CN113579483A - Automatic change semiconductor nanometer electric heat membrane and remove membrane machine - Google Patents
Automatic change semiconductor nanometer electric heat membrane and remove membrane machine Download PDFInfo
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- CN113579483A CN113579483A CN202110989991.0A CN202110989991A CN113579483A CN 113579483 A CN113579483 A CN 113579483A CN 202110989991 A CN202110989991 A CN 202110989991A CN 113579483 A CN113579483 A CN 113579483A
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- electrothermal film
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 239000012528 membrane Substances 0.000 title claims description 10
- 238000010330 laser marking Methods 0.000 claims abstract description 24
- 239000000835 fiber Substances 0.000 claims abstract description 4
- 239000000428 dust Substances 0.000 claims description 31
- 230000005540 biological transmission Effects 0.000 claims description 19
- 238000003860 storage Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 abstract description 2
- 238000009776 industrial production Methods 0.000 abstract description 2
- 210000003128 head Anatomy 0.000 description 18
- 238000000576 coating method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 239000000779 smoke Substances 0.000 description 4
- 239000007888 film coating Substances 0.000 description 3
- 238000009501 film coating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to an automatic semiconductor nano electrothermal film removing machine. The invention adopts the fiber laser to output laser, realizes the laser film removing function through the high-speed scanning galvanometer system, has high film removing efficiency and higher precision on the electrothermal film of the semiconductor nano electrothermal film heating plate, has higher reliability, and can accurately control the depth, the smoothness and the fineness during film removing. The laser marking head adopts a light laser with higher photoelectric conversion efficiency, and the whole energy consumption is low through a natural air cooling mode, the operation is stable, the industrial production environment can be met, the whole machine volume is smaller, the energy consumption is low, the processing efficiency is high, and the processing effect is better.
Description
Technical Field
The invention relates to the technical field of laser film removing equipment, in particular to an automatic semiconductor nano electric heating film removing machine.
Background
The semiconductor nano electrothermal film is a new generation of heating material. The heating mode of the heating wire is different from that of the traditional metal resistance wire. It has excellent physical and chemical properties of corrosion resistance, oxidation resistance, temperature shock resistance, insulation, flame retardance, moisture resistance, high hardness, no toxicity, no harmful radiation, no discharge of harmful substances and the like. It has zero inductive reactance and a power factor of 1. And generate heat in a surface form, the heat transfer effect is good, and the electric heat conversion efficiency is high: 80% -97%, has better energy-saving advantage. Long service life, difficult attenuation and the like.
However, the semiconductor nano electrothermal film coating technology is to coat a whole surface on the substrate through a high-temperature environment, so that local coating is difficult to realize. Then the electrodes at both sides are connected with a power supply to work and generate heat. But the conductive electrothermal film layer also exists in the area beyond the electric connection electrode, so that the electric leakage problem exists in the area without heating. If the coating process is immature, a small amount of conductive electrothermal film layers are also coated on the back of the uncoated film, and when the substrate is electrified, the electrothermal film layers coated on the edge surfaces of the substrate also have induced voltage, so that the insulated substrate becomes a conductor, and the risks of electric leakage, tripping and the like are caused, and the use effect is seriously influenced.
In order to solve the coating defect, materials such as high-temperature resistant and corrosion resistant metal, non-metallic slurry and the like are used at present to cover the coating substrate at the position where coating is not needed. However, the method seriously affects the efficiency of manufacturing and production, reduces the yield, increases the labor cost, and has the problems that the covered material expands with heat and contracts with cold under the high-temperature airflow state during film coating, and deviates under the airflow state, so that the error is large, the area without film coating cannot be accurately and completely covered, and the yield is reduced. Because the semiconductor nano electrothermal film has strict requirements on the thickness of the film and the positioning precision during film removal, a set of more suitable equipment is needed to complete the film removal of the semiconductor nano electrothermal film.
