CN113594100B - Refrigerating type packaging structure with miniaturized volume - Google Patents
Refrigerating type packaging structure with miniaturized volume Download PDFInfo
- Publication number
- CN113594100B CN113594100B CN202110716339.1A CN202110716339A CN113594100B CN 113594100 B CN113594100 B CN 113594100B CN 202110716339 A CN202110716339 A CN 202110716339A CN 113594100 B CN113594100 B CN 113594100B
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- fixedly connected
- heat
- groove
- face
- pin
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 43
- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 238000005057 refrigeration Methods 0.000 claims abstract description 28
- 238000005538 encapsulation Methods 0.000 claims abstract description 14
- 239000004065 semiconductor Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a refrigeration type packaging structure with a miniaturized volume, which comprises a packaging base, a packaging cover and a mounting piece, wherein the bottom end of the packaging base is fixedly connected with a heat dissipation assembly, the top end of the packaging base is fixedly connected with the mounting piece, a placing groove is formed in the mounting piece, the outer wall of the mounting piece is fixedly connected with a pin, the inner wall of the placing groove is fixedly connected with a pin, a chip is arranged in the placing groove, the chip is connected with the pin, and one end of the pin, far away from the chip, is fixedly connected with the pin; the mounting piece top fixedly connected with encapsulation lid, encapsulation lid up end department in the middle of set up the first recess that is used for installing first heat-conducting plate, first recess and standing groove intercommunication, first heat-conducting plate outside and first recess inner wall fixed connection, first heat-conducting plate up end fixedly connected with semiconductor refrigeration piece. The packaging structure has the refrigerating function, and can improve the heat dissipation efficiency of the chip.
Description
Technical Field
The invention relates to the technical field of packaging structures, in particular to a refrigeration type packaging structure with a miniaturized volume.
Background
Packaging is the process of assembling an integrated circuit into a chip end product, simply by placing the integrated circuit Die (Die) produced by the foundry on a substrate that serves as a carrier, bringing the pins out, and then fixedly packaging the integrated circuit Die as a whole. As a verb, "packaging" emphasizes the processes and actions of placing, securing, sealing, threading; as a noun, the "package" mainly focuses on the form and category of the package, materials of the substrate, the shell and the leads, and emphasizes important roles of protecting the chip, enhancing the electrothermal performance and facilitating the assembly of the whole machine. The existing packaging structure has the problem of single function and poor heat dissipation effect, so that improvement is needed.
For this reason, we propose a small-sized refrigeration type package structure.
Disclosure of Invention
The invention mainly aims to provide a refrigeration type packaging structure with a small volume, which can effectively solve the problems in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
The utility model provides a refrigeration type packaging structure of miniaturized volume, includes the encapsulation base, still includes encapsulation lid and installed part, encapsulation base bottom fixedly connected with radiator unit, encapsulation base top fixedly connected with installed part, the inside standing groove that is equipped with of installed part, installed part outer wall fixedly connected with pin, standing groove inner wall fixedly connected with pin, be equipped with the chip in the standing groove, the chip is connected with the pin, the one end that the chip was kept away from to the pin is fixedly connected with the pin;
The mounting top fixedly connected with encapsulation lid, the encapsulation lid up end department of centering has offered the first recess that is used for installing first heat-conducting plate, first recess and standing groove intercommunication, first heat-conducting plate outside and first recess inner wall fixed connection, first heat-conducting plate up end fixedly connected with semiconductor refrigeration piece, fixedly connected with wire on the semiconductor refrigeration piece, semiconductor refrigeration piece can refrigerate, and through the design of first heat-conducting plate, the air conditioning can be transmitted to the standing groove in to cool off the chip, and the semiconductor refrigeration piece is prior art, and the theory of operation is not repeated here.
Further, the radiating component comprises a second heat conducting plate, a shell and radiating fins, openings are formed in two ends of the shell, the second heat conducting plate is fixedly connected with the bottom end of the packaging base through bolts, and the radiating component is convenient to install and detach through the design of the bolts.
Further, the shell, the top of the radiating fin are fixedly connected with the lower end face of the second heat conducting plate, the radiating fin is relatively parallel to the second heat conducting plate, the radiating fin is located in the shell, and the radiating fin, the first heat conducting plate, the second heat conducting plate, the first adapter plate and the second adapter plate are made of metal materials, so that the metal materials have the advantage of good heat conducting effect.
Further, a plurality of heat dissipation channels are arranged between two adjacent heat dissipation fins, and the heat dissipation channels and the heat dissipation fins are arranged at intervals.
