CN113710057B - Airborne single-phase immersed comprehensive circulation heat management system and airborne integrated comprehensive rack - Google Patents
Airborne single-phase immersed comprehensive circulation heat management system and airborne integrated comprehensive rack Download PDFInfo
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- CN113710057B CN113710057B CN202110925860.6A CN202110925860A CN113710057B CN 113710057 B CN113710057 B CN 113710057B CN 202110925860 A CN202110925860 A CN 202110925860A CN 113710057 B CN113710057 B CN 113710057B
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- 239000007788 liquid Substances 0.000 claims abstract description 96
- 238000001816 cooling Methods 0.000 claims abstract description 45
- 239000000110 cooling liquid Substances 0.000 claims abstract description 44
- 230000017525 heat dissipation Effects 0.000 claims abstract description 41
- 238000007654 immersion Methods 0.000 claims description 16
- 239000002826 coolant Substances 0.000 claims description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 12
- 239000012809 cooling fluid Substances 0.000 claims description 11
- 238000012546 transfer Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000010963 304 stainless steel Substances 0.000 claims description 3
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 210000000664 rectum Anatomy 0.000 claims 1
- 230000007306 turnover Effects 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 24
- 238000005516 engineering process Methods 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000010354 integration Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
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- 238000012856 packing Methods 0.000 description 1
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- 238000002791 soaking Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides an airborne single-phase immersed comprehensive circulating heat management system and an airborne integrated comprehensive rack, wherein the comprehensive circulating heat management system is integrated in the airborne integrated comprehensive rack, and can ensure the heat dissipation requirement of electronic equipment adapting to a novel liquid cooling mode in an airborne liquid cooling circulating system under the condition that the overall design architecture of a traditional airborne liquid cooling circulating system and a modularized comprehensive rack is not changed. The integrated circuit thermal management system includes: a first circulation subsystem, a plate heat exchanger and a control unit, the first circulation subsystem comprising: the pump body pumps the first cooling liquid to the immersed radiating electronic module through the circulating pipeline. The control unit is used for controlling the operation of the first circulation subsystem when the first cooling liquid flows through the plate heat exchanger and exchanges heat with the second cooling liquid flowing through the plate heat exchanger.
Description
Technical Field
The invention relates to the technical field of thermal management systems, in particular to an airborne single-phase immersed comprehensive circulating thermal management system and an airborne integrated comprehensive rack.
Background
With the development of microelectronic technology, high integration, high packing density and integrated manufacturing process, the thermal load of electronic devices of an on-board task system is continuously increased, and the conventional air cooling cannot meet the heat dissipation requirement of the existing on-board electronic devices. The liquid cooling technology has the advantages of high heat dissipation efficiency, light weight, small volume, low noise, energy conservation, environmental protection and the like, and becomes the main heat dissipation technology of the airborne integrated modularized task electronic system.
In order to ensure the thermal reliability and performance of the electronic equipment of the on-board task system, the structural design technologies such as a liquid cooling chassis, a modularized liquid cooling integrated rack and the like are generally adopted. The airborne liquid cooling circulation system provides circulating flowing cooling liquid with certain temperature, flow and pressure, continuously takes out heat from a heat load, exchanges heat with external cold air through the gas-liquid heat exchanger, and returns the cooled liquid to the system for continuous reciprocating circulation.
Wherein the thermal load is connected to it by means of pipelines of different flow distribution. Liquid-cooled cold plates are one of the important components for heat collection and exchange. Because the cold plate belongs to an indirect liquid heat radiation mode, the cooling liquid is not in direct contact with the heating device, and contact thermal resistance and conduction thermal resistance exist in the middle, so that the heat exchange capacity is lower. Along with the development of an electronic task system to high comprehensive integration level, high heat flux density and miniaturization, the development of a novel efficient liquid cooling technology can change the design requirement of the existing airborne liquid cooling circulation system.
Disclosure of Invention
The invention aims to solve the technical problem of how to solve the heat dissipation problem of high-integration and high-power electronic devices in an airborne electronic task system under the condition of not changing an airborne liquid cooling circulation system.
