CN113727473A - Embedded temperature control heating element, heating circuit and temperature control method - Google Patents
Embedded temperature control heating element, heating circuit and temperature control method Download PDFInfo
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- CN113727473A CN113727473A CN202111285379.1A CN202111285379A CN113727473A CN 113727473 A CN113727473 A CN 113727473A CN 202111285379 A CN202111285379 A CN 202111285379A CN 113727473 A CN113727473 A CN 113727473A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0202—Switches
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Abstract
The invention provides an embedded temperature control heating element, a heating circuit and a temperature control method, wherein the heating element comprises a substrate, a heating sheet, a thermistor and a protection plate, the heating sheet and the thermistor are both fixed between the front surface of the substrate and the back surface of the protection plate, the heating sheet is of a strip-shaped structure and comprises a left section, a middle section and a right section, the left section and the right section are arranged at intervals, the middle section is positioned between the top ends of the left section and the right section, the thermistor is of a strip-shaped structure, the top end of the thermistor is connected with the middle part of the middle section, insulation intervals are respectively arranged between the thermistor and the left section and the right section of the heating sheet, and pins are respectively arranged at the bottom ends of the left section, the right section and the thermistor of the heating sheet. The invention has the beneficial effects that: the heating element is used for entering the interior of an object to be heated to heat, the defect that a temperature measuring unit cannot be installed due to small volume is overcome, and the heating element is convenient to use and accurate and controllable in temperature control.
Description
Technical Field
The invention belongs to the technical field of heating elements, and particularly relates to an embedded type temperature-controlled heating element, a heating circuit and a temperature control method.
Background
The embedded heating element is used when some articles are heated, because the embedded heating element is inserted into the article to be heated for power-on heating when in use, and the heat transferred or leaked to the outside of the article after heating is limited, the embedded heating element has the advantages of small volume and high heating efficiency, and meanwhile, because the energy leakage of the embedded heating element is less when in heating, and the embedded heating element is electrified by a battery, the embedded heating element also has the advantage of saving the electric quantity of the battery. In the prior art, the embedded heating element is small in size and thin in thickness, a traditional temperature measuring element such as a thermocouple cannot be installed on the heating element, the temperature is difficult to be measured accurately, the heating effect cannot be controlled, and if the heating problem of the embedded heating element cannot be controlled, direct combustion of an object to be heated due to overhigh temperature or adverse effects caused by the fact that the preset heating effect is damaged can possibly occur.
Disclosure of Invention
In view of the above, the present invention provides an embedded temperature-controlled heating element, and a heating circuit and a temperature-controlling method based on the heating element, which are provided to overcome the above-mentioned disadvantages in the prior art.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
the utility model provides an embedded accuse temperature heating element, the camera comprises a substrate, the heating plate, thermistor and screening glass, heating plate and thermistor all are fixed in between the positive and screening glass reverse side of substrate, the heating plate is strip structure and includes left section, middle section and right section, the interval sets up between left section and the right section, the middle section is located between the top of left section and right section, thermistor is connected with the middle part for strip structure and top, it does not be equipped with insulating interval equally to divide between left section and the right section of thermistor and heating plate, left side section at the heating plate, right side section and thermistor bottom respectively are equipped with a pin, be first pin respectively, second pin and third pin.
Furthermore, a heating sheet is also arranged on the reverse side of the substrate, a protection sheet is also arranged on the reverse side of the heating sheet on the reverse side of the substrate, and pins, namely a fourth pin and a fifth pin, are respectively arranged at the bottom ends of the left section and the right section of the heating sheet on the reverse side of the substrate.
Furthermore, a sixth pin is arranged at the position of the reverse side of the substrate corresponding to the third pin.
Further, the substrate is a ceramic substrate.
Furthermore, the heating plate and the thermistor are both of coating structures.
Furthermore, the heating sheet is a far infrared radiation coating, and the protection sheet is a far infrared light transmission sheet.
Furthermore, the heating sheet is a resistance heating coating, and the protection sheet is an insulating coating.
Further, the thickness of the coating of the thermistor corresponds to the thickness of the coating of the heating plate.
Further, the heating plate is of a multilayer structure, the heating plate is arranged side by side at intervals from inside to outside and is arranged in parallel at the bottom end, and each layer of structure of the heating plate is connected with the end part of the top end of the thermistor through the same connecting strip.
