CN113660780A - Copper-buried circuit board and manufacturing method thereof - Google Patents
Copper-buried circuit board and manufacturing method thereof Download PDFInfo
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- CN113660780A CN113660780A CN202110892470.3A CN202110892470A CN113660780A CN 113660780 A CN113660780 A CN 113660780A CN 202110892470 A CN202110892470 A CN 202110892470A CN 113660780 A CN113660780 A CN 113660780A
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- pcb
- copper block
- copper
- embedded
- slot
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 100
- 229910052802 copper Inorganic materials 0.000 claims abstract description 96
- 239000010949 copper Substances 0.000 claims abstract description 96
- 239000003292 glue Substances 0.000 claims abstract description 28
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 14
- 238000003825 pressing Methods 0.000 claims abstract description 14
- 239000011889 copper foil Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 24
- 238000005553 drilling Methods 0.000 claims description 11
- 238000000227 grinding Methods 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 7
- 230000001680 brushing effect Effects 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 230000004927 fusion Effects 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000007781 pre-processing Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a copper block embedded circuit board and a manufacturing method thereof. The PCB comprises a plurality of layers of core plates and PP layers, wherein the size of a single side of a slotted hole in each layer of chip and PP layer is larger than that of a copper block. The manufacturing method comprises the following steps: s1, pre-enlarging the size of a single side of a groove hole on the PCB corresponding to the embedded copper block; s2, the dry film at the slot hole is not exposed, and the size of the non-exposed dry film at the slot hole is designed to be larger than that of the slot hole; s3, pressing the copper block and the PCB board to embed the copper block into the PCB board; s4, browning the PCB; and S5, removing the flowing glue by adopting non-woven fabric after the copper foil on the surface of the PCB is browned. The dry film at the position of the slotted hole on the PCB is not exposed, and the size of the non-exposed dry film at the slotted hole is designed to be larger than the single side of the slotted hole. The contact between the copper blocks and the inner-layer core board is reduced, and the risk of short circuit of the inner-layer circuit is reduced.
Description
Technical Field
The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a copper-buried circuit board and a manufacturing method thereof.
Background
The copper-embedded board is developed in order to effectively solve the problem of high heat dissipation in the PCB industry, and has the advantages of high manufacturing difficulty, precise board structure and high requirement on production equipment, so that only a few large PCBs can be produced.
At present, the manufactured copper block-embedded plate is easy to cause the phenomenon that the copper block is connected with an inner layer circuit due to the fact that the copper block generates small deviation, and the inner layer circuit is connected together by extrusion deformation to cause inner layer short circuit. Meanwhile, as shown in fig. 1, more dent defects a appear at the copper block position of the Bottom surface, and although the previous sample passes the technical verification of the customer and the test is completely qualified, the appearance of the product and even the pasting operation may be problematic due to the appearance of the surface dent defect a.
Disclosure of Invention
The invention aims to provide a copper-embedded circuit board and a manufacturing method thereof, which can solve the problems that a copper block is connected with an inner layer circuit due to slight offset of the copper block and the inner layer circuit is connected together by extrusion deformation to cause short circuit of the inner layer circuit in the copper-embedded board manufactured by the prior art.
The invention is realized in this way, a method for manufacturing a circuit board with embedded copper blocks, the circuit board with embedded copper blocks comprises copper blocks and a PCB board, the copper blocks are embedded in the PCB board, and the method comprises the following steps:
s1, pre-enlarging the size of a single side of a groove hole on the PCB corresponding to the embedded copper block;
s2, the dry film at the slot hole position is not exposed, and the size of the non-exposed dry film at the slot hole is designed to be larger than the single side of the slot hole;
s3, pressing the copper block and the PCB board to enable the copper block to be embedded into the PCB board;
s4, browning the PCB;
and S5, removing the flowing glue by adopting non-woven fabric after the copper foil on the surface of the PCB is browned.
Further, in the step S1, the PCB includes a plurality of core boards, and in the design drawing of the PCB, a single side of the size of the slot hole of each core board and the corresponding embedded copper block on the PP layer is preset.
Further, in the step S1, the PCB includes L1 to L14 layers of core boards, wherein a single edge of the positions of the L1 to L8 layers of core boards and the corresponding PP layers corresponding to the slots is pre-enlarged by 0.1 mm; two pre-enlarging parameters are adopted for positions of the core plates of the L9-L14 layers and the corresponding groove holes of the PP layers, wherein the single side pre-enlarging parameters are respectively 0.5mm and 0.075 mm.
