CN113589454B

CN113589454B - Optical module hard connection implementation method and optical module

Info

Publication number: CN113589454B
Application number: CN202111132520.4A
Authority: CN
Inventors: 胡百泉; 林雪枫; 李林科; 吴天书; 杨现文; 张健
Original assignee: Wuhan Linktel Technologies Co Ltd
Current assignee: Wuhan Linktel Technologies Co Ltd
Priority date: 2021-09-27
Filing date: 2021-09-27
Publication date: 2021-12-28
Anticipated expiration: 2041-09-27
Also published as: CN113589454A

Abstract

The invention relates to a hard connection realization method of an optical module and the optical module, the hard connection is firstly carried out, a PCBA and an optical device are integrally assembled, and then the mounting of internal key elements is carried out, thereby avoiding the obvious dislocation of an optical path or a circuit; and then, carrying out key high-frequency interconnection, and carrying out optical path interconnection by utilizing the characteristic that a parallel optical path is insensitive to axial deviation and transverse deviation to form a non-positive sequence implementation method, which not only has the advantage of large facula coupling tolerance, but also can keep each channel coupled to the optimal tolerance curve position, has the advantages of simple device structure, easy control of the coupling method and the like, and has the advantages of small space occupation, easy assembly and the like.

Description

Optical module hard connection implementation method and optical module

Technical Field

The invention belongs to the technical field of optical communication, and particularly relates to a hard connection implementation method of an optical module and the optical module.

Background

For many miniaturized optical modules, such as SFP + optical modules, QSFP28 optical modules, etc., the optical devices are assembled together with PCBA after being bent by a soft tape or a TO pin of the optical device, which is common in the application of hermetic optical devices, such as patents with application numbers CN201711243548.9, CN201710833529.5, CN201921371832.9, etc.; for the application of a non-airtight optical device, particularly for an optical module with a very small optical module, such as an optical module packaged by SFP DD, QSFP DD and the like, since the single rate reaches 100Gpbs and above, a corresponding PCBA is provided with a higher-rate electrical chip, such as a DSP chip, a driver chip and other auxiliary circuits, such as a TEC control circuit and the like, the layout of the PCBA is very compact, the occupied space is increased by more than 50% compared with the PCBA of SFP +, the geometric space of the optical device is severely compressed, and the optical device cannot be electrically interconnected with the PCBA by using a conventional soft tape. One solution is to use a hard connection for the electrical interface and a soft connection for the optical interface, i.e. the optical interface uses a pigtail type or other optical fiber type interface that is insensitive to bending. The flexible connection is characterized in that space is flexible, the allowance of the dislocation amount existing in the two components is large and reaches mm magnitude, the flexible connection material occupies large space, particularly tail fiber, because the tail fiber has the requirement of minimum bending radius, the bending radius of the existing bending insensitive fiber is only 5mm, even if the fiber is wound for 1 circle, the fiber winding space of at least 10mm needs to be reserved, which provides great challenge to dense high-speed PCBA packaging, and in addition, the flexible connection material also has the requirement of minimum bending radius for the flexible tape, otherwise, high-frequency impedance can obviously change, which causes high-frequency signal degradation; the hard connection is that at the optical port or the electric port, a relatively freely bent material is not adopted, but a hard material such as a metal tube, a PCB (printed Circuit Board), a ceramic part and the like is directly adopted for direct butt joint, and the hard connection is characterized in that the two connected parts only allow a small dislocation amount such as 0.1mm, otherwise, obvious adverse factors such as electric loss, optical loss, mechanical stress and the like can be caused. For example, in patent CN202011634058.3, an MPO type optical interface is adopted, and the MPO connector is connected with a ribbon pigtail, which can be bent freely in a certain space, but the MPO type pigtail has an obvious characteristic that the pigtail needs to be long, otherwise, the pigtail has great stress, is difficult to process and is difficult to assemble; for example, CN201811006706.3, the LC type single-core pigtail can be freely bent in space, and has obvious characteristics, a space with a bending diameter of the pigtail needs to be reserved, so that the space layout inside the module is greatly limited, and in addition, the pigtail itself is a vulnerable part, which is easily damaged by pressure and twisted, and temperature cycling causes optical fiber shrinkage to cause optical power change; for example, CN109283632A and CN109613661A adopt a hard connection mode, which is characterized in that the device and the PCBA adopt a conventional hard connection design, and the position of the optical interface at the module package is separately disassembled, and the optical interface of the module package forms a freely movable part, so as to solve the problem of hard connection, but the disadvantage is that the optical interface of the module package forms a freely movable part, which is separated from the main body of the module package and needs to be adhered by glue, so that a very obvious gap exists, which makes EMI control very difficult; meanwhile, the splitting mode easily causes the deviation amount of the position and the angle of the optical interface to be out of tolerance, and the international standard protocol is not met. IEEE and MSA define the size and position of the electrical and optical interfaces of the optical module, and impose constraints on the electrical and optical interfaces. In order to meet the electrical interface and the optical interface specified by the protocol, when the PCBA in the optical module is hard-connected with the optical interface of the optical device, since the PCBA and the optical device are completed in the normal production process according to the positive sequence, that is, the optical device component is manufactured first and then assembled into the module, various deviations formed by the optical device component are accumulated at the module end, so that during hard connection, deviation exists in a key high-frequency electrical signal and deviation exists in a key optical path, further, the optical module signal attenuation is large, the optical signal insertion loss is large, and the module index is unqualified in severe cases, and meanwhile, the mechanism stress after the assembly of the PCBA and the optical device is large due to the hard connection, and the later-stage reliability performance is affected.

How to make the electrical interface and the optical interface satisfy the protocol simultaneously when realizing hard connection in a limited space, and have good connection and small loss, and can also ensure the integrity of the module to obtain good EMI effect is a problem to be solved in the field.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a hard connection implementation method of an optical module and the optical module.

The technical scheme of the invention is realized as follows: the invention discloses a method for realizing hard connection of an optical module, which comprises the following steps:

fixing part of the transmitting end optical element and part of the receiving end optical element at corresponding positions in the device tube shell to form a first assembly;

the light emitting interface component and the light receiving interface component are fixedly arranged on the first component through light spot coupling to form a second component;

fixedly connecting the PCBA with a device tube shell of the second component after assembling to form a third component;

key electronic elements are correspondingly mounted on the device tube shell and the PCBA of the third component respectively, and then the key electronic elements are electrically connected with the PCBA to form a fourth component;

and coupling and fixing the rest of receiving end optical elements and the rest of transmitting end optical elements of the fourth assembly to form a fifth assembly.

Furthermore, a light source is respectively connected to a transmitting optical interface of the transmitting optical interface assembly and a receiving optical interface of the receiving optical interface assembly, light input from the transmitting optical interface is coupled into a part of transmitting end optical element in a device tube shell of the first assembly, a plurality of transmitting end light spots are output after the light is passed through a wavelength division multiplexing assembly, light input from the receiving optical interface is coupled into a part of receiving end optical element in the device tube shell of the first assembly, a receiving end light spot is output after the light is passed through a part of receiving end optical element of the first assembly, the plurality of transmitting end light spots and the receiving end light spot output from the first assembly are detected by a light spot detecting instrument, the position of the optical interface etalon chuck is adjusted to carry out light spot coupling, when the transmitting end light spot and the receiving end light spot meet set requirements, the adjustment of the position of the optical interface etalon chuck is stopped, and the transmitting optical interface assembly and the receiving optical interface assembly are fixedly connected with the device tube shell of the first assembly, forming a second assembly.

The light spot detection instrument has the capability of detecting infrared light spots and the capability of analyzing information such as energy, size, position and the like; the spot detection instrument may employ a beam quality analyzer.

Further, the method also comprises the following steps after the fifth component is formed:

and fixing a protective cover above the device tube shell of the fifth component, installing the fifth component fixed with the protective cover inside the module tube shell, and mounting the radiating fins and fixing the cover plate to form the optical module.

Further, the portion of the emitter end optical element initially fixed within the first assembly comprises a wavelength division multiplexing assembly;

through the facula coupling fixed transmission light interface module, receive the light interface module on first subassembly, form the second subassembly, specifically include:

placing the first component into a corresponding position in a light spot coupling machine tool and fixing; in addition, the transmitting optical interface and the receiving optical interface are respectively arranged at a first clamping groove and a second clamping groove in the optical interface etalon clamping head and are fixed;

the corresponding positions are respectively provided with an adjustable sliding ring at the transmitting end and an adjustable sliding ring at the receiving end;

respectively externally connecting a light source to the transmitting optical interface and the receiving optical interface, and displacing the optical interface etalon chuck to an initial calibration coupling position;

the optical coupling input from the light emitting interface enters a part of transmitting end optical elements in a device tube shell of the first assembly, a plurality of transmitting end light spots are output after the optical coupling input from the light receiving interface passes through a wavelength division multiplexing assembly, a part of receiving end optical elements in the device tube shell of the first assembly, a receiving end light spot is output after the optical coupling input from the light receiving interface passes through the part of receiving end optical elements of the first assembly, and a plurality of transmitting end light spots and a receiving end light spot output from the first assembly are detected by a light spot detecting instrument;

and adjusting the position of the optical interface etalon chuck to couple light spots, stopping adjusting the position of the optical interface etalon chuck when the light spots of the transmitting end and the receiving end meet set requirements, fixedly connecting the transmitting light interface with one end of the adjustable sliding ring of the transmitting end, fixedly connecting the receiving light interface with one end of the adjustable sliding ring of the receiving end, and fixedly connecting the other end of the adjustable sliding ring of the transmitting end and the other end of the adjustable sliding ring of the receiving end with the device tube shell of the first assembly respectively to form a second assembly.

