CN113663871B - IC card chip filling equipment with uniform glue coating - Google Patents
IC card chip filling equipment with uniform glue coating Download PDFInfo
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- CN113663871B CN113663871B CN202110958800.4A CN202110958800A CN113663871B CN 113663871 B CN113663871 B CN 113663871B CN 202110958800 A CN202110958800 A CN 202110958800A CN 113663871 B CN113663871 B CN 113663871B
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- glue
- rubber
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- plate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
- B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
Abstract
The invention discloses an IC card chip filling device with uniform glue coating, which belongs to the field of chip filling and comprises a glue coating device, a suction device and a plate to be filled, wherein the glue coating device comprises a supporting seat, a supporting plate, a swinging mechanism and a glue coating mechanism, the glue coating mechanism comprises a rotating shaft, a guide wheel, a ball seat, a glue dripping tube, an adjusting plate, an adjusting block and a glue storage cavity, the hanging end of the supporting plate is connected with the rotating shaft through a bearing, the rotating shaft is sequentially provided with a motor, the adjusting plate, a glue storage cavity and the guide wheel from top to bottom, the hanging end of the adjusting plate is movably sleeved with the adjusting block, the lower end of the adjusting block is connected with the glue dripping tube through a pin shaft, the lower end of the glue dripping tube is provided with the ball seat, the glue storage cavity comprises a glue guide upper cavity, a glue guide lower cavity, a sealing ring, a deflector rod, a glue inlet tube and a glue outlet tube, the filling stability of an IC card chip is increased under the condition of the same glue coating amount, and the accuracy of the gluing position is ensured, and meanwhile, the filling efficiency of the IC card chip is improved.
Description
Technical Field
The invention relates to the field of chip filling, in particular to an IC card chip filling device with uniform glue.
Background
Along with the development of science and technology, electronic products are more and more advanced and smaller in size, the development of the electronic products mainly lies in the use of a large number of IC card chips, and the IC is formed by placing an integrated circuit formed by a large number of microelectronic components (transistors, resistors, capacitors and the like) on a plastic substrate to form a chip. Because the electronic chip is extremely small in size, the electronic chip needs to be encapsulated by epoxy ester before use, but before encapsulation, the electronic chip needs to be fixed in a board to be filled with the IC card chip by glue dispensing so as to be used for the IC card chip. The IC card chip filling process generally comprises a glue coating device, a suction device and a board to be filled for filling the chip, wherein after glue is coated on a specific position on the board to be filled through the glue coating device, the chip is pressed into the glue coating position through the suction device so as to fill the chip.
The existing chip filling device sprays similar point-like glue solution on one side of a chip filling position on a board to be filled through a gluing mechanism, then drives a chip to be pressed into the glue solution position through a suction device to fill the chip on the board to be filled, the chip is easy to fall off due to weak uncured adhesive property of a glue surface in the glue pressing process, and the unqualified gluing position needs to be manually searched for glue filling.
Disclosure of Invention
1. Technical problem to be solved
The invention aims to provide the IC card chip filling equipment with uniform glue coating, which can effectively solve the problems that the chip is easy to fall off from a board to be filled and the glue coating position is not accurate due to a point glue injection mode of glue solution in the chip filling process.
