CN113583588A - Photovoltaic module packaging adhesive film and photovoltaic module - Google Patents
Photovoltaic module packaging adhesive film and photovoltaic module Download PDFInfo
- Publication number
- CN113583588A CN113583588A CN202110994796.7A CN202110994796A CN113583588A CN 113583588 A CN113583588 A CN 113583588A CN 202110994796 A CN202110994796 A CN 202110994796A CN 113583588 A CN113583588 A CN 113583588A
- Authority
- CN
- China
- Prior art keywords
- interlayer
- layer
- photovoltaic module
- adhesive film
- packaging adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 85
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 66
- 239000010410 layer Substances 0.000 claims abstract description 130
- 239000011229 interlayer Substances 0.000 claims abstract description 112
- 238000000576 coating method Methods 0.000 claims abstract description 43
- 239000011248 coating agent Substances 0.000 claims abstract description 37
- 239000011247 coating layer Substances 0.000 claims description 80
- -1 polyethylene terephthalate Polymers 0.000 claims description 50
- 229920005989 resin Polymers 0.000 claims description 46
- 239000011347 resin Substances 0.000 claims description 46
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 43
- 239000004814 polyurethane Substances 0.000 claims description 21
- 229920002635 polyurethane Polymers 0.000 claims description 21
- 239000004408 titanium dioxide Substances 0.000 claims description 21
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- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 13
- 239000005022 packaging material Substances 0.000 claims description 12
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- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 10
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- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 6
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- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 claims description 3
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 claims description 3
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- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 9
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 9
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- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 7
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- LSNUCIIBOVXXCW-UHFFFAOYSA-N methyl 2-methylprop-2-enoate 1-phenylpyrrole-2,5-dione styrene Chemical compound COC(=O)C(C)=C.C=Cc1ccccc1.O=C1C=CC(=O)N1c1ccccc1 LSNUCIIBOVXXCW-UHFFFAOYSA-N 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
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- XYXJKPCGSGVSBO-UHFFFAOYSA-N 1,3,5-tris[(4-tert-butyl-3-hydroxy-2,6-dimethylphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C)=C1CN1C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C1=O XYXJKPCGSGVSBO-UHFFFAOYSA-N 0.000 description 4
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 4
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- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 4
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- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 3
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
- H01L31/0547—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
- C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention belongs to the technical field of photovoltaics. The invention discloses a photovoltaic module packaging adhesive film which comprises an interlayer, a transparent layer, a bonding layer and at least one coating. Wherein the thickness of the interlayer is 50-300 μm, the thickness of the transparent layer is 200-350 μm, and the thickness of the bonding layer is 10-100 μm. The photovoltaic module packaging adhesive film has higher light reflection performance, particularly has higher reflectivity in a visible light-infrared light area, and has good power gain effect; the photovoltaic module packaging adhesive film is not easy to have appearance defects such as wrinkles, white overflow, flanging and the like in the module laminating process, and has higher yield; the photovoltaic module packaging adhesive film is simple and convenient to prepare, does not need pre-crosslinking treatment, is obviously thinned compared with a conventional adhesive film, and is beneficial to reducing the production cost.
Description
Technical Field
The invention relates to the technical field of photovoltaics, in particular to a photovoltaic module packaging adhesive film and a photovoltaic module.
Background
In recent years, energy and environmental problems have become severe, and clean energy has been attracting attention. The development and innovation of the photovoltaic industrial chain technology is accelerated continuously, the application of high-efficiency battery pieces such as PERC, Topcon, HJT, double-sided power generation batteries and multi-main grid is wider and wider, and in addition, the cost of the flat-price internet surfing is considered, and the reliability of the photovoltaic module adopting the laminated high-efficiency battery piece superposition power gain packaging scheme is concerned more and more in the laminating manufacturing and service processes.
At present, in the aspect of power gain, the use of a white adhesive film is a solution with high reliability and wide application range. The scheme is that the packaging adhesive film on the back surface of the battery piece is replaced from a transparent type to a white type, the white adhesive film has high reflectivity, the sunlight utilization efficiency of the photovoltaic module can be improved, and the power gain of the photovoltaic module can reach more than 2%. In the white adhesive film used in the prior art, the white adhesive film with higher reflectivity is prepared by adding titanium dioxide into an EVA or POE resin system, and pre-crosslinking is generally needed to reduce the problem of appearance defects after lamination. However, the adhesive film still has the problems of low yield, wrinkle, white overflow, flanging and the like in a photovoltaic module, particularly a high-efficiency thin-film module, the defects of cracking, breaking and the like which are easily caused in the service operation process due to the increased hardness after pre-crosslinking, and the problems of white adhesive film wrinkle, white overflow, flanging and the like caused in the lamination process of a battery sheet.
Disclosure of Invention
In view of the above, the invention provides a photovoltaic module packaging adhesive film, which can improve the defects that the conventional efficient thinned module is low in yield and is easy to crack and break, and the problems of white adhesive film wrinkles, white overflow and edge turning in the laminating process of a battery sheet.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
according to one aspect of the present invention, the present applicant provides a photovoltaic module encapsulant film comprising:
the interlayer is used for providing support for the photovoltaic module packaging adhesive film and improving the light reflectivity of the photovoltaic packaging adhesive film; the transparent layer is arranged on one side of the interlayer, is a transparent film layer and is used for bonding the photovoltaic cell and isolating the interlayer and the photovoltaic cell; the bonding layer is arranged on the other side of the interlayer, is a white, transparent or colored film layer and is used for bonding the backlight surface packaging material; and at least one coating layer disposed between the interlayer and the transparent layer and/or between the interlayer and the bonding layer.
Furthermore, the thickness of the interlayer is 50-300 mu m, and the Shore hardness HA of the interlayer is not more than 90.
Further, the raw materials of the interlayer comprise the following components:
65-99 wt% of first resin, 0.9-30 wt% of filler and 0.1-5 wt% of auxiliary agent.
Further, the first resin includes at least one of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethylene-acrylate, polyethylene-methacrylate, polyester, polyurethane, styrene-methyl methacrylate copolymer, methyl methacrylate-butadiene-styrene copolymer.
Further, the thickness of the transparent layer is 200 to 350 μm.
Further, the raw materials of the transparent layer comprise the following components:
85-95 wt% of second resin, 0-10 wt% of anti-ultraviolet auxiliary agent, 0.1-3 wt% of anti-thermal-oxidation aging agent and 0.1-3 wt% of initiator.
Furthermore, the thickness of the bonding layer is 10-100 mu m.
Further, the raw materials of the bonding layer comprise the following components:
75-90 wt% of a second resin, 0-20 wt% of a filler, 0-5 wt% of an anti-ultraviolet auxiliary agent, 0.1-3 wt% of an anti-thermal-oxidative aging agent and 0.1-3 wt% of an initiator.
Further, the second resin comprises at least one of resins obtained by copolymerizing ethylene and one or more of propylene, butylene, heptene, octene, norbornene, vinyl acetate, methyl acrylate and methyl methacrylate.
Further, the coating layer arranged between the interlayer and the transparent layer is an upper coating layer, and the upper coating layer is a fluorine-containing coating layer.
