CN113724592B - Display module and display device - Google Patents
Display module and display device Download PDFInfo
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- CN113724592B CN113724592B CN202110994440.3A CN202110994440A CN113724592B CN 113724592 B CN113724592 B CN 113724592B CN 202110994440 A CN202110994440 A CN 202110994440A CN 113724592 B CN113724592 B CN 113724592B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application discloses a display module and a display device, which are used for improving the installation efficiency and yield of the display module and reducing the manufacturing cost of the display module while realizing communication bridging of different printed circuit boards. The display module provided by the embodiment of the application comprises: a display panel and a plurality of printed circuit boards; the display panel comprises a display area and a peripheral area; the display panel is divided into at least one bending area and a non-bending area; the peripheral region includes: a plurality of binding areas; the binding area is bound with at least one printed circuit board; each printed circuit board comprises at least one first driving signal line; the peripheral region comprises at least one connecting lead; the connecting leads extend from the bending region to binding regions positioned at two sides of the bending region along a first direction; and the first driving signal wires in the two adjacent printed circuit boards are electrically connected through connecting leads in the binding areas at two sides of the bending area.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a display module and a display device.
Background
At present, the Organic Light Emitting Diode (OLED) display technology is applied to terminal products such as mobile phones, wearing and the like on a large scale, and good market acceptance and economic benefits are obtained.
The flexible foldable OLED product is applied to a foldable Notebook (NB) to realize full-screen and keyboard-free of the notebook, and is a hot spot development direction which is continuously expanded at present. The utility model provides an OLED display screen suitable for folding NB product, two Printed Circuit Board Assemblies (PCBA) cooperation that module circuit generally needs are used, in order to satisfy the foldability of product simultaneously, and current scheme is for adopting, flexible folding flexible circuit board (FPC) board connection between two PCBA. However, this solution has the following problems: 1. the flexible FPC is extremely difficult to assemble and operate between the left PCBA and the right PCBA, and the bonded Chip On Film (COF) and display Panel (Panel) are extremely easy to be pulled and broken in the process of fastening the flexible FPC, so that the yield and the operation efficiency of the module are greatly influenced; 2. the flexible FPC is always folded along with the Panel to form vibration, so that loosening of an FPC interface is easy to occur, and serious bad reliability such as abnormal display is caused; 3. the flexible FPC bridging process is complex, the purchasing cost is high, and the shipment cost of the module product is increased.
Disclosure of Invention
The embodiment of the application provides a display module and a display device, which are used for improving the installation efficiency and yield of the display module and reducing the manufacturing cost of the display module while realizing communication bridging of different printed circuit boards.
The embodiment of the application provides a display module, which comprises: a display panel and a plurality of printed circuit boards;
the display panel comprises a display area and a peripheral area outside the display area;
the display panel is divided into: at least one inflection region, and non-inflection regions located on both sides of the inflection region;
the peripheral area on one side of the display area includes: a plurality of binding regions corresponding to the non-inflection regions; each binding area is bound with at least one printed circuit board;
each printed circuit board comprises at least one first driving signal line;
the peripheral region comprises at least one connecting lead; the connecting leads extend from the bending region to binding regions positioned at two sides of the bending region along a first direction;
and the first driving signal wires in the two adjacent printed circuit boards are electrically connected through connecting leads in the binding areas at two sides of the bending area.
In some embodiments, the display panel further includes: a plurality of display signal lines;
the at least one printed circuit board further includes a plurality of second driving signal lines;
the peripheral region comprises a plurality of connecting leads; one end of the partial connecting lead is electrically connected with a part of the second driving signal wire, and the other end of the partial connecting lead extends to the non-bending area; in the non-bending region where the connection lead extends, the connection lead is electrically connected to a portion of the display signal line located in the non-bending region.
In some embodiments, the display module further includes: a plurality of flip chip thin film circuit boards; each printed circuit board is bound with the binding area through at least one flip chip film circuit board;
each binding area includes: a plurality of binding terminals bound with the flip chip thin film circuit board;
the first driving signal wire is electrically connected with the binding terminal through the flip-chip thin film circuit board;
both ends of the partial connecting lead wires are electrically connected with the binding terminals.
In some embodiments, when the at least one printed circuit board further includes a plurality of second driving signal lines, a portion of the second driving signal lines are electrically connected to the bonding terminals through the flip chip thin film circuit board;
one end of the connecting lead wire electrically connected with the second driving signal wire is electrically connected with the binding terminal;
the connecting lead extends to the part of the non-bending area, and the binding terminal in the non-bending area faces to the side of the display area.
In some embodiments, the plurality of printed circuit boards comprises: a main printed circuit board and at least one sub printed circuit board;
the main printed circuit board includes: a first power supply terminal, a time sequence controller;
each flip chip thin film circuit board comprises a first driving chip;
the first drive signal line includes: a first driving power signal line, a plurality of first differential signal lines; in the main printed circuit board, a first driving power supply signal wire is connected with a first power supply end, and a first differential signal wire is electrically connected with a time sequence controller; in the secondary printed circuit board, the first driving power supply signal line and the first differential signal line are electrically connected with the first driving chip.
In some embodiments, only the main printed circuit board includes a plurality of second driving signal lines;
the main printed circuit board further includes: a second power supply terminal;
the plurality of second driving signal lines includes: a second driving power signal line and a third driving power signal line electrically connected to the second power source terminal, and a plurality of gate driving circuit driving signal lines electrically connected to the timing controller;
the second driving power supply signal line provides a high level signal, and the third driving power supply signal line provides a low level signal;
and part of the second driving power supply signal wires, the third driving power supply signal wires and the grid driving circuit driving signal wires are electrically connected with the connecting lead wires through the flip chip film circuit board and the binding terminals, and the rest of the second driving power supply signal wires, the third driving power supply signal wires and the grid driving circuit driving signal wires are electrically connected with the display signal wires through the flip chip film circuit board and the binding terminals.
