CN113764356B - Display module and display device - Google Patents
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- CN113764356B CN113764356B CN202111049143.8A CN202111049143A CN113764356B CN 113764356 B CN113764356 B CN 113764356B CN 202111049143 A CN202111049143 A CN 202111049143A CN 113764356 B CN113764356 B CN 113764356B
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- 230000003014 reinforcing effect Effects 0.000 claims abstract description 115
- 230000017525 heat dissipation Effects 0.000 claims abstract description 96
- 239000002131 composite material Substances 0.000 claims abstract description 58
- 238000005452 bending Methods 0.000 claims abstract description 33
- 239000010410 layer Substances 0.000 claims description 314
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 230000002787 reinforcement Effects 0.000 claims 3
- 238000000034 method Methods 0.000 abstract description 24
- 238000003825 pressing Methods 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 53
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 11
- 229910001294 Reinforcing steel Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a display module and a display device, wherein the display module comprises a display panel and a supporting component; the display panel comprises a display part, a bending part and a binding part; one side of the supporting component is attached to the display part, and the other side of the supporting component is attached to the binding part, and comprises a buffer layer, a composite film layer and a reinforcing layer; the composite film layer comprises a heat dissipation layer and a reinforcing layer which is arranged on the same layer with the heat dissipation layer, wherein the hardness of the reinforcing layer is greater than that of the heat dissipation layer, and the orthographic projection of the reinforcing layer on the display panel is overlapped with the orthographic projection of the reinforcing layer on the display panel; according to the invention, the reinforcing layer and the heat dissipation layer are arranged on the same layer, the hardness of the reinforcing layer is larger than that of the heat dissipation layer, the orthographic projection of the reinforcing layer on the display panel is overlapped with the orthographic projection of the reinforcing layer on the display panel, the reinforcing layer can provide better supporting force in the bending process, the pressing deformation between the reinforcing layer and the heat dissipation layer is avoided, and the problem of impression caused by the bending process is solved on the premise of not increasing the thickness.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display module and a display device.
Background
At present, a Pad bonding (bonding area Bending) technology is generally adopted in an OLED (Organic Light Emitting Diode ) display panel to achieve the effect of a narrow frame, namely, firstly, yellow PI (polyimide) is coated on a glass substrate as a flexible substrate, then a TFT (Thin Film Transistor ) device is manufactured on the flexible substrate, then, after a module manufacturing process is completed, an integral flexible film layer is peeled off from the glass substrate, and then, pad bonding is carried out, and metal wires of the bonding area are bent to the back surface of the display panel. The outermost side of the back of the display panel is usually a SCF (Super Clean Foam) component, which is a laminated structure of Foam and copper, and the outer copper is soft, so that an imprint can be generated when the display panel is pressed in the bonding process.
In order to improve the problem that the display panel is pressed to generate the impression in the Bending process, a reinforcing steel sheet is added to the back of the SCF component to improve the impression generated in the Bending process because the copper material is softer, however, the reinforcing steel sheet is added to increase the whole thickness of the display module, which is unfavorable for realizing the light and thin module. Therefore, it is necessary to improve this defect.
Disclosure of Invention
The embodiment of the invention provides a display module, which is used for solving the technical problems that the display module in the prior art is increased in thickness and is unfavorable for realizing the light and thin module because a reinforcing steel sheet is additionally arranged on the outer side of copper to improve the impression generated by the compression of a display panel in the bending process.
The embodiment of the invention provides a display module, which comprises a display panel and a supporting component; the display panel comprises a display part, a bending part and a binding part, wherein the binding part is bent to one side, far away from the light emitting side, of the display part through the bending part; one side of the supporting component is attached to the display part, the other side of the supporting component is attached to the binding part, and the supporting component comprises a buffer layer positioned on one side of the display part far away from the light emitting side, a composite film layer positioned on one side of the buffer layer far away from the display part, and a reinforcing layer positioned between the composite film layer and the binding part; the composite film layer comprises a heat dissipation layer and a reinforcing layer which is arranged on the same layer as the heat dissipation layer, wherein the hardness of the reinforcing layer is larger than that of the heat dissipation layer, and the orthographic projection of the reinforcing layer on the display panel coincides with the orthographic projection of the reinforcing layer on the display panel.
