CN113740585B - Current sensor, current probe and current detection system - Google Patents
Current sensor, current probe and current detection system Download PDFInfo
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- CN113740585B CN113740585B CN202110932505.1A CN202110932505A CN113740585B CN 113740585 B CN113740585 B CN 113740585B CN 202110932505 A CN202110932505 A CN 202110932505A CN 113740585 B CN113740585 B CN 113740585B
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Abstract
The invention discloses a current sensor, a current probe and a current detection system. The common-mode inductance modules in the technical scheme have higher self-resonance frequency, and the bandwidth of the current sensor can be improved by arranging each common-mode inductance module with higher self-resonance frequency on the electromagnetic magnetic circuit.
Description
Technical Field
The present invention relates to the field of current detection technologies, and in particular, to a current sensor, a current probe, and a current detection system.
Background
The current sensor is a detection device, can sense the information of the detected current, and can convert the information sensed by detection into an electric signal meeting certain standard requirements or other information output in a required form according to a certain rule so as to meet the requirements of information transmission, processing, storage, display, recording, control and the like.
In the existing zero-flux current sensor technology, the most used is a zero-flux hall current sensor with a hall element as a sensitive element, a coil group of the hall current sensor is formed by directly connecting coils distributed on a magnetic core of the hall current sensor, and the coil group is formed in a mode that the bandwidth of the hall current sensor is smaller and the detection effect is poor.
Disclosure of Invention
The embodiment of the invention provides a current sensor, a current probe and a current detection system, which are used for solving the problem of smaller bandwidth of the current sensor.
A current sensor comprising an electromagnetic circuit and at least one common-mode inductance module, each common-mode inductance module being disposed on the electromagnetic circuit.
Further, the number of the common mode inductance modules is at least two, and at least two common mode inductance modules are arranged on the electromagnetic magnetic path in series.
Further, the common mode inductance module comprises a first coil, a second coil and common mode magnetic beads; the first coil and the second coil are oppositely arranged on the electromagnetic magnetic path in parallel; the homonymous ends of the first coil and the second coil are connected in parallel to form a first lead and a second lead; the first lead and the second lead are arranged in the common mode magnetic bead in a penetrating way.
Further, the number of turns of the first coil is the same as the number of turns of the second coil.
Further, the common mode magnetic beads are annular magnetic beads.
Further, if the number of the common-mode inductance modules is 1, the first lead of the common-mode inductance module is a first connection end of the current sensor, and the second lead of the common-mode inductance module is a second connection end of the current sensor;
if the number of the common-mode inductance modules is N, the first lead of the 1 st common-mode inductance module is a first connecting end of the current sensor, the second lead of the i th common-mode inductance module is connected with the first lead of the i+1th common-mode inductance module, the second lead of the N th common-mode inductance module is a second connecting end of the current sensor, and N is more than or equal to 2, and i is more than or equal to 1 and less than or equal to N-1.
Further, the electromagnetic circuit comprises a first magnetic core and a second magnetic core which are arranged in parallel and opposite to each other, and at least one common-mode inductance module is arranged on the first magnetic core and the second magnetic core.
Further, the electromagnetic circuit further includes a third core and a fourth core; the first end of the third magnetic core is connected with the first end of the first magnetic core, and the second end of the third magnetic core is connected with the first end of the second magnetic core; the first end of the fourth magnetic core is connected with the second end of the first magnetic core, and the second end of the fourth magnetic core is connected with the second end of the second magnetic core.
The current probe comprises a front-end signal processing circuit and the current sensor, wherein the current sensor is connected with the front-end signal processing circuit.
A current detection system comprises a back-end amplifying circuit, an oscilloscope and the current probe; the front-end signal processing circuit in the current probe is connected with the rear-end amplifying circuit; and the back-end amplifying circuit is connected with the oscilloscope.
The current sensor comprises an electromagnetic magnetic circuit and at least one common-mode inductance module, and the common-mode inductance module has higher self-resonance frequency, so that the bandwidth of the current sensor can be improved by arranging each common-mode inductance module with higher self-resonance frequency on the electromagnetic magnetic circuit.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments of the present invention will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a current sensor according to an embodiment of the invention;
FIG. 2 is a schematic diagram of another structure of a current sensor according to an embodiment of the invention;
FIG. 3 is a schematic diagram of another structure of a current sensor according to an embodiment of the invention;
FIG. 4 is a schematic diagram of a current probe according to an embodiment of the invention;
FIG. 5 is a schematic diagram of a current detection system according to an embodiment of the invention.
