CN113763822A - Bonding alignment compensation method and device - Google Patents
Bonding alignment compensation method and device Download PDFInfo
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Abstract
The embodiment of the invention discloses a bonding alignment compensation method and a bonding alignment compensation device. In one embodiment, the method comprises: acquiring coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards; calculating the alignment coordinate of the first circuit board according to the mean value of the coordinates of the at least four first alignment marks, and calculating the alignment coordinate of the display panel according to the mean value of the coordinates of the at least four second alignment marks; and calculating the offset of the first circuit board and the display panel in the first direction on the bonding station according to the alignment coordinate of the first circuit board and the alignment coordinate of the display panel, and performing alignment compensation on the offset distance in the first direction according to the offset distance. The method can effectively reduce the influence of plate warping caused by multiple high-temperature processes in the production process of the first circuit board, reduce the bonding offset and improve the bonding quality.
Description
Technical Field
The invention relates to the technical field of bonding compensation. And more particularly, to a bonding alignment compensation method and a compensation apparatus thereof.
Background
At present, a rigid-flex board PCBA is frequently used in the design of a display panel product, and because the rigid-flex board PCBA has well connected a flexible printed circuit board FPC and a printed circuit board PCB, the rigid-flex board PCBA can reduce a FOB (FPC ON PCB, the flexible printed circuit board is connected with the printed circuit board) bonding process.
However, the flexible printed circuit board PCBA undergoes a plurality of high temperature processes in a Surface Mount Technology (SMT) production process, and a slight warpage deformation of the PCB board occurs, which causes an FPC ON the flexible printed circuit board PCBA to be positioned and offset, and makes it difficult to position the FPC and position the display panel in the FOG (FPC ON GLASS, where a flexible printed circuit board is connected to a GLASS substrate) bonding process.
Disclosure of Invention
The invention aims to provide a bonding alignment compensation method and a compensation device thereof, which are used for solving at least one of the problems in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a bonding alignment compensation method for bonding alignment of a first circuit board and a display panel, wherein the first circuit board comprises a printed circuit board and a plurality of flexible circuit boards which are arranged side by side, the flexible circuit board is provided with a first alignment mark, the display panel is provided with a plurality of second alignment marks corresponding to the flexible circuit boards, and the method comprises the following steps:
acquiring coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards, wherein the at least four flexible circuit boards comprise two flexible circuit boards positioned in the middle and two flexible circuit boards positioned at the edge;
calculating according to the mean value of the coordinates of the at least four first alignment marks to obtain the alignment coordinates of the first circuit board, and calculating according to the mean value of the coordinates of the at least four second alignment marks to obtain the alignment coordinates of the display panel;
and calculating the offset of the first circuit board and the display panel in the first direction on a bonding station according to the alignment coordinate of the first circuit board and the alignment coordinate of the display panel, and performing alignment compensation on the offset distance of the first direction according to the offset of the first circuit board and the display panel, wherein the first direction is the direction of the first circuit board facing the display panel on the bonding station.
The bonding alignment compensation method provided by the first aspect of the present application obtains coordinates of first alignment marks of at least four flexible circuit boards in a first circuit board and coordinates of at least four second alignment marks in a display panel corresponding to the at least four flexible circuit boards, obtains alignment coordinates of the first circuit board according to an average value of the coordinates of the at least four first alignment marks, obtains alignment coordinates of the display panel according to an average value of the coordinates of the at least four second alignment marks, and then obtains an offset in a first direction between the first circuit board and the display panel at a bonding station according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel, and performs alignment compensation of an offset distance in the first direction according to the offset distance, thereby effectively reducing an influence of a warpage of a board caused by a plurality of high temperature processes in a production process on the bonding alignment of the first circuit board and the first direction of the display panel, reduce the bonding offset and improve the bonding quality.
Optionally, the method further comprises:
and calculating according to the alignment coordinate of the first circuit board and the alignment coordinate of the display panel to obtain the offset of the first circuit board and the display panel in the second direction on the binding station and performing alignment compensation of the offset distance of the second direction according to the offset of the first circuit board and the display panel in the second direction, wherein the second direction is the arrangement direction of the flexible circuit boards on the binding station.
According to the optional mode, the offset of the first circuit board and the offset of the display panel in the second direction on the bonding station can be calculated, the offset compensation of the offset distance in the second direction is carried out on the offset, the influence of the warping of the board, caused by multiple high-temperature processes in the production process, on the bonding alignment of the first circuit board and the display panel in the second direction can be effectively reduced, the bonding offset is reduced, and the bonding quality is improved.
Optionally, the method further comprises:
and calculating the angle deviation between the first circuit board and the display panel on the bonding station according to the alignment coordinate of the first circuit board, the alignment coordinate of the display panel and the coordinate distance of the first alignment marks of the two flexible circuit boards at the edge positions, and performing alignment compensation of the deviation angle according to the angle deviation.
