CN113604183A - Rigid epoxy glue solution - Google Patents
Rigid epoxy glue solution Download PDFInfo
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- CN113604183A CN113604183A CN202110961165.5A CN202110961165A CN113604183A CN 113604183 A CN113604183 A CN 113604183A CN 202110961165 A CN202110961165 A CN 202110961165A CN 113604183 A CN113604183 A CN 113604183A
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- parts
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- glue solution
- epoxy glue
- curing agent
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5026—Amines cycloaliphatic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
Abstract
The invention provides a rigid epoxy glue solution, which comprises the following components in a volume ratio of 2-4: 1 a component and a b component; the component A comprises 50-80 parts of bisphenol A type epoxy resin, 20-40 parts of phenolic aldehyde modified epoxy resin, 10-20 parts of polyfunctional diluent and 1-2 parts of silane coupling agent in parts by mass; the component B comprises 25-70 parts of modified curing agent and 0.5-1.5 parts of tertiary amine accelerator by mass. The invention relates to a rigid epoxy glue solution, which is a bi-component epoxy glue solution, wherein a bisphenol A type epoxy resin and a phenolic aldehyde modified epoxy resin are added in a component A, a modified curing agent is added in a component B, and active groups reach a hinge with high density after the two components are mixed, so that a cured product has higher rigidity.
Description
Technical Field
The invention relates to a rigid epoxy glue solution, belonging to the technical field of epoxy glue.
Background
With the rapid development in the fields of aviation, aerospace, rail transit, buildings and the like, the construction requirements of a large number of public facilities such as rail transit and the like are gradually improved, wherein guardrails are arranged on platforms of the public facilities such as subway trains and the like, and in order to enhance the stability and firmness of the guardrails, the steel ring sleeves on the guardrails are generally required to be reinforced and bonded by using colloid. Most of the existing epoxy glue solutions are single-component epoxy glue solution and double-component epoxy glue solution; wherein, the single-component epoxy glue solution is widely applied due to the characteristics of excellent heat resistance and good elastic film-forming property, and the double-component epoxy glue solution has the characteristics of low-temperature rapid curing, high storage stability and the like; both have higher application prospects, but the rigidity performance of the bi-component epoxy glue solution is lower, the use conditions and use occasions are limited, and the use is inconvenient in a specific environment, so the invention relates to a rigid epoxy glue solution which is mainly suitable for reinforcing a bonded steel ring sleeve.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a rigid epoxy glue solution to solve the problems in the background technology.
In order to achieve the above object, the present invention is achieved by the following technical solutions, including:
a rigid epoxy glue solution comprises the following components in a volume ratio of 2-4: 1 a component and a b component; the component A comprises 50-80 parts of bisphenol A type epoxy resin, 20-40 parts of phenolic aldehyde modified epoxy resin, 10-20 parts of polyfunctional diluent and 1-2 parts of silane coupling agent in parts by mass; the component B comprises 25 to 70 parts of modified curing agent and 0.5 to 1.5 parts of tertiary amine accelerator by mass; firstly, functional groups at two ends of bisphenol A type epoxy resin added in the component A are epoxy groups, and a molecular main chain is rich in ether bonds, secondary hydroxyl groups, benzene rings, methine and isopropyl groups, wherein the epoxy groups have strong reaction capacity, so that the steel ring sleeve and glue solution can have strong adhesive force, the ether bonds increase the wettability of the component A and the flexibility among molecules, the plate and the glue solution are combined favorably, the secondary hydroxyl groups further enhance the cohesive force and the adhesive force of the glue solution, the benzene rings enable the component A to have high heat resistance and rigidity, so that the epoxy glue solution has enough strength, the volume of the bisphenol A type epoxy resin can shrink when the plate is cured, a small amount of operations are performed in the plate bonding process, and the bonded plate is guaranteed to have a better bonding effect under the same environment; secondly, the phenolic aldehyde modified epoxy resin has the characteristics of both phenolic aldehyde resin and epoxy resin, has excellent cohesiveness of the epoxy resin and the characteristic of heat resistance of the phenolic aldehyde resin, and simultaneously has higher epoxy group content in the phenolic aldehyde modified epoxy resin, so that the phenolic aldehyde modified epoxy resin has higher viscosity, and thus, the cured product has high crosslinking density and better physical and mechanical properties, and the integral rigidity and compression resistance of the A component are improved; the bisphenol A type epoxy resin and the phenolic aldehyde modified epoxy resin are matched with each other to increase the crosslinking density between substances, and the rigidity and the compression resistance of the epoxy glue solution are increased after the crosslinking density is increased.
