CN113540201B - Display substrate and display device - Google Patents
Display substrate and display device Download PDFInfo
- Publication number
- CN113540201B CN113540201B CN202110818067.6A CN202110818067A CN113540201B CN 113540201 B CN113540201 B CN 113540201B CN 202110818067 A CN202110818067 A CN 202110818067A CN 113540201 B CN113540201 B CN 113540201B
- Authority
- CN
- China
- Prior art keywords
- partition
- substrate
- display
- display area
- encapsulation layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 144
- 238000005192 partition Methods 0.000 claims abstract description 207
- 238000004806 packaging method and process Methods 0.000 claims abstract description 20
- 238000005538 encapsulation Methods 0.000 claims description 64
- 239000002184 metal Substances 0.000 claims description 24
- 238000012546 transfer Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 95
- 238000000034 method Methods 0.000 description 26
- 230000008569 process Effects 0.000 description 16
- 238000002955 isolation Methods 0.000 description 11
- 238000005520 cutting process Methods 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- SQEHCNOBYLQFTG-UHFFFAOYSA-M lithium;thiophene-2-carboxylate Chemical compound [Li+].[O-]C(=O)C1=CC=CS1 SQEHCNOBYLQFTG-UHFFFAOYSA-M 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920006280 packaging film Polymers 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
- H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The display substrate and the display device provided by the present disclosure include: a substrate including a display region, and a non-display region adjacent to the display region; the inorganic packaging layer is positioned on the substrate base plate, completely covers the display area and extends from the display area to the non-display area; the plurality of mutually separated partition structures are positioned between the inorganic packaging layer and the substrate, and the partition structures are arranged around the display area or are arranged around the display area in the non-display area, wherein the structural parameters of at least one partition structure are different from those of other partition structures, so that the inorganic packaging layer is disconnected at the at least one partition structure and is continuously arranged at the other partition structures. Because the wrapping property of the partition structures with different structural parameters of the inorganic packaging layer is different, the inorganic packaging layer can be disconnected at the position of at least one partition structure, so that cracks can be limited to a non-display area, the cracks are prevented from being expanded to the display area, and the packaging reliability is improved.
Description
Technical Field
The disclosure relates to the technical field of display, in particular to a display substrate and a display device.
Background
Organic electroluminescent devices (OLEDs) represent a great potential for application as a new type of light emitting device in the display and lighting fields, and are therefore receiving great attention in academia and industry. In the display field, organic electroluminescent devices have advantages of self-luminescence, fast response, wide viewing angle, high brightness, bright color, light weight, etc., compared with liquid crystal display devices (LCDs), and are considered as a next generation display technology.
Disclosure of Invention
The embodiment of the disclosure provides a display substrate and a display device, which are used for improving packaging reliability.
Accordingly, a display substrate provided by an embodiment of the present disclosure includes:
a substrate including a display region, and a non-display region adjacent to the display region;
an inorganic encapsulation layer over the substrate, the inorganic encapsulation layer completely covering the display region and extending from the display region to the non-display region;
The plurality of mutually separated partition structures are positioned between the inorganic packaging layer and the substrate, and the partition structures are arranged around the display area or are arranged around the display area in the non-display area, wherein the structural parameters of at least one partition structure are different from those of other partition structures, so that the inorganic packaging layer is disconnected at the at least one partition structure and is continuously arranged at the other partition structures.
Optionally, in the foregoing display substrate provided by the embodiments of the present disclosure, the partition structure includes a first partition portion, a second partition portion, and a third partition portion that are sequentially disposed along a direction away from the substrate, and orthographic projections of the first partition portion and the third partition portion on the substrate respectively completely cover orthographic projections of the second partition portion on the substrate;
the distance from the edge of the orthographic projection of the third partition part of the at least one partition structure to the adjacent edge of the orthographic projection of the second partition part of the substrate is larger than the corresponding distance of the other partition structures.
Optionally, in the display substrate provided in the embodiment of the present disclosure, a difference between a distance from an edge of the orthographic projection of the third partition portion on the substrate to an adjacent edge of the orthographic projection of the second partition portion on the substrate and a corresponding distance in the other partition structures is greater than or equal to 1 μm.
Optionally, in the above display substrate provided by the embodiment of the present disclosure, a height of the second partition portion of the at least one partition structure in a direction perpendicular to the substrate is greater than a height of the second partition portion of the other partition structure in a direction perpendicular to the substrate.
Optionally, in the above display substrate provided in the embodiment of the present disclosure, a difference between a height of the second partition portion of the at least one partition structure in a direction perpendicular to the substrate and a height of the second partition portion of the other partition structure in a direction perpendicular to the substrate is greater than or equal to
Optionally, in the display substrate provided in the embodiment of the present disclosure, at least one of the other partition structures is located between the at least one partition structure and the display area.
