CN113660842A

CN113660842A - Shielding film with radiation heat dissipation function and manufacturing method thereof

Info

Publication number: CN113660842A
Application number: CN202110831990.3A
Authority: CN
Inventors: 夏超华
Original assignee: Suzhou Xinguangyi Electronics Co ltd
Current assignee: Suzhou Xinguangyi Electronics Co ltd
Priority date: 2021-07-22
Filing date: 2021-07-22
Publication date: 2021-11-16

Abstract

The invention discloses a shielding film with a radiation heat dissipation function, and relates to a shielding film for a flexible circuit board, which comprises a transfer film, and an insulating layer, a radiation heat dissipation layer, a conductive shielding layer and a conductive adhesive layer which are sequentially laminated on the transfer film, or an insulating heat dissipation layer, a radiation heat dissipation layer, a conductive shielding layer and a conductive adhesive layer which are sequentially laminated on the transfer film. Compared with the prior art, this application can help equipment to see through the radiation mode and accelerate the effluvium of heat energy and still have the highest temperature that good soaking effect reduced equipment, can also prevent simultaneously that the heat energy from gathering at the shielding film and making becoming the shielding film ageing.

Description

Shielding film with radiation heat dissipation function and manufacturing method thereof

Technical Field

The present invention relates to a shielding film for a flexible circuit board.

Background

With the development of modern science and technology, various digital and high-frequency electronic and electric equipment generate a large amount of heat during working and radiate a large amount of electromagnetic waves to the space. Meanwhile, electronic components are also developing towards miniaturization, light weight and high-density integration, the heat generated by equipment is more and more, but the space is more and more reduced, the heat is not easy to dissipate, the temperature of the equipment is higher and higher, the working efficiency of the equipment is reduced, and even the equipment is damaged.

A current shielding film for a flexible wiring board is generally structured such that an insulating layer is formed on a surface of a carrier film, a shielding layer is formed on a surface of the insulating layer, and an adhesive layer is formed on a surface of the shielding layer, as disclosed in japanese patent laid-open No. 2000269632, a reinforced shielding film is comprised of a cover film, a shielding layer is provided on one surface of the cover film, and an adhesive film having a peelable adhesiveness is attached on the other surface to form a reinforced shielding film, and the shielding layer is formed on the base film. The reinforcing shielding film is placed on the printed wiring board, adhered by heating and pressing, and then the adhesive film is peeled off. The material can only solve the problem of electromagnetic wave interference, has no functions of heat dissipation or heat conduction and the like, and can not meet the requirement of the current electronic product on heat management.

Disclosure of Invention

Aiming at the defects in the prior art, the invention provides the shielding film with the radiation heat dissipation function and the manufacturing method thereof, the circuit board and the shielding film are subjected to heat dissipation in a radiation heat dissipation mode, the equipment can be helped to penetrate through the radiation mode to accelerate the heat energy dissipation, the highest temperature of the equipment is reduced with a good heat equalizing effect, and meanwhile, the shielding film aging caused by the heat energy gathering on the surface of the shielding film can be prevented.

The invention has a technical scheme that: the shielding film with the radiation heat dissipation layer comprises a transfer film, and an insulating layer, a radiation heat dissipation layer, a conductive shielding layer and a conductive adhesive layer which are sequentially laminated on the transfer film; wherein the radiation heat dissipation layer is composed of an infrared radiation material monomer or a mixture containing an infrared radiation material; the surface roughness profile unit average width RSm of the radiation heat dissipation layer facing the insulating layer is more than 10um and less than 500um, and the maximum profile height Rz is more than 0.1um and less than 10 um.

In the above technical solution, preferably, the average width RSm of the roughness profile unit of the radiation heat dissipation layer facing the insulating layer is greater than 100um, and the maximum height Rz of the profile is less than 6 um.

In the above technical solution, preferably, the infrared radiation material is graphene, a carbon nanotube, a spinel metal oxide, or a spinel composite metal oxide.

In the above technical solution, preferably, when the radiation heat dissipation layer is made of an infrared radiation material monomer, the infrared radiation material monomer is deposited on the insulating layer by magnetron sputtering or chemical vapor deposition.

In the above-described aspect, preferably, when the radiation heat dissipation layer is formed of a mixture including an infrared radiation material, the mixture including an infrared radiation material is coated on the insulating layer.

In the above technical solution, preferably, the mixture including the infrared radiation material further includes one or more of a high temperature resistant resin, a high temperature resistant elastic material, and an additive.

In the above technical solution, preferably, the high temperature resistant resin is one or more of epoxy resin, polyurethane resin, imide resin, and acrylic resin.

In the above technical solution, preferably, the high temperature resistant elastic material is one or more of polyurethane, styrene, and polyolefin .

In the above technical solution, preferably, the additive includes one or more of a curing agent, a catalyst, a flame retardant, an antioxidant, and a filler.

In the above technical solution, preferably, the thickness of the radiation heat dissipation layer is 0.01um or more, 10um or less.

In the above technical solution, preferably, the thickness of the radiation heat dissipation layer is 1um or more, 3um or less.

In the above technical solution, a method for manufacturing a shielding film with a radiation heat dissipation layer includes the following steps: step A: preparing plastic particles and filler into a film on a roller meeting the roughness requirement by a tape casting process, coating a release agent on the rough surface of the film by a coating process, and curing to obtain a transfer film, wherein the surface of the transfer film with the roughness is a release surface; and B: coating or spraying a prepared mixture comprising an infrared radiation material and an insulating material on the off-molded surface of the transfer film, and drying and curing at high temperature to obtain an insulating heat dissipation layer; and C: drying the prepared semi-finished product to remove moisture and various volatile substances, and depositing a metal film on the radiation heat dissipation layer on the insulating heat dissipation layer through magnetron sputtering, vacuum evaporation, ion plating or electroplating to obtain a conductive shielding layer; step D: and coating conductive glue on the conductive shielding layer by a coating process, drying to obtain a conductive adhesive layer, and then attaching a release film on the conductive adhesive layer to obtain the shielding heat dissipation film.

