CN113634890A - Laser welding system and laser welding method - Google Patents
Laser welding system and laser welding method Download PDFInfo
- Publication number
- CN113634890A CN113634890A CN202010394187.3A CN202010394187A CN113634890A CN 113634890 A CN113634890 A CN 113634890A CN 202010394187 A CN202010394187 A CN 202010394187A CN 113634890 A CN113634890 A CN 113634890A
- Authority
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- China
- Prior art keywords
- ball
- solder
- laser welding
- side plate
- solder balls
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 126
- 238000003860 storage Methods 0.000 claims abstract description 27
- 238000007664 blowing Methods 0.000 claims description 18
- 230000004907 flux Effects 0.000 claims description 16
- 230000000007 visual effect Effects 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 abstract 1
- 239000007921 spray Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000002893 slag Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
A laser welding system, comprising: a solder ball placing device and a laser generator. The solder ball placing device comprises: the solder ball storage component is used for temporarily storing solder balls; the solder ball transfer component is positioned on one side of the solder ball storage component and is used for sucking the solder balls from the solder ball storage component and transferring the solder balls to a bonding pad of an element to be welded. The laser generator is used for generating laser to perform laser welding on the solder balls on the bonding pads of the components to be welded. The invention also relates to a laser welding method. The laser welding system and the laser welding method provided by the invention have the advantages that the nozzle is not blocked, the drop point of the solder ball is accurate, and the molding is stable after the solder ball is melted.
Description
Technical Field
The invention relates to a laser welding system and a laser welding method using the same.
Background
According to the traditional nozzle type laser welding system design, the solder balls are melted and fall on the bonding pad through laser after falling to the nozzle opening, after long-term operation, tin slag generated by melting of the solder balls can be remained in the nozzle opening to cause blockage, the position of the melted solder balls falling on the bonding pad is inaccurate, and finally the melted solder balls are unstable in forming on the bonding pad. In the module assembling process, frequent disassembly and cleaning in the operation process due to blockage of a nozzle opening and re-debugging and calibration after disassembly seriously affect the production efficiency, and the problems of inaccurate drop point of the molten solder ball and unstable forming directly affect the welding quality and the production yield.
Disclosure of Invention
In view of the above, the present invention provides a laser welding system with a stable formation after melting of solder balls, which has a nozzle that is not blocked and a solder ball landing point that is accurate.
It is also necessary to provide a laser welding method using the laser welding system as described above.
A laser welding system, comprising: a solder ball placement device, the solder ball placement device comprising: the solder ball storage component is used for temporarily storing solder balls; the solder ball transfer component is positioned on one side of the solder ball storage component and is used for sucking the solder balls from the solder ball storage component and transferring the solder balls to a bonding pad of an element to be welded; and the laser generator is used for generating laser so as to carry out laser welding on the solder balls on the bonding pads of the components to be welded.
Further, the solder ball storage assembly comprises a ball nest, a connecting rod positioned below the ball nest and an oscillator formed on the ball nest; the ball nest is used for temporarily storing the solder balls; one end of the connecting rod is provided with a ball falling hole and a first ball hole positioned right below the ball falling hole; the oscillator vibrates the solder balls, so that the solder balls fall into the first ball cavities through the ball falling holes, and the connecting rods transfer the solder balls in the first ball cavities to the outside of the solder ball storage assembly.
Furthermore, the solder ball storage assembly also comprises a shell and an inclined plate positioned above the connecting rod, and the inclined plate and part of the shell form the ball nest; the shell comprises a first side plate and a second side plate opposite to the first side plate; one end of the connecting rod is abutted against the first side plate, and the other end of the connecting rod penetrates through the second side plate; one end of the inclined plate is fixed on the first side plate, and the other end of the inclined plate abuts against the connecting rod; the end of the connecting rod with the first ball hole can extend out of the second side plate.
Further, the housing further comprises a bottom plate connecting the first side plate and the second side plate and a top plate opposite to the bottom plate, the top plate is connected with the first side plate and the second side plate, and the top plate faces the inclined plate; the oscillator is arranged on the top plate.