Furthermore, the first pin, the second pin, the third pin, the fourth pin, the fifth pin, the sixth pin and the connecting strip are all conductive coating structures.
The invention also provides an embedded temperature control heating circuit, which comprises the following components in part by weight:
an embedded temperature control heating circuit comprises the embedded temperature control heating element, and further comprises an MCU, a first switch SW1 and a second switch SW2, wherein a first pin on a heating plate is connected with a power supply anode, a second pin is connected with a first switch SW1, a third pin is connected with a second switch SW2, the first switch SW1, the second switch SW2 and a power supply cathode are all grounded, the first switch SW1 and the second switch SW2 are both connected with the same MCU, and the current and the voltage of a thermistor are detected through a current sensor and a voltage sensor and are fed back to the MCU.
Further, the first pin and the fourth pin are shorted together, the second pin and the fifth pin are shorted together, and the fifth pin and the sixth pin are shorted together.
The invention also provides a temperature control method of the heating circuit based on the embedded temperature control heating element, which comprises the following steps:
a temperature control method of a heating circuit based on an embedded temperature control heating element controls the opening and closing states of a first switch SW1 and a second switch SW2 through an MCU, and comprises the following steps:
the first switch SW1 and the second switch SW2 are opened and closed alternately in a period T, the closing time of the first switch SW1 in one period T is T1, and the closing time of the second switch SW2 is T2;
the heater sheet on current operates during the closing time T1 of the first switch SW1, and the thermistor on current operates during the closing time T2 of the second switch SW 2;
the current and voltage values in the circuit are detected through a current sensor and a voltage sensor and fed back to the MCU, and the impedance value R of the thermistor is obtained in real time through the MCU;
obtaining the temperature change of the heating element according to the characteristic that the resistance value R of the thermistor changes along with the temperature;
if the obtained temperature of the heating element reaches the target temperature, suspending heating for a fixed time t and restarting heating; if the temperature of the heating element is detected to still exceed the target temperature, the heating is suspended again, the suspended heating time is still fixed time t, and the periodic heating is continued; if the temperature of the heating element is detected to be lower than the target temperature, the heating is kept periodically and continuously.
Further, the target temperature is set to 300 ± 5 ℃.
Further, the fixed time t is set to 16 ms.
Compared with the prior art, the invention has the following advantages:
the embedded temperature control heating element is characterized in that a heating sheet is arranged on a substrate, a thermistor is connected onto the heating sheet, and temperature change is obtained in real time through the electrical impedance change of the thermistor; the heating element is used for avoiding the defect that temperature measurement cannot be realized due to small volume under the condition that the heating element needs to enter the interior of an object to be heated for heating, is convenient to use and accurate and controllable in temperature control, and ensures that the heated object cannot be damaged due to overheating.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate an embodiment of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of an embodiment of an embedded temperature-controlled heating element with a heater chip disposed on a front surface of a substrate;
FIG. 2 is a schematic structural view of an embedded temperature-controlled heating element according to an embodiment of the present invention, in which the heating sheets disposed on the front surface of the substrate are double-layered;
FIG. 3 is a schematic view of an embodiment of an embedded temperature-controlled heating element with heating plates on both the front and back sides of a substrate;
FIG. 4 is a schematic structural view of an embedded temperature-controlled heating element according to an embodiment of the present invention, in which the heating sheets on the front and back sides of the substrate are dual-layered;
FIG. 5 is a schematic diagram of a heating circuit of an embedded temperature-controlled heating element according to an embodiment of the invention;
FIG. 6 is a schematic branch current diagram of a heating circuit of an embedded temperature-controlled heating element according to an embodiment of the invention.
