth is 256-367 mu m.
In the step (2), the copper nano layer is deposited by adopting a magnetron sputtering process.
When the copper nano layer is deposited, the vacuum degree is 4.0X10 -4 Pa, the sputtering air pressure is 2.0Pa, the substrate temperature is room temperature to 300 ℃, the sputtering power is 10 to 30W, and the deposition time is 6 to 14h.
The copper nanowire layer is characterized in that the copper nanowire layer is composed of copper nanowires with diameters of 260-350nm and heights of 5-12 mu m, and the copper nanowire layer has a porosity of 60-80%.
The multistage micro-channel structure of the high-efficiency enhanced boiling heat transfer surface prepared by the method is provided.
The beneficial effects of the invention are as follows:
(1) According to the design and preparation method of the micro-channel structure for efficiently strengthening the boiling heat transfer surface, the micro-channel structure is cut on the surface of the high-heat-conductivity copper material by adopting the laser technology, and then the copper nano layer is deposited on the micro-channel structure by magnetron sputtering, so that the critical heat flow density of the heat-conductivity metal surface is increased, and the surface temperature of the metal surface is reduced. The inventor discovers in the research that the copper material has high heat conductivity, and the copper nano layer and the base copper material are the same material by depositing the copper nano layer on the surface of the copper material with a micro-channel structure, so that the mismatch of the thermal expansion coefficient and the heat transfer loss in the middle of the material can be effectively reduced, and finally, the surface temperature of the copper material can be reduced while the critical heat flow density of the heat conductivity metal surface is improved.
(2) According to the design and preparation method of the micro-channel structure for efficiently strengthening the boiling heat transfer surface, disclosed by the application, the wettability and surface nucleation of the surface of the copper microstructure prepared by laser are regulated by introducing the copper nanowire, so that the simultaneous enhancement of critical heat flow density and heat exchange coefficient is realized. This is because the inventor finds that the copper nanowire array introduced by the application is orderly controllable in long-term research, and compared with the irregular randomness of other nano layers, the copper nanowire array structure is more favorable for the conditions of bubble release and liquid supplement formation in the boiling heat transfer process, and the size of the porosity influences the bubble nucleation size and escape rate. The data show that the number of nucleation sites of the micro-channel structure is increased, the critical heat flow density is increased by 1.61 times compared with the surface of the copper material, the heat exchange coefficient is increased by 2.26 times, and the temperature of the surface contacted with liquid is greatly reduced. The increase in heat transfer coefficient is related to the specific surface area, the structural height and the density of active nucleation sites, the higher the specific surface area, the higher the heat transfer coefficient. The copper nanowire in the micro-channel structure can effectively improve surface wettability and wicking capability. According to bubble dynamics, the micro-channel structure provided by the application has the advantages that the diameters of bubble release on the surface of the closely packed structure are smaller, and the frequency of bubble release is higher. The critical heat flow density of the micro-channel structure of the high-efficiency enhanced boiling heat transfer surface prepared by the method is as high as 141.3W/cm 2, and the wall superheat degree is only 8.9K.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIGS. 1a, 1b, 1c and 1d are respectively surface topography and channel structure diagrams of the micro-channel structures obtained in comparative example 1, example 2 and example 3;
FIG. 1e is a cross-sectional view of a copper nanowire layer deposited in example 3;
FIGS. 2a-2c are schematic diagrams of static contact angles of 5 μm sessile drops on a copper surface treated by the method of comparative examples 2-4, respectively;
FIGS. 2d-2f are schematic diagrams of static contact angles of 5 μm sessile drops on a copper surface treated by the method of examples 1-3, respectively;
FIG. 3a is a graph showing the superheat versus critical heat flux density for the surfaces of the different microchannel structures of examples 1-3;
FIG. 3b is a graph of critical heat flux versus boiling heat transfer coefficient for the surfaces of different microchannel structures of examples 1-3;
FIG. 4 is a cross-sectional view of the copper nanowire layer obtained in example 4;
FIG. 5 is a cross-sectional view of the copper nanowire layer obtained in example 5.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, based on the examples herein, which are within the scope of the invention as defined by the claims, will be within the scope of the invention as defined by the claims.