Further, the raw materials of the upper coating comprise the following components:
40-95 wt% of fluorocarbon resin, 0-50 wt% of filler, 0.5-20 wt% of curing agent and 0.001-1 wt% of auxiliary agent.
Further, the thickness of the coating layer is 1 to 20 μm.
Further, the fluorocarbon resin comprises at least one of polyvinyl monofluoride, polyvinylidene fluoride, polychlorotrifluoroethylene, polytetrafluoroethylene, a monovinyl fluoride-vinyl ether copolymer, a monovinyl fluoride-vinyl ester copolymer, vinylidene fluoride-vinyl ether, vinylidene fluoride-vinyl ester, chlorotrifluoroethylene-vinyl ether, chlorotrifluoroethylene-vinyl ester, tetrafluoroethylene-vinyl ether or tetrafluoroethylene-vinyl ester.
Further, the coating layer disposed between the interlayer and the bonding layer is a lower coating layer.
Further, the raw materials of the lower coating comprise the following components:
60-90 wt% of third resin, 0-30 wt% of filler, 0.001-20 wt% of curing agent and 0.001-1 wt% of auxiliary agent.
Further, the thickness of the lower coating is 1 to 10 μm.
Further, the third resin includes at least one of acrylic resin, alkyd resin, polyester resin, epoxy resin, phenolic resin, and terpene resin.
Further, the filler comprises at least one of titanium dioxide, calcium carbonate and silicon dioxide.
Further, the curing agent includes at least one of hexamethylene diisocyanate trimer, hexamethylene diisocyanate prepolymer, isophorone diisocyanate trimer, isophorone diisocyanate prepolymer, hydrogenated xylylene isocyanate trimer, hydrogenated xylylene diisocyanate prepolymer, methylated polymethylol melamine resin, butylated polymethylol melamine resin, mixed etherified polymethylol melamine resin, polyamide, polymethylene diamine, diethylenetriamine, pentamethyldiethylenetriamine, triethylenetetramine, diethylenetriamine, triethylenetetramine, (2, 3-dimethyl) dibutylenetriamine.
Further, the auxiliary agent comprises at least one of an ultraviolet absorber, a hindered amine light stabilizer, an antioxidant, a heat stabilizer, a catalyst and a hydrolysis stabilizer.
The invention provides a preparation method of a photovoltaic module packaging adhesive film, which comprises the following steps:
preparing an interlayer by a melt extrusion process;
preparing an upper coating on one side of the interlayer by one of the processes of reticulate pattern coating, mask coating, spraying, ink-jet printing, silk-screen printing and transfer printing at the temperature of 60-200 ℃;
preparing a lower coating on the other side of the interlayer through one of reticulate pattern coating, mask coating, spraying, ink-jet printing, silk-screen printing and transfer printing processes at the temperature of 60-200 ℃;
preparing a transparent layer by a film coating or coating process;
the adhesive layer is prepared by a laminating or coating process.
In yet another aspect, the present invention provides a photovoltaic module, comprising,
the photovoltaic cell piece is used for realizing photoelectric conversion for the photovoltaic module;
the backlight surface packaging material is arranged on the backlight side of the photovoltaic cell and used for providing support for the photovoltaic cell;
the photovoltaic module packaging adhesive film is used for bonding the backlight surface packaging material and the photovoltaic cell piece together;
photovoltaic module encapsulation glued membrane includes: the interlayer is used for providing support for the photovoltaic module packaging adhesive film and improving the light reflectivity of the photovoltaic packaging adhesive film; the transparent layer is arranged on one side of the interlayer, is a transparent film layer and is used for bonding the photovoltaic cell and isolating the interlayer and the photovoltaic cell; the bonding layer is arranged on the other side of the interlayer, is a white, transparent or colored film layer and is used for bonding the backlight surface packaging material; and at least one coating layer disposed between the interlayer and the transparent layer and/or between the interlayer and the bonding layer.
Therefore, the invention has the following beneficial effects:
(1) the photovoltaic module packaging adhesive film has higher light reflection performance, particularly has higher reflectivity in a visible light-infrared light area, and has good power gain effect;
(2) the photovoltaic module packaging adhesive film is not easy to have appearance defects such as wrinkles, white overflow, flanging and the like in the module laminating process, and has higher yield;
(3) the photovoltaic module packaging adhesive film is simple and convenient to prepare, pre-crosslinking treatment is not needed, meanwhile, the hardness of the interlayer is limited within a certain range, the risk of fragments is reduced, and compared with the conventional adhesive film, the photovoltaic module packaging adhesive film is obviously thinned, and the production cost is favorably reduced.
Drawings
FIG. 1 is a schematic cross-sectional view of a photovoltaic packaging film in one embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a photovoltaic packaging film according to another embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a photovoltaic packaging film according to another embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a photovoltaic packaging film in comparative example 1;
FIG. 5 is a schematic cross-sectional view of a photovoltaic packaging film of comparative example 2;
in the figure: the packaging adhesive film 100, the transparent layer 11, the upper coating 12, the interlayer 13, the lower coating 14 and the bonding layer 15.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail with reference to examples.
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present invention, all the equipments and materials are commercially available or commonly used in the industry, and the methods in the following examples are conventional in the art unless otherwise specified.
As introduced in the background art, the white adhesive film used in the prior art is made into a white adhesive film with higher reflectivity by adding titanium dioxide into an EVA or POE resin system. Pre-crosslinking is generally required to reduce the problem of appearance defects after lamination. However, the adhesive film still has the defects of low yield, splintering, breakage and the like in the service operation process of a photovoltaic module, particularly a high-efficiency thin-section battery piece module, and the problems of white adhesive film folding, white overflow, flanging and the like in the lamination process of the battery piece.
In order to solve the above problems, the present applicant provides a photovoltaic module encapsulant film 100 for bonding a backlight surface encapsulant material and a photovoltaic cell sheet together, as shown in fig. 1 to 3, including: the interlayer 13 is used for improving the light reflectivity of the photovoltaic packaging adhesive film 100, and the thickness of the interlayer 13 is 50-300 microns; the transparent layer 11 is arranged on one side of the interlayer 13, is a transparent film layer and is used for bonding the photovoltaic cell and isolating the interlayer 13 and the photovoltaic cell, and the thickness of the transparent layer 11 is 200-350 microns; the bonding layer 15 is arranged on the other side of the interlayer 13, is a white, transparent or colored film layer and is used for bonding the backlight surface packaging material, and the thickness of the bonding layer 15 is 10-100 micrometers; and at least one coating layer provided between the interlayer 13 and the transparent layer 11 and/or between the interlayer 13 and the adhesive layer 15. The photovoltaic packaging adhesive film comprises at least one coating layer, wherein the coating layer is arranged between an interlayer 13 and a transparent layer 11 or between the interlayer 13 and an adhesive layer 15, the coating layer is an upper coating layer 12 when the coating layer is arranged between the interlayer 13 and the transparent layer 11, and the coating layer is a lower coating layer 14 when the coating layer is arranged between the interlayer 13 and the adhesive layer 15. There are three cases in the present invention for the provision of the coating, one implementation of which is shown in fig. 1, both providing two layers of coating, namely an upper coating layer 12 between the interlayer 13 and the transparent layer 11 and a lower coating layer 14 between the interlayer 13 and the adhesive layer 15; in another implementation, as shown in fig. 2, only one coating layer is provided, i.e. the top coating layer 12 is provided between the interlayer 13 and the transparent layer 11; in another implementation, as shown in fig. 3, only one coating layer is provided, i.e. the under-coating layer 14 is provided between the interlayer 13 and the adhesive layer 15. The upper coating 12 is a white or transparent fluorine-containing film layer and is arranged between the interlayer 13 and the transparent layer 11 and used for improving the weather resistance of the photovoltaic module packaging adhesive film 100 and bonding the interlayer 13 and the transparent layer 11 together; and a lower coating layer 14, which is a white or transparent film layer provided between the interlayer 13 and the adhesive layer 15, for bonding the interlayer 13 and the adhesive layer 15 together.