According to an embodiment of the present invention, an on-board single-phase immersion type integrated circulation thermal management system is integrated in an on-board integrated comprehensive rack, and is configured to provide a first cooling liquid for an immersion type heat dissipation electronic module on the on-board integrated comprehensive rack, so as to cool down and cool electronic components on the immersion type heat dissipation electronic module, and the integrated circulation thermal management system includes:
A first circulation subsystem comprising: the pump body pumps the first cooling liquid to the immersed radiating electronic module through the circulating pipeline so as to cool the electronic element;
A plate heat exchanger through which the first cooling liquid exchanges heat with the second cooling liquid flowing through the plate heat exchanger;
And the control unit is used for controlling the operation of the first circulation subsystem.
According to the airborne single-phase immersed comprehensive circulation heat management system provided by the embodiment of the invention, the heat dissipation requirement of electronic equipment adapting to a novel liquid cooling mode in the airborne liquid cooling circulation system can be ensured under the condition that the overall design architecture of the traditional airborne liquid cooling circulation system and the modularized comprehensive rack is not changed.
According to some embodiments of the invention, the circulation line of the on-board single-phase submerged integrated circulation thermal management system comprises:
A vertical shunt line through which the first coolant is branched into shunts on different levels to provide the first coolant to the submerged heat dissipating electronic modules on different layers;
The vertical converging pipeline is used for converging the split first cooling liquid;
in some embodiments of the invention, the circulation line further comprises:
the horizontal liquid distributor is arranged on the bearing plate of the airborne integrated comprehensive rack and is used for distributing the first cooling liquid along the horizontal direction so as to provide the first cooling liquid for the immersed radiating electronic module;
the horizontal liquid collector is arranged on the bearing plate of the airborne integrated comprehensive frame and is used for converging the first cooling liquid which is split in the horizontal direction.
According to some embodiments of the invention, the plate heat exchanger of the on-board single-phase submerged integrated cycle thermal management system is located between the pump body and the submerged heat dissipation electronic module, and a filter is arranged between the pump body and the plate heat exchanger.
In some embodiments of the present invention, an expansion tank is disposed on the circulation pipeline, and the expansion tank is provided with an exhaust valve, and the first cooling liquid after cooling the electronic component is pumped into the pump body after passing through the expansion tank.
According to some embodiments of the invention, the circulating pipeline is provided with temperature and pressure integrated sensors at an upstream part of the immersed radiating electronic module and a downstream part of the immersed radiating electronic module.
In some embodiments of the invention, the system further comprises:
And the display unit is used for carrying out early warning prompt on the running state and the fault state of the system.
According to some embodiments of the invention, the first cooling fluid is a fluorinated fluid and the second cooling fluid is ethylene glycol.
According to the airborne integrated comprehensive rack provided by the embodiment of the invention, the airborne integrated comprehensive rack is provided with the submerged heat dissipation electronic module, the comprehensive circulation thermal management system and the second circulation subsystem, wherein the submerged heat dissipation electronic module is communicated with the comprehensive circulation thermal management system, the comprehensive circulation thermal management system is the airborne single-phase submerged comprehensive circulation thermal management system, the second circulation subsystem is provided with the cooling liquid sub-pipe, and the second cooling liquid flows through the plate heat exchanger through the cooling liquid sub-pipe.
According to some embodiments of the invention, the on-board integrated comprehensive rack is provided with two layers of comprehensive bearing racks, the two layers of comprehensive bearing racks are provided with the submerged radiating electronic module, and the comprehensive circulating thermal management system is communicated with the submerged radiating electronic module to provide the first cooling liquid for the submerged radiating electronic module.
Drawings
FIG. 1 is a schematic diagram of the structure of an on-board integrated comprehensive rack according to an embodiment of the present invention;
FIG. 2 is a schematic functional diagram of an on-board single-phase submerged integrated circuit thermal management system according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an on-board single-phase immersion integrated circulation thermal management system according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of an on-board single-phase immersion integrated circulation thermal management system according to an embodiment of the present invention;
Fig. 5 is a schematic structural diagram of an on-board single-phase immersion integrated circulation heat management system according to an embodiment of the present invention at a third view angle.
