CN113731728A - Gap dispensing pressure compensation method and device, computer equipment and storage medium thereof - Google Patents
Gap dispensing pressure compensation method and device, computer equipment and storage medium thereof Download PDFInfo
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- CN113731728A CN113731728A CN202110865518.1A CN202110865518A CN113731728A CN 113731728 A CN113731728 A CN 113731728A CN 202110865518 A CN202110865518 A CN 202110865518A CN 113731728 A CN113731728 A CN 113731728A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
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Abstract
The invention discloses a gap dispensing pressure compensation method, a gap dispensing pressure compensation device, computer equipment and a storage medium thereof, wherein the method comprises the following steps: dispensing glue at the joint gap of the two objects by controlling the dispensing head; after the glue dispensing is finished, controlling the suction device to absorb the glue into the gluing gap from the back of the glue dispensing position of the gluing gap of the two objects according to the set suction force and the set suction force time. Thus, the glue can flow into the jointing surfaces of the two attaching objects from the gap under the action of suction. Because the suction force and the suction force time of vacuum suction are set to corresponding values, the glue on the upper surface can be adsorbed to the binding surfaces of the two binding materials through the suction force. Avoid glue can't inhale the binding face, perhaps flow out from the back in gap department.
Description
Technical Field
The invention relates to the technical field of glue dispensing, in particular to a gap glue dispensing pressure compensation method and device, computer equipment and a storage medium thereof.
Background
In dispensing application, generally, the surfaces of two objects to be bonded need to be dispensed, and the bonding surfaces are dispensed, and after dispensing is finished, the dispensing positions of the two objects are bonded. Therefore, the two objects can be connected and attached tightly through glue.
However, in practical dispensing applications, the dispensing operation cannot be directly performed on the dispensing surface due to the limitation of the dispensing system. For example, two metal plates with regular surfaces are taken out of the plastic plate, or one metal plate and one plastic plate are in between. And under the condition that the glue can not be continuously dispensed and laminated from the laminating surface, dispensing is required to be performed from the gap of the two laminating plates. The glue is directly dispensed from the gap, and the two attaching plates cannot be adhered and attached due to the fact that the glue is located on the surface of the gap.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, an object of the present invention is to provide a gap dispensing pressure compensation method, device, computer device and storage medium thereof.
In order to achieve the above object, in a first aspect, a gap dispensing pressure compensation method according to an embodiment of the present invention includes:
controlling the dispensing head to dispense glue at the joint gap of the two objects;
after the glue dispensing is finished, controlling the suction device to absorb the glue into the gluing gap from the back of the glue dispensing position of the gluing gap of the two objects according to the set suction force and the set suction force time.
According to an embodiment of the present invention, before controlling the dispensing head to dispense glue at the joint gap between the two objects, the method further includes:
acquiring the size of a gap at the joint gap of the two objects;
and setting the value of the set suction force according to the size of the gap.
According to one embodiment of the invention, the method for acquiring the size of the gap at the fitting gap of the two objects comprises the following steps:
setting the pressure of the template;
controlling the air suction device to suck from the back of the adhesive dispensing position of the joint gap of the two objects in vacuum according to the set template pressure and the second suction time;
acquiring a current pressure feedback value;
and acquiring the size of the gap according to the front pressure feedback value.
According to one embodiment of the invention, the second suction time is 1 second;
the suction time was 4 seconds.
According to one embodiment of the invention, the dispensing method comprises the following steps: and covering the seam spot glue along the seam by using the glue.
In a second aspect, a gap dispensing pressure compensation apparatus according to an embodiment of the present invention includes:
the glue dispensing module is used for controlling the glue dispensing head to dispense glue at the joint gap of the two objects;
and the glue absorption module is used for controlling the air suction device to absorb glue into the joint gap from the back of the glue dispensing position of the joint gap of the two objects according to the set suction force and the set suction force time after the glue dispensing is finished.
According to an embodiment of the present invention, the gap dispensing pressure compensation apparatus further includes:
the gap acquisition module is used for acquiring the size of a gap at the joint gap of the two objects;
and the suction setting module is used for setting the value of the set suction according to the size of the gap.
According to an embodiment of the present invention, the gap acquisition module includes:
the template pressure setting module is used for setting template pressure;
the vacuum absorption module is used for controlling the suction device to perform vacuum suction from the back of the adhesive dispensing position of the joint gap of the two objects according to the set template pressure and the second suction time;
the pressure feedback value acquisition module is used for acquiring a current pressure feedback value;
and the gap size acquisition module is used for acquiring the size of the gap according to the front pressure feedback value.
