CN113677108A - Manufacturing method of embedded copper block - Google Patents
Manufacturing method of embedded copper block Download PDFInfo
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- CN113677108A CN113677108A CN202110939423.XA CN202110939423A CN113677108A CN 113677108 A CN113677108 A CN 113677108A CN 202110939423 A CN202110939423 A CN 202110939423A CN 113677108 A CN113677108 A CN 113677108A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 144
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 96
- 239000010949 copper Substances 0.000 title claims abstract description 96
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 239000010410 layer Substances 0.000 claims abstract description 228
- 239000011241 protective layer Substances 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 238000003825 pressing Methods 0.000 claims abstract description 20
- 239000012790 adhesive layer Substances 0.000 claims abstract description 13
- 239000011889 copper foil Substances 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 23
- 230000003139 buffering effect Effects 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 14
- 238000006087 Brown hydroboration reaction Methods 0.000 claims description 2
- 239000002120 nanofilm Substances 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 239000000945 filler Substances 0.000 abstract description 3
- 238000005429 filling process Methods 0.000 abstract description 3
- 238000007711 solidification Methods 0.000 abstract 1
- 238000003801 milling Methods 0.000 description 17
- 229910052782 aluminium Inorganic materials 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 238000010586 diagram Methods 0.000 description 7
- 238000003475 lamination Methods 0.000 description 6
- 238000010030 laminating Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009969 flowable effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a manufacturing method of an embedded copper block, which comprises the following steps: manufacturing a first accommodating groove on a secondary outer plate; manufacturing a pre-pasting board, wherein the bonding layer of the pre-pasting board is in a semi-solidification state; manufacturing a second through groove on each pre-pasting plate; removing the protective layer of the pre-pasting plate, arranging the pre-pasting plate on the secondary outer plate to form an outer-layer plate to be pressed, wherein the second through groove is communicated with the first accommodating groove; placing copper blocks to be embedded in the first accommodating groove and the second through groove of the outer layer plate to be pressed; then the outer layer plate to be pressed is pressed, and through pressing, the resin of the pre-pasting plate bonding layer flows and fills the gaps among the first accommodating groove, the second through groove and the copper block, so that the copper block, the secondary outer layer plate and the pre-pasting plate are combined into a whole. The resin of the adhesive layer of the present invention can flow to fill the gap between the copper block and the through groove or the blind groove, so that an additional filler or filling process is not required. The invention realizes the manufacture of any layer of interconnection plate or two or more levels of high-density interconnection plates communicated with the outer layer and embedded into the copper block.
Description
Technical Field
The invention relates to a manufacturing method of an embedded copper block.
Background
With the rapid development of the 5G communication technology, the operation speed of electronic products is faster and faster, and meanwhile, due to the development trend of miniaturization of the size of the electronic products, the reduction of the packaging volume and the increase of the packaging density easily cause heating and heat accumulation of electronic components, the requirement on the heat dissipation performance of a printed circuit board is higher and higher, so that the reliability of the components is improved, and the service life of the components is prolonged. The direct embedding and embedding of the metal copper block in the PCB, i.e. the printed circuit board, is one of the effective ways to solve the heat dissipation problem of the PCB.
The manufacturing method of the embedded copper plate common in the industry at present is manufactured by milling and superposing an upper core plate and a lower core plate with a middle bonding layer or superposing the upper core plate and the lower core plate with the middle bonding layer and an inner layer plate, and the method has the defects that: firstly, laser blind holes of the bonding layer cannot be manufactured due to the fact that the stacked layers are fixed; secondly, due to thickness limitation, it is difficult to manufacture first-order blind holes communicating the outer core plate and the bonding layer or the manufactured first-order blind holes are difficult to fill with copper, and cannot meet the requirements of the aperture design of customers; therefore, it is impossible to manufacture any layer of interconnection board and two-step or more high-density interconnection boards connected with the outer layer.
Disclosure of Invention
The invention provides a manufacturing method of an embedded copper block to solve the technical problems.