In some embodiments, the main printed circuit board further comprises a plurality of balancing resistors; the second driving power supply signal wire and the third driving power supply signal wire which are electrically connected with the display signal wire through the flip chip film circuit board and the binding terminal are electrically connected with the second power supply end through the balance resistor.
In some embodiments, the main printed circuit board further comprises: a main touch control driving chip;
the secondary printed circuit board further includes: a sub-touch driving chip;
the first driving signal line further includes: a second differential signal line and a fourth driving power signal line; in the main printed circuit board, a second differential signal wire is electrically connected with the main touch control driving chip, and a fourth driving power supply signal wire is electrically connected with the first power supply end; in the secondary printed circuit board, the second differential signal line is electrically connected with the secondary touch control driving chip, and the fourth driving power signal line is electrically connected with the secondary touch control driving chip.
In some embodiments, the display area includes a plurality of subpixels arranged in an array; the sub-pixel includes a transistor;
the display panel specifically includes: the substrate comprises a substrate, a first conductive layer positioned on one side of the substrate, and a second conductive layer positioned on one side of the first conductive layer away from the substrate;
the first conductive layer includes: a gate of the transistor, and a connection lead electrically connected to the plurality of gate driving circuit driving signal lines, the plurality of first differential signal lines, and the plurality of second differential signal lines, respectively;
the second conductive layer includes: and a plurality of connection leads electrically connected to the first driving power signal line, the second driving power signal line, the third driving power signal line, and the fourth driving power signal line, respectively.
In some embodiments, the second conductive layer includes a front projection of the connection lead on the substrate that covers a front projection of a portion of the connection lead included in the first conductive layer on the substrate.
In some embodiments, the first conductive layer comprises: the first sub-conductive layer and the second sub-conductive layer are positioned on one side of the first sub-conductive layer, which is away from the substrate;
and any adjacent connecting lead wire is respectively positioned on the first sub-conductive layer and the second sub-conductive layer in a plurality of connecting lead wires respectively electrically connected with the plurality of gate driving circuit driving signal wires, the plurality of first differential signal wires and the plurality of second differential signal wires.
In some embodiments, a plurality of connection leads electrically connected to the second driving power signal line, the third driving power signal line, the fourth driving power signal line, and the first driving power signal line, respectively, are sequentially arranged in a direction in which the display area points to the bonding area.
In some embodiments, the second conductive layer comprises: a third sub-conductive layer and a fourth sub-conductive sub-layer positioned on a side of the third sub-conductive layer facing away from the first conductive layer;
and any adjacent connecting lead wires are respectively positioned on the third sub-conductive layer and the fourth sub-conductive layer in a plurality of connecting lead wires respectively electrically connected with the second driving power signal wire, the third driving power signal wire, the fourth driving power signal wire and the first driving power signal wire.
In some embodiments, connection leads electrically connected to the gate driving circuit driving signal lines, the first differential signal lines, and the second differential signal lines, respectively, are sequentially arranged in a direction in which the display region points to the bonding region.
In some embodiments, each binding terminal includes: the first sub-binding terminal and the second sub-binding terminal are electrically connected;
the first conductive layer further comprises a first sub-binding terminal, and the second conductive layer further comprises a second sub-binding terminal;
the first conductive layer comprises a connecting lead wire which is electrically connected with the first sub-binding terminal;
the second conductive layer includes a connection lead electrically connected to the second sub-bond terminal.
The display device provided by the embodiment of the application comprises the display module provided by the embodiment of the application.
The display module, namely the display device, provided by the embodiment of the application is provided with the connecting lead which extends along the first direction and passes through the bending area, the connecting lead extends to the binding areas at two sides of the bending area, and the first driving signal wires in different printed circuit boards at two sides of the bending area are electrically connected through the connecting lead, namely the communication between the two printed circuit boards is realized through the connecting lead. Therefore, the display module provided by the embodiment of the application does not need to be provided with the flexible circuit board bound with two adjacent printed circuit boards, so that the assembly process flow and difficulty of the display module can be reduced, the yield and assembly efficiency of the display module are improved, the cost of the display module is reduced, the loose assembly interface caused by bending of the flexible circuit board due to bending of the display module can be avoided, and poor display is avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a display module according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of another display module according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of another display module according to an embodiment of the application;
fig. 4 is a schematic structural diagram of another display module according to an embodiment of the present application;
FIG. 5 is a cross-sectional view taken along AA' of FIGS. 1-3, according to one embodiment of the present application;
FIG. 6 is a cross-sectional view taken along AA' of FIGS. 1-3, according to yet another embodiment of the present application;
FIG. 7 is a cross-sectional view taken along AA' of FIGS. 1-3, according to yet another embodiment of the present application;
FIG. 8 is a cross-sectional view taken along AA' of FIGS. 1-3, in accordance with another embodiment of the present application;
fig. 9 is a schematic structural diagram of another display module according to an embodiment of the application;
Fig. 10 is a schematic structural diagram of another display module according to an embodiment of the application;
fig. 11 is a schematic structural diagram of another display module according to an embodiment of the application;
FIG. 12 is a cross-sectional view taken along BB' in FIG. 11, in accordance with an embodiment of the present application;
fig. 13 is a cross-sectional view taken along CC' in fig. 11, provided by an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present application. It will be apparent that the described embodiments are some, but not all, embodiments of the application. And embodiments of the application and features of the embodiments may be combined with each other without conflict. All other embodiments, which can be made by a person skilled in the art without creative efforts, based on the described embodiments of the present application fall within the protection scope of the present application.
Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The terms "first," "second," and the like, as used herein, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.
