CN113640555B - Array type thin film probe card and test module thereof - Google Patents
Array type thin film probe card and test module thereof Download PDFInfo
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- CN113640555B CN113640555B CN202010391464.5A CN202010391464A CN113640555B CN 113640555 B CN113640555 B CN 113640555B CN 202010391464 A CN202010391464 A CN 202010391464A CN 113640555 B CN113640555 B CN 113640555B
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- conductive bumps
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- thin film
- probe card
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- 239000000523 sample Substances 0.000 title claims abstract description 66
- 239000010409 thin film Substances 0.000 title claims abstract description 40
- 238000012360 testing method Methods 0.000 title claims abstract description 25
- 239000010408 film Substances 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 7
- 238000004378 air conditioning Methods 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000000806 elastomer Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
Abstract
The invention discloses an array type film probe card and a testing module thereof. The film sheet comprises a carrier locally arranged on the elastic pad, a plurality of signal lines arranged on the carrier, and a plurality of conductive bumps respectively formed on the signal lines. The plurality of conductive bumps are arranged in an annular manner, one ends of the plurality of vertical probes are positioned on the inner sides of the plurality of conductive bumps, and the ends of the plurality of vertical probes and the tail ends of the plurality of conductive bumps are arranged in a coplanar manner. Therefore, an array detection point is formed by the configuration of the plurality of conductive bumps and the plurality of vertical probes, so that the application and test range of the array thin film probe card are effectively expanded.
Description
Technical Field
The present invention relates to probe cards, and more particularly, to an array type thin film probe card and a testing module thereof.
Background
When the conventional thin film probe card is used for testing by propping a plurality of conductive bumps annularly arranged on an object to be tested (device under test, DUT), the conventional thin film probe card is only suitable for peripheral type testing, but cannot be applied to array type testing.
Accordingly, the present inventors considered that the above-mentioned drawbacks could be improved, and have intensively studied and combined with the application of scientific principles, and finally have proposed an invention which is reasonable in design and effectively improves the above-mentioned drawbacks.
Disclosure of Invention
The embodiment of the invention provides an array type thin film probe card and a testing module thereof, which can effectively improve the defects possibly generated by the existing thin film probe card.
The embodiment of the invention discloses an array type thin film probe card, which comprises: an adapter plate; the bearing unit is arranged on the adapter plate; a plurality of vertical probes positioned on the bearing unit; the elastic pad is arranged on the bearing unit so that the bearing unit is clamped between the elastic pad and the adapter plate; and a film sheet defining an outer block, an inner block having a level difference in a height direction from the outer block, and an extension block connecting the outer block and the inner block; wherein the film sheet comprises: the carrier is at least partially arranged on the elastic pad at the position of the inner block, and at least partially arranged on the adapter plate at the position of the carrier of the outer block; the plurality of signal lines are arranged on the carrier, and at least part of the plurality of signal lines are electrically coupled with the adapter plate; the plurality of conductive bumps are positioned in the inner block and respectively formed on the plurality of signal lines, and are arranged in an annular arrangement; one end of the plurality of vertical probes is positioned at the inner side of the plurality of conductive bumps, one end of the plurality of vertical probes and the tail ends of the plurality of conductive bumps are arranged in a coplanar manner, and the other ends of the plurality of vertical probes are connected and electrically coupled with the adapter plate.
Preferably, a plurality of grooves are formed at the carrier part of the inner block so that the carrier forms a plurality of actuating sections in the inner block, and the signal lines of the inner block are respectively positioned on the actuating sections; the film sheet comprises a plurality of independent cylinders arranged between the plurality of actuating sections and the elastic pad, and the plurality of independent cylinders respectively correspond to the plurality of conductive bumps along the height direction, so that the carrier part positioned in the inner block is in a ladder-shaped structure.
Preferably, when any one of the conductive bumps and its corresponding independent cylinder are orthographically projected to a plane along the height direction, a projection area formed by the conductive bump is located within an outer contour of the projection area formed by the independent cylinder.
Preferably, a central axis of any one conductive bump overlaps a central axis of the corresponding independent cylinder and is parallel to the height direction.