Description of reference numerals:
1. a substrate; 2. a heating plate; 3. a thermistor; 4. a protective sheet; 5. a first pin; 6. a second pin; 7. a third pin; 8. a connecting strip; 9. a fourth pin; 10. a fifth pin; 11. a sixth pin; 12. a first connection hole; 13. a third connection hole; 14. a second connection hole; 15. a fourth connection hole; 16. a first through hole; 17. a second through hole; 18. a third through hole.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1 to 4, an embedded temperature-controlled heating element comprises a substrate 1, a heating sheet 2, a thermistor 3 and a protection sheet 4, wherein the heating sheet 2 and the thermistor 3 are both fixed between the front surface of the substrate 1 and the back surface of the protection sheet 4, the heating sheet 2 is of a strip-shaped structure and comprises a left section, a middle section and a right section, the left section and the right section are arranged at intervals, the middle section is located between the top ends of the left section and the right section, the thermistor 3 is of a strip-shaped structure and is connected with the middle section at the top end, the thermistor 3 and the left section and the right section of the heating sheet 2 are respectively provided with an insulation interval, and the left section, the right section and the bottom end of the thermistor 2 are respectively provided with a pin, namely a first pin 5, a second pin 6 and a third pin 7. In this embodiment, the heating sheet 2 is disposed on the front surface of the substrate 1, the thermistor 3 is electrically connected to the heating sheet 2, the protection sheet 4 covers the front side surfaces of the heating sheet 2 and the thermistor 3 to protect the inside of the heating element, the left section and the right section of the heating sheet 2 and the bottom end of the thermistor 3 are respectively provided with a pin for connecting with a peripheral heating circuit to heat, and the temperature of the heating element can be obtained and controlled by using the temperature of the thermistor 3 along with the variation of the electrical impedance value.
The heating sheet 2 with the same structure as the heating sheet 2 on the front side of the substrate 1 is also arranged on the back side of the substrate 1, the protection sheet 4 is also arranged on the back side of the heating sheet 2 on the back side of the substrate 1, pins, namely a fourth pin 9 and a fifth pin 10, are respectively arranged at the bottom ends of the left section and the right section of the heating sheet 2 on the back side of the substrate 1, the fourth pin 9 is in short circuit with the first pin 5, and the fifth pin 10 is in short circuit with the second pin 6 in the heating circuit, so that the heating effect is better due to the fact that the heating area is increased.
And a sixth pin 11 is arranged at the position, corresponding to the third pin 7, on the reverse side of the substrate 1 and is used for being in short circuit with the third pin 7 in the heating circuit, so that the stability of the circuit connected at the position of the third pin 7 is improved.
The substrate 1 is a ceramic substrate 1, which is used as a carrier of a heating element and has certain thickness and hardness, so that the substrate is ensured not to be bent, deformed and damaged when being inserted into an object to be heated.
The heating plate 2 and the thermistor 3 are both of a coating structure.
The heating sheet 2 is a far infrared radiation coating or a resistance heating coating, when the heating sheet 2 is a far infrared radiation coating, the protection sheet 4 is a far infrared transparent sheet, a far infrared graphene layer is used as the far infrared radiation coating, and after being electrified, the heating sheet can rapidly generate heat to generate a large amount of far infrared rays for heating; the far infrared light-transmitting sheet is a thin layer and is made of enamel materials which can transmit far infrared light, so that on one hand, the far infrared light-transmitting sheet plays a role in transmitting the far infrared light and transferring heat outwards to heat an object to be heated, and on the other hand, the far infrared light-transmitting sheet plays an insulating protection role to prevent the heating sheet 2 from being worn or oxidized due to direct contact with the object to be heated; when the heating sheet 2 is a resistance heating coating, the protection sheet 4 is an insulating coating, the resistance heating coating is a resistance conducting layer, heating can be rapidly carried out after electrification for heating, and the insulating layer is a thin layer and is made of enamel materials for insulation protection.
The thickness of the coating of the thermistor 3 is consistent with that of the heating plate 2, so that the volume of the heating element is not increased on the premise of realizing accurate temperature control, and the resistance of the heating plate 2 inserted into an article to be heated is reduced.
The middle part of the middle section of the heating plate 2 is connected with the end part of the top end of the thermistor 3 through the conductive connecting strip 8, and the conductivity between the heating plate 2 and the thermistor 3 is more stable and reliable through the connecting strip 8.
The heating plate 2 is of a multilayer structure, the heating plate 2 is arranged side by side at intervals from inside to outside and is arranged in parallel at the bottom end, and each layer of structure of the heating plate 2 is connected with the end part of the top end of the thermistor 3 through the same connecting strip 8. When the heating plate 2 is printed, sprayed or electroplated on the substrate 1, the thickness of the heating plate 2 is easily uneven, and the multilayer structure is arranged to optimize the conductive tracks on the heating plate 2 and minimize the phenomenon that the current flowing through each position of the heating plate 2 is uneven due to uneven thickness.