Different from the existing white film scheme, the invention adopts an interlayer design, namely a structure of a transparent layer 11 with a thinner front surface, an interlayer 13 with a softer middle surface and higher reflection performance and a bonding layer 15 with a thinner back surface and capable of enhancing bonding performance is adopted, and the Shore hardness HA of the interlayer 13 is lower than 90, so that the problem of appearance defects of the laminated assembly can be solved; meanwhile, two sides of the middle interlayer 13 are respectively provided with a coating to enhance the weather resistance and the bonding performance with the adjacent layers, so that the problems of falling and peeling between the interlayer 13 and the transparent layer 11 or between the interlayer 13 and the bonding layer 15 and the like can be avoided after long-time use, and the durability of the adhesive film can be ensured. The preparation process of the transparent layer 11 and the bonding layer 15 is simple and convenient, a pre-crosslinking treatment process is not needed, and the thicknesses of the transparent layer 11 and the bonding layer 15 are obviously reduced compared with the thickness of the conventional adhesive film. In the preparation process of the packaging adhesive film 100, the interlayer 13 in the middle is subjected to melt extrusion and then is formed into a film, the upper coating 12 and/or the lower coating 14 on the two sides are prepared at the temperature of 60-200 ℃ by adopting a coating process, and then the transparent layer 11 and the bonding layer 15 are sequentially coated on the other surface of the upper coating and/or the lower coating 14, so that the packaging adhesive film 100 is finally prepared.
As an implementation, the interlayer 13 is made from raw materials comprising: 65-99 wt% of first resin, 0.9-30 wt% of filler and 0.1-5 wt% of auxiliary agent.
As one implementation, the first resin includes at least one of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethylene acrylate, polyethylene methacrylate, polyester, polyurethane, styrene-methyl methacrylate copolymer, methyl methacrylate-butadiene-styrene copolymer.
The interlayer 13 in the invention adopts a relatively soft resin material as the matrix resin, and the first resin has the characteristics of relatively soft after molding and the like, and can solve the problems that the material of the adhesive film prepared by crosslinking the existing adhesive film raw material is hard, the flowability at high temperature is poor and the like. While corresponding fillers are added to the interlayer 13 to enhance the light emission properties.
As an implementation, the transparent layer 11 is made of raw materials comprising the following components: 85-95 wt% of second resin, 0-10 wt% of anti-ultraviolet auxiliary agent, 0.1-3 wt% of anti-thermal-oxidation aging agent and 0.1-3 wt% of initiator.
The thickness of the transparent layer 11 is 200-350 μm, and the thickness of the solder strip is covered to prevent the solder strip from contacting the interlayer 13 during lamination. The transparent layer 11 is not pre-crosslinked, so that the phenomena of cracking, breaking and the like of the battery piece assembly caused by the increased hardness of the adhesive film after pre-crosslinking are avoided; in addition, the transparent layer 11 may be made of a conventional transparent EVA or POE material.
As one implementation, the bonding layer 15 is made from raw materials comprising: 75-90 wt% of a second resin, 0-20 wt% of a filler, 0-5 wt% of an anti-ultraviolet auxiliary agent, 0.1-3 wt% of an anti-thermal-oxidative aging agent and 0.1-3 wt% of an initiator.
In one embodiment, the second resin comprises at least one resin obtained by copolymerizing ethylene with one or more monomers selected from the group consisting of propylene, butene, heptene, octene, norbornene, vinyl acetate, methyl acrylate, and methyl methacrylate.
The bonding layer 15 does not need pre-crosslinking, has a thickness of 10-100 mu m, provides bonding property, and is used for bonding a rear plate (a back plate or glass) and a glue film; in addition, the adhesive layer 15 may be a conventional transparent or white EVA or POE material, or may be a color EVA or POE film layer with corresponding color substances added.
As an implementation, the coating layer provided between the interlayer 13 and the transparent layer 11 is an upper coating layer 12, the upper coating layer 12 being made of raw materials comprising: 40-95 wt% of fluorocarbon resin, 0-50 wt% of filler, 0.5-20 wt% of curing agent and 0.001-1 wt% of auxiliary agent; the thickness of the upper coating 12 is 1 to 20 μm.
The topcoat 12 is a white or clear fluorine coating that provides primarily weatherability and adhesion, especially uv resistance.
As one implementation, the fluorocarbon resin includes at least one of polyvinylmonofluoride, polyvinylidene fluoride, polychlorotrifluoroethylene, polytetrafluoroethylene, a monovinyl fluoride-vinyl ether copolymer, a monovinyl fluoride-vinyl ester copolymer, a vinylidene fluoride-vinyl ether, a vinylidene fluoride-vinyl ester, a chlorotrifluoroethylene-vinyl ether, a chlorotrifluoroethylene-vinyl ester, a tetrafluoroethylene-vinyl ether, or a tetrafluoroethylene-vinyl ester.
As an implementation, the coating layer disposed between the interlayer 13 and the bonding layer 15 is an upper coating layer 14, and the lower coating layer 14 is made of raw materials including the following components: 60-90 wt% of third resin, 0-30 wt% of filler, 0.001-20 wt% of curing agent and 0.001-1 wt% of auxiliary agent; the thickness of the lower coating 14 is 1 to 10 μm.
The lower coating layer 14 mainly provides adhesion, and is a transparent or white coating layer.
In one implementation, the third resin includes at least one of a poly-p-acrylic resin, an alkyd resin, a polyester resin, an epoxy resin, a phenolic resin, and a terpene resin.
As one implementation mode, the filler comprises at least one of titanium dioxide, calcium carbonate and silicon dioxide.
As one implementation, the curing agent includes at least one of hexamethylene diisocyanate trimer, hexamethylene diisocyanate prepolymer, isophorone diisocyanate trimer, isophorone diisocyanate prepolymer, hydrogenated xylylene isocyanate trimer, hydrogenated xylylene diisocyanate prepolymer, methylated polymethylol melamine resin, butylated polymethylol melamine resin, mixed etherified polymethylol melamine resin, polyamide, polymethylene diamine, diethylenetriamine, pentamethyl diethylenetriamine, triethylenetetramine, (2, 3-dimethyl) dibutylenetriamine.
