CN113631002B - Shell assembly and electronic equipment - Google Patents

Shell assembly and electronic equipment Download PDF

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Publication number
CN113631002B
CN113631002B CN202111070597.3A CN202111070597A CN113631002B CN 113631002 B CN113631002 B CN 113631002B CN 202111070597 A CN202111070597 A CN 202111070597A CN 113631002 B CN113631002 B CN 113631002B
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pattern
layer
sub
conductive
pattern structure
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CN202111070597.3A
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CN113631002A (en
Inventor
叶万俊
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/0243—Mechanical details of casings for decorative purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units

Abstract

The application discloses a casing subassembly and electronic equipment. The shell assembly comprises a pattern visible area and a non-visible area, and the pattern visible area comprises: an electronic ink layer; the first pattern assembly comprises a plurality of first sub-pattern structure layers which are arranged in a stacked mode, each first sub-pattern structure layer comprises a first electrode pattern layer, a first insulating base material and a first conducting wire layer, each first electrode pattern layer comprises a first pattern area and a first non-pattern area which are arranged in an insulating mode at intervals, and the patterns of the first pattern areas of the first electrode pattern layers in different first sub-pattern structure layers are different; a second component disposed at one side of a second surface of the electronic ink layer, the second component including an insulating layer and an electrode layer; the optical coating layer is arranged on one side of the second component far away from the electronic ink layer; the substrate is arranged on one side of the optical coating layer, which is far away from the electronic ink layer. Therefore, the shell assembly can display different patterns, and the display is not single.

Description

Housing assembly and electronic device
Technical Field
The present application relates to the field of electronics, and in particular, to a housing assembly and an electronic device.
Background
With the development of communication technology, mobile terminals such as mobile phones and tablet computers have become indispensable tools for people. When a consumer faces a mobile terminal product with full-purpose of Lin Lang, the consumer needs to consider whether the functions of the product meet the requirements of the consumer and also consider the appearance of the product, that is, when the consumer selects the mobile terminal product at present, the appearance of the product can also be taken as one of important factors for purchasing. However, as the mobile terminal is iterated, the appearance of each brand of mobile terminal gradually becomes homogeneous, the appearance identification is poor, and after the mobile terminal leaves the factory, the color and the pattern of the mobile terminal are usually fixed and are easy to generate aesthetic fatigue for a long time.
Currently, the housing of the mobile terminal is still to be further improved.
Disclosure of Invention
The present application aims to mitigate or solve at least to some extent at least one of the above mentioned problems.
In one aspect of the present application, a housing assembly is provided, the housing assembly including a pattern visible region and a non-visible region, the pattern visible region including: an electronic ink layer having first and second oppositely disposed surfaces; the first pattern assembly is arranged on one side of the first surface and comprises a plurality of first sub-pattern structure layers which are arranged in a stacked mode, each first sub-pattern structure layer comprises a first electrode pattern layer, a first insulating base material and a first conducting wire layer which are arranged in a stacked mode sequentially, each first electrode pattern layer comprises first pattern areas and first non-pattern areas which are arranged in an insulating mode at intervals, the first conducting wire layers are electrically connected with the first pattern areas through first conducting pillars penetrating through the first insulating base materials, and patterns of the first pattern areas of the first electrode pattern layers in different first sub-pattern structure layers are different; a second component disposed on one side of the second surface, the second component including an insulating layer and an electrode layer disposed on a surface of the insulating layer; the optical coating layer is arranged on one side of the second component far away from the electronic ink layer; the substrate is arranged on one side, far away from the electronic ink layer, of the optical coating layer. Therefore, the layer structure with different patterns can be arranged, so that the shell assembly can display different patterns, the display is not single, and the user experience is better.
In another aspect of the present application, the present application provides an electronic device including: the housing assembly described above; the display screen assembly is connected with the shell assembly, an installation space is defined between the display screen assembly and the shell assembly, and a base body in the shell assembly is far away from the installation space; and the mainboard is arranged in the installation space and is electrically connected with the display screen assembly. Thus, the electronic device has all the features and advantages of the housing assembly described above, and thus, the description thereof is omitted.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 illustrates a partial schematic structural view of a housing assembly according to one example of the present application;
FIG. 2 illustrates a partial schematic structural view of a housing assembly according to another example of the present application;
fig. 3 to 5 illustrate a case where the first pattern assembly includes three first sub-pattern structure layers in an example of the present application, where fig. 3 (a) illustrates a schematic structure of the first electrode pattern layer of the 1 st first sub-pattern structure layer, and fig. 3 (B) illustrates the first wire layer (first sub-wire sheet), the third wire layer, the first conductive sheet, the second conductive sheet, the first wire, the second wire, and the like of the 1 st first sub-pattern structure layer; fig. 4 (a) shows a schematic structure diagram of the first electrode pattern layer of the 2 nd first sub-pattern structure layer, and fig. 4 (B) shows the first wire layer (first sub-wire sheet), the third wire layer, the first conductive sheet, the second conductive sheet, the first wire, the second wire, and the like of the 2 nd first sub-pattern structure layer; fig. 5 (a) shows a schematic structural diagram of the first electrode pattern layer of the 3 rd first sub-pattern structure layer, and fig. 5 (B) shows the first wire layer (first sub-wire sheet), the third wire layer, the first conductive sheet, the second conductive sheet, the third conductive sheet, the first wire, the second wire, the first Pin and the like of the 3 rd first sub-pattern structure layer;
FIG. 6 illustrates a schematic view of a portion of a housing assembly according to yet another example of the present application;
fig. 7 to 9 show a case where the second pattern assembly includes three second sub-pattern structure layers according to an example of the present application, in which fig. 7 (a) shows a schematic structure of the second electrode pattern layer of the 1 st second sub-pattern structure layer, and fig. 7 (B) shows the second wire layer (second sub-wire sheet), the fourth wire layer, the fourth conductive sheet, the fifth conductive sheet, the third wire, the fourth wire, and the like of the 1 st second sub-pattern structure layer; fig. 8 (a) shows a schematic structure diagram of the second electrode pattern layer of the 2 nd second sub-pattern structure layer, and fig. 8 (B) shows the second wire layer (second sub-wire sheet), the fourth wire layer, the fourth conductive sheet, the fifth conductive sheet, the third wire, the fourth wire, and the like of the 2 nd second sub-pattern structure layer; fig. 9 (a) shows a schematic structural diagram of the second electrode pattern layer of the 3 rd second sub-pattern structure layer, and fig. 9 (B) shows the second wire layer (second sub-wire sheet), the fourth wire layer, the fourth conductive sheet, the fifth conductive sheet, the sixth conductive sheet, the third wire, the fourth wire, the second Pin and the like of the 3 rd second sub-pattern structure layer;
FIG. 10 illustrates a schematic view of a portion of a housing assembly according to yet another example of the present application;
FIG. 11 illustrates a partial schematic structural view of a housing assembly according to yet another example of the present application;
FIG. 12 illustrates a schematic view of a portion of a housing assembly according to yet another example of the present application;
FIG. 13 illustrates a partial schematic structural view of a housing assembly according to yet another example of the present application;
FIG. 14 illustrates a schematic view of a portion of a housing assembly according to yet another example of the present application;
FIG. 15 shows a schematic of one state of an electronic ink layer;
FIG. 16 shows a schematic view of another state of the electronic ink layer;
FIG. 17 shows a schematic view of a structure of an optical coating according to an example of the present application;
FIG. 18 shows a schematic view of a structure of an optical coating according to another example of the present application;
FIG. 19 shows a schematic view of a structure of an optical coating according to yet another example of the present application;
FIG. 20 shows a schematic view of a structure of an optical coating according to yet another example of the present application;
FIG. 21 shows a schematic view of different energization states of a housing assembly according to one example of the present application;
fig. 22 shows a schematic structural diagram of an electronic device according to an example of the application.
Description of reference numerals:
1000: a housing assembly; 2000: an electronic device; 100: an electronic ink layer; 110: a first surface; 120: a second surface; 130: microcapsule particles; 131: white titanium oxide particles; 132: black carbon particles; 133: electrophoresis liquid; 200: a first sub-pattern structure layer; 300: a second sub-pattern structure layer; 211: a first pattern region; 311: a second pattern region; 211-1: a first sub-pattern region; 311-1: a second sub-pattern region; 212: a first non-pattern region; 312: a second non-pattern region; 220: a first insulating substrate; 320: a second insulating substrate; 420: a third insulating base material; 230: a first conductive line layer; 330: a second conductive line layer; 240: a third conductive line layer; 340: a fourth conductive line layer; 231: a first sub-lead piece; 331: a second sub-conductor piece; 250: a first conductive sheet; 260: a second conductive sheet; 290: a third conductive sheet; 350: a fourth conductive sheet; 360: a fifth conductive sheet; 390: a sixth conductive sheet; 270: a first conductive line; 280: a second conductive line; 370: a third conductive line; 380: a fourth conductive line; 400: a background color component; 410: a front electrode layer; 500: an optical coating layer; 510: a first sub-coating layer; 520: a second sub-coating layer; 530: a third sub-coating layer; 540: coating a film on the substrate layer; 600: a substrate; 700: sealing the frame glue; 800: a waterproof barrier layer; 10: a first conductive post; 20: a second conductive post; 40: a third conductive pillar; 50: a fourth conductive post; 60: a fifth conductive post; 30: transparent adhesive tape; 1: a first Pin Pin; 2: a second Pin Pin; 3: a flexible circuit board; 7: and a seventh conductive sheet.