In order to achieve the above purpose, the invention is realized by the following technical scheme:
a manufacturing method of an embedded copper block comprises the following steps:
step one, manufacturing a first accommodating groove on a secondary outer layer plate, wherein the size of the first accommodating groove is larger than that of a copper block to be embedded;
preparing at least one bonding layer, wherein a protective layer is arranged on one surface of the bonding layer, and a copper foil layer is arranged on the other surface of the bonding layer to form a pre-pasted plate, and the bonding layer of the pre-pasted plate is in a semi-solidified state;
step three, manufacturing a second through groove on each pre-pasting plate, wherein the size of the second through groove is larger than that of the copper block to be embedded;
removing the protective layer of the pre-pasting plate, arranging the pre-pasting plate on the secondary outer plate to form an outer-layer plate to be pressed, and communicating the second through groove with the first accommodating groove;
placing copper blocks to be embedded in the first accommodating groove and the second through groove of the outer layer to-be-pressed plate; then the outer layer plate to be pressed is pressed, and through pressing, resin of the bonding layer flows and fills gaps among the first accommodating groove, the second through groove and the copper block, so that the copper block, the secondary outer layer plate and the pre-pasted plate are combined into a whole.
According to an embodiment of the present invention, the first receiving groove includes a first through groove or a first blind groove.
According to an embodiment of the invention, when the first accommodating groove is a first through groove, pre-pasting plates are respectively arranged above and below the first through groove; when the first accommodating groove is a first blind groove, a pre-pasting plate is arranged above the first blind groove.
According to an embodiment of the present invention, in the first step, the size of the first accommodating groove is larger than the size of the copper block to be embedded.
According to one embodiment of the present invention, in the second step, the copper foil is bonded to the adhesive layer, the adhesive layer after bonding is in a semi-cured state, and the bonding parameters are as follows: 75-125 ℃, bonding time: 5 to 30 seconds, bonding pressure: 0.5-1 MPa.
According to an embodiment of the invention, in the second step, the thickness of the bonding layer is 30 μm to 150 μm; the protective layer is a high-molecular film which can resist high temperature of more than 200 ℃, and the thickness of the protective layer is 12-30 μm; the thickness of the copper foil layer is 12-35 μm.
According to an embodiment of the invention, in the fifth step, before the lamination, the copper foil layer on the pre-pasting board and the copper block to be embedded are respectively subjected to brown oxidation or black oxidation treatment.
According to one embodiment of the invention, the pre-pasting board or the pre-pasting board is provided with a positioning hole, the secondary outer board is also provided with a positioning hole, and the positioning hole is used for stacking and positioning the secondary outer board and the pre-pasting board.
According to an embodiment of the invention, in the fifth step, before the pressing, a buffering release material is placed on the outer layer of the pre-laminated board, and then the outer layer to be pressed is pressed. The buffering release material comprises one or more of an aluminum sheet, a copper foil or a high-temperature resistant release film.
According to one embodiment of the invention, the size of the second through groove is the same as or different from that of the first accommodating groove, and the size of the second through groove is 60-110 μm larger than the size of the single side of the copper block to be embedded.
The resin of the adhesive layer of the present invention can flow to fill the gap between the copper block and the through groove or the blind groove, so that an additional filler or filling process is not required. The invention realizes the manufacture of any layer of interconnection plates and two or more stages of high-density interconnection plates communicated with the outer layer, and provides a processing method of an embedded copper plate.
Through setting up the protective layer and the mode of pasting in advance, make tie coat and copper foil layer at first form the flitch in advance, be convenient for form logical groove, guaranteed the semi-solid state of tie coat again simultaneously to make the resin of tie coat can flow and fill the clearance between copper billet and logical groove or the blind groove in whole pressfitting.
Wherein the effect of protective layer is, increases tie coat rigidity, plays the protection supporting role for paste the copper foil layer in advance and level and smooth, protect the tie coat simultaneously and cut the board in advance of formation of laminating and form to lead to the groove in-process and not receive external environment's influence, external force damage and pollution etc. more effectually guaranteed that the tie coat is in the semi-solid state, follow-up lamination resin is flowable promptly.