Examples
The embodiment provides a design and preparation method of a micro-channel structure for efficiently enhancing a boiling heat transfer surface, which comprises the following steps:
(1) Taking a copper cylinder with the diameter of 10mm and the height of 20mm, and forming a micro-channel structure on the surface of the copper cylinder by utilizing laser processing;
The specific conditions of the laser processing are as follows:
Designing a 'well' -shaped structure on a laser platform (model PicoYL-15), wherein the interval between two laser processing lines closest to the laser platform is 0.2mm; the laser wavelength is 1064nm, the diameter of a light spot is 50 mu m, and the total power is 15W;
The cross section of the micro-channel structure is rectangular, the width of the rectangle is 0.2mm (corresponding to the interval between two lines of the 'well' -shaped structure), the width of a channel (groove) of the micro-channel structure is 0.2mm, and the depth is 312 mu m;
(2) Depositing a copper nanowire layer on the micro-channel structure obtained in the step (1) by adopting a magnetron sputtering process, wherein an instrument is a JGP-450a type magnetron sputtering deposition system; the specific conditions for the magnetron sputtering process are as follows: the target material is a high-purity copper target, the target base distance is 14cm, and the sample stage is opened to rotate when the vacuum degree is about 4.0 multiplied by 10 -4 Pa; high-purity argon is introduced, the flow rate of the argon is fixed to be 25 sccm, the air pressure is regulated to be 2.0 Pa of the preset working air pressure, the sputtering power is regulated to be 20W, the sputtering is performed for 10 minutes, and after the glow is stable, a baffle is opened to start sputtering; and after the sputtering is finished, turning off a sputtering power supply, turning off the rotation of a sample table and other power supplies, and taking out a sample to obtain the micro-channel structure of the efficient enhanced boiling heat transfer surface.
Examples
Example 2 differs from example 1 only in that: in the step (1), when laser processing is adopted, the interval between two lines of the 'well' -shaped structure is 0.1mm, and the other steps are the same as those of the embodiment 1; correspondingly, the cross section of the micro-channel structure obtained in the embodiment is rectangular, the width of the rectangle is 0.1mm, the width of a channel (groove) of the micro-channel structure is 0.1mm, and the depth is 367 mu m.
Examples
This embodiment 3 differs from embodiment 1 only in that: in the step (1), the interval between two lines of the "well" structure was 0.03mm when laser processing was used, and the same procedure as in example 1 was repeated. Correspondingly, the cross section of the micro-channel structure obtained in this embodiment is rectangular, the width of the rectangle is 0.03mm, the width of the channel (groove) of the micro-channel structure is 0.03mm, and the depth is 256 μm.
Examples
This embodiment differs from embodiment 3 only in that: the deposition conditions in step (2) are different, specifically:
The target base distance is 14cm, and the sample platform is opened to rotate when the vacuum degree is about 4.0X10 -4 Pa; high-purity argon is introduced, the flow rate of the argon is fixed to be 25 sccm, the air pressure is regulated to be 2.0 Pa of the preset working air pressure, the sputtering power is regulated to be 20W, the sputtering is performed for 10 minutes, and after the glow is stable, a baffle is opened to start sputtering; and after the sputtering is finished, turning off a sputtering power supply, turning off the rotation of a sample table and other power supplies, and taking out a sample to obtain the micro-channel structure of the efficient enhanced boiling heat transfer surface.
Examples
This embodiment differs from embodiment 3 only in that: the deposition conditions in step (2) are different, specifically:
The target base distance is 14cm, and the sample platform is opened to rotate when the vacuum degree is about 4.0X10 -4 Pa; high-purity argon is introduced, the flow rate of the argon is fixed to be 25 sccm, the air pressure is regulated to be 2.0 Pa of the preset working air pressure, the sputtering power is regulated to be 20W, the sputtering is performed for 10 minutes, and after the glow is stable, a baffle is opened to start sputtering; and after the sputtering is finished, turning off a sputtering power supply, turning off the rotation of a sample table and other power supplies, and taking out a sample to obtain the micro-channel structure of the efficient enhanced boiling heat transfer surface.
The comparative example differs from example 3 in that the copper nanowire layer was directly deposited on the surface of the copper cylinder without the laser cutting treatment of step (1).
The comparative example differs from example 1 in that only the laser cutting treatment of step (1) was performed to obtain a micro-channel structure without further deposition of a copper nanowire layer on the surface of the micro-channel structure.