The first pin 5, the second pin 6, the third pin 7, the fourth pin 9, the fifth pin 10, the sixth pin 11 and the connecting strip 8 are all conductive coating structures.
The heating plate 2, the first pin 5, the second pin 6, the third pin 7, the fourth pin 9, the fifth pin 10, the sixth pin 11, the connecting strip 8 and the coating structure of the thermistor 3 are all attached to the substrate 1 through printing, electroplating or spraying, and the protective sheet 4 covers the outer side of the heating plate 2 through printing or spraying. In this embodiment, because heating plate 2 and thermistor 3 are the coating structure, when coating on substrate 1, very easily lead to unable smooth and easy conduction current because of the coating effect is not good between heating plate 2 middle section and the 3 top end of thermistor, consequently adopt connecting strip 8 to further strengthen the electrically conductive effect between heating plate 2 and the thermistor 3.
In the present invention, the shapes of the substrate 1 and the heating sheet 2 are not limited as long as the heating effect can be achieved by the multilayer structure, but for the convenience of the heating element and achieving the same heating effect with a smaller area element, a specific example is given:
the outer contour of the upper section of the substrate 1 is an inverted V-shaped or inverted U-shaped track, the whole substrate is sheet-shaped, and the substrate 1 is used as a bearing body of a heating element and has certain thickness and hardness, so that the substrate is prevented from being bent, deformed and damaged when being inserted into an article to be heated, the top of the substrate 1 is used as a pointed shape to be conveniently inserted into the article to be heated, and the resistance in the insertion process is reduced; in order to cooperate 1 shape of substrate, increase heating range, set up 2 middle sections of heating plate into sharp portion, left side section and right side section are two vertical portions that set up side by side at middle section downside both ends department, thermistor 3 is the strip structure of vertical setting, and be located between 2 left side sections of heating plate and the right side section, first pin 5 is connected in 2 left side sections of heating plate bottom, second pin 6 is connected in 2 right side sections of heating plate bottom sides, be used for connecting external heating circuit, make the electric current follow the distribution path walking of whole heating plate 2 as far as, pass through most substrate 1's area promptly, and the heating efficiency is improved.
As shown in fig. 5 to 6, the present invention further provides a heating circuit of an embedded temperature-controlled heating element, which comprises:
a heating circuit of an embedded temperature control heating element comprises the embedded temperature control heating element, and further comprises an MCU, a first switch SW1 and a second switch SW2, wherein a first pin 5 on a heating plate 2 is connected with a power supply anode, a second pin 6 is connected with a first switch SW1, a third pin 7 is connected with a second switch SW2, the first switch SW1, the second switch SW2 and a power supply cathode are all grounded, the first switch SW1 and the second switch SW2 are both connected with the same MCU, and the current and the voltage of a thermistor are detected through a current sensor and a voltage sensor and are fed back to the MCU. In this embodiment, the MCU controls the first switch SW1 and the second switch SW2 to open and close, so as to control the heating state of the heating circuit, and then the temperature change of the heating element is obtained by measuring the change in the electrical resistance value of the thermistor 3.
The first pin 5 and the fourth pin 9 are shorted together, the second pin 6 and the fifth pin 10 are shorted together, and the fifth pin 10 and the sixth pin 11 are shorted together. In this embodiment, the conductive coatings of the first pin 5 and the fourth pin 9 are respectively provided with a first connection hole 12, the conductive coatings of the second pin 6 and the fifth pin 10 are respectively provided with a second connection hole 14, the bottom of the substrate 1 is provided with a first through hole 16 corresponding to the first connection hole 12 and a second through hole 17 corresponding to the second connection hole 14, and an electric wire passes through the first through hole 16 and is soldered at two ends thereof to the corresponding two first connection holes 12 by soldering tin, so that the two first pins 5 are short-circuited together; meanwhile, another wire passes through the second through hole 17, and two ends of the other wire are welded at the corresponding two second connecting holes 14 through soldering tin, so that the two second pins 6 are in short circuit; the third pin 7 is provided with a third connecting hole 13, the fifth pin 10 is provided with a fourth connecting hole 15, the bottom end of the substrate 1 is provided with a third through hole 18 corresponding to the third connecting hole 13, the third pin 7 and the fifth pin 10 are in short circuit together by passing an electric wire through the third through hole 18 and welding the two ends of the electric wire at the third connecting hole 13 and the fourth connecting hole 15 through soldering tin, so that the electric wire can be in good contact with the conductive coating of the third pin 7 when the electric wire is welded on the conductive layer at the third pin 7, and the electric conduction is more reliable.