Detailed Description
Examples of the present application are described in detail below and are illustrated in the accompanying drawings. The examples described below with reference to the drawings are only for the purpose of explaining the present application and are not to be construed as limiting the present application.
As described above, the colors and patterns of current mobile terminals are usually fixed after the terminals are shipped from the factory, and the current mobile terminals are prone to aesthetic fatigue for a long time. The inventor of the present application has found that a plurality of pattern layers can be stacked, each pattern layer has a different pattern, the pattern layer is combined with an electronic ink layer, the state of the electronic ink layer can be adjusted by applying a voltage to each pattern layer, and the optical coating layer is combined, so that a consumer can see the patterns of the pattern layers, and a dynamic display effect can be produced by alternately displaying each pattern layer.
In view of the above, in one aspect of the present application, a housing assembly is provided. According to some examples of the present application, the housing assembly includes a pattern visible region and a non-visible region, and referring to fig. 1 or 2, the pattern visible region includes: an electronic ink layer 100, the electronic ink layer 100 having a first surface 110 and a second surface 120 oppositely disposed; a first pattern assembly disposed on one side of the first surface 110, the first pattern assembly including a plurality of first sub-pattern structure layers 200 disposed in a stacked manner, wherein each first sub-pattern structure layer 200 includes a first electrode pattern layer, a first insulating base material 220 and a first conducting wire layer 230 disposed in a stacked manner in sequence, the first electrode pattern layer includes first pattern regions 211 and first non-pattern regions 212 disposed in an insulating manner at intervals, the first conducting wire layer 230 is electrically connected to the first pattern regions 211 through first conductive pillars 10 penetrating through the first insulating base material 220, and the first pattern regions 211 of the first electrode pattern layers in different first sub-pattern structure layers 200 have different patterns; a second component disposed at one side of the second surface 120, the second component including an insulating layer and an electrode layer disposed on a surface of the insulating layer; the optical coating layer 500 is arranged on one side of the second component far away from the electronic ink layer 100; the substrate 600, the substrate 600 is disposed on the side of the optical coating layer 500 away from the electronic ink layer 100. Therefore, voltage can be applied to different areas of the electronic ink layer by electrifying the first electrode pattern layer and the second component of the first sub-pattern structure layer, so that the electronic ink layer is partially white and partially black (namely, one of the electronic ink layer corresponding to the first pattern region 211 and the electronic ink layer corresponding to the first non-pattern region 212 is white and the other is black), and the shell component can be made to present patterns with different colors under the regulation of the optical coating layer by combining light; moreover, when the pattern layers are switched at a higher speed, the shell assembly can also present a dynamic display effect; the electronic ink layer needs little electric energy, has high response speed and better user experience.
It should be noted that the first surface 110 and the second surface 120 are not particularly limited, and only for distinguishing two opposite surfaces of the electronic ink layer 100, a surface of the electronic ink layer 100 on a side away from the substrate 600 is referred to as a first surface, and a surface of the electronic ink layer 100 on a side close to the substrate 600 is referred to as a second surface, which are used to describe some specific examples of the present application. In addition, the relative positional relationship between the insulating layer and the electrode layer is not particularly limited as long as the electrode layer is provided on the surface of the insulating layer, that is, the electrode layer may be provided on the side of the insulating layer close to the second surface of the electronic ink layer, or may be provided on the side of the insulating layer away from the second surface of the electronic ink layer.
In this application, the second component may be a second pattern component or a background color component, and the following two cases will be described in detail by taking the second component as the second pattern component and the second component as the background color component as examples respectively:
according to an example of the present application, the second component is a second pattern component, and the second pattern component is disposed on one side of the second surface 120, wherein, referring to fig. 1, the second pattern component includes a plurality of second sub-pattern structure layers 300 that are stacked, and the number of the second sub-pattern structure layers 300 is equal to the number of the first sub-pattern structure layers 200, wherein each second sub-pattern structure layer 300 includes a second electrode pattern layer, a second insulating base material 320, and a second conductive line layer 330 that are sequentially stacked, the second pattern layer includes a second pattern region 311 and a second non-pattern region 312 that are spaced apart and insulated, the second conductive line layer 330 and the second pattern region 311 are electrically connected by a second conductive pillar 20 penetrating through the second insulating base material 320, wherein the second pattern regions 311 of the second electrode pattern layers in different second sub-pattern structure layers 300 are different in pattern. Therefore, the voltage can be applied to different areas of the electronic ink layer by electrifying the first electrode pattern layer of the first sub-pattern structure layer and the second electrode pattern layer of the second sub-pattern structure layer, so that part of the electronic ink layer is white and part of the electronic ink layer is black (namely, one of the electronic ink layer corresponding to the first pattern area 211 and the electronic ink layer corresponding to the first non-pattern area 212 is white and the other is black), and the shell component can be made to present patterns with different colors under the regulation of the optical coating layer by combining light; moreover, a plurality of different pattern layers can be independently controlled and do not influence each other; when the pattern layers are switched at a higher speed, the shell assembly can also present a dynamic display effect; the electronic ink layer needs little electric energy, has high response speed and better user experience.
When the second component is the second pattern component, the optical coating layer is arranged on the side of the second pattern component far away from the electronic ink layer. It should be noted that, when the second component is a second pattern component, the second electrode pattern layer and the second insulating substrate in one second sub-pattern structure layer closest to the electronic ink layer in the second pattern component are equivalent to the electrode layer and the insulating layer in the second component, respectively. In addition, it should be noted that the number of the second sub-pattern structure layers 300 is equal to the number of the first sub-pattern structure layers 200, which means that, in some specific examples of the present application, when a certain number of first sub-pattern structure layers are disposed on the first surface 110 side of the electronic ink layer 100 in the housing assembly, the number of second sub-pattern structure layers disposed on the second surface 120 side of the electronic ink layer 100 should be the same as the number of the first sub-pattern structure layers. That is, if the number of first sub-pattern-structure layers is 2, the number of second sub-pattern-structure layers is also 2; if the number of the first sub pattern-structure layers is 3, the number of the second sub pattern-structure layers is also 3; if the number of the first sub-pattern-structure layers is 4, the number of the second sub-pattern-structure layers is also 4, and so on. According to an example of the present application, the second sub-pattern structure layer may have the same structure as the first sub-pattern structure layer and may be symmetrical with respect to the electronic ink layer, so that the electronic ink layer may be better controlled, and the housing assembly may accurately display the pattern of the corresponding electrode pattern layer. That is, the pattern of the pattern region of the first sub pattern-structure layer should correspond to the pattern of the pattern region of the second sub pattern-structure layer one-to-one, that is, the pattern of the first pattern region 211 and the pattern of the second pattern region 311 of the two first and second sub pattern-structure layers symmetrically disposed with respect to the electronic ink layer are the same, and the above-mentioned "applying a voltage to different regions of the electronic ink layer by energizing the first electrode pattern layer of the first sub pattern-structure layer and the second electrode pattern layer of the second sub pattern-structure layer" means applying a voltage to the two first and second sub pattern-structure layers symmetrically disposed with respect to the electronic ink layer, so that the pattern of the corresponding pattern-structure layer can be displayed after applying a voltage to the electronic ink layer.
According to some examples of the present application, the material of the first conductive pillars 10 may be silver paste, that is, the first conductive pillars 10 may be formed by pouring silver paste after punching holes on the first insulating substrate 220. The material of the second conductive pillars 20 may be silver paste, that is, the second conductive pillars 20 may be formed by filling silver paste after punching holes on the second insulating substrate 320. From this, can make first conductive pillar and second conductive pillar through simple ripe technology to make first conductive pillar and second conductive pillar all have good electric conductivity, and then be favorable to adjusting the outward appearance of casing subassembly.
According to the examples of the present application, the shape of the specific pattern of the first electrode pattern layer in the different first sub-pattern structure layers has no special requirement, and may be, for example, a pentagram, a triangle, a quadrangle, a moon shape, an animal shape, a circle, an ellipse, or the like; the shapes of the specific patterns of the first electrode pattern layers in different first sub-pattern structure layers may be the same or different, and the orthographic projection positions of the specific patterns of the first electrode pattern layers in different first sub-pattern structure layers on the substrate may be the same or different, and those skilled in the art can flexibly select the specific patterns according to actual design requirements, which is not limited herein. Likewise, the number of the specific patterns included in each first electrode pattern layer is not limited, and those skilled in the art can flexibly design the specific patterns according to actual requirements, for example, in fig. 3, the first electrode pattern layer includes three specific patterns, and of course, whether the shapes of the three patterns are consistent or not is not a special requirement, and those skilled in the art can flexibly select the specific patterns according to actual situations.
In the present application, specific materials of the first insulating substrate 220, the second insulating substrate 320, and the third insulating substrate 420 are not particularly limited as long as the insulating properties and the light transmittance are good. According to some specific examples of the present application, the first insulating substrate 220, the second insulating substrate 320, and the third insulating substrate 420 may be made of PET (polyethylene terephthalate), PMMA (polymethyl methacrylate), or PC (polycarbonate), and thus, the insulating substrate made of the above materials has good insulating performance and light transmittance, and can provide a good supporting effect for the conductive layer formed thereon, which is beneficial to improving the overall performance of the housing assembly.
It should be further noted that in the present application, the materials of the first electrode pattern layer, the first wire layer 230, the second electrode pattern layer, the second wire layer 330, and the entire electrode layer 410 may all be ITO (indium tin oxide), so that a patterned layer structure may be formed through a mature etching process (e.g., yellow etching), which is beneficial to reducing the manufacturing cost.