Furthermore, the solder ball transfer assembly comprises a ball needle, a suction nozzle, an air duct, an air blowing control valve and an air suction control valve, wherein the suction nozzle is positioned at one end of the ball needle, the air duct is positioned inside the ball needle, the air duct is communicated with the suction nozzle, and the air blowing control valve and the air suction control valve are respectively positioned at the other end of the ball needle and are respectively communicated with the air duct; the suction nozzle is used for sucking air, blowing air, sucking or placing the solder balls; the air duct is used as a channel for inhaling and blowing air; the suction control valve is used for controlling the suction nozzle to suck air so as to suck the solder balls; and the air blowing control valve is used for controlling the suction nozzle to blow air so as to place the solder balls.
Furthermore, the ball needle also comprises a second ball hole inside, and the second ball hole is positioned between the air duct and the suction nozzle and is used for temporarily storing the solder balls sucked by the suction nozzle.
Furthermore, the solder ball transfer assembly further comprises a ball pin tilting member, and the ball pin tilting member is connected with the ball pin and used for controlling the tilting angle of the ball pin.
Further, the laser welding system also comprises a visual positioning recognition system which is used for positioning the welding pad of the element to be welded.
Further, the laser welding system also comprises a flux spray gun which is used for spraying flux on the welding pads of the components to be welded.
A laser welding method applying the laser welding system as described above, comprising: oscillating the solder ball storage assembly to enable the solder balls in the ball nest to roll to the lowest part of the ball nest and fall into the first ball hole through the ball falling hole; pushing the connecting rod to make one end of the connecting rod with a first ball hole extend out of the solder ball storage component; opening a suction control valve of the solder ball transfer assembly, and sucking the solder balls from the first ball holes by a suction nozzle of the solder ball transfer assembly; positioning a bonding pad of a component to be welded by using a visual positioning recognition system; spraying a soldering flux on the bonding pad of the element to be welded by using a soldering flux spray gun; according to the positioning of the visual positioning identification system, a suction nozzle of the tin ball transfer assembly moves to the position above the bonding pad of the component to be welded, the relative position of the suction nozzle and the bonding pad is adjusted, and a blowing control valve is opened to blow air towards the bonding pad so as to place the tin balls in the tin ball transfer assembly on the bonding pad; and starting a laser generator to perform laser welding on the solder balls.
The invention provides a laser welding system and a laser welding method using the same.1) a solder ball storage component, a solder ball transfer component and a laser generator are separately arranged, so that the placement of the solder balls and the laser welding can be separately operated, and the blockage caused by the residual tin slag generated by the melting of the solder balls at a nozzle opening can be avoided; 2) the visual positioning recognition system is used for positioning the bonding pad of the element to be welded, so that the problem of unstable forming caused by inaccurate position of the molten solder ball falling on the bonding pad can be avoided.
Drawings
Fig. 1 is a block diagram of a laser welding system according to a preferred embodiment of the present invention.
Fig. 2 is a schematic view of the solder ball placement device shown in fig. 1.
FIG. 3 is a schematic view of another state of the solder ball storage device shown in FIG. 2.
Fig. 4 is a schematic diagram of a bonding pad for positioning a component to be bonded by using a visual positioning recognition system according to a preferred embodiment of the present invention.
Fig. 5 is a schematic diagram of spraying flux on the pads of the components to be soldered by using a flux gun according to a preferred embodiment of the present invention.
FIG. 6 is a schematic view of the solder ball transfer device of FIG. 2 placing solder balls extracted from the solder ball storage device on pads of a component to be soldered.
Fig. 7 is a schematic view of laser welding using a laser generator.