In a third aspect, a computer device provided according to an embodiment of the present invention includes a memory, a processor, and a computer program stored on the memory and executable on the processor, and the processor implements the gap dispensing pressure compensation method as described above when executing the computer program.
In a fourth aspect, a computer storage medium is provided according to an embodiment of the present invention, on which a computer program is stored, which when executed by a processor implements the gap dispensing pressure compensation method as described above.
According to the gap dispensing pressure compensation method, the gap dispensing pressure compensation device, the computer equipment and the storage medium thereof, the dispensing of the adhesive at the joint gap of the two objects is controlled by the dispensing head; after the glue dispensing is finished, controlling the suction device to absorb the glue into the gluing gap from the back of the glue dispensing position of the gluing gap of the two objects according to the set suction force and the set suction force time. Thus, the glue can flow into the jointing surfaces of the two attaching objects from the gap under the action of suction. Because the suction force and the suction force time of vacuum suction are set to corresponding values, the glue on the upper surface can be adsorbed to the binding surfaces of the two binding materials through the suction force. Avoid glue can't inhale the binding face, perhaps flow out from the back in gap department.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a flowchart illustrating a gap dispensing pressure compensation method according to an embodiment of the present invention;
FIG. 2 is a flowchart illustrating another exemplary embodiment of a gap dispensing pressure compensation method according to the present invention;
FIG. 3 is a flowchart of step S201 in an embodiment of a gap dispensing pressure compensation method according to the present invention;
FIG. 4 is a schematic structural diagram of an embodiment of a gap dispensing pressure compensation device according to the present invention;
FIG. 5 is a schematic structural diagram of another embodiment of the gap dispensing pressure compensation device of the present invention;
FIG. 6 is a schematic structural diagram of a gap acquisition module in an embodiment of a gap dispensing pressure compensation device according to the present invention;
fig. 7 is a schematic diagram of the structure of the computer device of the present invention.
Reference numerals:
a gap dispensing pressure compensation device 10;
a dispensing module 101;
a glue absorption module 102;
a gap acquisition module 103;
a template pressure setting module 1031;
a vacuum absorption module 1032;
a pressure feedback value acquisition module 1033;
a gap size acquisition module 1034;
a suction setting module 104;
a computer device 20;
a memory 201;
a computer program 2011;
a processor 202.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In practical dispensing applications, the dispensing operation cannot be directly performed on the dispensing surface due to the limitation of the dispensing system. For example, two metal plates with regular surfaces are taken out of the plastic plate, or one metal plate and one plastic plate are in between. And under the condition that the glue can not be continuously dispensed and laminated from the laminating surface, dispensing is required to be performed from the gap of the two laminating plates. The glue is directly dispensed from the gap, and the two attaching plates cannot be adhered and attached due to the fact that the glue is located on the surface of the gap.
Referring to fig. 1, fig. 1 is a flowchart illustrating an embodiment of a gap dispensing pressure compensation method according to an embodiment of the present invention, and for convenience of description, only portions related to the embodiment of the present invention are shown.
The gap dispensing pressure compensation method specifically comprises the following steps:
S1O1, controlling the glue dispensing head to dispense glue at the joint gap of the two objects;
and S1O2, after the glue dispensing is finished, controlling the suction device to absorb the glue into the joint gap from the back of the glue dispensing position of the joint gap of the two objects according to the set suction force and suction force time.
Specifically, in step S101, the controller performs dispensing at a gap between two placed pastes by controlling the dispensing head. In an embodiment of the present invention, the dispensing method includes: and covering the seam spot glue along the seam by using the glue. For example, the adhesive dispensing head is used to dispense all the gaps on the upper surface, so as to dispense all the gaps on the upper surfaces of the two adhesives. And after the dispensing head is controlled to finish dispensing the upper surface of the gap between the two paste materials. And S1O2, after dispensing is finished, controlling the suction device to absorb the glue into the bonding gap from the back of the dispensing position of the bonding gap of the two objects according to the set suction force and the set suction force time. After glue is dispensed to the upper surface of the dispensing position of the gluing gap of the two objects, the gap between the two gluing plates is relatively small, the glue cannot be introduced to the combining surface of the two objects only under the action of gravity, and the two gluing plates cannot be adhered and attached due to the fact that the glue is located on the surface of the gap. The vacuum suction is arranged on the back face of the gap between the two attached objects, the glue on the upper surface of the gap can be sucked by the vacuum suction under the control of the controller according to the set suction force and the set suction force time, and the glue can flow into the attaching faces of the two attached objects from the gap under the action of the suction force. Because the suction force and the suction force time of vacuum suction are set to corresponding values, the glue on the upper surface can be adsorbed to the binding surfaces of the two binding materials through the suction force. Meanwhile, the situation that the glue is not adsorbed on the two laminates due to too small suction force and too short suction force time is avoided. Or the situation that the suction force is too large and the suction force time is too long is avoided, so that the glue is adsorbed to the two attaching objects to be attached and flows out from the back of the gap. The problem of insufficient glue on the binding surface is caused. Through carrying out vacuum to the product seam back and inhaling, glue infiltration to the seam in with higher speed, because preceding vacuum pressure size and time before the point is glued, let glue infiltration to the gap in, and do not spill over from the gap back.