According to the optional mode, the angle deviation of the first circuit board and the display panel on the bonding station can be obtained, the alignment compensation of the deviation angle is carried out according to the angle deviation, the influence of the board warping of the first circuit board caused by multiple high-temperature processes in the production process on the bonding alignment of the angle deviation of the first circuit board and the display panel can be effectively reduced, the bonding offset is reduced, and the bonding quality is improved.
Optionally, the obtaining the coordinates of the first alignment marks of the at least four flexible circuit boards and the coordinates of the at least four second alignment marks corresponding to the at least four flexible circuit boards includes:
moving the first circuit board to an image acquisition station, acquiring first images of at least four flexible circuit boards by using a movable image acquisition device or at least four image acquisition devices, and acquiring coordinates of first alignment marks of the at least four flexible circuit boards according to the first images;
moving a first circuit board to a bonding station by a first stroke;
moving the display panel to an image acquisition station, acquiring second images of areas of at least four second alignment marks of the display panel corresponding to the at least four flexible circuit boards by using a movable image acquisition device or at least four image acquisition devices, and acquiring coordinates of the at least four second alignment marks according to the second images;
and moving the display panel to a bonding station by the first stroke.
This optional mode, the collection of the first image of first circuit board and the second image of display panel is accomplished through image acquisition device to with the same stroke with first circuit board and display panel remove to bonding station, can ensure that the bonding of first circuit board and display panel is counterpointed and is not influenced by the stroke.
Optionally, the obtaining coordinates of the first alignment marks of the at least four flexible circuit boards and coordinates of the at least four second alignment marks corresponding to the at least four flexible circuit boards includes: and acquiring the coordinates of the first alignment marks of all the flexible circuit boards and the coordinates of all the second alignment marks corresponding to all the flexible circuit boards.
According to the optional mode, the coordinates of the first alignment marks of all the flexible circuit boards and the coordinates of all the second alignment marks in the display panel corresponding to the flexible circuit boards are obtained, so that the bonding alignment precision of the first circuit board and the display panel is higher.
The invention provides a bonding alignment compensation device for bonding alignment of a first circuit board and a display panel, wherein the first circuit board comprises a printed circuit board and a plurality of flexible circuit boards arranged side by side, the flexible circuit board is provided with a first alignment mark, the display panel is provided with a plurality of second alignment marks corresponding to the flexible circuit boards, and the device comprises:
the device comprises an acquisition unit, a display unit and a control unit, wherein the acquisition unit is used for acquiring coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards, and the at least four flexible circuit boards comprise two flexible circuit boards positioned in the middle and two flexible circuit boards positioned at the edge;
the calculation unit is used for calculating the alignment coordinates of the first circuit board according to the mean value of the coordinates of the at least four first alignment marks and calculating the alignment coordinates of the display panel according to the mean value of the coordinates of the at least four second alignment marks;
and the compensation unit is used for calculating the offset of the first circuit board and the display panel in the first direction on the bonding station according to the alignment coordinate of the first circuit board and the alignment coordinate of the display panel and performing alignment compensation on the offset distance of the first direction according to the offset of the first circuit board and the display panel, wherein the first direction is the direction of the first circuit board facing the display panel on the bonding station.
The bonding alignment compensation device provided by the second aspect of the present application obtains coordinates of first alignment marks of at least four flexible circuit boards in the first circuit board and coordinates of at least four second alignment marks in the display panel corresponding to the at least four flexible circuit boards through the obtaining unit, obtains alignment coordinates of the first circuit board through calculation of a mean value of the coordinates of the at least four first alignment marks by the calculating unit, obtains alignment coordinates of the display panel through calculation of a mean value of the coordinates of the at least four second alignment marks by the compensating unit, obtains offset in the first direction between the first circuit board and the display panel at the bonding station through calculation of the alignment coordinates of the first circuit board and the alignment coordinates of the display panel by the compensating unit, and performs alignment compensation of offset distance in the first direction according to the offset coordinates, thereby effectively reducing warpage of the first circuit board caused by multiple high temperature processes in the production process of the first circuit board to the first circuit board and the second circuit board of the display panel The influence of the bonding alignment of one direction reduces the bonding offset and improves the bonding quality.
Optionally, the compensation unit is further configured to calculate, according to the alignment coordinate of the first circuit board and the alignment coordinate of the display panel, an offset between the first circuit board and the display panel in a second direction on the bonding station and perform alignment compensation on an offset distance in the second direction according to the offset between the first circuit board and the display panel, where the second direction is an arrangement direction of the plurality of flexible circuit boards on the bonding station.
According to the optional mode, the offset of the first circuit board and the display panel in the second direction on the bonding station can be obtained through calculation of the calculating unit, and the offset distance in the second direction is subjected to alignment compensation through the compensating unit, so that the influence of board warping of the first circuit board caused by multiple high-temperature processes in the production process on the bonding alignment of the first circuit board and the display panel in the second direction can be effectively reduced, the bonding offset is reduced, and the bonding quality is improved.