Further, when the optical axis direction of the optical interface is vertically arranged, the optical interface etalon chuck is horizontally adjusted, when the light spot of the transmitting end meets the set requirement, the two-dimensional movement of the optical interface etalon chuck in the horizontal plane direction is stopped to be adjusted, the light spot of the transmitting end meets the set requirement, the angle of the light spot of the transmitting end meets the set range, and the distance between the light spots of the transmitting end meets the set condition;

adjusting the optical interface etalon chuck up and down along the vertical direction, observing the beam quality of the light spot of the receiving end, and stopping the displacement of the optical interface etalon chuck along the up and down direction when the diameter and the ellipticity of the light spot of the receiving end reach set targets;

when the light spots of the transmitting end and the receiving end both meet the set requirements, welding the adjustable sliding ring of the transmitting end with the transmitting light interface, and welding the adjustable sliding ring of the receiving end with the receiving light interface;

horizontally adjusting the position of the optical interface etalon chuck again to couple light spots, and respectively welding the adjustable sliding ring of the transmitting end and the adjustable sliding ring of the receiving end with the device tube shell of the first assembly when the light spots of the transmitting end meet the set requirement;

horizontal adjustment optical interface etalon chuck, when the transmitting terminal facula satisfies when setting for the requirement, the two-dimensional motion of the horizontal plane direction of stopping adjusting optical interface etalon chuck specifically includes: connecting the central points of the two transmitting end light spots or fitting the central points of a plurality of transmitting end light spots into a line by adopting a linear trend fitting method, an angle delta theta exists between a straight line where the line is located and a reference horizontal line, whether the angle delta theta is located in an angle standard range of product requirements or not is calculated, if the angle delta theta exceeds the angle standard range required by a product, moving the horizontal position of the chuck of the optical interface etalon, changing the position and distribution of a light spot at a transmitting end along with the position change of the chuck of the optical interface etalon, calculating whether the angle delta theta is reduced or not once when the light spot is moved once, if the angle delta theta is increased, indicating that the moving direction of the chuck of the optical interface etalon is wrong, changing the direction to be opposite to move, and if the angle delta theta is reduced, indicating that the moving direction of the chuck of the optical interface etalon is correct, continuously moving the chuck of the optical interface etalon until the angle delta theta is positioned in the angle standard range required by the product;

and judging whether the distance meets the set condition, if the distance does not meet the condition, moving the horizontal position of the optical interface etalon chuck until the distance between the light spots of the transmitting end meets the set condition.

Further, the PCBA and the device package of the second component are assembled and then fixedly connected to form a third component, which specifically includes: embedding the right end part of the PCBA into an open slot of a device tube shell of the second component, installing the right end part of the PCBA into a tool together, making a vacuum suction hole in an area where the bottom surface of the device tube shell is contacted with the tool so as to adsorb the device tube shell, opening vacuum adsorption, fixing the device tube shell at the moment, pressing down a PCBA pressing plate of the tool in place, fixing the PCBA, and closing the vacuum adsorption; at the moment, a curing adhesive is applied to the surface of the device tube shell in contact with the PCBA in an auxiliary mode for pre-curing, and then the device tube shell and the PCBA are fixed through thermosetting to form a third assembly;

then, placing the tool fixed with the third component into a chip mounting platform for chip mounting;

after mounting, putting the whole tool into a gold wire bonding platform, and performing a gold wire bonding process to form a fourth component;

the device tube shell is provided with identification points for material mounting and material alignment; the PCBA is also provided with identification points for material mounting and material alignment; when the right end part of the PCBA is embedded into an open slot of a device tube shell of the second component, the PCBA is moved and rotated to enable a first identification point on the PCBA to be aligned with a first identification point of the device tube shell;

the third component is provided with a device tube shell and a PCBA which are correspondingly and respectively provided with a key electronic element, and then the key electronic element is bonded with the PCBA gold wire, and the third component specifically comprises the following steps: respectively mounting a TEC (thermoelectric cooler), a COC (chip on chip) component and a thermistor in a device tube shell of the third component, and respectively mounting a PD (PD) chip and a TIA (three-dimensional interactive application) chip on a PCBA (printed circuit board assembly) of the third component;

and carrying out gold wire bonding on the COC component, the thermistor, the TEC and the PCBA, carrying out gold wire bonding on the TIA chip and the PCBA, and carrying out gold wire bonding on the PD chip and the TIA chip.

Furthermore, part of the transmitting end optical elements initially fixed in the first assembly comprise a transmitting end optical port lens, a transmitting end prism and a wavelength division multiplexing assembly, and part of the receiving end optical elements initially fixed in the first assembly comprise a receiving end optical port lens and a receiving end prism;

the remaining receiving end optical elements comprise a triangular reflecting prism, an array lens and a wavelength division demultiplexing component;

the step of coupling the remaining receiving-end optical elements specifically includes: respectively clamping a triangular reflecting prism, an array lens and a wavelength division demultiplexing component by a coupling tool for coupling, and finding out positions meeting the power requirements of a plurality of channels by scanning XYZ three-dimensional coordinate positions;

the remaining emission end optical element comprises a collimating lens group;

the coupling step of the remaining transmitting end optical elements specifically comprises the following steps: and sequentially coupling the light path channels of each transmitting end in a single-channel mode, and coupling one collimating lens at a time.

Further, the step of coupling the remaining receiving-end optical elements specifically includes:

setting the optical axis direction of the parallel optical interface, namely the length direction of the optical module as the Y-axis direction, setting the width direction of the optical module as the X-axis direction, and setting the height direction of the optical module as the Z-axis direction to form an XYZ three-dimensional coordinate;

supplying power to the PCBA, wherein the PCBA and the PDs and TIAs mounted on the PCBA normally work at the moment, a receiving optical interface of the receiving optical interface component is connected with a light source, the light source inputs optical signals with multiple wavelengths, when the optical signals reach the PD, photoproduction current can be generated, and the numerical value of the photoproduction current is transmitted to a computer end through the PCBA to be displayed;

respectively coupling a wavelength division demultiplexing component, a triangular reflecting prism and an array lens serving as optical elements to be coupled in X-axis, Y-axis and Z-axis directions as required in XYZ three-dimensional coordinates, finishing a first coupling step after the wavelength division demultiplexing component, the triangular reflecting prism and the array lens are coupled, observing the change of magnitude of photo-generated current of a PD, finishing the coupling of the wavelength division demultiplexing component, the triangular reflecting prism and the array lens when the magnitude of the photo-generated current of the PD meets the requirement of a product, starting a second coupling step when the magnitude of the photo-generated current of the PD does not meet the requirement of the product, repeating the steps until the magnitude of the photo-generated current of the PD meets the requirement of the product, and finishing the coupling of the wavelength division demultiplexing component, the triangular reflecting prism and the array lens;

when coupling is carried out along the X-axis direction, the magnitude of the photo-generated current of the PD is observed when the optical element to be coupled is moved along the X-axis direction as required, when the optical element to be coupled is moved along the X-axis direction, the numerical value of one photo-generated current is recorded every time the optical element is moved along the X-axis direction, the numerical value of the photo-generated current is compared with the numerical value of the previous photo-generated current, if the photo-generated current is reduced, the moving direction is wrong, the optical element is moved along the X-axis negative direction, if the photo-generated current is increased, the moving direction is correct, the optical element is continuously moved along the correct direction, the maximum photo-generated current value and the corresponding X-axis coordinate are found by comparing the numerical values of the photo-generated currents, and the X-axis coordinate of the optical element to be coupled is determined;

when coupling is carried out along the Y-axis direction, the magnitude of the photo-generated current of the PD is observed when the optical element to be coupled is moved along the Y-axis direction as required, when the optical element to be coupled is moved along the Y-axis direction in the positive direction of the Y-axis, the numerical value of one photo-generated current is recorded every time the optical element is moved, the numerical value of the photo-generated current is compared with the numerical value of the previous photo-generated current, if the photo-generated current is reduced, the moving direction is wrong, the optical element is moved along the negative direction of the Y-axis, if the photo-generated current is increased, the moving direction is correct, the optical element is continuously moved along the correct direction, the maximum photo-generated current value and the corresponding Y-axis coordinate are found by comparing the numerical values of the photo-generated currents, and the Y-axis coordinate of the optical element to be coupled is determined;

when coupling is carried out along the Z-axis direction, the optical element to be coupled is moved along the Z-axis direction as required, the magnitude of the photo-generated current of the PD is observed, when the optical element moves along the positive direction of the Z-axis, the numerical value of one photo-generated current is recorded every time the optical element moves, the numerical value of the photo-generated current is compared with the numerical value of the previous photo-generated current, if the photo-generated current becomes smaller, the moving direction is wrong, the optical element moves along the negative direction of the Z-axis, if the photo-generated current becomes larger, the moving direction is correct, the optical element continues to move along the correct direction, and the maximum photo-generated current value and the corresponding Z-axis coordinate are found by comparing the numerical values of the photo-generated currents, so that the Z-axis coordinate of the optical element to be coupled is determined.