The gap dispensing pressure compensation method provided by the embodiment of the invention controls the dispensing head to dispense glue at the joint gap of the two objects through the step S1O 1; and S1O2, after the glue dispensing is finished, controlling the suction device to absorb the glue into the joint gap from the back of the glue dispensing position of the joint gap of the two objects according to the set suction force and suction force time. Thus, the glue can flow into the jointing surfaces of the two attaching objects from the gap under the action of suction. Because the suction force and the suction force time of vacuum suction are set to corresponding values, the glue on the upper surface can be adsorbed to the binding surfaces of the two binding materials through the suction force. Avoid glue can't inhale the binding face, perhaps flow out from the back in gap department.
Referring to fig. 2, the gap dispensing pressure compensation method further includes, before the step of controlling the dispensing head to dispense the adhesive at the joint gap between the two objects:
s201, acquiring the size of a gap at the joint gap of two objects;
s202, setting the value of the set suction force according to the size of the gap.
Specifically, when the size of the gap between two glued objects is consistent, the glue at the gap on the upper surface of the glued object with the consistent size of the gap can be adsorbed by setting a fixed suction force and a fixed suction force time, and the glue is led out from the gluing surface. However, in some applications, the gap between two different laminates may be of different sizes. If the same suction force and suction force time are adopted, the suction force is too small due to the inconsistent size of the gap, or the suction time is too short, so that the glue cannot be completely adsorbed on the adhering surfaces of the two adhering materials, or the suction force is too large, or the adsorption time is too long, so that the glue flows out from the back surface. Before setting the suction force and the suction force time, the size of a gap at the joint gap of the two objects is obtained through the step S201; the size of the acquired gap can be acquired in a vacuum suction mode or other modes. After the size of the gap is acquired, the value of the set suction force is set according to the size of the gap in step S202. Because the back of the product seam is vacuumized, the glue is accelerated to permeate into the seam, and the vacuum pressure is adjusted according to the size of the current product seam before dispensing, so that the gap difference of the instant product can be realized, the glue can also permeate into the seam, and the glue does not overflow from the back of the seam.
Referring to fig. 3, the method for obtaining the size of the gap at the joint gap between the two objects includes:
s2011, setting template pressure;
s2012, controlling the suction device to perform vacuum suction from the back of the adhesive dispensing position of the joint gap of the two objects according to the set template pressure and the second suction time;
s2013, acquiring a current pressure feedback value;
and S2014, acquiring the size of the gap according to the front pressure feedback value.
Specifically, before the gap of the object to be bonded is dispensed by controlling the dispensing head, the size of the gap at the bonding gap between the two objects is obtained by adopting a vacuum suction mode, the vacuum suction head can be arranged at the position of the back surface of the gap, and the pressure of the template is set through the step S2011; by setting a template negative pressure value. For example, the template value is 70. Then, controlling the suction device to perform vacuum suction from the back of the adhesive dispensing position of the joint gap of the two objects according to the second suction time through the step S2012 according to the set template pressure; in one embodiment of the present invention, the second suction time may be 1 second; the suction time may be 4 seconds. The second suction time is set shorter than the suction time (first suction time) because in this step, no glue needs to be sucked and a smaller value of suction time can be set. And vacuumizing from the back of the gap at the joint gap of the two objects by setting the template value and the second suction force. Meanwhile, a current pressure feedback value is obtained through the step S2013; the size of the gap is proportional to the feedback value generated by the vacuum (the negative pressure value of the template). In this manner, in step S2014, the size of the gap is acquired from the pre-pressure feedback value. The controller can obtain the size relation of the gap according to the pressure value fed back by the vacuum pressure gauge. For example, the negative feedback value may be 60 and 50 may be obtained according to the size of the gap. When the feedback negative pressure value is larger, the gap is smaller, and when glue is actually adsorbed, the suction value can be set to be a larger value. When the feedback negative pressure value is smaller, the gap is larger, and when glue is actually adsorbed, the suction value can be set to be a smaller value. The method comprises the following steps in actual operation: 1, firstly setting a negative pressure value of a template in an electric proportional valve, 2, starting vacuum suction for 1S to obtain a feedback value (namely the negative pressure value under the current product clearance) of the electric proportional valve, 3, selecting the negative pressure value required to be used after dispensing according to an adjusting interval corresponding to the feedback negative pressure value in the step 2, and adjusting the output size of vacuum pressure in the electric proportional valve according to the size of a gap in the set value.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an embodiment of the gap dispensing pressure compensation device 10 according to the present invention, and for convenience of description, only the parts related to the embodiment of the present invention are shown. The gap dispensing pressure compensation device 10 specifically includes: the glue dispensing device comprises a glue dispensing module 101 and a glue absorbing module 102, wherein the glue dispensing module 101 is used for controlling a glue dispensing head to dispense glue at a joint gap between two objects.