According to an example of the present application, referring to fig. 3 to 5 (it should be noted that fig. 1 or fig. 2 can be regarded as a cross-sectional view along AA' of the housing assembly in fig. 3 to 5, and in addition, for convenience of explanation, only a specific structure of the first electrode pattern layer and a partial structure of the non-visible region in different first sub-pattern structure layers in the housing assembly are respectively shown in fig. 3 to 5, where the housing assembly includes a visible pattern region Q1 and a non-visible region Q2 (in this application, the non-visible region Q2 is disposed at an edge portion of the visible pattern region Q1), and in the housing assembly corresponding to the visible pattern region Q1, each first sub-pattern structure layer 200 further includes a third conductive wire layer 240 disposed at the same layer and at intervals as the first conductive wire layer 230 (including a plurality of first conductive wires 231 disposed at intervals). Also, referring to fig. 6, the third conductive wire layer 240 is electrically connected to the first non-pattern region 212 through the third conductive pillars 40 penetrating through the first insulating base material 220. Therefore, the third conducting wire layer of the first sub-pattern structure layer is electrically connected with the first non-pattern area, and voltage can be applied to the first non-pattern area through the third conducting wire layer, so that the color change of the first non-pattern area can be conveniently regulated and controlled. It should be noted that the first insulating substrate penetrated by the third conductive pillars 40, the third conductive line layer 240, and the first non-pattern region 212 all belong to the same first sub-pattern structure layer 200. According to some examples of the present application, the material of the third conductive pillars 40 may be silver paste, that is, the third conductive pillars 40 may be formed by pouring silver paste after punching holes on the first insulating substrate 220.
According to an example of the present application, referring to fig. 3 to 5, taking an example that the first pattern assembly of the housing assembly includes three first sub-pattern structure layers 200, that is, each first pattern region 211 includes a plurality of first sub-pattern regions 211-1 arranged at intervals, the first conductive line layer 230 includes a plurality of first sub-conductive line sheets 231 arranged at intervals, and the plurality of first sub-pattern regions 211-1 are electrically connected to the plurality of first sub-conductive line sheets 231 in a one-to-one correspondence. Thus, the plurality of first sub-pattern regions 211-1 and the plurality of first sub-conductive sheets 231 are electrically connected in a one-to-one correspondence, and a voltage may be applied to the first sub-pattern regions 211-1 electrically connected thereto through the first sub-conductive sheets 231, respectively, to facilitate control and adjustment of the first sub-pattern regions 211-1. In a specific example of the present application, referring to fig. 3, the first pattern region 211 of the first sub-pattern structure layer 200 farthest from the electronic ink layer includes three first sub-pattern regions 211-1 of triangular patterns (as shown in fig. 3 (a)), and the first conductive line layer 230 of the first sub-pattern structure layer 200 corresponding thereto includes three first sub-conductive line pieces 231 arranged at intervals (as shown in fig. 3 (B), it should be noted that the dotted line of the triangle shown in fig. 3 (B) does not really exist, but to show that the portion corresponds to the first sub-pattern region of the triangle in fig. 3 (a)), the three first sub-pattern regions 211-1 are electrically connected to the three first sub-conductive line pieces 231 in one-to-one correspondence; in another specific example of the present application, referring to fig. 4, the first pattern region 211 of the first sub-pattern structure layer next to the electronic ink layer includes four first sub-pattern regions 211-1 of the moon-shaped pattern (as shown in fig. 4 (a)), and the first conductive line layer of the first sub-pattern structure layer corresponding thereto includes four first sub-conductive line pieces 231 disposed at intervals (as shown in fig. 4 (B), it is to be noted that the broken line of the moon shape shown in fig. 4 (B) does not really exist, but to show that the portion corresponds to the first sub-pattern region of the moon shape in fig. 4 (a)), the four first sub-pattern regions 211-1 are electrically connected to the four first sub-conductive line pieces 231 in one-to-one correspondence; in another specific example of the present application, referring to fig. 5, the first pattern region 211 of the first sub-pattern structure layer closest to the electronic ink layer includes three first sub-pattern regions 211-1 of a pentagram-shaped pattern (as shown in fig. 5 (a)), and the first conductive line layer of the first sub-pattern structure layer corresponding thereto includes three first sub-conductive line pieces 231 disposed at intervals (as shown in fig. 5 (B), it is to be noted that the dotted line of the pentagram shape shown in fig. 5 (B) does not really exist, but to show that the portion corresponds to the first sub-pattern region of the pentagram shape in fig. 5 (a)), and the three first sub-pattern regions 211-1 are electrically connected to the three first sub-conductive line pieces 231 in one-to-one correspondence. It should be noted that the number of the first sub-pattern regions 211-1 in the above example is the same as the number of the first sub-conductive sheets 231, and the specific number thereof is not specifically limited in this application.
In addition, it should be noted that, the third conductive line layer 240 is disposed at the same layer and at an interval as the first conductive line layer 230, which means that the third conductive line layer 240 and the first conductive line layer 230 may be formed by the same etching step.
According to an example of the present application, in the case assembly corresponding to the pattern viewing area Q1, referring to fig. 7 to 9, each second sub-pattern structure layer 300 may further include a fourth wire layer 340 disposed at a same layer and interval as the second wire layer 330 (including a plurality of second wire pieces 331 disposed at intervals). Referring to fig. 10, the fourth conductive wire layer 340 is electrically connected to the second non-pattern region 312 through the fourth conductive pillar 50 penetrating through the second insulating substrate 320. The fourth conductive line layer 340 may be formed by the same etching step as the second conductive line layer 330. Thus, the fourth wire layer may be electrically connected to the second non-pattern region, and a voltage may be applied to the second non-pattern region through the fourth wire layer. It should be noted that the second insulating base material penetrated by the fourth conductive pillar 50, the fourth conductive line layer 340, and the second non-pattern region 312 belong to the same second sub-pattern structure layer 300. According to some examples of the present application, the material of the fourth conductive pillars 50 may be silver paste, that is, the fourth conductive pillars 50 may be formed by pouring silver paste after punching on the second insulating substrate 320.
According to some examples of the present application, the fourth wire layer 340 and the third wire layer 240 may be made of indium tin oxide, so that the fourth wire layer and the third wire layer have good light transmittance, and can be formed by using the same etching process as the first wire layer and the second wire layer disposed on the same layer, which is beneficial to saving the manufacturing cost.
According to an example of the present application, referring to fig. 7 to 9, the same second pattern region 311 includes a plurality of second sub-pattern regions 311-1 arranged at intervals, the second conductive line layer 330 includes a plurality of second sub-conductive line pieces 331 arranged at intervals, and the plurality of second sub-pattern regions 311-1 are electrically connected to the plurality of second sub-conductive line pieces 331 in a one-to-one correspondence. Therefore, the plurality of second sub-pattern regions and the plurality of second sub-conducting wire sheets are electrically connected in a one-to-one correspondence manner, namely the orthographic projection of one second sub-conducting wire sheet is positioned inside the orthographic projection of one second sub-pattern region 311-1, the second sub-conducting wire sheet is electrically connected with the second sub-pattern region through a second conducting pillar penetrating through the second insulating base material, and voltage can be respectively applied to the second sub-pattern regions electrically connected with the second sub-pattern regions through the second sub-conducting wire sheets, so that the color change of the second sub-pattern regions can be controlled and adjusted conveniently.
According to an example of the present application, as shown in fig. 3 to 5, Q1 is a pattern visible region, Q2 is a non-visible region, one end of the first insulating substrate 220 in each first sub-pattern structure layer 200 extends to the non-visible region Q2, a portion of the first insulating substrate 220 in the non-visible region Q2 is defined as a first insulating portion, a first conductive sheet 250 and a second conductive sheet 260 are disposed on one surface of the first insulating portion, and the first conductive sheet 250 and the second conductive sheet 260 are disposed on the same layer as the first conductive layer 230, wherein the first conductive sheet 250 is electrically connected to the first conductive layer 230, that is, the first conductive sheet 250 is electrically connected to the plurality of first sub-conductive sheets 231 of the first conductive layer 230, and the second conductive sheet 260 is electrically connected to the third conductive layer 240. According to a specific example of the present application, referring to fig. 3 (B), fig. 4 (B), and fig. 5 (B), the first conductive sheet 250 may be electrically connected to the first wire layer 230 through the first wires 270, that is, the first conductive sheet 250 is electrically connected to the plurality of first sub-wire sheets 231 of the first wire layer 230 through the first wires 270, and the second conductive sheet 260 may be electrically connected to the third wire layer 240 through the second wires 280. It should be noted that the first conductive line 270 may have different branches, and as shown in fig. 3 (B), fig. 4 (B), and fig. 5 (B), the plurality of first sub-conductive line segments 231 may be electrically connected to the first conductive sheet by disposing the first conductive line 270.
