CN113707043A - Spliced display panel and display device - Google Patents
Spliced display panel and display device Download PDFInfo
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- CN113707043A CN113707043A CN202010443853.8A CN202010443853A CN113707043A CN 113707043 A CN113707043 A CN 113707043A CN 202010443853 A CN202010443853 A CN 202010443853A CN 113707043 A CN113707043 A CN 113707043A
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Classifications
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- G—PHYSICS
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- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
- G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
The invention provides a spliced display panel and a display device. The display panel and the display device comprise: the display panel comprises at least two sub-display panels which are spliced with each other, wherein each sub-display panel comprises a bearing substrate, the bearing substrate is provided with a first surface, a second surface and a side surface, the first surface is opposite to the second surface, and the side surface is connected with the first surface and the second surface; the display unit and the first splicing unit are arranged on the first surface, the second splicing unit is arranged on the side surface, and the first splicing unit is connected with the second splicing unit; the sub-display panels are connected with each other through the second splicing units, and the display units are arranged on two sides of the splicing units; the first splicing unit is provided with a light absorption layer. According to the spliced display panel and the display device, the light absorption layer is arranged on the first splicing unit, so that the phenomenon that the display effect is influenced by refraction and the like at the splicing part is prevented, the display effect of the display panel is improved, and the use experience of a user is effectively improved.
Description
Technical Field
The invention relates to the technical field of displays, in particular to a splicing type display panel and a display device.
Background
Miniature LED displays, such as: MICRO-LED display, MINI-LED display, have good stability, life-span, and operating temperature's advantage, also inherited LED low-power consumption, color saturation, reaction rate are fast, contrast advantage such as strong simultaneously, have very big application prospect.
The existing display panel is formed by splicing a plurality of sub-display panels, and along with the continuous reduction of the sizes of the micron-sized LED chips, the requirements on the spacing between the micron-sized LED chips and the splicing gap of the sub-display panels are more and more strict, otherwise, the defect of poor visual effect of an application end product is caused. In the display panel in the prior art, the phenomenon of uneven emergent light caused by light refraction and even total reflection easily occurs at the splicing part of two adjacent sub-display panels; the display effect of the display is greatly influenced, and the use experience of a user is further influenced.
Disclosure of Invention
Accordingly, there is a need for a tiled display panel and a display device having better uniformity of emitted light.
In order to solve the technical problems, the technical scheme of the invention is as follows:
in one aspect, the present invention provides a tiled display panel, including at least two sub-display panels tiled with each other, each sub-display panel including a carrier substrate, the carrier substrate having a first surface, a second surface and a side surface, the first surface being opposite to the second surface, and the side surface being connected to the first surface and the second surface;
the display unit and the first splicing unit are arranged on the first surface, the second splicing unit is arranged on the side surface, and the first splicing unit is connected with the second splicing unit;
the sub-display panels are connected with each other through the second splicing units, and the display units are arranged on two sides of the splicing units;
the first splicing unit is provided with a light absorption layer.
The display unit comprises a driving array arranged on the first surface and a light-emitting element connected with the driving array.
The light-emitting element comprises a first light-emitting element arranged adjacent to the first splicing unit and a second light-emitting element far away from the first splicing unit.
The light-emitting element is a flip-chip LED chip, and a reflecting layer is arranged between a first electrode and a second electrode of the flip-chip LED chip.
The first light-emitting element is a flip-chip LED chip, and a reflecting layer is arranged between a first electrode and a second electrode of the flip-chip LED chip.
The bearing substrate comprises a plurality of via holes penetrating through the bearing substrate, auxiliary wires are arranged inside the via holes, and the driving array is electrically connected with the circuit control unit arranged on the second surface through the auxiliary wires.
Wherein, be provided with the layer of inhaling light on the second concatenation unit.
Wherein, the light absorption layer includes at least one of the following: epoxy resin, silicone resin.