In the display module provided by the embodiment of the invention, a notch is arranged at one end of the heat dissipation layer, which is close to the bending part, and the reinforcing layer is positioned in the notch.
In the display module provided by the embodiment of the invention, in the direction of the light emitting side of the display panel, the depth of the notch is smaller than or equal to the thickness of the heat dissipation layer.
In the display module provided by the embodiment of the invention, one side of the heat dissipation layer, which is far away from the buffer layer, is provided with at least one first groove, and the reinforcing layer is positioned in the first groove.
In the display module provided by the embodiment of the invention, one side of the heat dissipation layer, which is close to the buffer layer, is provided with at least one second groove, and the reinforcing layer is positioned in the second groove.
In the display module provided by the embodiment of the invention, at least one through hole is arranged on the heat dissipation layer, and the reinforcing layer is positioned in the through hole.
In the display module provided by the embodiment of the invention, the material of the reinforcing layer is stainless steel or aluminum alloy.
In the display module provided by the embodiment of the invention, an air layer is arranged between the reinforcing layer and the heat dissipation layer, and the composite film layer is adhered to the buffer layer through the pressure-sensitive adhesive layer.
In the display module provided by the embodiment of the invention, the reinforcing layer is welded with the heat dissipation layer.
The embodiment of the invention also provides a display device which comprises the display module and a driving chip electrically connected with the binding part of the display module.
The beneficial effects are that: the embodiment of the invention provides a display module, which comprises a display panel and a supporting component; the display panel comprises a display part, a bending part and a binding part, wherein the binding part is bent to one side of the display part far away from the light emitting side through the bending part; one side of the supporting component is attached to the display part, the other side of the supporting component is attached to the binding part, and the supporting component comprises a buffer layer positioned on one side of the display part far away from the light emitting side, a composite film layer positioned on one side of the buffer layer far away from the display part, and a reinforcing layer positioned between the composite film layer and the binding part; the composite film layer comprises a heat dissipation layer and a reinforcing layer which is arranged on the same layer as the heat dissipation layer, wherein the hardness of the reinforcing layer is greater than that of the heat dissipation layer, and the orthographic projection of the reinforcing layer on the display panel is overlapped with the orthographic projection of the reinforcing layer on the display panel; according to the invention, the reinforcing layer and the heat dissipation layer are arranged on the same layer, the hardness of the reinforcing layer is larger than that of the heat dissipation layer, the orthographic projection of the reinforcing layer on the display panel is overlapped with the orthographic projection of the reinforcing layer on the display panel, the reinforcing layer can provide better supporting force in the bending process, the pressing deformation between the reinforcing layer and the heat dissipation layer is avoided, and the problem of impression caused by the bending process is solved on the premise of not increasing the thickness.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the description of the embodiments will be briefly described below.
Fig. 1 is a schematic diagram of a basic structure of a display module according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a basic structure of a buffer layer and a composite film layer according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a basic structure of a buffer layer and another composite film layer according to an embodiment of the present invention.
Fig. 4a to 4c are schematic basic structural diagrams of each component in the preparation process flow of the composite film layer in fig. 1.
Fig. 5a and 5b are schematic basic structural diagrams of components in another process flow for preparing the composite film layer in fig. 1.
Fig. 6 is a schematic diagram of a basic structure of a buffer layer and a further composite film layer according to an embodiment of the present invention.
FIG. 7 is a schematic diagram of a basic structure of a buffer layer and a further composite film layer according to an embodiment of the present invention.
Fig. 8 is a schematic diagram of a basic structure of a buffer layer and a further composite film layer according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. In the drawings, the size and thickness of the components depicted in the drawings are not to scale for clarity and ease of understanding and description.