Further, the wavelength division demultiplexing component, the triangular reflecting prism and the array lens are respectively used as optical elements to be coupled to perform X-axis, Y-axis and Z-axis direction coupling in XYZ three-dimensional coordinates according to requirements, and the method specifically comprises the following steps:

1) moving the wavelength division demultiplexing component along the X-axis direction, observing the magnitude of photo-generated current of the PD, recording the numerical value of one photo-generated current every time when the wavelength division demultiplexing component is moved along the positive direction of the X-axis, comparing the numerical value of the photo-generated current with the numerical value of the last photo-generated current, and if the photo-generated current becomes smaller, indicating that the moving direction is wrong, changing to moving along the negative direction of the X-axis; if the photoproduction current is increased, the movement direction is correct, the movement is continued along the correct direction, the maximum photoproduction current value and the corresponding X-axis coordinate are found by comparing the numerical values of the photoproduction current, and the X-axis coordinate of the wavelength division demultiplexing component is determined;

2) moving the wavelength division demultiplexing component along the Z-axis direction, observing the magnitude of the photo-generated current of the PD, recording the numerical value of one photo-generated current every time when the wavelength division demultiplexing component is moved along the Z-axis positive direction, comparing the numerical value of the photo-generated current with the numerical value of the last photo-generated current, and if the photo-generated current becomes smaller, indicating that the moving direction is wrong, changing to moving along the Z-axis negative direction; if the photo-generated current is increased, the moving direction is correct, the movement is continued along the correct direction, the maximum photo-generated current value and the corresponding Z-axis coordinate are found by comparing the numerical values of the photo-generated current, and the Z-axis coordinate of the wavelength division demultiplexing component is determined;

3) the triangular reflecting prism and the array lens are moved along the X-axis direction simultaneously, the magnitude of the photo-generated current of the PD is observed, when the triangular reflecting prism and the array lens are moved along the positive direction of the X-axis simultaneously, the numerical value of one photo-generated current is recorded every time the triangular reflecting prism and the array lens are moved, the numerical value of the photo-generated current is compared with the numerical value of the previous photo-generated current, if the photo-generated current becomes smaller, the moving direction is wrong, and the movement is changed into the negative direction along the X-axis; if the photoproduction current is increased, the movement direction is correct, the movement is continued along the correct direction, the maximum photoproduction current value and the corresponding X-axis coordinate are found by comparing the numerical values of the photoproduction current, and the X-axis coordinate of the triangular reflecting prism and the X-axis coordinate of the array lens are determined;

4) simultaneously moving the triangular reflecting prism and the array lens along the Y-axis direction, observing the magnitude of photo-generated current of the PD, recording the numerical value of one photo-generated current every time when the triangular reflecting prism and the array lens are simultaneously moved along the positive direction of the Y-axis, comparing the numerical value of the photo-generated current with the numerical value of the previous photo-generated current, and if the photo-generated current becomes smaller, indicating that the moving direction is wrong, changing to moving along the negative direction of the Y-axis; if the photoproduction current is increased, the movement direction is correct, the movement is continued along the correct direction, the maximum photoproduction current value and the corresponding Y-axis coordinate are found by comparing the numerical values of the photoproduction current, and the Y-axis coordinate of the triangular reflecting prism and the array lens is determined;

5) simultaneously moving the triangular reflecting prism and the array lens along the Z-axis direction, observing the magnitude of photo-generated current of the PD, recording the numerical value of one photo-generated current every time when the triangular reflecting prism and the array lens are simultaneously moved along the Z-axis positive direction, comparing the numerical value of the photo-generated current with the numerical value of the previous photo-generated current, and if the photo-generated current becomes smaller, indicating that the moving direction is wrong, changing to moving along the Z-axis negative direction; if the photo-generated current is increased, the moving direction is correct, the photo-generated current continues to move along the correct direction, the maximum photo-generated current value and the corresponding Z-axis coordinate are found by comparing the numerical values of the photo-generated current, and the Z-axis coordinate of the triangular reflecting prism and the array lens is determined;

6) and observing the magnitude change of the photo-generated current of the PD, finishing the coupling of the wavelength division demultiplexing component, the triangular reflecting prism and the array lens when the magnitude of the photo-generated current of the PD meets the requirement of the product, and repeatedly repeating the steps 1), 2), 3), 4) and 5) when the magnitude of the photo-generated current of the PD does not meet the requirement of the product, and stopping the coupling until the magnitude of the photo-generated current of the PD meets the requirement of the product.

Further, bonding and curing the isolator on the second assembly is also included.

The invention discloses an optical module, which comprises a module tube shell, a device tube shell, a transmitting light assembly, a receiving light assembly and a PCBA, wherein a transmitting light window and a receiving light window are arranged at one end part of the device tube shell, an open slot is arranged at the other end part of the device tube shell, the end part of the PCBA is inserted into the device tube shell from the open slot and is fixedly connected with the device tube shell, a transmitting light interface of the transmitting light assembly and a receiving light interface of the receiving light assembly are fixedly connected with the end parts of the device tube shell, which are provided with the transmitting light window and the receiving light window, respectively and correspond to the transmitting light window and the receiving light window, other parts of the transmitting light assembly and the receiving light assembly are fixed in an inner cavity of the device, the device tube shell and the PCBA are fixed in the module tube shell, and the module tube shell is provided with light interface clamping grooves for respectively clamping the transmitting light interface and the receiving light interface.

Furthermore, a radiating fin is arranged between the bottom surface of the device tube shell and the cavity bottom of the inner cavity of the module tube shell.

Further, the emission light component comprises an emission light interface, an emission port lens, a laser chip set, a collimating lens set, and a wavelength division multiplexing component, the transmitting port lens is arranged in a transmitting light window of the device tube shell, the fiber end surface of the transmitting light interface is positioned at the back focal plane of the transmitting port lens, the transmitting port lens is used for converting parallel light into convergent light, the wavelength division multiplexing component is positioned on the light path between the light emitting port lens and the laser chip set, the wavelength division multiplexing component is used for spatially combining the multipath laser optical signals into a beam of optical signal, the collimating lens set is positioned on the light path between the wavelength division multiplexing component and the laser chip set, the laser chip group is close to the collimating lens group and arranged at the back focal plane of the collimating lens group; the laser chip group is attached to the upper surface of the ceramic carrier group, and a metal wiring layer, a gold wire bonding pad and a laser chip eutectic solder area which are used for electrical interconnection are arranged on the upper surface of the ceramic carrier group; the ceramic carrier group and the collimating lens group are attached to the upper surface of the cold surface of the TEC, and the thermistor is attached to the upper surface of the cold surface of the TEC; an emitting end prism is arranged on a light path between the emitting end light port lens and the wavelength division multiplexing component; an isolator is arranged on a light path between the transmitting end light port lens and the wavelength division multiplexing component; the isolator is positioned on a light path between the wavelength division multiplexing component and the transmitting end prism; an adjustable emitting end sliding ring is arranged between the emitting light interface and the device tube shell; the optical axes of the emission light interface, the emission end adjustable sliding ring, the emission end optical port lens, the laser chip set, the collimating lens set, the wavelength division multiplexing component, the isolator and the prism are positioned in the same plane, the plane is parallel to the bottom surface of the device tube shell and the bottom surface of the module tube shell, and the TEC, the wavelength division multiplexing component, the isolator and the prism are all fixed with the device tube shell;

the receiving optical assembly comprises a receiving optical interface, a receiving end optical port lens, a detector chip set and a TIA chip, wherein the receiving end optical port lens is arranged in a receiving optical window of the device tube shell; the optical fiber end face of the receiving optical interface is positioned on a back focal plane of the receiving optical port lens, the receiving optical port lens is used for converting parallel light into convergent light, a wavelength division demultiplexing component, an array lens and a triangular reflecting prism are sequentially arranged on an optical path between the receiving end optical port lens and the detector chip set, the wavelength division demultiplexing component is used for spatially decomposing optical signals input from optical fibers in multiple paths into a plurality of optical signals and outputting the optical signals to the array lens, the array lens is used for converting the parallel light into the convergent light and outputting the convergent light to the triangular reflecting prism, the triangular reflecting prism is used for reflecting the convergent light to the detector chip set in the vertical propagation direction from the horizontal propagation direction, the detector chip set is positioned below the triangular reflecting prism, and a photosensitive surface of the detector chip set faces the triangular reflecting prism; a receiving end prism is arranged on a light path between the wavelength division demultiplexing component and the receiving end optical port lens; the wavelength division demultiplexing component and the prism are fixed with the device tube shell; the array lens and the triangular reflecting prism are bonded on the upper surface of the PCBA extending into the device tube shell area through a support or a cushion block; the detector chip set and the TIA chip are directly attached to the upper surface of the PCBA extending into the device tube shell area by adopting conductive silver adhesive; a receiving end adjustable sliding ring is arranged between the receiving optical interface and the device tube shell; the optical axes of the receiving optical interface, the receiving end adjustable sliding ring and the receiving end prism are positioned in the same plane, and the plane is parallel to the bottom surface of the device tube shell and the bottom surface of the module tube shell; the optical axes of the triangular reflecting prism, the array lens, the wavelength division demultiplexing component and the receiving end prism are positioned in the same plane, and the plane is parallel to the bottom surface of the device tube shell and the bottom surface of the module tube shell; the optical axes of the detector chip set and the triangular reflecting prism are positioned in the same plane, and the plane is vertical to the bottom surface of the device tube shell and the bottom surface of the module tube shell;

the detector chip set is connected with the TIA chip through gold wire bonding, and the TIA chip is connected with the PCBA through gold wire bonding; the ceramic carrier group, the thermistor, the TEC and the PCBA are connected through gold wire bonding; and the PCBA is provided with a high-frequency pin bonding pad corresponding to the ceramic carrier group.

