CN113644043A - Novel TO-263 lead frame - Google Patents
Novel TO-263 lead frame Download PDFInfo
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- CN113644043A CN113644043A CN202110900315.1A CN202110900315A CN113644043A CN 113644043 A CN113644043 A CN 113644043A CN 202110900315 A CN202110900315 A CN 202110900315A CN 113644043 A CN113644043 A CN 113644043A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a novel TO-263 lead frame, and relates TO the technical field of semiconductor packaging. The lead frame can improve creepage voltage, increase carrier area and save copper materials. The method comprises the following steps: a heat dissipation area, a chip carrying area and a pin area; the heat dissipation area is arranged above the chip carrying area, and an oval glue locking groove is arranged between the heat dissipation area and the chip carrying area; the pin area is arranged below the chip carrying area, and a frame is arranged below the pin area; the lead area is provided with a first lead and a second lead, and the first lead, the second lead and the chip carrying area are isolated from each other.
Description
Technical Field
The invention relates TO the technical field of semiconductor packaging, in particular TO a novel TO-263 lead frame.
Background
Traditional H2PAK product is as TO-263 series optimization version product, because of its pin and carrier phase separation have good internal insulation, widely used in market, but traditional H2PAK product, lead frame design is three pin, excise middle pin in the eager muscle shaping, because TO factors such as product reliability, layering consider, middle pin can not follow the excision of plastic-sealed body root, so middle pin has some TO remain, but after product voltage increase, middle pin has the problem of striking sparks, easily lead TO the product TO damage. In order to solve the problem of sparking of the middle pin and increase the size of the carrier, the safe creepage distance during high-voltage output is ensured, and the reliability of a packaged product is increased, so that the conventional H2PAK packaging structure needs to be improved.
Disclosure of Invention
The embodiment of the invention provides a novel TO-263 lead frame which can improve creepage voltage, increase carrier area and save copper materials.
The embodiment of the invention provides a novel TO-263 lead frame, which comprises: a heat dissipation area, a chip carrying area and a pin area;
the heat dissipation area is arranged above the chip carrying area, and an oval glue locking groove is arranged between the heat dissipation area and the chip carrying area;
the pin area is arranged below the chip carrying area, and a frame is arranged below the pin area;
the lead area is provided with a first lead and a second lead, and the chip carrying area is isolated from the first lead and the second lead.
Preferably, the device further comprises a first pin welding area and a second pin welding area;
a first corner is arranged at the upper right corner of the first pin welding area, a second corner and a third corner are respectively arranged at the upper right corner and the lower left corner of the second pin welding area, and inclined edges included in the first corner, the second corner and the third corner are parallel to each other;
the first pin is connected with the first pin welding area, and the second pin is connected with the second pin welding area.
Preferably, the horizontal distance between the chip carrying area and the first pin welding area and the second pin welding area is 0.30mm, and the vertical distance is 1.30 mm;
the distance between the first pin and the second pin is 5.08 mm.
Preferably, the angles of the first corner, the second corner and the third corner are all between 40 and 50 degrees;
the area of the second pin welding area is 1.8-2.4 times of the area of the first pin welding area.
Preferably, a semicircular glue locking groove and a first pin V groove are formed in the connection part of the first pin and the first pin welding area, and the semicircular glue locking groove is located on one side, close to the second pin welding area, of the connection part of the first pin and the first pin welding area;
the part, connected with the second pin welding area, of the second pin is provided with a circular glue locking groove and a second pin V groove, and the circular glue locking groove is located in the part, connected with the second pin welding area, of the second pin.
Preferably, a fourth corner and a dovetail groove are further included between the heat dissipation area and the chip carrying area;
the front surface and the back surface of the oval glue locking groove are sequentially punched and formed, and the thickness of the oval glue locking groove is 1.3 mm;
the front surface of the oval glue locking groove is 3.8mm long and 1.2mm wide; the reverse side of the oval glue locking groove is 3.6mm long and 1mm wide;
and filling plastic packaging materials in the packaged elliptical glue locking groove.
