CN113652190A - Reusable thermal response adhesive based on crystalline compound and preparation method and application thereof - Google Patents

Reusable thermal response adhesive based on crystalline compound and preparation method and application thereof Download PDF

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CN113652190A
CN113652190A CN202110955746.8A CN202110955746A CN113652190A CN 113652190 A CN113652190 A CN 113652190A CN 202110955746 A CN202110955746 A CN 202110955746A CN 113652190 A CN113652190 A CN 113652190A
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crystalline compound
reusable
weight
adhesive
parts
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严锋
刘子央
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Suzhou University
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Suzhou University
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J105/00—Adhesives based on polysaccharides or on their derivatives, not provided for in groups C09J101/00 or C09J103/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0869—Acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/02—Homopolymers or copolymers of unsaturated alcohols
    • C09J129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J159/00—Adhesives based on polyacetals; Adhesives based on derivatives of polyacetals
    • C09J159/02—Polyacetals containing polyoxymethylene sequences only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3045—Sulfates
    • C08K2003/3072—Iron sulfates

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention provides a reusable thermal response adhesive based on a crystalline compound, and a preparation method and application thereof. The reusable thermal response adhesive based on the crystalline compound comprises 10-50 parts by weight of polymerizable monomers, 50-100 parts by weight of the crystalline compound, 1-10 parts by weight of cross-linking agents and 1-10 parts by weight of photoinitiators. The invention also provides a preparation method of the reusable thermal response adhesive based on the crystalline compound, the reusable thermal response adhesive based on the crystalline compound can be used for electronic products, has strong adhesive strength, and the adhesive strength of the adhesive can be controlled by temperature, so that the adhesive can be peeled and adhered as required.