Drawings
FIG. 1 is an L2/5 laminate of step one of example 1;
FIG. 2 is a diagram showing a second step in example 1;
FIG. 3 is a schematic view of step three in example 1;
FIG. 4 is a schematic view of step three in example 1;
FIG. 5 is a diagram showing a fourth step in example 1;
FIG. 6 is a diagram showing a fourth step in example 1;
FIG. 7 is a schematic view of step five in example 1;
FIG. 8 is a schematic view of step five in example 1;
FIG. 9 is a schematic view of step six of example 1;
FIG. 10 is a schematic view of step six of example 1;
FIG. 11 is a diagram showing a seventh step in example 1;
FIG. 12 is a schematic view of step eight in example 1;
FIG. 13 is the finished product of example 1;
FIG. 14 is a diagram showing a first step in example 2;
FIG. 15 is a diagram showing a second step in example 2;
FIG. 16 is a schematic view of step three in example 2;
FIG. 17 is a diagram showing a fourth step in example 2;
FIG. 18 is a schematic view of step five in example 2;
FIG. 19 is a schematic view of step six of example 2;
FIG. 20 is a schematic view of step seven in example 2;
FIG. 21 is a view showing a step eight in example 2;
FIG. 22 is the finished product of example 2;
FIG. 23 is the finished product of example 3;
FIG. 24 is the finished product of example 4.
Detailed Description
The invention is described in detail below with reference to the attached drawing figures:
example 1
In the method for manufacturing the embedded copper block of this embodiment, taking manufacturing the embedded copper block as a through type, and taking an arbitrary-layer interconnection structure with 6 layers as an example, the total thickness of the board of the arbitrary-layer interconnection structure with 6 layers of this embodiment is 1.0mm, and the thickness of the embedded copper block is 1.0mm, and specifically includes the following steps:
step one, as shown in figure 1, according to the conventional manufacturing flow of the circuit board, an L2/5 layer pattern is manufactured and completed through an L3/4 layer core plate stacking method, and the manufactured L2/5 layer plate 1 completes the manufacturing of laser blind holes between an inner layer circuit and a connecting layer;
step two, as shown in fig. 2, milling a first through groove 2 on the L2/5 layer plate 1 in a region needing to be embedded with copper by a CCD (charge coupled device) machine, and milling first positioning holes at four corners on the plate edge to form a first-time outer layer plate 3; the size of the first through groove 2 is 75 microns larger than that of the copper block 4;
step three, as shown in fig. 3 and 4, selecting a first bonding layer 5 and a second bonding layer 6, and respectively arranging a protective layer 7 below the first bonding layer 5 and a protective layer 7 above the second bonding layer 6; the protective layer 7 is respectively attached to the first bonding layer 5 and the second bonding layer 6 through a rolling film sticking machine; wherein the thickness of the first bonding layer 5 and the second bonding layer 6 is 75 μm, and the thickness of the protective layer 7 is 25 μm; the protective layer 7 is a polymer film resistant to a high temperature of 200 degrees celsius or higher, and is specifically a polyimide film, that is, a PI film in this embodiment.
And fourthly, as shown in fig. 5 and 6, respectively pre-pasting the corresponding first copper foil layers 8 on the first bonding layers 5 through a vacuum rapid press to form first pre-pasting plates 9. Similarly, a second copper foil layer 10 is bonded to the lower side of the second adhesive layer 6 to form a second pre-bonded sheet 11. Wherein the thickness of the copper foil layer is 18 μm. During laminating, place the copper foil layer in the below after, then place the tie coat, put into the laminating in the quick press in vacuum, the laminating parameter of the quick press in vacuum is the temperature: 85 ℃, time: 10 seconds, bonding pressure: 0.8Mpa, and the bonding layer is still in a semi-cured state after the bonding; the copper foil layer and the bonding layer are smooth and have no wrinkles.
Step five, as shown in fig. 7 and 8, cutting second through grooves 12 in the copper-embedded area of the first pre-attached plate 9 and the second pre-attached plate 11 respectively by using a UV laser milling machine, and milling second positioning holes at four corners on the plate edges of the first pre-attached plate 9 and the second pre-attached plate 11 respectively; the position of the second positioning hole is the same as that of the first positioning hole in the second step; the size of the second through groove 12 is 80 μm larger than that of the copper block 4.
And step six, as shown in fig. 9 and fig. 10, stripping the protective layer 7 from the first pre-pasting board 9 and the second pre-pasting board 11 respectively.