Preferably, first V-shaped grooves are formed in the periphery of the slide area; the left side and the right side of the slide glass area are provided with a stepped semi-punching structure, and the stepped semi-punching structure is positioned on one side of the first V-shaped groove far away from the slide glass area;
the slide area comprises a base island; or the slide region includes two base islands.
Preferably, the device also comprises a connecting rib, a middle rib and a pin area;
the heat dissipation area, the chip carrying area, the middle ribs, the pin areas and the frame form a lead frame unit;
the lead frame units comprise a heat dissipation area and a middle rib, two connecting ribs are respectively arranged on two sides of the chip carrying area, and two adjacent lead frame units are connected through the connecting ribs; or
Two adjacent lead frame units are a group of lead frames, and two non-adjacent sides of two carrying areas in the group of lead frames are respectively provided with a connecting rib.
Preferably, the device further comprises a flow passage waist hole and a non-flow passage waist hole, wherein the aperture of the non-flow passage waist hole is larger than or equal to that of the flow passage waist hole;
the runner waist hole and the non-runner waist hole are arranged on the connecting rib between the middle rib and the frame at intervals in sequence.
Preferably, the heat dissipation region comprises a top heat dissipation region and a back heat dissipation region;
the top heat dissipation area is arranged above the chip carrying area;
the back heat dissipation area is arranged right below the chip carrying area.
The embodiment of the invention provides a novel TO-263 lead frame, which comprises: a heat dissipation area, a chip carrying area and a pin area; the heat dissipation area is arranged above the chip carrying area, and an oval glue locking groove is arranged between the heat dissipation area and the chip carrying area; the pin area is arranged below the chip carrying area, and a frame is arranged below the chip carrying area; the pin area is provided with a first pin and a second pin. In the lead frame provided by the embodiment, the two pins with a gap are arranged in the pin area, and are separated from the chip area, so that the creepage distance between the heat dissipation area and the pins is increased, the creepage distance for high-voltage output safety can be ensured, and the electrical property of a packaged product is effectively improved; moreover, be provided with oval glue locking groove between radiating area and slide glass district, move oval glue locking groove central line to encapsulating linear position moreover, when guaranteeing that the plastic-sealed body combines well with the frame, improves encapsulation product dilatancy, can make carrier Y direction distance grow bigger, can bond bigger specification chip, make the chip size scope of encapsulation wider, satisfy different user demands. In the lead frame provided by the embodiment, the connecting ribs between two adjacent carrier sections are optimized from one for each unit to one for each two units; the non-runner waist hole below the middle rib meets the requirement of stable frame structure, and simultaneously, the hole pitch is increased as much as possible, the use of copper materials is reduced, and the material cost is effectively saved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a novel TO-263 lead frame structure provided by an embodiment of the present invention;
FIG. 2 is a schematic left-view structural diagram of a novel TO-263 lead frame according TO an embodiment of the present invention;
FIG. 3 is a cross-sectional view of an elliptical glue-locking groove provided by an embodiment of the present invention;
FIG. 4 is a schematic view of another lead frame structure provided by an embodiment of the present invention;
FIG. 5 is a schematic diagram of a structure for plating nickel on a pin according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a structure of a pin bonding area and a carrier area all plated with nickel according to an embodiment of the present invention;
the structure comprises a top radiating fin area, a first chip carrying area, a pin area, a second chip carrying area, a first pin area, a second pin area, a third pin area, a fourth pin area, and a fourth pin area, a second pin area, and a second pin area, wherein the fourth pin area, and a second pin area, wherein the fourth pin area, and a second pin area, and a fourth pin area, wherein the fourth pin area, and a fourth pin area, wherein the fourth pin area, and a fourth pin area.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
FIG. 1 is a schematic diagram illustrating an exemplary structure of a novel TO-263 lead frame provided by an embodiment of the present invention, and FIG. 2 is a schematic diagram illustrating a left-view structure of the novel TO-263 lead frame provided by the embodiment of the present invention; fig. 3 is a cross-sectional view of an elliptical glue-locking groove provided in an embodiment of the present invention. The novel TO-263 lead frame provided by the embodiment of the invention is described below with reference TO FIGS. 1 TO 4.