The glue absorption module 102 is used for controlling the suction device to absorb glue into the joint gap from the back of the glue dispensing position of the joint gap between the two objects according to the set suction force and the set suction force time after the glue dispensing is finished.
The gap dispensing pressure compensation device 10 provided by the embodiment of the invention dispenses glue at the joint gap of two objects by controlling the dispensing head; after the glue dispensing is finished, controlling the suction device to absorb the glue into the gluing gap from the back of the glue dispensing position of the gluing gap of the two objects according to the set suction force and the set suction force time. Thus, the glue can flow into the jointing surfaces of the two attaching objects from the gap under the action of suction. Because the suction force and the suction force time of vacuum suction are set to corresponding values, the glue on the upper surface can be adsorbed to the binding surfaces of the two binding materials through the suction force. Avoid glue can't inhale the binding face, perhaps flow out from the back in gap department.
Referring to fig. 5, the gap dispensing pressure compensation device 10 further includes: the device comprises a gap acquisition module 103 and a suction setting module 104, wherein the gap acquisition module 103 is used for acquiring the size of a gap at the joint gap of two objects.
The suction setting module 104 is configured to set a value of the set suction according to a size of the gap.
Referring to fig. 6, the gap acquisition module 103 includes: a template pressure setting module 1031, a vacuum absorption module 1032, a pressure feedback value obtaining module 1033, and a gap size obtaining module 1034, where the template pressure setting module 1031 is used to set the template pressure.
And the vacuum suction module 1032 is used for controlling the suction device to perform vacuum suction from the back of the adhesive dispensing position of the joint gap of the two objects according to the set template pressure and the second suction time.
The pressure feedback value obtaining module 1033 is configured to obtain a current pressure feedback value.
The gap size obtaining module 1034 is configured to obtain the size of the gap according to the front pressure feedback value.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other. For the device or system type embodiment, since it is basically similar to the method embodiment, the description is simple, and for the relevant points, refer to the partial description of the method embodiment.
Referring to fig. 6, fig. 6 shows a computer device provided in an embodiment of the present invention, which includes a memory 201, a processor 202, and a computer program 2011 stored on the memory 201 and executable on the processor 202, and when the computer program 2011 is executed by the processor 202, the gap dispensing pressure compensation method is implemented as described above.
Illustratively, the computer program 2011 can be partitioned into one or more modules/units, which are stored in the memory 201 and executed by the processor 202 to implement the present invention. The one or more modules/units may be a series of computer program instruction segments capable of performing specific functions, which are used for describing the execution process of the computer program 2011 in the computer device 20.
The computer device 20 may include, but is not limited to, a processor 202, a memory 201. Those skilled in the art will appreciate that the figure is merely an example of a computer device 20 and is not intended to limit the computer device 20 and may include more or fewer components than those shown, or some of the components may be combined, or different components, for example the computer device 20 may also include input output devices, network access devices, buses, etc.
The Processor 202 may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other programmable logic device, discrete Gate or transistor logic, discrete default hardware components, and so on. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The storage 201 may be an internal storage unit of the computer device 20, such as a hard disk or a memory of the computer device 20. The memory 201 may also be an external storage device of the computer device 20, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and the like, which are provided on the computer device 20. Further, the memory 201 may also include both an internal storage unit and an external storage device of the computer device 20. The memory 201 is used for storing the computer program 2011 and other programs and data required by the computer device 20. The memory 201 may also be used to temporarily store data that has been output or is to be output.
An embodiment of the present invention further provides a computer storage medium, on which a computer program 2011 is stored, and when the program is executed by the processor 202, the method for compensating the gap dispensing pressure as described above is implemented.