Reference numerals:
A comprehensive cyclic thermal management system 100;
A first circulation subsystem 110; a pump body 112; a circulation line 113; a vertical shunt line 1130; a vertical confluence line 1131; a horizontal knockout 1132; a horizontal liquid trap 1133; expansion tank 114; an exhaust valve 115; a temperature and pressure integrated sensor 116; a filter 117; positioning guide pins 119;
A second circulation subsystem 120; a cooling liquid separation pipe 122;
A plate heat exchanger 130;
A control unit 140;
A power supply interface 150;
An inner circulation liquid return flange end surface 161; an inner circulation liquid outlet flange end face 162; an external circulation feed connector 163; an external circulation liquid outlet connector 164; a drain connector 165;
a frequency converter 171; an electrical device 172; a handle 180; a power switch 191; a signal indicator 192;
An onboard integrated comprehensive rack 1000;
an immersed heat dissipating electronic module 200; the carrier 300 is integrally carried.
Detailed Description
In order to further describe the technical means and effects adopted by the present invention for achieving the intended purpose, the following detailed description of the present invention is given with reference to the accompanying drawings and preferred embodiments.
In the related art, an immersed liquid cooling heat dissipation device or a cabinet used by a ground data center server cannot be integrated in an on-board task electronic system modularized comprehensive rack, and cannot meet the design requirements of secondary quick maintenance, light weight, size interface standard, good adaptation with other electronic modules and the like.
The above-described solutions in the prior art are only suitable for use in ground data centers. At present, an airborne single-phase immersed comprehensive circulation heat management system for heat dissipation of an immersed electronic module is not available in China.
The immersed comprehensive circulation heat management system is suitable for the heat dissipation requirement of single-phase immersed liquid cooled electronic equipment, has good compatibility with an airborne liquid cooling circulation system, is plug and play, and can flexibly enter an electromechanical liquid interface design. The standard 6U plug box structure type is formed and installed in the modularized comprehensive rack by the design of a pump driving heat transfer unit based on fluoridized liquid and the design of a plate heat exchanger for heat exchange with an airborne liquid cooling circulation system and integrating the electric control, the heat transfer unit, the heat exchange and other functions. Meanwhile, the integrated design can be mixed with an airborne modularized comprehensive frame, and pipelines and flow distribution are designed independently.
In particular, compared to the prior art, the present invention has been developed in at least the following respects:
1. The design methods of the immersed comprehensive circulation heat management system are different.
The existing ground data center server is provided with a phase-change and non-phase-change immersed liquid cooling device or an integral soaking type cabinet, and the corresponding system principle, overall design, component selection, interfaces and the like are large in design difference with an onboard thermal management system and cannot be directly used in any technical state.
According to the heat dissipation requirement of an actual immersed electronic module, the integrated circulation heat management system design adopting the non-phase-change immersed liquid cooling technology is designed, and a plug-and-play electromechanical liquid interface compatible with an airborne liquid cooling circulation system, a modularized integrated rack and the like is designed.
2. Under the constraints of the weight, the size and the interface of the airborne, the overall design, the configuration layout and the interface form of the airborne immersed thermal management system are greatly different from those of the ground heat dissipation device.
Under the condition of limited weight and size of the machine, the machine-mounted submerged heat management system integrates the heat transfer, heat exchange, electric control modules and other functional modules into a whole, is installed in the modularized comprehensive rack in a standard-size plug box structural mode, is compatible with other standard electronic module bearing areas, does not influence the heat dissipation function, and is connected with the machine-mounted liquid cooling circulation system to conduct heat exchange. The heat distribution and exchange units should be designed integrally and installed in a standard comprehensive rack instead of being designed and installed separately. The structural design should meet the integrated rack interface size standard.
3. The airborne liquid cooling circulation system is different from the ground outdoor refrigeration device.
The outdoor refrigeration unit of the heat dissipation cabinet of the ground data center server is generally a cooling water tower, a water chiller and an external air-cooled heat exchange device which take cooling water as working media, and the characteristic difference between the working media in the refrigeration unit and the characteristic difference of the cooling liquid of an airborne liquid cooling circulation system is large, so that the design of selection, materials, layout, structure and the like of the plate type liquid-liquid heat exchanger in the heat management system are influenced.
As shown in fig. 1, according to the on-board single-phase immersion type integrated circulation thermal management system 100 of the embodiment of the present invention, the integrated circulation thermal management system 100 is integrated in the on-board integrated comprehensive rack 1000, and is configured to provide a first cooling liquid for the immersion type heat dissipation electronic module 200 on the on-board integrated comprehensive rack 1000, so as to cool down and cool down the electronic components 201 on the immersion type heat dissipation electronic module 200.