Seventhly, as shown in FIG. 11, the first pre-pasting board 9 is arranged on the L2 layer of the L2/5 laminate, and the second pre-pasting board 11 is arranged on the L5 layer of the L2/5 laminate; overlapping and fixing the first positioning hole and the second positioning hole which are manufactured in advance in the second step and the fifth step and are in the same position in a riveting or heat bonding mode to form an outer layer pressing plate;
step eight, as shown in fig. 12, placing a copper block 4 at the overlapping position of the first through groove 2 and the second through groove 12 of the outer layer to-be-laminated plate 13, wherein a buffering release material 14 is placed on the second copper foil layer 10 before the copper block 4 is placed, the buffering release material 14 is placed on the first copper foil layer 8 after the copper block 4 is placed, and performing outer layer lamination manufacturing, wherein the buffering release material 14 has the function of enabling resin of the first bonding layer 5 and the second bonding layer 6 to flow and then uniformly filling a gap between the through groove and the copper block 4; by pressing, as shown in fig. 13, the first adhesive layer 5 and the second adhesive layer 6 are formed by filling resin flowing into the gaps between the first through groove 2, the second through groove 12 and the copper block 4, so that the copper block 4 and the plate are integrated. As shown in fig. 13, resin, which is indicated by 15 in fig. 13, fills the gap between the copper block 4 and the outer plate.
And placing a buffering release material on the outer layer of the pre-pasting board, and then pressing the outer layer to be laminated. The buffering release material comprises one or more of an aluminum sheet, a copper foil or a high-temperature resistant release film, and has the functions of enabling resin of the pre-pasting board to flow and uniformly fill gaps of the copper blocks by using different single or combined buffering materials 1); 2) and after lamination, the buffer material is removed, so that the bonding force of the copper block resin gap is not influenced.
Removing resin exposed on the surface of the copper block 4 of the laminated outer-layer plate by abrasive belt grinding, further thinning the first copper foil layer 8 and the second copper foil layer 10, performing surface browning treatment, performing outer-layer laser drilling, electroplating and other subsequent processes for manufacturing; and finishing the manufacture of the interconnection and stacking circuit board of any layer.
Example 2
In the method for manufacturing the embedded copper block 4 of this embodiment, the manufactured embedded copper block 4 is a semi-embedded type, the number of layers is 10, the 2-step HDI structure is in conduction with the outer layer, the total thickness of the board is 1.5mm, and the thickness of the embedded copper block 4 is 0.6 mm. In this embodiment, since the embedded copper block 4 is semi-embedded, after the second outer layer plate 21 and the first blind groove 17 on the second outer layer plate 21 are manufactured, only the first bonding layer 5 is required to be manufactured to provide the second through groove 12, which is communicated with the first blind groove 17; and the second adhesive layer 6 is provided for build-up. The method specifically comprises the following steps:
step one, as shown in fig. 14, according to the conventional manufacturing flow of the circuit board, 3 core boards of L3/4 layers, L5/6 layers and L7/8 layers are manufactured to complete the L2/9 layer pattern, and the manufactured L2/9 layer board 16 is already completed with the manufacture of laser blind holes between the inner layer circuit and the L2/3 layers and between the inner layer circuit and the L8/9 layer;
step two, as shown in fig. 15, deeply milling a first blind groove 17 on the L2/9 layer plate 16 in a region needing to be embedded with copper through a CCD machine control, and simultaneously milling first positioning holes at four corners on the plate edge to form a second outer layer plate 21; wherein the size of the first blind groove 17 is 100 μm larger than that of the copper block 4;
step three, as shown in fig. 16, selecting a first bonding layer 5, and attaching a protective layer 7 below the first bonding layer by a rolling film sticking machine; wherein the thickness of the first bonding layer 5 is 78 μm, and the thickness of the protective layer 7 is 25 μm; the protective layer 7 is a polymer film resistant to a high temperature of 200 degrees celsius or higher, and is specifically a polyimide film, that is, a PI film in this embodiment.
Step four, as shown in fig. 17, pre-pasting a first copper foil layer 8 on the first bonding layer 5 by a vacuum rapid press to form a first pre-pasting plate 9, wherein the thickness of the first copper foil layer 8 is 18 μm, placing the copper foil layer below the first copper foil layer during pasting, then placing the bonding layer, placing the first copper foil layer in the vacuum rapid press for pasting, and the pasting parameters of the vacuum rapid press are temperature: 100 ℃, time: 20 seconds, bonding pressure: 1.0Mpa, the first bonding layer 5 is still in a semi-cured state after the bonding; the first copper foil layer 8 and the first bonding layer 5 are flat and have no wrinkles;
step five, as shown in fig. 18, cutting the second through-grooves 12 in the copper-embedded area of the first pre-pasting board 9 by using a UV laser milling machine, and milling four second positioning holes at the board edge; the position of the second positioning hole is the same as that of the first positioning hole in the step 2; the size of the second through groove 12 is 90 microns larger than that of the copper block 4 on one side;
step six, as shown in fig. 19, the first pre-pasting board 9 is stripped from the protective layer 7.