Preferably, any one of the individual cylinders has a supporting height in the height direction, and any one of the conductive bumps has a protruding height in the height direction, and the supporting height is not less than the protruding height and not more than five times the protruding height.
Preferably, the plurality of signal lines, the plurality of conductive bumps and the plurality of independent cylinders are all made of the same material, and a ring side edge of each independent cylinder is exposed to air.
Preferably, each conductive bump includes a claw-shaped metal structure electrically coupled to the corresponding signal line and an elastomer located inside the claw-shaped metal structure; wherein, in each conductive bump, the claw-like metal structure can be elastically deformed by pressing against the elastic body.
Preferably, the array type thin film probe card further comprises at least one coaxial connector mounted on the adapter plate, the plurality of signal lines of the thin film sheet comprise at least one high-frequency signal line, and the part of the at least one high-frequency signal line located on the outer block is connected with the at least one coaxial connector.
The embodiment of the invention also discloses a test module of the array type thin film probe card, which comprises: a bearing unit; a plurality of vertical probes positioned on the bearing unit; an elastic pad arranged on the bearing unit; and a film sheet defining an outer block, an inner block having a level difference in a height direction from the outer block, and an extension block connecting the outer block and the inner block; wherein the film sheet comprises: the carrier is arranged on the elastic pad at the position of the inner block; a plurality of signal lines disposed on the carrier; a kind of electronic device with high-pressure air-conditioning system
The plurality of conductive bumps are positioned in the inner block and respectively formed on the plurality of signal lines, and are arranged in an annular arrangement; one end of the plurality of vertical probes is positioned on the inner side of the plurality of conductive bumps, and one end of the plurality of vertical probes and the tail ends of the plurality of conductive bumps are arranged in a coplanar manner.
Preferably, a plurality of grooves are formed at the carrier part of the inner block so that the carrier forms a plurality of actuating sections in the inner block, and the signal lines of the inner block are respectively positioned on the actuating sections; the film sheet comprises a plurality of independent cylinders arranged between the plurality of actuating sections and the elastic pad, and the plurality of independent cylinders respectively correspond to the plurality of conductive lugs along the height direction so that the carrier part positioned in the inner block is in a ladder-shaped structure; wherein, a central axis of any conductive bump is overlapped with a central axis of the corresponding independent cylinder and is parallel to the height direction; when any conductive bump and the corresponding independent cylinder are orthographically projected to a plane along the height direction, a projection area formed by the conductive bump is positioned within the outline of the projection area formed by the independent cylinder.
In summary, the array type thin film probe card and the testing module thereof disclosed in the embodiments of the present invention form an array type testing point through the configuration of the plurality of conductive bumps and the plurality of vertical probes, so as to effectively expand the application and testing range of the array type thin film probe card.
For a further understanding of the nature and the technical aspects of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are included to illustrate and not to limit the scope of the invention.
Drawings
Fig. 1 is a schematic perspective view of an array type thin film probe card according to an embodiment of the invention.
Fig. 2 is a schematic cross-sectional view along section line II-II of fig. 1.
Fig. 3 is a schematic perspective view of a portion (e.g., conductive bump and corresponding portion) of a thin film sheet of an array type thin film probe card according to a second embodiment of the present invention.
Fig. 4 is a schematic perspective view of an array type thin film probe card according to a third embodiment of the present invention.
Fig. 5 is a schematic bottom view of fig. 4.
Fig. 6 is a perspective view of the elastic pad and the film sheet of fig. 4.
Fig. 7 is another perspective view of the elastic pad and the film sheet of fig. 4.
Fig. 8 is a schematic cross-sectional view along section line VIII-VIII of fig. 4.
Fig. 9 is an enlarged schematic view of the portion IX in fig. 8.
Detailed Description
The following specific embodiments are described in order to explain the present invention, which relates to an array type thin film probe card and a testing module thereof, and those skilled in the art will appreciate the advantages and effects of the present invention from the disclosure herein. The invention is capable of other and different embodiments and its several details are capable of modifications and various other uses and applications, all of which are obvious from the description, without departing from the spirit of the invention. The drawings of the present invention are merely schematic illustrations, and are not intended to be drawn to actual dimensions. The following embodiments will further illustrate the related art content of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or signal from another signal. In addition, the term "or" as used herein shall include any one or combination of more of the associated listed items as the case may be.