The other technical scheme of the invention is as follows: a shielding film with an insulating heat dissipation layer comprises a transfer film, and an insulating heat dissipation layer, a conductive shielding layer and a conductive adhesive layer which are sequentially stacked on the transfer film; wherein the insulating radiation heat sink layer is comprised of a mixture comprising an infrared radiating material and an insulating material.

In the above technical solution, preferably, the insulating material is one or more of epoxy resin, polyurethane resin, imide resin, and acrylic resin.

In the above technical solution, preferably, the insulating heat dissipation layer further includes one or more of a high temperature resistant elastic material and an additive.

In the above technical solution, preferably, the high temperature resistant elastic material is one or more of a styrene-butadiene-styrene block copolymer and a hydrogenated styrene-butadiene block copolymer.

In the above technical solution, preferably, the additive is one or more of a curing agent, a catalyst, an ink, a dye, a flame retardant, an antioxidant, and a filler.

In the above technical solution, preferably, the thickness of the insulating heat dissipation layer is 1um or more, 15um or less.

In the above technical solution, preferably, the thickness of the insulating heat dissipation layer is 3um or more, 10um or less.

In the above technical solution, preferably, the average width RSm of the roughness profile unit of the surface of the insulating and heat dissipating layer is 10um to 500um, and the maximum height Rz of the profile is 0.1um to 10 um.

In the above technical solution, a method for manufacturing a shielding film with an insulating heat dissipation layer includes the following steps: step A: preparing plastic particles and filler into a film on a roller meeting the roughness requirement by a tape casting process, coating a release agent on the rough surface of the film by a coating process, and curing to obtain a transfer film, wherein the surface of the transfer film with the roughness is a release surface; and B: coating or spraying a prepared mixture comprising an infrared radiation material and an insulating material on the off-molded surface of the transfer film, and drying and curing at high temperature to obtain an insulating heat dissipation layer; and C: drying the prepared semi-finished product to remove moisture and various volatile substances, and depositing a metal film on the radiation heat dissipation layer on the insulating heat dissipation layer through magnetron sputtering, vacuum evaporation, ion plating or electroplating to obtain a conductive shielding layer; step D: and coating conductive glue on the conductive shielding layer by a coating process, drying to obtain a conductive adhesive layer, and then attaching a release film on the conductive adhesive layer to obtain the shielding heat dissipation film.

The other technical scheme of the invention is as follows: a shielding film with an insulating heat dissipation layer and a radiation heat dissipation layer comprises a transfer film, and the insulating heat dissipation layer, the radiation heat dissipation layer, a conductive shielding layer and a conductive adhesive layer which are sequentially stacked on the transfer film; wherein the insulating heat dissipation layer is composed of a mixture including an infrared radiation material and an insulating material. Wherein the radiation heat dissipation layer is composed of a single body of infrared radiation material or a mixture including the infrared radiation material.

In the above technical solution, the method for manufacturing a shielding film having an insulating heat dissipation layer and a radiation heat dissipation layer includes the following steps: step A: preparing plastic particles and filler into a film on a roller meeting the roughness requirement by a tape casting process, coating a release agent on the rough surface of the film by a coating process, and curing to obtain a transfer film, wherein the surface of the transfer film with the roughness is a release surface; and B: coating or spraying a prepared mixture comprising an infrared radiation material and an insulating material on the off-molded surface of the transfer film, and drying and curing at high temperature to obtain an insulating heat dissipation layer; and C: depositing an infrared radiation material monomer on the insulating heat dissipation layer by magnetron sputtering or chemical vapor deposition, or coating a mixture containing an infrared radiation material on the insulating heat dissipation layer, immediately drying, and drying to obtain the radiation heat dissipation layer; step D: drying the prepared semi-finished product to remove moisture and various volatile substances, and depositing a metal film on the radiation heat dissipation layer through magnetron sputtering, vacuum evaporation, ion plating or electroplating on the radiation heat dissipation layer to obtain a conductive shielding layer; step F: and coating conductive glue on the conductive shielding layer by a coating process, drying to obtain a conductive adhesive layer, and then attaching a release film on the conductive adhesive layer to obtain the shielding heat dissipation film.

Three main ways of heat dissipation are: heat-conduction, convection current and heat radiation, because the heat conduction effect of air is not good, so the speed of heat dispersion is slower during the heat-conduction heat dissipation, so the shielding film surface can accumulate the heat capacity, and this can let the shielding layer take place to age, reduces shielding performance and life, and equipment temperature itself also can rise simultaneously, reduces equipment performance, adopts the mode of heat radiation to dispel the heat to the shielding film for solving this problem this application. The existing heat radiation materials are mainly carbon-based materials and spinel metal oxides, and the heat radiation rate of the existing heat radiation materials can reach or exceed 0.7, and even can partially exceed 0.9. In actual use, the material can achieve a good heat dissipation effect only by heat transfer with high heat conductivity, the carbon-based nano carbon tube can achieve 700W/m.K at room temperature with the thickness of 1um, the heat conductivity exceeds 1000W/m.K at 4um, the carbon-based graphene has the thickness of 1um of about 800W/m.K at room temperature, the spinel metal oxide has the thickness of 3um of about 500W/m.K at room temperature, the radiation heat dissipation layer has good heat conduction and heat radiation effects at the thickness of 1 um-3 um, and the thickness of the shielding film cannot be obviously increased.

The thickness of the shielding film after removing the transfer film is between 8um to 20um, and the thickness of the insulating layer is between 4um to 8 um. Under the condition of enough thickness, such as 5um to 10um, the heat radiation material can be mixed with the insulating material, so that the mixed material not only has high heat conductivity and high emissivity, but also has an insulating effect, and at the moment, the mixture can replace the insulating layer and the heat dissipation layer in the existing shielding film to integrate the shielding film. Under the condition, the total thickness of the new insulating heat dissipation layer is smaller than that of the insulating layer and the heat dissipation layer, the insulating effect is not lower than that of the original insulating layer, and the heat dissipation effect is superior to that of the radiation heat dissipation layer due to the fact that the thickness is increased and the new insulating heat dissipation layer is directly contacted with the outside, so that the effect of making the best of two things is achieved. Moreover, because insulating heat dissipation layer and transfer membrane contact, the one side of this application towards the transfer membrane just has roughness, and the diffuse reflection that can strengthen naturally promotes the heat radiation efficiency and improves.