Optionally, in the display substrate provided in the embodiment of the present disclosure, all of the other partition structures are located between the at least one partition structure and the display area.
Optionally, in the foregoing display substrate provided by the embodiments of the present disclosure, at least one of the other partition structures is located between the at least one partition structure and the display area, and the rest is located on a side of the at least one partition structure away from the display area.
Optionally, in the foregoing display substrate provided by the embodiments of the present disclosure, the inorganic encapsulation layer includes a first inorganic encapsulation layer and a second inorganic encapsulation layer that are stacked;
The display substrate further comprises an organic encapsulation layer positioned between the first inorganic encapsulation layer and the second inorganic encapsulation layer;
The organic encapsulation layer completely covers the display area and extends from the display area to the non-display area, and the organic encapsulation layer is disconnected at each partition structure.
Optionally, in the foregoing display substrate provided by the embodiment of the present disclosure, the method further includes: a transfer electrode located between the inorganic encapsulation layer and the substrate base plate in the display area, and an anode located between the transfer electrode and the inorganic encapsulation layer, the transfer electrode being electrically connected with the anode;
the partition structure and the switching electrode are arranged on the same layer and the same material.
Optionally, in the display substrate provided by the embodiment of the present disclosure, the non-display area is located around the display area, and the non-display area on one side of the display area includes a binding area;
in the non-display area including the binding area, the partition structure extends along the direction of the binding area pointing to the display area at two sides of the area between the binding area and the display area, and in other non-display areas, the partition structure is arranged around the display area.
Optionally, in the foregoing display substrate provided by the embodiments of the present disclosure, the shape of the display substrate is circular, elliptical, or heart-shaped.
Optionally, in the display substrate provided by the embodiment of the present disclosure, the display substrate further includes an insulating structure and an anode metal sequentially located on a side of the partition structure, which is away from the substrate, in the non-display area, wherein the anode metal contacts the partition structure through a through hole penetrating through the insulating structure.
Optionally, in the foregoing display substrate provided by the embodiment of the present disclosure, an orthographic projection of the anode metal on the substrate is located in an orthographic projection of the third partition portion on the substrate, and an orthographic projection of the insulating structure on the substrate is located in an orthographic projection of the anode metal on the substrate.
Based on the same inventive concept, the embodiment of the present disclosure provides a display device, including the above display substrate provided by the embodiment of the present disclosure.
The beneficial effects of the present disclosure are as follows:
The display substrate and the display device provided by the embodiment of the disclosure comprise a substrate, wherein the substrate comprises a display area and a non-display area adjacent to the display area; the inorganic packaging layer is positioned on the substrate base plate, completely covers the display area and extends from the display area to the non-display area; the plurality of separated partition structures are positioned between the inorganic packaging layer and the substrate, and the partition structures are arranged around the display area or around the display area in the non-display area, wherein the structural parameters of at least one partition structure are different from those of other partition structures, so that the inorganic packaging layer is disconnected at the position of at least one partition structure and is continuously arranged at the position of the other partition structure. Because each partition structure is positioned in the non-display area, and the envelopment of the partition structures with different structural parameters of the inorganic packaging layer is different, the inorganic packaging layer can be disconnected at the position of at least one partition structure with different structural parameters from other partition structures, so that cracks possibly generated in the cutting process can be limited in the non-display area, thereby effectively blocking the cracks from expanding to the display area, and further improving the packaging reliability.
Drawings
FIG. 1 is a schematic diagram of a display substrate in the related art;
FIGS. 2 and 3 are electron microscope diagrams of cracks generated in an inorganic encapsulation layer in the related art, respectively;
fig. 4 is a schematic structural diagram of a display substrate according to an embodiment of the disclosure;
FIG. 5 is a schematic view of a cross-sectional structure taken along line I-II in FIG. 4;
FIG. 6 is a schematic view of a second partition structure of FIG. 5;
FIG. 7 is a schematic view of the first partition structure of FIG. 5;
FIG. 8 is an electron micrograph of a batch deposited inorganic encapsulation layer of 2 μm thickness provided in an embodiment of the present disclosure;
FIG. 9 is an electron microscope image of an inorganic encapsulation layer deposited separately to a thickness of 1 μm provided by an embodiment of the present disclosure;
Fig. 10 is a schematic structural diagram of a display substrate according to an embodiment of the disclosure;
FIG. 11 is a schematic view of a cross-sectional structure taken along line V-VI in FIG. 10;
FIG. 12 is a schematic view of a further cross-sectional structure taken along line V-VI in FIG. 10;
FIG. 13 is a schematic view of a cross-sectional structure taken along line V-VI in FIG. 10;
FIG. 14 is a schematic view of a further cross-sectional structure taken along line V-VI in FIG. 10;
FIG. 15 is a schematic view of a cross-sectional structure taken along line III-IV in FIG. 3 or FIG. 10;
FIG. 16 is a schematic view of a further cross-sectional structure taken along line I-II in FIG. 4;
Fig. 17 is a flowchart of a method for manufacturing a display substrate according to an embodiment of the disclosure.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It should be noted that the dimensions and shapes of the various figures in the drawings do not reflect true proportions, and are intended to illustrate the present disclosure only. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like in the description and in the claims, are not used for any order, quantity, or importance, but are used for distinguishing between different elements. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. "inner", "outer", "upper", "lower", etc. are used merely to denote relative positional relationships, which may also change accordingly when the absolute position of the object to be described changes.