It should be noted that the dimensions and shapes of the figures in the drawings do not reflect true proportions, and are intended to illustrate the present application only. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
The embodiment of the application provides a display module, as shown in fig. 1 and 2, the display module comprises: a display panel 1 and a plurality of printed circuit boards 2;
the display panel 1 includes a display area 3 and a peripheral area 4 outside the display area 3;
the display panel 1 is divided into: at least one inflection region 5, and non-inflection regions 6 located at both sides of the inflection region 5;
the peripheral area 4 on the display area 3 side includes: a plurality of binding areas 8 corresponding to the non-inflection areas 6; each binding region 8 is bound with at least one printed circuit board 2;
each printed circuit board 2 comprises at least one first drive signal line 9;
the peripheral region 4 comprises at least one connecting lead 10; the connecting leads 10 extend in the first direction X from the inflection region 5 to the binding regions 8 located on both sides of the inflection region 5;
at the binding region 8 on both sides of the bending region 5, the first drive signal lines 9 in the adjacent two printed circuit boards 2 are electrically connected by connection leads 10.
The display module provided by the embodiment of the application is provided with the connecting lead which extends along the first direction and passes through the bending area, the connecting lead extends to the binding areas at two sides of the bending area, and the first driving signal wires in different printed circuit boards at two sides of the bending area are electrically connected through the connecting lead, namely, the communication between the two printed circuit boards is realized through the first driving signal wires and the connecting lead. Therefore, the display module provided by the embodiment of the application does not need to be provided with the flexible circuit board bound with two adjacent printed circuit boards, so that the assembly process flow and difficulty of the display module can be reduced, the yield and assembly efficiency of the display module are improved, the cost of the display module is reduced, the loose assembly interface caused by bending of the flexible circuit board due to bending of the display module can be avoided, and poor display is avoided.
In fig. 1 and 2, the bending axis 7 of the bending region 5 extends along the second direction Y, and the bending axis 7 extends through the display region 3 to the peripheral region 4, and the first direction X intersects the second direction Y. Fig. 1 and 2 illustrate an example in which the second direction Y is perpendicular to the first direction X. One inflection region in fig. 1 and 2 corresponds to one binding region.
It should be noted that fig. 1 and fig. 2 illustrate an example in which the display panel is divided into one bending region and two non-bending regions. In a specific implementation, the display panel may be divided into more bending regions and non-bending regions.
In some embodiments, the printed circuit board may be directly bound to the binding area of the display panel, and each binding area includes: a plurality of binding terminals bound to the printed circuit board. At least two ends of part of the connecting leads are electrically connected with the binding terminals, so that the first driving signal wires are electrically connected with the connecting leads through the binding terminals.
Alternatively, in some embodiments, as shown in fig. 1, 2, and 3, the display module further includes: a plurality of COFs; each printed circuit board 2 is bound to the binding region 8 by at least one flip chip film circuit board COF.
It should be noted that fig. 1, 2, and 3 illustrate that each printed circuit board 2 is bound to the binding region 8 by two chip on film circuit boards COFs.
In some embodiments, each binding region includes: a plurality of binding terminals bound with the flip chip thin film circuit board;
the first driving signal wire is electrically connected with the binding terminal through the flip-chip thin film circuit board;
at least two ends of part of the connecting leads are electrically connected with the binding terminals.
Namely, two ends of a connecting lead wire which is positioned in different printed circuit boards and electrically connected with the first driving signal wire are electrically connected with the first binding terminal.
The bonding terminals are not shown in fig. 1, and only the electrical connection relationship between the first drive signal line and the connection lead and the signal transmission path are illustrated by solid lines.
It should be noted that, in the implementation, the printed circuit board includes electrical components, and the flip-chip thin film circuit board may also include electrical components, and in the implementation, the first driving signal line is configured to provide signals to the electrical components in the printed circuit board and/or the flip-chip thin film circuit board. When signals are required to be transmitted between the electrical components in different printed circuit boards and flip chip film circuit boards, the signal transmission between the different printed circuit boards and the flip chip film circuit boards can be realized through the first driving signal line and the connecting lead wire electrically connected with the first driving signal line.
In some embodiments, the display panel further includes: a plurality of display signal lines;
as shown in fig. 2 and 3, the at least one printed circuit board 2 further includes a plurality of second driving signal lines 11;
the peripheral region 4 includes a plurality of connection leads 10; one end of a part of the connection lead 10 is electrically connected to a part of the second driving signal line 11, and the other end of the part of the connection lead 10 extends to the non-bent region 6; in the non-bent region 6 where the connection lead 10 extends, the connection lead 10 is electrically connected to a portion of the display signal line (not shown) located in the non-bent region 6.
It should be noted that, in the implementation, the second driving signal line does not need to provide signals to the electrical components in the printed circuit board and/or the flip-chip thin film circuit board, so that the second driving signal line led out from a part of the printed circuit board does not need to be led to the circuit board, and can be directly electrically connected to the display signal line through the connection lead extending to the non-bending region.
In some embodiments, the display area includes a plurality of subpixels arranged in an array; the sub-pixels comprise pixel circuits, for example comprising transistors, and may also comprise capacitors. The plurality of display signal lines include, for example, a data signal line, a power signal line, and the like electrically connected to the pixel circuits. The power signal lines include, for example, a first power signal line and a second power signal line. The peripheral region of the display panel may further include a gate driving circuit electrically connected to the scan signal lines of the pixel circuit array. The plurality of display signal lines may further include a control signal line of the gate driving circuit. In particular, the display signal lines electrically connected to the connection leads extend, for example, in the second direction.
In a specific implementation, the display panel may be, for example, an electroluminescent display panel. The display area further includes an electroluminescent device electrically connected to the pixel circuit. The electroluminescent device may be, for example, an organic light emitting diode or a quantum dot light emitting diode.
In some embodiments, when the at least one printed circuit board further includes a plurality of second driving signal lines, and the printed circuit board is directly bonded to the bonding region of the display panel, the second driving signal lines are electrically connected to the bonding terminals; only one end of the connection lead electrically connected to the second driving signal line is electrically connected to the bonding terminal.
