CN113540118A - Display device - Google Patents
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- CN113540118A CN113540118A CN202010234792.4A CN202010234792A CN113540118A CN 113540118 A CN113540118 A CN 113540118A CN 202010234792 A CN202010234792 A CN 202010234792A CN 113540118 A CN113540118 A CN 113540118A
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- 239000000758 substrate Substances 0.000 claims abstract description 114
- 230000003287 optical effect Effects 0.000 claims abstract description 82
- 230000000903 blocking effect Effects 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 230000000873 masking effect Effects 0.000 claims 2
- 239000011521 glass Substances 0.000 abstract description 11
- 238000002310 reflectometry Methods 0.000 abstract description 9
- 230000007547 defect Effects 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 6
- 230000001678 irradiating effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 2
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- MDPILPRLPQYEEN-UHFFFAOYSA-N aluminium arsenide Chemical compound [As]#[Al] MDPILPRLPQYEEN-UHFFFAOYSA-N 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
- H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a display device which comprises a pixel array, at least one flexible substrate and at least one optical shielding layer. The flexible substrate is located below the pixel array. The optical shielding layer is positioned between the flexible substrate and the pixel array. The optical shielding layer comprises a first sublayer and a second sublayer. The first sub-layer is located between the second sub-layer and the flexible substrate, and the refractive index of the first sub-layer is different from the refractive index of the second sub-layer. Since the optical shielding layer includes the first sub-layer and the second sub-layer having different refractive indexes, it may have a high reflectivity. By arranging the optical shielding layer with high reflectivity between the pixel array and the flexible substrate, the problem that the pixel array is damaged by laser due to the defect of the flexible substrate when the flexible substrate is separated from the glass substrate by the laser can be avoided.
Description
Technical Field
The present invention relates to a display device, and more particularly, to a flexible display device.
Background
In the manufacturing process of a flexible display device, laser irradiation is performed to weaken the adhesive force between the flexible substrate and the glass substrate, thereby separating the flexible substrate from the glass substrate. However, defects in the flexible substrate may cause laser light to impinge on the pixel array, thereby damaging the pixel array. Therefore, how to provide a display device capable of preventing laser from irradiating on the pixel array is still one of the directions in which research is needed
Disclosure of Invention
An object of the present invention is to provide a display device, which can prevent a pixel array from being damaged by laser light due to a defect of a flexible substrate when the flexible substrate and a glass substrate are separated by the laser light.
In some embodiments, a display device includes a pixel array, at least one flexible substrate, and at least one optical shielding layer. The flexible substrate is located below the pixel array. The optical shielding layer is positioned between the flexible substrate and the pixel array. The optical shielding layer comprises a first sublayer and a second sublayer. The first sub-layer is located between the second sub-layer and the flexible substrate, and the refractive index of the first sub-layer is different from the refractive index of the second sub-layer.
In some embodiments, a perpendicular projection of the optical shielding layer on the flexible substrate overlaps a perpendicular projection of the entire pixel array on the flexible substrate.
In some embodiments, the optical shielding layer covers the entire flexible substrate.
In some embodiments, the optical shielding layer directly contacts the flexible substrate.
In some embodiments, the display device further comprises a water-vapor blocking layer between the pixel array and the optical shielding layer, and the optical shielding layer covers an entire lower surface of the water-vapor blocking layer.
In some embodiments, a perpendicular projection of the optical obscuring layer on the flexible substrate overlaps a perpendicular projection of the entire water-gas resistant layer on the flexible substrate.
In some embodiments, the number of the flexible substrates is two, the display device further includes a water-gas blocking layer between the pixel array and one of the two flexible substrates, and the two flexible substrates are respectively located at two opposite sides of the optical shielding layer.
In some embodiments, a perpendicular projection of the optical obscuring layer on the other flexible substrate overlaps a perpendicular projection of the entire flexible substrate between the water and air blocking layer and the optical obscuring layer on the other flexible substrate.
In some embodiments, a perpendicular projection of the optical shielding layer on the other flexible substrate overlaps a perpendicular projection of the entire water-gas resistant layer on the other flexible substrate.