Optionally, the compensation unit is further configured to calculate an angle offset between the first circuit board and the display panel at the bonding station according to the alignment coordinate of the first circuit board, the alignment coordinate of the display panel, and the coordinate distance between the first alignment marks of the two flexible circuit boards located at the edge positions, and perform alignment compensation of the offset angle according to the angle offset.
According to the optional mode, the first circuit board and the display panel are in angle deviation on the bonding station through the calculation unit, and the offset angle alignment compensation is performed through the compensation unit, so that the influence of board warping of the first circuit board caused by multiple high-temperature processes in the production process on the bonding alignment of the first circuit board and the angle deviation of the display panel can be effectively reduced, the bonding offset is reduced, and the bonding quality is improved.
Optionally, the method further comprises: the image acquisition unit comprises a movable image acquisition device or at least four image acquisition devices;
the displacement mechanism is used for moving the first circuit board to the image acquisition station;
the image acquisition unit is used for acquiring first images of at least four flexible circuit boards of a first circuit board positioned at an image acquisition station;
the acquisition unit is used for acquiring the coordinates of first alignment marks of at least four flexible circuit boards according to the first image;
the displacement mechanism is also used for moving the first circuit board to the bonding station by a first stroke;
the displacement mechanism is also used for moving the display panel to an image acquisition station;
the image acquisition unit is also used for acquiring second images of at least four second alignment mark areas, corresponding to the at least four flexible circuit boards, of the display panel positioned at an image acquisition station;
the acquisition unit is further configured to acquire coordinates of at least four second alignment marks according to the second image;
the displacement mechanism is also used for moving the display panel to the bonding station by the first stroke.
According to the optional mode, the first image of the first circuit board and the second image of the display panel are acquired through the image acquisition unit, the first circuit board and the display panel are moved to the bonding station through the displacement mechanism by the same stroke, and the bonding alignment of the first circuit board and the display panel is not affected by the stroke.
Optionally, the obtaining unit is configured to obtain coordinates of the first alignment marks of all the flexible circuit boards and coordinates of all the second alignment marks corresponding to all the flexible circuit boards.
In this optional manner, the coordinates of the first alignment marks of all the flexible circuit boards and the coordinates of all the second alignment marks in the display panel corresponding to the flexible circuit boards are obtained by the obtaining unit, so that the accuracy of bonding alignment of the first circuit board and the display panel is higher.
The invention has the following beneficial effects:
according to the technical scheme of the application, by acquiring the coordinates of the first alignment marks of at least four flexible circuit boards in the first circuit board and acquiring the coordinates of at least four second alignment marks in the display panel corresponding to the at least four flexible circuit boards, calculating the alignment coordinate of the first circuit board according to the average value of the coordinates of the at least four first alignment marks, calculating the alignment coordinate of the display panel according to the average value of the coordinates of the at least four second alignment marks, calculating the offset of the first circuit board and the display panel on the bonding station in the first direction according to the alignment coordinate of the first circuit board and the alignment coordinate of the display panel, and performing alignment compensation on the offset distance in the first direction according to the offset distance, therefore, the influence of plate warping caused by multiple high-temperature processes in the production process of the first circuit board on the bonding alignment of the first circuit board and the display panel can be eliminated.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Figure 1 shows a schematic diagram of a soft and hard combined board PCBA generating slight PCB board warpage deformation.
Fig. 2 shows a schematic diagram of a flexible Printed Circuit Board Assembly (PCBA) with 6 FPCs.
FIG. 3 illustrates a diagram of a prior art method of bonding offsets beyond regulatory specifications.
Fig. 4 shows a flowchart of a bonding alignment compensation method provided in an embodiment of the present application.
Fig. 5 shows a schematic diagram of a first collection station provided by an embodiment of the present application.
Fig. 6 shows a schematic view of a second collection station provided by an embodiment of the present application.
Fig. 7 is a schematic diagram illustrating a result of collecting 6 FPC images for bonding alignment compensation according to the bonding alignment compensation method provided in the embodiment of the present application.
FIG. 8 is a schematic diagram illustrating a bonding alignment compensation apparatus provided in an embodiment of the present application.
Detailed Description
In order to more clearly illustrate the present invention, the present invention will be further described with reference to the following examples and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
At present, often use rigid-flex board PCBA in the display panel product design, because rigid-flex board PCBA has been connected flexible circuit board FPC and printed circuit board PCB, use rigid-flex board PCBA only need once FOG (FPC ON GLASS, flexible circuit board and GLASS substrate connection) bonding technology, FOB (FPC ON PCB, flexible circuit board is connected with printed circuit board) bonding process has once been reduced, thereby shorten the technology process, also be favorable to promoting the product yield.
However, the flexible Printed Circuit Board Assembly (PCBA) undergoes a plurality of high temperature processes in a Surface Mount Technology (SMT) production process, and a slight warpage deformation of the PCB board occurs, as shown in fig. 1, so that the FPC on the flexible Printed Circuit Board Assembly (PCBA) is positioned and shifted, which makes positioning and alignment of the FPC and the display panel in the FOG bonding process difficult.