Step seven, as shown in fig. 20, arranging the first pre-pasting board 9 on the layer L2 of the layer board L2/9, and performing riveting or thermal bonding on the first positioning hole and the second positioning hole which are manufactured in advance in the step 2 and the step 5 and are at the same positions to form an L1/9 layer to-be-pressed board;
step eight, as shown in fig. 21, sequentially arranging a lower-layer buffering aluminum sheet 18, a second copper foil layer 10, a second bonding layer 6 and an L1/9 layer to-be-pressed plate according to a stacking sequence, wherein the second bonding layer 6 is in contact with an L9 layer of the L1/9 layer to-be-pressed plate, and then placing a copper block 4 in an overlapping area of the first blind groove 17 and the second through groove 12; finally, an upper layer of buffering aluminum sheet 19 is placed for pressing; the upper layer of buffering aluminum sheet 19 is used for enabling the resin of the first bonding layer 5 to flow and then uniformly filling the gap between the blind groove and the copper block 4; by pressing, as shown in fig. 22, the first adhesive layer 5 resin flows to fill the gap between the blind groove and the copper block 4, so that the copper block 4 and the plate are firmly combined into a whole. As shown in fig. 22, reference numeral 20 in fig. 22 denotes a resin filled gap between the copper block 4 and the outer plate. A
And placing a buffering release material on the outer layer of the pre-pasting board, and then pressing the outer layer to be laminated. The buffering release material comprises one or more of an aluminum sheet, a copper foil or a high-temperature resistant release film, and has the functions of enabling resin of the pre-pasting board to flow and uniformly fill gaps of the copper blocks by using different single or combined buffering materials 1); 2) and after lamination, the buffer material is removed, so that the bonding force of the copper block resin gap is not influenced.
Removing resin exposed on the surface of the copper block 4 of the laminated outer-layer plate by abrasive belt grinding, further thinning the first copper foil layer 8 and the second copper foil layer 10, performing surface browning treatment, performing outer-layer laser drilling, electroplating and other subsequent processes for manufacturing; and finishing the manufacture of a two-stage HDI semi-embedded copper block product communicated with the outer layer.
Example 3
As shown in fig. 23, the method for manufacturing the embedded copper block 4 in this embodiment takes the manufactured embedded copper block 4 as a penetrating type, and takes a 2-step HDI structure with 10 layers and conducting with an outer layer as an example, the total thickness of the board is 1.2mm, and the thickness of the embedded copper block 4 is 0.3mm, and specifically includes the following steps:
step one, according to the conventional manufacturing flow of the circuit board, 3 core boards including an L3/4 layer, an L5/6 layer and an L7/8 layer are manufactured to complete an L2/9 layer graph, and the manufactured L2/9 layer board is manufactured to complete the manufacture of laser blind holes between an inner layer circuit and the L2/3 layer and between the inner layer circuit and the L8/9 layer;
step two, deeply milling a first through groove in an area needing to be embedded with copper through a CCD (charge coupled device) machine control on the L2/9 laminate, and milling first positioning holes at four corners on the laminate to form a secondary outer laminate; the size of the first through groove is 50 microns larger than that of the copper block 4 on one side;
selecting a first bonding layer and a second bonding layer, and respectively attaching a protective layer to one surface of the first bonding layer and one surface of the second bonding layer through a rolling film sticking machine; wherein the thickness of the first bonding layer and the second bonding layer is 30 μm, and the thickness of the protective layer is 12 μm; the protective layer is a polyimide film, namely a PI film.
