CN113571556B - Manufacturing method of flexible display device and flexible display device - Google Patents
Manufacturing method of flexible display device and flexible display device Download PDFInfo
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- CN113571556B CN113571556B CN202110777061.9A CN202110777061A CN113571556B CN 113571556 B CN113571556 B CN 113571556B CN 202110777061 A CN202110777061 A CN 202110777061A CN 113571556 B CN113571556 B CN 113571556B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 98
- 239000000463 material Substances 0.000 claims abstract description 35
- 239000002346 layers by function Substances 0.000 claims abstract description 21
- 239000000084 colloidal system Substances 0.000 claims abstract description 9
- 150000001875 compounds Chemical class 0.000 claims description 33
- 238000005452 bending Methods 0.000 claims description 26
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 9
- 229910052797 bismuth Inorganic materials 0.000 claims description 7
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 5
- AOWVKYFCBZQVCT-UHFFFAOYSA-N [Fe].[Ta].[Hf] Chemical compound [Fe].[Ta].[Hf] AOWVKYFCBZQVCT-UHFFFAOYSA-N 0.000 claims description 4
- PXELSXAIIUMJCA-UHFFFAOYSA-N [Si].[Fe].[La] Chemical compound [Si].[Fe].[La] PXELSXAIIUMJCA-UHFFFAOYSA-N 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 4
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 3
- 229910052735 hafnium Inorganic materials 0.000 claims description 3
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052746 lanthanum Inorganic materials 0.000 claims description 3
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- 229910000676 Si alloy Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 description 14
- 239000010410 layer Substances 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 5
- 229910052733 gallium Inorganic materials 0.000 description 5
- 239000011572 manganese Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910017082 Fe-Si Inorganic materials 0.000 description 3
- 229910017133 Fe—Si Inorganic materials 0.000 description 3
- RBVYPNHAAJQXIW-UHFFFAOYSA-N azanylidynemanganese Chemical compound [N].[Mn] RBVYPNHAAJQXIW-UHFFFAOYSA-N 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001622 bismuth compounds Chemical class 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 150000002259 gallium compounds Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
A flexible display device and a manufacturing method thereof are provided, the flexible display device comprises a substrate base plate and a film group functional layer arranged on the substrate base plate, wherein the substrate base plate comprises a material with negative thermal expansion coefficient property and is fixed with the module functional layer by using colloid, and when the temperature is in the range of 10 ℃ to 100 ℃, the thermal expansion coefficient of the substrate base plate is less than 0.
Description
[ technical field ] A method for producing a semiconductor device
The present disclosure relates to the field of display technologies, and in particular, to a method for manufacturing a flexible display device and a flexible display device.
[ background of the invention ]
Organic light-emitting diode (OLED) flexible devices are considered as a new generation of display technology, and currently, a variety of flexible folding products are already put into the market. For the flexible display module, when the flexible display module is repeatedly bent in a small radius, the bending area can be obviously deformed, and the display screen body has obvious creases when being seen in appearance, so that the appearance grade is influenced.
The current flexible display module is often fixed on the whole mechanism by means of gluing, that is, the substrate at the lowest layer of the display module is glued with the whole structure. The crease of bending zone is observed, can find that the crease is undercut and forms, if the substrate base plate of the module structure lower floor does not take place decurrent sunken, then the display module assembly just can not appear undercut, just also can solve the problem of bending zone crease.
The reason for the downward concavity of the base substrate is that the base substrate material undergoes plastic deformation during repeated bending, which is associated with fatigue in the repeated bending of the material. If the fatigue resistance of the substrate base plate can be improved, the plastic deformation in bending can be reduced or even overcome, and the problem of bending crease can be reduced or overcome.
[ summary of the invention ]
In order to solve the above technical problem, the present application provides a method for manufacturing a flexible display device, including the following steps:
s1, providing a substrate base plate;
s2, manufacturing a module functional layer on the substrate;
the substrate comprises a material with negative thermal expansion coefficient property, the substrate and the module functional layer are fixed by using colloid, and the thermal expansion coefficient of the substrate is less than 0 when the temperature is within the range of 10-100 ℃.
Further, the method for manufacturing the substrate in step S1 further includes the following steps:
s11, providing at least one compound, grinding the at least one compound into particles, and uniformly mixing to form a mixture;
s12, pressing the mixture into a preset shape;
s13, sintering the mixture with a preset shape and cooling to room temperature;
and S14, repeating the steps S11 to S13 for a plurality of times to finally obtain the substrate base plate.
Still further, the at least one compound is an oxide of lanthanum, an oxide of iron, and an oxide of silicon.