Fig. 1 is a schematic diagram of a basic structure of a display module according to an embodiment of the present invention, where the display module includes a display panel 10 and a support assembly 20; the display panel 10 includes a display portion 101, a bending portion 102, and a binding portion 103, wherein the binding portion 103 is bent to a side of the display portion 101 away from the light emitting side by the bending portion 102; one side of the supporting component 20 is attached to the display portion 101, the other side is attached to the binding portion 103, the supporting component 20 includes a buffer layer 203 located on one side of the display portion 101 away from the light emitting side, a composite film layer 204 located on one side of the buffer layer 203 away from the display portion 101, and a reinforcing layer 205 located between the composite film layer 204 and the binding portion 103; the composite film 204 includes a heat dissipation layer 2041 and a reinforcing layer 2042 disposed on the same layer as the heat dissipation layer 2041, wherein the hardness of the reinforcing layer 2042 is greater than that of the heat dissipation layer 2041, and the orthographic projection of the reinforcing layer 2042 on the display panel 10 coincides with the orthographic projection of the reinforcing layer 205 on the display panel 10.
It can be appreciated that in order to realize narrow frame, the prior art will buckle the binding portion to the back of display panel generally to improve display panel's screen ratio, however, in the process of buckling, because the heat dissipation layer is located display panel's outermost side, the heat dissipation layer generally adopts copper in addition, and copper's material is softer, when binding portion and display portion pressfitting, produce pressfitting deformation easily between enhancement layer and the copper, lead to display panel to appear the impression, lead to user experience to descend, prior art generally adopts and adds the one deck reinforcement steel sheet in the outside of heat dissipation layer, in order to improve the holding power of heat dissipation layer, but the holistic thickness increase of display module assembly can be led to the additional reinforcement steel sheet of setting up, be unfavorable for realizing the modularity frivolously. The invention provides a composite film 204, which comprises a heat dissipation layer 2041 and a reinforcing layer 2042, wherein the reinforcing layer 2042 and the heat dissipation layer 2041 are arranged in the same layer, the hardness of the reinforcing layer 2042 is higher than that of the heat dissipation layer 2041, the orthographic projection of the reinforcing layer 2042 on the display panel 10 and the orthographic projection of the reinforcing layer 205 on the display panel 10 are overlapped, and compared with the heat dissipation layer 2041, the reinforcing layer 2042 can provide better supporting force in the bending process, so that the lamination deformation between the reinforcing layer 205 and the heat dissipation layer 2041 is avoided, and the problem of marks caused in the bending process is solved on the premise of not increasing the thickness.
In one embodiment, the support assembly 20 further includes a first support layer 201 and a second support layer 202, the first support layer 201 is located on a side surface of the display portion 101 away from the light emitting side, the buffer layer 203 is located on a side surface of the first support layer 201 away from the display portion 101, the second support layer 202 is located on a side surface of the binding portion 103 near the support assembly 20, and the reinforcing layer 205 is located on a side surface of the second support layer 202 away from the binding portion 103.
It should be noted that, the first supporting layer 201 and the second supporting layer 202 are respectively configured to support the display portion 101 and the binding portion 103 of the display panel 10, and the reinforcing layer 205 is configured to fix the binding portion 103, and in a bending process, that is, in a process of pressing the binding portion 103 and the display portion 101, since an orthographic projection of the reinforcing layer 2042 on the display panel 10 coincides with an orthographic projection of the reinforcing layer 205 on the display panel 10, that is, the reinforcing layer 2042 can improve a hardness of the composite film 204 corresponding to an area of the reinforcing layer 205, that is, a supporting force of the composite film 204 is improved, and press-fit deformation is avoided in a bending process, so as to avoid an imprint of the display panel 10. In addition, the reinforcing layer 2042 and the heat dissipation layer 2041 are arranged on the same layer, so that the overall thickness of the display module is not increased additionally.