As shown in fig. 1, the lead frame mainly includes a heat dissipation area, a chip carrying area, and a lead area 3. Specifically, the heat dissipation region comprises a top heat dissipation region 1 and a back heat dissipation region 19, wherein the top heat dissipation region 1 is disposed above the carrier region. In order to ensure that the plastic package body can be well combined with the frame, on one hand, the dragging strength of a packaged product can be improved, and on the other hand, the distance of the carrier in the Y direction can be larger, namely, a chip with a larger size can be bonded, preferably, an oval glue locking groove 4 is arranged between the top heat dissipation area 1 and the slide area, and the central line of the oval glue locking groove 4 is shifted to the position of an encapsulation line.
In the embodiment of the invention, one part of the oval glue locking groove 4 is positioned in the top heat dissipation area 1, the other part is positioned in the chip carrying area, and the oval glue locking groove 4 is completely filled with the plastic package material after packaging. In practical application, the front surface and the back surface of the oval glue locking groove 4 are respectively subjected to one-time punch forming, the through hole 23 with the aperture of 1mm is formed by punching from the left side for the first time, redundant copper materials are removed, the half through hole 24 with the aperture of 1.2mm is formed by punching from the right side for the second time, the shape after punching is ensured, and one-time punching with corner collapse is prevented. After twice stamping, the thickness of the oval glue locking groove 4 is 1.3mm, the length of the front surface is 3.8mm, and the width of the front surface is 1.2 mm; the width of the back surface of the oval glue locking groove 4 is 3.6mm, and the width of the back surface is 1 mm.
Further, in order to ensure that the plastic package material is well combined with the frame, and simultaneously, the combination force is increased and the layered moisture of the product is prevented from entering, preferably, a fourth corner 22 and a dovetail groove 20 are further arranged between the top heat dissipation area 1 and the slide area in addition to the oval glue locking groove 4, wherein the dovetail groove 20 is positioned on two sides of the oval glue locking groove 4, and the fourth corner 22 is positioned on two sides of the dovetail groove 20.
Further, the slide glass area is arranged right above the back heat dissipation area 19, the pin area 3 is arranged below the slide glass area, and the frame 16 is arranged below the pin area 3.
In practical applications, the lead area 3 includes a first lead 14 and a second lead 15 from left to right. In order to ensure a safe creepage distance for high voltage output and effectively improve the electrical performance of a packaged product, preferably, a gap exists between the first pin 14 and the second pin 15, that is, the first pin 14 and the second pin 15 are isolated from each other; in practical application, the first pin 14 is a G pole, and the second pin 15 is an S pole; further, there is a space between each of the first lead 14 and the second lead 15 and the chip area, that is, the first lead 14 and the second lead 15 are isolated from the chip area.
The first pin 14 is connected with the first pin welding area 7, the second pin 15 is connected with the second pin welding area 10, wherein the first pin welding area 7 and the second pin welding area 10 are arranged below the chip carrying area side by side, the horizontal distance between the chip carrying area and the first pin welding area 7 and the second pin welding area 10 is 0.3mm, and the vertical distance is 1.3 mm. Further, the distance between the first lead 14 and the second lead 15 is 5.08 mm.
In the embodiment of the present invention, in order to ensure the structural strength of a packaged product and prevent the product from dragging and cracking, preferably, a first corner is disposed at the upper right corner of the first pin bonding area 7, a second corner and a third corner are respectively disposed at the upper right corner and the lower left corner of the second pin bonding area 10, and oblique sides included in the first corner, the second corner and the third corner are parallel to each other, further, angles of the three corners are between 40 ° and 50 °, an area of the second pin bonding area 10 is larger than an area of the first pin bonding area 7, and in practical application, an area of the second pin bonding area 10 is 1.8 times to 2.4 times of an area of the first pin bonding area 7.