Further, the top end of the packaging base is provided with a mounting groove, a substrate is embedded in the mounting groove, and the upper end face of the substrate is fixedly connected with the lower end face of the chip.
Further, the clamping groove communicated with the mounting groove is formed in the inner wall of the bottom end of the mounting groove, a first adapter plate is embedded in the clamping groove, and the upper end face of the first adapter plate is in contact with the lower end face of the base plate.
Further, a second groove for installing a second adapter plate is formed in the inner wall of the bottom end of the clamping groove, the upper end face of the second adapter plate is in contact with the lower end face of the first adapter plate, and the lower end face of the second adapter plate is in contact with the upper end face of the second heat conducting plate.
Furthermore, the jacks are formed in four corners of the upper end face of the mounting piece, the inserted bars matched with the jacks are fixedly connected to the four corners of the lower end face of the packaging plate, and the positions of the packaging cover can be limited through the design of the inserted bars and the slots, so that the packaging cover is connected with the mounting piece more tightly.
Compared with the prior art, the invention has the following beneficial effects: the heat on chip and the base plate can be transmitted to the second heat-conducting plate through the first adapter plate and the second adapter plate, and is transmitted to the radiating fin and the radiating channel through the second heat-conducting plate, the semiconductor refrigerating fin can refrigerate, and through the design of the first heat-conducting plate, the cold air can be transmitted to the standing groove, so that the chip is cooled, and through the cooperation of the structure, the packaging structure has the refrigerating function, and the radiating efficiency of the chip can be improved.
Drawings
Fig. 1 is a schematic structural diagram of a refrigeration type package structure with a miniaturized volume according to the present invention.
Fig. 2 is a perspective view of a mounting member of a refrigeration type package structure of a miniaturized volume according to the present invention.
Fig. 3 is a schematic view of the internal structure of a package base of a refrigeration type package structure with a miniaturized volume according to the present invention.
Fig. 4 is a perspective view of a heat dissipating assembly of a refrigeration type package structure with a miniaturized volume according to the present invention.
Fig. 5 is a perspective view of a package base of a refrigeration type package structure with a miniaturized volume according to the present invention.
In the figure: 1. packaging a base; 2. a package cover; 3. a mounting member; 4. a pin; 5. a heat dissipation assembly; 6. a first heat-conducting plate; 7. a first groove; 8. a semiconductor refrigeration sheet; 9. a wire; 10. a jack; 11. pins; 12. A chip; 13. a placement groove; 14. a substrate; 15. a first adapter plate; 16. a second adapter plate; 17. a bolt; 18. a second heat-conducting plate; 19. a housing; 20. a heat sink; 21. a heat dissipation channel; 22. a mounting groove; 23. A clamping groove; 24. and a second groove.
Detailed Description
The invention is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
As shown in fig. 1-5, a refrigeration type packaging structure with a miniaturized volume comprises a packaging base 1, a packaging cover 2 and a mounting piece 3, wherein the bottom end of the packaging base 1 is fixedly connected with a heat dissipation assembly 5, the top end of the packaging base 1 is fixedly connected with the mounting piece 3, a placing groove 13 is formed in the mounting piece 3, a pin 4 is fixedly connected with the outer wall of the mounting piece 3, a pin 11 is fixedly connected with the inner wall of the placing groove 13, a chip 12 is arranged in the placing groove 13, the chip 12 is connected with the pin 11, and one end, far away from the chip 12, of the pin 11 is fixedly connected with the pin 4;
The top fixedly connected with encapsulation lid 2 of installed part 3, encapsulation lid 2 up end department placed in the middle has offered the first recess 7 that is used for installing first heat-conducting plate 6, first recess 7 and standing groove 13 intercommunication, first heat-conducting plate 6 outside and first recess 7 inner wall fixed connection, first heat-conducting plate 6 up end fixedly connected with semiconductor refrigeration piece 8, fixedly connected with wire 9 on the semiconductor refrigeration piece 8, semiconductor refrigeration piece 8 can refrigerate, and through the design of first heat-conducting plate 6, the air conditioning can be transmitted to in the standing groove 13 to cool off chip 12, semiconductor refrigeration piece 8 is prior art, and the theory of operation is not repeated here.
The heat dissipation assembly 5 comprises a second heat conduction plate 18, a shell 19 and heat dissipation fins 20, openings are formed in two ends of the shell 19, the second heat conduction plate 18 is fixedly connected with the bottom end of the package base 1 through bolts 17, and the heat dissipation assembly 5 is convenient to install and detach through the design of the bolts 17.