Description of the main elements
Solder ball placing device 110
Solder ball storage assembly 10
Third side plate 115
Fourth side plate 116
Inclined plate 12
Ball nest 101
Connecting rod 13
Solder ball transfer assembly 20
Gas-guide tube 23
Purge control valve 26
Ball needle tilting member 27
Vision positioning recognition system 120
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description is given to the specific embodiments, structures, features and effects of the laser welding system provided by the present invention with reference to the accompanying drawings 1 to 7 and the preferred embodiments. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 3, a laser welding system 100 is provided according to a first embodiment of the present invention. The laser welding system 100 is used for welding the solder ball 200 on a pad 301 of a component 300 to be welded.
Referring to fig. 1, the laser welding system 100 includes a solder ball placement device 110, a visual positioning and recognition system 120, a flux gun 130, and a laser generator 140. Wherein, the visual positioning recognition system 120 is located at one side of the tin ball placing device 110.
Referring to fig. 2, the solder ball placement device 110 includes a solder ball storage device 10 and a solder ball transfer device 20 disposed on one side of the solder ball storage device 10.
Referring to fig. 2-3, the solder ball storage device 10 includes a housing 11, an inclined plate 12, a link 13 and an oscillator 14, wherein the inclined plate 12 and the link 12 are disposed in the housing 11. The oscillator 14 is disposed outside the housing 11. The inclined plate 12 is located between the link 13 and the oscillator 14.
In the present embodiment, the housing 11 is shaped like a boss-shaped hexahedron. Of course, in other embodiments, the shape of the housing 11 is not limited to a boss-like hexahedron.
Specifically, the housing 11 includes a first side plate 111, a second side plate 112 opposite to the first side plate 111, a third side plate 115 connecting the first side plate 111 and the second side plate 112, a fourth side plate 116 opposite to the third side plate 115, a bottom plate 113 connecting the first side plate 111, the second side plate 112, the third side plate 115 and the fourth side plate 116, and a top plate 114 opposite to the bottom plate 113 and connecting the first side plate 111, the second side plate 112, the third side plate 115 and the fourth side plate 116. In the present embodiment, the height of the first side plate 111 is greater than the height of the second side plate 112, the third side plate 115 and the fourth side plate 116 are both vertically connected to the first side plate 111 and the second side plate 112, the bottom plate 113 is vertically connected to the first side plate 111 and the second side plate 112, and the top plate 114 is inclined with respect to the bottom plate 113.
One end of the inclined plate 12 is fixedly connected to the first side plate 111, and the other end of the inclined plate abuts against the connecting rod 13. The inclined plate 12 is located above the link 13 and is inclined with respect to the link 13. The inclined plate 12, the top plate 114, the first side plate 111, the second side plate 112, the third side plate 115 and the fourth side plate 116 form a ball nest 101 between the top plate 114 and the inclined plate 12. The ball nest 101 is used for temporarily storing the solder balls 200. The inclined plate 12 is inclined relative to the connecting rod 13, so that the solder balls 200 in the ball nest 101 can naturally roll to the lowest position of the ball nest 101.
The second side plate 112 is provided with an opening 1121 penetrating through the second side plate 112, and the opening 1121 faces the first side plate 111. One end of the connecting rod 13 abuts against the first side plate 111, and the other end is disposed in the opening 1121. Under the power of the power, the end of the connecting rod 13 with the first ball hole 132 can protrude from the opening 1121.
One end of the connecting rod 13 close to the opening 1121 is provided with a ball falling hole 131 and a first ball hole 132 located right below the ball falling hole 131 and communicated with the ball falling hole 131. The ball falling hole 131 is located at the point where the second side plate 112 abuts against the inclined plate 12 on the connecting rod 13. The ball falling hole 131 is an entrance for the solder ball in the ball nest 101 to enter the first ball hole 132. The first ball cavity 132 is used for receiving the solder ball 200 entering from the ball falling hole 131.
Wherein the oscillator 14 is fixed on the top plate 114, the oscillator 14 is configured to generate oscillation, and the solder balls 200 in the ball nest 101 roll along the inclined plate 12 along with the oscillation of the oscillator 14 until falling into the first ball cavities 132 from the ball falling holes 131.
