CN113677096A - Ultra-long microwave printed board with welding holes at bottom of blind groove and manufacturing process thereof - Google Patents
Ultra-long microwave printed board with welding holes at bottom of blind groove and manufacturing process thereof Download PDFInfo
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- CN113677096A CN113677096A CN202110961287.4A CN202110961287A CN113677096A CN 113677096 A CN113677096 A CN 113677096A CN 202110961287 A CN202110961287 A CN 202110961287A CN 113677096 A CN113677096 A CN 113677096A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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Abstract
The application provides an overlength microwave printed board with welding holes at the bottom of a blind groove and a manufacturing process of the overlength microwave printed board. The manufacturing steps comprise protection before welding hole lamination, staggered grading manufacturing of the target and the positioning hole, and local etching of the welding hole after blind hole forming. The problem of size limitation of an exposure machine, a drilling machine and a milling machine is solved; positioning holes are used for graded dislocation distinguishing and manufacturing, and each positioning layer and each non-positioning layer are separately identified, so that the problems of target ghosting caused by expansion and shrinkage and dislocation and deviation of blind grooves and blind holes caused by further expansion and shrinkage are solved, and scrapping caused by dislocation of interlayer slotted holes is avoided; the inner layer blind hole is locally processed by nickel and gold to be used as an anti-corrosion layer, and the open slot is etched by alkaline, so that the problems of copper plating delamination and uneven thickness of the blind hole welding hole can be solved, and the quality of the welding hole is ensured.
Description
Technical Field
The invention relates to the technical field of multilayer microwave printed boards, in particular to an overlong microwave printed board with a welding hole at the bottom of a blind slot and a manufacturing process thereof.
Background
The manufacturing process of the multilayer microwave printed board containing the step blind slot and the metal circuit pattern at the bottom is generally carried out by laminating a no-flow bonding sheet or a low-fluidity bonding sheet, an outer core board is generally manufactured by a full-open window or a half-open window before lamination, and the exposed part of the inner core board containing the metal circuit is protected by a protective film or a protective glue in advance. And after laminating and manufacturing the outer layer circuit, carrying out cover uncovering operation on a milling machine and removing a protective film or protective colloid on the circuit layer to finally obtain the target printed board.
When the microwave printed board is overlong (more than or equal to 800mm), part of the working procedures can not be realized due to the limitation of the size of optical drawing or machine-added equipment manufacturing; and because the accumulated value of expansion and shrinkage of the slot hole position caused by the manufacturing process is very large, the interlayer deviation phenomenon is serious, and the phenomenon of inaccurate hole position of secondary opening of a blind slot and the phenomenon of deviation of the hole position of the blind slot and the center of the welding hole position are easily caused by using the lamination front half-open window or full-open window process, thereby causing the occurrence of waste products. Especially, when the number of the slotted hole layers is multi-stage, a multi-stage lamination process is adopted, the expansion and shrinkage of different layers are inconsistent, and the center offset phenomenon is particularly serious. When the step blind slot contains a welding hole, adhesive overflow of the bonding sheet can flow into the hole in the laminating process, so that the cleaning treatment in the hole is difficult after the cover is uncovered; the welding holes are subjected to copper plating twice, so that the phenomena of separation of hole wall copper plating layers and uneven plating layer thickness are easy to occur.
Disclosure of Invention
Aiming at the defects of the prior art, the application provides the overlong microwave printed board with the welding holes at the bottom of the blind groove and the manufacturing process thereof, which effectively solve the problem of central deviation of the hole site of the overlong board groove in size and the problem of difficulty in removing glue blockage in the welding groove hole or uneven layering of the plating layer on the hole wall.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a manufacturing process of an overlong microwave printed board with a welding hole at the bottom of a blind groove, which comprises the following steps:
1) and splitting the large-size engineering file into a left partition engineering file and a right partition engineering file, wherein each partition is provided with a positioning hole, and machining is carried out on the partitions.
2) Manufacturing a first core board, wherein the first core board comprises an L1 layer and an L2 layer, manufacturing 1-2 layers of metallized blind holes, an L2 layer of graphs and a primary positioning target of the first core board according to left and right partitions, and locally plating nickel and gold in and around the blind holes of the L2 layer of graphs and sticking a protective film.
3) And manufacturing a second core board, wherein the second core board comprises an L3 layer and an L4 layer, manufacturing an L3 layer graph of the second core board according to the left and right partitions, adjusting data of the L3 layer graph according to the expansion and contraction data after the first core board is manufactured, and manufacturing the L3 layer target graph and the L2 layer in a staggered and differentiated mode.
4) And laminating the first core plate and the second chip for the first time to form a first-level laminated plate, manufacturing 1-4 layers of metallized blind holes, L4 layers of graphs and a first-level positioning target of the first-level laminated plate according to left and right partitions, wherein the L4 layers of the first-level positioning target are not overlapped with the L2 layers of primary positioning targets and the L3 layers of target graphs, locally plating gold in and around the blind holes of the L4 layers of graphs, and sticking a protective film.
5) And manufacturing a third core plate, wherein the third core plate comprises an L5 layer and an L6 layer, manufacturing an L5 layer graph of the third core plate according to the left partition and the right partition, adjusting the data of the L5 layer graph according to the expansion and shrinkage data after the first-level laminated plate is manufactured, and manufacturing the L5 layer target graph and the target of the positioning layer comprising the L2 layer and the L4 layer in a staggered and distinguished mode.
6) And (3) carrying out secondary lamination on the primary laminated plate and the third chip to form a secondary laminated plate, and manufacturing 1-6 layers of through holes and L1 and L6 layers of patterns of the secondary laminated plate according to the left and right partitions.
7) And respectively opening windows according to the positioning holes of the respective layers to expose the bottom metalized through hole, and performing local etching treatment.
Preferably, LDI exposure equipment is used for respectively carrying out two-partition exposure operation according to left and right partition positioning holes to splice a complete circuit graph; and (4) respectively carrying out two-subarea drilling and appearance operation according to the left and right subarea positioning holes by using a drilling and milling machine device, and splicing a complete machining graph.
Preferably, the specific sub-steps of step 2) are as follows:
2-1) respectively drilling a left subarea primary positioning hole, a rivet hole and 1-2 layers of blind holes of the first core plate according to the left subarea and the right subarea, and manufacturing a right subarea primary positioning hole, a rivet hole and 1-2 layers of blind holes according to a left subarea and a right subarea positioning hole;
2-2) plating copper in the holes;
2-3) sticking a dry film, measuring the expansion and contraction data of the positioning holes in the X direction and the Y direction, adjusting the film data according to the expansion and contraction values, and manufacturing an L2 layer pattern and a primary positioning target pattern on the layer according to left and right partitions;
2-4) the L2 layer of patterns are positioned in the blind hole of the 1-2 layers of patterns and the exposed part of the periphery needing slotting, and the surface treatment of local nickel and gold plating is carried out;
2-5) grooving the exposed part around the 1-2 layers of blind holes, and performing local protection by using a high-temperature resistant protective film.
More preferably, the protective film should withstand temperatures higher than the lamination temperature, and generally should withstand a high temperature of 230 ℃ for more than 6 hours without undergoing denaturation. The protective film is manufactured by using a laser mill and is aligned with the centers of the 1-2 layers of blind holes of the first core plate. The high temperature resistant film is tightly bonded with the first core plate by using hot quick pressing or rolling, and can resist the solution erosion in the process.
Preferably, the specific sub-steps of step 3) are as follows:
3-1) respectively drilling a positioning hole and a rivet hole of the left and right subareas of the second core plate according to the data of the expanded and contracted first core plate according to the left and right subareas, and aligning the positioning hole and the rivet hole with the expanded and contracted first core plate;
3-2) sticking dry films, and manufacturing an L3 layer graph according to the data after adjusting the expansion and contraction according to the left and right partitions, wherein the L3 layer target graph and the L2 layer are manufactured in a staggered and differentiated mode.
Preferably, the specific sub-steps of step 4) are as follows:
4-1) carrying out brown/black treatment on the first core board and the second core board; preparing a first-time laminating bonding sheet, and performing first-time laminating by using laser milling to open a window at the position of the blind groove corresponding to the 1-2 layers of blind holes to form a first-level laminated plate;
4-2) carrying out X-ray target drilling according to the L2 layer primary positioning target pattern to form a primary positioning hole, and measuring the expansion and contraction data of the primary positioning hole to align the L2 layer pattern, the primary positioning target pattern and the primary positioning hole of each individual plate;
4-3) respectively drilling a first-level rivet hole and 1-4 layers of blind holes of the left subarea and a first-level rivet hole and 1-4 layers of blind holes of the right subarea according to the left subarea and the right subarea;
4-4) plating copper in the holes;
4-5) preparing an L4 layer graph according to the same steps as the L2 layer, wherein the positions of a primary target graph contained in the L4 layer graph and the positions of target graphs of the L2 layer and the L3 layer are not overlapped, and the layer is distinguished;
4-6) the L4 layer pattern is positioned in the 1-4 blind hole and the exposed part of the periphery needing slotting, the local gold plating surface treatment is carried out, and a protective film is pasted.
Preferably, the specific sub-steps of step 5) are as follows:
5-1) respectively drilling a positioning hole and a rivet hole of the left and right subareas of the third core plate according to the data after the expansion and contraction adjustment according to the left and right subareas, and aligning the positioning hole and the rivet hole with the rivet hole of the first-level laminated plate;
5-2) sticking dry films, manufacturing an L5 layer graph according to the data after the expansion and contraction adjustment according to the left and right subareas, and manufacturing the target graph of the L5 layer and the target of the positioning graph layer (comprising the L2 layer and the L4 layer) in a staggered and distinguished mode.
Preferably, the specific sub-steps of step 6) are as follows:
6-1) performing brown/black treatment on the primary laminated board and the third core board, preparing a second laminated bonding sheet, and performing secondary lamination on the blind holes of 1-4 layers corresponding to the blind grooves by using a laser mill to open windows to form a secondary laminated board;
6-2) performing X-ray target drilling according to the primary target graph of the L4 layer to form a secondary positioning hole, measuring the expansion and contraction data of the secondary positioning hole, and drilling the primary positioning hole for positioning a blind slot at the later stage so as to align the graph of the L2 layer with the primary positioning hole and align the graph of the L4 layer with the secondary positioning hole;
6-3) respectively drilling a left partition through hole and a right partition through hole according to the left partition and the right partition and the secondary positioning hole;
6-4) plating copper in the holes;
6-5) sticking dry films, and manufacturing L1 layer and L6 layer graphs according to left and right partition;
6-6) carrying out nickel and gold plating treatment on the whole plate.
Preferably, the specific steps of step 7) are as follows:
7-1) positioning by using a first-level positioning hole, dividing the positioning into a left area and a right area, windowing the positions of the welding metallized holes of the 1-2 layers to expose the protective film, and ensuring that the center of the windowing position is aligned with the center of the position of the welding hole of the graph of the L2 layer;
7-2) positioning by using a secondary positioning hole, dividing the positioning into a left area and a right area, windowing the positions of the 1-4 layers of welded metallized holes to expose the protective film, and ensuring that the center of the windowing position is aligned with the center of the position of the L4 layer of graphic welded holes;
7-3) removing the protective film and the residual adhesive at the bottom of the blind groove to expose the metallized hole pattern bonding pad;
7-4) sticking a dry film, protecting the positions except the blind groove, carrying out alkaline etching operation, and removing the unreliable copper plating layer after secondary copper plating in the blind hole.
The invention also provides an ultralong microwave printed board with the welding holes at the bottom of the blind groove, and the ultralong microwave printed board is manufactured by the manufacturing process.
Compared with the prior art, the invention has the beneficial effects that:
1. the size is large, the problem of size limitation of an LDI exposure machine, a drilling machine and a milling machine can be thoroughly solved by using the partitioned file to be manufactured and then splicing, and the problem that a part of processes added by a graphic machine cannot be manufactured due to size limitation is avoided.
2. When the graphic expansion and shrinkage accumulation is large and the individual difference is large, the positioning holes are used for graded dislocation distinguishing and manufacturing, and each positioning layer and each non-positioning layer are separately identified, so that the problems of target ghosting caused by the expansion and shrinkage and blind groove and blind hole dislocation and deviation caused by further expansion and shrinkage can be thoroughly solved, and the scrapping caused by the dislocation of the interlayer slotted holes is avoided.
3. The inner layer blind hole is locally processed by nickel and gold to be used as an anti-corrosion layer, and unreliable and unqualified secondary copper plating is etched off by alkaline etching after the groove is formed, so that the problems of copper plating delamination and uneven thickness of the blind hole welding hole can be solved, and the quality of the welding hole is ensured.
Drawings
FIG. 1 is a schematic diagram of partition creation of engineering documents according to the present invention.
FIG. 2 is a schematic diagram of a manufacturing process of the present invention.
FIG. 3 is a schematic diagram of the positioning hole and target dislocation grading manufacturing of the present invention, wherein:
0 bit: the positioning holes are primary positioning holes, and each core plate is drilled for drilling rivet holes and positioning 1-2 blind holes;
1 position: the positioning target is a primary positioning target, is manufactured with the L2 layer of graphs on the same layer, is used for X-ray positioning drilling of a primary positioning hole after one-time pressing, and is used for positioning 3-6 layers of blind slotted holes;
2, position: the positioning target is a primary positioning target, is manufactured with the L4 layer of patterns on the same layer, and is used for X-ray positioning drilling of a secondary positioning hole after secondary pressing, and is used for positioning 5-6 layers of blind slotted holes;
x position: the positioning layer is a non-positioning layer target, is manufactured with the L3 layer and the L5 layer at the same layer, and is used for positioning a layer with low requirement on precision. And the subsequent pattern etching is carried out according to the conventional process.
Detailed Description
In order to more clearly illustrate the present invention, the present invention will be described in further detail below with reference to examples and the accompanying drawings. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
Examples
For convenience of description, the technical scheme of the application is explained by taking an ultra-long multi-stage blind slot six-layer plate as an example. The example product comprises 1-2 layers of welded metallized holes, and non-metallized blind grooves are arranged corresponding to 3-6 layers; meanwhile, the metal-plated hole comprises 1-4 layers of welded metallized holes, and non-metallized blind grooves are arranged at the positions corresponding to 5-6 layers. The processing steps and the cautions are as follows:
first, partition making graph and partition machining technology
The size of the printed board is too long, the size limit of the equipment capable of being manufactured can be exceeded during drilling, image sunning and appearance manufacturing, accumulated expansion and shrinkage are too large, the phenomena of hole pattern misalignment and hole groove misalignment are easily caused, when the early engineering document is manufactured, the engineering document can be spliced and manufactured in sections, the large-size document is split into section documents, each section is respectively provided with a positioning hole, and the sections are machined. See figure 1. In this embodiment, the large-size whole project file is split into two sets of project files, namely, a left partition project file and a right partition project file, where the left partition project file is located at A, B, C, D and the right partition project file is located at C, D, E, F.
It should be noted that, because the core board material and the board thickness are different, the expansion and contraction compensation should be given to the drilling and graphic engineering documents according to the material, the board thickness, the process flow and the experience data.
And secondly, a manufacturing step, which comprises the steps of protecting before the lamination of the welding holes, manufacturing the target and the positioning holes in a staggered and graded mode, and locally etching the welding holes after the blind holes are formed, and is shown in figure 2.
1. And manufacturing a first core plate, manufacturing an L2 layer pattern of the first core plate, and locally pasting a protective film. The method comprises the following specific steps:
1) cutting and drilling: and respectively drilling a primary positioning hole, a rivet hole and a 1-2 layers of blind holes of the left subarea of the first core plate according to the left subarea and the right subarea, and manufacturing a primary positioning hole, a rivet hole and a 1-2 layers of blind holes of the right subarea according to a positioning hole (1C, D holes in the figure) of the right end of the left subarea.
2) Plating holes: and finishing copper plating in the holes according to the conventional microwave board hole metallization process.
3) And (3) pattern: and (3) pasting a dry film, measuring the expansion and shrinkage data of the positioning holes in the X direction and the Y direction, adjusting the film data according to the expansion and shrinkage values, and manufacturing an L2 layer pattern containing a primary positioning target pattern according to left and right partitions.
For convenience of description, a layer having a line pattern and corresponding to the slot position is defined as a positioning layer, and a layer having only a shielding pattern or a supporting pattern and having no requirement for accurate positioning of the slot position is defined as a non-positioning layer. Therefore, the L2 layer is a positioning layer, and the corresponding positioning target is a primary positioning target, both of which are fabricated simultaneously. And (3) the manufacturing proposal of the left and right partition patterns uses LDI exposure equipment to respectively carry out two partition exposure operations according to left and right partition positioning holes so as to splice complete patterns. Note that the left and right zoned interfaces are aligned and there may not be an exposed seam. And the subsequent pattern etching is carried out according to the conventional process.
4) Local nickel and gold plating: and (3) carrying out surface treatment on the local nickel-gold plating in and around the blind hole holes of the L2 layer pattern 1-2 layer.
5) Locally pasting a protective film: and (3) grooving exposed parts around the 1-2 layers of blind holes, and performing local protection by using a high-temperature resistant protective film. The protective film can endure a temperature higher than the pressing temperature, and can endure a high temperature of 230 ℃ for more than 6 hours without denaturation. The protective film is manufactured by using a laser mill and is aligned with the centers of the 1-2 layers of blind holes of the first core plate. The high temperature resistant film is tightly bonded with the first core plate by using hot quick pressing or rolling, and can resist the solution erosion in the process.
2. And manufacturing a second core plate, and manufacturing an L3 layer graph of the second core plate, wherein the drilling data and the L3 layer graph data are adjusted according to the expansion and contraction data after the first core plate is manufactured. The method comprises the following specific steps:
1) cutting and drilling: according to the left and right subareas, the positioning holes and the rivet holes of the left and right subareas of the second core plate are respectively drilled according to the data after the expansion and contraction of the first core plate, and are aligned with the rivet holes after the expansion and contraction of the first core plate, so that the left and right subareas of the second core plate are prevented from being misplaced when the rivet is put on.
2) And (3) pattern: and (5) pasting a dry film, and manufacturing an L3 layer graph according to the data after the expansion and contraction are adjusted according to the left and right partitions. Because the L3 layer is a non-positioning layer, in order to prevent the L2 layer and the L3 layer after lamination from causing offset double images due to inconsistent expansion and contraction, which affects the alignment of the drill target and the blind slot, the L3 layer target pattern and the L2 layer are manufactured in a staggered and differentiated manner, as shown in fig. 3.
3. Manufacturing a first-grade laminated board, and manufacturing a first-grade laminated board L4 layer graph, wherein the method comprises the following steps:
1) and (3) laminating: performing brown/black treatment on the first core board and the second core board; preparing a first lamination bonding sheet, and milling a window at the position of the blind groove corresponding to the 1-2 layers of blind holes by using a laser; and carrying out first lamination according to the bonding sheet lamination process requirement to form a first-grade laminated board.
2) Drilling a target: and (4) performing X-ray target drilling according to the primary target pattern of the L2 layer to form a primary positioning hole, and measuring the expansion and contraction data of the primary positioning hole. Due to the large size, the expansion and contraction of each plate after pressing can be different to a certain extent, and the expansion and contraction data are averaged. But can ensure that the L2 layer patterns, the primary target patterns and the primary positioning holes of each individual plate are aligned and are in the same positioning system.
3) Drilling 1-4 layers of blind holes: according to the left and right subareas, a left subarea first-level rivet hole and 1-4 layers of blind holes and a right subarea first-level rivet hole and 1-4 layers of blind holes are respectively drilled according to the first-level positioning holes.
4) Plating holes: and finishing copper plating in the holes according to the conventional microwave board hole metallization process.
5) And (3) pattern: the procedure for making the L4 layer pattern was the same as for the L2 layer, except that the L4 layer pattern contained the target primary target pattern. The primary target pattern is not aligned with the target pattern, and is distinguished as shown in fig. 3.
6) Local gold plating and local protective film pasting: the L4 layer pattern is located in the 1-4 blind hole and the exposed part of the periphery needing slotting, and the local gold plating surface treatment is carried out. The manufacturing steps of the adhesive protective film are the same as the patterns of the L2 layer.
4. And (4) manufacturing a third core plate, and manufacturing an L5 layer graph of the third core plate, wherein the drilling data and the L5 layer graph data are adjusted according to the expansion and contraction data after the first-level laminated plate is manufactured. The method comprises the following specific steps:
1) cutting and drilling: according to the left and right subareas, positioning holes and rivet holes of the left and right subareas of the third core plate are respectively drilled according to the data after the expansion and contraction adjustment and are aligned with the rivet holes of the first-level laminated plate, so that the left and right subareas of the third core plate are prevented from being misplaced when the rivets are put on.
2) And (3) pattern: and (5) pasting a dry film, and manufacturing an L5 layer graph according to the data after the expansion and contraction are adjusted according to the left and right partitions. The L5 layer is also a non-positioning layer, and the target graph of the non-positioning layer is manufactured by dislocation and distinguishing with the targets of the positioning layers such as the L2 layer, the L4 layer and the like. And the subsequent pattern etching is carried out according to the conventional process.
5. And (3) manufacturing a secondary laminated plate (finally), and manufacturing L1 and L6 layer graphs of the secondary laminated plate, wherein the steps are as follows:
1) and (3) laminating: the first-level laminated board and the third core board are subjected to brown/black treatment; preparing a second lamination bonding sheet, and milling a window at the position of the blind groove corresponding to the 1-4 layers of blind holes by using a laser; and carrying out secondary lamination according to the lamination process requirement of the bonding sheet to form a secondary laminated board.
2) Drilling a target: and (4) performing X-ray target drilling according to the primary target pattern of the L4 layer to form a secondary positioning hole, and measuring the expansion and contraction data of the secondary positioning hole. And simultaneously, drilling a first-stage positioning hole for later blind slot positioning. Therefore, the L2 layer pattern and the primary positioning holes can be aligned, and the L4 layer pattern and the secondary positioning holes can be aligned.
3) Drilling a through hole: and respectively drilling a left partition through hole and a right partition through hole according to the left partition and the right partition and the secondary positioning holes.
4) Plating holes: and finishing copper plating in the holes according to the conventional microwave board hole metallization process.
5) And (3) pattern: and (5) pasting a dry film, and manufacturing L1 layer and L6 layer patterns according to left and right partitions by a conventional process. So far, the expansion and contraction accumulation between different individual plates may be inconsistent, and the self-adaptive expansion and contraction of the equipment can be used for positioning by using a secondary positioning hole when the LDI is used for exposure.
6) And (4) plating nickel and gold on the whole board.
6. And (4) carrying out blind slot windowing and local etching treatment. Respectively according to each layer of positioning hole, opening a window to expose the bottom metalized through hole, wherein the specific steps are as follows:
1) and a high-precision depth control mechanical milling machine is used for windowing, and the depth control precision of the equipment is adapted to the thickness box of the protective film.
2) And (3) positioning by using a first-level positioning hole, dividing the positioning into a left area and a right area, windowing the positions of the 1-2 layers of welded metallized holes, exposing the protective film, and ensuring that the center of the windowing position is aligned with the center of the position of the L2 layers of graphical welded holes.
3) And (3) positioning by using a secondary positioning hole, dividing the secondary positioning hole into a left area and a right area, windowing the positions of the 1-4 layers of welded metallized holes, exposing the protective film, and ensuring that the center of the windowing position is aligned with the center of the position of the L4 layer of graphical welded holes.
4) And removing the protective film and the residual glue at the bottom of the blind groove by using a cutter or other tools to expose the metallized hole pattern bonding pad. The operation process is not damaged by the pad and the surface plating layer, so that the welding quality is prevented from being influenced.
5) And (4) pasting a dry film, protecting the positions except the blind groove, and carrying out alkaline etching operation to remove the unreliable copper plating layer after secondary copper plating in the blind hole. Because the 1-2 layers of welded metallized holes and the 1-4 layers of welded metallized holes are subjected to secondary copper plating after primary nickel-gold plating treatment, the secondary copper plating is a blind hole copper plating layer, and the phenomena of poor copper plating quality, uneven thickness (tapered holes) and the like exist, and the plated holes are required to be removed by etching.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all the embodiments of the present invention are not exhaustive, and all the obvious variations or modifications which are introduced in the technical scheme of the present invention are within the scope of the present invention.
Claims (10)
1. A manufacturing process of an ultralong microwave printed board with welding holes at the bottom of a blind groove comprises the following steps:
1) splitting a large-size project file into a left partition project file and a right partition project file, wherein each partition is provided with a positioning hole, and machining is carried out on the partitions;
2) manufacturing a first core board, wherein the first core board comprises an L1 layer and an L2 layer, manufacturing 1-2 layers of metallized blind holes, an L2 layer of graphs and a primary positioning target of the first core board according to left and right partitions, and locally plating nickel gold in and around the blind holes of the L2 layer of graphs and sticking a protective film;
3) manufacturing a second core board, wherein the second core board comprises L3 layers and L4 layers, manufacturing L3 layer graphs of the second core board according to left and right partitions, adjusting data of the L3 layer graphs according to expansion and contraction data after the first core board is manufactured, and manufacturing L3 layer target graphs and L2 layer target graphs in a staggered and differentiated mode;
4) carrying out first lamination on the first core plate and the second chip to form a first-stage laminated plate, manufacturing 1-4 layers of metallized blind holes, L4 layers of graphs and a first-stage positioning target of the first-stage laminated plate according to left and right partitions, wherein the L4 layers of the first-stage positioning target are not overlapped with the L2 layers of primary positioning targets and the L3 layers of target graphs, locally plating gold in and around the blind holes of the L4 layers of graphs, and sticking a protective film;
5) manufacturing a third core board, wherein the third core board comprises an L5 layer and an L6 layer, manufacturing an L5 layer graph of the third core board according to left and right partitions, adjusting the data of the L5 layer graph according to the expansion and shrinkage data after the first-level laminated board is manufactured, and manufacturing the L5 layer target graph and the target of the positioning layer comprising the L2 layer and the L4 layer in a staggered and distinguished mode;
6) carrying out secondary lamination on the first-level laminated plate and the third chip to form a second-level laminated plate, and manufacturing 1-6 layers of through holes and L1 and L6 layers of graphs of the second-level laminated plate according to the left and right partitions;
7) and respectively opening windows according to the positioning holes of the respective layers to expose the bottom metalized through hole, and performing local etching treatment.
2. The manufacturing process of the overlong microwave printed board with the welding holes at the bottom of the blind groove according to claim 1, wherein two subarea exposure operations are respectively carried out according to left and right subarea positioning holes by using LDI exposure equipment to splice a complete circuit pattern; and (4) respectively carrying out two-subarea drilling and appearance operation according to the left and right subarea positioning holes by using a drilling and milling machine device, and splicing a complete machining graph.
3. The manufacturing process of the overlength microwave printed board with the welding holes at the bottom of the blind slot according to claim 1, wherein the specific sub-steps of the step 2) are as follows:
2-1) respectively drilling a left subarea primary positioning hole, a rivet hole and 1-2 layers of blind holes of the first core plate according to the left subarea and the right subarea, and manufacturing a right subarea primary positioning hole, a rivet hole and 1-2 layers of blind holes according to a left subarea and a right subarea positioning hole;
2-2) plating copper in the holes;
2-3) sticking a dry film, measuring the expansion and contraction data of the positioning holes in the X direction and the Y direction, adjusting the film data according to the expansion and contraction values, and manufacturing an L2 layer pattern and a primary positioning target pattern on the layer according to left and right partitions;
2-4) the L2 layer of patterns are positioned in the blind hole of the 1-2 layers of patterns and the exposed part of the periphery needing slotting, and the surface treatment of local nickel and gold plating is carried out;
2-5) grooving the exposed part around the 1-2 layers of blind holes, and performing local protection by using a high-temperature resistant protective film.
4. The manufacturing process of the overlength microwave printed board with the welding holes at the bottom of the blind groove according to claim 3, characterized in that the high temperature resistant protective film has a temperature resistance higher than the pressing temperature and can resist the high temperature of 230 ℃ for more than 6 hours; the high-temperature resistant protective film is manufactured by using a laser mill and is aligned with the centers of the 1-2 layers of blind holes of the first core plate; and (3) bonding the high-temperature resistant protective film and the first core plate tightly by using hot quick pressing or rolling.
5. The manufacturing process of the overlength microwave printed board with the welding holes at the bottom of the blind slot according to claim 3, is characterized in that the specific steps of the step 3) are as follows:
3-1) respectively drilling a positioning hole and a rivet hole of the left and right subareas of the second core plate according to the data of the expanded and contracted first core plate according to the left and right subareas, and aligning the positioning hole and the rivet hole with the expanded and contracted first core plate;
3-2) sticking dry films, and manufacturing an L3 layer graph according to the data after adjusting the expansion and contraction according to the left and right partitions, wherein the L3 layer target graph and the L2 layer are manufactured in a staggered and differentiated mode.
6. The manufacturing process of the overlength microwave printed board with the welding holes at the bottom of the blind slot according to claim 5, wherein the specific sub-steps of the step 4) are as follows:
4-1) carrying out brown/black treatment on the first core board and the second core board; preparing a first-time laminating bonding sheet, and performing first-time laminating by using laser milling to open a window at the position of the blind groove corresponding to the 1-2 layers of blind holes to form a first-level laminated plate;
4-2) carrying out X-ray target drilling according to the L2 layer primary positioning target pattern to form a primary positioning hole, and measuring the expansion and contraction data of the primary positioning hole to align the L2 layer pattern, the primary positioning target pattern and the primary positioning hole of each individual plate;
4-3) respectively drilling a first-level rivet hole and 1-4 layers of blind holes of the left subarea and a first-level rivet hole and 1-4 layers of blind holes of the right subarea according to the left subarea and the right subarea;
4-4) plating copper in the holes;
4-5) preparing an L4 layer graph according to the same steps as the L2 layer, wherein the positions of a primary target graph contained in the L4 layer graph and the positions of target graphs of the L2 layer and the L3 layer are not overlapped, and the layer is distinguished;
4-6) the L4 layer pattern is positioned in the 1-4 blind hole and the exposed part of the periphery needing slotting, the local gold plating surface treatment is carried out, and a protective film is pasted.
7. The manufacturing process of the overlength microwave printed board with the welding holes at the bottom of the blind slot according to claim 6, is characterized in that the specific steps of the step 5) are as follows:
5-1) respectively drilling a positioning hole and a rivet hole of the left and right subareas of the third core plate according to the data after the expansion and contraction adjustment according to the left and right subareas, and aligning the positioning hole and the rivet hole with the rivet hole of the first-level laminated plate;
5-2) sticking dry films, manufacturing an L5 layer graph according to the data after the expansion and contraction adjustment according to the left and right partitions, and manufacturing the target graph of the L5 layer and the target of the positioning graph layer in a staggered and distinguished mode.
8. The manufacturing process of the overlength microwave printed board with the welding holes at the bottom of the blind slot according to claim 7, is characterized in that the specific sub-steps of the step 6) are as follows:
6-1) performing brown/black treatment on the primary laminated board and the third core board, preparing a second laminated bonding sheet, and performing secondary lamination on the blind holes of 1-4 layers corresponding to the blind grooves by using a laser mill to open windows to form a secondary laminated board;
6-2) performing X-ray target drilling according to the primary target graph of the L4 layer to form a secondary positioning hole, measuring the expansion and contraction data of the secondary positioning hole, and drilling the primary positioning hole for positioning a blind slot at the later stage so as to align the graph of the L2 layer with the primary positioning hole and align the graph of the L4 layer with the secondary positioning hole;
6-3) respectively drilling a left partition through hole and a right partition through hole according to the left partition and the right partition and the secondary positioning hole;
6-4) plating copper in the holes;
6-5) sticking dry films, and manufacturing L1 layer and L6 layer graphs according to left and right partition;
6-6) carrying out nickel and gold plating treatment on the whole plate.
9. The manufacturing process of the overlength microwave printed board with the welding holes at the bottom of the blind slot according to claim 8, wherein the specific steps of the step 7) are as follows:
7-1) positioning by using a first-level positioning hole, dividing the positioning into a left area and a right area, windowing the positions of the welding metallized holes of the 1-2 layers to expose the protective film, and ensuring that the center of the windowing position is aligned with the center of the position of the welding hole of the graph of the L2 layer;
7-2) positioning by using a secondary positioning hole, dividing the positioning into a left area and a right area, windowing the positions of the 1-4 layers of welded metallized holes to expose the protective film, and ensuring that the center of the windowing position is aligned with the center of the position of the L4 layer of graphic welded holes;
7-3) removing the protective film and the residual adhesive at the bottom of the blind groove to expose the metallized hole pattern bonding pad;
7-4) sticking a dry film, protecting the positions except the blind groove, carrying out alkaline etching operation, and removing the unreliable copper plating layer after secondary copper plating in the blind hole.
10. An overlength microwave printed board with welding holes at the bottom of a blind groove is manufactured by the manufacturing process of the overlength microwave printed board with welding holes at the bottom of the blind groove according to any one of claims 1 to 9.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114055087A (en) * | 2021-11-22 | 2022-02-18 | 上海第二工业大学 | Precise manufacturing process and assembling clamp for high-aspect-ratio group narrow groove |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114055087A (en) * | 2021-11-22 | 2022-02-18 | 上海第二工业大学 | Precise manufacturing process and assembling clamp for high-aspect-ratio group narrow groove |
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