Alternatively, in some embodiments, when the at least one printed circuit board further includes a plurality of second driving signal lines, the second driving signal lines are electrically connected to the bonding terminals through the flip chip thin film circuit board;
only one end of the connection lead wire which is electrically connected with the second driving signal wire is electrically connected with the binding terminal;
the connecting lead extends to the part of the non-bending area, and the binding terminal in the non-bending area faces to the side of the display area.
In some embodiments, as shown in fig. 1, 2, 3, the plurality of printed circuit boards 2 includes: a main printed circuit board 12 and at least one secondary printed circuit board 13;
The main printed circuit board includes: a first power supply terminal PMIC, a time sequence controller Tcon;
each COF comprises a first drive chip SDIC;
the first drive signal line 9 includes: a first driving power signal line AVDD, a plurality of first differential signal lines 14; in the main printed circuit board 12, a first driving power signal line AVDD is electrically connected to the first power source terminal PMIC, and a first differential signal line 14 is electrically connected to the timing controller Tcon; in the sub printed circuit board 13, the first drive power supply signal line AVDD and the first differential signal line 14 are electrically connected to the first drive chip SDIC.
In some embodiments, as shown in fig. 1, the main printed circuit board 12 further includes: and a first driving power signal line AVDD electrically connected to the first driving chip SDIC in the flip chip film circuit board COF bonded to the main printed circuit board 12. As shown in fig. 2, the main printed circuit board 12 further includes: and first differential signal lines 14 electrically connected to the first drive chip SDIC in the flip-chip film circuit board COF bonded to the main printed circuit board 12.
In particular implementations, the first drive chip SDIC is configured to provide the data signal to the data signal line. The data signal line is electrically connected with the first drive chip SDIC through the flip-chip thin film circuit board and the binding terminal. The first power supply terminal PMIC supplies a first driving power supply signal to the first driving chip SDIC through the first driving power supply signal line AVDD. The timing controller Tcon supplies a differential signal to the first drive chip SDIC through a first differential signal line.
In the implementation, the main printed circuit board and the auxiliary printed circuit board can be provided with only one first driving power signal wire AVDD electrically connected with the connecting lead, so that the signal of the first power end PMIC in the main printed circuit board can be transmitted to the auxiliary printed circuit board through the driving power signal wire AVDD and the connecting lead.
In particular embodiments, the primary and secondary printed circuit boards include a plurality of first differential signal lines electrically connected to the connection leads. The number of first differential signal lines electrically connected to the connection leads may be set according to the number of first driving chips electrically connected to the sub-printed circuit board, for example.
In some embodiments, as shown in fig. 2 and 3, only the main printed circuit board 12 includes a plurality of second driving signal lines 11;
the main printed circuit board 12 further includes: a second power supply terminal ELIC;
the plurality of second driving signal lines 11 includes: a second driving power signal line ELVDD and a third driving power signal line ELVSS electrically connected to the second power terminal ELIC, and a plurality of gate driving circuit driving signal lines GOA electrically connected to the timing controller Tcon;
the second driving power signal line ELVDD supplies a high level signal, and the third driving power signal line ELVSS supplies a low level signal;
Part of the second driving power signal lines ELVDD, the third driving power signal lines ELVSS and the gate driving circuit driving signal lines GOA are electrically connected to the connection leads 10 through the flip chip film circuit board COF and the bonding terminals, and the remaining second driving power signal lines ELVDD, the third driving power signal lines ELVSS and the gate driving circuit driving signal lines GOA are electrically connected to the display signal lines through the flip chip film circuit board COF and the bonding terminals.
That is, in the implementation, part of the second driving signal lines in the main printed circuit board are electrically connected with the display signal lines in the non-bending area corresponding to the auxiliary printed circuit board through the flip chip film circuit board, the binding terminals and the connecting leads. The other second driving signal wires in the main printed circuit board are electrically connected with the display signal wires of the non-bending areas corresponding to the main printed circuit board through the flip chip film circuit board and the binding terminals.
In particular, the second driving power signal line ELVDD is electrically connected to, for example, a first power signal line among the display signal lines, the second driving power signal line ELVDD supplies a high level signal to the first power signal line, the third driving power signal line ELVSS is electrically connected to, for example, a second power signal line among the display signal lines, and the third driving power signal line ELVSS supplies a low level signal to the second power signal line. The gate driving circuit driving signal line GOA is electrically connected to, for example, a control signal line of a gate driving circuit among the display signal lines, and the gate driving circuit driving signal line GOA supplies a gate driving circuit control signal to the gate driving circuit. The gate drive circuit control signal includes, for example, a clock signal, a start signal, and the like.
In fig. 3, only one gate driving circuit driving signal line GOA is shown to be electrically connected to the connection lead 10, and in a specific implementation, a plurality of gate driving circuit driving signal lines GOA led out from the timing controller may be electrically connected to control signal lines of the corresponding gate driving circuits through connection leads.
In particular, for example, only one second driving power signal line ELVDD electrically connected to the connection lead may be provided, and the high level signal may be supplied to the first power signal line. The supply of the low level signal to the second power supply signal line may be achieved by providing only one third driving power supply signal line ELVSS electrically connected to the connection lead.
In some embodiments, as shown in fig. 4, the main printed circuit board further includes a plurality of balancing resistors R; the second driving power signal line ELVDD and the third driving power signal line ELVSS electrically connected to the display signal line through the flip chip film circuit board COF and the bonding terminal are electrically connected to the second power terminal ELIC through the balance resistor R.
The connection leads electrically connected to the second and third driving power signal lines ELVDD and ELVSS extend to the non-bent regions, and thus the connection leads have a long length and high resistance. The display module provided by the embodiment of the application is provided with the balance resistor between the second driving power supply signal line ELVDD and the third driving power supply signal line ELVSS which are not electrically connected with the connecting lead and the second power supply end ELIC, so that the resistance of the second driving power supply signal line ELVDD and the third driving power supply signal line ELVSS which are not electrically connected with the connecting lead is consistent with the resistance of the second driving power supply signal line ELVDD and the third driving power supply signal line ELVSS which are electrically connected with the connecting lead, and the brightness difference of a display area caused by the difference of the resistances of the signal lines can be avoided.