In the figure: 10. a current sensor; 11. an electromagnetic magnetic circuit; 111. a first magnetic core; 112. a second magnetic core; 113. a third magnetic core; 114. a fourth magnetic core; 12. a common mode inductance module; 121. a first coil; 122. a second coil; 123. common mode magnetic beads; 124. a first lead; 125. a second lead; 30. a current probe; 31. a front-end signal processing circuit; 41. a back-end amplifying circuit; 42. an oscilloscope.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the present invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the dimensions and relative dimensions of layers and regions may be exaggerated for the same elements throughout for clarity.
It will be understood that when an element or layer is referred to as being "on" …, "" adjacent to "…," "connected to" or "coupled to" another element or layer, it can be directly on, adjacent to, connected to or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on" …, "" directly adjacent to "…," "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.
Spatially relative terms, such as "under …," "under …," "below," "under …," "above …," "above," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "under …" and "under …" may include both an upper and a lower orientation. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.
In the following description, for the purpose of providing a thorough understanding of the present invention, detailed structures and steps are presented in order to illustrate the technical solution presented by the present invention. Preferred embodiments of the present invention are described in detail below, however, the present invention may have other embodiments in addition to these detailed descriptions.
The present embodiment provides a current sensor 10, as shown in fig. 1, the current sensor 10 includes an electromagnetic circuit 11 and at least one common-mode inductance module 12, each common-mode inductance module 12 being disposed on the electromagnetic circuit 11.
The current sensor 10 is a hall current sensor 10. Preferably, the hall current sensor 10 is a zero flux hall current sensor 10, i.e., a closed loop hall sensor. The electromagnetic circuit 11 is a closed path through which magnetic flux in the current sensor 10 passes. The common-mode inductance module 12 is a module equivalent to the common-mode inductance. Alternatively, common mode inductance module 12 includes a coil assembly equivalent to the common mode inductance. Optionally, the coil assembly includes, but is not limited to, a coil and magnetic beads. For example, by combining the coil and the magnetic beads, a coil assembly which can be equivalent to a common-mode inductance is formed, so that distributed capacitance existing in the coil assembly is counteracted, and the self-resonance frequency of the coil assembly is improved.
In a specific embodiment, as shown in fig. 1, the current sensor 10 includes an electromagnetic circuit 11 and at least one common-mode inductance module 12, each common-mode inductance module 12 being disposed on the electromagnetic circuit 11. Since the distributed capacitance in the common-mode inductance module 12 can be offset by the common-mode inductance module 12, so that the common-mode inductance module 12 has a higher self-resonant frequency, the bandwidth of the current sensor 10 can be increased by disposing each common-mode inductance module 12 on the electromagnetic circuit 11.
In the present embodiment, the current sensor 10 includes the electromagnetic circuit 11 and at least one common-mode inductance module 12, and since the distributed capacitance in the common-mode inductance module 12 can be offset by the common-mode inductance module 12, the common-mode inductance module 12 has a higher self-resonant frequency, and thus the present embodiment can improve the bandwidth of the current sensor 10 by disposing each common-mode inductance module 12 on the electromagnetic circuit 11.
In one embodiment, as shown in fig. 2 to 3, the number of common-mode inductance modules 12 is at least two, and at least two common-mode inductance modules 12 are disposed in series on the electromagnetic circuit 11.
In a specific embodiment, as shown in fig. 2, if the number of the common-mode inductance modules 12 is at least two, at least two common-mode inductance modules 12 are disposed in series on the electromagnetic circuit 11, where the series connection manner of the at least two common-mode inductance modules 12 is sufficient to satisfy that the magnetic field directions of the at least two common-mode inductance modules 12 are the same.
In the present embodiment, if the number of the common-mode inductance modules 12 in the current sensor 10 is at least two, the current sensor 10 including at least two common-mode inductance modules 12 can also have a higher bandwidth by providing at least two common-mode inductance modules 12 in series on the electromagnetic circuit 11 and ensuring that the series connection can make the magnetic field directions of the at least two common-mode inductance modules 12 the same.
In one embodiment, as shown in fig. 1, the common mode inductance module 12 includes a first coil 121, a second coil 122, and a common mode magnetic bead 123; the first coil 121 and the second coil 122 are disposed in parallel and opposite to each other on the electromagnetic circuit 11; the same name ends of the first coil 121 and the second coil 122 are connected in parallel to form a first lead 124 and a second lead 125; the first and second leads 124 and 125 are provided to penetrate the common-mode magnetic beads 123.