Preferably, the oscillator 14 is an ultrasonic oscillator.
Wherein the solder ball transfer component 20 is located on one side of the second side plate 112.
Specifically, the solder ball transfer assembly 20 includes a ball pin 21, a suction nozzle 22, a gas tube 23, a suction control valve 25, a blowing control valve 26, and a ball pin tilting member 27.
Wherein the suction nozzle 22 is disposed at one end of the ball needle 21. The air duct 23 is provided inside the ball needle 21. The suction control valve 25 and the purge control valve 26 are provided at one end of the ball needle 21 away from the suction nozzle 22. One end of the air duct 23 is communicated with the suction nozzle 22, and the other end is communicated with the suction control valve 25 and the air blowing control valve 26, respectively. The ball needle tilting member 27 is disposed at an end of the ball needle 21 away from the suction nozzle 22 and connected to the ball needle 21.
Wherein, the suction nozzle 22 sucks air, blows air, sucks or places the solder ball 200.
Wherein the air duct 23 serves as a passage for inhaling and blowing air.
Wherein, the suction control valve 25 is used for controlling whether the suction nozzle 22 sucks air to suck the solder balls 200. Preferably, the suction control valve 25 is a negative pressure valve.
Wherein, the air blowing control valve 26 is used for controlling whether the suction nozzle 22 blows air or not so as to place the solder balls 200. In addition, the air blowing control valve 26 can blow air after the molten balls so as to assist the molten tin to be flattened, expanded and climbed on the welded elements and reduce the heat radiation effect of non-welding areas. Preferably, the blow control valve 26 is a positive pressure control valve.
The ball pin tilting member 27 is used for controlling the tilting angle of the ball pin 21 so as to accurately place the solder ball on the bonding pad 301 with different angles.
A second ball hole 24 is further disposed inside the ball needle 21, and the second ball hole 24 is located between the air duct 23 and the suction nozzle 22 and is used for temporarily storing the solder balls 200 sucked by the suction nozzle 22.
Wherein, the visual positioning recognition system 120 is located at one side of the tin ball placing device 110. The visual positioning recognition system 120 is used to position the pads 301 of the elements to be welded 300. Wherein, one vision positioning identification system 120 can position a plurality of bonding pads 301 at the same time.
Wherein, the soldering flux spray gun 130 is located at one side of the solder ball placing device 110. The flux spray gun 130 is used for spraying flux on the pads 301 of the components 300 to be soldered. Of course, in other embodiments, the flux gun 130 may be omitted.
Wherein the laser generator 140 is used for generating laser to melt the solder ball 200 placed on the pad 301 of the component 300 to be soldered, thereby soldering the solder ball 200 to the component 300 to be soldered.
Referring to fig. 2-7, the present invention further provides a laser welding method using the laser welding system 100, comprising the steps of:
step S1, the oscillator 14 is turned on, so that the solder balls 200 in the ball nest 101 roll to the lowest position of the ball nest 101, and fall into the first ball cavity 132 through the ball falling holes 131.
In step S2, the connecting rod 13 is pushed so that the end of the connecting rod 13 having the first ball hole 132 protrudes from the opening 1121 of the second side plate 112, and the first ball hole 132 faces the suction nozzle 22 of the solder ball transfer assembly 20.
In step S3, the suction control valve 25 is opened, suction force is generated at the suction nozzle 22, and the solder balls 200 in the first ball pockets 132 are sucked by the suction nozzle 22.
In step S4, the pads 301 of the component 300 to be soldered are positioned using the visual positioning recognition system 120.
Step S5, spraying flux on the pads 301 of the components to be soldered 300 using the flux spray gun 130.
Step S6, moving the suction nozzle 22 of the solder ball transfer assembly 20 to the position above the pad 301 of the component 300 to be soldered according to the positioning of the visual positioning recognition system 120, adjusting the relative position of the suction nozzle 22 and the pad 301 by using the ball pin tilting member 27, and opening the air blowing control valve 26 to blow air against the pad 301 to place the solder ball 200 in the second ball cavity 24 on the pad 301 of the component 300 to be soldered.