In some embodiments, the display area further includes a touch module. The touch module comprises a touch electrode and a touch signal wire. Namely, the display panel provided by the embodiment of the application is a touch display panel.
When the display panel is a touch display panel, in some embodiments, as shown in fig. 1 to 4, the main printed circuit board further includes: a main touch control driving chip MTIC;
the secondary printed circuit board further includes: and a sub-touch driving chip STIC.
In some embodiments, as shown in fig. 1 and 2, the first driving signal line 9 further includes: a second differential signal line 15 and a fourth driving power signal line VDD; in the main printed circuit board 12, a second differential signal line 15 is electrically connected with a main touch control driving chip MTIC, and a fourth driving power supply signal line VDD is electrically connected with a first power supply end PMIC; in the sub printed circuit board 13, the second differential signal line 15 is electrically connected to the sub touch driving chip STIC, and the fourth driving power signal line VDD is electrically connected to the sub touch driving chip STIC.
In the implementation, only one fourth driving power signal line VDD electrically connected to the connection lead may be provided, so that the touch power signal may be provided to the sub touch driving chip STIC. Only one second differential signal line 15 electrically connected to the connection lead may be provided, so that the differential signal may be provided to the sub touch driving chip STIC.
In the implementation, as shown in fig. 1, the main printed circuit board 12 further includes a fourth driving power signal line VDD electrically connected to the first power terminal PMIC and the main touch driving chip MTIC. That is, the first power supply terminal PMIC supplies the touch power supply signal to the main touch driving chip MTIC and the sub touch driving chip STIC through the fourth driving power supply signal line VDD.
In the implementation, as shown in fig. 2, the main printed circuit board 12 further includes a second differential signal line 15 electrically connecting the timing controller Tcon and the main touch driving chip MTIC. Namely, the timing controller Tcon provides the differential signal to the main touch driving chip MTIC, and then the main touch driving chip MTIC provides the differential signal to the sub touch driving chip STIC through the second differential signal line electrically connected with the connection lead.
In order to facilitate the illustration of the transmission paths of the signal lines in the printed circuit board, fig. 1, 2 and 3 show different electrical components and signal lines connected to the respective electrical components. Only the first driving power signal line AVDD and the fourth driving power signal line VDD are shown in fig. 1. Only the gate driving circuit driving signal line GOA, the first differential signal line 14, and the second differential signal line 15 are shown in fig. 2. Only the second driving power signal line ELVDD and the third driving power signal line ELVSS are shown in fig. 3.
In some embodiments, the display area includes a plurality of subpixels arranged in an array; the sub-pixel includes a transistor;
as shown in fig. 5, the display panel specifically includes: a substrate 16, a first conductive layer 17 located on one side of the substrate 16, a second conductive layer 18 located on one side of the first conductive layer 17 facing away from the substrate;
the first conductive layer 17 includes: a gate electrode of the transistor, a connection lead 10 electrically connected to each of the plurality of gate driving circuit driving signal lines, the plurality of first differential signal lines, and the plurality of second differential signal lines;
the second conductive layer 18 includes: and a plurality of connection leads 10 electrically connected to the first, second, third, and fourth driving power signal lines, respectively.
That is, connection leads electrically connected to the plurality of gate driving circuit driving signal lines, the plurality of first differential signal lines, and the plurality of second differential signal lines, respectively, are provided in the same layer as the gates of the transistors. A plurality of connection leads electrically connected to the first drive power supply signal line, the second drive power supply signal line, the third drive power supply signal line, and the fourth drive power supply signal line, respectively, are arranged on the same layer as the source electrode and the drain electrode of the transistor.
In fig. 5, the connection lead 10 denoted by goa is a connection lead electrically connected to the gate driving circuit driving signal line, the connection lead 10 denoted by tcon1 is a connection lead electrically connected to the first differential signal line, and the connection lead 10 denoted by tcon2 is a connection lead electrically connected to the second differential signal line. The connection lead 10 denoted by elvdd is a connection lead electrically connected to the second driving power signal line, the connection lead 10 denoted by elvss is a connection lead electrically connected to the third driving power signal line, the connection lead 10 denoted by vdd is a connection lead electrically connected to the fourth driving power signal line, and the connection lead 10 denoted by avdd is a connection lead electrically connected to the first driving power signal line.
Fig. 5 may be a sectional view taken along AA' in fig. 1 to 3, for example.
In some embodiments, as illustrated in fig. 5, the display panel further includes: a buffer layer 19 between the substrate 16 and the first conductive layer 17, an active layer (not shown) between the buffer layer 19 and the first conductive layer 17, a first gate insulating layer 20 between the active layer and the first conductive layer 17, an interlayer insulating layer 21 between the first conductive layer 17 and the second conductive layer 18, a first passivation protection layer 22 on a side of the second conductive layer 18 facing away from the interlayer insulating layer 21, and a planarization layer 23 on a side of the passivation protection layer 22 facing away from the second conductive layer 18. The active layer includes an active layer of a transistor, that is, the transistor in the display panel provided by the embodiment of the application is in a top gate structure. Of course, the transistor may be a bottom gate structure in implementation.
In a specific implementation, the plurality of connection leads electrically connected to the first driving power signal line, the second driving power signal line, the third driving power signal line, and the fourth driving power signal line, respectively, need to transmit a dc signal with a higher load, and the connection leads may be set to have a higher conductivity. In the process of manufacturing the display panel, the source electrode and the drain electrode of the transistor are usually made of materials with higher conductivity, so that the connecting lead and the source electrode and the drain electrode of the transistor can be arranged in the same layer. The plurality of connection leads electrically connected to the first driving power signal line, the second driving power signal line, the third driving power signal line, and the fourth driving power signal line, respectively, in some embodiments include: titanium/aluminum/titanium laminate.