According to an example of the present application, the first pattern assembly includes M first sub-pattern structure layers sequentially stacked, and is defined in M of the first sub-pattern structure layers, a first sub-pattern structure layer closest to the electronic ink layer is an mth first sub-pattern structure layer, and a first sub-pattern structure layer farthest from the electronic ink layer is a 1 st first sub-pattern structure layer (that is, the first pattern assembly includes, in a direction close to the electronic ink layer 100, the 1 st first sub-pattern structure layer, the 2 nd first sub-pattern structure layer, \ 8230 \ the mth first sub-pattern structure layer), wherein a plurality of third conductive sheets 290 are disposed on a surface of a first insulating portion extending from the first insulating substrate 220 in the mth first sub-pattern structure layer, the number of the third conductive sheets 290N =2M-2, and the plurality of the third conductive sheets 290 are respectively electrically connected to the first conductive sheets 250 and the second conductive sheets in the 1 st to M-1 st first sub-pattern structure layers, where M is a positive integer number equal to or more than 2. According to some specific examples of the present application, the first pattern assembly may include two first sub-pattern structure layers; according to further examples of the present application, the first pattern assembly may also include three first sub-pattern structure layers; the first pattern assembly may also include other numbers of first sub-pattern structure layers, and those skilled in the art can design the first sub-pattern structure layers according to the actual situation. The first pattern assembly is described below as including three first sub-pattern structure layers, fig. 3 to 5 may correspond to the 1 st first sub-pattern structure layer, the 2 nd first sub-pattern structure layer, and the 3 rd first sub-pattern structure layer, respectively, as shown in fig. 3 (a), fig. 4 (a), and fig. 5 (a), where fig. 5 is the first sub-pattern structure layer closest to the side of the electronic ink layer in the first pattern assembly, that is, fig. 3 (a) may be the 1 st first sub-pattern structure layer, fig. 4 (a) may be the 2 nd first sub-pattern structure layer, and fig. 5 (a) may be the 3 rd first sub-pattern structure layer, and as can be clearly seen from the drawings, the patterns of the first pattern regions 211-1 of the three first sub-pattern structure layers are all different, the pattern of the first sub-pattern structure layer in fig. 3 is a triangle, the pattern of the first sub-pattern structure layer in fig. 4 is a moon shape, while the pattern of the first sub-pattern structure layer in fig. 5 is a pentagon shape, the pattern structure layer to be described, and the outermost pattern structure layer in fig. 3 to 220 is an outermost side of the first sub-pattern structure layer; in this specific example, M =3, as shown in fig. 5 (B), the surface of the first insulating portion extending from the first insulating substrate in the 3 rd first sub-pattern structure layer is provided with (2M-2) third conductive sheets 290, that is, 4 third conductive sheets 290, two of the 4 third conductive sheets 290 are electrically connected to the first conductive sheet 250 and the second conductive sheet 260 in the 1 st first sub-pattern structure layer 200 in a one-to-one correspondence manner (silver paste is filled in the via hole through the via hole, and thus electrical connection is achieved), and the other two third conductive sheets 290 are electrically connected to the first conductive sheet 250 and the second conductive sheet 260 in the 2 nd first sub-pattern structure layer 200 in a one-to-one correspondence manner (silver paste is filled in the via hole through the via hole, and thus electrical connection is achieved). When the number of the first sub-pattern structure layers 200 is other numbers, the same principle as described above is not described one by one. Therefore, by applying voltages to the first conductive sheet 250, the second conductive sheet 260, and the plurality of third conductive sheets 290 in the first sub-pattern structure layer closest to the electronic ink layer, different first sub-pattern structure layers can be adjusted and controlled, and each first sub-pattern structure layer can be independently controlled without affecting each other.
According to an example of the present application, referring to fig. 7 to 9, one end of the second insulating substrate 320 in each second sub-pattern structure layer 300 extends to the non-visible region Q2, and the portion of the second insulating substrate 320 in the non-visible region Q2 is defined as a second insulating portion, referring to fig. 7 (B), fig. 8 (B), and fig. 9 (B), a fourth conductive sheet 350 and a fifth conductive sheet 360 are disposed on one surface of the second insulating portion, and the fourth conductive sheet 350 and the fifth conductive sheet 360 are disposed in the same layer as the second conductive layer 330, wherein the fourth conductive sheet 350 is electrically connected to the second conductive layer 330, that is, the fourth conductive sheet 350 is electrically connected to the plurality of second sub-conductive sheets 331 of the second conductive layer 330, and the fifth conductive sheet 360 is electrically connected to the fourth conductive layer 340. According to a specific example of the present application, the fourth conductive sheet 350 may be electrically connected to the second wire layer 330 through the third wires 370, that is, the fourth conductive sheet 350 is electrically connected to the plurality of second sub-wire sheets 331 of the second wire layer 330 through the third wires 370, and the fifth conductive sheet 360 may be electrically connected to the fourth wire layer 340 through the fourth wires 380. It should be noted that, the fourth conductive sheet and the fifth conductive sheet are both disposed on the same layer as the second conductive layer, which means that the fourth conductive sheet and the fifth conductive sheet can be formed by using the same etching process during manufacturing.
When the second pattern element is disposed on the second surface 120 of the electronic ink layer 100, the arrangement of each second sub-pattern structure layer 300 in the second pattern element is similar to the arrangement of each first sub-pattern structure layer 200 in the first pattern element, and the patterns of each first sub-pattern structure layer 200 in the first pattern element and the second sub-pattern structure layer 300 in the second pattern element are the same in one-to-one correspondence. Specifically, referring to fig. 7 to 9, the second pattern assembly includes M second sub-pattern structure layers 300 stacked in sequence, and is defined in the M second sub-pattern structure layers 300, the second sub-pattern structure layer 300 closest to the electronic ink layer 100 is an mth second sub-pattern structure layer, and the second sub-pattern structure layer 300 farthest from the electronic ink layer 100 is a 1 st second sub-pattern structure layer (that is, the second pattern assembly includes a 1 st second sub-pattern structure layer, a 2 nd second sub-pattern structure layer, an 8230; an M th second sub-pattern structure layer in a direction close to the electronic ink layer 100), wherein a plurality of sixth conductive sheets 390 are disposed on a surface of a first insulating portion extending from the second insulating substrate 320 in the M second sub-pattern structure layer, a number N =2M-2 of the sixth conductive sheets 390 are electrically connected to a fourth sub-pattern 350 and a fifth conductive sheet 360 in the 1 st to M-1 st second sub-pattern structure layers, respectively, and the number N =2M-2 of the sixth conductive sheets are electrically connected to the fourth conductive sheets, where M is greater than an integer equal to M2. According to some specific examples of the present application, the second pattern assembly may include two second sub-pattern structure layers; according to further examples of the present application, the second pattern assembly may also include three second sub-pattern structure layers; the second pattern assembly may also include other numbers of second sub-pattern structure layers, and those skilled in the art may design according to actual situations, and it is necessary to ensure that the number of the second sub-pattern structure layers in the second pattern assembly is the same as that of the first sub-pattern structure layers in the first pattern assembly. Hereinafter, it is described that the second pattern assembly includes three second sub-pattern structure layers, fig. 7 to 9 may correspond to the 1 st second sub-pattern structure layer, the 2 nd second sub-pattern structure layer and the 3 rd second sub-pattern structure layer, respectively, as shown in fig. 7 (a), fig. 8 (a) and fig. 9 (a), wherein fig. 9 is the second sub-pattern structure layer closest to the side of the electronic ink layer in the second pattern assembly, that is, fig. 7 (a) may be the 1 st second sub-pattern structure layer, fig. 8 (a) may be the 2 nd second sub-pattern structure layer, and fig. 9 (a) may be the 3 rd second sub-pattern structure layer, and as is clear from the figures, the patterns of the second pattern regions 311-1 of the three second sub-pattern structure layers 300 are all different, the pattern of the second sub-pattern structure layer in fig. 7 is triangular, the pattern of the second sub-pattern structure layer in fig. 8 is moon-shaped, and the pattern of the second sub-pattern structure layer in fig. 9 is pentagram-shaped, it should be noted that, in fig. 7 to 9, the outermost contour line corresponds to the edge of the second insulating substrate 320, and the dotted lines of the triangular, moon-shaped, pentagram-shaped in fig. 7 (B), fig. 8 (B), and fig. 9 (B) are not true, but only to show that the dotted line regions correspond to the second sub-pattern regions of the triangular, moon-shaped, pentagram-shaped in fig. 7 (a), fig. 8 (a), and fig. 9 (a), respectively; in this specific example, M =3, referring to fig. 9 (B), the surface of the first insulating portion extending from the second insulating substrate 320 in the 3 rd second sub-pattern structure layer is provided with (2M-2) sixth conductive sheets 390, that is, 4 sixth conductive sheets 390, two of the 4 sixth conductive sheets 390 are electrically connected to the fourth conductive sheet 350 and the fifth conductive sheet 360 in the 1 st second sub-pattern structure layer 300 in a one-to-one correspondence manner (by filling a silver paste in a via hole, an electrical connection is achieved), and the other two sixth conductive sheets 390 are electrically connected to the fourth conductive sheet 350 and the fifth conductive sheet 360 in the 2 nd second sub-pattern structure layer 300 in a one-to-one correspondence manner (by filling a silver paste in a via hole, an electrical connection is achieved). When the number of the second sub-pattern structure layers 300 is other numbers, the same principle as described above is not described one by one. Therefore, by applying voltages to the fourth conductive sheet 350, the fifth conductive sheet 360, and the sixth conductive sheets 390 in the second sub-pattern structure layer closest to the electronic ink layer, different second sub-pattern structure layers can be adjusted and controlled, and each second sub-pattern structure layer can be independently controlled without affecting each other.