Still further, the at least one compound is an oxide of hafnium, an oxide of tantalum, and an oxide of iron.
Still further, the at least one compound is an oxide of manganese and an oxide of nitrogen.
Further, the at least one compound is a compound of bismuth or a compound of gallium.
In order to solve the above technical problem, the present application further provides a flexible display device, including:
a substrate base plate; and
the module functional layer is arranged on the substrate base plate;
the substrate comprises a material with negative thermal expansion coefficient property, the substrate and the module functional layer are fixed by using colloid, and the thermal expansion coefficient of the substrate is less than 0 when the temperature is within the range of 10-100 ℃.
Still further, the material of the substrate base plate comprises lanthanum-iron-silicon alloy or hafnium-tantalum-iron alloy.
Further, the material of the substrate base plate comprises manganese nitrogen compound.
Furthermore, the material of the substrate base plate comprises a bismuth compound or a gallium compound.
The manufacturing method of the flexible display device and the flexible display device have the advantages that the substrate base plate of the flexible display device comprises a material with a negative thermal expansion coefficient (NTE), so that the thermal expansion coefficient of the flexible display device is smaller than 0 at normal temperature (10-100 ℃), and the average stress of the flexible display device in a flattening-bending cycle is reduced, therefore, in the use process of the flexible display device, the substrate base plate cannot be sunken downwards due to bending, the technical problem that a module functional layer above the substrate base plate is sunken downwards due to the fact that the substrate base plate is sunken downwards, finally, a bending area of the flexible display device is creased is caused is avoided, and the fatigue resistance of the substrate base plate is improved.
In order to make the aforementioned and other objects of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
[ description of the drawings ]
Fig. a is a flowchart illustrating a method for manufacturing a flexible display device according to the present application.
Fig. two is a flowchart illustrating a method for manufacturing a substrate in a flexible display device method according to the present application.
[ detailed description ] A
In order to make the aforementioned and other objects, features and advantages of the present disclosure comprehensible, preferred embodiments accompanied with figures are described in detail below. Furthermore, directional phrases used in this disclosure, such as, for example, upper, lower, top, bottom, front, rear, left, right, inner, outer, lateral, peripheral, central, horizontal, lateral, vertical, longitudinal, axial, radial, uppermost or lowermost, etc., refer only to the orientation of the attached drawings. Accordingly, the directional terminology is used for the purpose of describing and understanding the present disclosure, and is not intended to be limiting of the present disclosure.
First embodiment
Referring to fig. 1, an embodiment of the present application provides a method for manufacturing a flexible display device, including the following steps:
s1, providing a substrate base plate;
s2, manufacturing a module functional layer on the substrate;
the substrate comprises a material with negative thermal expansion coefficient property, the substrate and the module functional layer are fixed by using colloid, and the thermal expansion coefficient of the substrate is less than 0 when the temperature is within the range of 10-100 ℃.
It should be noted that the module functional layer in this embodiment may be any film layer (such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, etc.) in a conventional OLED display device, or a combination of the above film layers, and the colloid may be an optical adhesive.
This application is dedicated to the fatigue resistance ability that promotes among the flexible display device substrate and produces the technical problem of crease in order to solve the traditional flexible display device bending back bending zone, and the mode of promoting material fatigue resistance ability reduces average stress. In brief, when the flexible display device is flat, the stress of the material is 0, when the flexible display device is bent, the stress of the material is X, and assuming that the flat time and the bending time are the same, the average stress of the material in one cycle is X/2. The material receives the tensile stress effect when buckling, if let the material receive the effect of compressive stress in the flattening state, then compare the state of not atress in the flattening, the average tensile stress that the material received in once circulation descends, and material fatigue resistance can promote, and above function can be realized through the thermal contraction metal. The heat shrinkable metal is a metal that shrinks in size when heated, that is, a metal material exhibiting NTE (negative thermal expansion) properties. Because the flat state is the screen using state, the temperature of the screen body can greatly rise (for example, from 20 degrees to 50 degrees), and for NTE metal, the screen body can shrink when the temperature rises, and the size can not shrink because the screen body is fixed by glue, so that the whole screen body is under the action of compressive stress. Therefore, in a flattening and bending cycle, the average tensile stress borne by the material is reduced, and the fatigue resistance is improved.
In order to achieve the above object, the substrate of this embodiment is made of a material having a negative thermal expansion coefficient property (NTE), and during the use of the flexible display device, the temperature of the flexible display device increases greatly, and for the material having the NTE property, the temperature increases and shrinks, which generates a shrinkage stress.