As one implementation mode, the auxiliary agent comprises at least one of an ultraviolet absorber, a hindered amine light stabilizer, an antioxidant, a heat stabilizer, a catalyst and a hydrolysis stabilizer.
The invention provides a preparation method of a photovoltaic module packaging adhesive film, which comprises the following steps:
preparing an interlayer by a melt extrusion process;
preparing an upper coating on one side of the interlayer by one of the processes of reticulate pattern coating, mask coating, spraying, ink-jet printing, silk-screen printing or transfer printing at 60-200 ℃, and/or preparing a lower coating on the other side of the interlayer by one of the processes of reticulate pattern coating, mask coating, spraying, ink-jet printing, silk-screen printing or transfer printing at 60-200 ℃;
preparing a transparent layer by a film coating or coating process;
the adhesive layer is prepared by a laminating or coating process.
The preparation method of the photovoltaic module packaging adhesive film only needs to be satisfied when the packaging adhesive film with the five-layer structure can be prepared. But since the interlayer needs to provide support for the whole packaging adhesive film, the preparation by means of melt extrusion is the optimal choice. The upper and lower coating layers are thin and thus may be preferably prepared by one of the processes of screen coating, mask coating, spray coating, inkjet printing, screen printing, and transfer printing. The transparent layer and the adhesive layer are relatively thick and can be prepared by a laminating and coating process. Of course, the packaging adhesive film can also be prepared in a four-layer or five-layer co-extrusion mode; the packaging adhesive film can also be prepared by respectively preparing four or five corresponding film layers through a melt extrusion process and then carrying out hot-pressing treatment; or preparing an interlayer, a transparent layer and a bonding layer by melt extrusion, then preparing an upper coating layer between the interlayer and the transparent layer and/or a lower coating layer between the interlayer and the bonding layer by processes such as pattern coating, mask coating, spraying, ink-jet printing, screen printing or transfer printing, and finally preparing the packaging adhesive film with a four-layer or five-layer structure.
The invention also provides a photovoltaic module, which comprises a photovoltaic cell piece, a photovoltaic module and a photovoltaic module, wherein the photovoltaic cell piece is used for realizing photoelectric conversion for the photovoltaic module; the backlight surface packaging material is arranged on the backlight side of the photovoltaic cell and used for providing support for the photovoltaic cell; the photovoltaic module packaging adhesive film 100 is used for bonding the backlight surface packaging material and the photovoltaic cell piece together. The photovoltaic module package adhesive film 100 includes: the interlayer 13 is used for improving the light reflectivity of the photovoltaic packaging adhesive film 100, and the thickness of the interlayer 13 is 50-300 microns; the transparent layer 11 is arranged on one side of the interlayer 13, is a transparent film layer and is used for bonding the photovoltaic cell and isolating the interlayer 13 and the photovoltaic cell, and the thickness of the transparent layer 11 is 10-100 micrometers; the bonding layer 15 is arranged on the other side of the interlayer 13, is a white, transparent or colored film layer and is used for bonding the backlight surface packaging material, and the thickness of the bonding layer 15 is 10-100 micrometers; and at least one coating layer disposed between the interlayer and the transparent layer and/or between the interlayer and the bonding layer.
The technical solution of the present invention will be further described with reference to the following examples.
Example 1
As shown in fig. 1, a photovoltaic module packaging adhesive film 100 is composed of a transparent layer 11, an upper coating layer 12, an interlayer 13, a lower coating layer 14 and an adhesive layer 15 in sequence, wherein the thickness of the transparent layer 11 is 200 μm, the thickness of the upper coating layer 12 is 10 μm, the thickness of the interlayer 13 is 300 μm, the thickness of the lower coating layer 14 is 1 μm, and the thickness of the adhesive layer 15 is 100 μm.
Wherein the transparent layer 11 is made of the following components: ethylene-vinyl acetate copolymer (DuPont) 85 wt%, 2- [4- [ 2-hydroxy-3-tridecyloxypropyl ] oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine (basf) 5 wt%, polysuccinic acid (4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidineethanol) 5 wt%, 2, 6-di-tert-butyl-4-methylphenol (Santa and Chemicals) 2 wt%, benzoyl peroxide (Gracilaria chemistry) 3 wt%;
the topcoat layer 12 is made from the following components: 40 wt% of hydroxyl polytetrafluoroethylene ether type fluorocarbon resin (Japan gold), 50 wt% of titanium dioxide R706 (DuPont), 9 wt% of isophorone diisocyanate prepolymer (Japan polyurethane) and 1 wt% of stannous octoate (Zhengheng technology);
the interlayer 13 is made of the following components: 99 wt% of polyethylene terephthalate (DuPont), 0.9 wt% of titanium dioxide R960 (DuPont), 0.05 wt% of hydrolysis stabilizer I powder (Rhine chemical), 0.04 wt% of triethylene glycol ether-bis (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate (permanent chemical), and 0.01 wt% of N-phenylmaleimide-styrene-methyl methacrylate (chemical industry of Huawen and Wen);
the lower coating layer 14 is made of the following components: acrylic resin AC-1 (Changxing chemical) 90 wt%, isophorone diisocyanate prepolymer (Japanese polyurethane) 4 wt%, triethylene tetramine (Shanghai chemical) 5 wt%, stannous octoate (Zhengheng technology) 1 wt%;
the adhesive layer 15 is made of the following components: 75% by weight of ethylene-vinyl acetate copolymer (DuPont), 20% by weight of titanium dioxide CR-60-2 (Stachydon japonicus Co.) 2- [4- [ 2-hydroxy-3-tridecyloxypropyl ] oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine (basf) 2.8% by weight, 2% by weight of poly { [6- [ (1,1,3, 3-tetramethylbutyl) amino ] ] -1,3, 5-triazine-2, 4- [ (2,2,6,6, -tetramethyl-piperidinyl) imino ] -1, 6-hexadiene [ (2,2,6, 6-tetramethyl-4-piperidinyl) imino ] } (basf) 2% by weight, 0.1 wt% of 2, 6-di-tert-butyl-4-methylphenol (Santa chemical industry) and 0.1 wt% of benzoyl peroxide (Gray Siya chemical industry).
Example 2
As shown in fig. 1, a photovoltaic module packaging adhesive film 100 is composed of a transparent layer 11, an upper coating layer 12, an interlayer 13, a lower coating layer 14 and an adhesive layer 15 in sequence, wherein the thickness of the transparent layer 11 is 350 μm, the thickness of the upper coating layer 12 is 50 μm, the thickness of the interlayer 13 is 200 μm, the thickness of the lower coating layer 14 is 5 μm, and the thickness of the adhesive layer 15 is 10 μm.
