CN113736215A - Thermosetting resin composition for low-dielectric-loss flexible copper clad laminate and preparation method thereof - Google Patents
Thermosetting resin composition for low-dielectric-loss flexible copper clad laminate and preparation method thereof Download PDFInfo
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- CN113736215A CN113736215A CN202111068512.8A CN202111068512A CN113736215A CN 113736215 A CN113736215 A CN 113736215A CN 202111068512 A CN202111068512 A CN 202111068512A CN 113736215 A CN113736215 A CN 113736215A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 239000011342 resin composition Substances 0.000 title claims abstract description 38
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 33
- 239000010949 copper Substances 0.000 title claims abstract description 33
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000003822 epoxy resin Substances 0.000 claims abstract description 44
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 44
- 239000004593 Epoxy Substances 0.000 claims abstract description 29
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 24
- 229920001971 elastomer Polymers 0.000 claims abstract description 16
- 150000002148 esters Chemical class 0.000 claims abstract description 15
- 239000000945 filler Substances 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims abstract description 10
- 238000003756 stirring Methods 0.000 claims abstract description 10
- 229920013636 polyphenyl ether polymer Polymers 0.000 claims abstract description 9
- 239000003960 organic solvent Substances 0.000 claims abstract description 8
- 239000007787 solid Substances 0.000 claims abstract description 8
- 238000000227 grinding Methods 0.000 claims abstract description 6
- 239000002904 solvent Substances 0.000 claims abstract description 4
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 claims description 9
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 9
- -1 bicyclic amidine Chemical class 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 6
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 claims description 5
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 claims description 5
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 5
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 5
- 229920001955 polyphenylene ether Polymers 0.000 claims description 5
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 229920006132 styrene block copolymer Polymers 0.000 claims description 5
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 4
- 239000007965 rubber solvent Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 2
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 claims description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052580 B4C Inorganic materials 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 2
- 229910002113 barium titanate Inorganic materials 0.000 claims description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 2
- 235000010290 biphenyl Nutrition 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000378 calcium silicate Substances 0.000 claims description 2
- 229910052918 calcium silicate Inorganic materials 0.000 claims description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 claims description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims description 2
- WDWDWGRYHDPSDS-UHFFFAOYSA-N methanimine Chemical compound N=C WDWDWGRYHDPSDS-UHFFFAOYSA-N 0.000 claims description 2
- 125000001624 naphthyl group Chemical group 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 238000006735 epoxidation reaction Methods 0.000 claims 1
- 239000002994 raw material Substances 0.000 abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- 238000010521 absorption reaction Methods 0.000 abstract description 7
- 238000005476 soldering Methods 0.000 abstract description 2
- 230000003014 reinforcing effect Effects 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 10
- 239000003292 glue Substances 0.000 description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000013032 Hydrocarbon resin Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- 229920006270 hydrocarbon resin Polymers 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical class O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002633 Kraton (polymer) Polymers 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920013638 modified polyphenyl ether Polymers 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- PSHKMPUSSFXUIA-UHFFFAOYSA-N n,n-dimethylpyridin-2-amine Chemical compound CN(C)C1=CC=CC=N1 PSHKMPUSSFXUIA-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
- C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The invention discloses a thermosetting resin composition for a low-dielectric-loss flexible copper clad laminate and a preparation method thereof. The resin composition consists of the following components in terms of no solvent: 5-40 parts by mass of epoxy modified rubber, 1-30 parts by mass of epoxidized polyphenyl ether, 5-40 parts by mass of dicyclopentadiene type epoxy resin, 0-20 parts by mass of liquid crystal type epoxy resin, 5-50 parts by mass of active ester curing agent, 0.005-0.5 part by mass of curing accelerator and 0-30 parts by mass of filler. The preparation method comprises the following steps: dissolving the raw materials except the filler and the solid accelerant by using an organic solvent, then adding the filler, grinding and dispersing uniformly, and finally, uniformly stirring the reinforcing accelerant. The flexible copper clad laminate prepared by the resin composition has extremely low dielectric constant, dielectric loss and water absorption, higher peel strength and excellent dip soldering resistance, meanwhile, the raw material source is not limited, and the preparation method is simple and easy to implement, and is suitable for flexible printed circuit boards with medium dielectric loss.