2. Technical scheme
In order to solve the problems, the invention adopts the following technical scheme:
an even IC-card chip of rubber coating loads equipment, includes rubber coating device, suction means, treats and loads board and pump sending and scribbles the glue solution to the rubber coating device's rubber inlet pipe, suction means absorbs the IC-card chip by pneumatic actuator control, the rubber coating device includes supporting seat, backup pad, swing mechanism and daub mechanism, daub mechanism includes pivot, leading wheel, ball seat, rubber dripping pipe, adjusting plate, regulating block and deposit gluey chamber, the backup pad hangs the end and is connected with the pivot through the bearing, be equipped with motor, adjusting plate, deposit gluey chamber and leading wheel from last to down in proper order in the pivot, adjusting plate hangs the end activity and cup joints the regulating block, the tip is connected with rubber dripping pipe through the round pin axle under the regulating block, rubber dripping pipe tip is equipped with the ball seat down, deposit gluey chamber including leading gluey epicoele, leading gluey lower chamber, sealing washer, driving lever, rubber inlet pipe and play gluey pipe, lead gluey epicoele and lead gluey lower chamber and pass through the bearing connection, a deflector rod is arranged at the upper end part of the upper cavity of the rubber guide upper cavity, a rubber inlet pipe and a rubber outlet pipe are respectively arranged on the upper cavity of the rubber guide and the lower cavity of the rubber guide, and the sealing ring is arranged between the upper cavity of the rubber guide and the lower cavity of the rubber guide;
the swing mechanism comprises a push plate, a connecting piece and a limiting pin, a sliding groove is formed in the supporting plate, the limiting pin is movably connected in the sliding groove and is connected with the push plate through the connecting piece, an air cylinder is arranged at the rear end of the supporting seat, and the output end of the air cylinder is connected with the push plate.
Preferably, a T-shaped groove is formed in the lower end of the supporting seat, a sliding block is connected in the T-shaped groove in a sliding mode, and the sliding block is fixed on the supporting plate.
Preferably, the connecting piece passes the supporting seat, and the left end and the right end of the connecting piece are respectively and movably connected with a limiting pin and a push plate.
Preferably, the glue storage cavity and the glue dripping pipe are connected through a glue outlet pipe.
Preferably, the outer side surface of the rolling ball seat is provided with a rolling ball movably connected to the guide wheel.
Preferably, the adjusting plate is provided with a plurality of limit holes which are orderly arranged, and limit bolts are movably connected in the limit holes.
Preferably, the adjusting plate and the adjusting block can be fixed by a limiting bolt.
Preferably, the glue guiding lower cavity is movably sleeved on the glue guiding upper cavity, and the lower end part of the glue guiding lower cavity is conical.
Preferably, the rotating shaft is divided into two sections which are arranged at the upper end part and the lower end part of the glue storage cavity, and the rotating shaft is connected with the glue guide lower cavity through a bearing.
3. Advantageous effects
(1) The invention can make the rotating shaft drive the guide wheel to rotate under the action of the motor by installing the structures of the adjusting plate, the adjusting block, the glue dripping pipe, the guide wheel, the glue storage cavity, the ball rolling seat and the like, at the moment, the glue dripping pipe rotates by taking the rotating shaft as the center, the glue solution in the glue dripping pipe is smeared on the plate to be filled, the smearing track of the glue solution is in a ring shape, the adjusting block is slid to be positioned at different positions on the adjusting plate (because the adjusting plate is provided with a plurality of apertures with different intervals, the aperture is calculated according to the specification of the IC card chip) and the adjusted position is fixed by the limiting bolt, the included angle between the glue dripping pipe and the rotating shaft is changed, the size of the ring-shaped track of the glue solution can be adjusted, the glue injecting track of the chip in a similar circle shape is changed into the ring shape, the same glue spreading amount can increase the adsorption range between the IC card chip and the plate to be filled, the fixing firmness of the chip and the plate to be filled is improved, and the using effect of the chip is ensured.
(2) According to the invention, by installing the push plate, the cylinder, the connecting piece and the limiting pin, after one side of the IC card chip groove on the plate to be filled is coated with glue, the push plate can be driven to move forwards and backwards through the pushing action of the cylinder, and the connecting piece rotates around the joint of the connecting piece and the supporting seat due to the pin shaft connection mode of the push plate and the connecting piece, at the moment, the limiting pin slides in the sliding groove of the supporting plate to push the supporting plate to move forwards and backwards for a specific distance, and the glue dripping state of the glue dripping pipe at each time can be ensured to be consistent by sliding the sliding block on the supporting plate in the groove of the supporting seat, so that the small-stroke cylinder can be realized, the accuracy of the glue coating position is ensured, and the filling efficiency of the IC card chip is improved.