In one embodiment, an end of the heat dissipation layer 2041 near the bending portion 102 is provided with a notch 80, and the reinforcing layer 2042 is located in the notch 80. It can be appreciated that, since the binding portion 103 is fixed at the end of the heat dissipation layer 2041 near the bending portion 102, in this embodiment, the notch 80 is disposed at the end of the heat dissipation layer 2041 near the bending portion 102, and the reinforcing layer 2042 is disposed in the notch 80, so as to improve the supporting force of the composite film 204 corresponding to the region of the reinforcing layer 205, avoid the pressing deformation during the bending process, and avoid the imprint of the display panel 10. In addition, the reinforcing layer 2042 and the heat dissipation layer 2041 are arranged on the same layer, so that the overall thickness of the display module is not increased additionally.
In one embodiment, the depth of the notch 80 is less than or equal to the thickness of the heat dissipation layer 2041 in the direction of the light emitting side of the display panel 10. In fig. 1 is shown an embodiment in which the depth of the indentations 80 is equal to the thickness of the heat dissipation layer 2041, i.e. the thickness of the stiffening layer 2042 in fig. 1 is equal to the thickness of the heat dissipation layer 2041.
Next, referring to fig. 2 and 3, a schematic basic structure of the buffer layer and the composite film provided by the embodiment of the present invention and a schematic basic structure of the buffer layer and another composite film provided by the embodiment of the present invention are shown in fig. 2 and 3, respectively, in which a depth T1 of the notch 80 is smaller than a thickness T2 of the heat dissipation layer 2041, specifically, the notch 80 in fig. 2 is located at a side of the heat dissipation layer 2041 away from the buffer layer 203, and the notch 80 in fig. 3 is located at a side of the heat dissipation layer 2041 near the buffer layer 203. It can be appreciated that, in this embodiment, by setting the depth T1 of the notch 80 to be smaller than the thickness T2 of the heat dissipation layer 2041, not only the reinforcing layer 2042 but also a part of the heat dissipation layer 2041 is disposed in the region corresponding to the reinforcing layer 205 (as shown in fig. 1), so that the composite film 204 corresponding to the region of the reinforcing layer 205 can be provided with both increased hardness and heat dissipation function.
It should be noted that, in the direction perpendicular to the light emitting side of the display panel, the width of the notch 80 may be greater than the width of the reinforcing layer 205, that is, the orthographic projection of the reinforcing layer 205 on the display panel falls within the orthographic projection range of the reinforcing layer 2042 on the display panel, that is, in the bending process, the reinforcing layer 2042 is disposed in the lamination area of the reinforcing layer 205 and the composite film 204, so as to avoid lamination deformation and imprint of the display panel. In addition, the reinforcing layer 2042 and the heat dissipation layer 2041 are arranged on the same layer, so that the overall thickness of the display module is not increased additionally.
With continued reference to fig. 1, in one embodiment, the display module further includes a polarizing layer 30 disposed on the light emitting side of the display portion 101, a cover plate 50 disposed on a side of the polarizing layer 30 away from the display portion 101, and a protective layer 60 disposed on a side of the display panel 10 away from the supporting component 20. Wherein, the cover plate 50 is attached to the polarizing layer 30 through the optical adhesive layer 40, and a light shielding adhesive 70 is further disposed around one side of the cover plate 50, which is close to the polarizing layer 30, so as to prevent lateral light leakage of the display module.
In one embodiment, the material of the stiffening layer 2042 is stainless steel or an aluminum alloy. It can be appreciated that copper is generally used for the heat dissipation layer 2041, and the copper is made of a softer material, and the reinforcing layer 2042 is made of stainless steel or aluminum alloy, which has a hardness far greater than that of copper, so that the supporting force of the composite film 204 can be improved.