Further, in the step S2, a single side size of the non-exposed dry film at the slot is 0.076mm larger than a single side size of the slot.
Further, in the step S5, the glue of the PCB is removed twice by using the non-woven fabric after the palm fiber of the PCB is removed, the glue removing effect is checked, and if the glue removing requirement is not met, the chemical glue removing is performed once.
Further, the non-woven fabric glue removing is adopted twice in the outer layer graph pretreatment line, and the non-woven fabric glue removing parameters are as follows: h2SO4Concentration of 4% and pressure of 1.5Kg/cm2The pressure of overflow water washing is 1.5Kg/cm2Overflow amount of 3L/min, nonwoven cloth brushing width of 14mm, brushing current value of 2.5A, and pressurized water washing pressure of 2.5Kg/cm2。
Further, before the step S3, the method further includes a drilling alignment step and an exposure alignment step:
drilling holes by adopting a four-hole positioning method to ensure that the holes are drilled with positioning holes identical to the LDI,
the LDI exposure positioning hole is consistent with the drilling positioning hole, and the relative position of the slot hole is ensured to be consistent after the slot hole is stretched and contracted through the circuit board on the inner layer.
Further, the step S3 includes
Adopting a fusion riveting laminated plate;
putting the copper blocks before pressing for half an hour, and standardizing typesetting operation;
cleaning the L1 and L14 two layers of circuit boards before typesetting;
and observing the glue filling amount of the copper block after pressing to ensure that the slot and the gap of the slot are fully filled with glue.
Further, step S5 is followed by the step of sanding a plate:
and fixing the circuit board with the embedded copper blocks, grinding the circuit board in a mode that the Bottom surface faces downwards, and after grinding the circuit board, mainly checking the concave-convex condition of the copper blocks at the embedded copper block position to determine whether secondary board grinding is needed.
The invention also provides a circuit board with a copper block embedded, which solves the problems and comprises the copper block and a PCB board, wherein the PCB board is provided with a slotted hole, and the copper block is embedded in the slotted hole of the PCB board; the PCB comprises a plurality of layers of core plates, a PP layer is arranged between every two adjacent layers of core plates, and the size single side of the slotted hole on each layer of chip and the PP layer is larger than that of the copper block.
Compared with the prior art, the invention has the beneficial effects that:
according to the manufacturing method, the dry film at the position of the slotted hole on the PCB is not exposed, and the size of the non-exposed dry film at the slotted hole is designed to be larger than the single side of the slotted hole. The contact between the copper blocks and the inner-layer core board is reduced, and the risk of short circuit of the inner-layer circuit is reduced.
Drawings
FIG. 1 is a schematic diagram of a PCB manufactured by the prior art in which a plurality of dent defects appear at the copper block positions on the Bottom surface;
fig. 2 is a flowchart of a method for manufacturing a circuit board with a copper block embedded therein according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a position of a PCB where a copper block needs to be embedded in the PCB during a lamination process of the PCB;
FIG. 4a is a schematic view of an inner core before the exposure area of the dry film at the slot is changed;
FIG. 4b is a schematic view of the inner core after the exposure area of the dry film at the slot is changed;
fig. 5 is a schematic structural diagram of a jig applied in a browning process of a PCB according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 2, an embodiment of the present invention provides a method for manufacturing a copper block-embedded circuit board, where the copper block-embedded circuit board includes a copper block and a PCB, and the copper block is embedded in the PCB, and the method for manufacturing the PCB specifically includes the following steps:
s1, folding and patterning, and designing the size of the slotted hole of the jigsaw pattern:
in the superposed picture and the spliced picture of the PCB, the single side of a slotted hole for correspondingly embedding a copper block on the PCB is pre-enlarged; in this embodiment, as shown in the PCB stacked structure shown in fig. 3, the PCB includes L1-L14 layers of core boards, wherein a single side at a position b of the L1-L8 layers of core boards and corresponding PP layers corresponding to the slot holes is 0.1mm larger; two pre-enlarging parameters are adopted for the positions c of the core plates of the L9-L14 layers and the corresponding slotted holes of the PP layers, and the single edges are pre-enlarged by 0.5mm and 0.075mm respectively.