Example one
Referring to fig. 1 and 2, the present embodiment discloses an array type thin film probe card 100, which includes an adapter plate 1 (space transformer), a carrier unit 2 disposed on the adapter plate 1, at least one coaxial connector 3 mounted on the adapter plate 1, a plurality of vertical probes 4 positioned on the carrier unit 2, an elastic pad 5 disposed on the carrier unit 2, and a thin film sheet 6 partially disposed on the elastic pad 5. The carrier unit 2, the plurality of vertical probes 4, the elastic pad 5, and the film sheet 6 may also be referred to as a testing module in this embodiment, and the testing module may also be applied (e.g. sold) alone or used with other components.
The carrying unit 2 is disposed at a substantially central portion of the adapter plate 1 in the present embodiment, and at least one of the coaxial connectors 3 is located outside the carrying unit 2. The at least one coaxial connector 3 may be disposed through the adapter plate 1 or disposed on the surface of the adapter plate 1 according to design requirements.
Furthermore, the carrying unit 2 is illustrated in the present embodiment as a guide plate assembly (e.g., the guide plate assembly includes an upper guide plate, a lower guide plate, and a spacer plate sandwiched between the upper guide plate and the lower guide plate), but the present invention is not limited thereto. It should be noted that the specific configurations of the vertical probe 4 and the carrying unit 2 may be adjusted and changed according to the design requirement, and the invention is not limited herein.
The elastic pad 5 may be made of a material or a structure that can be restored after being deformed under pressure, and the elastic pad 5 is made of an insulating material such as a silica gel pad in the present embodiment, but the invention is not limited thereto. Wherein the elastic pad 5 is disposed on the carrying unit 2, and the periphery of the elastic pad 5 is aligned with the periphery of the carrying unit 2 in the present embodiment; that is, the carrying unit 2 is clamped between the adapter plate 1 and the elastic pad 5 in the present embodiment. Furthermore, the elastic pad 5 is annular in this embodiment, and the plurality of vertical probes 4 pass through the inner side of the elastic pad 5.
The film 6 defines an outer block 6a, an inner block 6b having a level difference from the outer block 6a in a height direction H, and an extension block 6c connecting the outer block 6a and the inner block 6b. In this embodiment, the inner block 6b corresponds to the elastic pad 5 in position and size, and the extension block 6c connects the outer block 6a and the inner block 6b in an inclined manner.
The film sheet 6 includes a carrier 61 having a sheet shape, a plurality of signal lines 62 disposed on the carrier 61, and a plurality of conductive bumps 63 respectively disposed on the plurality of signal lines 62. The carrier 61 is preferably made of an insulating material, the portion of the carrier 61 located in the inner block 6b is at least partially disposed on the elastic pad 5, and the portion of the carrier 61 located in the outer block 6a is at least partially disposed on the adapter plate 1.
A plurality of the signal lines 62 are formed on the carrier 61, and each of the signal lines 62 extends from the outer block 6a to the inner block 6b, and each of the signal lines 62 may be linear or irregular, which is not limited thereto.
In this embodiment, the signal lines 62 of the film sheet 6 include at least one high-frequency signal line 621, and at least one portion of the high-frequency signal line 621 located in the outer area 6a is connected to at least one of the coaxial connectors 3, so that the array film probe card 100 can stably and accurately transmit high-frequency signals through the cooperation between the high-frequency signal line 621 and the coaxial connectors 3. The connection between the high-frequency signal line 621 and the coaxial connector 3 may be a horizontal connection (not shown) or a vertical connection (e.g. fig. 2) according to design requirements, which is not limited herein.
Furthermore, at least some of the signal lines 62 of the plurality of signal lines 62 are electrically coupled to the interposer 1. In the present embodiment, the other signal lines 62 except the high-frequency signal line 621 are electrically coupled to the interposer 1, and the electrical coupling between the signal line 62 and the interposer 1 may be soldering, pressing connection, connector engagement, or reed abutment, but the present invention is not limited thereto.