Furthermore, one end of the adjustable sliding ring of the emitting end is welded with the emitting light interface, and the other end of the adjustable sliding ring of the emitting end is welded with the end part of the device tube shell and corresponds to the emitting light window; one end of the receiving end adjustable sliding ring is welded with the receiving optical interface, and the other end of the receiving end adjustable sliding ring is welded with the end part of the device tube shell and corresponds to the receiving optical window.

Furthermore, the height of the opening groove of the device tube shell is higher than the thickness of the PCBA, and the upper end face of the opening groove is higher than all optical elements in the device;

the device tube shell is provided with identification points for material mounting and material alignment; and the PCBA is also provided with identification points for material mounting and material alignment.

The invention has at least the following beneficial effects: the hard connection part is fixed, and then the internal key elements are pasted, so that obvious dislocation caused by an optical path or a circuit is avoided; at an electrical interface, the COC and the PCBA are directly subjected to gold wire bonding, and a soft belt mode is avoided, so that on one hand, high-frequency loss can be greatly reduced, and on the other hand, the space occupied by the soft belt is avoided; at the optical interface, the optical interface is connected with the device tube shell through laser welding type hard connection, so that on one hand, the high reliability of the device structure is ensured, on the other hand, the space occupied by the tail fiber during tail fiber type soft connection is avoided, and the defect of the tail fiber is also avoided; at the optical interface of the module tube shell, the module tube shell is not split, the integrity of the module tube shell is kept, and the EMI characteristics and advantages of the module products in the same sequence are also continued; in the aspect of dislocation deviation caused by assembly, a parallel light path and angle compensation method is utilized, and high-precision contraposition mounting is adopted during mounting, so that light path deviation caused by deviation is effectively solved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a partial cross-sectional view of an optical module according to an embodiment of the present invention;

fig. 2 is a partial cross-sectional view of a light emitting assembly of a light module according to an embodiment of the present invention;

fig. 3 is a partial cross-sectional view of a light receiving module of an optical module according to an embodiment of the present invention;

fig. 4 is a partially enlarged view of a receiving optical assembly of the optical module according to the embodiment of the present invention;

fig. 5 is a top view of a passive optical element according to an embodiment of the present invention;

FIG. 6 is a side elevational view of a passive optical component according to an embodiment of the invention;

fig. 7 is a schematic structural diagram of an optical interface etalon chuck according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of spot coupling provided by an embodiment of the present invention;

fig. 9 is a schematic diagram of a light spot at a transmitting end and a light spot at a receiving end according to an embodiment of the present invention;

fig. 10 is a schematic diagram of a semi-finished upper tool holder for performing a mounting operation according to an embodiment of the present invention;

FIG. 11 is a partial schematic view of a PCBA provided in accordance with an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of the present invention, the meaning of "plurality" or "a plurality" is two or more unless otherwise specified.

Example one

Referring to fig. 1 to 4, an embodiment of the present invention provides an optical module, including a module package 101, a PCBA102, and an optical device 103, where the optical device 103 includes a device package 104, an emission optical interface 105, a reception optical interface 106, an emission end adjustable sliding ring 107, a reception end adjustable sliding ring 108, an emission end optical port lens 109, a reception end optical port lens 110, a laser chip set 111, a ceramic carrier set 112, a thermistor 113, a collimating lens set 114, a TEC115, a wavelength division multiplexing component 116, an isolator 117, an emission end prism 118, a detector chip set 119, a TIA chip 120, a triangular reflection prism demultiplexing component 121, an array lens 122, a wavelength division component 123, and a reception end prism 124.

The emitting light assembly consists of an emitting light interface 105, an emitting end adjustable sliding ring 107, an emitting end optical port lens 109, a laser chip set 111, a ceramic carrier set 112, a thermistor 113, a collimating lens set 114, a TEC115, a wavelength division multiplexing assembly 116, an isolator 117 and an emitting end prism 118; the receiving optical assembly is composed of a receiving optical interface 106, a receiving end adjustable sliding ring 108, a receiving end optical port lens 110, a detector chip set 119, a TIA chip 120, a triangular reflecting prism 121, an array lens 122, a wavelength division demultiplexing assembly 123 and a receiving end prism 124.

The module package 101 is an optical module package conforming to the international standard protocol, such as but not limited to SFP-DD, QSFP-DD, OSFP, and the like, and the type of the module package clearly defines the optical interface mode, the size of the optical interfaces, the size between the optical interfaces, and the size and the mode of the electrical interfaces. The patent solves the problem of hard connection of an optical interface and hard connection of a device and PCBA electric interconnection, and does not relate to a PCBA electric interface (commonly called a gold finger end).

The emitting optical component and the receiving optical component use the same device case 104, and the device case 104 uses a BOX-type housing, and the size of the housing completely covers all materials of the emitting optical component and the receiving optical component except for the emitting optical interface 105, the receiving optical interface 106, the emitting end adjustable sliding ring 107 and the receiving end adjustable sliding ring 108. The transmitting optical interface 105 and the receiving optical interface 106 are mounted in the optical interface card slot of the module case 101. PCBA102 is located on the left side of module housing 101, limited by the limiting holes/posts of module housing 101. A body structure of the optical device 103 is provided between the PCBA102 and the

optical interfaces

105, 106. The end part of the device package 104 close to the PCBA102 is provided with an open slot 601, the height of the open slot 601 is not only higher than the thickness of the PCBA102, but also the upper end face of the open slot 601 is higher than all optical elements in the device, on one hand, the PCBA is convenient to install at the left end part of the device package 104, and on the other hand, the open slot 601 is used for transmitting parallel light to enable the parallel light to reach a light spot detection instrument. The right end of the PCBA102 extends into or is embedded within the interior of the device package 104, and the bottom surface of the PCBA102 contacts the open slot 601 of the device package 104 and is secured with structural adhesive. The device package 104 is provided with two protruding circular columns in the direction of the

optical interfaces

105, 106, forming the emitting and receiving optical windows of the optical device, respectively, and the emitting and receiving

optical port lenses

109, 110 are provided in circular holes in the optical windows, respectively. Adjustable sliding

tubes

107, 108 are also provided between the device package 104 and the

optical interfaces

105, 106, the small-diameter portions of the adjustable sliding

tubes

107, 108 are respectively sleeved on the metal outer sleeves of the

optical interfaces

105, 106, and the large-diameter portions contact the optical windows of the device package 104. The optical interface 105 and the adjustable sliding tube body 107 are fixed by laser welding, and the adjustable sliding tube body 107 and the device tube shell 104 are fixed by laser welding; the optical interface 106 and the adjustable sliding tube 108 are fixed by laser welding, and the adjustable sliding tube 108 and the device package 104 are fixed by laser welding.

In the device package 104, there are disposed in two regions, a light emitting element and a light receiving element, which are separated by a dotted line 126, the dotted line 126 is located near the middle line of the light device 103, as shown in fig. 1, the light emitting element is located at the upper end of the dotted line 126, the light receiving element is located at the lower end of the dotted line 126, and if necessary, the arrangement can be reversed, that is, the light emitting element is located at the lower end of the dotted line 126, and the light receiving element is located at the upper end of the dotted line 126, which is not limited by the illustration.