Step four, pre-pasting a first copper foil layer and a second copper foil layer on the other side of the first bonding layer and the second bonding layer, which is not pasted with a protective layer, through a vacuum fast press to form a first pre-pasting board and a second pre-pasting board respectively, wherein the thickness of the first copper foil layer and the thickness of the second copper foil layer are 12 microns, when pasting, placing the copper foil layer behind the lower part, then placing the bonding layer, placing the bonding layer into the vacuum fast press for pasting, and the pasting parameter of the vacuum fast press is temperature: 75 ℃, time: 5 seconds, bonding pressure: 0.5Mpa, and the first bonding layer and the second bonding layer are still in a semi-cured state after the bonding; the copper foil layer and the bonding layer are smooth and have no wrinkles;
step five, respectively enabling the first pre-pasting plate and the second pre-pasting plate to pass through a UV laser milling machine, cutting a second through groove in the copper-embedded area, and milling second positioning holes at four corners on the plate edge; the position of the second positioning hole is the same as that of the first positioning hole in the step 2; the size of the second through groove is 60 microns larger than the size of the copper block 4 on one side;
and step six, stripping the protective layer from the first pre-pasting plate and the second pre-pasting plate.
Step seven, arranging the first pre-pasting plate and the second pre-pasting plate on the L2 layer and below the L9 layer respectively, and performing rivet or thermal bonding on the first positioning hole and the second positioning hole which are manufactured in advance in the step 2 and the step 5 and are in the same position to form an L1/10 layer to-be-pressed plate in an overlapping and fixing mode;
step eight, sequentially arranging a lower-layer buffering aluminum sheet and an L1/10-layer pressure plate to be pressed according to the stacking sequence, and then placing a copper block 4 in a through groove formed by the first through groove and the second through groove; finally, placing an upper-layer buffering aluminum sheet for pressing; the buffer aluminum sheet has the function of enabling the bonding layer resin to flow and then uniformly fill the gap between the blind groove and the copper block 4; through pressing, the first bonding layer and the second bonding layer resin flow to fill the gap between the blind groove and the copper block 4, so that the copper block 4 and the plate are firmly combined into a whole.
Removing resin exposed on the surface of the copper block 4 from the laminated outer-layer plate through abrasive belt grinding, further thinning the first copper foil layer and the second copper foil layer, performing surface browning treatment, performing outer-layer laser drilling, electroplating and other subsequent processes; and finishing the manufacture of a two-stage HDI semi-embedded copper block product communicated with the outer layer.
Example 4
As shown in fig. 24, in the method for manufacturing the embedded copper block 4 according to this embodiment, the embedded copper block 4 manufactured according to this embodiment is a semi-embedded board with 6 layers of any layer of interconnection structure, the total thickness of the board is 2mm, and the thickness of the embedded copper block 4 is 1.2mm, and specifically includes the following steps:
step one, according to the conventional manufacturing flow of the circuit board, an L2/5 layer of graph is manufactured through an L3/4 layer core plate stacking method, and the manufactured L2/5 layer plate 1 is manufactured through laser blind holes between an inner layer circuit and a connecting layer;
step two, milling a first blind groove on the L2/5 laminate 1 in a region needing to be embedded with copper by a CCD (charge coupled device) machine, and milling first positioning holes at four corners on the edge of the laminate to form a first-time outer laminate; wherein the size of the first blind groove is 90 μm larger than the size of the copper block 4;
step three, selecting a first bonding layer, and attaching a protective layer on one surface of the first bonding layer through a rolling film sticking machine; wherein the thickness of the first bonding layer is 150 μm, and the thickness of the protective layer is 30 μm; the protective layer is a polyimide film, namely a PI film.
Step four, pre-pasting a first copper foil layer on the other side of the first bonding layer, which is not pasted with the protective layer 7, through a vacuum fast press to form a first pre-pasting plate, wherein the thickness of the first copper foil layer is 35 microns, during pasting, placing the copper foil layer behind the lower part, then placing the bonding layer, placing the bonding layer in the vacuum fast press for pasting, and the pasting parameters of the vacuum fast press are temperature: 125 ℃, time: 30 seconds, bonding pressure: 0.8Mpa, the first bonding layer is still in a semi-cured state after the bonding; the first copper foil layer and the first bonding layer are flat and have no folds;
step five, cutting a second through groove in the copper-embedded area of the first pre-laminated board through a UV laser milling machine, and milling second positioning holes at four corners on the board edge; the position of the second positioning hole is the same as that of the first positioning hole in the step 2; the size of the second through groove is 110 microns larger than the size of the copper block 4 on one side;
and step six, stripping the protective layer from the first pre-pasting plate.