In some embodiments, as shown in fig. 5, second conductive layer 18 includes an orthographic projection of connecting lead 10 on substrate 16, covering an orthographic projection of a portion of connecting lead 10 included in first conductive layer 17 on substrate 16.
Therefore, the size of the peripheral area provided with the connecting lead can be reduced, and the display with a narrow frame is facilitated.
In some embodiments, as shown in fig. 6, the first conductive layer 17 includes: a first sub-conductive layer 25, and a second sub-conductive layer 26 on a side of the first sub-conductive layer 25 facing away from the substrate 16.
Among the plurality of connection leads 10 electrically connected to the plurality of gate driving circuit driving signal lines, the plurality of first differential signal lines, and the plurality of second differential signal lines, any adjacent connection lead 10 is located in the first sub-conductive layer 25 and the second sub-conductive layer 26, respectively.
That is, a plurality of connection leads electrically connected to the plurality of gate driving circuit driving signal lines, the plurality of first differential signal lines, and the plurality of second differential signal lines, respectively, are alternately arranged in the first sub-conductive layer and the second sub-conductive layer.
As shown in fig. 6, a plurality of connection wirings goa electrically connected to the gate driving circuit driving signal lines are alternately disposed in the first and second sub-conductive layers 25 and 26. A plurality of connection leads tcon1 electrically connected to the first differential signal lines are alternately arranged in the first sub-conductive layer 25 and the second sub-conductive layer 26. In fig. 6, the second sub-conductive layer 26 includes a connection lead tcon2 electrically connected to the second differential signal line, and in the implementation, how the plurality of connection leads electrically connected to the plurality of gate driving circuit driving signal lines, the plurality of first differential signal lines, and the plurality of second differential signal lines are alternately arranged may be selected according to practical needs.
In a specific implementation, a plurality of gate driving circuits need to be arranged to drive the signal lines and a plurality of first differential signal lines, and a plurality of connecting leads respectively electrically connected with the signal lines need to be correspondingly arranged. A plurality of connection leads electrically connected to the plurality of gate driving circuit driving signal lines, the plurality of first differential signal lines, and the plurality of second differential signal lines are alternately arranged in the first sub-conductive layer and the second sub-conductive layer, respectively, so that signal interference between the plurality of connection leads can be reduced.
In practice, the display panel further comprises a second gate insulating layer 24 between the first 25 and second 26 sub-conductive layers, as shown in fig. 6. In an implementation, the first sub-conductive layer may include, for example, a gate of a transistor, and may further include a first electrode of a capacitor, and the second sub-conductive layer may include a second electrode of the capacitor.
In some embodiments, as shown in fig. 6, connection leads goa, tcon1, tcon2 electrically connected to the gate driving circuit driving signal line, the first differential signal line, and the second differential signal line, respectively, are sequentially arranged in a direction in which the display area points to the bonding area (i.e., in a direction in which a points to a').
In particular, the gate driving circuit driving signal line is not required to be electrically connected to the sub-printed circuit board, but is electrically connected to the display signal line through the connection lead extending to the non-bending region, so that the connection lead electrically connected to the gate driving circuit driving signal line is disposed at a side close to the display region, and the connection lead electrically connected to the gate driving circuit driving signal line is electrically connected to the display signal line.
In some embodiments, as shown in fig. 5 and 6, a plurality of connection wires elvdd, elvss, vdd, avdd electrically connected to the second driving power signal line, the third driving power signal line, the fourth driving power signal line and the first driving power signal line, respectively, are sequentially arranged in a direction in which the display area points to the bonding area (i.e., in a direction in which a points to a').
In the specific implementation, the second driving power signal line and the third driving power signal line are not required to be electrically connected with the auxiliary printed circuit board, but are electrically connected with the display signal line through the connecting lead wire extending to the non-bending area, so that the connecting lead wires electrically connected with the second driving power signal line and the third driving power signal line are arranged on one side close to the display area, and the connecting lead wires electrically connected with the second driving power signal line and the third driving power signal line are conveniently electrically connected with the display signal line. Further, the connection lead elvss electrically connected to the third driving power supply signal line and the connection lead avdd electrically connected to the first driving power supply signal line are spaced apart by the connection lead vdd electrically connected to the fourth driving power supply signal line, so that a defect caused by a large voltage difference between the connection lead elvss electrically connected to the third driving power supply signal line and the connection lead vdd electrically connected to the fourth driving power supply signal line can be avoided.
In some embodiments, as shown in fig. 7 and 8, the second conductive layer 18 includes: a third sub-conductive layer 27, and a fourth sub-conductive layer 28 on the side of the third sub-conductive layer 27 facing away from the first conductive layer 17.
In the embodiment, as shown in fig. 7 and 8, the first passivation layer 22 is located between the third sub-conductive layer 27 and the fourth sub-conductive layer 28, and the second passivation layer 29 is further located between the fourth sub-conductive layer 28 and the planarization layer 23.
In some embodiments, as shown in fig. 7, any adjacent connection lead among the plurality of connection leads elvdd, elvss, vdd, avdd electrically connected to the second, third, first, and fourth driving power signal lines, respectively, is located at the third and fourth sub-conductive layers 27 and 28, respectively.
That is, the connection leads elvdd, elvss, vdd, avdd are alternately arranged in the third and fourth sub-conductive layers, so that signal interference between the connection leads can be prevented.