S2, inner core board pattern design:
the dry film at the slot hole position of the inner core board is not exposed, and the unilateral size of the non-exposed dry film at the slot hole is 0.076mm (namely 3mil) larger than the unilateral size of the slot hole. The exposed area of the dry film at the slot is changed from 0.05mm smaller than the original single side of the slot to 0.076mm larger than the slot (which is equivalent to increasing the pre-enlargement rate of the slot), please refer to fig. 4a, which is a graphic diagram of the inner core board before the change, please refer to fig. 4b, which is a graphic diagram of the inner core board after the change. The comparison shows that the method reduces the phenomenon that the copper blocks are connected with the inner layer circuit due to the small offset of the copper blocks, and the inner layer circuit is connected together by extrusion deformation to cause the short circuit of the inner layer.
S3, drilling alignment and exposure alignment:
drilling holes by adopting a four-hole positioning method to ensure that the holes are drilled with positioning holes identical to the LDI,
the LDI exposure positioning hole is consistent with the drilling positioning hole, and the relative position of the slot hole is ensured to be consistent after the slot hole is stretched and contracted through the circuit board on the inner layer.
S4, pressing the PCB:
adopting a fusion riveting laminated plate;
putting the copper blocks before pressing for half an hour, and standardizing typesetting operation;
cleaning the L1 and L14 two layers of circuit boards before typesetting;
and observing the glue filling amount of the copper block after pressing to ensure that the slot and the gap of the slot are fully filled with glue.
Further, in this embodiment, the HTG011 pressing parameters are used to perform the pressing test on the two boards, and the thickness of the board after pressing is measured by the 12-point method, and the result shows that the thickness of the board manufactured by IT180A is larger than that of the board manufactured by S1000-H, and both the thicknesses conform to the control requirement of 1.49 ± 0.13mm, which also indicates that S1000-H has higher fluidity than IT180A, and is beneficial to the filling of the gap between the copper block and the slot hole.
S5, browning of the PCB:
the flatness of the copper blocks in the pressing process is one of the main reasons for influencing the dents of the copper blocks, therefore, an optimal laminated plate typesetting mode needs to be set, the looseness of the copper blocks in the plate transferring process after the copper blocks are embedded is reduced, whether all the copper blocks are loosened or not is checked, and the unevenness of the copper blocks in the slotted holes is avoided.
The problems existing in the prior copper block browning scheme are that: (1) when the splint made by drilling the light plate is used for browning the copper block, the copper block is difficult to dry after being browned and needs to be additionally placed into an oven for drying; (2) in the browning process of the gauze, the copper blocks are easy to collide in the browning process, the phenomenon of scratching of the browning layer occurs, and the drying effect is slightly good. Therefore, the copper block browning scheme is to be improved.
Therefore, a faster copper block browning scheme needs to be selected to improve the browning efficiency of the copper block and reduce the problem that the browning surface is damaged due to collision of the copper block. In this example, the browning step is as follows:
the copper block is directly adhered to the adhesive tape d of the jig during packaging (see fig. 5, which shows the jig provided with the adhesive tape d of the embodiment), and then the copper block is directly removed from the adhesive tape d when being embedded into the copper block through the browning line, so that secondary drying is not needed, collision between the copper blocks is avoided, and the browning layer of the copper block is not damaged.
S6, removing flow glue:
and (3) after the copper foil on the surface of the PCB is decolourized, removing the glue twice by adopting non-woven fabric, checking the glue removing effect, and if the glue removing requirement cannot be met, chemically removing the glue once.
Specifically, the non-woven fabric degumming is adopted twice in the outer layer graph pretreatment line, and the non-woven fabric degumming parameters are as follows: h2SO4Concentration of 4% and pressure of 1.5Kg/cm2The pressure of overflow water washing is 1.5Kg/cm2Overflow amount of 3L/min, nonwoven cloth brushing width of 14mm, brushing current value of 2.5A, and pressurized water washing pressure of 2.5Kg/cm2. Because the smoothness of the surface of the PCB after lamination is poor, the board surface close to the copper block is thick, and the board surface far away from the copper block is thin, more glue flowing is remained on the surface at the position of the slot after the non-woven fabric is subjected to board grinding twice, and the chemical glue removing of the copper-plated wire is adopted once. The glue removal for the first time can only remove the glue flow with very thin thickness at the position of the plate surface, and the glue flow effect on the position of the copper block is not obvious enough; the second-time adhesive removing of the adhesive removing non-woven fabric has a good effect on the adhesive flowing at the position of the copper block, but the adhesive removing effect cannot meet the requirement, and after the first-time chemical adhesive removing, no adhesive flowing is left at the position of the copper block and the surface of the plate, so that the requirement can be met.