Referring to fig. 2, in the present embodiment, the method for manufacturing the substrate base plate in the step S1 further includes the following steps:
s11, providing at least one compound, grinding the at least one compound into particles, and uniformly mixing to form a mixture;
s12, pressing the mixture into a preset shape, wherein the shape of the preset shape can be a block shape, a sheet shape or any shape which is convenient for forming the substrate base plate, and in the step, the substrate base plate can be formed by using a method such as calendaring or casting;
s13, sintering the mixture with a preset shape and cooling to room temperature, wherein the sintering temperature can be between 1000 and 1500 ℃;
and S14, repeating the grinding, briquetting, sintering and cooling processes in the steps S11-S13 for 1-5 times to finally obtain the substrate base plate.
In the present embodiment, the at least one compound may be an oxide of lanthanum, an oxide of iron, and an oxide of silicon, in which case the substrate base plate finally formed includes a lanthanum-iron-silicon (La-Fe-Si) alloy.
In this embodiment, the at least one compound may be an oxide of hafnium, an oxide of tantalum, and an oxide of iron, in which case the substrate base plate ultimately formed includes a hafnium-tantalum-iron (Hf-Ta-Fe) alloy.
In this embodiment, the at least one compound may be an oxide of manganese (Mn) and an oxide of nitrogen (N), in which case the substrate base plate eventually formed includes a manganese-nitrogen (Mn-N) compound.
In this embodiment, the at least one compound may be a compound of bismuth (Bi) or a compound of gallium (Ga), in which case the substrate base plate is finally formed to include the compound of bismuth (Bi) or the compound of gallium (Ga).
It should be noted that the substrate base plates with different thermal expansion coefficients can be realized by adjusting the element mass ratio among the at least one compound, for example, when the substrate base plate comprises La-Fe-Si alloy, the NTE value of the substrate base plate can reach-5 ppm/K to-25 ppm/K along with the increase of the Fe element mass ratio; when the substrate base plate comprises the Mn-N compound, the NTE value of the substrate base plate can reach-20 ppm/K along with the change of the element mass ratio between Mn and N; when the substrate base plate comprises Hf-Ta-Fe alloy, when the mass ratio of Ta in the whole alloy is 10-20%, the NTE value of the substrate base plate can reach-20 ppm/K, and the tests are all carried out under the condition of normal temperature (10-100 ℃), so that the real situation that the temperature of the substrate base plate rises when the flexible display device is unfolded for use can be reflected, and the element mass ratio can be adjusted according to the thermal expansion coefficient value required by the substrate base plate by a person skilled in the art after referring to the application.
In this embodiment, a material with NTE properties is added to a substrate, and the mass ratio of each element in the material with NTE properties is properly adjusted, so that the thermal expansion coefficient of the substrate at normal temperature (10 ℃ to 100 ℃) is smaller than 0, and therefore, when the temperature of the flexible display device is increased due to unfolding use, the substrate generates an inward contracting stress due to the temperature increase, which can cancel out the stress received by the substrate when the substrate is bent, so that the average stress received by the substrate in a flattening-bending cycle is reduced, and therefore, the fatigue resistance of the substrate is improved, and the situation that a display module above the substrate sags due to sagging of the substrate in a conventional flexible display device, which finally causes the bending area of the flexible display device, is avoided.
Second embodiment
Another embodiment of the present application also provides a flexible display device including:
a substrate base plate; and
the module functional layer is arranged on the substrate base plate;
the substrate comprises a material with negative thermal expansion coefficient property, the substrate and the module functional layer are fixed by using colloid, and the thermal expansion coefficient of the substrate is less than 0 when the temperature is within the range of 10-100 ℃.
Still further, the material of the substrate base plate may include lanthanum-iron-silicon (La-Fe-Si) alloy or hafnium-tantalum-iron (Hf-Ta-Fe) alloy.
Still further, the material of the substrate base plate may include a manganese-nitrogen (Mn — N) compound.
Further, the material of the substrate may include a compound of bismuth (Bi) or a compound of gallium (Ga), and in other embodiments, the material of the substrate may also include a metallic solid solution or a metallic glass containing bismuth (Bi) or gallium (Ga).
It should be noted that, other functional layers (such as a heat dissipation layer, a buffer layer, etc.) may also be formed on a surface of the substrate away from the functional layer of the film group, and the two functional layers are also fixed by a glue, which further ensures that the substrate is not deformed due to the stress of inward shrinkage when the temperature rises.
The flexible display device provided in this embodiment has similar technical features to the flexible display device manufactured by the method provided in the first embodiment, so that the same beneficial effects as those of the first embodiment can be produced.