Next, please refer to fig. 4 a-4 c, which are schematic diagrams illustrating the basic structure of each component in the process flow of preparing the composite film in fig. 1, wherein the thickness of the reinforcing layer 2042 in fig. 1 is equal to the thickness of the heat dissipation layer 2041, so that the composite film 204 can be prepared by splicing and pasting. Specifically, as shown in fig. 4a, the heat dissipation layer 2041 is cut by a die cutting process to form a notch, and then the heat dissipation layer 2041 is attached to a corresponding position on the buffer layer 203 through the pressure sensitive adhesive layer 21; next, as shown in fig. 4b, a pressure-sensitive adhesive layer 21 is attached to one side of the reinforcing layer 2042, and then the side of the reinforcing layer 2042 to which the pressure-sensitive adhesive layer 21 is attached to the notch of the heat dissipation layer 2041 in an aligned manner by a roller process; finally, as shown in fig. 4c, the side of the reinforcing layer 2042 to which the pressure sensitive adhesive layer 21 is attached to the buffer layer 203 exposed from the notch of the heat dissipation layer 2041, so as to obtain a composite film 204. Wherein, an air layer is arranged between the reinforcing layer 2042 and the heat dissipation layer 2041, and the composite film 204 is adhered to the buffer layer 203 through the pressure sensitive adhesive layer 21.
It should be noted that the preparation method of the splicing and pasting can be applied not only to the composite film layer of fig. 1, but also to the composite film layers of fig. 2 and 3. Specifically, the side of the reinforcing layer 2042 to which the pressure-sensitive adhesive layer 21 is attached to the portion of the heat dissipation layer 2041 where the notch is exposed.
Next, referring to fig. 5a and fig. 5b, which are schematic basic structural diagrams of components in another process flow of preparing the composite film 204 in fig. 1, the thickness of the reinforcing layer 2042 in fig. 1 is equal to the thickness of the heat dissipation layer 2041, so that the composite film 204 can be prepared by laser thermal welding. Specifically, as shown in fig. 5a, the reinforcing layer 2042 and the heat dissipation layer 2041 are welded first to obtain a spliced coil, wherein the length of the spliced coil may be infinitely long, and the width of the spliced coil corresponds to the length of the composite film 204 in the direction perpendicular to the light emitting side of the display panel; next, as shown in fig. 5b, the above-mentioned splicing roll is cut according to the thickness of the composite film 204 in the direction of the light emitting side of the display panel, and then the cut composite film 204 is adhered to the buffer layer 203 by a grid glue (not shown).
Next, referring to fig. 6, a schematic basic structure of a buffer layer and a further composite film layer provided in an embodiment of the invention, the support assembly includes a buffer layer 203 and a composite film layer 204 located on a side of the buffer layer 203 away from the display portion 101 (as shown in fig. 1); the composite film 204 includes a heat dissipation layer 2041 and a reinforcing layer 2042 disposed in the same layer as the heat dissipation layer 2041, wherein the hardness of the reinforcing layer 2042 is greater than that of the heat dissipation layer 2041, and the front projection of the reinforcing layer 2042 on the display panel 10 (fig. 1) coincides with the front projection of the reinforcing layer 205 (fig. 1) on the display panel 10. Wherein, at least one first groove 91 is disposed on a side of the heat dissipation layer 2041 away from the buffer layer 203, and the reinforcing layer 2042 is located in the first groove 91. It can be appreciated that, unlike the composite film layer of fig. 2, the heat dissipation layers 2041 are disposed on both sides of the reinforcing layer 2042 in the present embodiment, so that the heat dissipation effect corresponding to the region of the reinforcing layer 205 is further improved. In fig. 6, only 3 first grooves 91 are provided on one side of the heat dissipation layer 2041 away from the buffer layer 203, and other embodiments are not described herein.