Further, in order to ensure good waterproof performance and structural strength of the slide area and prevent moisture in the slide area from entering and being pulled and cracked by stress in the X direction, preferably, a semicircular glue locking groove 9 and a first pin V groove 8 are arranged at a connecting part of the first pin 14 and the first pin welding area 7, wherein the semicircular glue locking groove 9 is positioned at a connecting part of the first pin 14 and the first pin welding area 7 and is close to one side of the second pin welding area 10, and is called as a semicircular glue locking groove 9 because the semicircular glue locking groove is semicircular in shape; the part of the second pin 15, which is connected with the second pin welding area 10, is provided with a circular glue locking groove 12 and a second pin V groove 11, wherein the circular glue locking groove 12 is positioned in the part of the second pin 15, which is connected with the second pin welding area 10, and is called the circular glue locking groove 12 because the shape is circular.
In the embodiment of the invention, in order to improve the bonding force between the plastic package and the carrier and improve the problem of carrier layering, preferably, the first V-shaped groove 5 is arranged around the carrier region; furthermore, stepped half stamping structures 21 are arranged on the left side and the right side of the slide glass area, and the half stamping structures are positioned on one side of the first V-shaped groove 5 far away from the slide glass area. It should be noted that, in the embodiment of the present invention, the left and right sides of the carrier region refer to the two sides of the carrier region that are not adjacent to the top heat dissipation region 1 and the lead region 3.
In practical application, the slide area can be set as a first slide area 2 comprising only one base island, and can also be set as a second slide area 25 comprising two base islands; furthermore, one chip or two chips can be arranged on one base island; based on this, it can be determined that at least one chip or a maximum of four chips can be disposed in the slide region. The two base islands included in the second chip region 25 may have the same shape or different shapes.
It should be noted that the lead frame according to the embodiment of the present invention includes, from top to bottom, a top heat dissipation region 1, a chip carrying region, a middle rib 13, a lead region 3, and a frame 16, which form a lead frame unit. In practical application, the lead frame further comprises a connecting rib 6.
The connecting ribs 6 are present in the lead frame unit in two ways, one: when two sides of the chip carrying area included by the lead frame unit are respectively provided with one connecting rib 6, one connecting rib 6 is shared between two adjacent lead frame units, namely, the two adjacent lead frame units totally include three connecting ribs 6; in another mode: when two adjacent lead frame units form a group of lead frames, two non-adjacent sides of two carrying areas in the lead frames are respectively provided with a connecting rib 6, namely, only two connecting ribs 6 are included in one group of lead frames. Through the arrangement, the use of copper materials can be reduced on the premise of ensuring the product performance, and the material cost is saved.
Further, in order to save raw materials, on the premise of ensuring the stability of the frame, a flow passage waist hole 17 and a non-flow passage waist hole 18 with different apertures may be provided below the middle rib 13, wherein the flow passage waist hole 17 and the non-flow passage waist hole 18 are provided on the connecting rib 6 between the middle rib 13 and the frame 16 in a sequentially spaced manner, and one connecting rib 6 is provided with two flow passage waist holes 17 or two non-flow passage waist holes 18 with the same aperture. In the embodiment of the present invention, the aperture of the non-flow-passage waist hole 18 is greater than or equal to the aperture of the flow-passage waist hole 17, and preferably, the aperture of the non-flow-passage waist hole 18 is 2 to 3 times the aperture of the flow-passage waist hole 17.
In the embodiment of the invention, two pins are arranged in the pin area 3, and the distance between the two pins is large; the pin is separated from the slide area; the creepage distance between the back radiating fins and the pins is increased, the creepage distance of high-voltage output safety is guaranteed, and the electrical property of a packaged product is effectively improved. Moreover, move oval lock gluey hole central line to encapsulating the line position, guarantee that the plastic-sealed body combines well with the frame, when improving encapsulation product pulling strength, can make carrier Y direction distance become bigger, can bond bigger specification chip, processing chip size scope is wider, satisfies different user demands. Furthermore, the connecting ribs 6 in the vertical direction on the middle ribs 13 are optimized from one for each unit to one for every two units; the non-flow passage waist holes 18 with different apertures are arranged below the middle ribs 13, so that the aperture is enlarged as much as possible while the frame structure is stable, the use of copper materials is reduced, and the material cost is effectively saved; the lead frame provided by the embodiment of the invention can share packaging equipment with TO-263US-7L, and after parts are replaced, the interchange of two products can be realized, so that the capital investment of the packaging equipment is effectively reduced.