Disclosure of Invention
In view of the problems in the prior art, the invention discloses an automatic semiconductor nano electrothermal film removing machine, which adopts the technical scheme that the automatic semiconductor nano electrothermal film removing machine comprises a base, rollers are fixedly arranged on the lower surface of the base, a storage cabinet is arranged on the side surface of the base, a dust collector host and a computer host are arranged in the storage cabinet, an upper shell is fixedly arranged on the upper part of the base, a laser film removing device and a transmission device are arranged on the upper surface of the base in the inner cavity of the upper shell, the laser film removing device moves in two degrees of freedom in the transverse direction and the longitudinal direction, the transmission device is positioned at the middle position below the laser film removing device and extends out of the side surface of the upper shell, side limit devices are arranged on two sides of the upper surface of the transmission device, a warning lamp is arranged at the top of the upper shell, a main control unit is embedded on the left side of the front surface, a computer display screen is embedded on the right side of the front surface of the transmission device, the computer display screen below is in install the keyboard on the last casing, laser film removing device computer display screen, keyboard respectively with computer host electric connection, laser film removing device, conveyer, warning light, side stop device, dust catcher host computer, computer host computer respectively with main control unit electric connection, through main control unit and computer host control laser film removing device's removal membrane movement track, removal membrane degree of depth etc. the dust catcher host computer passes through the hose with laser film removing device intercommunication is connected, can directly take away the smoke and dust etc. that produce through the dust catcher host computer in the film removing process, avoids harmful gas's discharge.
As a preferable scheme of the invention, a bin door is rotatably arranged in the middle of the front surface of the upper shell, two sides of the bin door are connected with the upper shell through pneumatic telescopic rods, the bin door is supported by the pneumatic telescopic rods, the stability of the bin door after the bin door is opened is ensured, a eye protection observation window is arranged on the front surface of the bin door, internal processing conditions can be observed through the eye protection observation window, eyes cannot be injured by laser light, a keyboard placing table is rotatably arranged on the right side of the front surface of the upper shell in a matched manner, a containing cavity is formed in the upper shell corresponding to the keyboard placing table, a keyboard buckle is placed on the keyboard placing table, so that the keyboard placing table can be rotated and folded to contain a keyboard and the keyboard placing table into the containing cavity together, a discharge notch is formed below the end surface of the left side of the upper shell, and the conveying device extends out of the discharge notch, and the processed product is conveyed by the conveying device and is sent out from the discharge chute.
As a preferred scheme of the present invention, the laser film removing device includes a mounting frame fixedly mounted on the base, two ends of the mounting frame are fixedly connected with longitudinal moving modules, the two longitudinal moving modules are parallel to each other and are provided with transverse moving modules in a sliding fit manner, the transverse moving modules are provided with laser marking heads in a sliding fit manner, the laser marking heads select optical fiber lasers, the side edges of the laser marking heads are fixedly connected with dust collection pipes, the upper ends of the dust collection pipes are communicated with the dust collector main machine through hoses, the lower ends of the dust collection pipes extend to the upper side of the conveying device, the longitudinal moving modules, the transverse moving modules are electrically connected with the main control unit, the laser marking heads are electrically connected with the computer main machine, the longitudinal moving modules and the transverse moving modules select lead screw transmission structures, and the longitudinal moving modules drive the transverse moving modules and the laser marking heads mounted thereon through lead screw transmission to move along the longitudinal direction And the transverse moving module drives the laser marking head to transversely move through the screw rod transmission, so that the transverse and longitudinal movement of the laser marking head can be realized.
As a preferable scheme of the invention, the conveying device adopts a transmission belt structure, and the driving tensioning device is arranged below the conveying device and is positioned at the top of the storage cabinet inner cavity of the base.
As a preferable scheme of the invention, the side limiting device comprises two air cylinders fixedly connected to one side of the conveying device, a push plate is fixedly connected to the telescopic end of each air cylinder, the push plate is positioned above the conveying device, a baffle is fixedly arranged at the position, corresponding to the push plate, of the other side of the conveying device, and the products on the conveying device can be pushed to the baffle by pushing the push plate through the air cylinders, so that the products are positioned.
The invention has the beneficial effects that: the invention adopts the fiber laser to output laser, realizes the laser film removing function through the high-speed scanning galvanometer system, has high film removing efficiency and higher precision on the electrothermal film of the semiconductor nano electrothermal film heating plate, has higher reliability, and can accurately control the depth, the smoothness and the fineness during film removing. The laser marking head adopts a light laser with higher photoelectric conversion efficiency, and the whole energy consumption is low through a natural air cooling mode, the operation is stable, the industrial production environment can be met, the whole machine volume is smaller, the energy consumption is low, the processing efficiency is high, and the processing effect is better.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a sectional view of the internal structure of the present invention;
FIG. 3 is a schematic view of the upper housing structure of the present invention;
FIG. 4 is a schematic structural diagram of a conveying device and a laser film removing device of the present invention.