The common-mode magnetic beads 123 are magnetic beads in the common-mode inductance module 12. Alternatively, the common mode magnetic bead 123 may be a ring-shaped magnetic bead, facilitating the first and second leads 124 and 125 to be threaded inside the common mode magnetic bead 123.
In one embodiment, as shown in FIG. 1, common mode inductance module 12 includes a coil assembly equivalent to a common mode inductance. Optionally, the coil assembly includes a first coil 121, a second coil 122, and a common mode magnetic bead 123. In this embodiment, the first coil 121, the second coil 122 and the common-mode magnetic bead 123 are equivalent to be a common-mode inductance, so as to cancel the distributed capacitance of the first coil 121 and the second coil 122, and further improve the self-resonant frequency of the first coil 121 and the second coil 122, so as to achieve the purpose of improving the bandwidth of the current sensor 10.
In a specific embodiment, the first coil 121 and the second coil 122 are disposed on the electromagnetic circuit 11 in parallel and opposite to each other, and the identical ends of the first coil 121 and the second coil 122 are connected in parallel to form a first lead 124 and a second lead 125. As an example, the positive electrode of the first coil 121 is connected to the positive electrode of the second coil 122, and the negative electrode of the first coil 121 is connected to the negative electrode of the second coil 122, i.e., the same-name ends of the first coil 121 and the second coil 122 are connected in parallel. As another example, a first lead 124 is formed at a connection node of the positive electrode of the first coil 121 and the positive electrode of the second coil 122, and a second lead 125 is formed at a connection node of the negative electrode of the first coil 121 and the negative electrode of the second coil 122.
In a specific embodiment, the first lead 124 and the second lead 125 are disposed in the common-mode magnetic bead 123 in a penetrating manner, so that the first lead 124, the second lead 125 and the common-mode magnetic bead 123 can be equivalent to a common-mode inductance, and the equivalent common-mode inductance can offset the distributed capacitance of the first coil 121 and the second coil 122, so as to increase the self-resonant frequency of the first coil 121 and the second coil 122, i.e. increase the self-resonant frequency of the common-mode inductance module 12, and further achieve the purpose of increasing the bandwidth of the current sensor 10.
As an example, the first coil 121 and the second coil 122 are disposed in parallel and opposite to each other on the electromagnetic circuit 11, and the homonymous ends of the first coil 121 and the second coil 122 are connected in parallel to form a first lead 124 and a second lead 125; the first lead 124 and the second lead 125 are inserted into the common-mode magnetic bead 123, so that the bandwidth of the current sensor 10 can be increased as compared with the case where the first coil 121 and the second coil 122 are directly provided on the electromagnetic circuit 11. For example, two coils of 100 turns with a diameter of 5 mm are connected directly in series or in parallel to the electromagnetic circuit 11, the self-resonance frequency of both coils being lower than 50MHZ. If two coils with the diameter of 5 mm and 100 turns are oppositely arranged on the electromagnetic circuit 11 in parallel, and the same-name ends of the two coils are connected in parallel to form a first lead 124 and a second lead 125, the first lead 124 and the second lead 125 are arranged in the common-mode magnetic bead 123 in a penetrating way, the first lead 124, the second lead 125 and the common-mode magnetic bead 123 are equivalent to common-mode inductance, distributed capacitance of the two coils is counteracted, and therefore self-resonance frequencies of the two coils are improved to be more than 100MHz, and bandwidth of the current sensor 10 is also improved to be more than 100 MHz.
In the present embodiment, the common-mode inductance module 12 includes a first coil 121, a second coil 122, and a common-mode magnetic bead 123, and a first lead 124 and a second lead 125 are formed by arranging the first coil 121 and the second coil 122 in parallel and opposite to each other on the electromagnetic circuit 11, and connecting the same-name ends of the first coil 121 and the second coil 122 in parallel, while the first lead 124 and the second lead 125 are inserted into the common-mode magnetic bead 123. In this way, the first lead 124, the second lead 125 and the common-mode magnetic bead 123 can be equivalent to a common-mode inductance, and the equivalent common-mode inductance can offset the distributed capacitances of the first coil 121 and the second coil 122, so as to increase the self-resonant frequency of the first coil 121 and the second coil 122, i.e. increase the self-resonant frequency of the common-mode inductance module 12, thereby achieving the purpose of referring to the bandwidth of the current sensor 10.