The comparative example differs from example 2 in that only the laser cutting treatment of step (1) was performed to obtain a micro-channel structure without further deposition of a copper nanowire layer on the surface of the micro-channel structure.
The comparative example differs from example 3 in that only the laser cutting treatment of step (1) was performed to obtain a micro-channel structure without further deposition of a copper nanowire layer on the surface of the micro-channel structure.
This comparative example differs from example 3 only in that: the treatment modes of the step (2) are different, the copper oxide nanometer cone layer is prepared on the surface of the copper column according to the comparative example, and the specific process is as follows:
Immersing the copper column into a solution at room temperature, wherein the raw materials of the solution comprise NaClO 2、NaOH、Na3PO4·12H2 O and deionized water, and the mass ratio of each substance is 3.75:5:10:100, oxidizing for 15min, taking out the copper column, washing with deionized water and ethanol for 3 times, and drying.
This comparative example differs from example 3 only in that: the metal nickel nano layer is deposited in the step (2), and the specific process is as follows:
The target material is a high-purity nickel target, the target base distance is 14cm, and the sample stage is opened to rotate when the vacuum degree is about 4.0 multiplied by 10 -4 Pa; high-purity argon is introduced, the flow rate of the argon is fixed to be 25 sccm, the air pressure is regulated to be 2.0 Pa of the preset working air pressure, the sputtering power is regulated to be 20W, the sputtering is performed for 10 minutes, and after the glow is stable, a baffle is opened to start sputtering; and after the sputtering is finished, turning off a sputtering power supply, turning off the rotation of a sample table and other power supplies, and taking out a sample to obtain the micro-channel structure of the efficient enhanced boiling heat transfer surface.
As shown in fig. 1, the surface morphology and the channel structure diagram observed under the 3D laser scanning confocal microscope are shown in fig. 1a, 1b, 1c and 1D, wherein the surface morphology and the channel structure diagram of the micro-channel structures obtained in comparative example 1, example 2 and example 3 are shown, respectively, the center of the micro-channel structures in examples 1-3 is a square column obtained by laser processing, and the channels are depth grooves left after laser scanning, and are the width of the laser spot diameter. In example 3, the laser scanning width ("interval between two lines of the" well "structure) was set to 0.03mm, the scanning width was close to the spot diameter (50 μm), and the surface was tiled (as shown in fig. 1 d).
A schematic of static contact angles of 5 μl sessile drops on different copper surfaces is shown in fig. 2. FIGS. 2a-2c are schematic diagrams of static contact angles of 5. Mu.L of sessile drops on the surface of a copper material treated by the method of comparative examples 2-4, respectively; FIGS. 2d-2f are schematic diagrams of static contact angles of 5. Mu.L sessile drops on a copper surface treated by the method of examples 1-3, respectively. As can be seen from the figure, compared with the copper material subjected to laser cutting treatment only, the copper material prepared by performing laser cutting and then sputtering the copper nanowire layer by the method of the embodiment 1-3 has the advantages that the 2d and 2f surface hydrophobicity is obviously enhanced, so that the treatment mode of sputtering the copper nanowire layer is proved to improve the wettability of the surface and increase the nucleation sites of the surface.
FIG. 3 is a graph showing the comparison of pool boiling curves for the surfaces of different microchannel structures (examples 1-3) with water at atmospheric pressure. The criterion for determining the boiling performance is that the lower the superheat degree (Wall Superheat) is, the higher the critical Heat flow (Heat Flux) is, and the higher the boiling Heat exchange Coefficient (HEAT TRANSFER Coefficient) is, the better the Heat transfer performance is. As can be seen from the graph, the microchannel structure obtained in example 3 (channel width 0.03 mm) had the best heat transfer performance, and the critical heat flow density of the microchannel structure obtained in example 3 was 141.3W/cm 2, while the wall superheat degree was 8.9K. As shown in fig. 1e, which is a cross-sectional view of the copper nanowire layer deposited in example 3, it can be seen from the figure that the copper nanowire layer deposited in example 3 has a diameter of 310nm and a height of 8.16 μm, and the porosity (the ratio of the total volume of the minute voids in the material to the total volume) of the copper nanowire layer is 75.3%.