As shown in fig. 1, the encapsulation layer TFE is manufactured by using a metal Mask plate (Open Mask) with a conventional shape (for example, square shape) in the related art, so that the encapsulation layer TFE is larger than the shaped (for example, circular) substrate 01, and the encapsulation layer TFE exceeding the shaped substrate 01 is usually cut off by using a cutter wheel. However, in the cutting process of the cutter wheel, as shown in fig. 2 and 3, the inorganic packaging film layer (CVD) in the packaging layer TFE generates a Crack (ack), and water oxygen in the air or the like invades into the display area (AA) along the Crack, so that the packaging reliability of the special-shaped display product is seriously affected.
In order to solve at least the above problems in the related art, an embodiment of the present disclosure provides a display substrate, as shown in fig. 4 and 5, including:
A base substrate 101, the base substrate 101 including a display area AA, and a non-display area BB adjacent to the display area AA; specifically, fig. 4 shows that the non-display area BB surrounds the display area AA; in some embodiments, holes may be drilled in the display area AA to install a camera or the like at a location of the holes, where the location of the holes may be the non-display area BB, and the display area AA may surround the non-display area BB;
An inorganic encapsulation layer 102 located on the substrate 101, wherein the inorganic encapsulation layer 102 completely covers the display area AA and extends from the display area AA to the non-display area BB;
A plurality of isolating structures 103, which are separated from each other, are located between the inorganic encapsulation layer 102 and the substrate 101, and the isolating structures 103 are disposed around the display area AA or are disposed around the display area AA in the non-display area BB, wherein structural parameters of at least one isolating structure 103 are different from structural parameters of other isolating structures 103, so that the inorganic encapsulation layer 102 is disposed at the at least one isolating structure 103 in a disconnected manner, and is disposed at the other isolating structures 103 in a continuous manner. For convenience of explanation, each of the above-described at least one partition structure 103 will be referred to as a first partition structure 1031, and each of the above-described other partition structures 103 will be referred to as a second partition structure 1032.
In the display substrate provided by the embodiment of the present disclosure, since each partition structure 103 is located in the non-display area BB and the envelopment of the first partition structure 1031 and the second partition structure 1032 with different structural parameters of the inorganic encapsulation layer 102 are different, the inorganic encapsulation layer 102 may be disconnected at the first partition structure 1031 and continuous at the second partition structure 1032, so that the possible cracks generated in the cutting process may be limited to the non-display area BB, thereby effectively blocking the cracks from expanding to the display area AA, and further improving the encapsulation reliability and the cutting yield. In addition, the cutting stress does not influence the packaging reliability, so that the requirements on a cutting area and a cutting process are reduced, and a cutting window is improved. Carrying out
In some embodiments, in the above display substrate provided in the embodiments of the present disclosure, as shown in fig. 5 to 7, the partition structure 103 may include a first partition 31, a second partition 32, and a third partition 33 sequentially disposed along a direction Z away from the substrate 101, and front projections of the first partition 31 and the third partition 33 on the substrate 101 completely cover front projections of the second partition 32 on the substrate 101, respectively, such that the partition structure 103 appears as an "i" shape (RIB); in some embodiments, the structural parameters of the partition structure 103 may include a distance (also referred to as Tip) from an edge of the orthographic projection of the third partition 33 of the partition structure 103 on the substrate 101 to an adjacent edge of the orthographic projection of the second partition 32 on the substrate 101, and in particular, in order to effectively partition the inorganic encapsulation layer 102, a distance w1 from the edge of the orthographic projection of the third partition 33 of the first partition structure 1031 on the substrate 101 to the adjacent edge of the orthographic projection of the second partition 32 on the substrate 101 may be set to be greater than a corresponding distance w2 of the second partition structure 1032.