Description
Technical Field
The invention belongs to the field of special resin materials for flexible copper clad laminates, and particularly relates to a thermosetting resin composition with low dielectric loss characteristic and a preparation method of the resin composition.
Background
With the rapid development of 5G communication and mobile internet, the demand of mobile terminals, including antennas of mobile phones, tablet computers, notebook computers, etc., and data transmission and processing systems for flexible printed circuit board substrates (i.e., flexible copper clad laminates) with low dielectric constant and low dielectric loss has increased substantially.
At present, common flexible copper clad laminates in the market are prepared by directly bonding flexible films such as polyimide or ethylene terephthalate and the like serving as insulating base films or bonding the flexible films on copper foils through adhesives. However, the existing insulating base film and the adhesive types (acrylates and epoxy resins) can not meet the requirements of the 5G communication terminal on the low dielectric constant and low dielectric loss of the flexible copper clad laminate. For example, the dielectric constant and the dielectric loss of the adhesive for the acrylic flexible copper clad laminate at 1GHz are respectively more than or equal to 3.2 and more than or equal to 0.03, and the dielectric constant and the dielectric loss of the adhesive for the epoxy resin flexible copper clad laminate at 1GHz are respectively more than or equal to 3.5 and more than or equal to 0.02.
For resins with low dielectric constant and low dielectric loss used for flexible copper clad laminate substrates, only two types of liquid crystal polymers and modified polyimides have been commercialized and commercialized. Although the dielectric property of the bulk of the liquid crystal polymer is excellent, the source of the raw material film is extremely limited, the processing property is relatively poor, the designability of the molecular structure is single, and the modification space is small. Although polyimide has a good application base in the integrated circuit industry, modified polyimide (microporous, fluorine-containing or non-fluorine-containing) with low dielectric constant and low dielectric loss generally has the problems of complex monomer synthesis and polymerization process, high requirement, low mechanical strength, high water absorption, low bonding force with copper, halogen-containing hazard, limited sources, high cost and the like.
Meanwhile, resin materials (such as polytetrafluoroethylene, hydrocarbon resin, modified polyphenylene oxide, modified bismaleimide, cyanate ester or triazine resin and the like) with the characteristics of low dielectric constant (less than or equal to 3.5) and low dielectric loss (less than or equal to 0.01) can only be used for preparing the conventional hard copper clad laminate. Above all, polytetrafluoroethylene, hydrocarbon resins and specific polyphenylene ether raw materials have been monopolized abroad, particularly in countries such as Europe and America, so that the sources of the polytetrafluoroethylene, the hydrocarbon resins and the specific polyphenylene ether raw materials are also greatly limited.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention mainly aims to provide a thermosetting resin composition for a low-dielectric-loss flexible copper clad laminate and a preparation method thereof. When the resin composition is used for a copper-clad plate, the resin composition has good flexibility, extremely low dielectric constant, dielectric loss and water absorption, high peel strength and excellent dip soldering resistance, has high adhesive force to the copper foil, is not limited by raw material sources, and is simple and easy to prepare.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
the thermosetting resin composition for the low dielectric loss flexible copper clad laminate consists of the following components in percentage by weight based on no solvent: 5-40 parts by mass of epoxy modified rubber, 1-30 parts by mass of epoxidized polyphenyl ether, 5-40 parts by mass of dicyclopentadiene type epoxy resin, 0-20 parts by mass of liquid crystal type epoxy resin, 5-50 parts by mass of active ester curing agent, 0.005-0.5 part by mass of curing accelerator and 0-30 parts by mass of filler.