The computer program 2011 may be stored in a computer readable storage medium, and when executed by the processor 202, the computer program 2011 may implement the steps of the method embodiments. Wherein the computer program 2011 comprises computer program code, which may be in source code form, object code form, executable file or some intermediate form, etc. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, usb disk, removable hard disk, magnetic disk, optical disk, computer Memory, Read-Only Memory (ROM), Random Access Memory (RAM), electrical carrier wave signals, telecommunications signals, software distribution medium, and the like.
It should be noted that the computer readable medium may contain other components which may be suitably increased or decreased as required by legislation and patent practice in jurisdictions, for example, in some jurisdictions, computer readable media which may not include electrical carrier signals and telecommunications signals in accordance with legislation and patent practice.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.
The steps in the method of the embodiment of the invention can be sequentially adjusted, combined and deleted according to actual needs.
The modules or units in the system of the embodiment of the invention can be combined, divided and deleted according to actual needs.
Those of ordinary skill in the art would appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic pre-set hardware or in a combination of computer software and electronic pre-set hardware. Whether these functions are performed by pre-determined hardware or software depends on the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
In the embodiments provided by the present invention, it should be understood that the disclosed apparatus/computer device 500 and method may be implemented in other ways. For example, the above-described embodiment of apparatus/computer device 500 is merely illustrative, and for example, the division of the modules or units is only one logical division, and there may be other divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted, or not implemented. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. A gap dispensing pressure compensation method is characterized by comprising the following steps:
controlling the dispensing head to dispense glue at the joint gap of the two objects;
after the glue dispensing is finished, controlling the suction device to absorb the glue into the gluing gap from the back of the glue dispensing position of the gluing gap of the two objects according to the set suction force and the set suction force time.
2. The gap dispensing pressure compensation method of claim 1, wherein before dispensing at the joint gap between the control dispensing head and the two objects, the method further comprises:
acquiring the size of a gap at the joint gap of the two objects;
and setting the value of the set suction force according to the size of the gap.
3. The gap dispensing pressure compensation method according to claim 2, wherein the method for obtaining the size of the gap between the two objects comprises:
setting the pressure of the template;
controlling the air suction device to suck from the back of the adhesive dispensing position of the joint gap of the two objects in vacuum according to the set template pressure and the second suction time;
acquiring a current pressure feedback value;
and acquiring the size of the gap according to the front pressure feedback value.
4. The gap dispensing pressure compensation method according to claim 3, wherein the second suction time is 1 second;
the suction time was 4 seconds.
5. The gap dispensing pressure compensation method of claim 3, wherein the dispensing method comprises: and covering the seam spot glue along the seam by using the glue.
6. The utility model provides a pressure compensating device is glued to clearance point which characterized in that as for, includes:
the glue dispensing module is used for controlling the glue dispensing head to dispense glue at the joint gap of the two objects;
and the glue absorption module is used for controlling the air suction device to absorb glue into the joint gap from the back of the glue dispensing position of the joint gap of the two objects according to the set suction force and the set suction force time after the glue dispensing is finished.
7. The gap dispensing pressure compensating apparatus of claim 6, further comprising:
the gap acquisition module is used for acquiring the size of a gap at the joint gap of the two objects;
and the suction setting module is used for setting the value of the set suction according to the size of the gap.
8. The gap dispensing pressure compensating apparatus of claim 7, wherein the gap obtaining module comprises:
the template pressure setting module is used for setting template pressure;
the vacuum absorption module is used for controlling the suction device to perform vacuum suction from the back of the adhesive dispensing position of the joint gap of the two objects according to the set template pressure and the second suction time;
the pressure feedback value acquisition module is used for acquiring a current pressure feedback value;
and the gap size acquisition module is used for acquiring the size of the gap according to the front pressure feedback value.
9. A computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the gap dispensing pressure compensation method according to any one of claims 1 to 5 when executing the computer program.
10. A computer storage medium having a computer program stored thereon, wherein the program, when executed by a processor, implements the gap dispensing pressure compensation method of any one of claims 1 to 5.
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| CN108561391A (en) * | 2018-03-12 | 2018-09-21 | 广东欧珀移动通信有限公司 | Dispensing method, in-out box and electronic device |
| CN108636732A (en) * | 2018-05-30 | 2018-10-12 | 常州铭赛机器人科技股份有限公司 | Gap dispensing method and Fluid coater |
| CN110956902A (en) * | 2019-12-02 | 2020-04-03 | 深圳市洲明科技股份有限公司 | LED display module lamp seam glue pouring process |
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