As shown in connection with fig. 2, the integrated circuit thermal management system 100 includes: a first circulation subsystem 110, a plate heat exchanger 130 and a control unit 140.
Wherein, the first circulation subsystem 110 is a totally-enclosed internal circulation heat dissipation system based on safe liquid, and the first circulation subsystem 110 comprises: the pump body 112 and the circulation pipeline 113, the pump body 112 pumps the first cooling liquid to the submerged heat dissipation electronic module 200 through the circulation pipeline 113 so as to cool down the electronic components.
The first cooling fluid of the first circulation subsystem 110 exchanges heat with the second cooling fluid flowing through the plate heat exchanger when flowing through the plate heat exchanger, and reduces the temperature of the first cooling fluid.
The control unit 140 is used to control the operation of the first circulation subsystem 110.
According to some embodiments of the invention, as shown in fig. 2, the circulation line 113 includes: a vertical split line 1130 and a vertical merge line 1131. The coolant is branched into branches at different levels via vertical branch lines 1130 to provide a first coolant to the submerged radiator electronic modules 200 at different levels, and vertical converging lines 1131 are used to converge the branched coolant.
In some embodiments of the present invention, as shown in fig. 2, the circulation line 113 includes: a horizontal separator 1132 and a horizontal liquid trap 1133. The horizontal liquid separator 1132 and the horizontal liquid collector 1133 are arranged on a bearing plate of the airborne integrated comprehensive frame 1000, and the horizontal liquid separator 1132 is used for separating the cooling liquid along the horizontal direction so as to provide the first cooling liquid for the immersed radiating electronic module 200; the horizontal liquid collector 1133, the horizontal liquid collector 1133 is used for converging the coolant which is split in the horizontal direction.
The liquid pipeline, the vertical diversion pipeline 1130, the vertical confluence pipeline 1131, the horizontal liquid separator 1132 and the horizontal liquid collector 1133 of the circulation pipeline 113 in the embodiment of the invention communicate the heat transfer unit driven by the pump with the two-layer immersed electronic module bearing frame, so as to realize the heat dissipation of the liquid circulation flow.
According to some embodiments of the present invention, as shown in fig. 2, the plate heat exchanger 130 is located between the pump body 112 and the submerged heat dissipating electronic module 200, and a filter 117 is provided between the pump body 112 and the plate heat exchanger 130.
It should be noted that, by disposing the plate heat exchanger 130 between the pump body 112 and the submerged heat dissipation electronic module 200, the first cooling liquid may enter the plate heat exchanger 130 first, instead of directly entering the submerged heat dissipation electronic module 200, so that the inlet pressure of the submerged heat dissipation electronic module 200 in the system may be ensured to be stable, and the inlet pressure is reduced to be within a safe range after passing through the plate heat exchanger 130, so that adverse effects on the module may not be caused, and the system may work more safely and reliably.
By providing a filter between the pump body 112 and the plate heat exchanger 130, the cooling liquid flowing out of the pump body 112 can be filtered, avoiding impurities from entering the plate heat exchanger 130 and the submerged radiator electronic module 200.
According to some embodiments of the present invention, as shown in fig. 2, an expansion tank 114 is disposed on the circulation line 113, and an exhaust valve 115 is disposed on the expansion tank 114, so that the cooling liquid after cooling the electronic component is pumped into the pump body 112 after passing through the expansion tank 114. It should be noted that, the exhaust valve 115 can maintain a constant pressure for the system and can absorb the volume change of the cooling medium in the system, so as to ensure the normal operation of the whole system.
In some embodiments of the present invention, as shown in fig. 1 and 2, the circulating line 113 is provided with a temperature and pressure integrated sensor 116 at an upstream portion of the submerged heat dissipation electronic module 200 and at a downstream portion of the submerged heat dissipation electronic module 200.
By providing the temperature and pressure integrated sensor 116, the temperature and pressure of the coolant flowing into and out of the submerged heat dissipation electronic module 200 can be detected in real time, so as to control the flow rate of the coolant correspondingly. The monitoring, control operation, protection and display of the state parameters of the circulation pipeline 113 are realized by the pump body 112, the frequency converter 171, the temperature and pressure integrated sensor 116 and other devices on the circulation pipeline 113 through the control unit 140.