In the embodiment, the connection lead elvdd is electrically connected to the first power signal line, the connection lead elvss is electrically connected to the second power signal line, and the first power signal line and the second power signal line are disposed in the same layer, for example, the third sub-conductive layer may include the first power signal line and the second power signal line. When the connecting leads elvdd and elvss are alternately arranged on the third sub-conductive layer and the fourth sub-conductive layer, the connecting leads arranged on the fourth sub-conductive layer can be lapped with the corresponding power signal lines through the through holes penetrating through the first passivation protection layer, so that short circuits between signal lines which are not electrically connected and are crossed in the extending direction can be avoided. Namely, the connecting leads are alternately arranged, so that the lap joint difficulty of the connecting leads and the display signal line can be reduced. In a specific implementation, for example, the third sub-conductive layer includes connection leads elvdd and vdd, the fourth sub-conductive layer includes connection leads elvss and avdd, and the first power signal line is electrically connected to the connection leads elvdd in the same layer, and the connection leads elvss are overlapped with the second power signal line 33 through the via holes 32 penetrating the first passivation layer 22, as shown in fig. 9.
Of course, in the embodiment, when the connection lead elvdd, elvss, vdd, avdd is disposed in the same layer, the third sub-conductive layer included in the second conductive layer is exemplified as the connection lead elvdd, elvss, vdd, avdd in fig. 6, and the first power signal line, the second power signal line, the connection lead elvdd, and elvss are disposed in the same layer, in the embodiment, the first power signal line and the connection lead elvdd may be electrically connected in the same layer, as shown in fig. 10, and the fourth sub-conductive layer 28 may include, for example, a bonding wire 34 electrically connecting the second power signal line 33 and the connection lead elvss, and the bonding wire 34 may be bonded to the second power signal line 33 and the connection lead elvss through a via 32 penetrating the first passivation layer 22, respectively.
In some embodiments, as illustrated in fig. 8, the plurality of connection leads elvdd, elvss, vdd, avdd electrically connected to the second, third, first and fourth driving power signal lines, respectively, each include a first sub-connection lead 30 at the third sub-conductive layer 27 and a second sub-connection lead 31 at the fourth sub-conductive layer 28. The first sub-connection lead 30 and the second sub-connection lead 31 are electrically connected through a via hole (not shown) penetrating the second passivation protection layer 29.
I.e., each connection lead adopts a double-layered wiring, so that the resistance of the connection lead can be reduced.
In an implementation, the third sub-conductive layer further includes a source and a drain of a transistor. In some embodiments, when the planarizing layer comprises an electroluminescent device on a side facing away from the substrate base plate, the electroluminescent device comprises, for example, an anode, a light-emitting functional layer, a cathode in a stacked arrangement. The fourth sub-conductive layer for example further comprises a connection electrode electrically connecting the anode of the electroluminescent device with the source or drain of the transistor.
In some embodiments, a schematic diagram of the electrical connection of the binding terminals 35 to the connection leads 10 is shown in fig. 11.
In fig. 11, only a part of the peripheral region of the display panel is shown. Only two connecting leads at different layers are shown in fig. 11.
In some embodiments, as shown in fig. 12 and 13, each binding terminal 35 includes: a first sub-bonding terminal 36 and a second sub-bonding terminal 37 electrically connected;
the first conductive layer 17 further comprises a first sub-binding terminal 36 and the second conductive layer 18 further comprises a second sub-binding terminal 37;
the first conductive layer 17 includes a connection lead 10 electrically connected to the first sub-bonding terminal 36;
the second conductive layer 18 includes a connection lead 10 electrically connected to the second sub-bonding terminal 37.
Fig. 12 is a sectional view taken along BB 'in fig. 11, and fig. 13 is a sectional view taken along CC' in fig. 11.
In particular implementation, for example, the first sub-bonding terminal 36 and the second sub-bonding terminal 37 are electrically connected through a via penetrating the interlayer insulating layer 21.
The embodiment of the application provides a display device, which comprises the display module provided by the embodiment of the application.
In some embodiments, the display device provided in the embodiments of the present application is a foldable display device.
The display device provided by the embodiment of the application comprises the following components: any product or component with display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Other essential components of the display device will be understood by those skilled in the art, and are not described herein in detail, nor should they be considered as limiting the application. The implementation of the display device can be referred to the embodiment of the display module, and the repetition is not repeated.
In summary, the display module, i.e., the display device, provided by the embodiment of the application is provided with the connecting lead extending along the first direction and passing through the bending region, the connecting lead extends to the binding regions at two sides of the bending region, and the first driving signal lines in different printed circuit boards at two sides of the bending region are electrically connected through the connecting lead, i.e., the communication between the two printed circuit boards is realized through the connecting lead. Therefore, the display module provided by the embodiment of the application does not need to be provided with the flexible circuit board bound with two adjacent printed circuit boards, so that the assembly process flow and difficulty of the display module can be reduced, the yield and assembly efficiency of the display module are improved, the cost of the display module is reduced, the loose assembly interface caused by bending of the flexible circuit board due to bending of the display module can be avoided, and poor display is avoided.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (14)
1. A display module, characterized in that the display module comprises: a display panel and a plurality of printed circuit boards;
the display panel comprises a display area and a peripheral area outside the display area;
the display panel is divided into: at least one bending region and non-bending regions positioned at two sides of the bending region;
the peripheral region on one side of the display region includes: a plurality of binding regions corresponding to the non-inflection regions; each binding area is bound with at least one printed circuit board;
each of the printed circuit boards includes at least one first drive signal line configured to provide signals to electrical components in the printed circuit board and/or the flip-chip thin film circuit board;
the peripheral region comprises at least one connecting lead; the connecting leads extend from the bending region to the binding regions positioned at two sides of the bending region along a first direction;
The binding areas are arranged on two sides of the bending area, and the first driving signal wires in two adjacent printed circuit boards are electrically connected through the connecting lead;
wherein, the display panel still includes: a plurality of display signal lines;
at least one of the printed circuit boards further includes a plurality of second drive signal lines that do not need to provide signals to electrical components in the printed circuit board and/or the flip-chip thin film circuit board;
the peripheral region comprises a plurality of connecting leads; one end of part of the connecting lead is electrically connected with part of the second driving signal wire, and the other end of part of the connecting lead extends to the non-bending area; the connecting lead is electrically connected with part of the display signal line positioned in the non-bending area;
wherein the plurality of printed circuit boards comprises: a main printed circuit board and at least one sub printed circuit board; the first driving signal line includes: a first driving power supply signal line, a plurality of first differential signal lines, the first driving signal line further including: a second differential signal line and a fourth driving power signal line; only the main printed circuit board includes the plurality of second driving signal lines, the plurality of second driving signal lines including: a second driving power signal line and a third driving power signal line connected to a second power terminal in the main printed circuit board, and a plurality of gate driving circuit driving signal lines electrically connected to the timing controller; the display area comprises a plurality of sub-pixels which are arranged in an array manner; the sub-pixel includes a transistor; the display panel specifically includes: a substrate, a first conductive layer positioned at one side of the substrate, and a second conductive layer positioned at one side of the first conductive layer away from the substrate; the first conductive layer includes: the grid electrode of the transistor is electrically connected with the plurality of grid electrode driving circuit driving signal lines, the plurality of first differential signal lines and the plurality of second differential signal lines respectively; the second conductive layer includes: and a plurality of connection leads electrically connected to the first driving power signal line, the second driving power signal line, the third driving power signal line, and the fourth driving power signal line, respectively.