The light emitting assembly within the device package 104 is located in the left region of the light emitting port lens 109. The fiber end face of the launch optical interface 105 is located at the back focal plane of the launch optical port lens 109, and the launch optical port lens 109 functions to convert parallel light into convergent light. The first optical element on the left side of the light emitting port lens 109 is a light emitting end prism 118, and the light emitting end prism 118 functions to displace the optical axis of the light emitting port by a certain amount, so as to facilitate the overall layout of the light emitting assembly. On the left side of the emission end prism 118 is an isolator 117, and the isolator 117 is used to isolate stray light. On the left side of the isolator 117 is a wavelength division multiplexing module 116, and the wavelength division multiplexing module 116 may be a thin film filter or a polarization multiplexing module, where the thin film filter is preferred to spatially combine the multiple laser optical signals into one optical signal. On the left side of wavelength division multiplexing component 116 is TEC115, where TEC115 functions to control temperature and keep the temperature of the laser chip stable. TEC115 may be replaced with AlN ceramic if necessary. A ceramic carrier group 112, a thermistor 113 and a collimating lens group 114 are attached to the upper surface of the cold surface of the TEC115, and a laser chip group 111 is attached to the upper surface of the ceramic carrier group 112, wherein the collimating lens group 114 is located at one side of the wavelength division multiplexing component 116, and the laser chip group 111 is attached to the left side of the collimating lens group 114, is close to the collimating lens group 114, and is arranged at the back focal plane of the collimating lens group 114. The collimating lens group 114 functions to convert the optical signal of the laser chip into a quasi-parallel optical output. A metal wiring layer, a gold wire bonding pad, a laser chip eutectic solder area and the like for electrical interconnection are arranged on the upper surface of the ceramic carrier group 112, the gold wire bonding pad is close to the left side of the ceramic carrier group 112 and the right side of the PCBA102, and a gap of 0.05-0.15mm is reserved between the ceramic carrier group 112 and the PCBA 102. At the right border of the upper surface of the PCBA102, in the area near the ceramic carrier assembly 112, gold

wire bonding areas

1103 and 1106 for electrical interconnection are provided, which are electrically interconnected with the ceramic carrier assembly 112 by means of gold wire bonding.

In addition, the optical or mechanical axes of the emission optical interface 105, the emission end adjustable slip ring 107, the emission end optical port lens 109, the laser chip set 111, the ceramic carrier set 112, the thermistor 113, the collimating lens set 114, the TEC115, the wavelength division multiplexing component 116, the isolator 117, and the emission end prism 118 are located in the same plane 201, which is parallel to the bottom surface of the device package 104 and also parallel to the bottom surface of the module package 101. The transmit port lens 109, TEC115, wavelength division multiplexing component 116, isolator 117 and transmit port prism 118 are all located inside the device package 104 and are affixed to the device package 104 by gluing.

The light receiving components within the device package 104 are located in the left region of the light receiving port lens 110. The fiber end face of the receiving optical interface 106 is located at the back focal plane of the receiving optical port lens 110, and the receiving optical port lens 110 functions to convert parallel light into convergent light. The first optical element on the left side of the receiving port lens 110 is a receiving end prism 124, and the receiving end prism 124 is used for displacing the optical axis of the transmitting optical interface by a certain amount, so as to facilitate the overall layout of the receiving optical assembly. On the left side of the receiving end prism 124 is a wavelength division demultiplexing module 123, and the wavelength division demultiplexing module 123 uses a thin film filter to spatially decompose a multiplexed input optical signal into a plurality of optical signals. On the left side of the wavelength division demultiplexing component 123 is an array lens 122, and the array lens 122 functions to convert parallel light into convergent light. On the left side of the array lens 122 is a triangular reflecting prism 121, the triangular reflecting prism 121 functions to reflect the focused light from the horizontal propagation direction to the vertical propagation direction and to shift the focused light to the detector chip set 119. Below the triangular reflecting prism 121 is a detector chip set 119, the photosensitive surface of the detector chip set 119 facing the triangular reflecting prism 121. On the left side of the detector chipset 119 is a TIA chip 120. The receiving port lens 110, the wavelength division demultiplexing assembly 123 and the receiving end prism 124 are all located inside the device package 104 and are fixed to the device package 104 by means of gluing. Specifically, the probe chip set 119 and the TIA chip 120 are directly attached to the upper surface of the PCBA102 in the area where the device package 104 extends, and the array lens 122 and the triangular reflecting prism 121 are bonded to the upper surface of the PCBA102 in the area where the device package 104 extends through a gold layer bracket or a glass pad.

In addition, the optical or mechanical axes of the receiving-side optical interface 106, the receiving-side adjustable sliding ring 108, and the receiving-side prism 124 are located in the same plane 201, which is parallel to the bottom surface of the device package 104 and also parallel to the bottom surface of the module package 101. The optical or mechanical axes of the triangular reflecting prism 121, the array lens 122, the wavelength division demultiplexing module 123, and the receiving end prism 124 are located in the same plane 301, which is parallel to the bottom surface of the device package 104 and the bottom surface of the module package 101. The optical or mechanical axes of the detector chip set 119 and the triangular reflecting prism 121 lie in the same plane, which is perpendicular to the bottom surface of the device package 104 and also perpendicular to the bottom surface of the module package 101.

Inside the light device 103, cover plates or metal shields may be provided, if necessary, for the light-emitting component and the light-receiving component, respectively.

Example two

Referring to fig. 5 to 11, an embodiment of the present invention discloses a method for implementing hard connection of an optical module, including the following steps:

the first step is as follows: a part of the transmitting end optical element and a part of the receiving end optical element are respectively fixed inside the device tube shell to form a first assembly. As shown in fig. 5 and 6, in this step, passive optics such as an emission-end optical port lens 109, a receiving-end optical port lens 110, a wavelength division multiplexing component 116, and an emission-end prism 118 are respectively bonded inside the device package 104. The order of bonding is not limited.

It should be noted that 3

circular holes

501, 502, 503 are formed in the device package 104, and the outline of the circular holes is used as a mark. The positions of the

circular holes

501, 502, 503 are strongly correlated with the mounting positions of the optical window, the wavelength division multiplexing component 116 and the emission end prism 118 in the package 104, and can be used for mounting the wavelength division multiplexing component 116 and the emission end prism 118, and also can be used for marking the mounting of subsequent materials, such as TEC, laser chip set array, PCBA, and the like.

The second step is that: placing the first component into a light spot coupling machine tool and fixing; in addition, the transmitting optical interface 105 and the receiving optical interface 106 are respectively installed and fixed at the first card slot 703 and the second card slot 702 in the optical interface etalon chuck 701. As shown in fig. 7, the optical interface etalon chuck 701 has a card slot therein, which meets the optical interface of the international glazing module standard protocol, and the width, depth, distance and tolerance of the card slot are set according to the standard protocol or are set with stricter tolerance.

The third step: the light spots are coupled to fix the transmitting optical interface 105, the receiving optical interface 106, the transmitting end adjustable slip ring 107 and the receiving end adjustable slip ring 108. When the light spots are coupled, the elements in fig. 8 are placed perpendicular to the ground plane in real space, and the sliding ring 107 can freely slide down due to gravity to contact the housing 104. A light spot detection instrument is arranged in the light spot coupling machine table, and has the capability of detecting infrared light spots and the capability of analyzing information such as energy, size, position and the like; the spot detection instrument may employ a beam quality analyzer. The beam quality analyzer 801 is located at the bottom of the optical device 103 and is at a certain distance from the device case 104, and the beam quality analyzer 801 is a large photosensitive surface detection type instrument and can simultaneously detect and analyze position information, spot size information, and spot quality such as ellipticity and the like of a light spot at a transmitting end and a light spot at a receiving end. The present embodiment takes a four-channel optical module as an example, but the present invention is not limited to four channels. The beam quality analyzer 801 is set at a suitable position, so that the beam quality analyzer 801 can detect the space where 4 parallel

light spots

901 and 904 reversely input by the emitting light assembly and 1 parallel light spot 905 receiving input are located.

The third step can be divided into the following small steps:

3.1 the material is loaded into the clamp and is arranged at the initial calibration coupling position; the initial calibration coupling position is a reference position, and is generally the initial calibration position for the coupling process; the initial position is not required and is an empirical value or a theoretical setting.

3.2 install the adjustable slip ring of transmitting terminal between the transmitting optical window and the transmitting optical interface of the device tube shell of the first subassembly, install the adjustable slip ring of receiving terminal between the receiving optical window and the receiving optical interface of the device tube shell of the first subassembly, connect

coupling jumper wires

802, 803 respectively in transmitting optical interface and receiving optical interface,

coupling jumper wires

802, 803 connect the stable light source, then transmit optical interface 105 and receive optical interface 106 to shift to the initial calibration coupling position.

Because the transmitting optical interface 105 and the receiving optical interface 106 are both externally connected with a light source, the transmitting optical interface 105 is positioned near the back focal plane of the transmitting end optical port lens 109, and the receiving optical interface 106 is positioned near the back focal plane of the receiving end optical port lens 110, so that quasi-parallel light emitted from the transmitting end optical port lens 109 and the receiving end optical port lens 110 exists, the collimation distance length of the quasi-parallel light is at least 20mm, the transmitting end can transmit the wavelength division multiplexing component 116 without loss, and then the quasi-parallel light is decomposed into four Gaussian spots with different working wavelengths, and the receiving end can transmit the receiving end prism 124 without loss to form a Gaussian spot.

3.3 as shown in fig. 8, when the optical axis direction of the optical interface is vertically arranged, the optical interface etalon chuck 701 is adjusted to make the optical interface etalon chuck 701 perform two-dimensional motion on a plane parallel to the horizontal plane, and at this time, the observation beam quality analyzer 801 outputs coordinate information of four transmitting end

light spots

901 and 904 and 1 receiving end light spot 905, which respectively correspond to the four light spots decomposed by the wavelength division multiplexing component 116 and the light spot propagated by the receiving end.

The method comprises the steps of setting the optical axis direction of a parallel optical interface, namely the length direction of an optical module, as the Y-axis direction, setting the width direction of the optical module as the X-axis direction, setting the height direction of the optical module as the Z-axis direction, adjusting the optical interface to move along the Z-axis direction for adjusting the light spot angle, adjusting the optical interface to move along the X-axis direction for adjusting the light spot distance, and adjusting the optical interface to move along the Y-axis direction to adjust the light spot quality parameters such as the diameter and the size of the light spot.