The conductive bumps 63 are disposed in an annular arrangement in the inner block 6b, and the conductive bumps 63 are respectively formed on the signal lines 62. Wherein, each conductive bump 63 is integrally connected to the corresponding signal line 62 in the present embodiment; that is, each conductive bump 63 and the corresponding signal line 62 are made of the same material. In more detail, each of the conductive bumps 63 is a tapered metal structure in the present embodiment, and the tapered metal structure may be tapered, pyramidal, truncated conical, or truncated conical, which is not limited herein.
In addition, one ends (such as the bottom ends in fig. 2) of the vertical probes 4 are located inside the conductive bumps 63, and the one ends of the vertical probes 4 are coplanar with the ends of the conductive bumps 63 (such as the coplanar arrangement is a reasonable tolerance range), while the other ends (such as the top ends in fig. 2) of the vertical probes 4 are connected to and electrically coupled to the interposer 1.
Accordingly, the conductive bumps 63 of the thin film 6 and the vertical probes 4 can together form an array-type probing point, so as to effectively expand the application and testing range of the array-type thin film probe card 100.
Example two
Please refer to fig. 3, which is a second embodiment of the present invention, the second embodiment is similar to the first embodiment, so the same parts of the two embodiments will not be described again, and the differences between the first embodiment and the second embodiment are substantially as follows:
in this embodiment, each of the conductive bumps 63 includes a claw-shaped metal structure 631 electrically coupled to the corresponding signal line 62 and an elastic body 632 (e.g. silica gel or foam) located inside the claw-shaped metal structure 631. In each of the conductive bumps 63, the claw-shaped metal structure 631 can be elastically deformed by being pressed against the elastic body 632, so that the conductive bump 63 can be more stably abutted against the object to be tested.
Example III
Referring to fig. 4 to 9, a third embodiment of the present invention is similar to the first and second embodiments, so the same parts of the first embodiment will not be described again, and the differences between the first and second embodiments are substantially as follows:
in this embodiment, as shown in fig. 4 and 5, the carrier 61 may be formed into a single-sheet or multi-sheet structure according to design requirements, and a plurality of grooves 612 are formed at the carrier 61 portion of the inner block 6b, so that the carrier 61 forms a plurality of actuating segments 611 in the inner block 6b. In more detail, each of the grooves 612 formed by the carrier 61 extends from the inner block 6b to the extension block 6c in the present embodiment; that is, each of the actuating segments 611 is located between the inner block 6b and the extension block 6c, but the present invention is not limited thereto. For example, in other embodiments not shown in the present disclosure, each of the grooves 612 formed by the carrier 61 may extend from the inner block 6b to the outer block 6a, so that each of the actuating segments 611 is located in the inner block 6b, the extension block 6c, and the outer block 6a.
Furthermore, as shown in fig. 5 to 7, the portions of the signal lines 62 located in the inner block 6b are located on the actuating sections 611, respectively. It should be further noted that the positions of the signal lines 62 in the inner block 6b are respectively located on the plurality of actuating segments 611 one to one in the present embodiment, but the invention is not limited thereto. For example, in other embodiments of the present invention, which are not shown, the portions of the signal lines 62 located in the inner block 6b may be located on the plurality of actuating segments 611 in a pair-to-pair manner.
The film 6 further includes a plurality of independent cylinders 64 disposed between the actuating segments 611 and the elastic pad 5 in the present embodiment, and the independent cylinders 64 respectively correspond to the conductive bumps 63 along the height direction H, so that the portion of the carrier 61 located in the inner block 6b has a step-like structure. Wherein a plurality of the independent cylinders 64 are arranged at intervals, and a ring side edge of each independent cylinder 64 is exposed to air; alternatively, the annular side edge of each of the individual cartridges 64 may form a gap G with the portion of the carrier 61 that is stepped.
Further, the independent cylinder 64 may be made of an insulating material or a conductive material (e.g., metal); in this embodiment, the materials of the signal lines 62, the conductive bumps 63, and the individual cylinders 64 are preferably the same, so as to facilitate the production of the film sheet 6. The material of the independent cylinder 64 may be copper exposed to the atmosphere, so as to ensure a low contact resistance (e.g., the copper is coated with an oxidation-resistant material).