To above-mentioned problem, current FOG binds equipment and uses the camera to snatch two counterpoints, because soft or hard combination board PCBA warpage warp to FOG bind Y to the offset influence (vertical direction) more obvious, so with Y to the offset example as follows.
For example, the existing product has 6 FPCs using PCBA, as shown in fig. 2, the coordinates of FCP1 to FPC6 are (Xf1, Yf1), (Xf2, Yf2), (Xf3, Yf3), (Xf4, Yf4), (Xf5, Yf5), (Xf6, Yf6), and the coordinates of corresponding display panels FOG1 to FOG6 are (Xp1, Yp1), (Xp2, Yp2), (Xp3, Yp3), (Xp4, Yp4), (Xp5, Yp5), (Xp6, Yp6), and the alignment is performed using the Mark 2 and FPC5 (positioning points), and the alignment algorithm is as follows:
calculating the midpoint of the PCB as (Xfm, Yfm) by using coordinates (Xf2, Yf2) of the FPC2 and coordinates (Xf5, Yf5) of the FPC5, namely:
Xfm＝(Xf2+Xf5)/2；
Yfm＝(Yf2+Yf5)/2；
the coordinates (Xp2, Yp2) of the display panel FOG2 and the coordinates (Xp2, Yp5) of the display panel FOG5 calculate the midpoint (Xpm, Ypm) of the display panels FOG2 and FOG5, that is:
Xpm＝(Xp2+Xp5)/2；
Ypm＝(Yp2+Yp5)/2。
the compensation amount is calculated as:
ΔX＝Xfm-Xpm,
ΔY＝Yfm-Ypm,
Δθ＝(Yfm-Ypm)/(Xt+Xfm-Xpm),
wherein, Δ X is a compensation amount in the horizontal direction; Δ Y is the amount of compensation in the vertical direction; delta theta is the compensation quantity of the offset angle between the PCBA and the display panel; xt is the pitch of FPC2 and FPC 5.
Assuming that Y-direction offsets of the PCBA are 180um, 90um, 75um, 85um, 100um and 190um respectively when the FPCs 1-6 are aligned due to warping, the marks of the FPC2 and the FPC5 in the prior art are used for aligning and compensating for-95 um, the Y-direction offsets after aligning are 85um, -5um, -20um, -5um, 10um and 95um respectively (positive and negative values indicate the offset direction of the aligned FPC relative to a display panel Mark), and it can be seen that when the offset is 80um by using the FPC2/5Mark, the offsets of the FPC1 and the FPC6Y exceed the specification, as shown in FIG. 3, the product becomes a defective product.
Therefore, under the condition that the PCB in the rigid-flex printed circuit board PCBA has warpage, the influence of warpage on other positioning cannot be accurately identified in the prior art, the condition that the bonding offset exceeds the control specification is easily generated, and particularly for notebook type display screens, the used rigid-flex printed circuit board PCBA is longer, the warpage phenomenon is more obvious, and the influence on the offset is larger.
In view of the above, taking bonding alignment applied to a first circuit board (PCBA) and a display panel as an example, an embodiment of the present invention provides a method for compensating bonding alignment, as shown in fig. 4, the method includes the following steps:
s10, obtaining the coordinates of the first alignment marks of at least four flexible circuit boards and the coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards.
Wherein the at least four flexible circuit boards include two flexible circuit boards located at a middle position and two flexible circuit boards located at an edge position.
In a specific example, the flexible-rigid printed circuit board PCBA includes a printed circuit board PCB and a plurality of flexible circuit boards arranged side by side, a first alignment mark is disposed on the flexible circuit board, and a plurality of second alignment marks are disposed at positions of the display panel corresponding to the flexible circuit boards. The number of the flexible circuit boards is an even number of at least four, and may be, for example, 4, 6, 8, 10, 12, or the like.
In this embodiment, taking 6 flexible circuit boards shown in fig. 2 as an example, a first alignment mark (Xf1, Yf1), (Xf2, Yf2), (Xf3, Yf3), (Xf4, Yf4), (Xf5, Yf5), (Xf6, and Yf6) is provided on each flexible circuit board, and a plurality of second alignment marks (Xp1, Yp1), (Xp2, Yp2), (Xp3, Yp3), (Xp4, Yp4), (Xp5, Yp5), (Xp6, and Yp6) are provided at positions of the display panel corresponding to the flexible circuit boards. The coordinates of the first alignment marks of the four flexible circuit boards and the coordinates of the four corresponding second alignment marks are obtained, and therefore the FPC positioning and display panel bonding alignment offset can meet the requirements of control specifications.
The four flexible circuit boards include two flexible circuit boards at the middle position and two flexible circuit boards at the edge position, in the present embodiment, (Xf1, Yf1), (Xf3, Yf3), (Xf4, Yf4), (Xf5, Yf5), (Xf6, Yf6) and their corresponding (Xp1, Yp1), (Xp3, Yp3), (Xp4, Yp4), (Xp6, Yp6) are obtained.