Description

Reusable thermal response adhesive based on crystalline compound and preparation method and application thereof
Technical Field
The invention relates to an adhesive, in particular to a thermal response type adhesive capable of being repeatedly used, and belongs to the technical field of adhesives.
Background
The adhesive has wide application range, simple and convenient use and high economic benefit, so the adhesive plays an important role in high-precision technology and general modern industry. With the development of science and technology and the improvement of living standard of people, the requirements of people on the adhesive are more and more diversified. For example, in the production process of electronic products, some parts need to be replaced frequently. The disposable adhesive is often incapable of being quickly and effectively debonded, and is easy to damage a bonded part during debonding. After the components are renewed, the components need to be adhered again, and the conventional adhesive is difficult to use again.
Disclosure of Invention
In order to solve the above technical problems, an object of the present invention is to provide a thermally responsive adhesive that can be repeatedly used and a method for preparing the same.
In order to achieve the above technical objects, the present invention provides a reusable thermal response adhesive based on a crystalline compound, wherein the reusable thermal response adhesive based on a crystalline compound comprises 10 parts by weight to 50 parts by weight of a polymerizable monomer, 50 parts by weight to 100 parts by weight of a crystalline compound, 1 part by weight to 10 parts by weight of a crosslinking agent, and 1 part by weight to 10 parts by weight of a photoinitiator.
In one embodiment of the present invention, the crystalline compound used is selected from one or a combination of several of the following substances:
polyethylene glycol, polyvinyl alcohol, polyformaldehyde, polyhexamethylene adipamide, polycaprolactone, polyurethane, polyester terephthalate, polycaprolactam, polylactic acid, polytetrahydrofuran, polyethylene acrylic acid copolymer, sodium acetate, sodium thiosulfate, ferric sulfate heptahydrate, aluminum potassium sulfate dodecahydrate, xylitol, sorbitol, arabitol, sucrose and 1, 4-butanediol.
In a specific embodiment of the present invention, the polymerizable monomer is one or a combination of several of acrylate, hydroxyethyl acrylate, acrylic acid, acrylamide, and N, N-dimethylacrylamide.
In a specific embodiment of the present invention, the crosslinking agent used is one or a combination of several of polyethylene glycol acrylate, methylene bisacrylamide, pentaerythritol tetraacrylate, and divinylbenzene.
In a specific embodiment of the present invention, the photoinitiator used is one or a combination of several of the photoinitiator 184, the photoinitiator 1173, and the photoinitiator 907.
The invention also provides a preparation method of the reusable thermal response adhesive based on the crystalline compound, which comprises the following steps:
heating a polymerizable monomer, a crystalline compound, a cross-linking agent and a photoinitiator to 60-100 ℃ for melting to obtain a mixture;
fully stirring the mixture to form a uniform liquid phase, and defoaming in a vacuum environment to obtain defoaming liquid;
polymerizing the defoaming liquid under ultraviolet light to obtain the reusable thermal response adhesive based on the crystalline compound.
The reusable thermal response adhesive based on the crystalline compound is formed by polymerizing a polymerizable monomer and the crystalline compound in a molten state, and the obtained adhesive has the following temperature response: the crystalline compound is melted by raising the temperature, reaching a state in which it can adhere: the polymer crystallizes upon lowering the temperature, significantly increasing its adhesive strength.
In one embodiment of the present invention, the mixture is prepared such that the solid-to-solid ratio of the polymerizable monomer, the crystalline compound, the crosslinking agent and the photoinitiator is 10:10:1:1 to 10:100:10: 10.
In a specific embodiment of the invention, the mixture is stirred at 80-100 ℃, and defoaming treatment is carried out in a vacuum environment at 80-100 ℃, wherein the defoaming treatment time is 30-60 min.
In one embodiment of the present invention, the defoaming liquid is polymerized by ultraviolet light with a wavelength of 365nm-405nm and at 60-100 deg.C (preferably 80 deg.C) for 12-48 h (preferably 24 h).
The application of the reusable thermal response adhesive based on the crystalline compound in the electronic product; including but not limited to electronic products such as cell phones. The reusable heat responsive adhesive based on a crystalline compound is heated to an amorphous state, then hot-pressed to the surface of an adherend, and then gradually cooled until the adhesive is completely crystallized, at which time the adhesive is in an adhesive-adhering state. The adhered object adhered by the adhesive is heated until the adhesive becomes amorphous, and the adhesion strength is greatly weakened at the moment, so that the object can be easily debonded. When the method is used again, the steps are repeated.
The reusable thermal response adhesive based on crystalline compound of the present invention has temperature response, and the crystalline compound is melted by raising the temperature to reach a state where adhesion is possible: after the temperature is reduced, the polymer is crystallized, the adhesive strength of the polymer is obviously increased, so that the adhesive with the adhesive strength controllable through the temperature is obtained, and the adhesion and the debonding between an adherend and the adhesive can be realized through the temperature control.
The preparation method of the reusable thermal response adhesive based on the crystalline compound is environment-friendly and economical.
Drawings
FIG. 1 shows the molten state and the crystalline state of the adhesive in example 1 of the present invention.
Detailed Description
Example 1
The embodiment provides a reusable thermal response adhesive based on a crystalline compound, and the preparation method comprises the following steps:
(a) 10g of ethyl acrylate, 50g of polyurethane (M)w10000), 1g polyethylene glycol acrylate (M)n1000), 1g of photoinitiator 184 was mixed and heated to 80 ℃ to obtain a liquid phase mixture;
(b) stirring the liquid phase mixture obtained in the step (a) at 80 ℃, and defoaming the mixture in a vacuum drying oven at 80 ℃ for 30min after stirring.
(c) Taking out the mixed liquid obtained in the step (b), injecting the mixed liquid into a mold with the size of 20 multiplied by 0.1cm, and carrying out ultraviolet photopolymerization under the ultraviolet light with the wavelength of 365nm-405nm at the temperature of 80 ℃ for 24 h.
The molten state and the crystalline state of the adhesive are shown in fig. 1.
Example 2
The embodiment provides a reusable thermal response adhesive based on a crystalline compound, and the preparation method comprises the following steps:
(a) 10g of ethyl acrylate, 60g of polyoxymethylene (M)w10000), 1g polyethylene glycol acrylate (M)n1000), 1g of photoinitiator 184 was mixed and heated to 80 ℃ to obtain a liquid phase mixture;
(b) stirring the liquid phase mixture obtained in the step (a) at 80 ℃, and defoaming the mixture in a vacuum drying oven at 80 ℃ for 30min after stirring.
(c) Taking out the mixed liquid obtained in the step (b), injecting the mixed liquid into a mold with the size of 20 multiplied by 0.1cm, and carrying out ultraviolet photopolymerization under the ultraviolet light with the wavelength of 365nm-405nm at the temperature of 80 ℃ for 24 h.
Example 3
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: in step (a), 10g of N, N-dimethylacrylamide was added as the polymerizable monomer.
Example 4
This example provides a method based on crystallizationThe process for preparing a reusable thermo-responsive adhesive of the composition is essentially the same as that described in example 1, except that: the crystalline compound added was 70g of polylactic acid (M)w＝10000)。
Example 5
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the crystalline compound added was 80g of sodium acetate.
Example 6
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the crystalline compound added was 50g of arabitol.
Example 7
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the crystalline compound added was 50g of 1, 4-butanediol.
Example 8
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the crystalline compound added was 50g of polyethylene glycol (Mw ═ 4000).
Example 9
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the crystalline compound added was 50g of polyvinyl alcohol (Mw 8000).
Example 10
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the crystalline compound added was 50g of polyhexamethylene adipate (Mw 6000).
Example 11
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the crystalline compound added was 50g of polycaprolactone (Mw ═ 2000).
Example 12
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the added crystalline compound was 50g of a polyester terephthalate (Mw ═ 10000).
Example 13
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the added crystalline compound was 50g of polycaprolactam (Mw 8000-).
Example 14
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the added crystalline compound was 50g of polytetrahydrofuran (Mw ═ 6000).
Example 15
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the crystalline compound added was 50g of a polyethylene acrylic acid copolymer (Mw 8000).
Example 16
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the crystalline compound added was 50g of sodium thiosulfate.
Example 17
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the crystalline compound added was 50g of iron sulfate heptahydrate.
Example 18
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the crystalline compound added was 50g of aluminum potassium sulfate dodecahydrate.
Example 19
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the crystalline compound added was 50g of xylitol.
Example 20
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the crystalline compound added was 50g of sorbitol.
Example 21
This example provides a reusable thermo-responsive adhesive based on crystalline compounds, which is prepared by a process substantially as described in example 1, except that: the crystalline compound added was 50g of sucrose.
Comparative example 1
This comparative example provides an adhesive prepared by a process substantially as described in example 1, except that: the crystalline polymer used is an ethylene acrylic acid copolymer.
Comparative example 2
This comparative example provides an adhesive prepared by a process substantially as described in example 1, except that: the polymerizable monomer used was vinyl pyridine.
Comparative example 3
This comparative example provides an adhesive prepared by a process substantially as described in example 1, except that: 1g of ethyl acrylate, 50g of polyurethane.
Comparative example 4
This comparative example provides an adhesive prepared by a process substantially as described in example 1, except that: heating to 50 ℃ in step (a).
Application example 1
The adhesives of examples 1 to 21 and comparative examples 1 to 4 were subjected to adhesion strength and temperature control tests (relevant performance tests were sufficient), and the results are shown in table 1.
TABLE 1 tables for testing the properties of the adhesives of examples 1 to 21 and comparative examples 1 to 4
Figure BDA0003220179470000061
Figure BDA0003220179470000071
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims (10)