In addition, in order to provide the film 6 with better performance, the independent cylinder 64 may have at least one of the following conditions, but the invention is not limited thereto. As shown in fig. 8 and 9, a central axis C of any one of the conductive bumps 63 overlaps a central axis C of the corresponding independent cylinder 64 and is parallel to the height direction H. Furthermore, any one of the individual cylinders 64 has a supporting height H64 in the height direction H, and any one of the conductive bumps 63 has a protruding height H63 in the height direction H, and the supporting height H64 is not smaller than the protruding height H63 and not larger than five times the protruding height H63. In addition, when any one of the conductive bumps 63 and the corresponding independent cylinder 64 are orthographically projected onto a plane along the height direction H, a projection area formed by the conductive bump 63 is located within an outer contour of the projection area formed by the independent cylinder 64.
Accordingly, when any one of the conductive bumps 63 is pressed, the corresponding signal line 62 and the actuating section 611 only press the corresponding independent cylinder 64 (i.e. the different conductive bumps 63 are not linked by the carrier 61), so that the array thin film probe card 100 can reduce the linking of the plurality of conductive bumps 63, so that the plurality of conductive bumps 63 can be uniformly stressed and stably abutted against the plurality of metal pads of the object to be tested. Further, the array thin film probe card 100 can also have a wider test area (or a wider distribution range of the plurality of conductive bumps 63).
[ technical Effect of embodiments of the invention ]
In summary, in the array type thin film probe card and the testing module thereof disclosed in the embodiments of the present invention, the plurality of conductive bumps and the plurality of vertical probes can together form an array type testing point, so as to effectively expand the application and testing range of the array type thin film probe card. Furthermore, in the array thin film probe card disclosed in the embodiment of the present invention, the claw-shaped metal structure in each of the conductive bumps can be elastically deformed by being pressed against the elastic body, so that the conductive bumps can be more stably abutted against the object to be tested.
In addition, in the array type thin film probe card disclosed by the embodiment of the invention, when any one of the conductive bumps is pressed, the corresponding signal line and the corresponding actuating section only press the corresponding independent cylinder, so that the linkage among a plurality of the conductive bumps of the array type thin film probe can be reduced, and the conductive bumps can be uniformly stressed and stably propped against a plurality of metal pads of the object to be tested. Furthermore, the array type thin film probe can also enable the testing area (or the distribution range of a plurality of conductive bumps) to be wider.
The above disclosure is only a preferred embodiment of the present invention and is not intended to limit the claims of the present invention, so that all equivalent technical changes made by the application of the specification and the drawings of the present invention are included in the claims of the present invention.
Claims (9)
1. An array type thin film probe card, characterized in that the array type thin film probe card comprises:
an adapter plate;
the bearing unit is arranged on the adapter plate;
a plurality of vertical probes positioned at the carrier unit;
the elastic pad is arranged on the bearing unit so that the bearing unit is clamped between the elastic pad and the adapter plate; and
a film sheet defining an outer block, an inner block having a level difference in a height direction from the outer block, and an extension block connecting the outer block and the inner block; wherein the film sheet comprises:
the part of the carrier positioned on the inner block is at least partially arranged on the elastic pad, and the part of the carrier positioned on the outer block is at least partially arranged on the adapter plate;
a plurality of signal lines disposed on the carrier, and at least some of the signal lines are electrically coupled to the interposer; a kind of electronic device with high-pressure air-conditioning system
The conductive bumps are positioned in the inner block and respectively formed on the signal lines, and the conductive bumps are arranged in an annular arrangement;
one ends of the vertical probes are positioned on the inner sides of the conductive bumps, the one ends of the vertical probes and the tail ends of the conductive bumps are arranged in a coplanar manner, and the other ends of the vertical probes are connected and electrically coupled with the adapter plate;
each conductive bump comprises a claw-shaped metal structure electrically coupled with the corresponding signal line and an elastomer positioned on the inner side of the claw-shaped metal structure; wherein, in each of the conductive bumps, the claw-like metal structure is elastically deformable by being pressed against the elastic body.