In another aspect, the invention provides a display device comprising a tiled display panel as described above.
The display panel further comprises a protective layer arranged on the light emergent side of the spliced display panel.
According to the spliced display panel and the display device, the light absorption layer is arranged on the first splicing unit, so that the phenomenon that the display effect is influenced by refraction and the like at the splicing part is prevented, the display effect of the display panel is improved, and the use experience of a user is effectively improved.
Drawings
The above features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing in detail exemplary embodiments thereof with reference to the attached drawings, in which:
fig. 1 is a schematic view of an angle structure of a display panel according to an embodiment of the invention;
FIG. 2 is a schematic view of another angle structure of a display panel according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of an angle according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of another angle according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a state of the technical solution according to an embodiment of the present invention;
FIG. 7 is a schematic structural diagram of another embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a flip-chip LED chip according to the present invention;
fig. 9 is a schematic structural diagram of a technical solution according to an embodiment of the present invention.
Wherein the reference numerals are: 1. an LED chip; 11 a first light emitting element; 12. a second light emitting element; 2. a light absorbing layer; 3. splicing gaps; 4. a first sub display panel; 5. a second sub-display panel; 6. a third sub-display panel; 7. a fourth sub-display panel; 8. a reflective metal layer; 9. a first electrode; 10. a second electrode; 11. a display panel.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
In order that the present disclosure may be more clearly and accurately understood, reference will now be made in detail to the accompanying drawings. The drawings illustrate examples of embodiments of the invention, in which like numerals represent like elements. It is to be understood that the drawings are not to scale as the invention may be practiced in practice, but are for illustrative purposes and are not to scale.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1 to 9, a tiled display panel 11 includes at least two sub-display panels 11 tiled with each other, each sub-display panel 11 includes a carrier substrate having a first surface, a second surface and a side surface, the first surface is opposite to the second surface, and the side surface is connected to the first surface and the second surface;
the display unit and the first splicing unit are arranged on the first surface, the second splicing unit is arranged on the side surface, and the first splicing unit is connected with the second splicing unit;
the sub-display panels 11 are connected with each other through the second splicing units, and the display units are arranged on two sides of the splicing units;
the first splicing unit is provided with a light absorption layer 2.
According to the spliced display panel 11 and the display device, the light absorption layer 2 is arranged on the first splicing unit, so that the phenomenon that the display effect is influenced by refraction and the like at the splicing part is prevented, the display effect of the display panel 11 is improved, and the use experience of a user is effectively improved.
The display unit comprises a driving array arranged on the first surface and a light-emitting element connected with the driving array.
Referring to fig. 3, the light emitting device includes a first light emitting device 11 disposed adjacent to the first splicing unit, and a second light emitting device 12 disposed far away from the first splicing unit.
The light emitting element is a flip-chip LED chip 1, and a reflective layer is disposed between a first electrode and a second electrode of the flip-chip LED chip 1, that is, all the LED chips 1 have a reflective layer. The light of every LED chip 1 transmission department is gone out through the even reflection stratum on it, prevents that phenomenon such as concatenation department from producing influences display effect such as refraction from appearing, and it has promoted display panel's display effect, promotes user's use effectively and experiences.
The first light emitting element is a flip-chip LED chip 1, and a reflective layer is disposed between a first electrode and a second electrode of the flip-chip LED chip 1. I.e. the LED chip 1 near the splice has a reflective layer. The light of 1 transmission departments of LED chip is gone out through the even reflection stratum of concatenation department, prevents that the phenomenon that concatenation department produced influences display effect such as refraction from appearing, and it has promoted display panel's display effect.
The bearing substrate comprises a plurality of via holes penetrating through the bearing substrate, auxiliary wires are arranged inside the via holes, and the driving array is electrically connected with the circuit control unit arranged on the second surface through the auxiliary wires. Due to the arrangement of the via holes, auxiliary wiring is not needed to be conducted on the side edge, and the distance between the side edge and the light-emitting element at the edge is reduced.