The invention also provides a temperature control method of the heating circuit based on the embedded temperature control heating element, which comprises the following steps:
a temperature control method of a heating circuit based on an embedded temperature control heating element controls the opening and closing states of a first switch SW1 and a second switch SW2 through an MCU, and comprises the following steps:
the first switch SW1 and the second switch SW2 are opened and closed alternately in a period T, the closing time of the first switch SW1 in one period T is T1, and the closing time of the second switch SW2 is T2;
the heating plate 2 is conducted with large current to work within the closing time T1 of the first switch SW1, the temperature is rapidly increased to heat the heated object, and the thermistor 3 is conducted with small current to work within the closing time T2 of the second switch SW 2;
the current and voltage values in the circuit are detected by a current sensor and a voltage sensor and fed back to the MCU, and the impedance value R of the thermistor 3 is obtained in real time by the MCU;
obtaining the temperature change of the heating element according to the characteristic that the resistance value R of the thermistor 3 changes along with the temperature;
if the obtained temperature of the heating element reaches the target temperature, the heating is suspended for a fixed time t, and the heating is restarted, namely, the first switch SW1 and the second switch SW2 are periodically turned on and off in a circulating mode again; if the temperature of the heating element is detected to still exceed the target temperature, the heating is suspended again, the suspended heating time is still fixed time t, and the periodic heating is continued; if the temperature of the heating element is detected to be lower than the target temperature, the heating is kept periodically and continuously. In this embodiment, the target temperature is set to 300 ± 5 degrees celsius, and the fixed time t is set to 16 ms.
Specifically, the MCU controls the on-off states of the first switch SW1 and the second switch SW2 to control the heating of the heating element, the first switch SW1 and the second switch SW2 are periodically and alternately opened and closed in a plurality of periods T, the MCU controls the heating element to heat when the first switch SW1 is closed and the second switch SW2 is opened, and the MCU obtains the temperature of the heating element when the first switch SW1 is opened and the second switch SW2 is closed; when the temperature of the heating element is detected to be lower than the target temperature, the periodic heating is continued; when the heating element temperature is detected to be higher than the target temperature, the heating is stopped for a fixed time t, namely the first switch SW1 is opened to stop heating, then the periodic heating process is carried out again, the temperature of the heating element is detected again when the second switch SW2 is closed, if the temperature is still higher than the target temperature, the periodic heating process is carried out again after the heating element temperature is continuously stopped for a fixed time t, and the heating is stopped and continued until the detected heating element temperature reaches the target temperature.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. An embedded temperature control heating element, which is characterized in that: the substrate, the heating plate, thermistor and screening glass, heating plate and thermistor all are fixed in between the positive and screening glass reverse side of substrate, the heating plate is the stripe structure and includes left section, middle section and right section, the interval sets up between left section and the right section, the middle section is located between the top of left section and right section, thermistor is connected with the middle part of middle section for stripe structure and top, it does not be equipped with insulating interval to divide equally between left section and the right section of thermistor and heating plate, left side section at the heating plate, right side section and thermistor bottom respectively are equipped with a pin, be first pin respectively, second pin and third pin.
2. The embedded temperature-controlled heating element of claim 1, wherein: the back surface of the substrate is also provided with a heating sheet, the back surface of the heating sheet on the back surface of the substrate is also provided with a protection sheet, and the bottom ends of the left section and the right section of the heating sheet on the back surface of the substrate are respectively provided with a pin, namely a fourth pin and a fifth pin.
3. The embedded temperature-controlled heating element of claim 2, wherein: and a sixth pin is arranged at the position of the reverse side of the substrate corresponding to the third pin.
4. The embedded temperature-controlled heating element of claim 1, wherein: the substrate is a ceramic substrate.
5. The embedded temperature-controlled heating element of claim 1, wherein: the heating sheet is a far infrared radiation coating, and the protection sheet is a far infrared light-transmitting sheet.
6. The embedded temperature-controlled heating element of claim 1, wherein: the heating sheet is a resistance heating coating, and the protection sheet is an insulating coating.