Wherein the transparent layer 11 is made of the following components: ethylene-vinyl acetate copolymer (DuPont) 95 wt%, 2- [4- [ 2-hydroxy-3-tridecyloxypropyl ] oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine (basf) 3 wt%, tris (2, 4-di-tert-butylphenyl) phosphite (permanent photochemical) 1.8 wt%, 2-ethylhexyl tert-butylperoxycarbonate (Santa and Chemicals) 0.1 wt%, 2-ethylhexyl tert-butylperoxycarbonate (Gray Seiki Chemicals) 0.1 wt%;
the topcoat layer 12 is made from the following components: 75 wt% of hydroxyl polytrifluoroethylene ether type fluorocarbon resin (Japan gold), 5 wt% of titanium dioxide R706 (DuPont), 19.999 wt% of hexamethylene diisocyanate prepolymer (Japan polyurethane), and 0.001 wt% of monobutyl triisooctanoic acid tin (orthostatic technology);
the interlayer 13 is made of the following components: 75 wt% of polyurethane (DuPont), 20 wt% of titanium dioxide R960 (DuPont), 2 wt% of hydrolysis stabilizer I powder (Rhine chemical), 2 wt% of 1,3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1,3, 5-triazine-2, 4,6- (1H,3H,5H) -trione (permanent chemical), 2 wt% of N-phenylmaleimide-styrene-methyl methacrylate (Huawen chemical industry), 1 wt%;
the lower coating layer 14 is made of the following components: 80 wt% of alkyd resin (Changxing chemical), 12 wt% of hexamethylene diisocyanate trimer (Japanese polyurethane), 7.5 wt% of polymethylene diamine (Shanghai chemical industry) and 0.5 wt% of dioctyltin dilaurate (Zhengheng technology);
the adhesive layer 15 is made of the following components: ethylene-octene copolymer (DuPont) 90 wt%, 2- [4- [ 2-hydroxy-3-tridecyloxypropyl ] oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine (basf) 1 wt%, poly { [6- [ (1,1,3, 3-tetramethylbutyl) amino ] ] -1,3, 5-triazine-2, 4- [ (2,2,6, 6-tetramethyl-piperidinyl) imino ] -1, 6-hexadiene [ (2,2,6, 6-tetramethyl-4-piperidinyl) imino ] } (basf) 3 wt%, 2, 6-di-tert-butyl-4-methylphenol (san Johnson & Chemicals) 3 wt%, benzoyl peroxide (Gray Siya chemical) 3 wt%.
Example 3
As shown in fig. 1, a photovoltaic module packaging adhesive film 100 is composed of a transparent layer 11, an upper coating layer 12, an interlayer 13, a lower coating layer 14 and an adhesive layer 15 in sequence, wherein the thickness of the transparent layer 11 is 300 μm, the thickness of the upper coating layer 12 is 1 μm, the thickness of the interlayer 13 is 50 μm, the thickness of the lower coating layer 14 is 10 μm, and the thickness of the adhesive layer 15 is 50 μm.
Wherein the transparent layer 11 is made of the following components: ethylene-octene copolymer (dupont) 88 wt%, bis (1,2,2,6, 6-pentamethyl-4-piperidinyl) -sebacate/mono (1,2,2,6, 6-pentamethyl-4-piperidinyl) sebacate complex (basf) 5 wt%, bis (2,2,6, 6-tetramethyl-4-piperidinyl) sebacate (photochemistry) 5 wt%, tris (2, 4-di-tert-butylphenyl) phosphite (santa und chemism) 1 wt%, tert-amyl 2-ethylhexyl carbonate peroxide (giysian chemism) 1 wt%;
the topcoat layer 12 is made from the following components: 95 wt% of fluoroethylene ester type fluorocarbon resin (Changxing chemical), 4.999 wt% of hexamethylene diisocyanate trimer (Japanese polyurethane), and 0.001 wt% of dibutyltin dilaurate (positive constant technology);
the interlayer 13 is made of the following components: 65 wt% of polyethylene terephthalate (DuPont), 30 wt% of titanium dioxide R960 (DuPont), 1 wt% of hydrolysis stabilizer UN-03 (Rhine chemical), 2 wt% of tris (2, 4-di-tert-butylphenyl) phosphite (photochemical), 2 wt% of 2- [4- [ 2-hydroxy-3-tridecyloxypropyl ] oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine (basf);
the lower coating layer 14 is made of the following components: 60 wt% of epoxy resin (Changxing chemical), 19.999 wt% of titanium dioxide R960 (DuPont), 20 wt% of mixed etherified poly (hydroxymethyl) melamine resin (Japanese polyurethane) and 0.001 wt% of p-toluenesulfonic acid (positive constant technology);
the adhesive layer 15 is made of the following components: ethylene-methyl methacrylate copolymer (DuPont) 75 wt%, titanium dioxide R960 (DuPont) 20 wt%, 2- [4- [ 2-hydroxy-3-tridecyloxypropyl ] oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine (basf) 3 wt%, poly { [6- [ (1,1,3, 3-tetramethylbutyl) amino ] ] -1,3, 5-triazine-2, 4- [ (2,2,6,6, -tetramethyl-piperidinyl) imino ] -1, 6-hexadiene [ (2,2,6, 6-tetramethyl-4-piperidinyl) imino ] } (basf) 1.8 wt%, 2, 0.1 wt% of 6-di-tert-butyl-4-methylphenol (Santa and Chemicals) and 0.1 wt% of benzoyl peroxide (Gray Siya. Chemicals).
Example 4
As shown in fig. 1, a photovoltaic module packaging adhesive film 100 is composed of a transparent layer 11, an upper coating layer 12, an interlayer 13, a lower coating layer 14 and an adhesive layer 15 in sequence, wherein the thickness of the transparent layer 11 is 250 μm, the thickness of the upper coating layer 12 is 15 μm, the thickness of the interlayer 13 is 150 μm, the thickness of the lower coating layer 14 is 8 μm, and the thickness of the adhesive layer 15 is 20 μm.
Wherein the transparent layer 11 is made of the following components: ethylene-octene-norbornene copolymer (dupont) 90%, 2- [4- [ 2-hydroxy-3-tridecyloxypropyl ] oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine (basf) 2.5 wt%, N- (4-ethyl benzoate) -N ', N' - (methyl, phenyl) formamidine (permanent photochemical) 4 wt%, 2, 6-di-tert-butyl-4-methylphenol (santa and chemical) 3 wt%, benzoyl peroxide (gressian chemical) 0.5 wt%;
the topcoat layer 12 is made from the following components: 50 wt% of hydroxyl polytetrafluoroethylene ester type fluorocarbon resin (Japan gold), 30 wt% of calcium carbonate (DuPont), 19 wt% of mixed etherified poly (hydroxymethyl) melamine resin (Japan polyurethane) and 1 wt% of stannous octoate (positive constant technology);
the interlayer 13 is made of the following components: 80 wt% of methyl methacrylate-butadiene-styrene copolymer (DuPont), 17 wt% of titanium dioxide R960 (DuPont), 1 wt% of hydrolysis stabilizer glycidyl neodecanoate (Rhine chemical), 1 wt% of 2- (2H-benzotriazole-2-yl) -6-dodecyl-4-methylphenol (permanent photochemical), 1 wt% of 1,3, 5-trimethyl-2, 4, 6-tris (3, 5-di-tert-butyl-4-hydroxybenzyl) benzene;
the lower coating layer 14 is made of the following components: 69 wt% of terpene resin (Changxing chemical), 30 wt% of titanium dioxide R960 (DuPont), 0.001 wt% of triethylene tetramine (Japanese polyurethane) and 0.999 wt% of dioctyltin dilaurate (Zhengheng technology);
the adhesive layer 15 is made of the following components: ethylene-butene copolymer (DuPont) 82 wt%, calcium carbonate R960 (DuPont) 10 wt%, 2- [4- [ 2-hydroxy-3-tridecyloxypropyl ] oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine (basf) 3 wt%, 2- (4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazin-2-yl) -5-octyloxyphenol (basf) 2 wt%, 1,3, 5-trimethyl-2, 4, 6-tris (3, 5-di-tert-butyl-4-hydroxybenzyl) benzene (san Johnson & Chemicals) 1 wt%, t-butyl peroxy 3,3, 5-trimethylhexanoate (Gracilasia Chemicals) 2 wt%.