2. The display module of claim 1, wherein the display module further comprises: a plurality of flip chip thin film circuit boards; each printed circuit board is bound with the binding area through at least one flip chip film circuit board;
each binding area comprises: a plurality of binding terminals bound with the flip chip thin film circuit board;
the first driving signal line is electrically connected with the binding terminal through the flip chip thin film circuit board;
and two ends of part of the connecting leads are electrically connected with the binding terminals.
3. The display module of claim 2, wherein when at least one of the printed circuit boards further comprises a plurality of second driving signal lines, a portion of the second driving signal lines are electrically connected to the bonding terminals through the flip chip thin film circuit board;
one end of the connecting lead wire electrically connected with the second driving signal wire is electrically connected with the binding terminal;
and the connecting lead extends to the part of the non-bending area, and the binding terminal in the non-bending area faces to one side of the display area.
4. A display module according to claim 3, wherein the main printed circuit board comprises: a first power supply terminal, a time sequence controller;
Each flip chip thin film circuit board comprises a first driving chip;
in the main printed circuit board, the first driving power supply signal line is connected with the first power supply end, and the first differential signal line is electrically connected with the time sequence controller; in the secondary printed circuit board, the first driving power supply signal line and the first differential signal line are electrically connected with the first driving chip.
5. The display module of claim 4, wherein the plurality of second driving signal lines comprises: a plurality of gate driving circuits electrically connected to the timing controller, the gate driving circuits driving signal lines; the second driving power supply signal line provides a high level signal, and the third driving power supply signal line provides a low level signal;
and part of the second driving power supply signal line, the third driving power supply signal line and the grid driving circuit driving signal line are electrically connected with the connecting lead through the flip chip film circuit board and the binding terminal, and the rest of the second driving power supply signal line, the third driving power supply signal line and the grid driving circuit driving signal line are electrically connected with the display signal line through the flip chip film circuit board and the binding terminal.
6. The display module of claim 5, wherein the main printed circuit board further comprises a plurality of balancing resistors; the second driving power supply signal wire and the third driving power supply signal wire which are electrically connected with the display signal wire through the flip chip film circuit board and the binding terminal are electrically connected with the second power supply end through the balance resistor.
7. The display module of any one of claims 4-6, wherein the main printed circuit board further comprises: a main touch control driving chip;
the secondary printed circuit board further includes: a sub-touch driving chip;
in the main printed circuit board, the second differential signal line is electrically connected with the main touch control driving chip, and the fourth driving power supply signal line is electrically connected with the first power supply end; in the secondary printed circuit board, the second differential signal line is electrically connected with the secondary touch control driving chip, and the fourth driving power signal line is electrically connected with the secondary touch control driving chip.
8. The display module of claim 1, wherein the second conductive layer includes an orthographic projection of the connection lead on the substrate, covering an orthographic projection of a portion of the connection lead included in the first conductive layer on the substrate.
9. The display module of claim 1 or 8, wherein the first conductive layer comprises: the first sub-conductive layer and the second sub-conductive layer are positioned on one side of the first sub-conductive layer away from the substrate base plate;
and any adjacent connecting lead wire is respectively positioned in the first sub-conductive layer and the second sub-conductive layer in a plurality of connecting lead wires respectively electrically connected with the gate driving circuit driving signal wires, the first differential signal wires and the second differential signal wires.
10. The display module according to claim 1 or 8, wherein a plurality of the connection leads electrically connected to the second driving power signal line, the third driving power signal line, the fourth driving power signal line, and the first driving power signal line, respectively, are sequentially arranged in a direction in which the display area points to the bonding area.
11. The display module of claim 10, wherein the second conductive layer comprises: a third sub-conductive layer and a fourth sub-conductive layer positioned on a side of the third sub-conductive layer facing away from the first conductive layer;
and any adjacent connecting lead wire is respectively positioned on the third sub-conductive layer and the fourth sub-conductive layer in a plurality of connecting lead wires respectively electrically connected with the second driving power signal wire, the third driving power signal wire, the fourth driving power signal wire and the first driving power signal wire.
12. The display module according to claim 1 or 8, wherein the connection leads electrically connected to the gate driving circuit driving signal line, the first differential signal line, and the second differential signal line, respectively, are sequentially arranged in a direction in which the display region points to the bonding region.
13. The display module of claim 2, wherein each of the binding terminals comprises: the first sub-binding terminal and the second sub-binding terminal are electrically connected;
the first conductive layer further comprises the first sub-binding terminal, and the second conductive layer further comprises the second sub-binding terminal;
the connecting lead wire included in the first conductive layer is electrically connected with the first sub-binding terminal;
the second conductive layer includes the connection lead electrically connected to the second sub-bonding terminal.
14. A display device comprising the display module according to any one of claims 1 to 13.
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