In some embodiments, the difference between the distance w1 of the adjacent edge of the orthographic projection of the third partition 33 of the first partition structure 1031 to the orthographic projection of the second partition 32 on the substrate 101 and the corresponding distance w 2in the second partition structure 1032 (i.e., w1-w 2) may be greater than or equal to 1 μm. Illustratively, the distance w2 from the edge of the front projection of the third partition 33 of the second partition structure 1032 to the adjacent edge of the front projection of the second partition 32 on the substrate 101 is in the range of 0.03 μm to 0.05 μm, and the distance w1 from the edge of the front projection of the third partition 33 of the first partition structure 1031 to the adjacent edge of the front projection of the second partition 32 on the substrate 101 may be in the range of 1.03 μm to 1.05 μm.
In some embodiments, in the above display substrate provided in the embodiments of the present disclosure, as shown in fig. 5 to 7, the structural parameter of the partition structure 103 may include a height of the second partition portion 32 of the partition structure 1031 in the direction Z perpendicular to the substrate 101, and in particular, in order to effectively partition the inorganic encapsulation layer 102, a height h1 of the second partition portion 32 of the first partition structure 1031 in the direction Z perpendicular to the substrate 101 may be set to be greater than a height h2 of the second partition portion 32 of the second partition structure 1032 in the direction Z perpendicular to the substrate 101.
In some embodiments, the difference between the height h1 of the second partition 32 of the first partition structure 1031 in the direction Z perpendicular to the base substrate 101 and the height h2 of the second partition 32 of the second partition structure 1032 in the direction Z perpendicular to the base substrate 101 (i.e., h1-h 2) may be greater than or equal toIllustratively, the height h2 of the second partition 32 of the second partition structure 1032 in the direction Z perpendicular to the base substrate 101 may be/>The second partition 32 of the height h1 of the first partition structure 1031 may be greater than or equal to/>, in the direction Z perpendicular to the base substrate 101
In the present disclosure, at least one of the height h1 of the second partition portion 32 of the first partition structure 1031 in the direction Z perpendicular to the substrate 101 and the distance w1 between the edge of the orthographic projection of the third partition portion 33 of the first partition structure 1031 on the substrate 101 and the adjacent edge of the orthographic projection of the second partition portion 32 on the substrate 101 satisfies the above condition, that is, the inorganic encapsulation layer 102 may be partitioned. However, the inventors found that the thickness and the number of depositions of the inorganic encapsulation layer 102 have a certain influence on the blocking effect in process verification, and the thicker the inorganic encapsulation layer 102 is, the more the number of depositions is, the better the coating and coverage of the blocking structure 103 is, and the less likely the inorganic encapsulation layer is to break, as shown in fig. 8 and 9. Specifically, electron microscope (SEM) images of batch deposition of 2 μm batches of inorganic encapsulation layer 102 and individual deposition of 1 μm of inorganic encapsulation layer 102 are shown in fig. 8 and 9, respectively. Therefore, in the embodiment, in order to separate the inorganic encapsulation layer 102, the height h1 of the second separation portion 32 of the first separation structure 1031 in the direction Z perpendicular to the substrate 101 and the distance w1 between the edge of the orthographic projection of the third separation portion 33 of the first separation structure 1031 on the substrate 101 and the adjacent edge of the orthographic projection of the second separation portion 32 on the substrate 101 may be flexibly adjusted according to the thickness and the number of deposition times of the inorganic encapsulation layer 102. Specifically, the height h1 of the second partition 32 of the first partition structure 1031 in the direction Z perpendicular to the substrate 101 and/or the adjacent edge distance w1 of the orthographic projection of the third partition 33 of the first partition structure 1031 to the edge of the orthographic projection of the second partition 32 to the substrate 101 of the substrate 101 increases with the increase in the thickness of the inorganic encapsulation layer 102 and the increase in the number of depositions, that is, the height h1 of the second partition 32 of the first partition structure 1031 in the direction Z perpendicular to the substrate 101 and/or the adjacent edge distance w1 of the orthographic projection of the third partition 33 of the first partition structure 1031 to the edge of the second partition 32 to the orthographic projection of the substrate 101 are in positive correlation with the thickness and the number of depositions of the inorganic encapsulation layer 102.