Example 5
As shown in fig. 1, a photovoltaic module packaging adhesive film 100 is composed of a transparent layer 11, an upper coating layer 12, an interlayer 13, a lower coating layer 14 and an adhesive layer 15 in sequence, wherein the thickness of the transparent layer 11 is 220 μm, the thickness of the upper coating layer 12 is 50 μm, the thickness of the interlayer 13 is 300 μm, the thickness of the lower coating layer 14 is 3 μm, and the thickness of the adhesive layer 15 is 15 μm.
Wherein the transparent layer 11 is made of the following components: ethylene-vinyl acetate copolymer (dupont) 85 wt%, 2- (2 ' -hydroxy-3 ' -tert-butyl-5 ' -methylphenyl) -5-chlorobenzotriazole (basf) 3 wt%, bis (1-octyloxy-2, 2,6, 6-tetramethyl-4-piperidinyl) sebacate (basf) 6 wt%, 2, 6-di-tert-butyl-4-methylphenol (saint and chemical) 3 wt%, benzoyl peroxide (grecian chemical) 3 wt%;
the topcoat layer 12 is made from the following components: 60 wt% of hydroxypolytrifluoroethylene ester type fluorocarbon resin (Japan Dajin), 20 wt% of silicon dioxide (DuPont), 19.5 wt% of hexamethylene diisocyanate trimer (Japan polyurethane), and 0.5 wt% of p-toluenesulfonic acid (Zhengheng technology);
the interlayer 13 is made of the following components: 90 wt% of polycarbonate (DuPont), 19 wt% of titanium white CR-60-2 (Nippon Denshi Co., Ltd.), 0.6 wt% of hydrolysis stabilizer UN-03 (Rhine chemical), 0.2 wt% of 2- [4- [ 2-hydroxy-3-tridecyloxypropyl ] oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine (basf), 0.2 wt% of 2, 2' -methylene-bis- (4-methyl-6-tert-butylphenol) (Wagner chemical) 0.2 wt%;
the lower coating layer 14 is made of the following components: 88 wt% of epoxy resin (Changxing chemical), 10 wt% of isophorone diisocyanate prepolymer (Japanese polyurethane), 9.7 wt% of polyamide (CRYSTALLINE CHEMICAL), and 0.3 wt% of stannous octoate (POST science and technology);
the adhesive layer 15 is made of the following components: 88 wt% of ethylene-vinyl acetate copolymer (DuPont), 10 wt% of silica (Nippon Shiyuki Co., Ltd.), 1 wt% of n-octadecyl beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate, 0.5 wt% of 2, 6-di-tert-butyl-4-methylphenol (Santa and Chemicals), and 0.5 wt% of isopropyl tert-butylperoxycarbonate (Gelsemii chemical).
Example 6
As shown in fig. 2, a photovoltaic module packaging adhesive film 100 is composed of a transparent layer 11, an upper coating layer 12, an interlayer 13 and an adhesive layer 15 in sequence, wherein the thickness of the transparent layer 11 is 200 μm, the thickness of the upper coating layer 12 is 10 μm, the thickness of the interlayer 13 is 300 μm, and the thickness of the adhesive layer 15 is 100 μm.
Wherein the transparent layer 11 is made of the following components: ethylene-vinyl acetate copolymer (DuPont) 95 wt%, 2- [4- [ 2-hydroxy-3-dodecyloxypropyl ] oxy ] -2- [ hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine (basf) 3%, tris (2, 4-di-tert-butylphenyl) phosphite (permanent photochemical) 1.8 wt%, 2-ethylhexyl tert-butylperoxycarbonate (san Jose chemical) 0.1 wt%, 2-ethylhexyl tert-butylperoxycarbonate (Cigrel Segal chemical) 0.1 wt%;
the topcoat layer 12 is made from the following components: 75 wt% of hydroxyl polytrifluoroethylene ether type fluorocarbon resin (Japan gold), 5 wt% of titanium dioxide R706 (DuPont), 19.999 wt% of hexamethylene diisocyanate prepolymer (Japan polyurethane), and 0.001 wt% of monobutyl triisooctanoic acid tin (orthostatic technology);
the interlayer 13 is made of the following components: 75 wt% of polyurethane (DuPont), 20 wt% of titanium dioxide R960 (DuPont), 2 wt% of hydrolysis stabilizer I powder (Rhine chemical), 2 wt% of 1,3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1,3, 5-triazine-2, 4,6- (1H,3H,5H) -trione (permanent chemical), 2 wt% of N-phenylmaleimide-styrene-methyl methacrylate (Huawen chemical industry), 1 wt%;
the adhesive layer 15 is made of the following components: ethylene-octene copolymer (DuPont) 90 wt%, 2- [4- [ 2-hydroxy-3-tridecyloxypropyl ] oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine (basf) 1 wt%, poly { [6- [ (1,1,3, 3-tetramethylbutyl) amino ] ] -1,3, 5-triazine-2, 4- [ (2,2,6, 6-tetramethyl-piperidinyl) imino ] -1, 6-hexadiene [ (2,2,6, 6-tetramethyl-4-piperidinyl) imino ] } (basf) 3 wt%, 2, 6-di-tert-butyl-4-methylphenol (san Johnson & Chemicals) 3 wt%, benzoyl peroxide (Gray Siya chemical) 3 wt%.
Example 7
As shown in FIG. 3, a photovoltaic module packaging adhesive film 100 is composed of a transparent layer 11, an interlayer 13, a lower coating layer 14 and an adhesive layer 15 in sequence, wherein the thickness of the transparent layer 11 is 350 μm, the thickness of the interlayer 13 is 200 μm, the thickness of the lower coating layer 14 is 5 μm, and the thickness of the adhesive layer 15 is 10 μm.