Step S7, the laser generator 140 is started to perform laser welding on the solder ball 200.
In other embodiments, step 5 may be omitted.
The invention provides a laser welding system and a laser welding method using the same.1) a solder ball storage component, a solder ball transfer component and a laser generator are separately arranged, so that the placement of the solder balls and the laser welding can be separately operated, and the blockage caused by the residual tin slag generated by the melting of the solder balls at a nozzle opening can be avoided; 2) the visual positioning recognition system is used for positioning the bonding pad of the element to be welded, so that the problem of unstable forming caused by inaccurate position of the molten solder ball falling on the bonding pad can be avoided.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A laser welding system, characterized in that the laser welding system comprises:
a solder ball placement device, the solder ball placement device comprising:
the solder ball storage component is used for temporarily storing solder balls;
the solder ball transfer component is positioned on one side of the solder ball storage component and is used for sucking the solder balls from the solder ball storage component and transferring the solder balls to a bonding pad of an element to be welded; and
and the laser generator is used for generating laser to carry out laser welding on the solder balls on the bonding pads of the components to be welded.
2. The laser welding system of claim 1, wherein the solder ball storage assembly comprises a ball nest, a connecting rod located below the ball nest, and an oscillator formed on the ball nest; the ball nest is used for temporarily storing the solder balls; one end of the connecting rod is provided with a ball falling hole and a first ball hole positioned right below the ball falling hole; the oscillator vibrates the solder balls, so that the solder balls fall into the first ball cavities through the ball falling holes, and the connecting rods transfer the solder balls in the first ball cavities to the outside of the solder ball storage assembly.
3. The laser welding system of claim 2, wherein the solder ball storage assembly further comprises a housing and a tilt plate disposed above the connecting rod, the tilt plate and a portion of the housing forming the ball nest; the shell comprises a first side plate and a second side plate opposite to the first side plate; one end of the connecting rod is abutted against the first side plate, and the other end of the connecting rod penetrates through the second side plate; one end of the inclined plate is fixed on the first side plate, and the other end of the inclined plate abuts against the connecting rod; the end of the connecting rod with the first ball hole can extend out of the second side plate.
4. The laser welding system of claim 3, wherein the housing further comprises a bottom plate connecting the first side plate and the second side plate and a top plate opposite the bottom plate, the top plate connecting the first side plate and the second side plate, the top plate facing the angled plate; the oscillator is arranged on the top plate.
5. The laser welding system as claimed in claim 2, wherein the solder ball transfer assembly includes a ball needle, a suction nozzle, a gas guiding tube, a blowing control valve, and a suction control valve, the suction nozzle is located at one end of the ball needle, the gas guiding tube is located inside the ball needle, the gas guiding tube is communicated with the suction nozzle, and the blowing control valve and the suction control valve are respectively located at the other end of the ball needle and are respectively communicated with the gas guiding tube; the suction nozzle is used for sucking air, blowing air, sucking or placing the solder balls; the air duct is used as a channel for inhaling and blowing air; the suction control valve is used for controlling the suction nozzle to suck air so as to suck the solder balls; and the air blowing control valve is used for controlling the suction nozzle to blow air so as to place the solder balls.
6. The laser welding system as claimed in claim 5, wherein the ball needle further comprises a second ball cavity therein, the second ball cavity is located between the gas-guiding tube and the suction nozzle and is used for temporarily storing the solder balls sucked by the suction nozzle.
7. The laser welding system as recited in claim 5, wherein the solder ball transfer assembly further comprises a ball pin tilting member, the ball pin tilting member being connected to the ball pin for controlling a tilting angle of the ball pin.
8. The laser welding system of claim 2, further comprising a visual positioning recognition system for positioning the pads of the components to be welded.
9. The laser welding system of claim 2, further comprising a flux gun for spraying flux on the pads of the components to be welded.