Step seven, arranging the first pre-pasting plate 9 on an L2 layer, and performing rivet or heat bonding on the first positioning hole and the second positioning hole which are manufactured in advance in the step 2 and the step 5 and are in the same positions to form an outer layer to-be-pressed plate in an overlapping and fixing mode;
step eight, sequentially arranging a lower-layer buffering aluminum sheet, a second copper foil layer, a second bonding layer and an outer-layer pressing plate to be pressed according to the stacking sequence, wherein the second bonding layer 6 is in contact with an L5 layer of the L1/5-layer pressing plate to be pressed, and then placing a copper block 4 in the overlapping area of the first blind groove and the second through groove; finally, placing an upper-layer buffering aluminum sheet for pressing; the buffer aluminum sheet has the function of enabling the bonding layer resin to flow and then uniformly fill the gap between the blind groove and the copper block 4; through pressing, the first bonding layer resin flows to fill the gap between the blind groove and the copper block 4, so that the copper block 4 and the plate are firmly combined into a whole.
Removing resin exposed on the surface of the copper block 4 from the laminated outer-layer plate through abrasive belt grinding, further thinning the first copper foil layer and the second copper foil layer, performing surface browning treatment, performing outer-layer laser drilling, electroplating and other subsequent processes; and finishing the manufacture of a two-stage HDI semi-embedded copper block product communicated with the outer layer.
The resin of the adhesive layer of the present invention can flow to fill the gap between the copper block and the through groove or the blind groove, so that an additional filler or filling process is not required. The invention realizes the manufacture of any layer of interconnecting plates and two or more stages of HDI plates communicated with the outer layer, and provides a processing method of an embedded copper plate.
Through setting up the protective layer and the mode of pasting in advance, make tie coat and copper foil layer at first form the flitch in advance, be convenient for form logical groove, guaranteed the resin of tie coat again simultaneously can flow and fill the clearance between copper billet and logical groove or the blind groove.
Wherein the effect of protective layer is, increases tie coat rigidity, plays the protection supporting role for paste the copper foil layer in advance and level and smooth, protect the tie coat simultaneously and cut the board in advance of formation of laminating and form to lead to the groove in-process and not receive external environment's influence, external force damage and pollution etc. more effectually guaranteed that the tie coat is in the semi-solid state, follow-up lamination resin is flowable promptly.
The embodiments of the present invention are merely illustrative, and not restrictive, of the scope of the claims, and other substantially equivalent alternatives may occur to those skilled in the art and are within the scope of the present invention.
Claims (10)
1. A manufacturing method of an embedded copper block is characterized by comprising the following steps:
step one, manufacturing a first accommodating groove on a secondary outer layer plate, wherein the size of the first accommodating groove is larger than that of a copper block to be embedded;
preparing at least one bonding layer, wherein a protective layer is arranged on one surface of the bonding layer, and a copper foil layer is arranged on the other surface of the bonding layer to form a pre-pasted plate, and the bonding layer of the pre-pasted plate is in a semi-solidified state;
step three, manufacturing a second through groove on each pre-pasting plate, wherein the size of the second through groove is larger than that of the copper block to be embedded;
removing the protective layer of the pre-pasting plate, arranging the pre-pasting plate on the secondary outer plate to form an outer-layer plate to be pressed, and communicating the second through groove with the first accommodating groove;
placing copper blocks to be embedded in the first accommodating groove and the second through groove of the outer layer to-be-pressed plate; then the outer layer plate to be pressed is pressed, and through pressing, resin of the bonding layer flows and fills gaps among the first accommodating groove, the second through groove and the copper block, so that the copper block, the secondary outer layer plate and the pre-pasted plate are combined into a whole.
2. The method of claim 1, wherein the first receiving groove comprises a first through groove or a first blind groove.
3. The method of claim 2, wherein when the first receiving groove is a first through groove, pre-pasting plates are respectively disposed above and below the first through groove; when the first accommodating groove is a first blind groove, a pre-pasting plate is arranged above the first blind groove.
4. The method as claimed in claim 1, 2 or 3, wherein in the first step, the size of the first receiving groove is larger than the size of the copper block to be embedded.