Wherein the transparent layer 11 is made of the following components: ethylene-vinyl acetate copolymer (DuPont) 95 wt%, 2- [4- [ 2-hydroxy-3-tridecyloxypropyl ] oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine (basf) 3 wt%, tris (2, 4-di-tert-butylphenyl) phosphite (immortal chemical) 1.8 wt%, 2-ethylhexyl tert-butylperoxycarbonate (Sanko chemical industries) 0.1 wt%, 2-ethylhexyl tert-butylperoxycarbonate (Gracey chemical industries) 0.1 wt%;
the interlayer 13 is made of the following components: 75 wt% of polyurethane (DuPont), 20 wt% of titanium dioxide R960 (DuPont), 2 wt% of hydrolysis stabilizer I powder (Rhine chemical), 2 wt% of 1,3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1,3, 5-triazine-2, 4,6- (1H,3H,5H) -trione (permanent chemical), 2 wt% of N-phenylmaleimide-styrene-methyl methacrylate (Huawen chemical industry), 1 wt%;
the lower coating layer 14 is made of the following components: 80 wt% of alkyd resin (Changxing chemical), 12 wt% of hexamethylene diisocyanate trimer (Japanese polyurethane), 7.5 wt% of polymethylene diamine (Shanghai chemical industry) and 0.5 wt% of dioctyltin dilaurate (Zhengheng technology);
the adhesive layer 15 is made of the following components: ethylene-octene copolymer (DuPont) 90 wt%, 2- [4- [ 2-hydroxy-3-tridecyloxypropyl ] oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine (basf) 1 wt%, poly { [6- [ (1,1,3, 3-tetramethylbutyl) amino ] ] -1,3, 5-triazine-2, 4- [ (2,2,6, 6-tetramethyl-piperidinyl) imino ] -1, 6-hexadiene [ (2,2,6, 6-tetramethyl-4-piperidinyl) imino ] } (basf) 3 wt%, 2, 6-di-tert-butyl-4-methylphenol (san Johnson & Chemicals) 3 wt%, benzoyl peroxide (Gray Siya chemical) 3 wt%.
Comparative example 1
As shown in fig. 4, a photovoltaic module encapsulant film 100 is composed of a transparent layer 11, an upper coating layer 12, an interlayer 13 and a lower coating layer 14 in sequence, wherein the thickness of the transparent layer 11 is 350 μm, the thickness of the upper coating layer 12 is 50 μm, the thickness of the interlayer 13 is 200 μm, and the thickness of the lower coating layer 14 is 5 μm.
Wherein the transparent layer 11 is made of the following components: ethylene-vinyl acetate copolymer (DuPont) 95 wt%, 2- [4- [ 2-hydroxy-3-tridecyloxypropyl ] oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine (basf) 3 wt%, tris (2, 4-di-tert-butylphenyl) phosphite (permanent photochemical) 1.8 wt%, 2-ethylhexyl tert-butylperoxycarbonate (Santa and Chemicals) 0.1 wt%, 2-ethylhexyl tert-butylperoxycarbonate (Gray Seiki Chemicals) 0.1 wt%;
the topcoat layer 12 is made from the following components: 75 wt% of hydroxyl polytrifluoroethylene ether type fluorocarbon resin (Japan gold), 5 wt% of titanium dioxide R706 (DuPont), 19.999 wt% of hexamethylene diisocyanate prepolymer (Japan polyurethane), and 0.001 wt% of monobutyl triisooctanoic acid tin (orthostatic technology);
the interlayer 13 is made of the following components: 75 wt% of polyurethane (DuPont), 20 wt% of titanium dioxide R960 (DuPont), 2 wt% of hydrolysis stabilizer I powder (Rhine chemical), 2 wt% of 1,3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1,3, 5-triazine-2, 4,6- (1H,3H,5H) -trione (permanent chemical), 2 wt% of N-phenylmaleimide-styrene-methyl methacrylate (Huawen chemical industry), 1 wt%;
the lower coating layer 14 is made of the following components: 80 wt% of alkyd resin (Changxing chemical), 12 wt% of hexamethylene diisocyanate trimer (Japanese polyurethane), 7.5 wt% of polymethylene diamine (Kashihiki chemical), and 0.5 wt% of dioctyltin dilaurate (Zhengheng technology).
Comparative example 2
As shown in fig. 5, a photovoltaic module packaging adhesive film 100 is a single-layer structure, and is prepared from the following components:
65% by weight of ethylene-vinyl acetate copolymer (DuPont), 30% by weight of titanium dioxide R960 (DuPont), 2- [4- [ 2-hydroxy-3-tridecyloxypropyl ] oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine (basf) 2%, 1,3, 5-triazine [ (1,1,3, 3-tetramethylbutyl) amino ] ] -1,3, 5-triazine-2, 4- [ (2,2,6, 6-tetramethyl-piperidinyl) imino ] -1, 6-hexadiene [ (2,2,6, 6-tetramethyl-4-piperidinyl) imino ] } (basf) 1%, 1% by weight of 2, 6-di-tert-butyl-4-methylphenol (san Jose and Chemicals), benzoyl peroxide (Gray Siya chemical) 1 wt%.
Comparative example 3
Product F806W (foster, hangzhou).
Performance testing and results
Firstly, performance testing:
the above-described encapsulating adhesive films of examples 1 to 7 and the encapsulating adhesive films of comparative examples 1 to 3 were subjected to a performance test. The 60 sample assemblies were prepared and sequentially included photovoltaic glass, F406PS (Foster, Hangzhou), P-PERC cell sheets, encapsulant films in examples and comparative examples, and CPC back sheets.
1. Reflectance ratio:
the test method refers to a spectrophotometer method with an integrating sphere in the standard GB/T29848 ethylene-vinyl acetate copolymer (EVA) adhesive film for packaging photovoltaic modules. Testing an instrument: an ultraviolet-visible spectrophotometer; and (3) testing conditions are as follows: 400 nm-1200 nm.
2. Volume resistivity:
the test method refers to the standard GB/T31034 insulating back plate for crystalline silicon solar cell modules. Sample size: 100mm by 100 mm; and (3) testing conditions are as follows: the test voltage is 1000V.
3. Yellowing index:
the test method refers to the standard GB/T2409 Plastic yellow index test method. Sample size: 100mm by 100 mm; and (3) testing conditions are as follows: +25 ℃ 50% RH.
4. Tensile strength and elongation at break:
the test method is referred to the standard GB/T13542.2 film for electrical insulation. Sample size: 200mm by 200 mm; stretching speed: 100mm/min.
5. Interlayer peel strength:
the test method refers to a standard GB/T2790 method for testing 180-degree peel strength of adhesive for flexible materials versus rigid materials. Sample size: 200mm 15 mm; stretching speed: 100mm/min.
6. And the peel strength with EVA:
the test method refers to a standard GB/T2790 method for testing 180-degree peel strength of adhesive for flexible materials versus rigid materials. Sample size: 300mm by 300 mm; stretching speed: 100mm/min.
7. Constant resistance to wet heat aging:
the test method refers to the standard GB/T29848 ethylene-vinyl acetate copolymer (EVA) adhesive film for photovoltaic module packaging. The test conditions are as follows: +85 ℃ and 85% relative humidity.
8. Maximum power:
the test method refers to the design identification and design of crystalline silicon photovoltaic modules for ground in IEC 61215. Sample size: a double-sided battery piece, a 60-piece assembly; the test conditions are as follows: AM 1.5, irradiance 1000W/m2，+25℃，50％RH。
PID test:
the test method is referred to the standard IEC TS 2804-1. The test conditions are as follows: +85 ℃ and relative humidity of 85%; -1500V constant dc voltage, 192 h; and (3) performance test results:
second, performance test results
The results of the performance tests of the adhesive packaging films of the above examples 1 to 7 are shown in the following table 1, and the results of the performance tests of the adhesive packaging films of the above comparative examples 1 to 3 are shown in the following table 2.