Next, referring to fig. 7, a schematic basic structure of a buffer layer and another composite film layer provided in an embodiment of the invention is shown, where the support assembly includes a buffer layer 203 and a composite film layer 204 located on a side of the buffer layer 203 away from the display portion 101 (as shown in fig. 1); the composite film 204 includes a heat dissipation layer 2041 and a reinforcing layer 2042 disposed in the same layer as the heat dissipation layer 2041, wherein the hardness of the reinforcing layer 2042 is greater than that of the heat dissipation layer 2041, and the front projection of the reinforcing layer 2042 on the display panel 10 (fig. 1) coincides with the front projection of the reinforcing layer 205 (fig. 1) on the display panel 10. Wherein, at least one second groove 92 is disposed on a side of the heat dissipation layer 2041 adjacent to the buffer layer 203, and the reinforcing layer 2042 is located in the second groove 92. It can be understood that, unlike the composite film layer of fig. 3, the heat dissipation layers 2041 are disposed on both sides of the reinforcing layer 2042 in the present embodiment, so that the heat dissipation effect corresponding to the region of the reinforcing layer 205 is further improved. In fig. 7, only 3 second grooves 92 are provided on one side of the heat dissipation layer 2041 near the buffer layer 203, and other embodiments are not described herein.
Next, referring to fig. 8, a schematic basic structure of a buffer layer and a further composite film layer according to an embodiment of the present invention is shown, where the support assembly includes a buffer layer 203 and a composite film layer 204 located on a side of the buffer layer 203 away from the display portion 101 (as shown in fig. 1); the composite film 204 includes a heat dissipation layer 2041 and a reinforcing layer 2042 disposed in the same layer as the heat dissipation layer 2041, wherein the hardness of the reinforcing layer 2042 is greater than that of the heat dissipation layer 2041, and the front projection of the reinforcing layer 2042 on the display panel 10 (fig. 1) coincides with the front projection of the reinforcing layer 205 (fig. 1) on the display panel 10. Wherein, at least one through hole 93 is provided on the heat dissipation layer 2041, and the reinforcing layer 2042 is located in the through hole 93. It can be appreciated that, unlike the composite film layer of fig. 1, the heat dissipation layers 2041 are disposed on both sides of the reinforcing layer 2042 in the present embodiment, so that the heat dissipation effect corresponding to the region of the reinforcing layer 205 is further improved. In fig. 8, only 3 through holes 93 are provided on the heat dissipation layer 2041 as an example, and other embodiments will not be described in detail.
The embodiment of the invention also provides a display device which comprises the display module and a driving chip electrically connected with the binding part of the display module. Specifically, the structure and the preparation process of the display module refer to fig. 1 to 8 and the related description, and are not repeated here. The display device provided by the embodiment of the invention can be as follows: products or components with display function such as mobile phones, tablet computers, notebook computers, digital cameras, navigator and the like.
In summary, the display module provided by the embodiment of the invention includes a display panel and a supporting component; the display panel comprises a display part, a bending part and a binding part, wherein the binding part is bent to one side of the display part far away from the light emitting side through the bending part; one side of the supporting component is attached to the display part, the other side of the supporting component is attached to the binding part, and the supporting component comprises a buffer layer positioned on one side of the display part far away from the light emitting side, a composite film layer positioned on one side of the buffer layer far away from the display part, and a reinforcing layer positioned between the composite film layer and the binding part; the composite film layer comprises a heat dissipation layer and a reinforcing layer which is arranged on the same layer as the heat dissipation layer, wherein the hardness of the reinforcing layer is greater than that of the heat dissipation layer, and the orthographic projection of the reinforcing layer on the display panel is overlapped with the orthographic projection of the reinforcing layer on the display panel; according to the invention, the reinforcing layer and the heat dissipation layer are arranged on the same layer, the hardness of the reinforcing layer is larger than that of the heat dissipation layer, the orthographic projection of the reinforcing layer on the display panel is overlapped with the orthographic projection of the reinforcing layer on the display panel, the reinforcing layer can provide better supporting force in the bending process, the pressing deformation between the reinforcing layer and the heat dissipation layer is avoided, the problem of the impression brought by the bending process is solved on the premise that the thickness is not increased, and the technical problem that the display module in the prior art is improved by additionally arranging the reinforcing steel sheet on the outer side of copper so as to improve the impression generated by the compression of the display panel in the bending process, but the thickness of the whole display module is increased, and the realization of the light and thin display module is not facilitated.