S7, belt grinding plate:
the fixed copper block circuit board that buries adopts the Bottom face mode of facing down to grind the board, and the copper block face is ground the board downwards and is favorable to overcoming the dent defect. And after the plate is ground, the concave-convex condition of the copper block at the position of the copper block is mainly checked to determine whether the plate needs to be ground for the second time.
The embodiment also provides a circuit board with the embedded copper block, which comprises the copper block and a PCB, wherein the PCB is provided with a slotted hole, and the copper block is embedded in the slotted hole of the PCB; the PCB comprises a plurality of layers of core plates, a PP layer is arranged between every two adjacent layers of core plates, and the size single side of the slotted hole on each layer of chip and the PP layer is larger than that of the copper block.
In summary, in the embodiment, the dry film at the position of the slot on the PCB is not exposed, and the size of the non-exposed dry film at the slot is designed to be larger than the single side of the slot. The phenomenon that the copper blocks are connected with the inner layer circuit due to the fact that the copper blocks are slightly deviated, and the inner layer circuit is connected together through extrusion deformation to cause inner layer short circuit is reduced. The contact between the copper blocks and the inner-layer core board is reduced, and the risk of short circuit of the inner-layer circuit is reduced.
The drilling and the LDI exposure adopt the same positioning method, are assisted by a correct glue removing mode and a plate grinding mode, so that the produced copper block embedded plate can ensure that the surface smoothness meets the requirements of customers, and the occurrence of dent defects is avoided.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A manufacturing method of a copper block embedded circuit board is characterized in that the copper block embedded circuit board comprises a copper block and a PCB, the copper block is embedded in the PCB, and the manufacturing method comprises the following steps:
s1, pre-enlarging the size of a single side of a groove hole on the PCB corresponding to the embedded copper block;
s2, the dry film at the slot hole position is not exposed, and the size of the non-exposed dry film at the slot hole is designed to be larger than the single side of the slot hole;
s3, pressing the copper block and the PCB board to enable the copper block to be embedded into the PCB board;
s4, browning the PCB;
and S5, removing the flowing glue by adopting non-woven fabric after the copper foil on the surface of the PCB is browned.
2. The method according to claim 1, wherein in step S1, the PCB comprises a plurality of layers of core boards, and in the design drawing of the PCB, the size of the slot of the corresponding embedded copper block on each layer of core board and its PP layer is single-side pre-enlarged.
3. The manufacturing method of claim 2, wherein in the step S1, the PCB board includes L1-L14 layers of core boards, wherein a single side of the positions of the L1-L8 layers of core boards and the corresponding slots of the PP layers is 0.1mm larger; two pre-enlarging parameters are adopted for positions of the core plates of the L9-L14 layers and the corresponding groove holes of the PP layers, wherein the single side pre-enlarging parameters are respectively 0.5mm and 0.075 mm.
4. The method according to claim 1, wherein in step S2, the dimension of one side of the non-exposed dry film at the slot is 0.076mm larger than the dimension of one side of the slot.
5. The method of claim 1, wherein in step S5, the PCB is de-browned and then de-glued twice with non-woven fabric, the de-glued effect is checked, and if the de-glued requirement is not met, the chemical de-gluing is performed once.
6. The manufacturing method according to claim 5, wherein the non-woven fabric is used for removing glue twice in the outer layer pattern pre-processing line, and the parameters of the non-woven fabric removing glue are as follows: h2SO4Concentration of 4% and pressure of 1.5Kg/cm2The pressure of overflow water washing is 1.5Kg/cm2Overflow amount of 3L/min, nonwoven cloth brushing width of 14mm, brushing current value of 2.5A, and pressurized water washing pressure of 2.5Kg/cm2。
7. The manufacturing method of claim 1, wherein before the step S3, the method further comprises the steps of drilling alignment and exposure alignment:
drilling holes by adopting a four-hole positioning method to ensure that the holes are drilled with positioning holes identical to the LDI,
the LDI exposure positioning hole is consistent with the drilling positioning hole, and the relative position of the slot hole is ensured to be consistent after the slot hole is stretched and contracted through the circuit board on the inner layer.