Further can two-layerly compound, both have insulating heat dissipation layer and radiation heat dissipation layer simultaneously, like this because insulating heat dissipation layer and radiation heat dissipation layer all have thermal radiation material, the components of a whole that can function independently and holistic thermal conductivity of insulating heat dissipation layer and radiation heat dissipation layer can both reach the requirement, and the radiating effect is outstanding, and insulating heat dissipation layer can also improve insulating material's ratio simultaneously and let insulating effect better.

The invention discloses an electromagnetic wave shielding heat dissipation film for a flexible circuit board, which has the heat dissipation function that a radiation heat dissipation material is added in an insulating layer or between the insulating layer and a shielding layer, so that the device can accelerate the heat dissipation through a radiation mode, the highest temperature of the device can be reduced through a good heat equalizing effect, and meanwhile, the aging of the shielding film caused by the heat energy gathered on the surface of the shielding film can be prevented. The shielding film structure of the application also increases the adhesive force of the shielding layer material, and improves the shielding efficiency.

Detailed Description

The shielding film with radiation heat dissipation layer structurally comprises a transfer film, and an insulating layer, a radiation heat dissipation layer, a conductive shielding layer and a conductive adhesive layer which are sequentially stacked on the transfer film, wherein a protective layer can be further arranged on the conductive adhesive layer.

The purpose of the transfer film is to support the material and to make the product easy to produce and process. The transfer film in the application is a film material with good temperature resistance and separation property, the average width RSm of the roughness profile unit on at least one surface is more than 10um and less than 500um, the maximum profile height Rz is more than 0.1um and less than 10um, the material can be formed by coating a release agent on the surface of a high-temperature resistant base film, or a high-temperature resistant film material with low surface energy is used, and the like.

If the transfer film is formed by coating a parting agent on the surface of a high-temperature resistant base film, the high-temperature resistant base film is a base film made of one or more materials such as polyethylene terephthalate (PET), high-density polyethylene (HDPE), Polystyrene (PS), Polycarbonate (PC), polyphenylene sulfide (PPS) or Polyimide (PI), or a composite film formed by compounding a plurality of base films. And the high temperature resistant base film may contain one or more additive materials such as silica, elastomer, etc. as required. The release agent for coating is silicone oil, silicone grease, polyvinyl alcohol, polytetrafluoroethylene or emulsified paraffin wax, etc.

If the transfer film is a low surface energy and high-resistant film, the low surface energy and high-resistant film is a base film made of polymethylpentene (TPX), High Density Polyethylene (HDPE), polytetrafluoroethylene (TPFE) or the like, or a composite film made of a plurality of base films. High-resistance films of low surface energy may be required to contain more than one additional material, such as silica, elastomers, etc.

The high temperature resistant base film or the low surface energy high temperature resistant film of the transfer film can be manufactured by using a known process. For example: calendering, casting, showering, stretching, blowing, and the like. When the transfer film is formed by coating the release agent on the surface of the heat-resistant base film, the transfer film can be manufactured by a known process using a method for coating the release agent. For example: slit coating, dimple coating, comma coating, and the like. The surface of the transfer film may be roughened by a known method such as: embossing process, etching process, plasma treatment, etc.

The insulating layer is used as a substrate of the using layer and mainly plays the roles of insulating and bearing the radiation heat dissipation layer and the conductive shielding layer, so that the equipment cannot be short-circuited due to the fact that the equipment is in contact with the radiation heat dissipation layer. The transfer film is formed on the rough surface of the transfer film by a coating process or a film coating process. The high temperature resistant insulating material can be made of high temperature resistant resin or high temperature resistant elastic material and combination thereof. High temperature resistant resins such as epoxy resins, urethane resins, imide resins, acrylic resins, and the like, high temperature resistant elastomers such as styrene-butadiene-styrene block copolymer (SBS), hydrogenated styrene-butadiene block copolymer (SEBS), and the like. The high temperature resistant insulating material may contain 1 or more additives such as curing agents, catalysts, inks, dyes, heat conductive materials, flame retardants, antioxidants, fillers, etc., as needed. When the thickness of the insulating layer is 1um or more and 50um or less, good insulation, conformability, and bending effect can be obtained. Preferably 2um or more and 30um or less, and more preferably 3um or more and 15um or less.

The radiation heat dissipation layer has a radiation heat dissipation effect and can be made of pure radiation heat dissipation materials or a mixture of radiation heat dissipation materials. Pure radiation heat dissipation materials such as graphene, carbon nanotubes, spinel metal oxides, and the like have high thermal conductivity and infrared emission. The mixture of the radiation heat dissipation material is a mixture of materials such as the radiation heat dissipation material, the high-temperature resistant material, the additive and the like. The high-temperature resistant material is high-temperature resistant resin or high-temperature resistant elastic material. The high-temperature resistant resin is one or more of epoxy resin, polyurethane resin, imide resin and acrylic resin. The high-temperature resistant elastic material is one or more of polyurethane, styrene and polyolefin . The additive material is curing agent, catalyst, fire retardant, antioxidant, stuffing, etc. The pure radiation heat dissipation material can be deposited on the insulating layer by magnetron sputtering or chemical vapor deposition. The mixture of radiation-radiating materials, which is processed mainly by coating, can be manufactured by a known process. For example: slit coating, dimple coating, comma coating, and the like. The thickness of the radiation heat dissipation layer is more than 0.01um and less than 10um, and good heat dissipation, uniform heating, conformability and bending effects can be obtained. Preferably 0.1um or more and 5um or less, and more preferably 1um or more and 3um or less.