In the figure: the device comprises a base 1, rollers 101, a storage cabinet 102, a shell 2, a door 201, a keyboard 202, a vision protection observation window 203, an air pressure telescopic rod 204, a storage cavity 205, a discharge opening 206, a laser film removing device 3, a mounting rack 301, a longitudinal moving module 302, a transverse moving module 303, a laser marking head 304, a dust suction pipe 305, a conveying device 4, a driving tensioning device 401, a warning lamp 5, a main control unit 6, a computer display screen 7, a keyboard 8, a side limiting device 9, a cylinder 901, a push plate 902, a baffle 903, a host 10 and a host 11.
Detailed Description
Example 1
As shown in fig. 1 to 4, the automatic semiconductor nano electrothermal film removing machine adopts the technical scheme that the machine comprises a base 1, rollers 101 are fixedly arranged on the lower surface of the base 1, a storage cabinet 102 is arranged on the side surface of the base 1, a dust collector host 10 and a computer host 11 are arranged in the storage cabinet 102, an upper shell 2 is fixedly arranged on the upper portion of the base 1, a laser film removing device 3 and a transmission device 4 are arranged on the upper surface of the base 1 in the inner cavity of the upper shell 2, the laser film removing device 3 moves in two degrees of freedom in the transverse direction and the longitudinal direction, the transmission device 4 adopts a transmission belt structure, a driving tension device 401 of the transmission device is arranged below the transmission device 4, the driving tension device 401 is positioned at the top of the inner cavity of the storage cabinet 102 of the base 1, the transmission device 4 is positioned at the middle position below the laser film removing device 3 and extends out of the side surface of the upper shell 2, the side limiting devices 9 are mounted on two sides of the upper surface of the conveying device 4, the warning lamp 5 is mounted at the top of the upper shell 2, the main control unit 6 is mounted on the left side of the front surface of the upper shell, the computer display screen 7 is mounted on the right side of the front surface of the upper shell, the keyboard 8 is mounted on the upper shell 2 below the computer display screen 7, the bin door 201 is rotatably mounted at the middle position of the front surface of the upper shell 2, two sides of the bin door 201 are connected with the upper shell 2 through air pressure telescopic rods 204, the bin door 201 is supported by the air pressure telescopic rods 204 to ensure the stability of the opened bin door 201, the eye protection observation window 203 is mounted on the front surface of the bin door 201, the internal processing conditions can be observed through the eye protection observation window 203 without damaging eyes by the brightness of laser, the keyboard placing table 202 is rotatably mounted on the right side of the front surface of the upper shell 2 in a matching manner, and the accommodating cavity 205 is formed on the upper shell 2 corresponding to the keyboard placing table 202, the keyboard 8 is placed on the keyboard placing table 202 in a buckling manner, so that the keyboard placing table 202 can be rotated and folded to store the keyboard 8 and the keyboard placing table 202 into the storage cavity 205, a discharge notch 206 is formed below the left end face of the upper shell 2, the conveying device 4 extends out of the discharge notch 206, a processed product is conveyed out of the discharge notch 206 under the conveying of the conveying device 4, the laser film removing device 3, the computer display screen 7 and the keyboard 8 are respectively and electrically connected with the computer host 11, the laser film removing device 3, the conveying device 4, the warning lamp 5, the side limiting device 9, the dust collector host 10 and the computer host 11 are respectively and electrically connected with the main control unit 6, the film removing movement track, the film removing depth and the like of the laser film removing device 3 are controlled by the main control unit 6 and the computer host 11, the dust collector host 10 is communicated and connected with the laser film removing device 3 through a hose, during the film removing process, the generated smoke dust and the like can be directly pumped away through the dust collector main machine 10, and the discharge of harmful gas is avoided.