As shown in FIG. 4, which is a cross-sectional view of the copper nanowire layer obtained in example 4, it can be seen that the copper nanowire layer obtained by deposition of example 4 has a diameter of 170nm and a height of 3.63 μm, and the porosity of the copper nanowire layer is 87.1%.
As shown in FIG. 5, which is a cross-sectional view of the copper nanowire layer obtained in example 5, it can be seen that the diameter of the copper nanowire in the copper nanowire layer obtained in example 5 deposition was 180nm, the height was 4.98 μm, and the porosity of the copper nanowire layer was 80.7%.
The critical heat flux density and the wall superheat degree of the microchannel structures prepared in examples 1 to 5, comparative example 5 and comparative example 6 were measured, and the results are shown in table 1.
TABLE 1
| Project | Critical heat flux W/cm 2 | Wall superheat degree/K |
| Example 1 | 138.6 | 16.8 |
| Example 2 | 139.7 | 11.8 |
| Example 3 | 141.3 | 8.9 |
| Example 4 | 86.9 | 9.9 |
| Example 5 | 88.9 | 11.8 |
| Comparative example 5 | 137.3 | 15.3 |
| Comparative example 6 | 126.1 | 13.7 |
As can be seen from table 1, the method of the invention can remarkably improve the critical heat flux density of the copper material and simultaneously reduce the surface temperature of the copper material by firstly adopting the micro-channel structure cut on the surface of the copper material by the laser technology and then depositing the copper nanowire layer on the micro-channel structure. The micro-channel structure obtained by the method of the embodiment 3 has optimal performance, the critical heat flow density is as high as 141.3W/cm 2, and the wall superheat degree is only 8.9K. Compared with the schemes of depositing a copper oxide nano cone layer (comparative example 5) and depositing a metal nickel nano layer (comparative example 6), the method of the embodiment 3 of the invention obtains the advantages that when the diameter of the deposited copper nano wire layer in the micro-channel structure is 310nm, the critical heat flow density is higher, and meanwhile, the wall superheat degree is lower, so that the copper nano wires with different diameters are deposited to have different effects on enhancing the boiling heat transfer performance, wherein the boiling heat transfer performance is best enhanced by the copper nano wires with the diameter of 310 nm.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (2)
1. A design and preparation method of a microchannel structure for efficiently strengthening a boiling heat transfer surface is characterized by comprising the following steps:
(1) Taking a copper cylinder with the diameter of 10mm and the height of 20mm, and forming a micro-channel structure on the surface of the copper cylinder by utilizing laser processing;
The specific conditions of the laser processing are as follows:
Placing the copper cylinder on a laser platform, adjusting the position of the focus, adjusting the power to 60-90%, adjusting the frequency to 500kHz, adjusting the speed to 100-400mm/s, and adjusting the scanning times to 2000-3500 times;
Designing a 'well' -shaped structure on a laser platform, wherein the interval between two laser processing lines closest to the laser platform is 0.2mm; the laser wavelength is 1064nm, the diameter of a light spot is 50 mu m, and the total power is 15W;
The cross section of the micro-channel structure is rectangular, the width of the rectangle is 0.2mm, the rectangle corresponds to the interval between two lines of the 'well' -shaped structure, the channel width of the micro-channel structure is 0.2mm, and the depth is 312 mu m;
(2) Depositing a copper nanowire layer on the micro-channel structure obtained in the step (1) by adopting a magnetron sputtering process, wherein the diameter of the copper nanowire layer is 260-350nm, the height of the copper nanowire layer is 5-12 mu m, and the porosity of the copper nanowire layer is 60-80%;
the specific conditions for the magnetron sputtering process are as follows:
the target material is a high-purity copper target, the target base distance is 14cm, and the sample stage is opened to rotate when the vacuum degree is about 4.0 multiplied by 10 -4 Pa; high-purity argon is introduced, the flow rate of the argon is fixed to be 25 sccm, the air pressure is regulated to be 2.0 Pa of the preset working air pressure, the sputtering power is regulated to be 20W, the sputtering is performed for 10 minutes, and after the glow is stable, a baffle is opened to start sputtering; and after the sputtering is finished, turning off a sputtering power supply, turning off the rotation of a sample table and other power supplies, and taking out a sample to obtain the micro-channel structure of the efficient enhanced boiling heat transfer surface.
2. The multi-stage microchannel structure of the high-efficiency enhanced boiling heat transfer surface prepared by the method of claim 1.
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