The conductive shielding layer has functions of electromagnetic wave shielding and electric conduction, and is composed of a thin film formed of a conductive material. The conductive material may be gold, silver, copper, nickel, tin, aluminum, or an alloy thereof, or a graphene or other carbon material.

The method for forming the layer shielding layer can use one or more methods such as magnetron sputtering, vacuum evaporation, ion plating or electroplating, etc. to deposit one or more layers of films on the radiation heat dissipation layer, or directly use the conductive material film to compound with the product. The thickness of the conductive shielding layer is more than 0.01um and less than 20um, and good conductive electromagnetic shielding performance, electrical conductivity, thermal conductivity, conformability and bending effect can be obtained. Preferably 0.1um to 10um, and more preferably 0.5um to 5 um.

The conductive adhesive layer mainly plays a role in adhering the flexible circuit board, and needs to have good adhesion performance, conductivity and heat resistance. The conductive adhesive layer is a mixture of materials such as adhesive materials, conductive fillers, additives and the like. The adhesive material is epoxy resin, polyurethane resin, acrylic resin, etc. The conductive filler is metal material such as silver powder, copper powder, nickel powder, silver-coated copper powder, silver-coated glass-separated powder, nickel-coated graphite powder, graphene, carbon nano tube and the like, carbon material or alloy material and the like. Additive materials such as curing agents, catalysts, inks, dyes, thermally conductive materials, flame retardants, antioxidants, fillers, solvents, and the like. The conductive adhesive layer is prepared by mixing the required materials according to a formula, and coating the mixture on the conductive shielding layer or the protective layer by a coating mode, and then compounding the conductive shielding layer with the required materials. The coating process includes various known processes such as slot coating, dimple coating, comma coating, and the like. The thickness of the conductive adhesive layer is more than 1um and less than 30um, and good adhesiveness, conductivity, filling property, bending property and the like can be obtained. Preferably 2um to 20um, and more preferably 3um to 10 um.

A method for manufacturing a shielding film with a radiation heat dissipation layer comprises the following steps: step A: preparing plastic particles and filler into a film on a roller meeting the roughness requirement by a tape casting process, coating a release agent on the rough surface of the film by a coating process, and curing to obtain a transfer film, wherein the surface of the transfer film with the roughness is a release surface; and B: coating or spraying an insulating material on the release surface of the transfer film, drying at high temperature and curing to obtain an insulating layer; and C: depositing an infrared radiation material monomer on the insulating layer by magnetron sputtering or chemical vapor deposition, or coating a mixture containing an infrared radiation material on the insulating layer, immediately drying, and drying to obtain a radiation heat dissipation layer; step D: drying the prepared semi-finished product to remove moisture and various volatile substances, and depositing a metal film on the radiation heat dissipation layer through magnetron sputtering, vacuum evaporation, ion plating or electroplating on the radiation heat dissipation layer to obtain a conductive shielding layer; step F: and coating conductive glue on the conductive shielding layer by a coating process, drying to obtain a conductive adhesive layer, and then attaching a release film on the conductive adhesive layer to obtain the shielding heat dissipation film.

The protective layer is used for protecting the conductive adhesive layer and preventing the conductive adhesive layer from being polluted before use and from affecting the adhesiveness. The protective layer material can be a release film, a protective film, a self-adhesive film, a film material with low surface energy and the like. The release film, the adhesive surface and the conductive adhesive are compounded.

Example 1: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 100 +/-20 um and the maximum profile height Rz of the surface of 3 +/-1 um is manufactured, and the insulating layer of 5um, the radiation heat dissipation layer of 1um, the conductive shielding layer of 1um and the conductive adhesive layer of 6um are manufactured on the transfer film in sequence. The insulating layer is a mixture of epoxy resin and styrene-butadiene-styrene block copolymer, and a curing agent, a catalyst, ink, a flame retardant and an antioxidant are added into the mixture. The radiation heat dissipation layer is formed by depositing carbon nano-tube monomers on the insulating layer through magnetron sputtering, the average width RSm of a single-side roughness profile unit of the radiation heat dissipation layer is 50 +/-5 um, and the maximum height Rz of the profile of the surface is 5 +/-1 um. . The conductive shielding layer is copper alloy plated on the radiation heat dissipation layer.

Example 2: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 100 +/-20 um and the maximum profile height Rz of the surface of 3 +/-1 um is manufactured, and the insulating layer of 5um, the radiation heat dissipation layer of 1um, the conductive shielding layer of 0.5um and the conductive adhesive layer of 6um are manufactured on the transfer film in sequence. The insulating layer is a mixture of polyurethane resin and imide resin, and a curing agent, a catalyst, ink, a flame retardant and an antioxidant are added. The radiation heat dissipation layer is formed by depositing a graphene monomer on an insulating layer through magnetron sputtering, the average width RSm of a single-side roughness profile unit of the radiation heat dissipation layer is 50 +/-5 um, and the maximum height Rz of the profile of the surface is 5 +/-1 um. The conductive shielding layer is formed by plating silver alloy on the radiation heat dissipation layer.

Example 3: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 100 +/-20 um and the maximum profile height Rz of the surface of 3 +/-1 um is manufactured, and the insulating layer of 5um, the radiation heat dissipation layer of 4um, the conductive shielding layer of 0.5um and the conductive adhesive layer of 6um are manufactured on the transfer film in sequence. Wherein, the insulating layer is acrylic resin, and a curing agent, a catalyst, printing ink, a flame retardant and an antioxidant are added. . The radiation heat dissipation layer is formed by depositing spinel metal oxide monomers on the insulating layer through magnetron sputtering, the average width RSm of a single-side roughness profile unit of the radiation heat dissipation layer is 50 +/-5 um, and the maximum height Rz of the profile of the surface is 5 +/-1 um. The conductive shielding layer is formed by plating silver alloy on the radiation heat dissipation layer.