In some embodiments, since the location of the first partition structure 1031 is the partition location of the inorganic encapsulation layer 102, in order to avoid the inorganic encapsulation layer 102 being partitioned from being too close to the display area AA and causing the package failure, at least one of the second partition structures 1032 may be disposed between the first partition structure 1031 and the display area AA, as shown in fig. 5, 10 to 12. Alternatively, as shown in fig. 5 and 11, the second partition structure 1032 is entirely located between the first partition structure 1031 and the display area AA; alternatively, as shown in fig. 12, a portion of the second partition structures 1032 is located between the first partition structure 1031 and the display area AA, and the remaining second partition structures 1032 are located on a side of the first partition structure 1031 away from the display area AA.
Since the inorganic encapsulation layer 102 is continuously disposed in the region between the partition structure 103 and the display area AA, when the region between the partition structure 103 and the display area AA is large, even if the inorganic encapsulation layer 102 breaks at one partition structure 103 closest to the display area AA, a good encapsulation effect of the inorganic encapsulation layer 102 can be ensured. Based on this, in some embodiments, as shown in fig. 13 and 14, when the minimum distance d1 between the partition structure 103 and the display area AA is greater than the minimum distance d2 between the partition structure 1031 and the display area AA in fig. 11 and 12, it may be provided that at least part of the higher first partition structure 1031 intersects the lower second partition structure 1032 closer to the display area AA.
In some embodiments, in the above-described display substrate provided in the embodiments of the present disclosure, as shown in fig. 5, the inorganic encapsulation layer 102 includes a first inorganic encapsulation layer 1021 and a second inorganic encapsulation layer 1022 that are stacked; the display substrate may further include an organic encapsulation layer 104 between the first inorganic encapsulation layer 1021 and the second inorganic encapsulation layer 1022; the organic encapsulation layer 104 completely covers the display area AA and extends from the display area AA to the non-display area BB, and the organic encapsulation layer 104 is provided at each partition structure 103 (including all the first partition structures 1031 and all the second partition structures 1032) to enhance the encapsulation effect.
In some embodiments, in the foregoing display substrate provided in the embodiments of the present disclosure, as shown in fig. 15, the method may further include: and a switching electrode 105 located between the inorganic package layer 102 and the substrate 101 in the display area AA, and an anode 106 located between the switching electrode 105 and the inorganic package layer 102, wherein the switching electrode 105 is electrically connected with the anode 106, and the isolation structure 103 and the switching electrode 105 are arranged in the same layer and the same material so as to reduce the number of film layers and mask times.
In this disclosure, "the same layer" refers to a layer structure formed by forming a film layer for forming a specific pattern by the same film forming process and then forming the film layer by one patterning process using the same mask plate. I.e., one patterning process corresponds to one mask, also known as a reticle. Depending on the particular pattern, a patterning process may include multiple exposure, development, or etching processes, and the particular patterns in the formed layer structure may be continuous or discontinuous, and may be at the same height or have the same thickness, or may be at different heights or have different thicknesses.
In addition, as shown in fig. 5 and 15, the switching electrode 105 is specifically used to connect the transistor 107 and the anode 106. The display substrate may further include: a buffer layer 108, a first gate insulating layer 109, a second gate insulating layer 110, a capacitor 111, an interlayer dielectric layer 112, a first insulating layer 113, a first planarization layer 114, a second insulating layer 115, a second planarization layer 116, a pixel definition layer 117, a light emitting function layer 118, a cathode 119, a Filler layer (Filler) 120, a package Dam (Dam) 121, a protective Cover (cap) 122, and the like.
In some embodiments, in the display substrate provided by the embodiments of the present disclosure, as shown in fig. 4, the non-display area BB is located around the display area AA, and the non-display area BB on one side of the display area AA includes the binding area PB; in the non-display region BB (e.g., lower non-display region) including the binding region PB, the partition structure 103 extends along a direction Y in which the binding region PB points to the display region AA on both sides of the region between the binding region PB and the display region AA, and in the other non-display regions BB (e.g., left, right, and upper non-display regions), the partition structure 103 is disposed around the display region AA. By the arrangement, the signal wires in the display substrate can be electrically connected with the driving chips (ICs) of the binding areas PB in the area between the parts of the partition structure 103 extending along the direction Y, so that overlapping of the signal wires and the partition structure 103 is avoided, coupling capacitance on the signal wires is reduced, and improvement of display effects is facilitated.
In some embodiments, in the above display substrate provided in the embodiments of the present disclosure, the shape of the display substrate may be a circular shape, an elliptical shape, or a heart shape, which is not limited herein.
In some embodiments, in the display substrate provided in the embodiments of the present disclosure, as shown in fig. 16, the insulating structure 115 'and the anode metal 106' that are sequentially located on a side of the partition structure 103 away from the substrate 101 in the non-display area BB may be further included, where the anode metal 106 'is in contact with the partition structure 103 through a through hole penetrating through the insulating structure 115'. In particular, the anode metal 106' in the non-display area BB and the anode 106 in the display area AA are fabricated by the same masking process. The insulating structure 115' is a remaining pattern of the second insulating layer 115 in the non-display area AA.