Preferably, the thermosetting resin composition for the low-dielectric flexible copper clad laminate consists of the following components in terms of no solvent: 10-35 parts by mass of epoxy modified rubber, 5-25 parts by mass of epoxidized polyphenyl ether, 10-30 parts by mass of dicyclopentadiene type epoxy resin, 0-20 parts by mass of liquid crystal type epoxy resin, 5-50 parts by mass of active ester curing agent, 0.01-0.3 part by mass of curing accelerator and 0-25 parts by mass of filler.
According to the scheme, the thermosetting resin composition for the low-dielectric flexible copper clad laminate further comprises an organic solvent, and the solid content is 10-80 wt%. More preferably, the solid content is 20 to 50 wt%.
According to the scheme, the epoxy modified rubber is a product obtained by partially epoxidizing double bonds in a molecular chain of a (styrene-butadiene-styrene) block copolymer (SBS), a (styrene-isoprene-styrene) block copolymer (SIS) or a (styrene-isoprene/butadiene-styrene) block copolymer (SIBS), and the epoxy equivalent weight of the epoxy modified rubber is 1000-2500 g/eq.
Preferably, the content of the styrene chain segment in the molecular chain of the (styrene-butadiene-styrene) block copolymer (SBS), the (styrene-isoprene-styrene) block copolymer (SIS) or the (styrene-isoprene/butadiene-styrene) block copolymer (SIBS) is 10-40%, and the melt index at 200 ℃/5kg is 1-35 g/10 min.
According to the scheme, the epoxidized polyphenyl ether is low-molecular-weight epoxy-terminated polyphenyl ether with the number average molecular weight within the range of 1000-5000.
According to the scheme, the epoxy equivalent of the dicyclopentadiene phenol type epoxy resin (DCPD epoxy resin) is 200-300 g/eq, and the softening point is 40-110 ℃.
According to the scheme, the liquid crystal type epoxy resin is one or a combination of aromatic ester type liquid crystal epoxy resin, biphenyl type liquid crystal epoxy resin, alpha-methyl type liquid crystal epoxy resin, methylene amine type liquid crystal epoxy resin, azo type liquid crystal epoxy resin, naphthalene type liquid crystal epoxy resin and the like.
According to the scheme, the structure of the active ester curing agent contains two or more than two active phenyl esters or naphthyl esters, wherein the ester group equivalent is 200-300 g/eq.
According to the scheme, the curing accelerator is one or more of imidazole, 2-methylimidazole (2MI), 2-phenylimidazole, 2-ethyl-4-methylimidazole (2E4MI), DMP-10, DMP-30, dimethylbenzylamine, bicyclic amidine and 4-Dimethylaminopyridine (DMAP).
According to the scheme, the filler is one or more of silicon dioxide (silicon micropowder), titanium dioxide (titanium dioxide), zirconium dioxide, aluminum oxide, magnesium oxide, calcium silicate, barium titanate, boron nitride, aluminum nitride, boron carbide and polytetrafluoroethylene powder with unlimited appearance.
According to the scheme, the organic solvent is selected from one or more of butanone, toluene, cyclohexane, cyclohexanone and the like.
The preparation method of the thermosetting resin composition for the low dielectric loss flexible copper clad laminate comprises the following steps:
adding epoxy polyphenylene oxide, DCPD epoxy resin, liquid crystal epoxy resin, active ester curing agent, epoxy modified rubber and organic solvent into a container, stirring at room temperature to 120 ℃ to fully dissolve and uniformly mix; then adding the filler, and grinding and dispersing uniformly; and finally, adding a curing accelerator, and fully and uniformly stirring to obtain the thermosetting resin composition.