Example 4: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 100 +/-20 um and the maximum profile height Rz of the surface of 3 +/-1 um is manufactured, and the insulating layer of 5um, the radiation heat dissipation layer of 4um, the conductive shielding layer of 0.2um and the conductive adhesive layer of 6um are manufactured on the transfer film in sequence. Wherein the insulating layer is made of epoxy resin and hydrogenated styrene-butadiene block copolymer, and is added with curing agent, catalyst, printing ink, flame retardant and antioxidant. The radiation heat dissipation layer is formed by depositing spinel composite metal oxide monomers on the insulating layer through magnetron sputtering, the average width RSm of a single-side roughness profile unit of the radiation heat dissipation layer is 50 +/-5 um, and the maximum height Rz of the profile of the surface is 5 +/-1 um. The conductive shielding layer is platinum plated on the radiation heat dissipation layer.

Example 5: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 100 +/-20 um and the maximum profile height Rz of the surface of 3 +/-1 um is manufactured, and the insulating layer of 5um, the radiation heat dissipation layer of 3um, the conductive shielding layer of 1um and the conductive adhesive layer of 6um are manufactured on the transfer film in sequence. The insulating layer is a mixture of epoxy resin and styrene-butadiene-styrene block copolymer, and a curing agent, a catalyst, ink, a flame retardant and an antioxidant are added into the mixture. The radiation heat dissipation layer is formed by coating a mixture of carbon nanotubes, epoxy resin and polyurethane, with a curing agent and a catalyst on the insulating layer, wherein the average width RSm of a single-side roughness profile unit of the radiation heat dissipation layer is 50 +/-5 um, and the maximum height Rz of the profile of the surface is 5 +/-1 um. . The conductive shielding layer is copper alloy plated on the radiation heat dissipation layer.

Example 6: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 100 +/-20 um and the maximum profile height Rz of the surface of 3 +/-1 um is manufactured, and the insulating layer of 5um, the radiation heat dissipation layer of 3um, the conductive shielding layer of 1um and the conductive adhesive layer of 6um are manufactured on the transfer film in sequence. The insulating layer is a mixture of epoxy resin and styrene-butadiene-styrene block copolymer, and a curing agent, a catalyst, ink, a flame retardant and an antioxidant are added into the mixture. The radiation heat dissipation layer is formed by adding a curing agent and a catalyst into a mixture of graphene, imide resin, acrylic resin and styrene, and is coated on the insulating layer, the average width RSm of a single-side roughness profile unit of the radiation heat dissipation layer is 50 +/-5 um, and the maximum profile height Rz of the surface is 5 +/-1 um. . The conductive shielding layer is copper alloy plated on the radiation heat dissipation layer.

Comparative example 1, using the above method and material, a transfer film having a thickness of 50um, an average width RSm of a single-sided roughness profile unit of 100 ± 20um, and a maximum height Rz of the profile of the surface of 3 ± 1um was prepared, and on the transfer film, an insulating layer of 5um, a conductive shielding layer of 1um, and a conductive adhesive layer of 6um were sequentially formed. .

The heat dissipation performance was tested and the same flex circuit was started for 2 hours average maximum temperature at room temperature for examples 1-6 and comparative example 1, as detailed in table 1.

The shielding film with insulating heat dissipating layer has structure including transfer film, insulating heat dissipating layer, conducting shielding layer and conducting glue layer laminated successively on the transfer film, and protecting layer on the conducting glue layer.

The transfer film, the conductive shielding layer, the conductive adhesive layer, and the protective layer in a shielding film with an insulating heat dissipation layer are similar to those in a shielding film with a radiation heat dissipation layer.

The insulating heat dissipation layer mainly plays a role in insulation and heat dissipation and is a mixture of materials such as a radiation heat dissipation material, a high-temperature insulating material and an additive. And forming the rough surface of the transfer film by a coating process or a film coating process. The radiation heat dissipation materials such as graphene, carbon nanotubes, spinel metal oxide, and the like have high thermal conductivity and infrared emission. The high-temperature resistant resin is one or more of epoxy resin, polyurethane resin, imide resin and acrylic resin. The high-temperature resistant elastic material is one or more of polyurethane, styrene and polyolefin . The high temperature resistant insulating material may contain 1 or more additives such as curing agents, catalysts, inks, dyes, heat conductive materials, flame retardants, antioxidants, fillers, etc., as needed. When the thickness of the insulating radiation heat dissipation layer is more than 1um and less than 50um, good insulativity, heat dissipation effect, conformability and bending effect can be obtained. Preferably 2um or more and 30um or less, more preferably 3um or more and 15um or less, and particularly preferably 5um or more and 10um or less in wet state.

A method for manufacturing a shielding film with an insulating heat dissipation layer comprises the following steps: step A: preparing plastic particles and filler into a film on a roller meeting the roughness requirement by a tape casting process, coating a release agent on the rough surface of the film by a coating process, and curing to obtain a transfer film, wherein the surface of the transfer film with the roughness is a release surface; and B: coating or spraying a prepared mixture comprising an infrared radiation material and an insulating material on the off-molded surface of the transfer film, and drying and curing at high temperature to obtain an insulating heat dissipation layer; and C: drying the prepared semi-finished product to remove moisture and various volatile substances, and depositing a metal film on the radiation heat dissipation layer on the insulating heat dissipation layer through magnetron sputtering, vacuum evaporation, ion plating or electroplating to obtain a conductive shielding layer; step D: and coating conductive glue on the conductive shielding layer by a coating process, drying to obtain a conductive adhesive layer, and then attaching a release film on the conductive adhesive layer to obtain the shielding heat dissipation film.

Example 7: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 100 +/-20 um and the maximum profile height Rz of the surface of 3 +/-1 um is manufactured, and the insulating heat dissipation layer with the thickness of 6um, the conductive shielding layer with the thickness of 1um and the conductive adhesive layer with the thickness of 6um are sequentially manufactured on the transfer film. The insulating heat dissipation layer is formed by adding a curing agent, a catalyst, printing ink, dye, a flame retardant, an antioxidant and a filler into a mixture of carbon nano-tubes, epoxy resin and a styrene-butadiene-styrene block copolymer. The average width RSm of the single-side roughness profile unit of the insulating heat dissipation layer is 100 +/-20 um, and the maximum profile height Rz of the surface is 3 +/-1 um. The conductive shielding layer is copper alloy plated on the radiation heat dissipation layer.