Alternatively, the number of turns of the coil in any one common-mode inductance module 12 of the at least two common-mode inductance modules 12 may be the same as or different from the number of turns of the coil in other common-mode inductance modules 12 of the at least two common-mode inductance modules 12, which is not limited herein.
Optionally, the number of turns between coils in each common mode inductance module 12 is the same.
In an embodiment, the common mode inductance module 12 includes a first coil 121 and a second coil 122, and the number of turns of the first coil 121 is the same as the number of turns of the second coil 122.
In an embodiment, as shown in fig. 1, if the number of the common-mode inductance modules 12 is 1, the first lead 124 of the common-mode inductance module 12 is a first connection end of the current sensor 10, and the second lead 125 of the common-mode inductance module 12 is a second connection end of the current sensor 10; if the number of the common-mode inductance modules 12 is N, the first lead 124 of the 1 st common-mode inductance module 12 is the first connection end of the current sensor 10, the second lead 125 of the i th common-mode inductance module 12 is connected with the first lead 124 of the i+1th common-mode inductance module 12, the second lead 125 of the N th common-mode inductance module 12 is the second connection end of the current sensor 10, N is greater than or equal to 2, and i is greater than or equal to 1 and less than or equal to N-1.
In a specific embodiment, as shown in fig. 2, the number of common-mode inductance modules 12 is 1, and the common-mode inductance modules 12 include a first connection terminal and a second connection terminal, and the current sensor 10 further includes an output socket J1. The first connection terminal of the common-mode inductance module 12 is connected to the first output terminal of the output socket J1, and the second connection terminal of the common-mode inductance module 12 is connected to the second output terminal of the output socket J1. In this example, the first connection end of the common-mode inductance module 12 may be used as the first lead 124, the second connection end of the current sensor 10 may be used as the first lead 124, and the first lead 124 and the second lead 125 may be inserted into the common-mode magnetic bead 123, so that the first lead 124, the second lead 125 and the common-mode magnetic bead 123 may be equivalent to a common-mode inductance, and the equivalent common-mode inductance may counteract the distributed capacitance of the coil in the common-mode inductance module 12, thereby improving the self-resonant frequency of the common-mode inductance module 12, and further achieving the purpose of referring to the bandwidth of the current sensor 10.
In another embodiment, as shown in fig. 3, if the number N of the common-mode inductance modules 12 is 2, that is, if the number of common-mode inductance modules 12 is 2, the first lead 124 (positive electrode) of the 1 st common-mode inductance module 12 is the first connection end of the current sensor 10, the second lead 125 (negative electrode) of the 1 st common-mode inductance module 12 is connected to the first lead 124 (negative electrode) of the 2 nd common-mode inductance module 12, the second lead 125 (positive electrode) of the 2 nd common-mode inductance module 12 is the second connection end of the current sensor 10, and the first lead 124 and the second lead 125 of the 1 st common-mode inductance module 12 are simultaneously inserted into the common-mode magnetic bead 123 of the 1 st common-mode inductance module 12 to form an equivalent common-mode inductance, so as to increase the self-resonant frequency of the 1 st common-mode inductance module 12; the first lead 124 and the second lead 125 of the 2 nd common-mode inductance module 12 are inserted into the common-mode magnetic bead 123 of the 2 nd common-mode inductance module 12 to form an equivalent common-mode inductance, so that the self-resonant frequency of the 2 nd common-mode inductance module 12 is improved, and the bandwidth of the current sensor 10 is improved.
In another embodiment, if the number N of the common-mode inductance modules 12 is 3, that is, if the number of common-mode inductance modules 12 is 3, the first lead 124 (positive electrode) of the 1 st common-mode inductance module 12 is the first connection end of the current sensor 10, the second lead 125 (negative electrode) of the 1 st common-mode inductance module 12 is connected with the first lead 124 (negative electrode) of the 2 nd common-mode inductance module 12, the second lead 125 (positive electrode) of the 2 nd common-mode inductance module 12 is connected with the first lead 124 (positive electrode) of the 3 rd common-mode inductance module 12, the second lead 125 (negative electrode) of the 3 rd common-mode inductance module 12 is the second connection end of the current sensor 10, and the first lead 124 and the second lead 125 of the 1 st common-mode inductance module 12 are simultaneously threaded into the common-mode magnetic beads 123 of the 1 st common-mode inductance module 12 to form an equivalent common-mode inductance, so as to increase the self-resonant frequency of the 1 st common-mode inductance module 12; the first lead 124 and the second lead 125 of the 2 nd common-mode inductance module 12 are arranged in the common-mode magnetic bead 123 of the 2 nd common-mode inductance module 12 in a penetrating way so as to form equivalent common-mode inductance and improve the self-resonance frequency of the 2 nd common-mode inductance module 12; the first lead 124 and the second lead 125 of the 3 rd common-mode inductance module 12 are inserted into the common-mode magnetic bead 123 of the 3 rd common-mode inductance module 12 to form an equivalent common-mode inductance, so that the self-resonant frequency of the 3 rd common-mode inductance module 12 is improved, and the bandwidth of the current sensor 10 is improved.