In some embodiments of the invention, the system further comprises: and the display unit is used for carrying out early warning prompt on the running state and the fault state of the system.
According to some embodiments of the invention, the first cooling fluid is a fluorinated fluid and the second cooling fluid is ethylene glycol.
As shown in fig. 1, the integrated rack 300 is provided with an immersion heat dissipating electronic module 200, an integrated circulation thermal management system 100, and a second circulation subsystem 120 according to an embodiment of the present invention. The submerged heat dissipating electronic module 200 is in communication with the integrated circuit thermal management system 100, where the integrated circuit thermal management system 100 is the onboard single-phase submerged integrated circuit thermal management system 100 described above, and the second circulation subsystem 120 has a cooling fluid manifold 122, and the second cooling fluid flows through the plate heat exchanger 130 via the cooling fluid manifold 122.
In some embodiments of the present invention, as shown in fig. 1, the on-board integrated composite rack 1000 has two layers of composite carrying racks 300, and the two layers of composite carrying racks 300 are each provided with an immersed heat-dissipating electronic module 200, and the integrated circulation thermal management system 100 communicates with the immersed heat-dissipating electronic module 200 to provide the first cooling liquid for the immersed heat-dissipating electronic module 200.
The on-board single-phase immersion type integrated circulation heat management system 100 and the on-board integrated circuit rack 1000 according to the present invention are described in detail with reference to the accompanying drawings. It is to be understood that the following description is exemplary only and is not to be taken as limiting the invention in any way.
According to the invention, under the condition that the overall design framework of the airborne liquid cooling circulation system and the modularized comprehensive rack is not changed, the designed submerged circulation thermal management system is designed into a standard 6U-size plug box structure type and interface, and is integrated with a 19in standard cabinet. The novel immersed electronic heat dissipation module is arranged in a two-layer comprehensive bearing rack area at the bottom of the cabinet, and can be mixed with the existing airborne standard electronic module to be integrated and designed, and the design is shown in fig. 1. The submerged integrated circuit thermal management system 100 can ensure that two layers of integrated circuits carry the normal operating temperature requirements of the novel liquid cooling technology electronics module.
Referring to fig. 2, the submerged integrated circulation thermal management system 100 of the present invention is mainly divided into two circulation subsystems, so as to ensure that the heat dissipation requirement of the electronic device adapting to the novel liquid cooling mode in the airborne liquid cooling circulation system is ensured. One is a totally enclosed internal circulation heat dissipation system based on a safe liquid fluorinated liquid, namely the first circulation subsystem 110 described above. The system communicates a heat transfer unit driven by a pump with a bearing frame of the two-layer submerged heat dissipation electronic module 200 through a liquid pipeline, a vertical diversion pipeline 1130, a vertical confluence pipeline 1131, a horizontal liquid separator 1132 and a horizontal liquid collector 1133, so as to realize the heat dissipation of liquid circulation flow. One type of external circulation liquid cooling system, namely the second circulation subsystem 120, is described above, and the heat of the fluorinated liquid in the internal circulation system exchanges heat with the aviation cooling liquid in the external airborne liquid cooling circulation system through the plate heat exchanger 130, so as to reduce the temperature of the cooling liquid in the internal circulation system.
The submerged integrated thermal management system 100 of the present invention adopts a multifunctional integrated design concept, integrates functions of a heat transfer unit, a heat exchange unit, an electrical control display unit, etc. in the system, and is miniaturized and modularized integrated in the liquid cooling integrated rack 300.
The integrated thermal management system 100 is of a standard 6U plug-in box construction type with the overall dimensions 479mm by 265mm by 482.6mm, without the liquid connector fittings, handles 180. The weight was 40KG. The rated cooling capacity is 8KW, the rated liquid supply flow of the internal circulation system is 50L/min, and the liquid supply pressure is not more than 0.2Mpa. The rated flow of the external circulation is 30L/min, and the total power is less than 0.5KW.
As shown in fig. 3-5, the submerged integrated cycle thermal management system 100 mainly comprises a pump body 112, where the pump body 112 may be a main cycle shielding pump, an expansion tank 114, a filter 117, a liquid-liquid plate heat exchanger 130, a temperature-pressure integrated sensor 116, an electric controller, a frequency converter 171, a pipeline, an exhaust valve 115, a power supply interface 150, an external cycle liquid inlet connector 163, an external cycle liquid outlet connector 164, a liquid adding and discharging connector 165, an internal cycle liquid return flange end surface 161, an internal cycle liquid outlet flange end surface 162, a handle 180, a power switch 191, a signal indicator 192, a control display touch screen, a positioning guide pin 119, and the like, and the overall layout design is as shown in fig. 3.