Example 8: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 100 +/-20 um and the maximum profile height Rz of the surface of 3 +/-1 um is manufactured, and the insulating heat dissipation layer with the thickness of 6um, the conductive shielding layer with the thickness of 1um and the conductive adhesive layer with the thickness of 6um are sequentially manufactured on the transfer film. The insulating heat dissipation layer is formed by adding a curing agent, a catalyst, printing ink, a dye, a flame retardant, an antioxidant and a filler into a mixture of graphene, polyurethane resin and imide resin. The average width RSm of the single-side roughness profile unit of the insulating heat dissipation layer is 100 +/-20 um, and the maximum profile height Rz of the surface is 3 +/-1 um. The conductive shielding layer is copper alloy plated on the radiation heat dissipation layer.

Example 9: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 50 +/-10 um and the maximum profile height Rz of the surface of 5 +/-1 um is manufactured, and the insulating heat dissipation layer with the thickness of 7um, the conductive shielding layer with the thickness of 1um and the conductive adhesive layer with the thickness of 6um are sequentially manufactured on the transfer film. The insulating heat dissipation layer is formed by adding a curing agent, a catalyst, printing ink, dye, a flame retardant, an antioxidant and a filler into a mixture of graphene and acrylic resin. The average width RSm of the single-side roughness profile unit of the insulating heat dissipation layer is 50 +/-10 um, and the maximum profile height Rz of the surface is 5 +/-1 um. The conductive shielding layer is copper alloy plated on the radiation heat dissipation layer.

Example 10: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 50 +/-10 um and the maximum profile height Rz of the surface of 5 +/-1 um is manufactured, and the insulating heat dissipation layer with the thickness of 7um, the conductive shielding layer with the thickness of 1um and the conductive adhesive layer with the thickness of 6um are sequentially manufactured on the transfer film. The insulating heat dissipation layer is formed by adding a curing agent, a catalyst, printing ink, dye, a flame retardant, an antioxidant and a filler into a mixture of carbon nano-tubes, epoxy resin and hydrogenated styrene-butadiene block copolymer. The average width RSm of the single-side roughness profile unit of the insulating heat dissipation layer is 50 +/-10 um, and the maximum profile height Rz of the surface is 5 +/-1 um. The conductive shielding layer is copper alloy plated on the radiation heat dissipation layer.

Example 11: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 50 +/-10 um and the maximum profile height Rz of the surface of 5 +/-1 um is manufactured, and an insulating heat dissipation layer with the thickness of 8um, a conductive shielding layer with the thickness of 1um and a conductive adhesive layer with the thickness of 6um are sequentially manufactured on the transfer film. The insulating heat dissipation layer is formed by adding a curing agent, a catalyst, ink, a dye, a flame retardant, an antioxidant and a filler into a mixture of spinel composite metal oxide, epoxy resin and hydrogenated styrene-butadiene block copolymer. The average width RSm of the single-side roughness profile unit of the insulating heat dissipation layer is 50 +/-10 um, and the maximum profile height Rz of the surface is 5 +/-1 um. The conductive shielding layer is copper alloy plated on the radiation heat dissipation layer.

Example 12: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 50 +/-10 um and the maximum profile height Rz of the surface of 5 +/-1 um is manufactured, and an insulating heat dissipation layer with the thickness of 8um, a conductive shielding layer with the thickness of 1um and a conductive adhesive layer with the thickness of 6um are sequentially manufactured on the transfer film. The insulating heat dissipation layer is formed by adding a curing agent, a catalyst, ink, a dye, a flame retardant, an antioxidant and a filler into a mixture of spinel metal oxide, epoxy resin and a hydrogenated styrene-butadiene block copolymer. The average width RSm of the single-side roughness profile unit of the insulating heat dissipation layer is 50 +/-10 um, and the maximum profile height Rz of the surface is 5 +/-1 um. The conductive shielding layer is copper alloy plated on the radiation heat dissipation layer.

The heat dissipation performance was tested and the same flex circuit was started for 2 hours average maximum temperature at room temperature for examples 7-12 and comparative example 1, as detailed in table 2.

The shielding film comprises a transfer film, an insulating heat dissipation layer, a radiation heat dissipation layer, a conductive shielding layer and a conductive adhesive layer, wherein the insulating heat dissipation layer, the radiation heat dissipation layer, the conductive shielding layer and the conductive adhesive layer are sequentially stacked on the transfer film, and a protective layer can be further arranged on the conductive adhesive layer.

A transfer film, a radiation heat dissipation layer, a conductive shield layer, a conductive adhesive layer, and a protective layer in a shield film having an insulating heat dissipation layer and a radiation heat dissipation layer are similar to those in a shield film having a radiation heat dissipation layer.

A transfer film, an insulating heat dissipation layer, a conductive shield layer, a conductive adhesive layer, and a protective layer in a shield film having an insulating heat dissipation layer and a radiation heat dissipation layer are similar to a transfer film, an insulating heat dissipation layer, a conductive shield layer, a conductive adhesive layer, and a protective layer in a shield film having an insulating heat dissipation layer.