When the number of the common-mode inductance modules 12 is N, the bandwidth of the current sensor 10 can be increased by only inserting the first lead 124 and the second lead 125 of at least one common-mode inductance module 12 of the N common-mode inductance modules into the common-mode magnetic bead 123. Preferably, the first lead 124 and the second lead 125 on each of the N shared inductor modules 12 are each threaded within a common-mode magnetic bead 123, which can further increase the bandwidth of the current sensor 10. As an example, only the first lead 124 and the second lead 125 of the 1 st common-mode inductance module 12 need to be inserted into the common-mode magnetic bead 123 of the 1 st common-mode inductance module 12, and neither the first lead 124 nor the second lead 125 of the 2 nd common-mode inductance module 12 nor the first lead 124 nor the second lead 125 of the 3 rd common-mode inductance module 12 need to be inserted into the common-mode magnetic bead 123, which can also achieve the purpose of improving the bandwidth of the current sensor 10.
In the present embodiment, if the number of the common-mode inductance modules 12 is 1, the first lead 124 of the common-mode inductance module 12 is the first connection end of the current sensor 10, and the second lead 125 of the common-mode inductance module 12 is the second connection end of the current sensor 10; if the number of the common-mode inductance modules 12 is N, the first lead 124 of the 1 st common-mode inductance module 12 is the first connection end of the current sensor 10, the second lead 125 of the i th common-mode inductance module 12 is connected with the first lead 124 of the i+1th common-mode inductance module 12, the second lead 125 of the N th common-mode inductance module 12 is the second connection end of the current sensor 10, N is greater than or equal to 2,1 is less than or equal to i is less than or equal to N-1, so that the current sensor 10 can maintain higher bandwidth when having different numbers of common-mode inductance modules 12, and the current detection effect of the current sensor 10 is improved.
In one embodiment, as shown in fig. 1, the electromagnetic circuit 11 includes a first magnetic core 111 and a second magnetic core 112 disposed in parallel and opposite to each other, and at least one common-mode inductance module 12 is disposed on the first magnetic core 111 and the second magnetic core 112.
In a specific embodiment, electromagnetic circuit 11 includes a first core 111 and a second core 112 disposed in parallel opposition. Alternatively, the first magnetic core 111 and the second magnetic core 112 are ferrite magnetic cores.
In a particular embodiment, at least one common mode inductance module 12 is disposed on a first magnetic core 111 and a second magnetic core 112. As an example, the at least one common-mode inductance module 12 includes a first coil 121 and a second coil 122, the first coil 121 is disposed on the first magnetic core 111, the second coil 122 is disposed on the second magnetic core 112, and the first coil 121 and the second coil 122 are disposed in parallel and opposite to each other.
In the present embodiment, the electromagnetic circuit 11 includes the first magnetic core 111 and the second magnetic core 112 that are disposed in parallel and opposite to each other, and by disposing the common-mode inductance module 12 in at least one of the above embodiments on the first magnetic core 111 and the second magnetic core 112, it is possible to provide the current sensor 10 with a higher bandwidth, thereby improving the current detection effect of the current sensor 10.
In one embodiment, as shown in fig. 2, the electromagnetic circuit 11 further includes a third core 113 and a fourth core 114; a first end of the third magnetic core 113 is connected to a first end of the first magnetic core 111, and a second end of the third magnetic core 113 is connected to a first end of the second magnetic core 112; the first end of the fourth magnetic core 114 is connected to the second end of the first magnetic core 111, and the second end of the fourth magnetic core 114 is connected to the second end of the second magnetic core 112.
The electromagnetic circuit 11 further includes a third core 113 and a fourth core 114. Optionally, the third core 113 and the fourth core 114 are ferrite cores.