Referring to fig. 5, in some embodiments, a light absorbing layer 2 is disposed on the second splicing unit.
Wherein, the light absorbing layer 2 comprises epoxy resin, silicon resin or a mixture material of the epoxy resin and the silicon resin. The light absorbing layer 2 may be coated at the splicing unit.
Specifically, referring to fig. 1-9, in some embodiments, the present invention provides a tiled display panel 11, including at least two sub-display panels tiled with each other, each sub-display panel including a carrier substrate having a first surface, a second surface and a side surface, the first surface being opposite to the second surface, and the side surface being connected to the first surface and the second surface; the first surface is provided with a display unit and a first splicing unit, the side surface is provided with a second splicing unit, the first splicing unit is connected with the second splicing unit, and the display unit comprises a plurality of light-emitting elements; the first splicing unit is provided with a light absorption layer.
Specifically, the display panel 11 includes: the LED display panel comprises at least two sub display panels, an LED chip 1 and a light absorption layer 2, wherein optionally, the LED chip 1 is a micron-sized LED chip; each sub-display panel is provided with a drive array, each drive array is provided with a plurality of LED chips 1, the LED chips are spliced into a complete display panel 11 through a plurality of sub-display panels, and the upper side, the lower side, the left side and the right side of each sub-display panel can be spliced with the other sub-display panel; and the splicing part between two adjacent sub-display panels is provided with a splicing gap 3, and the light absorption layer 2 is arranged at the top of each sub-display panel and in the splicing gap 3.
Above-mentioned display panel sets up light-absorbing layer 2 in the concatenation department of display, prevents that the phenomenon that concatenation department produced influences display effect such as refraction from appearing. The technical scheme of the invention solves the optical problem in reality, and the connection of wiring is required in the splicing process of the display panel in practical use. The routing requirements are as follows: the routing is simplified, the routing is as short as possible, the turning is reduced as much as possible, and the line is simple and clear; the turning part of the routing is a round angle or an oblique angle, and wires on two sides of the double-sided board are perpendicular, oblique or bent to route, so that parallel routing is avoided as much as possible, and parasitic coupling is reduced.
Referring specifically to fig. 5, the light absorbing layer 2 locations include: the light absorbing layer 2 may be made of epoxy resin, silicone resin, or a mixture thereof at the edge adjacent to the first light emitting element of each sub display panel, i.e., the first splicing unit, and the side surface for splicing between the first sub display panel 4 and the second sub display panel 5, i.e., the second splicing unit.
Optionally, the light absorbing layer 2 includes: epoxy resin, silicon resin or the mixture of the epoxy resin and the silicon resin. So that the light-absorbing material has better light-absorbing effect and can prevent reflection, refraction and the like.
In some embodiments, the present invention provides a tiled display panel, comprising: the LED display panel comprises a sub display panel, an LED chip 1 and a light absorption layer 2, wherein optionally, the LED chip 1 is a micron-sized LED chip; each sub-display panel is provided with a plurality of LED chips 1, the LED chips are spliced into a complete display panel 11 by a plurality of sub-display panels, and the upper side, the lower side, the left side and the right side of each sub-display panel can be spliced with the other sub-display panel; and a splicing gap 3 is arranged at the splicing position between two adjacent sub-display panels, and the light absorption layer 2 is arranged at the top of each sub-display panel and in the splicing gap 3.
Above-mentioned display panel sets up light-absorbing layer 2 in the concatenation department of display, prevents that the phenomenon that concatenation department produced influences display effect such as refraction from appearing.
Referring to fig. 3 to 4, the light absorbing layer 2 is only located at the edge adjacent to the first light emitting element of each sub display panel, i.e. the first splicing unit, such as the first sub display panel 4, the second sub display panel 5, the third sub display panel 6, and the fourth sub display panel 7, and the light absorbing layer 2 may be made of epoxy resin, silicone resin, or a mixture thereof.