A method for manufacturing a shielding film having an insulating heat sink layer and a radiation heat sink layer, comprising the steps of: step A: preparing plastic particles and filler into a film on a roller meeting the roughness requirement by a tape casting process, coating a release agent on the rough surface of the film by a coating process, and curing to obtain a transfer film, wherein the surface of the transfer film with the roughness is a release surface; and B: coating or spraying a prepared mixture comprising an infrared radiation material and an insulating material on the off-molded surface of the transfer film, and drying and curing at high temperature to obtain an insulating heat dissipation layer; and C: depositing an infrared radiation material monomer on the insulating heat dissipation layer by magnetron sputtering or chemical vapor deposition, or coating a mixture containing an infrared radiation material on the insulating heat dissipation layer, immediately drying, and drying to obtain the radiation heat dissipation layer; step D: drying the prepared semi-finished product to remove moisture and various volatile substances, and depositing a metal film on the radiation heat dissipation layer through magnetron sputtering, vacuum evaporation, ion plating or electroplating on the radiation heat dissipation layer to obtain a conductive shielding layer; step F: and coating conductive glue on the conductive shielding layer by a coating process, drying to obtain a conductive adhesive layer, and then attaching a release film on the conductive adhesive layer to obtain the shielding heat dissipation film.

Example 13: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 100 +/-20 um and the maximum profile height Rz of the surface of 3 +/-1 um is manufactured, and the 5um insulating heat dissipation layer, the 2um radiation heat dissipation layer, the 1um conductive shielding layer and the 6um conductive adhesive layer are sequentially manufactured on the transfer film. The insulating heat dissipation layer is formed by adding a curing agent, a catalyst, printing ink, dye, a flame retardant, an antioxidant and a filler into a mixture of carbon nano-tubes, epoxy resin and a styrene-butadiene-styrene block copolymer. The average width RSm of the single-side roughness profile unit of the insulating heat dissipation layer is 100 +/-20 um, and the maximum profile height Rz of the surface is 3 +/-1 um. The radiation heat dissipation layer is formed by depositing carbon nanotube monomer on the insulating layer by magnetron sputtering. The conductive shielding layer is copper alloy plated on the radiation heat dissipation layer.

Example 14: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 100 +/-20 um and the maximum profile height Rz of the surface of 3 +/-1 um is manufactured, and the 6um insulating heat dissipation layer, the 1um radiation heat dissipation layer, the 0.5um conductive shielding layer and the 6um conductive adhesive layer are manufactured on the transfer film in sequence. The insulating heat dissipation layer is formed by adding a curing agent, a catalyst, printing ink, a dye, a flame retardant, an antioxidant and a filler into a mixture of graphene, polyurethane resin and imide resin. The average width RSm of the single-side roughness profile unit of the insulating heat dissipation layer is 100 +/-20 um, and the maximum profile height Rz of the surface is 3 +/-1 um. . The radiation heat dissipation layer is formed by depositing a graphene monomer on the insulating layer through magnetron sputtering. The conductive shielding layer is formed by plating silver alloy on the radiation heat dissipation layer.

Example 15: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 100 +/-20 um and the maximum profile height Rz of the surface of 3 +/-1 um is manufactured, and the 7um insulating heat dissipation layer, the 4um radiation heat dissipation layer, the 0.5um conductive shielding layer and the 6um conductive adhesive layer are sequentially manufactured on the transfer film. The insulating heat dissipation layer is formed by adding a curing agent, a catalyst, printing ink, dye, a flame retardant, an antioxidant and a filler into a mixture of graphene and acrylic resin. The average width RSm of the single-side roughness profile unit of the insulating heat dissipation layer is 50 +/-10 um, and the maximum profile height Rz of the surface is 5 +/-1 um. The radiation heat dissipation layer is formed by depositing spinel metal oxide monomers on the insulating layer through magnetron sputtering. The conductive shielding layer is formed by plating silver alloy on the radiation heat dissipation layer.

Example 16: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 100 +/-20 um and the maximum profile height Rz of the surface of 3 +/-1 um is manufactured, and the 7um insulating heat dissipation layer, the 4um radiation heat dissipation layer, the 0.2um conductive shielding layer and the 6um conductive adhesive layer are sequentially manufactured on the transfer film. The insulating heat dissipation layer is formed by adding a curing agent, a catalyst, printing ink, dye, a flame retardant, an antioxidant and a filler into a mixture of carbon nano-tubes, epoxy resin and hydrogenated styrene-butadiene block copolymer. The average width RSm of the single-side roughness profile unit of the insulating heat dissipation layer is 50 +/-10 um, and the maximum profile height Rz of the surface is 5 +/-1 um. The radiation heat dissipation layer is formed by depositing spinel composite metal oxide monomer on the insulating layer through magnetron sputtering. The conductive shielding layer is platinum plated on the radiation heat dissipation layer.

Example 17: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 100 +/-20 um and the maximum profile height Rz of the surface of 3 +/-1 um is manufactured, and an insulating heat dissipation layer with the thickness of 8um, a radiation heat dissipation layer with the thickness of 3um, a conductive shielding layer with the thickness of 1um and a conductive adhesive layer with the thickness of 6um are manufactured on the transfer film in sequence. The insulating heat dissipation layer is formed by adding a curing agent, a catalyst, ink, a dye, a flame retardant, an antioxidant and a filler into a mixture of spinel composite metal oxide, epoxy resin and hydrogenated styrene-butadiene block copolymer. The average width RSm of the single-side roughness profile unit of the insulating heat dissipation layer is 50 +/-10 um, and the maximum profile height Rz of the surface is 5 +/-1 um. The radiation heat dissipation layer is formed by coating a mixture of carbon nanotubes, epoxy resin and polyurethane, a curing agent and a catalyst on the insulating layer. The conductive shielding layer is copper alloy plated on the radiation heat dissipation layer.

Example 18: by using the method and the material, the transfer film with the thickness of 50um, the average width RSm of the single-sided roughness profile unit of 100 +/-20 um and the maximum profile height Rz of the surface of 3 +/-1 um is manufactured, and an insulating heat dissipation layer with the thickness of 8um, a radiation heat dissipation layer with the thickness of 3um, a conductive shielding layer with the thickness of 1um and a conductive adhesive layer with the thickness of 6um are manufactured on the transfer film in sequence. The insulating heat dissipation layer is formed by adding a curing agent, a catalyst, ink, a dye, a flame retardant, an antioxidant and a filler into a mixture of spinel metal oxide, epoxy resin and a hydrogenated styrene-butadiene block copolymer. The average width RSm of the single-side roughness profile unit of the insulating heat dissipation layer is 50 +/-10 um, and the maximum profile height Rz of the surface is 5 +/-1 um. The radiation heat dissipation layer is formed by adding a curing agent and a catalyst into a mixture of graphene, imide resin, acrylic resin and styrene, and coating the insulating layer. The conductive shielding layer is copper alloy plated on the radiation heat dissipation layer.