In one possible implementation, step S10 includes:
s100, moving the first circuit board to an image acquisition station, acquiring first images of at least four flexible circuit boards by using a movable image acquisition device or at least four image acquisition devices, and acquiring coordinates of first alignment marks of the at least four flexible circuit boards according to the first images.
Continuing with the foregoing example, the coordinates (Xf3, Yf3), (Xf4, Yf4) of the two flexible circuit boards located at the middle position, and the coordinates (Xf1, Yf1), (Xf6, Yf6) of the two flexible circuit boards located at the edge position, which can be obtained by capturing the first image of the flexible circuit boards with the image capturing device, are obtained.
In this embodiment, the image capturing station is provided with two capturing stations, and the first capturing station is provided with a movable image capturing device, as shown in fig. 5, the first capturing station is provided with a motion control unit and a movable image capturing device on the left and right sides. The left motion control unit drives the left movable image acquisition device to acquire a first image of the FPC1-FPC3, and the right motion control unit drives the right movable image acquisition device to acquire a first image of the FPC4-FPC6, wherein the image acquisition device is a CCD industrial camera. The first acquisition station is adaptable to acquire products of flexible circuit boards of different quantities in the soft and hard combined board PCBA, the number of cameras is small, and cost is saved.
The second acquisition station is provided with a plurality of fixed image acquisition devices, such as CCD industrial cameras, as shown in FIG. 6, the second acquisition station is provided with 6 fixed alignment cameras respectively corresponding to the lower positions of the 6 flexible circuit boards, and each fixed alignment camera is responsible for acquiring a first image of the corresponding flexible circuit board. The number of flexible circuit board is less than the product of camera quantity in the soft or hard combined plate PCBA can be gathered to the second collection station, uses the camera quantity more, and the cost is higher, can not adjust fixed counterpoint camera position when corresponding different products, but when gathering the product that the number of flexible circuit board is less than fixed counterpoint camera quantity in the soft or hard combined plate PCBA, because every camera only need be responsible for the image acquisition work of a flexible circuit board, consequently efficiency is higher.
The first acquisition station has stronger applicability than the second acquisition station, and the two acquisition stations can acquire the first image of the flexible circuit board; when the number of the flexible circuit boards in the rigid-flex printed circuit board PCBA is larger than the products of the fixed alignment cameras, a first acquisition station is selected. In this embodiment, when the first images of the FPCs 1, 3, 4 and 6 are taken by 6 flexible circuit boards, the first collecting station may be selected, and the second collecting station may also be selected.
And S102, moving the first circuit board to a bonding station by a first stroke.
Continuing with the above example, after selecting, for example, the second pick-up station to pick up the first image of FPC1, FPC3, FPC4, and FPC6, the rigid-flex board PCBA is moved to the bonding station in a first stroke using the first lead screw.
S104, moving the display panel to an image acquisition station, acquiring second images of areas of at least four second alignment marks of the display panel corresponding to the at least four flexible circuit boards by using a movable image acquisition device or at least four image acquisition devices, and acquiring coordinates of the at least four second alignment marks according to the second images.
Continuing with the above example, the first alignment mark coordinates (Xf1, Yf1) of FPC1, the first alignment mark coordinates (Xf3, Yf3) of FPC3, the first alignment mark coordinates (Xf4, Yf4) of FPC4, and the first alignment mark coordinates (Xf6, Yf6) of FPC6 are obtained by acquiring the first images of FPCs 1, 3, FPC4, and FPC6 according to the second acquisition station, and the plurality of second alignment marks in the display panel corresponding to (Xf1, Yf1), (Xf3, Yf3), (Xf4, Yf4), (Xf6, Yf6) may also be acquired by the image acquisition device.
The display panel is moved to an image acquisition station, a second acquisition station is also selected to acquire second images of the areas of the four second alignment marks of the display panel corresponding to the FPC1, the FPC2, the FPC3 and the FPC4, and the coordinates of the four second alignment marks acquired according to the second images are respectively: (Xp1, Yp1), (Xp3, Yp3), (Xp4, Yp4), (Xp6, Yp 6).
And S106, moving the display panel to a bonding station by the first stroke.
Continuing with the above example, after selecting the second collection station to collect the second image of the area of the four second alignment marks of the display panel corresponding to the FPCs 1, 2, 3 and 4, the display panel is moved to the bonding station by the first stroke using the second lead screw.
It should be noted that, the first lead screw is used to drive the rigid-flexible printed circuit board PCBA to move to the bonding station in a first stroke, and the second lead screw is used to drive the display panel to move to the bonding station in a first stroke, where both the moving range and the first stroke can be adjusted, but the paths of the rigid-flexible printed circuit board PCBA and the display panel moving from the image acquisition station to the bonding station are consistent.
And S20, calculating the alignment coordinate of the first circuit board (PCBA) according to the average value of the coordinates of the at least four first alignment marks, and calculating the alignment coordinate of the display panel according to the average value of the coordinates of the at least four second alignment marks.