Preferably, the epoxy value of the bisphenol A type epoxy resin is 0.48 to 0.54; the bisphenol A type epoxy resin with the epoxy value within the range has shorter molecular chains and lower molecular weight, so that the hardness of the cured glue solution is higher, and the compression resistance of the epoxy glue solution can be improved by the bisphenol A type epoxy resin with the epoxy value within the range.
Preferably, the diluent is phenyl glycidyl ether; the phenyl glycidyl ether is used as an active diluent, has a strong rigidity characteristic, and is beneficial to the certain pressure resistance of the epoxy glue solution after being cured.
Preferably, the silane coupling agent is one or more of gamma-glycidyl ether propyl trimethoxy silane, gamma-aminopropyl triethoxy silane and gamma-divinyltriaminopropyl methyl dimethoxy silane; the silane coupling agent has the function of increasing the adhesive force between the functional group and the inorganic substance, so that the cured epoxy glue solution is more firmly combined with the inorganic material, and the adhesive property is improved.
Preferably, the modified curing agent consists of 20-50 parts of alicyclic amine modified curing agent and 5-20 parts of phenolic aldehyde modified cyclopentylamine curing agent; the two curing modifiers are both aliphatic modified curing agents and have better heat resistance, and the alicyclic amine modified curing agent is a room-temperature curing agent, and the two curing modifiers are used in combination, so that the curing effect can be ensured, and the diversity of the molecular structure of the curing agent can be improved, thereby improving the compressive strength of the epoxy glue solution.
Preferably, the volume ratio of the components is 3: 1 a component and a b component; the component A comprises 70 parts of bisphenol A epoxy resin, 30 parts of phenolic aldehyde modified epoxy resin, 10 parts of polyfunctional diluent and 2 parts of silane coupling agent in parts by mass; the component B comprises 30 parts by mass of alicyclic amine modified curing agent, 10 parts by mass of phenolic aldehyde modified cyclopentylamine curing agent and 1.12 parts by mass of tertiary amine accelerator, and in the preferable component proportion, the component A comprises 112 parts by mass of the component A, and the tertiary amine accelerator accounts for 1% of the whole content of the component A to achieve a better effect, so that the addition amount of the tertiary amine accelerator in the component proportion is 1.12 parts.
A preparation method of rigid epoxy glue solution comprises the following steps:
s1, preparing a component A: pouring the substances of the component A into a stirring dispersion kettle in sequence according to the mass ratio, and stirring for later use;
s2, preparing a component B: stirring the components B in a closed container for later use;
s3, preparing an epoxy glue solution: before use, the component A and the component B are mixed and stirred uniformly to prepare the rigid epoxy glue solution.
The invention has the beneficial effects that:
(1) the invention relates to a rigid epoxy glue solution, which is a bi-component epoxy glue solution, wherein a component A is added with bisphenol A type epoxy resin and phenolic aldehyde modified epoxy resin, a component B is added with a modified curing agent, the modified curing agent consists of alicyclic amine modified curing agent and phenolic aldehyde modified cyclopentylamine curing agent with different contents, and after the bi-component is mixed, all active groups interact to form a long chain with higher crosslinking density and rigidity, so that the epoxy glue solution has higher rigidity, and the tensile and compressive strength of the epoxy glue solution is further increased.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Example 1
A rigid epoxy glue solution comprises the following components in a volume ratio of 3: 1 a component and a b component; the component A comprises 70 parts by mass of bisphenol A type epoxy resin with an epoxy value of 0.49, 30 parts of phenolic aldehyde modified epoxy resin, 10 parts of phenyl glycidyl ether and 2 parts of gamma-glycidyl ether propyl trimethoxy silane; the component B comprises 30 parts of alicyclic amine modified curing agent, 10 parts of phenolic aldehyde modified cyclopentylamine curing agent and 1.12 parts of tertiary amine accelerator in parts by mass.