The top ends of the shell 19 and the cooling fins 20 are fixedly connected with the lower end face of the second heat-conducting plate 18, the cooling fins 20 are relatively parallel and provided with a plurality of cooling fins, the cooling fins 20 are positioned in the shell 19, the cooling fins 20, the first heat-conducting plate 6, the second heat-conducting plate 18, the first adapter plate 15 and the second adapter plate 16 are all made of metal materials, and the metal materials have the advantage of good heat conduction effect.
Wherein, a plurality of heat dissipation channels 21 are arranged between two adjacent heat dissipation fins 20, and the heat dissipation channels 21 are arranged at intervals between the heat dissipation channels 21 and the heat dissipation fins 20.
The top end of the package base 1 is provided with a mounting groove 22, a substrate 14 is embedded in the mounting groove 22, and the upper end surface of the substrate 14 is fixedly connected with the lower end surface of the chip 12.
The inner wall of the bottom end of the mounting groove 22 is provided with a clamping groove 23 communicated with the mounting groove 22, the clamping groove 23 is embedded with a first adapter plate 15, and the upper end surface of the first adapter plate 15 is in contact with the lower end surface of the base plate 14.
The inner wall of the bottom end of the clamping groove 23 is provided with a second groove 24 for installing the second adapter plate 16, the upper end surface of the second adapter plate 16 contacts with the lower end surface of the first adapter plate 15, and the lower end surface of the second adapter plate 16 contacts with the upper end surface of the second heat conducting plate 18.
The four corners of the upper end surface of the mounting piece 3 are provided with insertion holes 10, the four corners of the lower end surface of the packaging plate 2 are fixedly connected with inserted bars matched with the insertion holes 10, and the positions of the packaging cover 2 can be limited through the design of the inserted bars and the insertion grooves 10, so that the packaging cover 2 is connected with the mounting piece 3 more tightly.
It should be noted that, the present invention is a refrigeration type packaging structure with a miniaturized volume, firstly, the lower end face of the packaging base 1 connected with the mounting piece 3 is fixedly provided with the upper heat dissipation component 5 through the bolt 17, then the mounting piece 3 is internally provided with the upper chip 12, the mounting piece 3 is buckled with the upper packaging cover 2, the semiconductor refrigeration piece 8 can refrigerate, and through the design of the first heat conduction plate 6, the cold air can be transmitted into the placing groove 13, so as to cool the chip 12, meanwhile, the heat on the chip 12 and the substrate 14 can be transmitted onto the second heat conduction plate 18 through the first heat conduction plate 15 and the second heat conduction plate 16, and is transmitted onto the heat dissipation piece 20 and the heat dissipation channel 21 through the second heat conduction plate 18, so as to realize the purpose of heat dissipation of the chip 12.
The foregoing has shown and described the basic principles and main features of the present invention and the advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, or the directions or positional relationships conventionally put in place when the inventive product is used, or the directions or positional relationships conventionally understood by those skilled in the art are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in a specific direction, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. The above embodiments are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention in this way, therefore: all equivalent changes in structure, shape and principle of the invention should be covered in the scope of protection of the invention.
Claims (5)
1. The utility model provides a refrigeration formula packaging structure of miniaturized volume, includes encapsulation base (1), its characterized in that still includes encapsulation lid (2) and installed part (3), encapsulation base (1) bottom fixedly connected with radiator unit (5), encapsulation base (1) top fixedly connected with installed part (3), inside standing groove (13) that are equipped with of installed part (3), installed part (3) outer wall fixedly connected with pin (4), standing groove (13) inner wall fixedly connected with pin (11), be equipped with chip (12) in standing groove (13), chip (12) are connected with pin (11), the one end and pin (4) fixedly connected of chip (12) are kept away from to pin (11).