2. The array type thin film probe card of claim 1, wherein a plurality of grooves are formed at the parts of the carrier located at the inner block so that the carrier forms a plurality of actuating sections at the inner block, and the parts of the plurality of signal lines located at the inner block are respectively located at the plurality of actuating sections; the film sheet comprises a plurality of independent cylinders arranged between the actuating sections and the elastic pad, and the independent cylinders respectively correspond to the conductive bumps along the height direction, so that the part of the carrier positioned in the inner block is in a ladder-shaped structure.
3. The array type thin film probe card of claim 2, wherein when any one of the conductive bumps and the corresponding independent cylinder are orthographically projected to a plane along the height direction, a projection area formed by the conductive bump is located within an outer contour of the projection area formed by the independent cylinder.
4. The array type thin film probe card of claim 2, wherein a central axis of any one of the conductive bumps overlaps a central axis of the corresponding independent cylinder and is parallel to the height direction.
5. The array film probe card of claim 2, wherein any one of the individual cartridges has a supporting height in the height direction, and any one of the conductive bumps has a protruding height in the height direction, and the supporting height is not less than the protruding height and not more than five times the protruding height.
6. The array type thin film probe card of claim 2, wherein the plurality of signal lines and the plurality of individual cartridges are made of the same material, and a ring side edge of each of the individual cartridges is exposed to air.
7. The array type thin film probe card of claim 1, further comprising at least one coaxial connector mounted to the adapter plate, wherein the plurality of signal lines of the thin film sheet comprise at least one high frequency signal line, and a portion of the at least one high frequency signal line located in the outer region is connected to the at least one coaxial connector.
8. A test module for an array type thin film probe card, the test module comprising:
a bearing unit;
a plurality of vertical probes positioned at the carrier unit;
an elastic pad arranged on the bearing unit; and
a film sheet defining an outer block, an inner block having a level difference in a height direction from the outer block, and an extension block connecting the outer block and the inner block; wherein the film sheet comprises:
a carrier, which is arranged on the elastic pad at the position of the inner block;
a plurality of signal lines disposed on the carrier; a kind of electronic device with high-pressure air-conditioning system
The conductive bumps are positioned in the inner block and respectively formed on the signal lines, and the conductive bumps are arranged in an annular arrangement;
one ends of the vertical probes are positioned on the inner sides of the conductive bumps, and the one ends of the vertical probes and the tail ends of the conductive bumps are arranged in a coplanar manner;
each conductive bump comprises a claw-shaped metal structure electrically coupled with the corresponding signal line and an elastomer positioned on the inner side of the claw-shaped metal structure; wherein, in each of the conductive bumps, the claw-like metal structure is elastically deformable by being pressed against the elastic body.
9. The module according to claim 8, wherein the carrier is formed with a plurality of grooves at the portion of the inner block so that the carrier forms a plurality of operation sections in the inner block, and the signal lines at the portion of the inner block are respectively located on the plurality of operation sections; the film sheet comprises a plurality of independent cylinders arranged between the actuating sections and the elastic pad, and the independent cylinders respectively correspond to the conductive bumps along the height direction so that the part of the carrier positioned in the inner block is in a ladder-shaped structure; wherein a central axis of any one of the conductive bumps overlaps a central axis of the corresponding independent cylinder and is parallel to the height direction; when any one of the conductive bumps and the corresponding independent cylinder are orthographically projected to a plane along the height direction, a projection area formed by the conductive bump is positioned within the outer contour of the projection area formed by the independent cylinder.
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| CN202010391464.5A CN113640555B (en) | 2020-05-11 | 2020-05-11 | Array type thin film probe card and test module thereof |
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| CN202010391464.5A CN113640555B (en) | 2020-05-11 | 2020-05-11 | Array type thin film probe card and test module thereof |
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| CN114200280B (en) * | 2021-11-29 | 2022-11-15 | 强一半导体（苏州）有限公司 | Film probe card and probe head thereof |
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| CN113640555A (en) | 2021-11-12 |
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