Continuing with the above example, the alignment coordinates (midpoint coordinates) of the rigid-flex board PCBA are calculated from the obtained mean values of the first alignment mark coordinates (Xf1, Yf1), (Xf3, Yf3), (Xf4, Yf4), (Xf6, Yf6) of the FPCs 1, 3, 4 and 6 (Xfm1, Yfm1) as:
Xfm1＝(Xf1+Xf3+Xf4+Xf6)/4,
Yfm1＝(Yf1+Yf3+Yf4+Yf6)/4。
the alignment coordinates (midpoint coordinates) of the display panel (Xpm1, Ypm1) are calculated from the average of the obtained coordinates (Xp1, Yp1), (Xp3, Yp3), (Xp4, Yp4), (Xp6, Yp6) of the four second alignment markers:
Xpm1＝(Xp1+Xp3+Xp4+Xp6)/4,
Ypm1＝(Yp1+Yp3+Yp4+Yp6)/4。
s30, calculating according to the alignment coordinate of the first circuit board and the alignment coordinate of the display panel to obtain the offset of the first circuit board and the display panel in the first direction (Y direction) on the bonding station and performing alignment compensation of the offset distance of the first direction according to the offset of the first circuit board and the display panel in the first direction (Y direction), wherein the first direction is the direction of the first circuit board facing the display panel on the bonding station.
Continuing with the above example, the vertical deformation of the rigid-flexible printed circuit board PCBA caused by the warpage deformation of the PCB board is the most serious, and the vertical offset of the rigid-flexible printed circuit board PCBA and the display panel at the bonding station is calculated according to (Xfm1, Yfm1) (Xpm1, Ypm1) as follows: the Δ Y1 is Yfm1-Ypm1, and the offset distance in the vertical direction is compensated for according to Δ Y1.
In one possible implementation, the method further includes:
and S40, calculating according to the alignment coordinate of the first circuit board and the alignment coordinate of the display panel to obtain the offset of the first circuit board and the display panel in the second direction on the bonding station and performing alignment compensation of the offset distance in the second direction according to the offset of the first circuit board and the display panel, wherein the second direction (X direction) is the arrangement direction of the flexible circuit boards on the bonding station.
Continuing with the above example, due to the warpage deformation of the PCB board, the horizontal direction of the rigid-flexible printed circuit board PCBA is slightly deformed, and the offset of the rigid-flexible printed circuit board PCBA and the display panel in the horizontal direction at the bonding station is calculated according to (Xfm1, Yfm1) (Xpm1, Ypm1) as: when Δ X1 is Xfm1 to Xpm1, the offset distance in the horizontal direction is compensated for by Δ X1.
In one possible implementation, the method further includes:
s50, calculating the angle deviation between the first circuit board and the display panel on the bonding station according to the alignment coordinate of the first circuit board, the alignment coordinate of the display panel and the coordinate distance of the first alignment marks of the two flexible circuit boards at the edge positions, and performing alignment compensation of the deviation angle according to the angle deviation.
Continuing with the above example, due to the warpage deformation of the PCB board, the rigid-flexible printed circuit board PCBA and the display panel also have a slight offset angle, and according to the alignment coordinates (Xfm1, Yfm1) of the rigid-flexible printed circuit board, the alignment coordinates (Xpm1, Ypm1) of the display panel, and the coordinate distance Xt1 of the first alignment marks of the two flexible printed circuit boards located at the edge position, the angular offset between the rigid-flexible printed circuit board PCBA and the display panel at the bonding station is calculated as: Δ θ 1 ═ (Yfm1-Ypm1)/(Xt1+ Xfm1-Xpm1), where Xt1 is the pitch of FPCs 1 and 6.
In one possible implementation manner, the obtaining coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards includes: and acquiring the coordinates of the first alignment marks of all the flexible circuit boards and the coordinates of all the second alignment marks corresponding to all the flexible circuit boards.
In a specific example, as shown in fig. 7, the rigid-flexible printed circuit board PCBA has 6 FPCs, the image capturing device is used to capture a first image of the 6 FPCs and a second image of an area of 6 second alignment marks of the display panel corresponding to the 6 flexible printed circuit boards, the rigid-flexible printed circuit board PCBA and the display panel are moved to the bonding station by a first stroke, coordinates of the first alignment marks of the 6 FPCs are obtained according to the captured first image, a midpoint coordinate of the rigid-flexible printed circuit board PCBA and a midpoint coordinate of the display panel are obtained according to the captured second image and the coordinates of the 6 second alignment marks corresponding to the 6 flexible printed circuit boards, and then the rigid-flexible printed circuit board PCBA and the display panel at the bonding station are obtained according to the mean value of the coordinates of the 6 first alignment marks and the mean value of the coordinates of the 6 second alignment marks, and then the rigid-flexible printed circuit board PCBA and the midpoint coordinate of the display panel are obtained according to the midpoint coordinate of the rigid-flexible printed circuit board PCBA and the midpoint coordinate of the display panel at the bonding station in the vertical direction, And (4) offsetting in the horizontal direction and the offset angle, and performing alignment compensation in the vertical direction, the horizontal direction and the offset angle according to the offset.