The packaging structure is characterized in that the top end of the mounting piece (3) is fixedly connected with a packaging cover (2), a first groove (7) for mounting a first heat-conducting plate (6) is formed in the middle of the upper end face of the packaging cover (2), the first groove (7) is communicated with a placing groove (13), the outer side of the first heat-conducting plate (6) is fixedly connected with the inner wall of the first groove (7), the upper end face of the first heat-conducting plate (6) is fixedly connected with a semiconductor refrigerating sheet (8), and a lead (9) is fixedly connected to the semiconductor refrigerating sheet (8);
The top end of the packaging base (1) is provided with a mounting groove (22), a substrate (14) is embedded in the mounting groove (22), and the upper end surface of the substrate (14) is fixedly connected with the lower end surface of the chip (12);
A clamping groove (23) communicated with the mounting groove (22) is formed in the inner wall of the bottom end of the mounting groove (22), a first adapter plate (15) is embedded and mounted in the clamping groove (23), and the upper end face of the first adapter plate (15) is in contact with the lower end face of the base plate (14);
The inner wall of the bottom end of the clamping groove (23) is provided with a second groove (24) for installing a second adapter plate (16), the upper end face of the second adapter plate (16) is in contact with the lower end face of the first adapter plate (15), and the lower end face of the second adapter plate (16) is in contact with the upper end face of the second heat conducting plate (18).
2. A miniaturized volume refrigeration type packaging structure according to claim 1, wherein: the heat dissipation assembly (5) comprises a second heat conduction plate (18), a shell (19) and heat dissipation fins (20), openings are formed in two ends of the shell (19), and the second heat conduction plate (18) is fixedly connected with the bottom end of the package base (1) through bolts (17).
3. A miniaturized volume refrigeration type packaging structure according to claim 2, characterized in that: the top ends of the shell (19) and the radiating fins (20) are fixedly connected with the lower end face of the second heat conducting plate (18), a plurality of radiating fins (20) are arranged in parallel relatively, and the radiating fins (20) are located in the shell (19).
4. A miniaturized volume refrigeration type package according to claim 3, wherein: and a plurality of heat dissipation channels (21) are arranged between two adjacent heat dissipation fins (20), and the heat dissipation channels (21) are arranged at intervals between the heat dissipation channels (21) and the heat dissipation fins (20).
5. A miniaturized volume refrigeration type packaging structure according to claim 1, wherein: the four corners of the upper end face of the mounting piece (3) are provided with jacks (10), and the four corners of the lower end face of the packaging cover (2) are fixedly connected with inserted bars matched with the jacks (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110716339.1A CN113594100B (en) | 2021-06-26 | 2021-06-26 | Refrigerating type packaging structure with miniaturized volume |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110716339.1A CN113594100B (en) | 2021-06-26 | 2021-06-26 | Refrigerating type packaging structure with miniaturized volume |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113594100A CN113594100A (en) | 2021-11-02 |
| CN113594100B true CN113594100B (en) | 2024-06-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202110716339.1A Active CN113594100B (en) | 2021-06-26 | 2021-06-26 | Refrigerating type packaging structure with miniaturized volume |
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| Country | Link |
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| CN (1) | CN113594100B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617968A (en) * | 2013-12-06 | 2014-03-05 | 中国电子科技集团公司第四十四研究所 | Packaging device of APD focal plane |
| CN109904139A (en) * | 2019-03-08 | 2019-06-18 | 中国科学院微电子研究所 | Large size chip system packaging structure and preparation method thereof with flexible pinboard |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002083914A (en) * | 2000-09-06 | 2002-03-22 | Sanyo Electric Co Ltd | Electronic circuit cooler |
| JP2008124430A (en) * | 2006-10-18 | 2008-05-29 | Hitachi Ltd | Power semiconductor module |
| CN209981203U (en) * | 2019-07-29 | 2020-01-21 | 复汉海志(江苏)科技有限公司 | Chip packaging structure convenient and rapid to radiate |
| CN211828825U (en) * | 2020-05-25 | 2020-10-30 | 深圳格来得电子科技有限公司 | Heat dissipation packaged semiconductor |
| CN111638580A (en) * | 2020-07-26 | 2020-09-08 | 武汉永鼎光通科技有限公司 | High-speed radiating optical module tube structure |
| CN213125053U (en) * | 2020-08-11 | 2021-05-04 | 郑君雄 | Laser chip heat radiation structure |
| CN212343002U (en) * | 2020-11-26 | 2021-01-12 | 江西联创光电科技股份有限公司 | Semiconductor laser packaging structure for improving heat dissipation |
-
2021
- 2021-06-26 CN CN202110716339.1A patent/CN113594100B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617968A (en) * | 2013-12-06 | 2014-03-05 | 中国电子科技集团公司第四十四研究所 | Packaging device of APD focal plane |
| CN109904139A (en) * | 2019-03-08 | 2019-06-18 | 中国科学院微电子研究所 | Large size chip system packaging structure and preparation method thereof with flexible pinboard |
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| CN113594100A (en) | 2021-11-02 |
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