3.4 judging whether the four transmitting end light spots 901-904 meet the set requirements, if not, horizontally adjusting the position of the optical interface etalon chuck, and when the transmitting end light spots meet the set requirements, stopping adjusting the position of the optical interface etalon chuck.

The emission end light spot meets the setting requirement, and the distance and the coordinate of each emission end light spot also meet the setting condition besides the requirement that the angle delta theta meets the setting requirement.

Judging whether the angle of the light spot of the transmitting end meets a set range or not, and performing angle coupling, wherein the method specifically comprises the following steps: the steps of the first scheme are as follows:

1) taking a connecting line of central points of the transmitting end light spots 901 and the transmitting end light spots 904 at the head end and the tail end, wherein the connecting line is a straight line, and an angle delta theta exists between the straight line and a reference horizontal line;

2) calculating whether the angle delta theta meets the angle standard theta 0 (such as +/-2 degrees) of the product requirement, and stopping angle adjustment if the angle delta theta is not more than theta 0;

3) if delta theta is larger than theta 0, the optical interface etalon chuck is moved along the Z-axis direction, the horizontal position of the optical interface is adjusted, the positions and the distribution of the four light spots can change along with the position of the optical interface, and whether the delta theta is reduced or not is calculated once every time the four light spots move;

3.1) if the optical interface is enlarged, indicating that the moving direction of the optical interface is wrong, changing the direction into a reverse direction;

3.2) if the size is smaller, the direction of the optical interface moving is correct, and the optical interface etalon chuck is continuously moved along the Z-axis direction until the requirement that delta theta is less than or equal to theta 0 is met.

The steps of the second scheme are as follows:

1) taking the central points of the four light spots, and fitting the four central points into a connecting line by adopting a linear trend fitting method such as a binomial fitting method, wherein the connecting line is a straight line, and the straight line and a reference horizontal line have an angle delta theta;

3) if delta theta is larger than theta 0, moving an etalon chuck of the optical interface, adjusting the horizontal position of the optical interface, and calculating whether delta theta is reduced or not every time the positions and the distribution of the four light spots change along with the positions of the optical interface;

3.2) if the size is smaller, the direction of the optical interface moving is correct, and the optical interface etalon chuck is continuously moved until the requirement that delta theta is less than or equal to theta 0 is met.

And judging whether the space meets the set condition, if the space does not meet the set condition, adjusting the horizontal position of the optical interface along the X-axis direction (referring to the angle coupling method), so that the space also meets the condition.

3.5 adjusting the optical interface etalon chuck 701 to move along the up-down direction, observing the beam quality of the light spot 905 at the receiving end, and stopping the optical interface etalon chuck 701 moving along the up-down direction when the diameter and the ellipticity of the light spot reach the set target.

It should be noted here that the two steps 3.4 and 3.5 are interchangeable, that is, the angles of the four light spots at the transmitting end may be coupled first and then the diameter of one light spot at the receiving end may be coupled, and the diameter of one light spot at the receiving end may be coupled first and then the angles of the four light spots at the transmitting end may be coupled.

It should be further noted here that the receiving spot diameters of steps 3.4 and 3.5 are obtained by theoretical calculation and repeated experiments, the angle criterion θ 0, the distances between the four transmitting end spots and the coordinates are obtained by theoretical calculation and repeated experiments, and the angles and the distances satisfy the conditions at the same time, but the coordinates are only used as reference. The angle, the space between the four transmitting end light spots and the coordinate are limited on the light spot coupling platform in a calibration mode, meanwhile, the angle direction is parallel to the bottom surface of the device tube shell 104, the path of the light spot is ensured to be parallel to the bottom surface of the tube shell 104, and the space between the four transmitting end light spots and the coordinate limit the relative position of the path of the light spot and the tube shell 104, which is important. The pitch of the four spots is kept the same as the pitch of the four laser chips 111 (some deviation is allowed). Generally, the coordinate position can not deviate too much, and the excessive deviation means that the optical path has larger dislocation after later assembly.

3.6 repeat step 3.4-3.5 once;

3.7, performing laser welding, namely performing laser welding on the transmitting end adjustable sliding ring 107 and the receiving end adjustable sliding ring 108 with the transmitting optical interface 105 and the receiving optical interface 106 respectively;

3.8 repeating step 3.4;

3.9, laser welding is carried out, and the emitting end adjustable sliding ring 107 and the receiving end adjustable sliding ring 108 are respectively carried out on the device tube shell 104. After welding, the transmitting optical interface 105, the receiving optical interface 106, the transmitting end adjustable sliding ring 107, the receiving end adjustable sliding ring 108 and the device package 104 are fixed.

The fourth step: the isolator 117 is bonded and cured within the device package of the second assembly.

The fifth step: assembling the semi-finished product of the device manufactured in the fourth step with PCBA to form a third component;

as shown in fig. 10, the placement tool 1001 is made to contain all the functions of the module case 101, and the tolerance accuracy control is stricter. Therefore, the die attach tool 1001 has all the spatial characteristics of the module package 101, such as the spacing column characteristics of the PCBA, the spatial characteristics of the device, and the characteristics of the module optical interface, and the space of the heat sink 125 where the device package 104 contacts the module package 101 is filled with the metal entity to ensure that the device package 104 fully contacts the tool 1001, and the vacuum suction hole is formed in the contact area of the bottom surface of the device package 104 and the tool 1001 to absorb the device package 104. In addition, the tooling 1001 can be used for mounting various materials in a module and is compatible with a gold wire bonding working platform, so that a semi-finished product assembled by a paster can be directly transferred to the gold wire bonding platform for gold wire bonding. In addition, the tool 1001 is further provided with a flip-type or rotary-type pressing plate for pressing the PCBA so that the PCBA does not move.

And thermosetting structural adhesive is coated on the left end tail part of the device package 104 and the contact area between the PCBA and the package 104.

It is explained here that the PCBA is provided with high-precision Mark marks 1101, 1102, alignment marks for mounting materials, and high-

frequency pin pads

1103 and 1106 corresponding to the ceramic carrier assembly 112.

In the tool, the right end of the PCBA is embedded into the open slot 601 of the semi-finished device package 104 manufactured in the fourth step, and is installed in the tool 1001 together, so as to ensure that the

optical interfaces

105 and 106 are in stress-free connection with the tool 1001, the package 104 is in flat contact with the tool 1001, and the PCBA is installed in the limit column of the tool 1001. Small movements and rotations of the PCBA cause the identification point 1101 to align with the identification point 503.

The vacuum suction is turned on, at which time the device package 104 is secured, pressing the PCBA platen of the tool 1001 in place, so that the PCBA is secured. The vacuum adsorption was turned off. At this time, the surface of the device package 104 in contact with the PCBA102 may be applied with an ultraviolet curing glue for pre-curing, so as to better ensure the fixation of the device package 104 to the PCBA 101.

And then heat cured to secure the device package 104 to the PCBA 102.

And then putting the whole tool into a chip mounting platform.

And a sixth step: and key electronic elements are correspondingly mounted on the device case and the PCBA of the third component respectively, wherein the key electronic elements comprise a TEC (thermoelectric cooler), a COC (chip on chip) component, a thermistor, a PD (PD) chip and a TIA (three-dimensional interactive application) chip.

Here, the laser chip 111 and the ceramic carrier 112 are fixed in advance in a eutectic manner to form a COC package, and then are subjected to aging and testing.

After the thermal curing silver adhesive is point-coated in the area corresponding to the TEC in the device tube shell 104, the automatic chip mounter absorbs the TEC and mounts the TEC at a set position, then the silver adhesive is point-coated on the TEC, the automatic chip mounter absorbs the COC component and mounts the COC component at the set position, when the COC component is mounted, the

marking point

1103 and 1106 are referred, and then the thermistor is mounted. After the area is arranged on the PCBA and the thermal curing silver colloid is dotted, the PD chip and the TIA are respectively sucked by the automatic chip mounter and mounted at the set positions, and the mark points 1101 and 1102 are referenced at the moment.

It is noted here that the end portions of the ceramic carrier assembly 112 and the PCBA102 in the COC package, where the ceramic carrier assembly 112 and the PCBA102 are gold wire bonded, are provided with pads matching the high frequency impedance, using the same high frequency impedance setting, such as 50 ohms. In addition, a gap of 0.05-0.15mm is reserved between the ceramic carrier group 112 and the PCBA102, so that a high-frequency signal passes through the COC and then propagates to a high-frequency wire of the PCBA in a short path. Compared with the mode of adopting the soft belt to carry out electric connection, the electric connection mode has the following advantages that on one hand, the wiring path is short, on the other hand, the high-frequency impedance mismatching caused by the welding and bending of the soft belt, the PCBA and the device tube shell is avoided, and on the other hand, the loss caused by the high-frequency mismatching of the ceramic high-frequency component body of the device tube shell used in the airtight tube shell is avoided. Therefore, the loss of high frequency can be greatly reduced compared to the soft band.