The invention has the beneficial effects that:
1. the invention provides a thermosetting resin composition for a low-dielectric-loss flexible copper clad laminate, which takes modified rubber and modified polyphenyl ether with low dielectric property and containing an epoxy functional group structure as raw materials, is matched with epoxy resin (dicyclopentadiene epoxy resin and liquid crystal epoxy resin) with low dielectric property, adopts an active ester curing system, and further is matched with a curing accelerator and a filler on the basis of the property that secondary hydroxyl groups with strong polarity and the like are not generated in the curing process and the flexibility and toughness increasing property of the modified rubber, so that the obtained thermosetting resin composition has the properties of low dielectric constant (3.0-3.5) and low dielectric loss (0.005-0.01) and also has the flexibility and the like, and the thermosetting resin composition for the low-dielectric-loss flexible copper clad laminate meeting the requirements is obtained.
2. Furthermore, the adopted epoxidized micromolecular polyphenyl ether with low dielectric property can be used for adjusting semi-cured products of the composition while ensuring the organic solubility and the compatibility with other components, and adjusting and controlling the glue overflow amount, the bonding strength and the like in the subsequent manufacturing and application process of the flexible copper clad laminate.
3. The heat resistance, water absorption rate and mechanical property of the resin composition, the bonding property and the processing property of the copper foil or polyimide film and the like can be comparable to those of the common epoxy resin adhesives currently used in the field of flexible copper clad plates, the raw material sources are not limited, and the preparation method is simple and easy to implement.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the following detailed description is given, but the scope of the present invention is not limited thereto.
The main raw material sources of the thermosetting resin composition for preparing the low-dielectric flexible copper clad laminate are as follows:
(1) epoxy modified rubber: epoxidized thermoplastic elastomers (epoxy equivalent weight of 1055g/eq and 2125g/eq, respectively, with a styrene content of 40%) under the designations EPOFRIND AT501 and CT310 from Daiichi Japan may be used as they are, and commercially available (styrene-butadiene-styrene) block copolymers (SBS), or (styrene-isoprene-styrene) block copolymers (SIS), or (styrene-isoprene/butadiene-styrene) block copolymers (SIBS), such as those from Kraton, USA, may also be used
D SBS, SIS or SIBS series products and products modified by epoxy. The epoxy modification steps are as follows:
100 parts by mass of a rubber to be modified (for example, but not limited to, SBS-D1118, SIS-D1119, SIBS-D1170, and the like of Corteng, U.S. Pat. Nos. 3 to 5) is dissolved in butanone to obtain a solution having a solid content of 10 to 30 wt%; then adding 25-40 parts by mass of formic acid, uniformly stirring at 30-50 ℃, slowly adding 2-3 parts by mass of hydrogen peroxide at a constant speed within 1 hour, and continuously reacting for 1-5 hours after dripping; and finally neutralizing the reaction solution to be neutral by using a proper amount of sodium carbonate, and sequentially carrying out liquid separation, water washing, separation, drying and the like to obtain the corresponding epoxy modified rubber.
(2) The conventional preparation method of epoxidized polyphenylene ether is as follows:
the method adopts a sapick small molecular polyphenylene oxide (trade name SA90, number average molecular weight 1600, hydroxyl equivalent 840g/eq) epoxy modified product, and the specific epoxy modification step is as follows: dissolving 100 parts by mass of SA90 with 200 parts by mass of toluene, adding 20 parts by mass of epichlorohydrin, heating to 65 ℃, and uniformly mixing; then slowly dripping 10 parts by mass of sodium hydroxide solution with 20 wt% of solid content into the solution at constant speed within 1.5h, and then reacting for 0.5 h; and finally precipitating and washing the reaction solution in methanol, repeating the precipitation and washing for 2-3 times, and drying to obtain the epoxidized polyphenyl ether.
(3) Other raw materials, including dicyclopentadiene type epoxy resin, liquid crystal type epoxy resin, active ester curing agent, curing accelerator and filler are all commercially available and are not listed here.
Examples 1-6 were prepared according to the components and parts by mass ratios in table 1, the specific preparation method being as follows:
adding epoxy polyphenylene oxide, DCPD epoxy resin, liquid crystal epoxy resin, active ester curing agent, epoxy modified rubber and organic solvent into a container, stirring at room temperature to 120 ℃ to fully dissolve and uniformly mix; then adding low dielectric filler, and grinding and dispersing uniformly; and finally, adding a curing accelerator, and fully and uniformly stirring to obtain the glue solution of the thermosetting resin composition.
