CN113658902A - 基板的贴合装置和贴合方法以及电子器件的制造方法 - Google Patents

基板的贴合装置和贴合方法以及电子器件的制造方法 Download PDF

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Publication number
CN113658902A
CN113658902A CN202110802644.2A CN202110802644A CN113658902A CN 113658902 A CN113658902 A CN 113658902A CN 202110802644 A CN202110802644 A CN 202110802644A CN 113658902 A CN113658902 A CN 113658902A
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CN
China
Prior art keywords
substrate
roller
force
side edge
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110802644.2A
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English (en)
Chinese (zh)
Inventor
宇津木洋
伊藤泰则
大坪豊
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AGC Inc
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Asahi Glass Co Ltd
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Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of CN113658902A publication Critical patent/CN113658902A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Fluid Mechanics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Quality & Reliability (AREA)
  • Mathematical Physics (AREA)
  • Laminated Bodies (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202110802644.2A 2014-11-25 2015-11-19 基板的贴合装置和贴合方法以及电子器件的制造方法 Pending CN113658902A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014237358 2014-11-25
JP2014-237358 2014-11-25
CN201580055520.5A CN106796913A (zh) 2014-11-25 2015-11-19 基板的贴合装置和贴合方法以及电子器件的制造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201580055520.5A Division CN106796913A (zh) 2014-11-25 2015-11-19 基板的贴合装置和贴合方法以及电子器件的制造方法

Publications (1)

Publication Number Publication Date
CN113658902A true CN113658902A (zh) 2021-11-16

Family

ID=56074270

Family Applications (2)

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CN201580055520.5A Pending CN106796913A (zh) 2014-11-25 2015-11-19 基板的贴合装置和贴合方法以及电子器件的制造方法
CN202110802644.2A Pending CN113658902A (zh) 2014-11-25 2015-11-19 基板的贴合装置和贴合方法以及电子器件的制造方法

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CN201580055520.5A Pending CN106796913A (zh) 2014-11-25 2015-11-19 基板的贴合装置和贴合方法以及电子器件的制造方法

Country Status (5)

Country Link
JP (1) JP6566386B2 (ja)
KR (1) KR20170087453A (ja)
CN (2) CN106796913A (ja)
TW (1) TWI687317B (ja)
WO (1) WO2016084703A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107039329B (zh) * 2017-03-22 2019-12-17 上海凯虹科技电子有限公司 针对薄基板的小尺寸封装体的封装方法及封装体
EP3722096B1 (en) * 2018-02-13 2023-01-11 Shanjin Optoelectronics (Suzhou) Co.,LTD. System and device for laminating optical film
JP6733966B2 (ja) * 2018-07-09 2020-08-05 Ａｉメカテック株式会社 基板組立装置及び基板組立方法
KR20210148127A (ko) 2019-03-29 2021-12-07 닛토덴코 가부시키가이샤 유리 수지 적층체 제조방법
JP7389703B2 (ja) * 2019-12-25 2023-11-30 住友化学株式会社 積層体の製造方法、及び、貼合装置
US11858244B2 (en) 2020-09-15 2024-01-02 Chengdu Boe Optoelectronics Technology Co., Ltd. Laminating device, laminating method thereof, flexible display module and display device
CN114005370B (zh) * 2021-11-19 2024-02-20 云谷（固安）科技有限公司 贴合装置和贴合方法
CN114248529B (zh) * 2021-12-16 2023-10-27 武汉天马微电子有限公司 一种柔性屏贴合装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1534342A (zh) * 2003-03-27 2004-10-06 友达光电股份有限公司 液晶显示器的组件的组装方法
JP2009040617A (ja) * 2007-08-06 2009-02-26 Kuraimu Prod Kk 板ガラスの貼合方法およびその装置
CN103003070A (zh) * 2011-06-15 2013-03-27 攀登制造株式会社 工件的精密粘合装置以及工件的精密粘合方法
US20140299276A1 (en) * 2013-04-04 2014-10-09 Fuk Co., Ltd. Bonding apparatus

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US4720415A (en) * 1985-07-30 1988-01-19 Kimberly-Clark Corporation Composite elastomeric material and process for making the same
JP4479209B2 (ja) * 2003-10-10 2010-06-09 パナソニック株式会社 電子回路装置およびその製造方法並びに電子回路装置の製造装置
JP4930161B2 (ja) * 2006-05-08 2012-05-16 旭硝子株式会社 薄板ガラス積層体、薄板ガラス積層体を用いた表示装置の製造方法および、支持ガラス基板

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* Cited by examiner, † Cited by third party
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CN1534342A (zh) * 2003-03-27 2004-10-06 友达光电股份有限公司 液晶显示器的组件的组装方法
JP2009040617A (ja) * 2007-08-06 2009-02-26 Kuraimu Prod Kk 板ガラスの貼合方法およびその装置
CN103003070A (zh) * 2011-06-15 2013-03-27 攀登制造株式会社 工件的精密粘合装置以及工件的精密粘合方法
US20140299276A1 (en) * 2013-04-04 2014-10-09 Fuk Co., Ltd. Bonding apparatus
JP2014200999A (ja) * 2013-04-04 2014-10-27 株式会社Ｆｕｋ 貼付装置

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网页发布者: "【泡沫3m双面胶】，让粘性更持久的技巧", pages 1, Retrieved from the Internet <URL:新浪微博> *
网页发布者: "3m双面胶|3m强力双面胶使用时的要求及储存环境", pages 1, Retrieved from the Internet <URL:http://www.jc3m.cn/article/3msmj3mqls_1.html> *
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Publication number Publication date
KR20170087453A (ko) 2017-07-28
JPWO2016084703A1 (ja) 2017-08-31
TWI687317B (zh) 2020-03-11
CN106796913A (zh) 2017-05-31
JP6566386B2 (ja) 2019-08-28
TW201632357A (zh) 2016-09-16
WO2016084703A1 (ja) 2016-06-02

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