In order to more clearly describe the lead frame provided by the embodiment of the present invention, the lead frame is described below by taking embodiment 1, embodiment 2, and embodiment 3 as examples, respectively, in conjunction with fig. 1 to 6.
Example 1
As shown in fig. 1, the lead frame mainly includes a top heat sink region 1, a chip-carrying region and a lead region 3, and the chip-carrying region and the lead region 3 are connected in parallel by the top heat sink region 1, a middle rib 13 and a frame 16 to form a lead frame unit; the chip carrying area is arranged on the front surface of the back heat dissipation area 19, and the pin area 3 is arranged at the lower part of the chip carrying area; the connecting part of the top radiating fin area 1 and the slide glass area is provided with an enlarged oval glue locking groove 4, a fourth corner 22 and a dovetail groove 20, and the purpose of the connecting part is to ensure that a plastic package material is well combined with a frame, increase the binding force and prevent layered water vapor from entering a product.
In practical application, the oval glue locking groove 4 is formed by two-time punch forming, a through hole 23 with the thickness of 1.00mm is punched from the left side for the first time, redundant copper materials are removed, a half through hole 24 with the thickness of 1.20mm is punched from the right side for the second time, the shape after punching is guaranteed, and one-time punching with a corner collapse is prevented.
In one lead frame unit, the chip area may be configured as a first chip area 2 as shown in fig. 1, which includes only one base island, or may be configured as a second chip area 25 as shown in fig. 1, which includes two left and right base islands, and the sizes of the two left and right base islands may be adjusted according to the size of the chip, that is, the two base islands may be the same size or different sizes. Further, in order to ensure good waterproof performance and structural strength of the slide area and prevent moisture in the slide area from entering and being pulled and cracked by stress in the X direction, preferably, V-grooves are formed around the slide area, stepped half stamping structures 21 are arranged on the left side and the right side of the slide area, and the stepped half stamping structures 21 are located on one side of the V-grooves away from the slide area.
It should be noted that, in practical application, one chip may be disposed on the base island, or two chips may be disposed on the base island, and when two chips are disposed, the shapes of the two chips may be the same or different. In the embodiment of the present invention, the specific shape of the chip disposed on the base island is not set.
As shown in fig. 1, the lead area 3 is provided with two leads, namely a first lead 14 and a second lead 15 from left to right, the first lead 14 and the second lead 15 are isolated from each other, specifically, the distance between the first lead 14 and the second lead 15 is 5.08 mm; further, the first lead 14, the second lead 15 and the chip region are isolated from each other.
In practical applications, the first lead 14 is connected to the first lead bonding area 7, and the second lead 15 is connected to the second lead bonding area 10, wherein the first lead bonding area 7 and the second lead bonding area 10 are disposed in parallel directly below the chip carrier area. In order to ensure a safe creepage distance for high voltage output and effectively improve the electrical performance of the packaged product, it is preferable that the horizontal distance between the chip carrying region and the bonding region of the first pins 14 and the bonding region of the second pins 15 is 0.30mm, the pin region 3 is higher than the chip carrying region, and the vertical distance is 1.30 mm.
Further, in order to ensure the structural strength of the packaged product and prevent the product from dragging and cracking, preferably, a first corner is arranged at the upper right corner of the first pin welding area 7, a second corner and a third corner are respectively arranged at the upper right corner and the lower left corner of the second pin welding area 10, the oblique edges of the three corners are parallel, and the angles of the three corners are 40-50 degrees; the area of the second lead bonding area 10 is 1.8 times to 2.4 times that of the first lead bonding area 7. Further, in order to ensure good waterproof performance and structural strength of the slide area and prevent moisture in the slide area from entering and being pulled and cracked by stress in the X direction, preferably, a semicircular glue locking groove 9 and a first pin V-groove 8 are formed in the part where the first pin 14 is connected with the first pin welding area 7; the semicircular glue locking groove 9 is positioned at the connecting part of the first pin 14 and the first pin welding area 7 and is close to one side of the second pin welding area 10, and the shape of the semicircular glue locking groove is semicircular, so that the semicircular glue locking groove 9 is called; the part of the second pin 15, which is connected with the second pin welding area 10, is provided with a circular glue locking groove 12 and a second pin V groove 11; since the circular shaped glue-locking groove 12 is located in the portion where the second pin 15 and the second pin land 10 meet and has a circular shape, it is called the circular shaped glue-locking groove 12.