The main circulation shielding pump of the immersion type comprehensive circulation heat management system 100 provides fluoride liquid with certain pressure, temperature and flow rate, the fluoride liquid is sequentially supplied to the immersion type heat dissipation electronic module 200 in the two layers of comprehensive bearing racks through the main filter 117 and the internal circulation liquid outlet connector, the temperature of the fluoride liquid rises after absorbing heat, the fluoride liquid flows through the liquid-liquid plate type heat exchanger 130 through the internal circulation liquid return connector, heat exchange is carried out with glycol cooling liquid in an external airborne liquid cooling circulation system, the temperature of the fluoride liquid is reduced, and the cooled fluoride liquid returns to the system expansion water tank 114 again for pump reciprocating circulation.
The expansion tank 114 pressure stabilizing system is provided with an automatic exhaust valve 115, so that the system is kept constant pressure and can absorb the volume change of cooling medium in the system, and the normal operation of the whole system is ensured. The monitoring, control operation, protection and display of the state parameters of the internal circulation system are realized by the devices such as the main circulation pump 112, the frequency converter 171, the temperature and pressure integrated sensor 116 and the like through the integrated device of the industrial personal computer and the touch screen. The electrical device 172 includes a power module, a circuit breaker, a connection terminal, etc., and completes the power supply of the system, and is reliably grounded, so as to ensure the stability and safety of the operation of the equipment. The frequency converter 171 can regulate the rotation speed and flow rate of the main circulation pump, and together with the electric device 172, the functions of short circuit, overcurrent, overvoltage, phase loss protection and the like of the pump are completed. The industrial personal computer PLC realizes control of the main circulating pump, temperature and pressure monitoring of the circulating system and analog quantity signals acquired by the sensor and displays the analog quantity signals on the touch screen of the control panel. And early warning and prompting the running state and various fault states of the system. Including the main circulation pump, the high temperature of the liquid supply, the high and low pressure of the liquid supply, and the corresponding temperature and pressure integrated sensor 116. The control panel is provided with a power switch 191 and three signal indicator lamps 192, namely an operation display lamp, an early warning display lamp and an alarm display lamp.
Through system resistance accounting, the flow rate of the main circulating pump is 3m 3/h (50L/min), the lift is 10.5m, the power is 0.4kw, and the rotating speed is 2820rpm. The heat dissipation capacity of the liquid-liquid plate heat exchanger is 8kW, aviation No. 65 glycol cooling liquid and fluoridized liquid are adopted for cooling, the plate material is 304 stainless steel, and the design allowance of plate exchange design is 2%. The heat exchange area is 1.49m 2, and the path of the inlet and outlet interfaces is 38.1mm. The inner diameter of the inner circulation main pipeline 113 of the inner circulation immersed cooling system is 35mm and 304 stainless steel material.
The electromechanical liquid interface of the whole system adopts standard interface design and is well compatible with the existing integrated rack 300 and the airborne liquid cooling system interface. The internal circulation system and the comprehensive bearing frames on the two sides can be sealed by an end face flange, and can also be designed by a pipe thread or a self-sealing joint. The interface of the external circulation loop and the airborne liquid cooling system adopts a self-sealing liquid connector, and the liquid adding and discharging port is a self-sealing liquid connector. The electrical interface may accommodate on-board power characteristics, unifying rear-end outgoing lines with the integrated chassis 300.
In summary, the present invention integrates a comprehensive circulation thermal management system 100 adapted to a novel submerged electronic module in an airborne liquid cooling circulation system and a modularized comprehensive rack 300 for the first time, and integrates the comprehensive circulation thermal management system in the airborne modularized comprehensive rack 300 in a standard plug-in box type size structure, and is mixed with other electronic modules for integration and good compatibility. The technical problems of the functional principles of circulation heat transfer, heat exchange, electrical control and the like of the immersed comprehensive circulation heat management system 100, system design, comprehensive integration and integration integrated overall layout, plug-and-play, flexible access of standard electromechanical liquid interfaces and the like are solved.