The present invention provides a display panel including: the LED display panel comprises a sub display panel, an LED chip 1 and a light absorption layer 2, wherein optionally, the LED chip 1 is a micron-sized LED chip; each sub-display panel is provided with a plurality of LED chips 1, the LED chips are spliced into a complete display panel 11 through a plurality of sub-display panels, and each side surface of each sub-display panel can be spliced with the other sub-display panel; and the concatenation department of side between two adjacent sub-display panel includes non-right angle inclined plane concatenation clearance 3, and light-absorbing layer 2 sets up in the edge adjacent with each sub-display panel's first light-emitting component promptly first concatenation unit and each sub-display panel is used for the side of concatenation promptly in concatenation clearance 3, and concatenation clearance 3 is the second concatenation unit, and what can understand has the contained angle between non-right angle inclined plane concatenation clearance 3 and the sub-display panel.
Above-mentioned display panel sets up light-absorbing layer 2 in the concatenation department of display, prevents that the phenomenon that concatenation department produced influences display effect such as refraction from appearing.
Referring to fig. 6-7, the light absorbing layer 2 is positioned to be included at the top of each sub display panel, i.e., at the edge adjacent to the first light emitting element of each sub display panel, and within the splicing gap 3, and the light absorbing layer 2 may be made of epoxy, silicone, or a mixture thereof. Wherein an inclined plane or a reflective plane is disposed between the first sub-display panel 4 and the second sub-display panel 5.
Referring to fig. 3 to 9, the present invention provides a display panel including: the LED display panel comprises a sub display panel, an LED chip 1 and a light absorption layer 2, wherein optionally, the LED chip 1 is a micron-sized LED chip; each sub-display panel is provided with a plurality of LED chips 1, the LED chips are spliced into a complete display panel 11 by a plurality of sub-display panels, and the upper side, the lower side, the left side and the right side of each sub-display panel can be spliced with the other sub-display panel; and the splicing part between two adjacent sub-display panels is provided with a splicing gap 3, and the light absorption layer 2 is arranged at the top of each sub-display panel and in the splicing gap 3.
Above-mentioned display panel sets up light-absorbing layer 2 in the concatenation department of display, prevents that the phenomenon that concatenation department produced influences display effect such as refraction from appearing.
Referring to fig. 9, in some embodiments, the LED chip 1 includes: a first semiconductor layer, a first electrode 9, a light emitting layer, a second semiconductor layer, and a second electrode 10; one end of the lower part of the second semiconductor layer is connected with a second electrode 10, and the other end of the lower part of the second semiconductor layer is sequentially connected with a light-emitting layer, a first semiconductor layer and a first electrode 9; the first electrode 9 and the second electrode 10 are disposed on the display panel 11, and the reflective metal layer 8 is disposed between the first electrode 9 and the second electrode 10 and is not connected to the first electrode 9 and the second electrode 10.
Optionally, the LED chip 1 is flip-chip on the display panel 11, a connection gap is formed between the LED chip 1 and the connection portion of the display panel 11, a reflective metal layer 8 is disposed at the connection gap on the display panel 11, and the reflective metal layer 8 is in an island shape and is not connected to the peripheral LED chip 1. The light emitted by the LED chip 1 is uniformly reflected by the reflective metal layer 8.
The first electrode 9 of the LED chip 1 is connected with a first connecting point of the substrate, the second electrode 10 is connected with a second connecting point of the substrate, and a reflecting layer is arranged between the first connecting point and the second connecting point; the projection of the light emitting layer of the LED chip 1 on the substrate overlaps with the reflective layer. The reflective layer may be made of metal or non-metal, and may be formed with the first connection point and the second connection point in the same process when made of metal, and the reflective layer is made of metal to prevent the first electrode 9 and the second electrode 10 from being short-circuited.