7. The embedded temperature-controlled heating element of claim 1, wherein: the heating plate is of a multilayer structure, the heating plate is arranged side by side at intervals from inside to outside and is arranged in parallel at the bottom end, and each layer of structure of the heating plate is connected with the end part of the top end of the thermistor through the same connecting strip.
8. A heating circuit of an embedded temperature control heating element is characterized in that: the embedded temperature-controlled heating element comprises the embedded temperature-controlled heating element as claimed in any one of claims 1 to 7, and further comprises an MCU, a first switch SW1, a second switch SW2, a first pin of the heating plate is connected with a positive electrode of a power supply, a second pin of the heating plate is connected with a first switch SW1, a third pin of the heating plate is connected with a second switch SW2, the first switch SW1, the second switch SW2 and a negative electrode of the power supply are all grounded, the first switch SW1 and the second switch SW2 are all connected with the same MCU, and the current and the voltage of the thermistor are detected by a current sensor and a voltage sensor and fed back to the MCU.
9. The heating circuit of claim 8, wherein: the first pin and the fourth pin are shorted together, the second pin and the fifth pin are shorted together, and the fifth pin and the sixth pin are shorted together.
10. A method for controlling temperature of a heating circuit based on the in-line temperature-controlled heating element of claim 8 or 9, wherein the MCU controls the on/off states of the first switch SW1 and the second switch SW2, and the method comprises the following steps:
the first switch SW1 and the second switch SW2 are opened and closed alternately in a period T, the closing time of the first switch SW1 in one period T is T1, and the closing time of the second switch SW2 is T2;
the heater sheet on current operates during the closing time T1 of the first switch SW1, and the thermistor on current operates during the closing time T2 of the second switch SW 2;
the current and voltage values in the circuit are detected through a current sensor and a voltage sensor and fed back to the MCU, and the impedance value R of the thermistor is obtained in real time through the MCU;
obtaining the temperature change of the heating element according to the characteristic that the resistance value R of the thermistor changes along with the temperature;
if the obtained temperature of the heating element reaches the target temperature, suspending heating for a fixed time t and restarting heating; if the temperature of the heating element is detected to still exceed the target temperature, the heating is suspended again, the suspended heating time is still fixed time t, and the periodic heating is continued; if the temperature of the heating element is detected to be lower than the target temperature, the heating is kept periodically and continuously.
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| JPS57186161A (en) * | 1981-05-12 | 1982-11-16 | Nissan Motor Co Ltd | Manufacture of substrate for gas sensor element with heater |
| CN201834372U (en) * | 2010-09-03 | 2011-05-18 | 上海超固商业发展有限公司 | Food delivery bag rapid heating core |
| CN102903468A (en) * | 2011-07-25 | 2013-01-30 | 瑞侃电子(上海)有限公司 | Overcurrent protection apparatus |
| CN205038538U (en) * | 2015-10-14 | 2016-02-17 | 沈阳东电电力设备开发有限公司 | Control by temperature change sensor for transformer |
| CN209930528U (en) * | 2019-03-23 | 2020-01-10 | 深圳鼎智通讯股份有限公司 | Novel ceramic heating sheet with independent temperature measuring circuit |
| CN212555383U (en) * | 2020-05-27 | 2021-02-19 | 山东黄河三角洲纺织科技研究院有限公司 | Intelligent temperature control heating sheet |
| CN212323080U (en) * | 2020-07-10 | 2021-01-08 | 德明通讯（上海）有限责任公司 | Battery heating control device |
| CN113475780A (en) * | 2021-07-07 | 2021-10-08 | 株洲利德英可电子科技有限公司 | Electronic cigarette heating sheet, manufacturing method thereof and electronic cigarette |
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| CN113727473B (en) | 2022-03-04 |
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Effective date of registration: 20221129 Address after: 518000 Aerospace Building 1-2104, No. 51, Gaoxin South 9th Road, High tech Zone Community, Yuehai Street, Nanshan District, Shenzhen, Guangdong Patentee after: Shenzhen Miraco New Material Technology Co.,Ltd. Address before: 301799 No. 156, room 1026, building B11, venture headquarters base, North Fuyuan Road, development zone, Wuqing District, Tianjin Patentee before: Tianjin mirico New Material Technology Co.,Ltd. |