It should be further noted that, in the above specific example, the pattern of the 1 st second sub-pattern-structure layer (as shown in fig. 7 (a)) is the same as the pattern of the 1 st first sub-pattern-structure layer (as shown in fig. 3 (a)), and is triangular; the pattern of the 2 nd second sub-pattern-structure layer (as shown in fig. 8 (a)) is the same as the pattern of the 2 nd first sub-pattern-structure layer (as shown in fig. 4 (a)), and is a moon shape; the pattern of the 3 rd second sub-pattern structure layer (as shown in fig. 9 (a)) is the same as the pattern of the 3 rd first sub-pattern structure layer (as shown in fig. 5 (a)), and is a five-pointed star shape. Thus, the electronic ink layer may assume a corresponding pattern shape by applying voltages to the first sub pattern structure layer and the second sub pattern structure layer having the same pattern, respectively. It should be further noted that the above examples are only used for illustrating the technical solutions of the present application, and are not limited to the present application, and the shapes of the various patterns given in the drawings are only examples, and those skilled in the art may also set the shapes according to actual needs, for example, the shapes may also be rectangles, diamonds, circles, ellipses, hearts, and other shapes, and may also be numbers, letters, and the like; the number of the patterns in each of the first sub-pattern structure layer and the second sub-pattern structure layer is not particularly limited in the present application, and those skilled in the art can set the number according to actual situations; in addition, the specific positions of the patterns in the first sub-pattern structure layer and the second sub-pattern layer are not particularly limited, and those skilled in the art can set the positions according to actual needs.
In this application, the material of first conducting strip, second conducting strip, third conducting strip, fourth conducting strip, fifth conducting strip, sixth conducting strip all can be indium tin oxide, can form through the same step sculpture of the conducting wire layer that the sculpture technology and the same layer set up rather than respectively, from this, is favorable to saving the cost to each conducting strip all has better electric conductivity and light transmissivity, is favorable to improving the wholeness ability of casing subassembly.
In the present application, a Pin pad bound to a Flexible Printed Circuit board (FPC) may be further provided to apply a voltage to the electronic ink layer.
According to an example of the present application, referring to fig. 5 (B) and 11, the non-visible region Q2 may further include: the first conductive sheets 250, the second conductive sheets 260 and the third conductive sheets 290 are disposed on the first insulating surface of the first insulating substrate 220 in the mth first sub-pattern structure layer, and the first pins 1, the second pins 1 and the third pins are electrically connected. Specifically, still taking the example of providing 3 first sub-pattern structure layers 200 for illustration, as shown in fig. 5 (B), the mth (i.e., the 3 rd) first sub-pattern structure layer includes one first conductive sheet 250, one second conductive sheet 260, and four third conductive sheets 290, and correspondingly, the housing assembly corresponding to the non-visible region Q2 includes six first Pin pins 1, and the six first Pin pins 1 are respectively and correspondingly electrically connected to the first conductive sheet 250, the second conductive sheet 260, and the four third conductive sheets 290 on the first insulating surface extending from the first insulating substrate 220 in the 3 rd first sub-pattern structure layer one by one. In order to facilitate the application of voltage to the electronic ink layer, the first Pin pins are bound to the flexible circuit board, as shown in fig. 11, the non-visible region Q2 may further include a flexible circuit board 3, and the plurality of first Pin pins 1 are bound to the flexible circuit board 3.
According to an example of the present application, when the first pattern element is disposed on the first surface of the electronic ink layer and the second pattern element is disposed on the second surface of the electronic ink layer, referring to fig. 9 (B), the non-visible region Q2 is disposed at an edge portion of the visible pattern region Q1, and the non-visible region Q2 may further include a plurality of second Pin pins 2, and the plurality of second Pin pins 2 are electrically connected to the fourth conductive sheet 350, the fifth conductive sheet 360, and the plurality of sixth conductive sheets 390 which are disposed on the second insulating portion surface extending from the second insulating substrate 320 (corresponding to the outermost outline in fig. 9 (B) which is an edge of the second insulating substrate 320) in the mth second sub-pattern structure layer. According to some specific examples of the present application, still taking the example of providing 3 second sub-pattern-structure layers 300 as an example, as shown in fig. 9 (B), the mth (i.e., the 3 rd) second sub-pattern-structure layer includes one fourth conductive sheet 350, one fifth conductive sheet 360 and four sixth conductive sheets 390, and accordingly, the non-visible region Q2 includes six second Pin pins 2, and the six second Pin pins 2 are respectively and correspondingly electrically connected to the third conductive sheet 350, the fourth conductive sheet 360 and the four sixth conductive sheets 390 on the first insulating surface extending from the first insulating substrate 320 in the 3 rd second sub-pattern-structure layer. As shown in fig. 11, the non-visible region Q2 may further include a flexible circuit board, and the second Pin leg 2 is bound to the flexible circuit board. It should be noted that the flexible circuit board herein may be the flexible circuit board 3 described above, that is, the first Pin 1 and the second Pin 2 may be bound to the same flexible circuit board, specifically, according to an example of the present application, as shown in fig. 11, the first Pin 1 and the second Pin 2 may be bound to the same flexible circuit board 3 in a positive-negative binding manner, and the first Pin and the second Pin may be bound to one flexible circuit board in the positive-negative binding manner, so that all the first sub-pattern structure layers and all the second sub-pattern structure layers may be respectively powered on and powered off through one flexible circuit board, which is more beneficial to structure stacking design and space saving. Certainly, the first Pin 1 and the second Pin 2 are respectively bound to different flexible circuit boards, and the power on and off of all the first sub-pattern structure layer and the second sub-pattern structure layer can also be realized, but compared with the technical scheme of binding the first Pin 1 and the second Pin 2 to the same flexible circuit board, the technical scheme of respectively binding the first Pin and the second Pin to different flexible circuit boards tends to complicate interface design and is not beneficial to light weight design.
According to further examples of the present application, the housing assembly includes a pattern visible region and a non-visible region, and referring to fig. 2, the pattern visible region includes: an electronic ink layer 100, wherein the electronic ink layer 100 has a first surface 110 and a second surface 120 which are oppositely arranged and is positioned in a visible pattern area; a first pattern assembly disposed on one side of the first surface 110 and located in a pattern viewing area, the first pattern assembly including a plurality of first sub-pattern structure layers 200 disposed in a stacked manner, wherein each first sub-pattern structure layer 200 includes a first electrode pattern layer, a first insulating base material 220 and a first conducting wire layer 230 disposed in a stacked manner in sequence, the first electrode pattern layer includes first pattern regions 211 and first non-pattern regions 212 disposed in an insulating manner at intervals, the first conducting wire layer 230 and the first pattern regions 211 are electrically connected by first conductive pillars 10 penetrating through the first insulating base material 220, and patterns of the first pattern regions 211 of the first electrode pattern layers in different first sub-pattern structure layers 200 are different; the background color component 400, the background color component 400 comprises a whole electrode layer 410 and a third insulating base material 420 which are sequentially stacked, and an optical coating layer 500, wherein the optical coating layer 500 is arranged on one side of the background color component 400 far away from the electronic ink layer 100; the substrate 600, the substrate 600 is disposed on the side of the optical coating layer 500 away from the electronic ink layer 100. Therefore, the whole electrode layer is respectively matched with different first sub-pattern structure layers to electrify and apply voltage so as to apply voltage to the electronic ink layer, so that the shell assembly displays the patterns of the first pattern region in the first sub-pattern structure layers, and the shell assembly can display the patterns with different colors by combining the optical coating layer; moreover, when the pattern layers are switched at a higher speed, the shell assembly can also present a dynamic display effect; moreover, only the whole electrode layer and the third insulating substrate are arranged on one side of the second surface of the electronic ink layer, so that the electronic ink layer can be adjusted, the shell component is light and thin, and when the shell component is applied to electronic equipment such as a mobile phone, the quality of the electronic equipment is favorably reduced, and the user experience is better. It should be noted that, when the second component is a background color component, the specific setting of the first sub-pattern structure layer in the first pattern component may be the same as the setting of the first sub-pattern structure layer when the second component is the second pattern component, and details are not described herein again. It should be noted that, when the second component is a background color component, the third insulating substrate is equivalent to the insulating layer in the second component, and the full-face electrode layer is equivalent to the electrode layer in the second component, and the full-face electrode layer may be disposed on a surface of the third insulating substrate close to the electronic ink layer, or on a surface of the third insulating substrate far from the electronic ink layer.
According to some examples of the present application, when the second surface 120 of the electronic ink layer 100 is provided with a background color component 400, as shown in fig. 12, fig. 12 is a schematic structural view of the background color component, wherein an outermost contour line in fig. 12 is an edge of the third insulating substrate 420, Q1 corresponds to a visible region, Q2 corresponds to a non-visible region, and a region corresponding to the entire electrode layer 410 is also referred to as a visible region Q1; as shown in fig. 12, one end of the third insulating substrate 420 extends to the non-visible region Q2, the portion of the third insulating substrate 420 defining the non-visible region Q2 is a third insulating portion, a connection conductive sheet 430 is disposed on the surface of the third insulating portion, and the connection conductive sheet 430 is disposed in the same layer as and electrically connected to the entire electrode layer 410. It should be noted that the connection wire connecting the conductive sheet 430 and the entire electrode layer 410 and the connection wire electrically connecting the conductive sheet 430 and the entire electrode layer 410 may be formed through the same etching process step, according to some examples of the present application, the connection conductive sheet 430 and the entire electrode layer 410 may be made of indium tin oxide, and thus, the entire electrode layer and the connection conductive sheet may be formed through the same step of a mature etching process, which is beneficial to saving the manufacturing cost; and the whole electrode layer has better light transmittance, which is beneficial to improving the overall performance of the shell component.