According to the implementation mode, the coordinates of the first alignment marks of all the flexible circuit boards and the coordinates of all the second alignment marks in the display panel corresponding to the flexible circuit boards are obtained, so that the bonding alignment precision of the first circuit board and the display panel is higher.
It should be understood by those skilled in the art that although the above steps are described in the order of S10-S50, it is not meant to necessarily be performed in such an order, for example, S50 may be performed first and then S30 may be performed, as long as the logic is not violated.
Another embodiment of the present application provides a bonding counterpoint compensation arrangement for first circuit board and display panel's bonding counterpoint, first circuit board includes printed circuit board and a plurality of flexible circuit board of arranging side by side, flexible circuit board is provided with first counterpoint mark, display panel is provided with the correspondence a plurality of second counterpoint marks of a plurality of flexible circuit board, as shown in fig. 8, the device includes:
the device comprises an acquisition unit, a display unit and a control unit, wherein the acquisition unit is used for acquiring coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards, and the at least four flexible circuit boards comprise two flexible circuit boards positioned in the middle and two flexible circuit boards positioned at the edge;
the calculation unit is used for calculating the alignment coordinates of the first circuit board according to the mean value of the coordinates of the at least four first alignment marks and calculating the alignment coordinates of the display panel according to the mean value of the coordinates of the at least four second alignment marks;
and the compensation unit is used for calculating the offset of the first circuit board and the display panel in the first direction on the bonding station according to the alignment coordinate of the first circuit board and the alignment coordinate of the display panel and performing alignment compensation on the offset distance of the first direction according to the offset of the first circuit board and the display panel, wherein the first direction is the direction of the first circuit board facing the display panel on the bonding station.
In a possible implementation manner, the compensation unit is further configured to calculate, according to the alignment coordinate of the first circuit board and the alignment coordinate of the display panel, an offset in a second direction between the first circuit board and the display panel at the bonding station and perform alignment compensation on an offset distance in the second direction according to the offset in the second direction, where the second direction is an arrangement direction of the plurality of flexible circuit boards at the bonding station.
In a possible implementation manner, the compensation unit is further configured to calculate an angle offset between the first circuit board and the display panel at the bonding station according to the alignment coordinate of the first circuit board, the alignment coordinate of the display panel, and the coordinate distance between the first alignment marks of the two flexible circuit boards located at the edge positions, and perform alignment compensation of the offset angle according to the angle offset.
In one possible implementation manner, the method further includes: the image acquisition unit comprises a movable image acquisition device or at least four image acquisition devices;
the displacement mechanism is used for moving the first circuit board to the image acquisition station;
the image acquisition unit is used for acquiring first images of at least four flexible circuit boards of a first circuit board positioned at an image acquisition station;
the acquisition unit is used for acquiring the coordinates of first alignment marks of at least four flexible circuit boards according to the first image;
the displacement mechanism is also used for moving the first circuit board to the bonding station by a first stroke;
the displacement mechanism is also used for moving the display panel to an image acquisition station;
the image acquisition unit is also used for acquiring second images of at least four second alignment mark areas, corresponding to the at least four flexible circuit boards, of the display panel positioned at an image acquisition station;
the acquisition unit is further configured to acquire coordinates of at least four second alignment marks according to the second image;
the displacement mechanism is also used for moving the display panel to the bonding station by the first stroke.
In a possible implementation manner, the obtaining unit is configured to obtain coordinates of the first alignment marks of all the flexible circuit boards and coordinates of all the second alignment marks corresponding to all the flexible circuit boards.
It should be noted that the principle and the working flow of the bonding alignment compensation device provided in this embodiment are similar to those of the bonding alignment compensation method, and reference may be made to the above description for relevant points, which is not described herein again.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
It is further noted that, in the description of the present invention, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations and modifications can be made on the basis of the above description, and all embodiments cannot be exhaustive, and all obvious variations and modifications belonging to the technical scheme of the present invention are within the protection scope of the present invention.
Claims (10)
1. The bonding alignment compensation method is used for bonding alignment of a first circuit board and a display panel, the first circuit board comprises a printed circuit board and a plurality of flexible circuit boards which are arranged side by side, the flexible circuit boards are provided with first alignment marks, the display panel is provided with a plurality of second alignment marks corresponding to the flexible circuit boards, and the method comprises the following steps:
acquiring coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards, wherein the at least four flexible circuit boards comprise two flexible circuit boards positioned in the middle and two flexible circuit boards positioned at the edge;
calculating according to the mean value of the coordinates of the at least four first alignment marks to obtain the alignment coordinates of the first circuit board, and calculating according to the mean value of the coordinates of the at least four second alignment marks to obtain the alignment coordinates of the display panel;
and calculating the offset of the first circuit board and the display panel in the first direction on a bonding station according to the alignment coordinate of the first circuit board and the alignment coordinate of the display panel, and performing alignment compensation on the offset distance of the first direction according to the offset of the first circuit board and the display panel, wherein the first direction is the direction of the first circuit board facing the display panel on the bonding station.