In some embodiments, the orthographic projection of the anode metal 106' on the substrate 101 may be located within the orthographic projection of the third partition 33 on the substrate 101, and the orthographic projection of the insulating structure 115' on the substrate 101 is located within the orthographic projection of the anode metal 106' on the substrate 101, so that the partition structure 103 located under the anode metal 106' and the insulating structure 115' is fabricated in an "i" shape.
In addition, the present disclosure further provides a method for manufacturing the display substrate, and for convenience of understanding, only the manufacturing of the partition structure 103 is described below, and the manufacturing process of each component in the display area AA may refer to related technologies, which are not described herein.
Specifically, as shown in fig. 17, the method for manufacturing the display substrate may include the following steps:
The first step: the buffer layer 108, the first gate insulating layer 109, the first gate metal layer 123 where the first electrode of the capacitor 111 is located, the second gate metal layer 124 where the second electrode of the capacitor 111 is located, the interlayer dielectric layer 112 having a first via hole in the design area of the isolation structure 103, the first conductive structure 125 located in the design area of the isolation structure 103 and being the same layer as the source of the transistor 106, the first insulating layer 113 having a second via hole in the design area of the isolation structure 103, and the second conductive structure 103 'having a same layer as the transfer electrode and being the same material in this order are formed in the non-display area BB of the substrate 101, wherein the first conductive structure 125 is electrically connected to the second gate metal layer 124 through the first via hole, and the second conductive structure 103' is electrically connected to the first conductive structure 125 through the second via hole.
And a second step of: a second insulating layer 115 is formed on the layer where the second conductive structure 103 'is located, and a third via is formed in the second insulating layer 115 in the middle region of the second conductive structure 103'.
And a third step of: an anode metal 106' is formed in the design area of the isolation structure 103 such that the anode metal 106' is electrically connected to the second conductive structure 103' through the third via. Of course, since the partition structure 103 is located in the non-display area BB, and the non-display area BB does not have a display function, the anode metal 106' in the design area of the partition structure 103 may be optional, and is not particularly limited.
Fourth step: the second insulating layer 115 over the second conductive structure 103 'is etched away by a dry etching process, leaving the second insulating layer 115 shielded by the anode metal 106, obtaining an insulating structure 115'. Then, the metal of the second conductive structure 103' is laterally etched by a wet etching process, so as to obtain an i-shaped partition structure 103. In a specific implementation, the isolation structures 103 with different heights can be obtained by forming the second conductive structures 103' with different thicknesses, and the distance that the third isolation portion 33 in the isolation structures 103 exceeds the second isolation portion 32 on one side can be controlled by adjusting the time of wet etching or the like, so as to obtain the first isolation structure 1031 and the second isolation structure 1032 with different specifications. Or the first partition structure 1031 and the second partition structure 1032 with different specification requirements can be manufactured respectively. Since the "i" shaped partition structure 103 is similar to the process of manufacturing the "i" shaped metal parts in the related art, it will not be described in detail herein.
In the foregoing manufacturing method provided by the embodiment of the present disclosure, the patterning process involved in forming each layer of structure may include not only a part or all of the process procedures of deposition, photoresist coating, mask masking, exposure, development, etching, photoresist stripping, and the like, but also other process procedures, specifically, the process of forming a pattern of a desired pattern in an actual manufacturing process is not limited herein. For example, a post bake process may also be included after development and before etching.
The deposition process may be a chemical vapor deposition method, a plasma enhanced chemical vapor deposition method or a physical vapor deposition method, which is not limited herein; the Mask used in the Mask process may be a Half Tone Mask (Half Tone Mask), a single slit diffraction Mask (SINGLE SLIT MASK) or a Gray Tone Mask (Gray Tone Mask), which are not limited herein; the etching may be dry etching or wet etching, and is not limited herein.
Based on the same inventive concept, the embodiment of the disclosure also provides a display device, which comprises the display substrate provided by the embodiment of the disclosure. Since the principle of the display device for solving the problems is similar to that of the display substrate, the implementation of the display device can refer to the embodiment of the display substrate, and the repetition is omitted.