The laser film removing device 3 comprises a mounting frame 301 fixedly mounted on the base 1, wherein two ends of the mounting frame 301 are fixedly connected with longitudinal moving modules 302, the two longitudinal moving modules 302 are parallel to each other and are provided with transverse moving modules 303 in a sliding fit manner, the transverse moving modules 303 are provided with laser marking heads 304 in a sliding fit manner, the laser marking heads 304 are selected from fiber lasers, the side edges of the laser marking heads 304 are fixedly connected with a dust suction pipe 305, the upper end of the dust suction pipe 305 is communicated and connected with the dust collector main machine 10 through a hose, the lower end of the dust suction pipe extends to the position above the conveying device 4, the longitudinal moving modules 302, the transverse moving modules 303 and the main control unit 6 are electrically connected, the laser marking heads 304 are electrically connected with the main machine 11, and the longitudinal moving modules 302 and the transverse moving modules 303 are selected from lead screw transmission structures, the longitudinal moving module 302 drives the transverse moving module 303 and the laser marking head 304 mounted thereon to move longitudinally through screw transmission, and the transverse moving module 303 drives the laser marking head 304 to move transversely through screw transmission, so that transverse and longitudinal movement of the laser marking head 304 can be realized.
The side limiting device 9 comprises two cylinders 901 fixedly connected to one side of the conveying device 4, a push plate 902 is fixedly connected to the telescopic end of each cylinder 901, the push plate 902 is located above the conveying device 4, a baffle 903 is fixedly installed at the position, corresponding to the push plate 902, of the other side of the conveying device 4, and the products on the conveying device 4 can be pushed to the baffle 903 by pushing the push plate 902 through the cylinders 901, so that the products are positioned.
The working principle of the invention is as follows: the bin door 201 is opened to place the semiconductor nano electrothermal film heating sheet needing film removal on the conveying device 4, the conveying device 4 conveys the semiconductor nano electrothermal film heating sheet to a corresponding position, the air cylinder 901 pushes the push plate 902 to press the semiconductor nano electrothermal film heating sheet on the baffle 903 so as to fix the semiconductor nano electrothermal film heating sheet, then the main control unit 6 and the computer host 11 control the laser marking head 304 to carry out film removal work on the electrothermal film at the corresponding position of the semiconductor nano electrothermal film heating sheet, the longitudinal moving module 302 and the transverse moving module 303 drive the laser marking head 304 to freely move above the semiconductor nano electrothermal film heating sheet, thereby realizing the laser film removal work on the electrothermal film at different positions, the dust suction pipe 305 synchronously moves along with the laser marking head 304, thereby working through the dust collector host 10, the smoke dust generated during film removal can be directly sucked away by the dust suction pipe 305, the diffusion of smoke dust is avoided, and the environment is polluted; the semiconductor nanometer electrothermal film heating sheet after film removal is loosened by the pushing plate 902, and then the semiconductor nanometer electrothermal film heating sheet can be conveyed out of the upper shell 2 from the discharging notch 206 through the conveying device 4.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore are not to be construed as limiting the invention, and further, the terms "first", "second", etc., are used only for descriptive purposes and are not intended to indicate or imply relative importance or to implicitly indicate the number of technical features indicated, whereby the features defined as "first", "second", etc., may explicitly or implicitly include one or more of such features, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, and the two elements may be communicated with each other, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art through specific situations.
Components and circuit connections not described in detail herein are prior art.
Although the present invention has been described in detail with reference to the specific embodiments, the present invention is not limited to the above embodiments, and various changes and modifications without inventive changes may be made within the knowledge of those skilled in the art without departing from the spirit of the present invention.
Claims (7)
1. An automatic change semiconductor nanometer electric heat membrane machine that removes which characterized in that: the device comprises a base (1), wherein rollers (101) are fixedly mounted on the lower surface of the base (1), a storage cabinet (102) is arranged on the side surface of the base (1), a dust collector host (10) and a computer host (11) are placed in the storage cabinet (102), an upper shell (2) is fixedly mounted on the upper portion of the base (1), a laser film removing device (3) and a conveying device (4) are mounted on the upper surface of the base (1) in an inner cavity of the upper shell (2), the conveying device (4) is located in the middle position below the laser film removing device (3) and extends out of the side surface of the upper shell (2), side limit devices (9) are mounted on two sides of the upper surface of the conveying device (4), a warning lamp (5) is mounted at the top of the upper shell (2), a main control unit (6) is mounted on the left side of the front in an embedded mode, a computer display screen (7) is mounted on the right side of the front in an embedded mode, computer display screen (7) below is in install keyboard (8) on last casing (2), laser remove membrane device (3) computer display screen (7), keyboard (8) respectively with computer (11) electric connection, laser remove membrane device (3), conveyer (4), warning light (5), side stop device (9), dust catcher host computer (10), computer (11) respectively with main control unit (6) electric connection, dust catcher host computer (10) through the hose with laser removes membrane device (3) intercommunication and connects.