A preparation method of rigid epoxy glue solution comprises the following steps:
s1, preparing a component A: pouring the substances of the component A into a stirring dispersion kettle in sequence according to the mass ratio, and stirring for later use;
s2, preparing a component B: stirring the components B in a closed container for later use;
s3, preparing an epoxy glue solution: before use, the component A and the component B are mixed and stirred uniformly to prepare the rigid epoxy glue solution.
Example 2
A rigid epoxy glue solution comprises the following components in a volume ratio of 3: 1 a component and a b component; the component A comprises 50 parts by mass of bisphenol A type epoxy resin with an epoxy value of 0.51, 30 parts of phenolic aldehyde modified epoxy resin, 20 parts of phenyl glycidyl ether and 2 parts of gamma-aminopropyltriethoxysilane; the component B comprises 30 parts of alicyclic amine modified curing agent, 15 parts of phenolic aldehyde modified cyclopentylamine curing agent and 1.02 parts of tertiary amine accelerator by mass.
A preparation method of rigid epoxy glue solution comprises the following steps:
s1, preparing a component A: pouring the substances of the component A into a stirring dispersion kettle in sequence according to the mass ratio, and stirring for later use;
s2, preparing a component B: stirring the components B in a closed container for later use;
s3, preparing an epoxy glue solution: before use, the component A and the component B are mixed and stirred uniformly to prepare the rigid epoxy glue solution.
Example 3
A rigid epoxy glue solution comprises the following components in a volume ratio of 3: 1 a component and a b component; the component A comprises 80 parts by mass of bisphenol A type epoxy resin with an epoxy value of 0.52, 40 parts of phenolic aldehyde modified epoxy resin, 18 parts of phenyl glycidyl ether, 1 part of gamma-aminopropyltriethoxysilane and 1 part of gamma-diethylenetriaminopropylmethyldimethoxysilane; the component B comprises 30 parts of alicyclic amine modified curing agent, 10 parts of phenolic aldehyde modified cyclopentylamine curing agent and 1.4 parts of tertiary amine accelerator in parts by mass.
A preparation method of rigid epoxy glue solution comprises the following steps:
s1, preparing a component A: pouring the substances of the component A into a stirring dispersion kettle in sequence according to the mass ratio, and stirring for later use;
s2, preparing a component B: stirring the components B in a closed container for later use;
s3, preparing an epoxy glue solution: before use, the component A and the component B are mixed and stirred uniformly to prepare the rigid epoxy glue solution.
Example 4
A rigid epoxy glue solution comprises the following components in a volume ratio of 3: 1 a component and a b component; the component A comprises 80 parts by mass of bisphenol A type epoxy resin with an epoxy value of 0.49, 40 parts of phenolic aldehyde modified epoxy resin, 15 parts of phenyl glycidyl ether and 2 parts of gamma-diethylenetriaminopropylmethyldimethoxysilane; the component B comprises 30 parts of alicyclic amine modified curing agent, 10 parts of phenolic aldehyde modified cyclopentylamine curing agent and 1.37 parts of tertiary amine accelerator in parts by mass.
A preparation method of rigid epoxy glue solution comprises the following steps:
s1, preparing a component A: pouring the substances of the component A into a stirring dispersion kettle in sequence according to the mass ratio, and stirring for later use;
s2, preparing a component B: stirring the components B in a closed container for later use;
s3, preparing an epoxy glue solution: before use, the component A and the component B are mixed and stirred uniformly to prepare the rigid epoxy glue solution.
Example 5
A rigid epoxy glue solution comprises the following components in a volume ratio of 3: 1 a component and a b component; the component A comprises 50 parts by mass of bisphenol A type epoxy resin with an epoxy value of 0.53, 30 parts of phenolic aldehyde modified epoxy resin, 10 parts of phenyl glycidyl ether and 2 parts of gamma-aminopropyltriethoxysilane; the component B comprises 30 parts of alicyclic amine modified curing agent, 10 parts of phenolic aldehyde modified cyclopentylamine curing agent and 0.92 part of tertiary amine accelerator in parts by mass.