In summary, the present application discloses a method for manufacturing a flexible display device and a flexible display device, and discloses a series of materials suitable for a flexible display device and having NTE properties, wherein a thermal expansion coefficient of a substrate prepared from the materials is less than 0 at a temperature ranging from 10 ℃ to 100 ℃, and the substrate is bonded with other functional layers by a colloid, so that the substrate does not sag downward due to bending in the use process of the flexible display device, thereby avoiding a technical problem that a module functional layer above the substrate sags downward due to sagging downward, and finally causing a bending region of the flexible display device to have a crease, and improving fatigue resistance of the substrate.
The foregoing is only a preferred embodiment of the present disclosure, and it should be noted that modifications and adaptations can be made by those skilled in the art without departing from the principle of the present disclosure, and should be considered as the scope of the present disclosure.
Claims (2)
1. A manufacturing method of a flexible display device is characterized by comprising the following steps:
s11, providing at least one compound, grinding the at least one compound into particles, and uniformly mixing to form a mixture;
s12, pressing the mixture into a preset shape;
s13, sintering the mixture with a preset shape and cooling to room temperature;
s14, repeating the steps S11-S13 for a plurality of times to obtain a substrate base plate; and
s2, manufacturing a module functional layer on the substrate;
the substrate base plate and the module functional layer are fixed by using a colloid, and when the temperature is in the range of 10-100 ℃, the thermal expansion coefficient of the substrate base plate is less than 0;
wherein the at least one compound is an oxide of lanthanum, an oxide of iron, and an oxide of silicon; or
The at least one compound is an oxide of hafnium, an oxide of tantalum, and an oxide of iron; or
The at least one compound is a compound of bismuth;
the mass ratio of the compounds of the material of the substrate base plate is adjusted according to the bending stress of the substrate base plate during bending, so that the bending stress of the substrate base plate during bending and the shrinkage stress of the material of the substrate base plate are neutralized.
2. A flexible display device, comprising:
a base substrate; and
the module functional layer is arranged on the substrate base plate;
the substrate comprises a material with negative thermal expansion coefficient property, the substrate and the module functional layer are fixed by using a colloid, and the thermal expansion coefficient of the substrate is less than 0 when the temperature is in the range of 10-100 ℃; the substrate base plate is made of lanthanum-iron-silicon alloy or hafnium-tantalum-iron alloy; or the substrate base plate comprises a compound of bismuth; the mass ratio of the compounds of the material of the substrate base plate is adjusted according to the bending stress of the substrate base plate during bending, so that the bending stress of the substrate base plate during bending and the shrinkage stress of the material of the substrate base plate are neutralized.
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| CN202110777061.9A CN113571556B (en) | 2021-07-09 | 2021-07-09 | Manufacturing method of flexible display device and flexible display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010029990A (en) * | 2008-07-29 | 2010-02-12 | National Institute Of Advanced Industrial & Technology | Negative thermal expansion coefficient material and composite material including the same |
| CN105752950A (en) * | 2016-02-05 | 2016-07-13 | 河北科技大学 | Intermetallic compound material with high-temperature negative thermal expansion performance and synthesis method thereof |
| CN106558279A (en) * | 2017-01-13 | 2017-04-05 | 京东方科技集团股份有限公司 | Flexible display apparatus and preparation method thereof |
| CN112384485A (en) * | 2018-07-31 | 2021-02-19 | 日本电气硝子株式会社 | Substrate for display and method for manufacturing same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013103867A (en) * | 2011-11-16 | 2013-05-30 | Nippon Electric Glass Co Ltd | Glass for resin-glass composite transparent substrate |
| CN108598217A (en) * | 2018-04-26 | 2018-09-28 | 上海空间电源研究所 | A kind of preparation method of the slim gallium arsenide solar cell of stress equilibrium |
| CN109638154B (en) * | 2018-12-17 | 2023-02-28 | 湖北大学 | Flexible gate tube device based on hafnium-titanium-oxygen composite film and preparation method thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010029990A (en) * | 2008-07-29 | 2010-02-12 | National Institute Of Advanced Industrial & Technology | Negative thermal expansion coefficient material and composite material including the same |
| CN105752950A (en) * | 2016-02-05 | 2016-07-13 | 河北科技大学 | Intermetallic compound material with high-temperature negative thermal expansion performance and synthesis method thereof |
| CN106558279A (en) * | 2017-01-13 | 2017-04-05 | 京东方科技集团股份有限公司 | Flexible display apparatus and preparation method thereof |
| CN112384485A (en) * | 2018-07-31 | 2021-02-19 | 日本电气硝子株式会社 | Substrate for display and method for manufacturing same |
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