(3) According to the invention, the upper glue guide cavity, the lower glue guide cavity, the sealing ring, the glue inlet pipe, the glue outlet pipe and the deflector rod are arranged, the deflector rod is arranged in the upper glue guide cavity, when the lower glue guide cavity rotates around the rotating shaft along with the glue dripping pipe, glue liquid in the lower glue guide cavity generates rotational flow and continuously collides with the deflector rod, the deflector rod is provided with a plurality of inclined deflector teeth, the inclination angles of the deflector teeth are different, the solidification of the glue liquid can be effectively avoided, the smearing effect of the glue liquid is ensured, the length of the upper glue guide cavity is smaller than that of the lower glue guide cavity, the glue liquid is completely placed in the lower glue guide cavity after entering the lower glue guide cavity through the glue inlet pipe, the situation of glue liquid seepage can be avoided in the rotating gluing process of the glue dripping pipe, and unnecessary waste of the glue liquid is avoided.
Drawings
FIG. 1 is a schematic view of a flow structure of an IC card chip filling apparatus for uniformly applying glue according to the present invention;
FIG. 2 is a schematic diagram of a glue applying structure of an IC card chip loading apparatus for applying glue uniformly according to the present invention;
FIG. 3 is another schematic view of a glue applying structure of an IC card chip loading apparatus for applying glue uniformly according to the present invention;
FIG. 4 is a schematic view of a partial structure of an IC card chip packing apparatus of the present invention with uniform glue;
FIG. 5 is a schematic cross-sectional view of a glue dripping tube of an IC card chip filling apparatus for uniformly applying glue according to the present invention;
FIG. 6 is a schematic diagram of a filling board of the IC card chip filling apparatus of the present invention with uniform glue.
Reference numerals: 1. a gluing device; 101. a supporting seat; 2. a suction device; 3. filling a plate; 4. a support plate; 5. a swing mechanism; 51. pushing the plate; 52. a connecting member; 53. a spacing pin; 54. a cylinder; 6. a glue applying mechanism; 61. a rotating shaft; 62. a guide wheel; 63. a ball rolling seat; 64. a rubber dripping pipe; 65. an adjustment plate; 66. an adjusting block; 67. a motor; 68. a limit bolt; 7. a glue storage cavity; 71 a glue guiding upper cavity; 72. a lower cavity for guiding glue; 73. a seal ring; 74. feeding a rubber tube; 75, discharging the rubber pipe; 76. a deflector rod; 8. a chute; 9. a slide block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, an embodiment of the present invention is shown: the utility model provides a uniform IC-card chip of rubber coating loads equipment, includes rubber coating device 1, suction means 2, treats and loads board 3 and pump sending and scribble the glue solution to rubber coating device 1 advances the rubber tube 74, suction means 2 is by pneumatic executive component control absorption IC-card chip, and pneumatic executive component is by solenoid valve controlled cylinder assembly to the opportunity of opening and closing can be controlled through the industrial personal computer to the solenoid valve makes suction means to IC-card chip and the cooperation of penetrating of rubber coating device.