The heat dissipation performance was tested and the same flex circuit was started for 2 hours at room temperature for average maximum temperature for examples 13-18 and comparative example 1, as detailed in table 3.

Claims

1. A shielding film with a radiation heat dissipation layer is characterized by comprising a transfer film, an insulating layer, a radiation heat dissipation layer, a conductive shielding layer and a conductive adhesive layer, wherein the insulating layer, the radiation heat dissipation layer, the conductive shielding layer and the conductive adhesive layer are sequentially laminated on the transfer film;

wherein the radiation heat dissipation layer is composed of a single body of infrared radiation material or a mixture including the infrared radiation material.

2. The shielding film with a radiation heat-dissipating layer as claimed in claim 1, wherein the infrared radiation material is graphene or carbon nanotubes or spinel metal oxide or spinel composite metal oxide.

3. The shielding film having a radiation heat-dissipating layer as claimed in claim 1, wherein the mixture including the infrared radiation material further has one or more of a high temperature resistant resin, a high temperature resistant elastic material and an additive.

4. A method for manufacturing a shielding film having a radiation heat-dissipating layer according to claim 1, comprising the steps of:

step A: preparing plastic particles and filler into a film on a roller meeting the roughness requirement by a tape casting process, coating a release agent on the rough surface of the film by a coating process, and curing to obtain a transfer film, wherein the surface of the transfer film with the roughness is a release surface;

and B: coating or spraying an insulating material on the release surface of the transfer film, drying at high temperature and curing to obtain an insulating layer;

and C: depositing an infrared radiation material monomer on the insulating layer by magnetron sputtering or chemical vapor deposition, or coating a mixture containing an infrared radiation material on the insulating layer, immediately drying, and drying to obtain a radiation heat dissipation layer;

step D: drying the prepared semi-finished product to remove moisture and various volatile substances, and depositing a metal film on the radiation heat dissipation layer through magnetron sputtering, vacuum evaporation, ion plating or electroplating on the radiation heat dissipation layer to obtain a conductive shielding layer;

step F: and coating conductive glue on the conductive shielding layer by a coating process, drying to obtain a conductive adhesive layer, and then attaching a release film on the conductive adhesive layer to obtain the shielding heat dissipation film.

5. A shielding film with an insulating heat dissipation layer is characterized by comprising a transfer film, and an insulating heat dissipation layer, a conductive shielding layer and a conductive adhesive layer which are sequentially laminated on the transfer film;

wherein the insulating heat dissipation layer is composed of a mixture including an infrared radiation material and an insulating material.

6. The shielding film with an insulating and heat dissipating layer as claimed in claim 5, wherein the infrared radiation material is graphene or carbon nanotubes or spinel metal oxide or spinel composite metal oxide.

7. The shielding film with the insulating and heat dissipating layer as claimed in claim 5, wherein the insulating material is one or more of epoxy resin, polyurethane resin, imide resin and acrylic resin.

8. The shielding film with an insulating heat dissipation layer as recited in claim 5, wherein the insulating heat dissipation layer further comprises one or more of a high temperature resistant elastic material and an additive.

9. A method for manufacturing a shielding film having a radiation heat-dissipating layer according to claim 5, comprising the steps of:

and B: coating or spraying a prepared mixture comprising an infrared radiation material and an insulating material on the off-molded surface of the transfer film, and drying and curing at high temperature to obtain an insulating heat dissipation layer;

and C: drying the prepared semi-finished product to remove moisture and various volatile substances, and depositing a metal film on the radiation heat dissipation layer on the insulating heat dissipation layer through magnetron sputtering, vacuum evaporation, ion plating or electroplating to obtain a conductive shielding layer;

step D: and coating conductive glue on the conductive shielding layer by a coating process, drying to obtain a conductive adhesive layer, and then attaching a release film on the conductive adhesive layer to obtain the shielding heat dissipation film.

10. A shielding film with an insulating heat dissipation layer and a radiation heat dissipation layer is characterized by comprising a transfer film, wherein the insulating heat dissipation layer, the radiation heat dissipation layer, a conductive shielding layer and a conductive adhesive layer are sequentially stacked on the transfer film;

the insulating heat dissipation layer is composed of a mixture of an infrared radiation material and an insulating material;

11. The shielding film having an insulating heat-dissipating layer and a radiation heat-dissipating layer as claimed in claim 10, wherein the infrared radiation material is graphene or carbon nanotubes or spinel metal oxide or spinel composite metal oxide.

12. A shielding film having an insulating heat-dissipating layer and a radiation heat-dissipating layer as claimed in claim 10, wherein the mixture including the infrared radiation material further has one or more of a high temperature resistant resin, a high temperature resistant elastic material and an additive.

13. The shielding film having an insulating heat dissipation layer and a radiation heat dissipation layer as claimed in claim 10, wherein the insulating material is one or more of epoxy resin, urethane resin, imide resin, and acrylic resin.

14. The shielding film having an insulating heat-dissipating layer and a radiation heat-dissipating layer as claimed in claim 10, wherein the insulating heat-dissipating layer further comprises one or more of a high temperature resistant elastic material, an additive.

15. A method for manufacturing a shielding film having an insulating heat-dissipating layer and a radiation heat-dissipating layer according to claim 10, comprising the steps of:

and C: depositing an infrared radiation material monomer on the insulating heat dissipation layer by magnetron sputtering or chemical vapor deposition, or coating a mixture containing an infrared radiation material on the insulating heat dissipation layer, immediately drying, and drying to obtain the radiation heat dissipation layer;