In the case where the LED chip 1 is a flip-chip type LED. The micro-LED display of the present invention generally uses a flip-chip type LED chip 1, as shown in fig. 8.
Wherein, the first semiconductor layer can be an N/P type doped gallium nitride (GaN) layer, and the light emitting layer can be a quantum well layer; the second semiconductor layer may be a P/N type doped gallium nitride (GaN) layer; the first electrode 9 and the second electrode 10 are made of a conductive material such as metal. When an electric signal is applied to the first electrode 9 and the second electrode 10, electrons in the N-type semiconductor and holes in the P-type semiconductor collide and recombine vigorously in the light emitting layer to generate photons, and energy is emitted as photons.
The materials of the first electrode 9 and the second electrode 10 may include: aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (mo), titanium (Ti), tungsten (W), copper (Cu), or the like.
Referring to fig. 9, in the solution of the present invention, the light absorbing layer 2 is disposed on the top of the sub display panel, and the light absorbing layer 2 may be made of epoxy resin, silicone resin, or a mixture thereof. According to the second embodiment, a reflective metal layer 8 is disposed between the first electrode 9 and the second electrode 10 of the LED chip 1, and the reflective metal layer 8 is in an island shape and is not connected to the peripheral electrode.
According to the technical scheme, the light absorption layer 2 is arranged at the splicing position of the displayer, so that the phenomenon that the display effect is influenced by refraction and the like at the splicing position is avoided.
The invention provides a display device comprising the display panel. The Display panel types may include LCD (Liquid Crystal Display), micro LED Display, MINI-LED Display, and the like, and specific types are not shown here.
In some embodiments, the LCD includes the following kinds of display panels: TN (Twisted Nematic) panel, MVA (Multi-domain Vertical Alignment) panel, IPS (In-Plane Switching) panel, CPA (Continuous flame Alignment) panel, and the like, are not particularly limited herein.
In the description of the present specification, reference to the description of the terms "one embodiment", "some embodiments", "an illustrative embodiment", "an example", "a specific example", or "some examples", etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, insofar as these modifications and variations of the invention fall within the scope of the claims of the invention and their equivalents, the invention is intended to include these modifications and variations.
The above-mentioned embodiments are only examples of the present invention, which should not be construed as limiting the scope of the present invention, and therefore, the present invention is not limited by the claims.
Claims (10)
1. A tiled display panel comprising at least two sub-display panels tiled with each other, wherein each of the sub-display panels comprises a carrier substrate having a first surface, a second surface and a side surface, the first surface is opposite to the second surface, and the side surface is connected to the first surface and the second surface;
the first surface is provided with a display unit and a first splicing unit, the side surface is provided with a second splicing unit, and the first splicing unit is connected with the second splicing unit;
the sub-display panels are connected with each other through the second splicing units, and the display units are arranged on two sides of the splicing units;
and a light absorption layer is arranged on the first splicing unit.
2. The tiled display panel of claim 1 wherein the display unit includes a drive array disposed on the first surface and a light emitting element coupled to the drive array.
3. The tiled display panel of claim 2, wherein the light emitting elements include a first light emitting element disposed adjacent to the first tiled cell and a second light emitting element distal from the first tiled cell.
4. The tiled display panel of claim 3 wherein the light emitting elements are flip-chip LED chips with a reflective layer disposed between the first and second electrodes.
5. The tiled display panel of claim 3 wherein the first light emitting element is a flip-chip LED chip having a reflective layer disposed between the first and second electrodes.
6. The tiled display panel according to claim 2, wherein the carrier substrate includes a plurality of via holes penetrating through the carrier substrate, auxiliary traces are disposed inside the via holes, and the driving array is electrically connected to the circuit control unit disposed on the second surface through the auxiliary traces.
7. The tiled display panel of claim 2, wherein a light absorbing layer is disposed over the second tiled cell.
8. The tiled display panel of claim 1 wherein the light absorbing layer comprises at least one of: epoxy resin, silicone resin.