2. The method of claim 1, further comprising:
and calculating according to the alignment coordinate of the first circuit board and the alignment coordinate of the display panel to obtain the offset of the first circuit board and the display panel in the second direction on the binding station and performing alignment compensation of the offset distance of the second direction according to the offset of the first circuit board and the display panel in the second direction, wherein the second direction is the arrangement direction of the flexible circuit boards on the binding station.
3. The method of claim 1, further comprising:
and calculating the angle deviation between the first circuit board and the display panel on the bonding station according to the alignment coordinate of the first circuit board, the alignment coordinate of the display panel and the coordinate distance of the first alignment marks of the two flexible circuit boards at the edge positions, and performing alignment compensation of the deviation angle according to the angle deviation.
4. The method according to any one of claims 1-3, wherein the obtaining coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards comprises:
moving the first circuit board to an image acquisition station, acquiring first images of at least four flexible circuit boards by using a movable image acquisition device or at least four image acquisition devices, and acquiring coordinates of first alignment marks of the at least four flexible circuit boards according to the first images;
moving a first circuit board to a bonding station by a first stroke;
moving the display panel to an image acquisition station, acquiring second images of areas of at least four second alignment marks of the display panel corresponding to the at least four flexible circuit boards by using a movable image acquisition device or at least four image acquisition devices, and acquiring coordinates of the at least four second alignment marks according to the second images;
and moving the display panel to a bonding station by the first stroke.
5. The method of claim 1, wherein obtaining coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards comprises: and acquiring the coordinates of the first alignment marks of all the flexible circuit boards and the coordinates of all the second alignment marks corresponding to all the flexible circuit boards.
6. The utility model provides a nation decides counterpoint compensation arrangement which characterized in that for the nation of first circuit board and display panel is counterpointed, first circuit board includes printed circuit board and a plurality of flexible circuit board of arranging side by side, flexible circuit board is provided with first counterpoint mark, display panel is provided with the correspondence a plurality of second counterpoint marks of a plurality of flexible circuit board, the device includes:
the device comprises an acquisition unit, a display unit and a control unit, wherein the acquisition unit is used for acquiring coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards, and the at least four flexible circuit boards comprise two flexible circuit boards positioned in the middle and two flexible circuit boards positioned at the edge;
the calculation unit is used for calculating the alignment coordinates of the first circuit board according to the mean value of the coordinates of the at least four first alignment marks and calculating the alignment coordinates of the display panel according to the mean value of the coordinates of the at least four second alignment marks;
and the compensation unit is used for calculating the offset of the first circuit board and the display panel in the first direction on the bonding station according to the alignment coordinate of the first circuit board and the alignment coordinate of the display panel and performing alignment compensation on the offset distance of the first direction according to the offset of the first circuit board and the display panel, wherein the first direction is the direction of the first circuit board facing the display panel on the bonding station.
7. The apparatus of claim 6, wherein the compensation unit is further configured to calculate, according to the alignment coordinate of the first circuit board and the alignment coordinate of the display panel, an offset between the first circuit board and the display panel in a second direction at the bonding station, and perform alignment compensation on an offset distance in the second direction according to the offset, where the second direction is an arrangement direction of the flexible circuit boards at the bonding station.
8. The apparatus according to claim 6, wherein the compensation unit is further configured to calculate an angle offset between the first circuit board and the display panel at the bonding station according to the alignment coordinate of the first circuit board, the alignment coordinate of the display panel, and a coordinate distance between the first alignment marks of the two flexible circuit boards located at the edge, and perform alignment compensation of the offset angle according to the angle offset.
9. The apparatus of any of claims 6-8, further comprising: the image acquisition unit comprises a movable image acquisition device or at least four image acquisition devices;
the displacement mechanism is used for moving the first circuit board to the image acquisition station;
the image acquisition unit is used for acquiring first images of at least four flexible circuit boards of a first circuit board positioned at an image acquisition station;
the acquisition unit is used for acquiring the coordinates of first alignment marks of at least four flexible circuit boards according to the first image;
the displacement mechanism is also used for moving the first circuit board to the bonding station by a first stroke;
the displacement mechanism is also used for moving the display panel to an image acquisition station;
the image acquisition unit is also used for acquiring second images of at least four second alignment mark areas, corresponding to the at least four flexible circuit boards, of the display panel positioned at an image acquisition station;
the acquisition unit is further configured to acquire coordinates of at least four second alignment marks according to the second image;
the displacement mechanism is also used for moving the display panel to the bonding station by the first stroke.
10. The apparatus according to claim 6, wherein the obtaining unit is configured to obtain coordinates of first alignment marks of all flexible circuit boards and coordinates of all second alignment marks corresponding to all flexible circuit boards.
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