Table 1: examples results of Performance testing
Table 2: comparative example Performance test results
As can be seen from the relevant data in table 1, the encapsulation films prepared in examples 1 to 7 have a high light reflectivity, which is generally over 95% or even 99% in the range from visible light to infrared light, i.e., the wavelength is 400-; the packaging adhesive films prepared in the embodiments 1 to 7 have no appearance defects such as wrinkles, white overflow, flanging and the like during lamination packaging, and can ensure good appearance forms after lamination packaging and lamination packaging; the packaging adhesive films prepared in examples 1-6 all have excellent weather resistance, and the yellowing index after the humid heat aging of 2000 hours is less than 3.
As can be seen from the comparison of the data in tables 1 and 2, the encapsulating adhesive films prepared in examples 1 to 7 of the present invention have the same light reflectivity as the encapsulating adhesive films prepared in comparative examples 1 to 3, and the power attenuation of the photovoltaic module is generally reduced, so that the photovoltaic module has better durability; most importantly, compared with the phenomena of extremely high wrinkles, white overflow and flanging during lamination in comparative examples 2 and 3, the packaging adhesive films in the embodiments 1 to 7 of the invention have no similar situation, have better appearance after lamination, and solve the appearance problem after lamination commonly occurring in the prior art.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (12)
1. A photovoltaic module packaging adhesive film is characterized by comprising:
the interlayer is used for providing support for the photovoltaic module packaging adhesive film and improving the light reflectivity of the photovoltaic packaging adhesive film;
the transparent layer is arranged on one side of the interlayer, is a transparent film layer and is used for bonding the photovoltaic cell and isolating the interlayer and the photovoltaic cell;
the bonding layer is arranged on the other side of the interlayer, is a white, transparent or colored film layer and is used for bonding the backlight surface packaging material;
and at least one coating layer disposed between the interlayer and the transparent layer and/or between the interlayer and the bonding layer.
2. The photovoltaic module packaging adhesive film according to claim 1,
the thickness of the interlayer is 50-300 mu m, and the Shore hardness HA of the interlayer is not more than 90; the raw materials of the interlayer comprise the following components:
65-99 wt% of first resin, 0.9-30 wt% of filler and 0.1-5 wt% of auxiliary agent.
3. The photovoltaic module packaging adhesive film according to claim 2, wherein:
the first resin comprises at least one of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethylene-acrylate, polyethylene-methacrylate, polyester, polyurethane, styrene-methyl methacrylate copolymer, and methyl methacrylate-butadiene-styrene copolymer.
4. The photovoltaic module packaging adhesive film according to claim 1,
the thickness of the transparent layer is 200-350 μm; the raw materials of the transparent layer comprise the following components:
85-95 wt% of second resin, 0-10 wt% of anti-ultraviolet auxiliary agent, 0.1-3 wt% of anti-thermal-oxidation aging agent and 0.1-3 wt% of initiator.
5. The photovoltaic module packaging adhesive film according to claim 1,
the thickness of the bonding layer is 10-100 mu m; the raw materials of the bonding layer comprise the following components:
75-90 wt% of a second resin, 0-20 wt% of a filler, 0-5 wt% of an anti-ultraviolet auxiliary agent, 0.1-3 wt% of an anti-thermal-oxidative aging agent and 0.1-3 wt% of an initiator.
6. The photovoltaic module encapsulant film of claim 4 or 5,
the second resin comprises at least one of resins obtained by copolymerizing ethylene and one or more of propylene, butylene, heptene, octene, norbornene, vinyl acetate, methyl acrylate and methyl methacrylate.
7. The photovoltaic module packaging adhesive film according to claim 1,
the coating layer arranged between the interlayer and the transparent layer is an upper coating layer, and the thickness of the upper coating layer is 1-20 micrometers; the upper coating is a fluorine-containing coating, and the raw materials of the upper coating comprise the following components:
40-95 wt% of fluorocarbon resin, 0-50 wt% of filler, 0.5-20 wt% of curing agent and 0.001-1 wt% of auxiliary agent.
8. The photovoltaic module packaging adhesive film according to claim 7,
the fluorocarbon resin comprises at least one of polyvinylidene fluoride, polychlorotrifluoroethylene, polytetrafluoroethylene, monovinyl fluoride-vinyl ether copolymer, monovinyl fluoride-vinyl ester copolymer, vinylidene fluoride-vinyl ether, vinylidene fluoride-vinyl ester, chlorotrifluoroethylene-vinyl ether, chlorotrifluoroethylene-vinyl ester, tetrafluoroethylene-vinyl ether or tetrafluoroethylene-vinyl ester.
9. The photovoltaic module packaging adhesive film according to claim 1,
the coating layer arranged between the interlayer and the bonding layer is a lower coating layer, and the thickness of the lower coating layer is 1-10 micrometers; the raw materials of the lower coating comprise the following components:
60-90 wt% of third resin, 0-30 wt% of filler, 0.001-20 wt% of curing agent and 0.001-1 wt% of auxiliary agent.
10. The photovoltaic module packaging adhesive film according to claim 9, wherein:
the third resin comprises at least one of acrylic resin, alkyd resin, polyester resin, epoxy resin, phenolic resin and terpene resin.
11. The photovoltaic module encapsulant film of any one of claims 2, 5, 7, or 9, wherein:
the filler comprises at least one of titanium dioxide, calcium carbonate and silicon dioxide.
12. A photovoltaic module, comprising a photovoltaic element having a photovoltaic element,
the photovoltaic cell piece is used for realizing photoelectric conversion for the photovoltaic module;
the backlight surface packaging material is arranged on the backlight side of the photovoltaic cell and used for providing support for the photovoltaic cell;
the photovoltaic module packaging adhesive film is used for bonding the backlight surface packaging material and the photovoltaic cell piece together;
the photovoltaic module packaging adhesive film is characterized by comprising:
the interlayer is used for providing support for the photovoltaic module packaging adhesive film and improving the light reflectivity of the photovoltaic packaging adhesive film;
the transparent layer is arranged on one side of the interlayer, is a transparent film layer and is used for bonding the photovoltaic cell and isolating the interlayer and the photovoltaic cell;
the bonding layer is arranged on the other side of the interlayer, is a white, transparent or colored film layer and is used for bonding the backlight surface packaging material; and at least one coating layer disposed between the interlayer and the transparent layer and/or between the interlayer and the bonding layer.
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| CN202110994796.7A CN113583588A (en) | 2021-08-27 | 2021-08-27 | Photovoltaic module packaging adhesive film and photovoltaic module |
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| CN202110994796.7A CN113583588A (en) | 2021-08-27 | 2021-08-27 | Photovoltaic module packaging adhesive film and photovoltaic module |
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| CN113583588A true CN113583588A (en) | 2021-11-02 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115386125A (en) * | 2022-09-30 | 2022-11-25 | 福斯特(嘉兴)新材料有限公司 | Packaging sheet, preparation method thereof and photovoltaic device |
| CN116936663A (en) * | 2023-09-18 | 2023-10-24 | 苏州腾晖光伏技术有限公司 | Photovoltaic double-sided assembly packaging film, manufacturing method and manufacturing equipment thereof |
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