8. The method of claim 2, wherein the step S3 includes
Adopting a fusion riveting laminated plate;
putting the copper blocks before pressing for half an hour, and standardizing typesetting operation;
cleaning the L1 and L14 two layers of circuit boards before typesetting;
and observing the glue filling amount of the copper block after pressing to ensure that the slot and the gap of the slot are fully filled with glue.
9. The method of claim 1, wherein said step S5 is further followed by the step of sanding a plate:
and fixing the circuit board with the embedded copper blocks, grinding the circuit board in a mode that the Bottom surface faces downwards, and after grinding the circuit board, mainly checking the concave-convex condition of the copper blocks at the embedded copper block position to determine whether secondary board grinding is needed.
10. A circuit board with a copper block embedded comprises a copper block and a PCB, wherein a slotted hole is formed in the PCB, and the copper block is embedded in the slotted hole of the PCB; the PCB is characterized by comprising a plurality of layers of core boards, a PP layer is arranged between every two adjacent layers of core boards, and the size single side of the slotted hole on each layer of chip and the PP layer is larger than that of the copper block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110892470.3A CN113660780A (en) | 2021-08-04 | 2021-08-04 | Copper-buried circuit board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110892470.3A CN113660780A (en) | 2021-08-04 | 2021-08-04 | Copper-buried circuit board and manufacturing method thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002134918A (en) * | 2000-10-26 | 2002-05-10 | Matsushita Electric Works Ltd | Method for manufacturing multilayer printed wiring board |
| CN103068174A (en) * | 2011-10-24 | 2013-04-24 | 悦虎电路(苏州)有限公司 | Manufacturing method for metallization slotted hole circuit board |
| CN107592725A (en) * | 2017-08-31 | 2018-01-16 | 深圳崇达多层线路板有限公司 | A kind of method that copper billet is buried on high multilayer printed circuit board |
| CN110933875A (en) * | 2019-11-18 | 2020-03-27 | 深圳崇达多层线路板有限公司 | Manufacturing method of copper-embedded PCB |
| CN111836470A (en) * | 2020-07-02 | 2020-10-27 | 肇庆昌隆电子有限公司 | In-hole copper plating method before hole plugging of circuit board with buried through hole |
| CN111970831A (en) * | 2020-08-31 | 2020-11-20 | 珠海崇达电路技术有限公司 | Manufacturing process of T-shaped high-rise copper-buried circuit board |
| CN111970818A (en) * | 2020-09-01 | 2020-11-20 | 胜宏科技（惠州）股份有限公司 | Sheet connecting operation method for copper-buried plate |
-
2021
- 2021-08-04 CN CN202110892470.3A patent/CN113660780A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002134918A (en) * | 2000-10-26 | 2002-05-10 | Matsushita Electric Works Ltd | Method for manufacturing multilayer printed wiring board |
| CN103068174A (en) * | 2011-10-24 | 2013-04-24 | 悦虎电路(苏州)有限公司 | Manufacturing method for metallization slotted hole circuit board |
| CN107592725A (en) * | 2017-08-31 | 2018-01-16 | 深圳崇达多层线路板有限公司 | A kind of method that copper billet is buried on high multilayer printed circuit board |
| CN110933875A (en) * | 2019-11-18 | 2020-03-27 | 深圳崇达多层线路板有限公司 | Manufacturing method of copper-embedded PCB |
| CN111836470A (en) * | 2020-07-02 | 2020-10-27 | 肇庆昌隆电子有限公司 | In-hole copper plating method before hole plugging of circuit board with buried through hole |
| CN111970831A (en) * | 2020-08-31 | 2020-11-20 | 珠海崇达电路技术有限公司 | Manufacturing process of T-shaped high-rise copper-buried circuit board |
| CN111970818A (en) * | 2020-09-01 | 2020-11-20 | 胜宏科技（惠州）股份有限公司 | Sheet connecting operation method for copper-buried plate |
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