1. A reusable thermal response adhesive based on a crystalline compound, wherein the reusable thermal response adhesive based on a crystalline compound comprises 10 parts by weight to 50 parts by weight of a polymerizable monomer, 50 parts by weight to 100 parts by weight of a crystalline compound, 1 part by weight to 10 parts by weight of a crosslinking agent, and 1 part by weight to 10 parts by weight of a photoinitiator.
2. The reusable thermally responsive adhesive based on crystalline compounds of claim 1 wherein the crystalline compounds are selected from one or a combination of:
polyethylene glycol, polyvinyl alcohol, polyformaldehyde, polyhexamethylene adipamide, polycaprolactone, polyurethane, polyester terephthalate, polycaprolactam, polylactic acid, polytetrahydrofuran, polyethylene acrylic acid copolymer, sodium acetate, sodium thiosulfate, ferric sulfate heptahydrate, aluminum potassium sulfate dodecahydrate, xylitol, sorbitol, arabitol, sucrose and 1, 4-butanediol.
3. The crystalline compound based reusable thermo-responsive adhesive of claim 1, wherein the polymerizable monomer is one or a combination of acrylates, hydroxyethyl acrylate, acrylic acid, acrylamide and N, N dimethylacrylamide.
4. The crystalline compound based reusable thermo-responsive adhesive of claim 1, wherein the cross-linking agent is one or a combination of polyethylene glycol acrylate, methylene bis acrylamide, pentaerythritol tetraacrylate, and divinylbenzene.
5. The reusable thermally responsive adhesive based on crystalline compounds of claim 1 wherein the photoinitiator is one or a combination of photoinitiators 184, 1173 and 907.
6. A process for the preparation of a crystalline compound based reusable thermo-responsive adhesive according to any of claims 1 to 5, comprising the steps of:
heating the polymerizable monomer, the crystalline compound, the cross-linking agent and the photoinitiator to 60-100 ℃ for melting to obtain a mixture;
fully stirring the mixture to form a uniform liquid phase, and defoaming in a vacuum environment to obtain defoaming liquid;
polymerizing the defoaming liquid under ultraviolet light to obtain the reusable thermal response adhesive based on the crystalline compound.
7. The production method according to claim 6, wherein the polymerizable monomer, the crystalline compound, the crosslinking agent, and the photoinitiator are mixed at a solid-to-solid ratio of 10:10:1:1 to 10:100:10:10 when the mixture is produced.
8. The preparation method according to claim 6, wherein the mixture is stirred at 80-C100℃, and defoaming treatment is performed in a vacuum environment at 80-100℃ for 30-60 min.
9. The preparation method according to claim 6, wherein the defoaming liquid is photopolymerized at 60-100 ℃ under ultraviolet light with a wavelength of 365-405 nm, and the polymerization time is 12-48 h.
10. Use of a crystalline compound based reusable thermo-responsive adhesive according to any of claims 1 to 5 in an electronic product.
CN202110955746.8A 2021-08-19 2021-08-19 Reusable thermal response adhesive based on crystalline compound and preparation method and application thereof Pending CN113652190A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1509323A (en) * 2001-05-17 2004-06-30 3M Adhesive composition and adhesive article
CN1703477A (en) * 2000-07-31 2005-11-30 3M创新有限公司 Polyhexanoic acid lactone adhesive composition
CN1771312A (en) * 2004-01-28 2006-05-10 Lg化学株式会社 Releasable adhesive composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1703477A (en) * 2000-07-31 2005-11-30 3M创新有限公司 Polyhexanoic acid lactone adhesive composition
CN1509323A (en) * 2001-05-17 2004-06-30 3M Adhesive composition and adhesive article
CN1771312A (en) * 2004-01-28 2006-05-10 Lg化学株式会社 Releasable adhesive composition

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