As shown in fig. 1, in this embodiment, when two connecting ribs 6 are respectively disposed on two sides of the chip carrying region included in the lead frame unit, one connecting rib 6 is shared between two adjacent lead frame units, that is, the two adjacent lead frame units include three connecting ribs 6 in total.
In this embodiment, the flow channel waist holes 17 and the non-flow channel waist holes 18 are sequentially arranged on the connecting rib 6 between the middle rib 13 and the frame 16 at intervals, and one connecting rib 6 is provided with two flow channel waist holes 17 or two non-flow channel waist holes 18 having the same aperture, it should be noted that the flow channel waist holes 17 and the non-flow channel waist holes 18 shown in fig. 1 have the same aperture.
Example 2
As shown in fig. 4, the lead frame is an improvement on the lead frame provided in embodiment 1, and while ensuring the structural stability of the frame, two adjacent lead frame units are arranged as a group of lead frames, the group of lead frames takes off the connecting rib in the middle of the two carrier areas, and the aperture of the non-flow-channel waist hole 18 in the middle of the two frames is increased. In the embodiment of the invention, the connecting ribs 6 in the middle of the slide area are optimized from one for each unit to be one for every two units, so that raw materials are saved.
Further, in order to save raw materials, under the framework stability, a flow passage waist hole 17 and a non-flow passage waist hole 18 with different apertures may be provided below the middle rib 13. In this embodiment, the aperture of the non-flow-passage waist hole 18 is 2 to 3 times the aperture of the flow-passage waist hole 17.
Example 3:
on the basis of the embodiments 1 and 2, the lead frame can be subjected to different electroplating process surface treatments in a pin welding area and a chip carrying area so as to improve the welding strength of a bonding wire and the pin welding area. The pin pad is nickel plated as shown in fig. 5, or the pin pad and carrier are all nickel plated as shown in fig. 6.
In summary, the embodiment of the present invention provides a novel TO-263 lead frame, including: a heat dissipation area, a chip carrying area and a pin area; the heat dissipation area is arranged above the chip carrying area, and an oval glue locking groove is arranged between the heat dissipation area and the chip carrying area; the pin area is arranged below the chip carrying area, and a frame is arranged below the chip carrying area; the lead area is provided with a first lead and a second lead, and a space is reserved between the first lead and the second lead. In the lead frame provided by the embodiment, the two pins with a gap are arranged in the pin area, and are separated from the chip area, so that the creepage distance between the heat dissipation area and the pins is increased, the creepage distance for high-voltage output safety can be ensured, and the electrical property of a packaged product is effectively improved; moreover, be provided with oval lock glue groove between radiating area and slide glass district, guaranteeing that the plastic-sealed body combines well with the frame, when improving encapsulation product pull strength, can make carrier Y direction distance become bigger, can bond bigger specification chip, processing chip size scope is wider, satisfies different user demands.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A novel TO-263 lead frame, comprising: a heat dissipation area, a chip carrying area and a pin area;
the heat dissipation area is arranged above the chip carrying area, and an oval glue locking groove is arranged between the heat dissipation area and the chip carrying area;
the pin area is arranged below the chip carrying area, and a frame is arranged below the pin area;
the lead area is provided with a first lead and a second lead, and the chip carrying area is isolated from the first lead and the second lead.
2. The lead frame of claim 1, further comprising a first pin land and a second pin land;
a first corner is arranged at the upper right corner of the first pin welding area, a second corner and a third corner are respectively arranged at the upper right corner and the lower left corner of the second pin welding area, and inclined edges included in the first corner, the second corner and the third corner are parallel to each other;
the first pin is connected with the first pin welding area, and the second pin is connected with the second pin welding area.