While the invention has been described in connection with specific embodiments thereof, it is to be understood that these drawings are included in the spirit and scope of the invention, it is not to be limited thereto.
Claims (9)
1. The utility model provides a comprehensive circulation thermal management system of single-phase immersion type on-vehicle, its characterized in that, comprehensive circulation thermal management system integrates in the integrated comprehensive frame of on-vehicle for the immersion type heat dissipation electronic module on the integrated comprehensive frame of on-vehicle provides first coolant liquid, in order to cool down electronic component on the immersion type heat dissipation electronic module, comprehensive circulation thermal management system is standard 6U subrack structural style, and overall dimension is 479mm x 265mm x 482.6mm, and weight is 40KG, and rated cooling capacity is 8KW, and the rated feed flow of inner loop system is 50L/min, and feed pressure is not more than 0.2Mpa, and the rated feed flow of outer loop is 30L/min, and total power is less than 0.5KW, comprehensive circulation thermal management system includes:
A first circulation subsystem, the first circulation subsystem comprising: the electronic component cooling device comprises a pump body and a circulating pipeline, wherein an expansion water tank is arranged on the circulating pipeline, and the pump body pumps first cooling liquid to an immersed radiating electronic module through the circulating pipeline so as to cool the electronic component;
The plate heat exchanger is used for exchanging heat with the second cooling liquid flowing through the plate heat exchanger when the first cooling liquid flows through the plate heat exchanger;
A control unit for controlling the operation of the first circulation subsystem;
The plate heat exchanger is positioned between the pump body and the immersed radiating electronic module, and the first cooling liquid flows out of the pump body and enters the plate heat exchanger first and then enters the immersed radiating electronic module;
The pump body, the plate heat exchanger and the expansion water tank are integrated in a standard 6U plug-in box structural type comprehensive circulation heat management system;
Through system resistance accounting, pump body flow is 3m 3/h, and the lift is 10.5m, and power is 0.4kW, and the rotational speed is 2820rpm, plate heat exchanger heat dissipation capacity is 8kW, adopts aviation No. 65 glycol coolant and fluoridized liquid cooling, and the sheet material is 304 stainless steel, and heat transfer area is 1.49m 2, and business turn over interface latus rectum is 38.1mm.
2. The on-board single-phase submerged integrated cycle thermal management system of claim 1, wherein the circulation line comprises:
A vertical shunt line through which the first coolant is branched into shunts on different levels to provide the first coolant to the submerged heat dissipating electronic modules on different layers;
and the vertical converging pipeline is used for converging the split first cooling liquid.
3. The on-board single-phase submerged integrated cycle thermal management system of claim 2, wherein the cycle line further comprises:
the horizontal liquid distributor is arranged on the bearing plate of the airborne integrated comprehensive rack and is used for distributing the first cooling liquid along the horizontal direction so as to provide the first cooling liquid for the immersed radiating electronic module;
the horizontal liquid collector is arranged on the bearing plate of the airborne integrated comprehensive frame and is used for converging the first cooling liquid which is split in the horizontal direction.
4. The on-board single-phase submerged integrated cycle thermal management system of claim 1, wherein a filter is disposed between the pump body and the plate heat exchanger.
5. The on-board single-phase immersed integrated cycle thermal management system according to claim 1, wherein the expansion tank is provided with an exhaust valve, and the first cooling liquid after cooling the electronic component is pumped into the pump body after passing through the expansion tank.
6. The on-board single-phase submerged integrated circulation thermal management system of claim 1, wherein the circulation pipeline is provided with temperature and pressure integrated sensors at an upstream portion of the submerged cooling electronic module and a downstream portion of the submerged cooling electronic module.
7. The on-board single-phase submerged integrated cycle thermal management system of claim 1, further comprising:
And the display unit is used for carrying out early warning prompt on the running state and the fault state of the system.
8. An integrated machine frame on board, characterized in that the integrated machine frame is provided with an immersed heat dissipation electronic module, an integrated circulation heat management system and a second circulation subsystem, wherein the immersed heat dissipation electronic module is communicated with the integrated circulation heat management system, the integrated circulation heat management system is the integrated circulation heat management system on board according to any one of claims 1-7, the second circulation subsystem is provided with a cooling liquid sub-pipe, and the second cooling liquid flows through the plate heat exchanger through the cooling liquid sub-pipe.