A preparation method of rigid epoxy glue solution comprises the following steps:
s1, preparing a component A: pouring the substances of the component A into a stirring dispersion kettle in sequence according to the mass ratio, and stirring for later use;
s2, preparing a component B: stirring the components B in a closed container for later use;
s3, preparing an epoxy glue solution: before use, the component A and the component B are mixed and stirred uniformly to prepare the rigid epoxy glue solution.
Comparative example 1
Epoxy glue solutions were prepared using existing methods and formulations as controls for examples 1 to 5.
Test example 1
Epoxy glue solutions of the same quality were selected from examples 1 to 5, and the common epoxy glue solution prepared in comparative example 1 of the same quality was used as a control: measuring the conventional parameters (VOC, tensile strength and compressive strength) of the epoxy glue solution, wherein the measurement standard conforms to the national standard requirement of technical specification for safety identification of engineering structure reinforced materials, and the obtained result is shown in Table 1; the pot life was measured at different test temperatures for each season, and the test results are shown in table 2.
TABLE 1 measurement results of conventional parameters of epoxy glue solutions
| VOC(G/L) | Tensile strength (Mpa) | Compressive resistance (Mpa) | |
| Example 1 | 83 | 69.2 | 107 |
| Example 2 | 85 | 68.7 | 103 |
| Example 3 | 89 | 69.4 | 106 |
| Example 4 | 87 | 68.9 | 104 |
| Example 5 | 82 | 69.1 | 105 |
| Comparative example 1 | 98 | 53 | 94 |
As can be seen from Table 1, the VOC of the epoxy glue solutions in examples 1 to 5 is less than 100G/L and lower than that of the existing products, and the tensile strength and compressive strength of the epoxy glue solutions are better than those of the existing products on the market.
TABLE 2 results of pot life measurement
As can be seen from table 2, the bonding strength between the epoxy glue solution and the dry concrete in the embodiments 1 to 5 is greater than 2Mpa, the bonding strength between the epoxy glue solution and the wet concrete is greater than 1.5Mpa, and the fluidity of the epoxy glue solution is better than that of the existing products in the market.
The epoxy glue solutions of examples 1 to 5 were selected for application safety performance (heat distortion temperature) evaluation according to the measurement results of tables 1 and 2, and the results are shown in table 3.
TABLE 3 safety performance evaluation results for epoxy glue solution applications
| Heat distortion temperature (. degree. C.) | |
| Example 1 | 73.4℃ |
| Example 2 | 74.1℃ |
| Example 3 | 72.8℃ |
| Example 4 | 73.2℃ |
| Example 5 | 73.6℃ |
| Comparative example 1 | 71.9℃ |
The results of the performance evaluation of the epoxy glue solutions obtained in example 1 are shown in table 3, and specifically, concrete was used as a base material, curing was carried out at a temperature of 23 ± 2 ℃ and a RH of 50 ± 5%, standardized curing was carried out for 21 days, and the heat distortion temperature was measured by a standard method, and the epoxy glue solutions involved in examples 1 to 5 were class ii products as shown in table 3, wherein class a products were obtained at a distortion temperature of 65 ℃ or higher, class ii products were obtained at a distortion temperature of 100 ℃ or higher, and class iii products were obtained at a distortion temperature of 130 ℃ or higher.
While there have been shown and described what are at present considered the fundamental principles and essential features of the invention and its advantages, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A rigid epoxy glue solution is characterized in that:
comprises the following components in a volume ratio of 2-4: 1 a component and a b component;
the component A comprises 50-80 parts of bisphenol A type epoxy resin, 20-40 parts of phenolic aldehyde modified epoxy resin, 10-20 parts of polyfunctional diluent and 1-2 parts of silane coupling agent in parts by mass;
the component B comprises 25-70 parts of modified curing agent and 0.5-1.5 parts of tertiary amine accelerator by mass.
2. A rigid epoxy glue solution according to claim 1, characterized in that: the epoxy value of the bisphenol A type epoxy resin is 0.48-0.54.