5. The method according to claim 1, wherein in the second step, the copper foil is bonded to the adhesive layer, the adhesive layer after bonding is in a semi-cured state, and the bonding parameters are as follows: 75-125 ℃, bonding time: 5 to 30 seconds, bonding pressure: 0.5-1 MPa.
6. The method for manufacturing an embedded copper block according to claim 1 or 5, wherein in the second step, the thickness of the adhesive layer is 30 μm to 150 μm; the protective layer is a high-molecular film which can resist high temperature of more than 200 ℃, and the thickness of the protective layer is 12-30 μm; the thickness of the copper foil layer is 12-35 μm.
7. The method as claimed in claim 1, wherein in the fifth step, the copper foil layer on the pre-pasting board and the copper block to be embedded are subjected to brown oxidation or black oxidation respectively before the pressing.
8. The method for manufacturing the embedded copper block according to claim 1, wherein the pre-attached plate or the pre-attached plate is provided with positioning holes, the secondary outer plate is also provided with positioning holes, and the positioning holes are used for stacking and positioning the secondary outer plate and the pre-attached plate.
9. The method for manufacturing the embedded copper block according to claim 1, wherein in the fifth step, before the pressing, a buffering release material is placed on the outer layer of the pre-pasting board in the outer layer pressing board, and then the outer layer pressing board is pressed.
10. The method as claimed in claim 1, wherein the size of the second through groove is the same as or different from the size of the first receiving groove, and the size of the second through groove is 60 μm to 110 μm larger than the size of the single side of the copper block to be embedded.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115023070A (en) * | 2022-06-24 | 2022-09-06 | 珠海杰赛科技有限公司 | Manufacturing method of semi-buried copper circuit board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160165731A1 (en) * | 2014-12-05 | 2016-06-09 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Method of fabricating a polymer frame with a rectangular array of cavities |
| CN107018621A (en) * | 2017-05-19 | 2017-08-04 | 上海美维科技有限公司 | A kind of method that copper billet is buried in printed circuit board |
| CN108684136A (en) * | 2018-05-22 | 2018-10-19 | 景旺电子科技(龙川)有限公司 | One kind burying copper billet heat-radiating substrate and preparation method thereof |
| CN111669906A (en) * | 2020-05-27 | 2020-09-15 | 上海美维电子有限公司 | Method for manufacturing multilayer circuit board |
| CN112040634A (en) * | 2020-08-31 | 2020-12-04 | 深圳崇达多层线路板有限公司 | Manufacturing process of embedded copper block circuit board |
| CN112689380A (en) * | 2021-01-15 | 2021-04-20 | 深圳市鼎盛电路技术有限公司 | Manufacturing method of embedded copper block circuit board structure and circuit board |
| CN113056121A (en) * | 2021-03-16 | 2021-06-29 | 上海美维电子有限公司 | Uncovering method of rigid-flex board |
-
2021
- 2021-08-16 CN CN202110939423.XA patent/CN113677108A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160165731A1 (en) * | 2014-12-05 | 2016-06-09 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Method of fabricating a polymer frame with a rectangular array of cavities |
| CN107018621A (en) * | 2017-05-19 | 2017-08-04 | 上海美维科技有限公司 | A kind of method that copper billet is buried in printed circuit board |
| CN108684136A (en) * | 2018-05-22 | 2018-10-19 | 景旺电子科技(龙川)有限公司 | One kind burying copper billet heat-radiating substrate and preparation method thereof |
| CN111669906A (en) * | 2020-05-27 | 2020-09-15 | 上海美维电子有限公司 | Method for manufacturing multilayer circuit board |
| CN112040634A (en) * | 2020-08-31 | 2020-12-04 | 深圳崇达多层线路板有限公司 | Manufacturing process of embedded copper block circuit board |
| CN112689380A (en) * | 2021-01-15 | 2021-04-20 | 深圳市鼎盛电路技术有限公司 | Manufacturing method of embedded copper block circuit board structure and circuit board |
| CN113056121A (en) * | 2021-03-16 | 2021-06-29 | 上海美维电子有限公司 | Uncovering method of rigid-flex board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115023070A (en) * | 2022-06-24 | 2022-09-06 | 珠海杰赛科技有限公司 | Manufacturing method of semi-buried copper circuit board |
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