As shown in fig. 6, in order to improve the fixing stability of the IC card chip and the board 3 to be loaded, the IC card chip and the board 3 to be loaded are fixed by two glue applying modes, a black arc position in fig. 6 is a glue applying position of the glue dropping tube 64, the glue applying device 1 includes a supporting seat 101, a supporting plate 4, a swinging mechanism 5 and a glue applying mechanism 6, a T-shaped groove is arranged at the lower end of the supporting seat 101, a sliding block 9 is connected in the T-shaped groove in a sliding manner, and the sliding block 9 is fixed on the supporting plate 4. By arranging the slide block 9 in the T-shaped groove at the lower end part of the support seat 101, the glue dripping pipe 64 can be always in the same state after the gluing positions at two sides are changed, and the glue solution track after glue dripping is not changed due to the change of the gluing positions;
the daub mechanism 6 includes pivot 61, leading wheel 62, rolling ball seat 63, rubber dripping pipe 64, adjusting plate 65, regulating block 66 and deposit gluey chamber 7, as shown in fig. 5, wherein, pivot 61 includes semi-axis and lower semi-axis, and last semi-axis is fixed in through the bearing and leads on gluey epicoele 71, and lower semi-axis is fixed in and leads on gluey cavity 72, and lower semi-axis and lead the inside contactless of gluey cavity 72, deposit gluey chamber 7 and locate between semi-axis and the lower semi-axis, pivot 61 divide into two sections and locate and deposit gluey chamber 7 tip from top to bottom, and pass through the bearing connection between pivot 61 and the gluey chamber 71 of leading. The end is hung out through the bearing to backup pad 4 is connected with pivot 61, and backup pad 4's setting can play the effect of support to daub mechanism 6, be equipped with motor 67, adjusting plate 65, deposit gluey chamber 7 and leading wheel 62 from last to down in proper order in pivot 61, motor 67 is step motor, and motor 67 passes through the wire and is connected with the step motor controller, through setting up step motor parameter, makes it realize that motor 67 rotates the round after, stops the certain time, rotatory round again, at motor 67 stall clearance, cylinder 54 promotes push pedal 51, makes the glue dripping pipe 64 glue dripping position change, and degree of automation is high, makes the efficiency of packing of IC-card chip obtain showing and promotes.
The adjusting plate 65 is provided with a plurality of limit holes which are orderly arranged, and limit bolts 68 are movably connected in the limit holes. The limiting bolt 68 is inserted on the adjusting plate 65, the limiting bolt 68 is connected with the adjusting block 66 through threads, the adjusting block 66 is approximately U-shaped, the adjusting plate 65 can be held by the adjusting block 66, the limiting bolt 68 is assisted to achieve the fixing effect of the glue dripping pipe 64, the lower end of the adjusting block 66 is provided with a support lug seat connected with the glue dripping pipe 64, a hinge pin is arranged at the joint of the support lug seat and the glue dripping pipe 64, when the adjusting block 66 slides on the adjusting plate 65, the included angle between the glue dripping pipe 64 and the rotating shaft 61 can be changed, the size of the circular track of glue solution is adjusted, the circular glue injection track similar to the IC card chip is changed into a circular shape, the same glue coating amount can increase the adsorption range of the IC card chip and the plate 3 to be filled, the fixing firmness of the chip and the plate 3 to be filled is improved, and the using effect of the chip is guaranteed.
After the position of the glue dripping pipe 64 is determined, the position of the glue dripping pipe 64 after adjustment can be fixed through a limiting bolt 68, and the adjusting plate 65 and the adjusting block 66 can be fixed through the limiting bolt 68. Adjusting block 66 is cup jointed in adjusting plate 65 outstanding end activity, there is rubber dripping pipe 64 tip under the adjusting block 66 through the round pin hub connection, and rubber dripping pipe 64 communicates with depositing gluey chamber 7 through rubber outlet pipe 75, rubber dripping pipe 64 tip is equipped with ball seat 63 down, and ball seat 63 includes ring seat and spin, the spin is embedded in the lateral surface of ring seat, and the shaping can be adopted by ball seat 63's processing mode to pour, has guaranteed the stability of being connected of spin with the ring seat, ball seat 63 lateral surface is equipped with swing joint in the spin on leading wheel 62. The swing joint mode of ball seat 63 and leading wheel 62 can play and be connected the rubber dripping pipe 64 with pivot 61 simultaneously, still can not influence the effect of coming the contained angle regulation to rubber dripping pipe 64 and pivot 61 through regulating block 66, in