10. A laser welding method using the laser welding system according to any one of claims 2 to 9, comprising the steps of:
oscillating the solder ball storage assembly to enable the solder balls in the ball nest to roll to the lowest part of the ball nest and fall into the first ball hole through the ball falling hole;
pushing the connecting rod to make one end of the connecting rod with a first ball hole extend out of the solder ball storage component;
opening a suction control valve of the solder ball transfer assembly, and sucking the solder balls from the first ball holes by a suction nozzle of the solder ball transfer assembly;
positioning a bonding pad of a component to be welded by using a visual positioning recognition system;
according to the positioning of the visual positioning identification system, a suction nozzle of the tin ball transfer assembly moves to the position above the bonding pad of the component to be welded, the relative position of the suction nozzle and the bonding pad is adjusted, and a blowing control valve is opened to blow air towards the bonding pad so as to place the tin balls in the tin ball transfer assembly on the bonding pad; and
and starting a laser generator to perform laser welding on the solder balls.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010394187.3A CN113634890A (en) | 2020-05-11 | 2020-05-11 | Laser welding system and laser welding method |
| TW109117748A TW202142342A (en) | 2020-05-11 | 2020-05-27 | Laser welding system and laser welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010394187.3A CN113634890A (en) | 2020-05-11 | 2020-05-11 | Laser welding system and laser welding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113634890A true CN113634890A (en) | 2021-11-12 |
Family
ID=78415512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010394187.3A Pending CN113634890A (en) | 2020-05-11 | 2020-05-11 | Laser welding system and laser welding method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113634890A (en) |
| TW (1) | TW202142342A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5506385A (en) * | 1993-12-14 | 1996-04-09 | Fujitsu Limited | Apparatus for forming solder-film on printed-wiring board |
| WO1999017593A1 (en) * | 1997-09-26 | 1999-04-08 | Advanced System Automation Ltd. | Fluxless laser reflow with template for solder balls of bga packaging |
| CN102085590A (en) * | 2009-12-08 | 2011-06-08 | 日立环球储存科技荷兰有限公司 | Method of manufacturing head gimbal assembly and device for connecting magnetic head gimbal assemblies |
| CN103418875A (en) * | 2013-08-20 | 2013-12-04 | 歌尔声学股份有限公司 | Automatic solder ball implantation device |
| CN105033384A (en) * | 2015-08-14 | 2015-11-11 | 武汉锐泽科技发展有限公司 | Laser soldering method and camera welding equipment |
| CN110605450A (en) * | 2019-10-09 | 2019-12-24 | 昆山大鑫华激光科技有限公司 | Automatic, rapid and accurate tin ball separation and laser tin ball welding device and welding method |
-
2020
- 2020-05-11 CN CN202010394187.3A patent/CN113634890A/en active Pending
- 2020-05-27 TW TW109117748A patent/TW202142342A/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5506385A (en) * | 1993-12-14 | 1996-04-09 | Fujitsu Limited | Apparatus for forming solder-film on printed-wiring board |
| WO1999017593A1 (en) * | 1997-09-26 | 1999-04-08 | Advanced System Automation Ltd. | Fluxless laser reflow with template for solder balls of bga packaging |
| CN102085590A (en) * | 2009-12-08 | 2011-06-08 | 日立环球储存科技荷兰有限公司 | Method of manufacturing head gimbal assembly and device for connecting magnetic head gimbal assemblies |
| CN103418875A (en) * | 2013-08-20 | 2013-12-04 | 歌尔声学股份有限公司 | Automatic solder ball implantation device |
| CN105033384A (en) * | 2015-08-14 | 2015-11-11 | 武汉锐泽科技发展有限公司 | Laser soldering method and camera welding equipment |
| CN110605450A (en) * | 2019-10-09 | 2019-12-24 | 昆山大鑫华激光科技有限公司 | Automatic, rapid and accurate tin ball separation and laser tin ball welding device and welding method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202142342A (en) | 2021-11-16 |
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Application publication date: 20211112 |