And placing the pasted materials and the tool into a high-temperature baking platform together and curing.

The seventh step: and then, carrying out gold wire bonding on the key electronic element and the PCBA to form a fourth component, which specifically comprises the following steps: and carrying out gold wire bonding on the COC component, the thermistor, the TEC and the PCBA of the transmitting terminal, carrying out gold wire bonding on the TIA and the PCBA of the receiving terminal, and carrying out gold wire bonding on the PD chip and the TIA.

Eighth step: and coupling, curing and temperature cycling the rest of the receiving-end optical elements. The remaining receiving-end optical elements include a triangular reflecting prism 121, an array lens 122, and a wavelength division demultiplexing assembly 123. The fourth component is sent to a receiving end coupling platform, and the coupling characteristic is that the triangular reflecting prism 121, the array lens 122 and the wavelength division demultiplexing component 123 are jointly coupled. The triangular reflecting prism 121, the array lens 122 and the wavelength division demultiplexing component 123 may be separately coupled in a moving manner, or at least two of them may be coupled in a moving manner together.

When the triangular reflecting prism and the array lens move simultaneously for coupling, X, Y, Z three directions need to be coupled, X, Y two directions only need to be coupled when the triangular reflecting prism is coupled alone, and X, Z two directions only need to be coupled when the array lens is coupled alone. When separately coupling the wavelength division demultiplexing components, only two directions of coupling X, Z are required. Of course, it is also possible to stick the three elements together and move them together, with the triangular reflecting prism, the array lens and the wavelength division demultiplexing assembly.

Preferably, the triangular reflecting prism and the array lens are moved simultaneously for coupling, so that the coupling is faster and more convenient, and the coupling dimensionality can be reduced. The triangular reflecting prism 121 and the array lens 122 are bonded on the same bottom plate to form a component, the component is clamped by a 6-dimensional coupling tool, the wavelength division demultiplexing component 123 is clamped by a 6-dimensional coupling tool, the two sets of coupling tools work simultaneously, and positions meeting power requirements of four channels are found through scanning of XYZ three-dimensional coordinate positions, and the method specifically comprises the following steps:

1. setting the optical axis direction (the direction parallel to the dotted line 126) of the parallel optical interface, namely the length direction of the optical module as the Y-axis direction, setting the positive direction of the Y-axis as the direction that the PCBA102 points to the optical interface 106, setting the direction which is the width direction of the optical module, namely the direction vertical to the Y-axis and parallel to the bottom surface of the device as the X-axis direction, setting the positive direction of the X-axis as the direction that the optical interface 106 points to the optical interface 105, setting the direction which is the height direction of the optical module, namely the direction vertical to the X-axis and the Y-axis as the Z-axis direction (at the moment, the Z-axis is vertical to the bottom surface of the device), and setting the X-axis, the Y-axis and the Z-axis to meet the geometrical Cartesian coordinate system;

2. the power of the PCBA102 is supplied, at this time, the PCBA102, the PD119, and the TIA120 operate normally, the optical interface 106 is connected to the light source through the optical fiber jumper, the light source inputs optical signals of four wavelengths, and the optical power value of each optical signal is 1 mW. When an optical signal reaches the PD119, a photoproduction current is generated, and the numerical value of the photoproduction current is transmitted to a computer end through the PCBA to be displayed, so that the manual reading is facilitated;

2. moving the wavelength division demultiplexing component 123 along the X-axis direction, and observing the magnitude of the photo-generated current of the PD 119;

2.1 when the wavelength division demultiplexing component 123 is moved along the positive direction of the X axis, recording a value of a photo-generated current once when the wavelength division demultiplexing component 123 is moved, comparing the value of the photo-generated current with the value of the last photo-generated current, and if the photo-generated current becomes smaller, indicating that the moving direction is wrong, changing to moving along the negative direction of the X axis;

2.2 when the wavelength division demultiplexing component 123 is moved along the positive direction of the X axis, recording a value of a photo-generated current once each movement, comparing the value of the photo-generated current with the value of the last photo-generated current, if the photo-generated current is increased, the movement direction is correct, continuing to move along the correct direction, finding the maximum photo-generated current value and the corresponding X-axis coordinate by comparing the values of the photo-generated currents, and stopping at the X-axis coordinate;

3. moving the wavelength division demultiplexing component 123 along the Z-axis direction, and observing the magnitude of the photo-generated current of the PD 119;

3.1 when the wavelength division demultiplexing component 123 is moved along the positive direction of the Z axis, recording a value of a photo-generated current once the wavelength division demultiplexing component 123 is moved, comparing the value of the photo-generated current with the value of the last photo-generated current, and if the photo-generated current becomes smaller, indicating that the moving direction is wrong, moving along the negative direction of the Z axis instead;

3.2 when the wavelength division demultiplexing component 123 is moved along the positive direction of the Z axis, recording a value of the photo-generated current once when the wavelength division demultiplexing component 123 is moved, comparing the value of the photo-generated current with the value of the last photo-generated current, if the photo-generated current is increased, indicating that the moving direction is correct, continuing to move along the correct direction, finding the maximum photo-generated current value and the corresponding Z axis coordinate by comparing the values of the photo-generated current, and stopping at the Z axis coordinate;

4. moving the triangular reflecting prism 121 and the array lens 122 along the X-axis direction, and observing the magnitude of the photo-generated current of the PD119, that is, moving the triangular reflecting prism 121 and the array lens 122 together, so that the triangular reflecting prism 121 and the array lens 122 can be bonded to an auxiliary substrate for facilitating the movement of the two components together;

4.1 when moving the triangular reflecting prism 121 and the array lens 122 along the positive direction of the X axis, recording the numerical value of one photo-generated current every time of moving, comparing the numerical value of the photo-generated current with the numerical value of the last photo-generated current, if the photo-generated current becomes smaller, the moving direction is wrong, and moving along the negative direction of the X axis is changed;

4.2 when moving the triangular reflecting prism 121 and the array lens 122 along the positive direction of the X axis, recording the numerical value of one photo-generated current every time, comparing the numerical value of the photo-generated current with the numerical value of the previous photo-generated current, if the photo-generated current is increased, indicating that the moving direction is correct, continuing to move along the correct direction, and finding the maximum photo-generated current value and the corresponding X axis coordinate by comparing the numerical values of the photo-generated currents, and stopping at the X axis coordinate;

5. moving the triangular reflecting prism 121 and the array lens 122 along the Y-axis direction, and observing the magnitude of the photo-generated current of the PD119, which means that the triangular reflecting prism 121 and the array lens 122 move together, so as to facilitate the two elements to move together;

5.1 when moving the triangular reflecting prism 121 and the array lens 122 along the positive direction of the Y axis, recording the numerical value of one photo-generated current every time of moving, comparing the numerical value of the photo-generated current with the numerical value of the last photo-generated current, if the photo-generated current becomes smaller, the moving direction is wrong, and moving along the negative direction of the Y axis is changed;

5.2 when the triangular reflecting prism 121 and the array lens 122 are moved along the positive direction of the Y axis, the numerical value of one photo-generated current is recorded every time, the numerical value of the photo-generated current is compared with the numerical value of the previous photo-generated current, if the photo-generated current is increased, the moving direction is correct, the movement is continued along the correct direction, and the maximum photo-generated current value and the corresponding Y axis coordinate can be found by comparing the numerical values of the photo-generated currents, and the movement is stopped at the Y axis coordinate;

6. moving the triangular reflecting prism 121 and the array lens 122 along the Z-axis direction, and observing the magnitude of the photo-generated current of the PD119, which means that the triangular reflecting prism 121 and the array lens 122 move together, so as to facilitate the two elements to move together;

6.1 when moving the triangular reflecting prism 121 and the array lens 122 along the positive direction of the Z axis, recording the numerical value of one photo-generated current every time of moving, comparing the numerical value of the photo-generated current with the numerical value of the last photo-generated current, if the photo-generated current becomes smaller, the moving direction is wrong, and moving along the negative direction of the Z axis is changed;

6.2 when the triangular reflecting prism 121 and the array lens 122 are moved along the positive direction of the Z axis, the numerical value of one photo-generated current is recorded every time, the numerical value of the photo-generated current is compared with the numerical value of the previous photo-generated current, if the photo-generated current is increased, the moving direction is correct, the movement is continued along the correct direction, and the maximum photo-generated current value and the corresponding coordinate of the Z axis can be found by comparing the numerical values of the photo-generated currents, and the movement is stopped at the coordinate of the Z axis;

7. and repeating the steps 2, 3, 4, 5 and 6 repeatedly and sequentially, and observing the change of the magnitude of the photo-generated current of the PD119 until the magnitude of the photo-generated current of the PD119 meets the requirement of the product, for example, the photo-generated current value is greater than 0.8, and stopping coupling.

The dimension of the coupling of the present invention is not limited to XYZ direction, and angular adjustment in three dimensions, such as rotation along X plane, Y plane, and Z plane, may also be performed.