In some embodiments, the display device may be: any product or component with display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, a smart watch, a body-building wristband, a personal digital assistant, and the like. The display device includes, but is not limited to: the system comprises a radio frequency unit, a network module, an audio output and input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, a power supply and the like. In addition, it will be understood by those skilled in the art that the above structures do not constitute limitations of the above display device provided by the embodiments of the present disclosure, in other words, more or fewer components described above may be included in the above display device provided by the embodiments of the present disclosure, or certain components may be combined, or different arrangements of components may be provided.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present disclosure without departing from the spirit or scope of the disclosure. Thus, the present disclosure is intended to include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. A display substrate, comprising:
a substrate including a display region, and a non-display region adjacent to the display region;
an inorganic encapsulation layer over the substrate, the inorganic encapsulation layer completely covering the display region and extending from the display region to the non-display region;
A plurality of mutually separated partition structures positioned between the inorganic packaging layer and the substrate, wherein the partition structures are arranged around the display area in the non-display area or are arranged around the display area, and the structural parameters of at least one partition structure are different from those of other partition structures, so that the inorganic packaging layer is disconnected at the at least one partition structure and is continuously arranged at the other partition structures;
The partition structure comprises a first partition part, a second partition part and a third partition part which are sequentially arranged along the direction far away from the substrate, wherein the orthographic projections of the first partition part and the third partition part on the substrate respectively completely cover the orthographic projections of the second partition part on the substrate;
The distance from the edge of the orthographic projection of the third partition part of the at least one partition structure to the adjacent edge of the orthographic projection of the second partition part of the substrate is larger than the corresponding distance of the other partition structures;
The height of the second partition part of the at least one partition structure in the direction vertical to the substrate is larger than the height of the second partition parts of the other partition structures in the direction vertical to the substrate;
a difference between a distance from an edge of the orthographic projection of the third partition portion on the substrate to an adjacent edge of the orthographic projection of the second partition portion on the substrate in the at least one partition structure and a corresponding distance in the other partition structures is greater than or equal to 1 μm;
the difference between the height of the second partition portion of the at least one partition structure in the direction perpendicular to the substrate and the height of the second partition portion of the other partition structure in the direction perpendicular to the substrate is greater than or equal to
The non-display area is positioned around the display area, and the non-display area at one side of the display area comprises a binding area; in the non-display area including the binding area, the partition structure extends along the direction of the binding area pointing to the display area at two sides of the area between the binding area and the display area, and in other non-display areas, the partition structure is arranged around the display area.
2. The display substrate of claim 1, wherein at least one of the other partition structures is located between the at least one partition structure and the display area.
3. The display substrate of claim 1, wherein all of the other partition structures are located between the at least one partition structure and the display area.
4. The display substrate of claim 1, wherein at least one of the other partition structures is located between the at least one partition structure and the display area, and the remainder is located on a side of the at least one partition structure remote from the display area.
5. The display substrate of claim 1, wherein the inorganic encapsulation layer comprises a first inorganic encapsulation layer and a second inorganic encapsulation layer disposed in a stack;
The display substrate further comprises an organic encapsulation layer positioned between the first inorganic encapsulation layer and the second inorganic encapsulation layer;
The organic encapsulation layer completely covers the display area and extends from the display area to the non-display area, and the organic encapsulation layer is disconnected at each partition structure.
6. The display substrate of claim 1, further comprising: a transfer electrode located between the inorganic encapsulation layer and the substrate base plate in the display area, and an anode located between the transfer electrode and the inorganic encapsulation layer, the transfer electrode being electrically connected with the anode;
the partition structure and the switching electrode are arranged on the same layer and the same material.
7. The display substrate of claim 1, wherein the display substrate is circular, elliptical, or heart-shaped in shape.
8. The display substrate of claim 1, further comprising an insulating structure and an anodic metal positioned in the non-display region in sequence on a side of the partition structure facing away from the substrate, wherein the anodic metal is in contact with the partition structure through a via penetrating the insulating structure.
9. The display substrate of claim 8, wherein an orthographic projection of the anode metal on the substrate is within an orthographic projection of the third partition on the substrate, and wherein an orthographic projection of the insulating structure on the substrate is within an orthographic projection of the anode metal on the substrate.