the contained angle regulation process to rubber dripping pipe 64 and pivot 61, the spin on ball seat 63 takes place the motion along the axial of pivot 61 in leading wheel 62, deposit gluey chamber 7 including leading gluey upper chamber 71, leading gluey cavity 72, sealing washer 73, driving lever 76, advance rubber tube 74 and play rubber tube 75, lead gluey cavity 71 and lead gluey cavity 72 and pass through the bearing and connect, it is equipped with driving lever 76 to lead gluey upper chamber 71 inner chamber upper end, driving lever 76 is fixed to be welded inside leading gluey cavity 71, sets up a plurality of group tooth on driving lever 76, when rubber dripping pipe 64 drives and leads gluey cavity 72 and rotates around pivot 61, the inside glue solution of leading gluey cavity 72 takes place the whirl along with leading gluey 72, the rubber storage cavity 7 and the rubber dropping tube 64 are connected through the rubber outlet tube 75, a rubber inlet tube 74 and a rubber outlet tube 75 are respectively arranged on the rubber guide upper cavity 71 and the rubber guide lower cavity 72, the rubber inlet tube 74 is connected with a rubber supply device and can continuously provide rubber liquid, the sealing ring 73 is arranged between the rubber guide upper cavity 71 and the rubber guide lower cavity 72, a bearing arranged between the rubber guide upper cavity 71 and the rubber guide lower cavity 72 is arranged at the upper end part of the rubber storage cavity 7 formed by the rubber guide upper cavity 71 and the rubber guide lower cavity 72;
swing mechanism 5 includes push pedal 51, connecting piece 52 and spacer pin 53, push pedal 51 is "L" font, and push pedal 51 is fixed in the output of cylinder 54, and under cylinder 54 concertina action, can make connecting piece 52 promote backup pad 4 seesaw, come the rubber coating position change on treating the packing plate 3, be equipped with spout 8 on the backup pad 4, the groove width of spout 8 is greater than spacer pin 53's external diameter, and spacer pin 53 is "worker" font, swing joint has spacer pin 53 in the spout 8, spacer pin 53 passes through connecting piece 52 and is connected with push pedal 51, the tip is equipped with cylinder 54 behind supporting seat 101, the cylinder 54 output is connected with push pedal 51. The connecting piece 52 penetrates through the supporting seat 101, and the left end and the right end of the connecting piece 52 are respectively movably connected with a limiting pin 53 and a push plate 51. The glue guiding lower cavity 72 is movably sleeved on the glue guiding upper cavity 71, the lower end part of the glue guiding lower cavity 72 is conical, glue can be discharged conveniently, the rotating shaft 61 is arranged on the outer sides of the glue guiding upper cavity 71 and the glue guiding lower cavity 72, a sealing ring 73 is arranged between the glue guiding upper cavity 71 and the glue guiding lower cavity 72, when the glue guiding upper cavity 71 and the glue guiding lower cavity 72 rotate relatively, the effect of sealing glue liquid can be guaranteed, the liquid level of the glue liquid entering the glue storage cavity 7 is lower than the position of the sealing ring 73, namely, most of the glue liquid is inside the glue guiding lower cavity 72 after the glue liquid enters the glue storage cavity 7.
The working principle is as follows: the IC card chip filling equipment with uniform glue coating comprises a board 3 to be filled, a suction device 2 arranged above the board 3 to be filled, a motor 67 started during use, glue in a glue dripping pipe 64 dripped into a glue coating position on one side of the board 3 to be filled in a ring shape along with the rotation of the glue dripping pipe 64 under the action of the motor 67, the motor 67 stops after the glue coating is finished, at the moment, an air cylinder 54 starts to work to push a push plate 51 to move backwards along a support seat 101, the connecting piece 52 drives a limit pin 53 to rotate anticlockwise around a connecting pin shaft of the connecting piece 52 and the support seat 101, due to the rotation of the limit pin 53, a support plate 4 is pushed to move in a direction opposite to the moving direction of the push plate 51, the glue dripping pipe 64 is changed from the glue coating position on one side of the board 3 to the glue coating position on the other side, and the glue coating is carried out through the glue dripping pipe 64 again, when the circular track of the glue solution needs to be adjusted, the limiting bolt 68 for connecting the adjusting block 66 and the adjusting plate 65 is taken down, the adjusting block 66 is slid, the adjusting block 66 moves towards one side close to the rotating shaft 61, the circular track of the glue solution is increased, and the circular track of the glue solution is reduced when the adjusting block 66 moves towards one side of the rotating shaft 61 in principle in the same manner.
It should be understood by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be used as a limitation of the present invention, and that changes and modifications to the above embodiments are within the scope of the claims of the present invention as long as they are within the spirit and scope of the present invention.
Claims (9)
1. The utility model provides an even IC-card chip of rubber coating loads equipment, includes rubber coating device (1), suction means (2), treats packing plate (3) and pump sending rubber coating liquid to rubber coating device (1) advance rubber tube (74), suction means (2) are by pneumatic executive component control absorption IC-card chip, its characterized in that: rubber coating device (1) is including supporting seat (101), backup pad (4), swing mechanism (5) and daub mechanism (6), daub mechanism (6) are including pivot (61), leading wheel (62), spin seat (63), glue dripping pipe (64), adjusting plate (65), regulating block (66) and deposit gluey chamber (7), backup pad (4) are hung the end and are connected with pivot (61) through the bearing, pivot (61) are gone up and are equipped with motor (67), adjusting plate (65) down in proper order, deposit gluey chamber (7) and leading wheel (62), adjusting plate (65) are hung the end activity and are cup jointed regulating block (66), there is glue dripping pipe (64) tip under adjusting block (66) through the round pin hub connection, the tip is equipped with spin seat (63) under glue dripping pipe (64), deposit gluey chamber (7) including leading gluey epicoele (71), lead gluey lower chamber (72) down, The rubber guide device comprises a sealing ring (73), a shifting rod (76), a rubber inlet pipe (74) and a rubber outlet pipe (75), wherein the rubber guide upper cavity (71) and the rubber guide lower cavity (72) are connected through a bearing, the shifting rod (76) is arranged at the upper end part of the inner cavity of the rubber guide upper cavity (71), the rubber inlet pipe (74) and the rubber outlet pipe (75) are respectively arranged on the rubber guide upper cavity (71) and the rubber guide lower cavity (72), and the sealing ring (73) is arranged between the rubber guide upper cavity (71) and the rubber guide lower cavity (72);
swing mechanism (5) include push pedal (51), connecting piece (52) and spacer pin (53), be equipped with spout (8) on backup pad (4), swing joint has spacer pin (53) in spout (8), spacer pin (53) are connected with push pedal (51) through connecting piece (52), supporting seat (101) rear end is equipped with cylinder (54), cylinder (54) output is connected with push pedal (51).
2. An even adhesive dispensing IC card chip loading apparatus as claimed in claim 1, wherein said support base (101) has a T-shaped slot at its lower end, a slider (9) is slidably engaged in said T-shaped slot, and said slider (9) is fixed to said support plate (4).
3. The IC card chip packing apparatus of claim 1, wherein the connecting member (52) passes through the support base (101), and the left and right ends of the connecting member (52) are movably connected with a spacing pin (53) and a push plate (51), respectively.
4. A device for filling an even adhesive IC card chip according to claim 1, wherein the adhesive storage chamber (7) and the adhesive dripping tube (64) are connected by an adhesive outlet tube (75).
5. An even adhesive dispensing IC card chip filling apparatus as claimed in claim 1, wherein the roller seat (63) is provided with a roller ball on its outer side for movably connecting to the guide wheel (62).
6. The IC card chip filling device with uniform glue spreading as recited in claim 1, wherein the adjusting plate (65) is provided with a plurality of regularly arranged limiting holes, and limiting bolts (68) are movably connected in the limiting holes.
7. A uniform paste applying IC card chip loading apparatus as claimed in claim 6, wherein said adjusting plate (65) and adjusting block (66) can be fixed by a limit bolt (68).
8. The IC card chip packing apparatus with uniform glue spreading as claimed in claim 1, wherein the glue guiding lower cavity (72) is movably sleeved on the glue guiding upper cavity (71), and the lower end of the glue guiding lower cavity (72) is conical.
9. The IC card chip filling device for uniformly gluing according to claim 1, wherein the rotating shaft (61) is divided into two sections which are arranged at the upper end and the lower end of the glue storage cavity (7), and the rotating shaft (61) and the glue guide lower cavity (72) are connected through a bearing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110958800.4A CN113663871B (en) | 2021-08-16 | 2021-08-16 | IC card chip filling equipment with uniform glue coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110958800.4A CN113663871B (en) | 2021-08-16 | 2021-08-16 | IC card chip filling equipment with uniform glue coating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113663871A CN113663871A (en) | 2021-11-19 |
| CN113663871B true CN113663871B (en) | 2022-03-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110958800.4A Active CN113663871B (en) | 2021-08-16 | 2021-08-16 | IC card chip filling equipment with uniform glue coating |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114589031B (en) * | 2021-12-07 | 2023-03-21 | 杭州速博雷尔传动机械有限公司 | Self-centering gluing device |
| CN114618748B (en) * | 2022-01-22 | 2023-03-10 | 红塔烟草(集团)有限责任公司 | Be used for cold and hot glue composite set of tobacco bale trademark paper spraying |
| CN114653533B (en) * | 2022-02-28 | 2022-12-02 | 江苏奥斯力特电子科技有限公司 | Fixed point mucilage binding of resonant piece is put among quartz crystal syntonizer |
| CN115569807B (en) * | 2022-10-18 | 2023-05-30 | 东莞鹏龙光电有限公司 | Production device for producing battery cover plate |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB723736A (en) * | 1952-07-24 | 1955-02-09 | Book Machinery Company Ltd | Improvements in synthetic glue applying means for bookbinding |
| CN104576464A (en) * | 2015-01-30 | 2015-04-29 | 日月光半导体（昆山）有限公司 | Equipment and method for packaging semiconductors, and sprayer of equipment |
| AT515471A2 (en) * | 2015-06-05 | 2015-09-15 | Seibersdorf Labor Gmbh | container |
| CN208146303U (en) * | 2018-01-20 | 2018-11-27 | 梵利特智能科技（苏州）有限公司 | A kind of card automatic glue application hot-press arrangement |
| CN111318423A (en) * | 2020-03-20 | 2020-06-23 | 施索 | Port gluing device for pipeline connection and use method thereof |
| CN111545406A (en) * | 2020-05-18 | 2020-08-18 | 上海艾斯迪克汽车装备制造有限公司 | Gluing equipment for bonding automobile parts |
| CN112275527A (en) * | 2020-10-30 | 2021-01-29 | 南京杉青陶商贸有限公司 | Avoid extravagant rubber coating device for TV set LCD screen assembly process of glue solution |
-
2021
- 2021-08-16 CN CN202110958800.4A patent/CN113663871B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB723736A (en) * | 1952-07-24 | 1955-02-09 | Book Machinery Company Ltd | Improvements in synthetic glue applying means for bookbinding |
| CN104576464A (en) * | 2015-01-30 | 2015-04-29 | 日月光半导体（昆山）有限公司 | Equipment and method for packaging semiconductors, and sprayer of equipment |
| AT515471A2 (en) * | 2015-06-05 | 2015-09-15 | Seibersdorf Labor Gmbh | container |
| CN208146303U (en) * | 2018-01-20 | 2018-11-27 | 梵利特智能科技（苏州）有限公司 | A kind of card automatic glue application hot-press arrangement |
| CN111318423A (en) * | 2020-03-20 | 2020-06-23 | 施索 | Port gluing device for pipeline connection and use method thereof |
| CN111545406A (en) * | 2020-05-18 | 2020-08-18 | 上海艾斯迪克汽车装备制造有限公司 | Gluing equipment for bonding automobile parts |
| CN112275527A (en) * | 2020-10-30 | 2021-01-29 | 南京杉青陶商贸有限公司 | Avoid extravagant rubber coating device for TV set LCD screen assembly process of glue solution |
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| CN113663871A (en) | 2021-11-19 |
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