The display module and the display device provided by the embodiment of the invention are described in detail. It should be understood that the exemplary embodiments described herein are to be considered merely descriptive for aiding in the understanding of the method of the present invention and its core concepts and not for limiting the invention.
Claims (8)
1. A display module, comprising:
the display panel comprises a display part, a bending part and a binding part, wherein the binding part is bent to one side, far away from the light emitting side, of the display part through the bending part;
the support assembly is attached to the display part on one side and attached to the binding part on the other side, and comprises a buffer layer positioned on one side, far away from the light emitting side, of the display part, a composite film layer positioned on one side, far away from the display part, of the buffer layer, and a reinforcing layer positioned between the composite film layer and the binding part;
the composite film layer comprises a heat dissipation layer and a reinforcing layer which is arranged on the same layer with the heat dissipation layer, wherein the hardness of the reinforcing layer is larger than that of the heat dissipation layer, and the orthographic projection of the reinforcing layer on the display panel is overlapped with the orthographic projection of the reinforcing layer on the display panel;
a notch is formed in one end, close to the bending part, of the heat dissipation layer, and the reinforcing layer is positioned in the notch; in the direction of the light-emitting side of the display panel, the depth of the notch is smaller than the thickness of the heat dissipation layer, and in the direction perpendicular to the light-emitting side of the display panel, the orthographic projection of the notch on the display panel and the orthographic projection of a part of the heat dissipation layer on the display panel are both positioned in the orthographic projection range of the reinforcing layer on the display panel.
2. The display module of claim 1, wherein the heat dissipation layer has at least one first groove on a side thereof away from the buffer layer, and the reinforcement layer is disposed in the first groove.
3. The display module of claim 1, wherein the heat dissipation layer has at least one second groove on a side thereof adjacent to the buffer layer, and the reinforcement layer is disposed in the second groove.
4. The display module of claim 1, wherein the heat dissipation layer is provided with at least one through hole, and the reinforcement layer is located in the through hole.
5. The display module of claim 1, wherein the material of the stiffening layer is stainless steel or an aluminum alloy.
6. The display module of claim 1, wherein an air layer is provided between the reinforcing layer and the heat dissipation layer, and the composite film layer is adhered to the buffer layer through a pressure sensitive adhesive layer.
7. The display module of claim 1, wherein the stiffening layer is welded to the heat sink layer.
8. A display device comprising the display module of any one of claims 1 to 7 and a driver chip electrically connected to a binding portion of the display module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111049143.8A CN113764356B (en) | 2021-09-08 | 2021-09-08 | Display module and display device |
Applications Claiming Priority (1)
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| CN114038339B (en) * | 2021-12-09 | 2023-01-10 | 武汉华星光电半导体显示技术有限公司 | Display module and mobile terminal |
| CN114203048B (en) * | 2021-12-22 | 2023-01-24 | 武汉华星光电半导体显示技术有限公司 | Display module and mobile terminal |
| CN114203050B (en) * | 2021-12-28 | 2023-11-28 | 武汉华星光电半导体显示技术有限公司 | Display module and display terminal |
| WO2023133718A1 (en) * | 2022-01-12 | 2023-07-20 | 厦门市芯颖显示科技有限公司 | Display panel and tiled display screen |
| CN114495741B (en) * | 2022-02-10 | 2023-06-27 | 武汉华星光电半导体显示技术有限公司 | Display module and terminal equipment |
| CN114666997A (en) * | 2022-03-29 | 2022-06-24 | 京东方科技集团股份有限公司 | Manufacturing method of display module, equipment for manufacturing display module and display module |
| CN114783309B (en) * | 2022-04-12 | 2023-11-28 | 武汉华星光电半导体显示技术有限公司 | Composite functional film, preparation method thereof and display device |
| CN115206189A (en) * | 2022-07-11 | 2022-10-18 | 武汉华星光电半导体显示技术有限公司 | Display device and display terminal |
| CN115240550B (en) * | 2022-07-22 | 2023-08-18 | 湖北长江新型显示产业创新中心有限公司 | Display device |
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