According to an example of the present application, when the second surface 120 of the electronic ink layer 100 is provided with the background color member 400, referring to fig. 13, a seventh conductive sheet 7 is further provided on the surface of the first insulating portion, the seventh conductive sheet 7 is electrically connected to the connecting conductive sheet 430 and to one of the first Pin pins 1. It should be noted that, in this specific example, the three first sub-pattern-structure layers 200 are still provided as the first pattern component, and the first sub-pattern-structure layer 200 closest to the electronic ink layer (i.e. the 3 rd first sub-pattern-structure layer 200) is shown in fig. 13, in this specific example, the number of the first Pin pins 1 provided on the surface of the first insulating portion is 7, one of the first Pin pins is electrically connected to the seventh conductive sheet 7, and since the seventh conductive sheet 7 is electrically connected to the connecting conductive sheet 430, the first Pin 1 electrically connected to the seventh conductive sheet 7 can be used to adjust and control the background color component. According to an example of the present application, referring to fig. 14, the seventh conductive sheet 7 and the connecting conductive sheet 430 may be electrically connected by the fifth conductive pillar 60, and the material of the fifth conductive pillar 60 may also be silver paste.
The specific structure of the electronic ink layer 100 will be described in detail below. According to an example of the present application, referring to fig. 15 and 16, the electronic ink layer 100 includes a plurality of microcapsule particles 130, each microcapsule particle 130 encapsulating therein a positively charged white titanium oxide particle 131, a negatively charged black carbon particle 132, and an electrophoretic liquid 133. It should be noted that fig. 15 and 16 illustrate that the electronic ink layer includes 3 microcapsule particles 130 for convenience of description, and do not represent the number of microcapsule particles actually included in the electronic ink layer; in addition, it should also be understood by those skilled in the art that the numbers of the positively charged white titanium oxide particles and the negatively charged black carbon particles in each microcapsule particle in the figure are also only for explanation and are not intended to limit the present application. Fig. 15 and 16 represent two different current-carrying conditions of the electronic ink layer 100, respectively, as shown in fig. 15, the first surface 110 side of the electronic ink layer 100 is charged negatively, the second surface 120 side of the electronic ink layer 100 is charged positively (the positive and negative charges in the figure are only used for illustration), in this case, the positively charged white titanium oxide particles 131 are gathered toward the first surface 110 side, and the negatively charged carbon particles 132 are gathered toward the second surface 120 side, so that the first surface 110 is white, and the second surface 120 is black, because the second surface 120 is disposed close to the optical coating layer 500, after incident light is irradiated from the outside to the housing component, the light is reflected by the layer structure of the optical coating layer 500, and part of the light is irradiated to the second surface 120 of the electronic ink layer 100, at this time, the second surface 120 is black, and the part of the light irradiated to the second surface 120 will be absorbed; as shown in fig. 16, in the electrified state, the negatively charged carbon particles 132 are gathered toward the first surface 110 side, and the positively charged white titanium oxide particles 131 are gathered toward the second surface 120 side, so that the first surface 110 is black, and the second surface 120 is white, because the second surface 120 is disposed close to the optical coating layer 500, when incident light is irradiated to the housing assembly from the outside, the light is reflected by the layer structure of the optical coating layer 500, and a part of the light is irradiated to the second surface 120 of the electronic ink layer 100, at this time, the second surface 120 is white, and the part of the light irradiated to the second surface 120 is reflected, and then is superimposed with the light reflected by the layer structure of the optical coating layer, so as to form a final coating color. As can be seen from the above description, when light enters the housing assembly from the outside, the color of the reflected light changes with the state of the electronic ink layer.
According to an example of the present application, referring to fig. 17 to 20, the optical coating layer 500 may include a plurality of sub coating layers sequentially stacked, and materials of two adjacent sub coating layers are different. According to a specific example of the present application, referring to fig. 17, the optical coating layer 500 may include two sub-coating layers, a first sub-coating layer 510 and a second sub-coating layer 520, wherein the first sub-coating layer 510 and the second sub-coating layer 520 are different materials. According to another specific example of the present application, referring to fig. 18, the optical coating layer 500 may further include a third sub-coating layer 530, thereby further improving the performance of the optical coating layer. Referring to fig. 19 and 20, the optical coating layer 500 includes a coating substrate layer 540, a third sub coating layer 530, a second sub coating layer 520, a first sub coating layer 510, a second sub coating layer 520, and a first sub coating layer 510, which are sequentially stacked, wherein the coating substrate layer 540 is disposed close to the electronic ink layer 100, and it should be noted that, in fig. 19 and 20, in order to illustrate that the electronic ink layer is in different states, a state that the second surface of the electronic ink layer is white is recorded as 5, and a state that the second surface of the electronic ink layer is black is recorded as 6, respectively, due to different reflected lights generated when the incident lights pass through the housing assembly. As shown in fig. 19, the second surface of the electronic ink layer is white, at this time, the incident light is reflected by each sub-coating layer and the coating base layer of the optical coating layer 500, and part of the light irradiates the second surface of the electronic ink layer, and because the second surface is white, the part of the light is reflected and then is superimposed with the light reflected by each sub-coating layer and the coating base layer of the optical coating layer, and the displayed color is the final superimposed color; as shown in fig. 20, the second surface of the electronic ink layer is black, at this time, the incident light is reflected by each sub-coating layer and the coating base layer of the optical coating layer 500, and a part of the light irradiates the second surface of the electronic ink layer.
According to some specific examples of the present application, the material of the first sub-coating layer 510 may be silicon oxide, the material of the second sub-coating layer 520 may be niobium oxide, and the material of the third sub-coating layer 530 may be zirconium oxide. According to still further examples of the present application, the material of the coated substrate layer 540 may be PET (polyethylene terephthalate). The material of the coated substrate layer 540 is polyethylene terephthalate, which can provide a good substrate layer for the sub-coating layers, and is convenient for forming each sub-coating layer on the substrate layer in the follow-up process. The third sub-coating layer 530 is made of zirconia, which is beneficial to improving the adhesive force of other sub-coating layers, and can ensure that all the layers of the formed optical coating layer are well combined, so that the optical coating layer has better stability. The material of the first sub-coating layer 510 is silicon oxide, and the material of the second sub-coating layer 520 is niobium oxide, which is favorable for further improving the performance of the optical coating layer. Because the rete of different thickness, different materials has certain difference to the reflection and the transmission effect of different wavelength light, in this application, sets up optical coating layer and includes multilayer structure, and adjacent two-layer structure's material is different, can realize the demonstration of different colours, need explain in addition that, do not specially limit to the concrete thickness of each layer structure of optical coating layer in this application, and the technical staff in the field can set up and adjust according to actual need.
The following provides a detailed description of the principle of the present application that can realize dynamic pattern display effect by some specific examples.
When the first surface 110 of the electronic ink layer 100 is provided with the first pattern element and the second surface 120 of the electronic ink layer 100 is provided with the second pattern element: still taking the case that the first pattern assembly includes three first sub-pattern structure layers, and the second pattern assembly includes three second sub-pattern structure layers, a positive voltage may be input to the first pattern region 211 of the 1 st first sub-pattern structure layer 200 of the first pattern assembly through the first Pin 1, a negative voltage may be input to the second pattern region 311 of the 1 st second sub-pattern structure layer 300 of the second pattern assembly through the second Pin, at this time, in a portion of the electronic ink layer 100 corresponding to the first pattern region 211 of the 1 st first sub-pattern structure layer 200, the negatively charged carbon particles 132 are gathered to the first surface 110, the positively charged titanium oxide particles 131 are gathered to the second surface 120, the second surface 120 of the portion of the electronic ink layer 100 is white, after the light is incident to the second surface of the portion of the electronic ink layer, the light is reflected, and the finally displayed color is the superimposed color of the partially reflected light and the light reflected by each layer structure of the optical ink layer; meanwhile, a negative voltage is input to the first non-pattern region 212 of the 1 st first sub-pattern structure layer 200 of the first pattern assembly through the first Pin 1, a positive voltage is input to the second non-pattern region 312 of the 1 st second sub-pattern structure layer 300 of the second pattern assembly through the second Pin, at this time, in a part of the electronic ink layer 100 corresponding to the first non-pattern region 212 of the 1 st first sub-pattern structure layer 200, the negatively charged carbon particles 132 are gathered to the second surface 120, the positively charged titanium oxide particles 131 are gathered to the first surface 110, the second surface 120 of the part of the electronic ink layer 100 is black, after the light enters the second surface 120 of the part of the electronic ink layer 100, the light is absorbed and not reflected, and the finally displayed color is only the superimposed color of the light reflected by each layer structure of the optical coating layer. Under the condition of electrifying, the second surface of the electronic ink layer corresponding to the first pattern area presents white, the second surface of the electronic ink layer corresponding to the first non-pattern area presents black, and the color of the first pattern area is different from that of the second pattern area after incident light irradiates the shell assembly by combining the optical coating layer, so that the shell assembly can display the patterns of the first pattern area. Similarly, the second surface of the electronic ink layer corresponding to the first pattern area may be rendered black and the second surface of the electronic ink layer corresponding to the second non-pattern area may be rendered white by applying different voltages, in which case, the first pattern area and the first non-pattern area may also generate a color difference, so that the housing assembly may display the pattern of the first pattern area.
According to some specific examples of the present application, voltages may be applied to different patterned areas and non-patterned areas in sequence, such that the surface of the housing assembly displays different patterns in sequence. According to a specific example of the present application, referring to fig. 21, first, a positive voltage is input to the first pattern region 211 of the 1 st first sub-pattern-structure layer 200 of the first pattern assembly through the first Pin 1, a negative voltage is input to the second pattern region 311 of the 1 st second sub-pattern-structure layer 300 of the second pattern assembly through the second Pin, and at the same time, a negative voltage is input to the first non-pattern region 212 of the 1 st first sub-pattern-structure layer 200 of the first pattern assembly through the first Pin 1, and a positive voltage is input to the second non-pattern region 312 of the 1 st second sub-pattern-structure layer 300 of the second pattern assembly through the second Pin, so that the housing assembly displays the pattern of the 1 st first sub-pattern-structure layer, as shown in fig. 21 (a); the voltages applied to the 1 st first sub-pattern-structure layer and the 1 st second sub-pattern-structure layer are turned off, and then, a positive voltage is inputted to the first pattern region 211 of the 2 nd first sub-pattern-structure layer 200 of the first pattern assembly through the first Pin 1, a negative voltage is inputted to the second pattern region 311 of the 2 nd second sub-pattern-structure layer 300 of the second pattern assembly through the second Pin, and at the same time, a negative voltage is inputted to the first non-pattern region 212 of the 2 nd first sub-pattern-structure layer 200 of the first pattern assembly through the first Pin 1, and a positive voltage is inputted to the second non-pattern region 312 of the 2 nd second sub-pattern-structure layer 300 of the second pattern assembly through the second Pin, so that the housing assembly displays the pattern of the 2 nd first sub-pattern-structure layer, as shown in fig. 21 (B); the voltages applied to the 2 nd first sub-pattern-structure layer and the 2 nd second sub-pattern-structure layer are turned off, and then, a positive voltage is inputted to the first pattern region 211 of the 3 rd first sub-pattern-structure layer 200 of the first pattern assembly through the first Pin 1, a negative voltage is inputted to the second pattern region 311 of the 3 rd second sub-pattern-structure layer 300 of the second pattern assembly through the second Pin, and at the same time, a negative voltage is inputted to the first non-pattern region 212 of the 3 rd first sub-pattern-structure layer 200 of the first pattern assembly through the first Pin 1, and a positive voltage is inputted to the second non-pattern region 312 of the 3 rd second sub-pattern-structure layer 300 of the second pattern assembly through the second Pin, so that the housing assembly displays the pattern of the 3 rd first sub-pattern-structure layer, as shown in fig. 21 (C). In this way, voltage can be continuously applied to the first and second different sub-pattern structure layers, so that the three patterns shown in fig. 21 can be repeatedly appeared on the housing assembly, thereby forming the effect of dynamic pattern display. It should be noted that the faster the frequency of cycling the power is, the faster the speed of switching the different patterns is, but the electronic ink generally requires a certain response time, typically 120 ms to 150 ms, and therefore the frequency of power is preferably not more than 5 times per second. In the present application, the energizing sequence of each sub-pattern structure layer is not particularly limited, and those skilled in the art can set the energizing sequence according to actual display requirements. Furthermore, the skilled person can realize animation effect by reasonable design of the pattern.
Another case of the housing assembly is explained as follows: when the first surface 110 of the electronic ink layer 100 is provided with the first pattern component and the second surface 120 of the electronic ink layer 100 is provided with the background color component 400, since only the whole electrode layer 410 is disposed on the second surface 120 side of the electronic ink layer 100, the plurality of first sub-pattern structure layers 200 on the first surface 110 side of the electronic ink layer 100 need to cooperate with the whole electrode layer 410 for power supply, and the description will be given by the first pattern component including three first sub-pattern structure layers 200: first, a negative voltage is input to the first non-pattern region 212 of the 1 st first sub-pattern-structure layer 200 of the first pattern assembly through the first Pin 1, and a positive voltage is input to the entire electrode layer 410 through the first Pin, so that the case assembly displays the pattern of the 1 st first sub-pattern-structure layer, as shown in fig. 21 (a); inputting a positive voltage to the first non-pattern region 212 of the 1 st first sub-pattern-structure layer 200 of the first pattern assembly through the first Pin 1, inputting a negative voltage to the entire electrode layer 410 through the first Pin, so that the case assembly is restored to a non-energized state, and then inputting a negative voltage to the first non-pattern region 212 of the 2 nd first sub-pattern-structure layer 200 of the first pattern assembly through the first Pin 1, and inputting a positive voltage to the entire electrode layer 410 through the first Pin, so that the case assembly displays a pattern of the 2 nd first sub-pattern-structure layer, as shown in fig. 21 (B); inputting a positive voltage to the first non-pattern region 212 of the 2 nd first sub-pattern-structure layer 200 of the first pattern assembly through the first Pin 1, inputting a negative voltage to the full-area electrode layer 410 through the first Pin, so that the case assembly is restored to a non-energized state, and then inputting a negative voltage to the first non-pattern region 212 of the 3 rd first sub-pattern-structure layer 200 of the first pattern assembly through the first Pin 1, and inputting a positive voltage to the full-area electrode layer 410 through the first Pin, so that the case assembly displays a pattern of the 3 rd first sub-pattern-structure layer, as shown in fig. 21 (C); inputting a positive voltage to the first non-pattern region 212 of the 3 rd first sub-pattern structure layer 200 of the first pattern element through the first Pin 1, and inputting a negative voltage to the full-area electrode layer 410 through the first Pin, so that the housing element recovers a non-energized state, 8230, and so on, so that the housing element can display dynamic changes of different patterns through cyclic energization. In this case, each first sub-pattern structure layer needs to be matched with the whole electrode layer for power supply, and before the next pattern is displayed, the state when the power supply is not supplied needs to be restored, so that the response time is doubled in this case, otherwise, patterns in different areas are easily overlapped with each other, and a state of pattern disorder is generated.
According to an example of the present application, as shown in fig. 1 or fig. 2, two adjacent first sub-pattern structure layers 200 may be bonded by a transparent adhesive 30, so that a bonding force between the adjacent first sub-pattern structure layers 200 is improved, and thus, the overall stability of the housing assembly is improved. According to the example of the present application, as shown in fig. 1, two adjacent second sub-pattern structure layers 300 may also be bonded by a transparent adhesive 30, so that the bonding force between the adjacent second sub-pattern structure layers 300 is favorably improved, and the overall stability of the housing assembly is further favorably improved. According to some examples of the present disclosure, the optical coating layer 500 and the substrate 600 may be bonded by a transparent adhesive, and the optical coating layer 500 and the background color component 400 may be bonded by a transparent adhesive, thereby facilitating the improvement of the bonding force between the structures. According to other examples of the present application, the optical coating layer 500 and the second pattern assembly may be bonded by a transparent adhesive, that is, the optical coating layer 500 and the 1 st second pattern structure layer of the second pattern assembly are bonded by a transparent adhesive, so that the bonding force between the optical coating layer and the second pattern assembly is improved.
According to an example of the present application, referring to fig. 1 or 2, the housing assembly may further include a frame sealing adhesive 700, where the frame sealing adhesive 700 is located in the non-visible region and is used for sealing edges of the electronic ink layer 100, the first pattern assembly, and the second assembly (the second pattern assembly or the background color assembly 400), so that effective sealing of the electronic ink layer, the first pattern assembly, and the second assembly (the second pattern assembly or the background color assembly) may be achieved. According to some examples of the present application, the frame sealing adhesive 700 may be a waterproof adhesive, which can prevent water and oxygen from entering.
According to an example of the present application, referring to fig. 1 or fig. 2, the housing assembly may further include a waterproof barrier layer 800, the waterproof barrier layer 800 being disposed opposite the optical coating layer 500 such that the electronic ink layer 100, the first pattern assembly, and the second pattern assembly or background color assembly 400 are located between the optical coating layer 500 and the waterproof barrier layer 800. Therefore, the performance of preventing the invasion of water and oxygen of the shell assembly can be further improved, and the service performance of the shell assembly is further effectively improved.
In another aspect of the invention, an electronic device 2000 is provided. Referring to fig. 22, the electronic device 2000 includes: a housing assembly 1000, the housing assembly 1000 being the housing assembly previously described; a display screen assembly (not shown) connected to the housing assembly 1000 and defining an installation space therebetween, wherein the base body 600 (not shown) of the housing assembly 1000 is disposed away from the installation space; and a main board (not shown in the figure) disposed in the installation space and electrically connected to the display screen assembly. Thus, the electronic device has all the features and advantages of the housing assembly described above, and the description thereof is omitted here. Generally speaking, the electronic equipment can display different patterns, dynamic display of different patterns can be realized by continuously applying voltage to different areas, the defect that the shell of the conventional electronic equipment is single in display is overcome, and user experience is better.
The specific type of the electronic device described in the present application is not particularly limited, and may be, for example, a mobile phone, a smart watch, a palm computer, or a notebook computer. The electronic device may be any of various types of computer system devices that are mobile or portable and perform wireless communication. In particular, the electronic device may be a mobile or smart phone (e.g., an iPhone (TM) based phone), a Portable gaming device (e.g., nintendo DS (TM), playStation Portable (TM), gameboy Advance (TM), iPhone (TM)), a laptop, a PDA, a Portable internet device, a music player, and a data storage device, other handheld devices, and a head-mounted device such as a watch, an in-ear headphone, a pendant, a headset, etc., and other wearable devices (e.g., a head-mounted device (HMD) such as an electronic necklace, an electronic garment, an electronic bracelet, an electronic tattoo, or a smart watch).
The electronic device may also be any one of a number of electronic devices including, but not limited to, cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbook computers, personal Digital Assistants (PDAs), portable Multimedia Players (PMPs), moving picture experts group (MPEG-1 or MPEG-2) audio layer 3 (MP 3) players, portable medical devices, and digital cameras, and combinations thereof.
In some cases, the electronic device may perform a variety of functions (e.g., playing music, displaying videos, storing pictures, and receiving and sending telephone calls). If desired, the electronic device may be a portable device such as a cellular telephone, media player, other handheld device, wristwatch device, pendant device, earpiece device, or other compact portable device.
In the description herein, references to the description of the terms "one example," "another example," "yet another example," "some examples," "some specific examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the example is included in at least one example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to be the same examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more examples. Moreover, various examples and features of different examples described in this specification can be combined and combined by one skilled in the art without contradiction. In addition, it should be noted that, in the present specification, the terms "first", "second", "third", "fourth", "fifth", "sixth", "seventh" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
Although examples of the present application have been shown and described above, it should be understood that the above examples are not to be construed as limiting the present application and that those of ordinary skill in the art may effect alterations, modifications, substitutions and variations to the above examples without departing from the scope of the present application.

Claims (18)

1. A housing assembly, comprising a pattern viewing area and a non-viewing area, the pattern viewing area comprising:
an electronic ink layer having first and second oppositely disposed surfaces;
the first pattern assembly is arranged on one side of the first surface and comprises a plurality of first sub-pattern structure layers which are arranged in a stacked mode, each first sub-pattern structure layer comprises a first electrode pattern layer, a first insulating base material and a first conducting wire layer which are arranged in a stacked mode sequentially, each first electrode pattern layer comprises first pattern areas and first non-pattern areas which are arranged in an insulating mode at intervals, the first conducting wire layers are electrically connected with the first pattern areas through first conducting pillars penetrating through the first insulating base materials, and patterns of the first pattern areas of the first electrode pattern layers in different first sub-pattern structure layers are different;
a second component disposed on one side of the second surface, the second component including an insulating layer and an electrode layer disposed on a surface of the insulating layer,
the optical coating layer is arranged on one side of the second component far away from the electronic ink layer;
the substrate is arranged on one side of the optical coating layer, which is far away from the electronic ink layer;
and applying voltages to different areas of the electronic ink layer by electrifying the first electrode pattern layer of the first sub-pattern structure layer and the electrode layer of the second component, so that the shell component presents patterns with different colors.
2. The housing assembly of claim 1,
the second assembly is a second pattern assembly, the second pattern assembly comprises a plurality of second sub-pattern structure layers which are arranged in a stacked manner, and the number of the second sub-pattern structure layers is equal to that of the first sub-pattern structure layers, each second sub-pattern structure layer comprises a second electrode pattern layer, a second insulating base material and a second conducting wire layer which are arranged in a stacked manner in sequence, each second electrode pattern layer comprises a second pattern region and a second non-pattern region which are arranged in an insulating manner at intervals, each second conducting wire layer is electrically connected with each second pattern region through a second conducting pillar which penetrates through the second insulating base material, and the patterns of the second pattern regions of the second electrode pattern layers in different second sub-pattern structure layers are different; alternatively, the first and second electrodes may be,
the second assembly is a background color assembly, and the background color assembly comprises a whole electrode layer and a third insulating base material which are sequentially stacked.
3. The housing assembly of claim 2, wherein each of the first sub-pattern structure layers further includes a third conductive line layer disposed at a same layer and a spacing from the first conductive line layer, and the third conductive line layer is electrically connected to the first non-pattern region through a third conductive pillar penetrating through the first insulating substrate.
4. The housing assembly of claim 2, wherein each of the second sub-pattern structure layers further includes a fourth conductive line layer disposed at a same layer and a spacing as the second conductive line layer, and the fourth conductive line layer is electrically connected to the second non-pattern region by a fourth conductive pillar penetrating the second insulating substrate.
5. The housing assembly of claim 1, wherein the first pattern area comprises a plurality of first sub-pattern areas arranged at intervals, the first conductor layer comprises a plurality of first sub-conductor sheets arranged at intervals, and the plurality of first sub-pattern areas are electrically connected with the plurality of first sub-conductor sheets in a one-to-one correspondence.
6. The housing assembly of claim 2 wherein the second pattern region includes a plurality of second sub-pattern regions spaced apart from each other, the second conductor layer includes a plurality of second sub-conductor pieces spaced apart from each other, and the plurality of second sub-pattern regions are electrically connected to the plurality of second sub-conductor pieces in a one-to-one correspondence.
7. The housing assembly of claim 3, wherein an end of the first insulating substrate in each of the first sub-pattern structure layers extends to the non-visible region, a portion of the first insulating substrate in the non-visible region is defined as a first insulating portion, a first conductive sheet and a second conductive sheet are disposed on one surface of the first insulating portion, the first conductive sheet and the second conductive sheet are disposed on the same layer as the first conductive layer, wherein the first conductive sheet is electrically connected to the first conductive layer, and the second conductive sheet is electrically connected to the third conductive layer.
8. The housing assembly of claim 7, wherein the first pattern assembly includes M first sub-pattern structure layers sequentially stacked, and the first sub-pattern structure layer closest to the electronic ink layer is an mth first sub-pattern structure layer, and the first sub-pattern structure layer farthest from the electronic ink layer is a 1 st first sub-pattern structure layer, wherein a plurality of third conductive sheets are disposed on a surface of the first insulating portion, which extends from the first insulating substrate, in the mth first sub-pattern structure layers, and the number of the third conductive sheets N =2M "2, and the plurality of third conductive sheets are electrically connected to the first conductive sheet and the second conductive sheet in the 1 st to M" 1 st sub-pattern structure layers, respectively, in a one-to-one correspondence manner, and M is a positive integer greater than or equal to 2.
9. The housing assembly of claim 8, wherein the non-viewable area comprises:
a plurality of first Pin pins, wherein the first Pin pins are electrically connected with a first conductive sheet, a second conductive sheet and a plurality of third conductive sheets which are arranged on the first insulating surface extending from the first insulating substrate in the Mth first sub-pattern structure layer;
and the plurality of first Pin pins are bound on the flexible circuit board.
10. The housing assembly of claim 4, wherein an end of the second insulating substrate in each of the second sub-pattern structure layers extends to the non-visible region, the portion of the second insulating substrate in the non-visible region is defined as a second insulating portion, a fourth conductive sheet and a fifth conductive sheet are disposed on one surface of the second insulating portion, and the fourth conductive sheet and the fifth conductive sheet are disposed on the same layer as the second conductive line layer, wherein the fourth conductive sheet is electrically connected to the second conductive line layer, and the fifth conductive sheet is electrically connected to the fourth conductive line layer.
11. The housing assembly of claim 10, wherein the second pattern assembly includes M second sub-pattern structure layers stacked in sequence, the second sub-pattern structure layer closest to the electronic ink layer is an mth second sub-pattern structure layer, the second sub-pattern structure layer farthest from the electronic ink layer is a 1 st second sub-pattern structure layer, wherein a plurality of sixth conductive sheets are disposed on a surface of the second insulating portion extending from the second insulating substrate in the mth second sub-pattern structure layer, the number of the sixth conductive sheets N =2M "2, the plurality of sixth conductive sheets are electrically connected to the fourth conductive sheets and the fifth conductive sheets in the 1 st to M" 1 th second sub-pattern structure layers, respectively, where M is a positive integer greater than or equal to 2.
12. The housing assembly of claim 11, wherein the non-viewable area further comprises:
the second Pin pins are electrically connected with a fourth conducting strip, a fifth conducting strip and a plurality of sixth conducting strips which are arranged on the surface of the second insulating part extending out of the second insulating base material in the Mth second sub-pattern structure layer;
and the plurality of second Pin pins are bound on the flexible circuit board.
13. The housing assembly of claim 9, wherein one end of the third insulating substrate extends to the invisible region, a portion of the third insulating substrate in the invisible region is defined as a third insulating portion, and a connection conductive sheet is disposed on a surface of the third insulating portion, and the connection conductive sheet is disposed in the same layer as and electrically connected to the entire electrode layer.
14. The housing assembly of claim 13, wherein a seventh conductive tab is further disposed on a surface of the first insulating portion, the seventh conductive tab being electrically connected to the connecting conductive tab and to one of the first Pin pins.
15. The housing assembly of claim 3, wherein the first conductive post, the second conductive post, and the third conductive post are made of silver paste.
16. The housing assembly of claim 1 wherein the optical coating comprises a plurality of sub-coatings arranged in a sequence, and wherein the materials of two adjacent sub-coatings are different.
17. The housing assembly of claim 1, further comprising:
the frame sealing glue is positioned in the non-visible area and used for packaging the edges of the electronic ink layer, the first pattern component and the second component;
the waterproof blocking layer with optical coating layer sets up relatively, makes the electron ink layer first pattern subassembly and the second subassembly is located optical coating layer with between the waterproof blocking layer.
18. An electronic device, comprising:
the housing assembly of any one of claims 1 to 17;
the display screen assembly is connected with the shell assembly, an installation space is defined between the display screen assembly and the shell assembly, and a base body in the shell assembly is far away from the installation space; and
the mainboard is arranged in the installation space and electrically connected with the display screen assembly.
CN202111070597.3A 2021-09-13 2021-09-13 Shell assembly and electronic equipment Active CN113631002B (en)

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