In one embodiment, the first end of the third magnetic core 113 is connected to the first end of the first magnetic core 111, and the second end of the third magnetic core 113 is connected to the first end of the second magnetic core 112; the first end of the fourth magnetic core 114 is connected to the second end of the first magnetic core 111, and the second end of the fourth magnetic core 114 is connected to the second end of the second magnetic core 112, thereby forming the electromagnetic circuit 11 in the above embodiment.
Optionally, the electromagnetic circuit 11 further includes a hall magnetic field sensor H1 for detecting the magnetic field of the electromagnetic circuit 11. As an example, the hall magnetic field sensor H1 is disposed between the second end of the fourth magnetic core 114 and the second end of the second magnetic core 112, and the output end of the hall magnetic field sensor H1 is connected to the output socket J1.
In the present embodiment, the electromagnetic circuit 11 further includes a third core 113 and a fourth core 114; a first end of the third magnetic core 113 is connected to a first end of the first magnetic core 111, and a second end of the third magnetic core 113 is connected to a first end of the second magnetic core 112; the first end of the fourth magnetic core 114 is connected to the second end of the first magnetic core 111, and the second end of the fourth magnetic core 114 is connected to the second end of the second magnetic core 112 to form the electromagnetic circuit 11 in the above embodiment.
The present embodiment provides a current probe 30, as shown in fig. 4, including a front-end signal processing circuit 31 and the current sensor 10 in the above embodiment, the current sensor 10 being connected to the front-end signal processing circuit 31.
In the present embodiment, the current probe 30 includes the front-end signal processing circuit 31 and the current sensor 10 in the above embodiment, and the current sensor 10 is connected to the front-end signal processing circuit 31. Since the current sensor 10 has a high bandwidth, the current detection effect of the current probe 30 can be improved.
The present embodiment provides a current detection system, as shown in fig. 5, including a back-end amplifying circuit 41, an oscilloscope 42, and the current probe 30 in the above embodiment; the front-end signal processing circuit 31 in the current probe 30 is connected to the back-end amplifying circuit 41; the back-end amplification circuit 41 is connected to an oscilloscope 42.
In the present embodiment, the back-end amplification circuit 41, the oscilloscope 42, and the current probe 30 in the above-described embodiment; the front-end signal processing circuit 31 in the current probe 30 is connected to the back-end amplifying circuit 41; the back-end amplification circuit 41 is connected to the oscilloscope 42, and since the current sensor 10 in the current probe 30 has a high bandwidth, the current detection effect of the current detection system can be improved.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention, and are intended to be included in the scope of the present invention.
Claims (6)
1. The current sensor is characterized by comprising an electromagnetic magnetic circuit and N common-mode inductance modules, wherein the N common-mode inductance modules are arranged on the electromagnetic magnetic circuit in series;
each common mode inductance module comprises a first coil, a second coil and common mode magnetic beads; the first coil and the second coil are oppositely arranged on the electromagnetic magnetic path in parallel; the homonymous ends of the first coil and the second coil are connected in parallel to form a first lead and a second lead; the first lead and the second lead are arranged in the common-mode magnetic bead in a penetrating way;
the number of turns of the first coil is the same as the number of turns of the second coil;
the first lead of the 1 st common-mode inductance module is a first connecting end of the current sensor, the second lead of the i th common-mode inductance module is connected with the first lead of the i+1th common-mode inductance module, the second lead of the N th common-mode inductance module is a second connecting end of the current sensor, and N is more than or equal to 2, and i is more than or equal to 1 and less than or equal to N-1.
2. The current sensor of claim 1, wherein the common mode magnetic beads are annular magnetic beads.
3. The current sensor of claim 1, wherein the electromagnetic circuit comprises first and second magnetic cores disposed in parallel opposing relation, at least one of the common mode inductance modules being disposed on the first and second magnetic cores.
4. The current sensor of claim 3, wherein the electromagnetic circuit further comprises a third magnetic core and a fourth magnetic core; the first end of the third magnetic core is connected with the first end of the first magnetic core, and the second end of the third magnetic core is connected with the first end of the second magnetic core; the first end of the fourth magnetic core is connected with the second end of the first magnetic core, and the second end of the fourth magnetic core is connected with the second end of the second magnetic core.
5. A current probe comprising a front-end signal processing circuit and a current sensor according to any one of claims 1 to 4, said current sensor being connected to said front-end signal processing circuit.
6. A current detection system comprising a back-end amplification circuit, an oscilloscope, and the current probe of claim 5; the front-end signal processing circuit in the current probe is connected with the rear-end amplifying circuit; and the back-end amplifying circuit is connected with the oscilloscope.
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