9. The integrated on-board integrated chassis of claim 8, wherein the integrated on-board chassis has two layers of integrated carrier racks, both layers of integrated carrier racks being provided with the submerged heat dissipating electronic module, the integrated circulation thermal management system being in communication with the submerged heat dissipating electronic module to provide the first cooling fluid to the submerged heat dissipating electronic module.
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| CN114828570A (en) * | 2022-04-22 | 2022-07-29 | 中国电子科技集团公司第二十九研究所 | Small-size covering heat exchanger and heat exchange system |
| CN116321934B (en) * | 2022-12-30 | 2023-12-22 | 比赫电气（太仓）有限公司 | 5U rack-type immersion liquid cooling system |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6217835B1 (en) * | 2016-09-16 | 2017-10-25 | 富士通株式会社 | Immersion cooling device |
| CN108089682A (en) * | 2018-01-08 | 2018-05-29 | 北京荷云达世科技有限公司 | A kind of efficiently integrated cloud computer cooling system |
| CN207637906U (en) * | 2017-12-28 | 2018-07-20 | 杭州银轮科技有限公司 | A kind of fuel cell heat management system of the non-mixed circulation waterway containing two-stage |
| CN108882658A (en) * | 2018-09-07 | 2018-11-23 | 中南大学 | The server cabinet cooling system that immersion liquid cooling and circulating air cooling combine |
| CN111077957A (en) * | 2019-11-14 | 2020-04-28 | 苏州浪潮智能科技有限公司 | Multi-way server cooling system |
| CN111465274A (en) * | 2020-04-21 | 2020-07-28 | 广州智冷节能科技有限公司 | Single-cabinet modular server liquid cooling system and control method thereof |
| CN211831631U (en) * | 2020-03-24 | 2020-10-30 | 深圳小牛冷却技术有限公司 | Small-size integrated liquid cooling heat dissipation case |
| CN211982397U (en) * | 2020-05-15 | 2020-11-20 | 苏州浪潮智能科技有限公司 | Liquid cooling device combining immersion type active condensation and passive condensation |
| CN212034610U (en) * | 2020-03-24 | 2020-11-27 | 深圳小牛冷却技术有限公司 | Liquid cooling heat dissipation cabinet for virtual digital currency mining machine |
| CN112886093A (en) * | 2021-01-14 | 2021-06-01 | 哈尔滨工程大学 | Active control type full-immersion liquid cooling power battery thermal management system |
-
2021
- 2021-08-12 CN CN202110925860.6A patent/CN113710057B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6217835B1 (en) * | 2016-09-16 | 2017-10-25 | 富士通株式会社 | Immersion cooling device |
| CN207637906U (en) * | 2017-12-28 | 2018-07-20 | 杭州银轮科技有限公司 | A kind of fuel cell heat management system of the non-mixed circulation waterway containing two-stage |
| CN108089682A (en) * | 2018-01-08 | 2018-05-29 | 北京荷云达世科技有限公司 | A kind of efficiently integrated cloud computer cooling system |
| CN108882658A (en) * | 2018-09-07 | 2018-11-23 | 中南大学 | The server cabinet cooling system that immersion liquid cooling and circulating air cooling combine |
| CN111077957A (en) * | 2019-11-14 | 2020-04-28 | 苏州浪潮智能科技有限公司 | Multi-way server cooling system |
| CN211831631U (en) * | 2020-03-24 | 2020-10-30 | 深圳小牛冷却技术有限公司 | Small-size integrated liquid cooling heat dissipation case |
| CN212034610U (en) * | 2020-03-24 | 2020-11-27 | 深圳小牛冷却技术有限公司 | Liquid cooling heat dissipation cabinet for virtual digital currency mining machine |
| CN111465274A (en) * | 2020-04-21 | 2020-07-28 | 广州智冷节能科技有限公司 | Single-cabinet modular server liquid cooling system and control method thereof |
| CN211982397U (en) * | 2020-05-15 | 2020-11-20 | 苏州浪潮智能科技有限公司 | Liquid cooling device combining immersion type active condensation and passive condensation |
| CN112886093A (en) * | 2021-01-14 | 2021-06-01 | 哈尔滨工程大学 | Active control type full-immersion liquid cooling power battery thermal management system |
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|---|---|
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