TABLE 1 examples 1 to 6 formulations (unit: parts by mass)
Comparative example 1:
typical epoxy resin hard copper clad laminate resin composition with low dielectric constant and low dielectric loss. The preparation method comprises the following steps: nippon DIC Co Ltd
100 parts of HP-7200H dicyclopentadiene cresol epoxy resin, 80 parts of HPC-8000-65T active ester curing agent, prepared by Nippon DIC company, preparing a glue solution with 35% mass solid content by butanone, adding 50 parts of spherical silica micropowder, grinding and dispersing uniformly, adding 0.1 part of dimethylaminopyridine curing accelerator, and stirring uniformly to obtain the glue solution of comparative example 1.
Comparative example 2:
epoxy adhesives for common flexible printed circuit boards. The preparation method comprises the following steps: 45 parts of bisphenol A epoxy resin (epoxy equivalent of 300-600 g/eq) and 30 parts of 1072CG nitrile rubber (acrylonitrile content of 27%), preparing a glue solution with 35% of mass solid content by butanone, adding 35 parts of aluminum hydroxide, grinding and dispersing uniformly, and finally adding 9.36 parts of 4, 4-diaminodiphenyl sulfone and stirring to obtain the glue solution of the comparative example 2.
In order to better test and evaluate the application characteristics of the thermosetting resin composition glue solutions of examples 1 to 6 and comparative examples 1 to 2, the compositions were prepared and tested according to the following steps.
Preparing a sample: the glue solution of the thermosetting resin composition is uniformly coated on a proper release film, the organic solvent is removed through baking, then the glue solution is transferred to a PI film with the thickness of 25 mu m or a copper foil rough surface with the thickness of 1/2oz through a plastic sealing machine, the other surface is supplemented with a corresponding copper foil, and then the quick pressing or the laminating curing is carried out.
The flexible copper clad laminate prepared from the resin composition was tested for peel strength, solder resistance (288 ℃), water absorption, dielectric constant and dielectric loss at 10GHz, flexibility, etc., by IPC-TM-650 test method, and the specific results are shown in Table 2.
Table 2 test results of examples 1 to 6 and comparative examples 1 to 2
At present, no formal national standard, international standard and industry standard about flexible printed circuit board base materials (including copper clad laminates, pure films and the like) with low dielectric constants and low dielectric losses exist at home and abroad, and the main technical or quality indexes of the flexible printed circuit board base material (including copper clad laminates, pure films and the like) products of commercialized Liquid Crystal Polymer (LCP) or Modified Polyimide (MPI) type are mainly the internal control standards of respective manufacturers. Therefore, the related technical indexes of the flexible copper clad laminate corresponding to the thermosetting resin composition of the invention are described by referring to the international standard of flexible printed circuit board base material (IPC 4203/19 common 'epoxy pure film') and the generally accepted experience values in the high-frequency and high-speed hard copper clad laminate industry, and the test results in the table 2 are described. The method comprises the following specific steps:
the results of the tests of peel strength, solder resistance (288 ℃) and water absorption in examples 1-6 all meet the requirements corresponding to the international standard (IPC 4203/19 common "epoxy pure film") standard (peel strength is more than or equal to 0.7N/mm, 288 ℃ +/-5 ℃/10s solder resistance is passed, and water absorption is less than or equal to 4.0%), and the three index values reach the same level of the common epoxy adhesive for flexible printed circuit boards (see comparative example 2). However, the dielectric constant (Dk is 3.0-3.5) and dielectric loss (Df is 0.006-0.0092) of the samples of examples 1-6 under 10GHz are obviously lower than those of comparative example 2, and even lower than that of the pure DCPD epoxy resin/active ester resin hard copper clad plate in comparative example 1. Meanwhile, the flexibility (R ═ 2mm) of the samples of examples 1 to 6 can be made equivalent to that of comparative example 2 (an epoxy adhesive for a general flexible printed wiring board).
The above test data are only typical formulations or test data of the present invention and are not intended to limit the present invention, the scope of which is defined by the claims. Any person skilled in the art can substitute or change the formula and the idea of the present invention within the technical scope disclosed in the present invention, and all those persons skilled in the art are within the protection scope of the present invention.
Claims (10)
1. A thermosetting resin composition for a low dielectric loss flexible copper clad laminate is characterized by comprising the following components in terms of no solvent: 5-40 parts by mass of epoxy modified rubber, 1-30 parts by mass of epoxidized polyphenyl ether, 5-40 parts by mass of dicyclopentadiene type epoxy resin, 0-20 parts by mass of liquid crystal type epoxy resin, 5-50 parts by mass of active ester curing agent, 0.005-0.5 part by mass of curing accelerator and 0-30 parts by mass of filler.
2. The thermosetting resin composition according to claim 1, which is composed of, on a solvent-free basis: 10-35 parts by mass of epoxy modified rubber, 5-25 parts by mass of epoxidized polyphenyl ether, 10-30 parts by mass of dicyclopentadiene type epoxy resin, 0-20 parts by mass of liquid crystal type epoxy resin, 5-50 parts by mass of active ester curing agent, 0.01-0.3 part by mass of curing accelerator and 0-25 parts by mass of filler.
3. The thermosetting resin composition of claim 1, wherein the thermosetting resin composition for the low dielectric loss flexible copper clad laminate further comprises an organic solvent, and the solid content is 10-80 wt%.
4. The thermosetting resin composition according to claim 1, wherein the epoxy-modified rubber is a (styrene-butadiene-styrene) block copolymer, a (styrene-isoprene-styrene) block copolymer, or a product of partial epoxidation of double bonds in a molecular chain of a (styrene-isoprene/butadiene-styrene) block copolymer, and has an epoxy equivalent of 1000 to 2500 g/eq.
5. The thermosetting resin composition as claimed in claim 4, wherein the content of styrene segment in the molecular chain of the (styrene-butadiene-styrene) block copolymer, the (styrene-isoprene-styrene) block copolymer, or the (styrene-isoprene/butadiene-styrene) block copolymer is 10 to 40%, and the melt index at 200 ℃/5kg is 1 to 35g/10 min.
6. The thermosetting resin composition as claimed in claim 1, wherein the epoxidized polyphenylene ether is a low-molecular-weight epoxy-based polyphenylene ether having a number average molecular weight in the range of 1000 to 5000.
7. The thermosetting resin composition as claimed in claim 1, wherein the dicyclopentadiene phenol type epoxy resin has an epoxy equivalent of 200 to 300g/eq and a softening point of 40 to 110 ℃; the liquid crystal type epoxy resin is one or a combination of aromatic ester type liquid crystal epoxy resin, biphenyl type liquid crystal epoxy resin, alpha-methyl type liquid crystal epoxy resin, methylene amine type liquid crystal epoxy resin, azo type liquid crystal epoxy resin and naphthalene type liquid crystal epoxy resin.
8. The thermosetting resin composition of claim 1, wherein the structure of the active ester curing agent contains two or more active phenyl or naphthyl esters, and the ester equivalent weight is 200 to 300 g/eq.
9. The thermosetting resin composition of claim 1, wherein the curing accelerator is one or more of imidazole, 2-methylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, DMP-10, DMP-30, dimethylbenzylamine, bicyclic amidine, and 4-dimethylaminopyridine; the filler is one or more of silicon dioxide, titanium dioxide, zirconium dioxide, aluminum oxide, magnesium oxide, calcium silicate, barium titanate, boron nitride, aluminum nitride, boron carbide and polytetrafluoroethylene powder.
10. The preparation method of the thermosetting resin composition for the low dielectric loss flexible copper clad laminate according to claim 3 is characterized by comprising the following steps:
adding epoxy polyphenylene oxide, DCPD epoxy resin, liquid crystal epoxy resin, active ester curing agent, epoxy modified rubber and organic solvent into a container, stirring at room temperature to 120 ℃ to fully dissolve and uniformly mix; then adding the filler, and grinding and dispersing uniformly; and finally, adding a curing accelerator, and fully and uniformly stirring to obtain the thermosetting resin composition.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115353845A (en) * | 2022-08-26 | 2022-11-18 | 江西省航宇电子材料有限公司 | Stainless steel base copper-clad plate silk-screen printing insulating glue and silk-screen printing method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101029165A (en) * | 2006-03-01 | 2007-09-05 | 广东榕泰实业股份有限公司 | Epoxy-resin mould plastic for packing IC circuit and its production |
| WO2012002434A1 (en) * | 2010-07-01 | 2012-01-05 | 住友ベークライト株式会社 | Prepreg, wiring board, and semiconductor device |
| US20140154939A1 (en) * | 2011-10-18 | 2014-06-05 | Qianping Rong | Halogen-free low-dielectric resin composition, and prepreg and copper foil laminate made by using same |
| JP2014198746A (en) * | 2013-03-29 | 2014-10-23 | 日本ゼオン株式会社 | Curable epoxy composition, film, laminated film, prepreg, laminate, cured product, and composite |
| CN108219434A (en) * | 2017-12-27 | 2018-06-29 | 浙江华正新材料股份有限公司 | A kind of compositions of thermosetting resin, prepreg and laminate |
| WO2018120563A1 (en) * | 2016-12-28 | 2018-07-05 | 广东生益科技股份有限公司 | Halogen-free epoxy resin composition, and prepreg and laminate using same |
| CN110845884A (en) * | 2018-07-26 | 2020-02-28 | 味之素株式会社 | Resin composition |
-
2021
- 2021-09-13 CN CN202111068512.8A patent/CN113736215A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101029165A (en) * | 2006-03-01 | 2007-09-05 | 广东榕泰实业股份有限公司 | Epoxy-resin mould plastic for packing IC circuit and its production |
| WO2012002434A1 (en) * | 2010-07-01 | 2012-01-05 | 住友ベークライト株式会社 | Prepreg, wiring board, and semiconductor device |
| US20140154939A1 (en) * | 2011-10-18 | 2014-06-05 | Qianping Rong | Halogen-free low-dielectric resin composition, and prepreg and copper foil laminate made by using same |
| JP2014198746A (en) * | 2013-03-29 | 2014-10-23 | 日本ゼオン株式会社 | Curable epoxy composition, film, laminated film, prepreg, laminate, cured product, and composite |
| WO2018120563A1 (en) * | 2016-12-28 | 2018-07-05 | 广东生益科技股份有限公司 | Halogen-free epoxy resin composition, and prepreg and laminate using same |
| CN108219434A (en) * | 2017-12-27 | 2018-06-29 | 浙江华正新材料股份有限公司 | A kind of compositions of thermosetting resin, prepreg and laminate |
| CN110845884A (en) * | 2018-07-26 | 2020-02-28 | 味之素株式会社 | Resin composition |
Non-Patent Citations (2)
| Title |
|---|
| 周文英等: "《导热高分子材料》", 30 April 2014, 国防工业出版社, pages: 279 - 281 * |
| 黄志雄等编著: "《热固性树脂复合材料及其应用》", 31 January 2007, 化学工业出版社, pages: 121 - 132 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115353845A (en) * | 2022-08-26 | 2022-11-18 | 江西省航宇电子材料有限公司 | Stainless steel base copper-clad plate silk-screen printing insulating glue and silk-screen printing method |
| CN115353845B (en) * | 2022-08-26 | 2024-02-02 | 江西省航宇电子材料有限公司 | Stainless steel-based copper-clad plate silk-screen insulating adhesive and silk-screen printing method |
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