10. A display device comprising a display substrate according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110818067.6A CN113540201B (en) | 2021-07-20 | 2021-07-20 | Display substrate and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110818067.6A CN113540201B (en) | 2021-07-20 | 2021-07-20 | Display substrate and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113540201A CN113540201A (en) | 2021-10-22 |
| CN113540201B true CN113540201B (en) | 2024-04-23 |
Family
ID=78100384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110818067.6A Active CN113540201B (en) | 2021-07-20 | 2021-07-20 | Display substrate and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113540201B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116584175A (en) * | 2021-10-29 | 2023-08-11 | 京东方科技集团股份有限公司 | Display panel motherboard, display panel and display device |
| CN116249378A (en) * | 2021-11-24 | 2023-06-09 | 京东方科技集团股份有限公司 | Display panel and display device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107591498A (en) * | 2017-08-31 | 2018-01-16 | 京东方科技集团股份有限公司 | OLED display panel and preparation method thereof, OLED display |
| CN108649141A (en) * | 2018-05-14 | 2018-10-12 | 云谷（固安）科技有限公司 | display screen and preparation method thereof |
| CN109802052A (en) * | 2019-01-25 | 2019-05-24 | 上海天马微电子有限公司 | A kind of organic light emitting display panel and preparation method thereof |
| CN111146211A (en) * | 2020-01-02 | 2020-05-12 | 京东方科技集团股份有限公司 | Substrate to be cut, display panel and micro display chip |
| CN111384069A (en) * | 2020-03-25 | 2020-07-07 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display panel |
| CN111816665A (en) * | 2020-06-29 | 2020-10-23 | 合肥维信诺科技有限公司 | Display panel and display device |
| CN111933822A (en) * | 2020-08-20 | 2020-11-13 | 昆山国显光电有限公司 | Display panel manufacturing method, display panel and display device |
| CN112599701A (en) * | 2020-12-14 | 2021-04-02 | 合肥维信诺科技有限公司 | Display substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210028790A (en) * | 2019-09-04 | 2021-03-15 | 삼성디스플레이 주식회사 | Display apparatus and method of manufacturing the same |
-
2021
- 2021-07-20 CN CN202110818067.6A patent/CN113540201B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107591498A (en) * | 2017-08-31 | 2018-01-16 | 京东方科技集团股份有限公司 | OLED display panel and preparation method thereof, OLED display |
| CN108649141A (en) * | 2018-05-14 | 2018-10-12 | 云谷（固安）科技有限公司 | display screen and preparation method thereof |
| CN109802052A (en) * | 2019-01-25 | 2019-05-24 | 上海天马微电子有限公司 | A kind of organic light emitting display panel and preparation method thereof |
| CN111146211A (en) * | 2020-01-02 | 2020-05-12 | 京东方科技集团股份有限公司 | Substrate to be cut, display panel and micro display chip |
| CN111384069A (en) * | 2020-03-25 | 2020-07-07 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display panel |
| CN111816665A (en) * | 2020-06-29 | 2020-10-23 | 合肥维信诺科技有限公司 | Display panel and display device |
| CN111933822A (en) * | 2020-08-20 | 2020-11-13 | 昆山国显光电有限公司 | Display panel manufacturing method, display panel and display device |
| CN112599701A (en) * | 2020-12-14 | 2021-04-02 | 合肥维信诺科技有限公司 | Display substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113540201A (en) | 2021-10-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111276496B (en) | Display back plate and display device | |
| US20200328267A1 (en) | Flexible display panel and manufacturing method thereof | |
| CN112186023B (en) | Display substrate, preparation method thereof and display device | |
| CN110246879B (en) | Organic light-emitting display panel and device | |
| CN113540201B (en) | Display substrate and display device | |
| US20240099053A1 (en) | Display substrate and method for manufacturing the same, display device | |
| US20230209974A1 (en) | Manufacturing method for display panel, display panel, and display device | |
| CN110112317A (en) | Display device, flexible display panels and its manufacturing method | |
| WO2021022594A1 (en) | Array substrate, display panel, and manufacturing method of array substrate | |
| CN109671722B (en) | Organic light emitting diode array substrate and manufacturing method thereof | |
| US11968872B2 (en) | Display substrate including first and second corner display regions having different layer thickness and hole regions | |
| WO2021238926A1 (en) | Display substrate and manufacturing method therefor, display panel, and display device | |
| CN110867475A (en) | Electroluminescent display substrate, preparation method thereof and electroluminescent display device | |
| CN114628405A (en) | Display substrate, manufacturing method thereof and display device | |
| US20230325042A1 (en) | Touch module and display device | |
| CN113725232A (en) | Display substrate, manufacturing method thereof and display device | |
| CN111293155B (en) | Display substrate, preparation method thereof and display device | |
| CN109742118B (en) | Display panel, array substrate and preparation method thereof | |
| CN109801948B (en) | Flexible display panel, preparation method thereof and flexible display device | |
| CN109671724B (en) | Light-emitting panel and display device | |
| US20240057449A1 (en) | Display panel and display device | |
| CN111969128B (en) | OLED display substrate, manufacturing method thereof and display device | |
| EP3993080A1 (en) | Display panel and manufacturing method therefor, and display device | |
| CN110783275B (en) | Display substrate, preparation method thereof and display device | |
| CN114122029A (en) | Display panel, manufacturing method thereof and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |