CN113625158A - 功率放大器芯片测试***及测试方法 - Google Patents
功率放大器芯片测试***及测试方法 Download PDFInfo
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- CN113625158A CN113625158A CN202111178872.3A CN202111178872A CN113625158A CN 113625158 A CN113625158 A CN 113625158A CN 202111178872 A CN202111178872 A CN 202111178872A CN 113625158 A CN113625158 A CN 113625158A
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- 238000012360 testing method Methods 0.000 title claims abstract description 82
- 238000010998 test method Methods 0.000 title description 3
- 230000007246 mechanism Effects 0.000 claims abstract description 143
- 230000000903 blocking effect Effects 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 13
- 238000005192 partition Methods 0.000 claims description 10
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 230000007306 turnover Effects 0.000 abstract 1
- 238000001514 detection method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000002457 bidirectional effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
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CN202111178872.3A CN113625158B (zh) | 2021-10-11 | 2021-10-11 | 功率放大器芯片测试***及测试方法 |
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CN202111178872.3A CN113625158B (zh) | 2021-10-11 | 2021-10-11 | 功率放大器芯片测试***及测试方法 |
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CN113625158A true CN113625158A (zh) | 2021-11-09 |
CN113625158B CN113625158B (zh) | 2021-12-10 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113777475A (zh) * | 2021-11-15 | 2021-12-10 | 枣庄智博智能科技有限公司 | 一种电子产品老化自动测试平台及其测试方法 |
CN116482517A (zh) * | 2023-05-04 | 2023-07-25 | 江苏友润微电子有限公司 | 一种集成电路测试连接装置 |
Citations (7)
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---|---|---|---|---|
JPH1022332A (ja) * | 1996-07-04 | 1998-01-23 | Matsushita Electric Ind Co Ltd | フリップチップ実装設備のic廃棄装置 |
TW200837353A (en) * | 2007-03-05 | 2008-09-16 | Chroma Ate Inc | Rotation-press cover inspection/test apparatus and the tester having the apparatus |
CN109585321A (zh) * | 2018-11-08 | 2019-04-05 | 深圳市卓精微智能机器人设备有限公司 | 一种检测芯片在测试中叠片的装置 |
CN212160007U (zh) * | 2020-04-17 | 2020-12-15 | 深圳市芯片测试技术有限公司 | 一种自动化芯片测试装置 |
CN212821225U (zh) * | 2020-08-10 | 2021-03-30 | 苏州欣华锐电子有限公司 | 一种用于芯片老化测试的芯片摆盘设备 |
CN112630722A (zh) * | 2021-01-04 | 2021-04-09 | 国网重庆市电力公司营销服务中心 | 电能表电磁抗干扰试验信号监测装置及监测*** |
CN113237442A (zh) * | 2021-07-12 | 2021-08-10 | 江苏澳芯微电子有限公司 | 一种芯片平整度检测装置及检测方法 |
-
2021
- 2021-10-11 CN CN202111178872.3A patent/CN113625158B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1022332A (ja) * | 1996-07-04 | 1998-01-23 | Matsushita Electric Ind Co Ltd | フリップチップ実装設備のic廃棄装置 |
TW200837353A (en) * | 2007-03-05 | 2008-09-16 | Chroma Ate Inc | Rotation-press cover inspection/test apparatus and the tester having the apparatus |
CN109585321A (zh) * | 2018-11-08 | 2019-04-05 | 深圳市卓精微智能机器人设备有限公司 | 一种检测芯片在测试中叠片的装置 |
CN212160007U (zh) * | 2020-04-17 | 2020-12-15 | 深圳市芯片测试技术有限公司 | 一种自动化芯片测试装置 |
CN212821225U (zh) * | 2020-08-10 | 2021-03-30 | 苏州欣华锐电子有限公司 | 一种用于芯片老化测试的芯片摆盘设备 |
CN112630722A (zh) * | 2021-01-04 | 2021-04-09 | 国网重庆市电力公司营销服务中心 | 电能表电磁抗干扰试验信号监测装置及监测*** |
CN113237442A (zh) * | 2021-07-12 | 2021-08-10 | 江苏澳芯微电子有限公司 | 一种芯片平整度检测装置及检测方法 |
Non-Patent Citations (2)
Title |
---|
P.A. COLLIER等: "Processing and reliability of flip-chip on board connections", 《 PROCEEDINGS OF THE 1997 1ST ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE》 * |
洪普等: "电动镜头盖级联位置检测技术研究", 《光学与光电技术》 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113777475A (zh) * | 2021-11-15 | 2021-12-10 | 枣庄智博智能科技有限公司 | 一种电子产品老化自动测试平台及其测试方法 |
CN113777475B (zh) * | 2021-11-15 | 2022-01-25 | 枣庄智博智能科技有限公司 | 一种电子产品老化自动测试平台及其测试方法 |
CN116482517A (zh) * | 2023-05-04 | 2023-07-25 | 江苏友润微电子有限公司 | 一种集成电路测试连接装置 |
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Denomination of invention: Power amplifier chip test system and test method Effective date of registration: 20220214 Granted publication date: 20211210 Pledgee: Zaozhuang rural commercial bank Limited by Share Ltd. Yicheng sub branch Pledgor: Shandong Hanxin Technology Co.,Ltd. Registration number: Y2022980001543 |
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Date of cancellation: 20230201 Granted publication date: 20211210 Pledgee: Zaozhuang rural commercial bank Limited by Share Ltd. Yicheng sub branch Pledgor: Shandong Hanxin Technology Co.,Ltd. Registration number: Y2022980001543 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Power amplifier chip test system and test method Effective date of registration: 20230213 Granted publication date: 20211210 Pledgee: Zaozhuang rural commercial bank Limited by Share Ltd. Yicheng sub branch Pledgor: Shandong Hanxin Technology Co.,Ltd. Registration number: Y2023980032481 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20211210 Pledgee: Zaozhuang rural commercial bank Limited by Share Ltd. Yicheng sub branch Pledgor: Shandong Hanxin Technology Co.,Ltd. Registration number: Y2023980032481 |