2. The automatic semiconductor nanometer electrothermal film removing machine according to claim 1, characterized in that: go up casing (2) openly intermediate position and rotate and install door (201), door (201) both sides pass through air telescopic rod (204) with it connects to go up casing (2), door (201) openly installs eye-protection observation window (203), it installs keyboard and places platform (202) to go up casing (2) openly right side normal running fit, with platform (202) is placed to the keyboard is corresponding to go up seted up on casing (2) and accomodate chamber (205), keyboard (8) buckle is placed on platform (202) is placed to the keyboard, go up casing (2) left side terminal surface below and seted up ejection of compact notch (206), conveyer (4) are followed ejection of compact notch (206) department stretches out.
3. The automatic semiconductor nanometer electrothermal film removing machine according to claim 1, characterized in that: the laser film removing device (3) comprises a mounting rack (301) fixedly mounted on the base (1), the two ends of the mounting rack (301) are fixedly connected with longitudinal moving modules (302), the two longitudinal moving modules (302) are parallel to each other and are provided with transverse moving modules (303) in a sliding fit manner, the transverse moving module (303) is provided with a laser marking head (304) in a sliding fit manner, the side edge of the laser marking head (304) is fixedly connected with a dust suction pipe (305), the upper end of the dust suction pipe (305) is communicated and connected with the dust collector main machine (10) through a hose, the lower end of the dust suction pipe extends to the upper part of the conveying device (4), the longitudinal moving module (302) and the transverse moving module (303) are electrically connected with the main control unit (6), the laser marking head (304) is electrically connected with the computer host (11).
4. The automatic semiconductor nanometer electrothermal film removing machine according to claim 3, characterized in that: the longitudinal moving module (302) and the transverse moving module (303) adopt a lead screw transmission structure.
5. The automatic semiconductor nanometer electrothermal film removing machine according to claim 3, characterized in that: the laser marking head (304) selects a fiber laser.
6. The automatic semiconductor nanometer electrothermal film removing machine according to claim 1, characterized in that: the conveying device (4) is of a transmission belt structure, a driving tensioning device (401) of the conveying device is arranged below the conveying device (4), and the driving tensioning device (401) is located at the top of the inner cavity of the storage cabinet (102) of the base (1).
7. The automatic semiconductor nanometer electrothermal film removing machine according to claim 1, characterized in that: the side limiting device (9) comprises two cylinders (901) fixedly connected to one side of the conveying device (4), a push plate (902) is fixedly connected to the telescopic end of each cylinder (901), the push plate (902) is located above the conveying device (4), and a baffle (903) is fixedly mounted at the position, corresponding to the push plate (902), of the other side of the conveying device (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110989991.0A CN113579483A (en) | 2021-08-26 | 2021-08-26 | Automatic change semiconductor nanometer electric heat membrane and remove membrane machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110989991.0A CN113579483A (en) | 2021-08-26 | 2021-08-26 | Automatic change semiconductor nanometer electric heat membrane and remove membrane machine |
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| Publication Number | Publication Date |
|---|---|
| CN113579483A true CN113579483A (en) | 2021-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110989991.0A Pending CN113579483A (en) | 2021-08-26 | 2021-08-26 | Automatic change semiconductor nanometer electric heat membrane and remove membrane machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114436608A (en) * | 2022-02-10 | 2022-05-06 | 福建晶烯新材料科技有限公司 | Semiconductor nano electrothermal film-removing water-based barrier slurry |
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| CN211840616U (en) * | 2020-03-12 | 2020-11-03 | 天津明远达科技发展有限公司 | Multi-station laser coding machine |
| CN111774733A (en) * | 2020-06-29 | 2020-10-16 | 深圳市吉祥云科技有限公司 | Laser film removing equipment for automobile glass |
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