9. A display device comprising the tiled display panel according to any of claims 1 to 8.
10. The display device of claim 9, further comprising a protective layer disposed on a light exit side of the tiled display panel.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010443853.8A CN113707043A (en) | 2020-05-22 | 2020-05-22 | Spliced display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010443853.8A CN113707043A (en) | 2020-05-22 | 2020-05-22 | Spliced display panel and display device |
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| CN113707043A true CN113707043A (en) | 2021-11-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010443853.8A Pending CN113707043A (en) | 2020-05-22 | 2020-05-22 | Spliced display panel and display device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113838381A (en) * | 2021-01-27 | 2021-12-24 | 友达光电股份有限公司 | Display device |
| CN114241943A (en) * | 2021-12-14 | 2022-03-25 | 惠州华星光电显示有限公司 | Display screen, display device and manufacturing method of display screen |
| CN114447183A (en) * | 2021-12-08 | 2022-05-06 | 友达光电股份有限公司 | Display module |
| CN115083296A (en) * | 2022-06-20 | 2022-09-20 | 湖北长江新型显示产业创新中心有限公司 | Display device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106057095A (en) * | 2016-08-18 | 2016-10-26 | 京东方科技集团股份有限公司 | Spliced display panel and spliced display device |
| CN107316882A (en) * | 2017-06-09 | 2017-11-03 | 深圳市华星光电技术有限公司 | OLED tiled display panels |
| CN108511569A (en) * | 2018-03-28 | 2018-09-07 | 厦门乾照光电股份有限公司 | A kind of LED chip and production method |
| CN111183473A (en) * | 2020-01-02 | 2020-05-19 | 康佳集团股份有限公司 | Method for improving bright lines of splicing seams of display screen |
| CN213025159U (en) * | 2020-05-22 | 2021-04-20 | 重庆康佳光电技术研究院有限公司 | Spliced display panel and display device |
-
2020
- 2020-05-22 CN CN202010443853.8A patent/CN113707043A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106057095A (en) * | 2016-08-18 | 2016-10-26 | 京东方科技集团股份有限公司 | Spliced display panel and spliced display device |
| CN107316882A (en) * | 2017-06-09 | 2017-11-03 | 深圳市华星光电技术有限公司 | OLED tiled display panels |
| CN108511569A (en) * | 2018-03-28 | 2018-09-07 | 厦门乾照光电股份有限公司 | A kind of LED chip and production method |
| CN111183473A (en) * | 2020-01-02 | 2020-05-19 | 康佳集团股份有限公司 | Method for improving bright lines of splicing seams of display screen |
| CN213025159U (en) * | 2020-05-22 | 2021-04-20 | 重庆康佳光电技术研究院有限公司 | Spliced display panel and display device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113838381A (en) * | 2021-01-27 | 2021-12-24 | 友达光电股份有限公司 | Display device |
| CN113838381B (en) * | 2021-01-27 | 2022-12-02 | 友达光电股份有限公司 | Display device |
| US11644705B2 (en) | 2021-01-27 | 2023-05-09 | Au Optronics Corporation | Display apparatus |
| CN114447183A (en) * | 2021-12-08 | 2022-05-06 | 友达光电股份有限公司 | Display module |
| CN114241943A (en) * | 2021-12-14 | 2022-03-25 | 惠州华星光电显示有限公司 | Display screen, display device and manufacturing method of display screen |
| CN114241943B (en) * | 2021-12-14 | 2024-03-15 | 惠州华星光电显示有限公司 | Display screen, display device and manufacturing method of display screen |
| CN115083296A (en) * | 2022-06-20 | 2022-09-20 | 湖北长江新型显示产业创新中心有限公司 | Display device |
| CN115083296B (en) * | 2022-06-20 | 2023-09-15 | 湖北长江新型显示产业创新中心有限公司 | display device |
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