3. A rigid epoxy glue solution according to claim 2, characterized in that: the diluent is phenyl glycidyl ether.
4. A rigid epoxy glue solution according to claim 3, characterized in that: the silane coupling agent is one or more of gamma-glycidyl ether propyl trimethoxy silane, gamma-aminopropyl triethoxy silane and gamma-diethylenetriaminopropyl methyl dimethoxy silane.
5. A rigid epoxy glue solution according to claim 4, characterized in that: the modified curing agent consists of 20-50 parts of alicyclic amine modified curing agent and 5-20 parts of phenolic aldehyde modified cyclopentylamine curing agent.
6. A rigid epoxy glue solution according to claim 5, characterized in that:
comprises the following components in a volume ratio of 3: 1 a component and a b component;
the component A comprises 70 parts of bisphenol A epoxy resin, 30 parts of phenolic aldehyde modified epoxy resin, 10 parts of polyfunctional diluent and 2 parts of silane coupling agent in parts by mass;
the component B comprises 30 parts of alicyclic amine modified curing agent, 10 parts of phenolic aldehyde modified cyclopentylamine curing agent and 1.12 parts of tertiary amine accelerator in parts by mass.
7. A process for the preparation of a rigid epoxy glue solution, characterized in that it is used for the preparation of a rigid epoxy glue solution according to any one of claims 1 to 6:
s1, preparing a component A: pouring the substances of the component A into a stirring dispersion kettle in sequence according to the mass ratio, and stirring for later use;
s2, preparing a component B: stirring the components B in a closed container for later use;
s3, preparing an epoxy glue solution: before use, the component A and the component B are mixed and stirred uniformly to prepare the rigid epoxy glue solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110961165.5A CN113604183A (en) | 2021-08-20 | 2021-08-20 | Rigid epoxy glue solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110961165.5A CN113604183A (en) | 2021-08-20 | 2021-08-20 | Rigid epoxy glue solution |
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| CN113604183A true CN113604183A (en) | 2021-11-05 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120029115A1 (en) * | 2009-02-27 | 2012-02-02 | Haiping Wu | Room-temperature curable epoxy structural adhesive composition and preparation method thereof |
| CN103571411A (en) * | 2013-01-16 | 2014-02-12 | 上海都为电子有限公司 | Dual-component epoxy resin adhesive for splicing silicon block or silicon rod and preparation method of dual-component epoxy resin adhesive |
| CN103571413A (en) * | 2013-11-13 | 2014-02-12 | 苏州市姑苏新型建材有限公司 | Dry-hanging stone curtain wall epoxy adhesive and preparation method thereof |
| CN106010407A (en) * | 2016-06-02 | 2016-10-12 | 北京中德新亚建筑技术有限公司 | High-thixotropy modified epoxy resin steel sticking glue |
| CN108219373A (en) * | 2017-12-29 | 2018-06-29 | 广东铁科灌浆科技有限公司 | 1：1 type leak stopping epoxy grouting material and its preparation method and application |
-
2021
- 2021-08-20 CN CN202110961165.5A patent/CN113604183A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120029115A1 (en) * | 2009-02-27 | 2012-02-02 | Haiping Wu | Room-temperature curable epoxy structural adhesive composition and preparation method thereof |
| CN103571411A (en) * | 2013-01-16 | 2014-02-12 | 上海都为电子有限公司 | Dual-component epoxy resin adhesive for splicing silicon block or silicon rod and preparation method of dual-component epoxy resin adhesive |
| CN103571413A (en) * | 2013-11-13 | 2014-02-12 | 苏州市姑苏新型建材有限公司 | Dry-hanging stone curtain wall epoxy adhesive and preparation method thereof |
| CN106010407A (en) * | 2016-06-02 | 2016-10-12 | 北京中德新亚建筑技术有限公司 | High-thixotropy modified epoxy resin steel sticking glue |
| CN108219373A (en) * | 2017-12-29 | 2018-06-29 | 广东铁科灌浆科技有限公司 | 1：1 type leak stopping epoxy grouting material and its preparation method and application |
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