When the optical element to be coupled rotates along an X axis, a Y axis or a Z axis as required, the magnitude of the photo-generated current of the PD is observed, when the optical element rotates in the positive direction, the numerical value of the photo-generated current is recorded once every rotation, the numerical value of the photo-generated current is compared with the numerical value of the previous photo-generated current, if the photo-generated current becomes smaller, the rotation direction is wrong, the rotation direction is changed to be negative, if the photo-generated current becomes larger, the rotation direction is correct, the optical element continues to rotate along the correct direction, and the maximum photo-generated current value and the corresponding angle direction are found by comparing the numerical values of the photo-generated current.

Because the receiving light path adopts a parallel light path structure, the parallel light path can meet the requirement of long working distance and is insensitive to the diameter of light spots and the transverse dislocation of the light spots. For the angle direction, the method of using two 6-dimensional coupling tools to realize the coupling of the triangular reflecting prism 121, the array lens 122 and the wavelength division demultiplexing component 123 can effectively compensate the angle deviation.

And then carrying out high-temperature baking curing and temperature cycling.

The ninth step: and coupling, curing and temperature cycling the rest of the emitting end optical elements. The remaining emission end optical elements include a collimating lens group.

And taking out the semi-finished product obtained in the eighth step, and then sending the semi-finished product into a transmitting end coupling platform, wherein the coupling characteristic is that a plurality of channels are sequentially coupled in a single-channel mode, and 1 collimating lens is coupled at each time.

Because the emission light path adopts a parallel light path structure, the parallel light path can meet the requirement of long working distance and is insensitive to the diameter of light spots and the transverse dislocation of the light spots. For the angle direction, the displacement of the horizontal or vertical micron order can effectively compensate the deviation of the angle.

And then, carrying out high-temperature baking curing and temperature cycling to form a fifth component.

The tenth step: assembling the module: and (4) inspecting the fifth component before capping, and then bonding the protective covers. And then, installing the fifth component with the protective cover bonded inside a formal module tube shell, and simultaneously carrying out operations of mounting a radiating fin, reinforcing a cover plate and the like.

When the invention uses hard connection, on the basis of reasonable tolerance of the hard connection, the hard connection is firstly carried out, the PCBA and the light emitting device are integrally assembled, then the mounting of key elements in the PCBA and the light emitting device are carried out, then the key high-frequency interconnection is carried out, and then the light path interconnection is carried out by utilizing the characteristic that parallel light paths are insensitive to axial deviation and transverse deviation, thus forming a realization method of non-positive sequence.

The PCBA and the optical device of the optical module are connected in a hard connection mode, the international protocol requirements of an electrical interface and an optical interface of the optical module are met, and the optical module has the advantages of being good in performance, simple in structure, high in reliability and the like, and belongs to the technical field of optical devices and optical modules in the field of optical communication. The optical fiber composite material can be applied to CWDM and LWDM wavelengths and can be packaged in SFP DD, QSFP28, QSFP DD, OSFP and other modules.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. A method for realizing hard connection of an optical module is characterized by comprising the following steps:

fixing part of the transmitting end optical element and part of the receiving end optical element at corresponding positions in the device tube shell to form a first assembly; the part of the transmitting end optical element which is initially fixed in the first assembly comprises a wavelength division multiplexing assembly;

adjusting the position of an optical interface etalon chuck to perform light spot coupling, stopping adjusting the position of the optical interface etalon chuck when the light spot of a transmitting end and the light spot of a receiving end meet set requirements, fixedly connecting a transmitting light interface with one end of an adjustable sliding ring of the transmitting end, fixedly connecting a receiving light interface with one end of the adjustable sliding ring of the receiving end, and fixedly connecting the other end of the adjustable sliding ring of the transmitting end and the other end of the adjustable sliding ring of the receiving end with a device tube shell of a first assembly respectively to form a second assembly;

2. A method for implementing a hard-wired connection of a light module according to claim 1, characterized in that: the method also comprises the following steps after the fifth component is formed:

3. A method for implementing a hard-wired connection of a light module according to claim 1, characterized in that: when the optical axis direction of the optical interface is vertically arranged, the optical interface etalon chuck is horizontally adjusted, when the light spot of the transmitting end meets the set requirement, the two-dimensional movement of the optical interface etalon chuck in the horizontal plane direction is stopped to be adjusted, the light spot of the transmitting end meets the set requirement, the angle of the light spot of the transmitting end meets the set range, and the distance between the light spots of the transmitting end meets the set condition;

4. A method for implementing a hard-wired connection of a light module according to claim 1, characterized in that: fixedly connecting the PCBA with the device tube shell of the second component after assembling to form a third component, and specifically comprising: embedding the right end part of the PCBA into an open slot of a device tube shell of the second component, installing the right end part of the PCBA into a tool together, making a vacuum suction hole in an area where the bottom surface of the device tube shell is contacted with the tool so as to adsorb the device tube shell, opening vacuum adsorption, fixing the device tube shell at the moment, pressing down a PCBA pressing plate of the tool in place, fixing the PCBA, and closing the vacuum adsorption; at the moment, a curing adhesive is applied to the surface of the device tube shell in contact with the PCBA in an auxiliary mode for pre-curing, and then the device tube shell and the PCBA are fixed through thermosetting to form a third assembly;

5. A method for implementing a hard-wired connection of a light module according to claim 1, characterized in that: the part of the transmitting end optical element initially fixed in the first assembly comprises a transmitting end optical port lens, a transmitting end prism and a wavelength division multiplexing assembly, and the part of the receiving end optical element initially fixed in the first assembly comprises a receiving end optical port lens and a receiving end prism;

the remaining emission end optical element comprises a collimating lens group;

6. The method for implementing hard-wiring of a light module according to claim 5, wherein: the step of coupling the remaining receiving-end optical elements specifically includes:

7. The method for implementing hard-wired connection of optical modules according to claim 6, characterized in that: the wavelength division demultiplexing component, the triangular reflecting prism and the array lens are respectively used as optical elements to be coupled to be respectively coupled in X-axis, Y-axis and Z-axis directions in XYZ three-dimensional coordinates according to needs, and the method specifically comprises the following steps:

8. An optical module, includes module tube, device tube, sends optical component, receives optical component, PCBA, its characterized in that: the method as claimed in any one of claims 1 to 7 is adopted to realize the assembly of the optical module, the end part of one end of the device tube shell is provided with an emitting optical window and a receiving optical window, the end part of the other end of the device tube shell is provided with an open slot, the end part of the PCBA is inserted into the device tube shell from the open slot and is fixedly connected with the device tube shell, the emitting optical interface of the emitting optical component and the receiving optical interface of the receiving optical component are respectively and fixedly connected with the end parts of the device tube shell, which are provided with the emitting optical window and the receiving optical window, and respectively correspond to the emitting optical window and the receiving optical window, other components of the emitting optical component and the receiving optical component are fixed in the inner cavity of the device tube shell, the device tube shell and the PCBA are fixed in the module tube shell, and the module tube shell is provided with optical interface clamping grooves for respectively clamping the emitting optical interface and the receiving optical interface.

9. The optical module of claim 8, wherein: the emission light assembly comprises an emission light interface, an emission end light port lens, a laser chip set, a collimating lens set and a wavelength division multiplexing assembly, wherein the emission end light port lens is arranged in an emission light window of the device tube shell, the optical fiber end surface of the emission light interface is positioned at the back focal plane of the emission light port lens, the emission light port lens is used for converting parallel light into convergent light, the wavelength division multiplexing assembly is positioned on a light path between the emission light port lens and the laser chip set, the wavelength division multiplexing assembly is used for combining a plurality of laser optical signals into one optical signal in space, the collimating lens set is positioned on the light path between the wavelength division multiplexing assembly and the laser chip set and is used for converting the optical signal of the laser chip into quasi-parallel light to be output, and the laser chip set is close to the collimating lens set and is arranged at the back focal plane of the collimating lens set; the laser chip group is attached to the upper surface of the ceramic carrier group, and a metal wiring layer, a gold wire bonding pad and a laser chip eutectic solder area which are used for electrical interconnection are arranged on the upper surface of the ceramic carrier group; the ceramic carrier group and the collimating lens group are attached to the upper surface of the cold surface of the TEC, and the thermistor is attached to the upper surface of the cold surface of the TEC; an emitting end prism is arranged on a light path between the emitting end light port lens and the wavelength division multiplexing component; an isolator is arranged on a light path between the transmitting end light port lens and the wavelength division multiplexing component; the isolator is positioned on a light path between the wavelength division multiplexing component and the transmitting end prism; an adjustable emitting end sliding ring is arranged between the emitting light interface and the device tube shell; the optical axes of the emission light interface, the emission end adjustable sliding ring, the emission end optical port lens, the laser chip set, the collimating lens set, the wavelength division multiplexing component, the isolator and the prism are positioned in the same plane, the plane is parallel to the bottom surface of the device tube shell and the bottom surface of the module tube shell, and the TEC, the wavelength division multiplexing component, the isolator and the prism are all fixed with the device tube shell;

the detector chip set is connected with the TIA chip through gold wire bonding, and the TIA chip is connected with the PCBA through gold wire bonding; the ceramic carrier group, the thermistor, the TEC and the PCBA are connected through gold wire bonding; the PCBA is provided with a high-frequency pin bonding pad corresponding to the ceramic carrier group;

the height of the opening groove of the device tube shell is higher than the thickness of the PCBA, and the upper end face of the opening groove is higher than all optical elements in the device;