3. Leadframe according to claims 1 and 2, characterized in that the horizontal distance between the carrier area and the first and second pin lands is 0.30mm and the vertical distance is 1.30 mm;
the distance between the first pin and the second pin is 5.08 mm.
4. The lead frame of claim 2, wherein the angles of the first, second and third corners are each between 40 ° and 50 °;
the area of the second pin welding area is 1.8-2.4 times of the area of the first pin welding area.
5. The lead frame according to claim 2, wherein the portion of the first lead that meets the first lead bonding area is provided with a semicircular glue-locking groove and a first lead V-groove, the semicircular glue-locking groove being located on a side of the portion of the first lead that meets the first lead bonding area and adjacent to the second lead bonding area;
the part, connected with the second pin welding area, of the second pin is provided with a circular glue locking groove and a second pin V groove, and the circular glue locking groove is located in the part, connected with the second pin welding area, of the second pin.
6. The lead frame of claim 1, further comprising a fourth corner and a dovetail slot between the heat spreading region and the carrier region;
the front surface and the back surface of the oval glue locking groove are sequentially punched and formed, and the thickness of the oval glue locking groove is 1.3 mm;
the front surface of the oval glue locking groove is 3.8mm long and 1.2mm wide; the reverse side of the oval glue locking groove is 3.6mm long and 1mm wide;
and filling plastic packaging materials in the packaged elliptical glue locking groove.
7. The lead frame of claim 1, wherein a first V-groove is disposed around the chip area; the left side and the right side of the slide glass area are provided with a stepped semi-punching structure, and the stepped semi-punching structure is positioned on one side of the first V-shaped groove far away from the slide glass area;
the slide area comprises a base island; or the slide region includes two base islands.
8. The lead frame of claim 1, further comprising a connecting rib;
the heat dissipation area, the chip carrying area, the middle ribs, the pin areas and the frame form a lead frame unit;
two sides of a chip carrying area included by the lead frame units are respectively provided with a connecting rib, and one connecting rib is shared between every two adjacent lead frame units; or the two adjacent lead frame units are a group of lead frames, and two non-adjacent side edges of the two carrying areas in the group of lead frames are respectively provided with a connecting rib.
9. The lead frame according to claim 1, further comprising a flow channel waist hole and a non-flow channel waist hole, wherein the diameter of the non-flow channel waist hole is greater than or equal to that of the flow channel waist hole;
the runner waist hole and the non-runner waist hole are arranged on the connecting rib between the middle rib and the frame at intervals in sequence.
10. The lead frame of claim 1, wherein the heat spreading region comprises a top heat spreading region and a back heat spreading region;
the top heat dissipation area is arranged above the chip carrying area;
the back heat dissipation area is arranged right below the chip carrying area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110900315.1A CN113644043A (en) | 2021-08-06 | 2021-08-06 | Novel TO-263 lead frame |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110900315.1A CN113644043A (en) | 2021-08-06 | 2021-08-06 | Novel TO-263 lead frame |
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| CN113644043A true CN113644043A (en) | 2021-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110900315.1A Pending CN113644043A (en) | 2021-08-06 | 2021-08-06 | Novel TO-263 lead frame |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115050720A (en) * | 2022-08-15 | 2022-09-13 | 华羿微电子股份有限公司 | Top heat dissipation power device lead frame |
| CN115472587A (en) * | 2022-11-14 | 2022-12-13 | 华羿微电子股份有限公司 | Lead frame compatible with large chip and large creepage distance |
-
2021
- 2021-08-06 CN CN202110900315.1A patent/CN113644043A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115050720A (en) * | 2022-08-15 | 2022-09-13 | 华羿微电子股份有限公司 | Top heat dissipation power device lead frame |
| CN115050720B (en) * | 2022-08-15 | 2023-01-06 | 华羿微电子股份有限公司 | Top heat dissipation power device lead frame |
| CN115472587A (en) * | 2022-11-14 | 2022-12-13 | 华羿微电子股份有限公司 | Lead frame compatible with large chip and large creepage distance |
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