In some embodiments, the optical shielding layer includes a plurality of first sub-layers and a plurality of second sub-layers, and the first sub-layers and the second sub-layers are staggered.
In the above embodiments, since the optical shielding layer includes the first sub-layer and the second sub-layer having different refractive indexes, it can have a high reflectivity. By arranging the optical shielding layer with high reflectivity between the pixel array and the flexible substrate, the problem that the pixel array is damaged by laser due to the defect of the flexible substrate when the flexible substrate is separated from the glass substrate by the laser can be avoided.
Drawings
Fig. 1 is a cross-sectional view of a display device according to an embodiment of the invention.
FIG. 2 is a cross-sectional view of the display device of FIG. 1 during a fabrication process.
Fig. 3 is a cross-sectional view of a display device according to another embodiment of the invention.
Fig. 4 is a cross-sectional view of a display device according to another embodiment of the invention.
FIG. 5 is a cross-sectional view of a display device according to another embodiment of the invention.
Description of the main reference numerals:
100,100a,100b,100 c-display device, 110-pixel array, 112-gate, 114-dielectric layer, 116-channel layer, 118-source/drain, 120 a-optical shielding layer, 122-first sublayer, 124-second sublayer, 126-interface, 130, 150-flexible substrate, 140-water-gas-blocking layer, 142-lower surface, 200-glass substrate, L-laser, OP-aperture.
Detailed Description
In the following description, numerous implementation details are set forth in order to provide a thorough understanding of the present invention. It should be understood, however, that these implementation details are not to be interpreted as limiting the invention. That is, in some embodiments of the invention, such implementation details are not necessary. In addition, for the sake of simplicity, some conventional structures and elements are shown in the drawings in a simple schematic manner. And the thickness of layers and regions in the drawings may be exaggerated for clarity, and the same reference numerals denote the same elements in the description of the drawings.
Fig. 1 is a cross-sectional view of a display device 100 according to an embodiment of the invention. The display device 100 includes a pixel array 110, an optical shielding layer 120, and a flexible substrate 130. The flexible substrate 130 is located below the pixel array 110 and the optical shielding layer 120. The optical shielding layer 120 is located between the flexible substrate 130 and the pixel array 110, that is, the flexible substrate 130 is located on a side of the optical shielding layer 120 opposite to the pixel array 110. The optical shielding layer 120 includes a first sublayer 122 and a second sublayer 124. The first sub-layer 122 is located between the second sub-layer 124 and the flexible substrate 130, and the refractive index of the first sub-layer 122 is smaller than that of the second sub-layer 124. In other words, the layer having the smaller refractive index is located on the side close to the flexible substrate 130.
In the present embodiment, the material of the flexible substrate 130 may be Polyimide (PI), and the display device 100 has flexibility. The thickness of the flexible substrate 130 is, for example, in the range of about 5 to 45 micrometers, but the invention is not limited thereto.
The optical shielding layer 120 may be designed according to the principle of Distributed Bragg Reflector (DBR). For example, in the present embodiment, the material of the first sub-layer 122 is Silicon Dioxide (SiO 2), and the refractive index is about 1.45-1.6. The material of the second sub-layer 124 is Titanium Dioxide (TiO 2) and has a refractive index of about 2.4-2.7. The materials and refractive indexes of the first sub-layer 122 and the second sub-layer 124 are merely examples, and the invention is not limited thereto. The optical shielding layer 120 can reflect light from an interface 126 between the first sublayer 122 and the second sublayer 124 through the difference between the refractive index of the first sublayer 122 and the refractive index of the second sublayer 124. The reflectivity of the interface 126 depends on the difference between the refractive indices of the first sub-layer 122 and the second sub-layer 124, and thus increases the reflectivity of the entire optical shielding layer 120. In this way, by disposing the optical shielding layer 120 with high reflectivity between the flexible substrate 130 and the pixel array 110, the optical shielding layer 120 can reflect light from the side of the flexible substrate 130 to protect the pixel array 110 above.
In some embodiments, the materials of the first sub-layer 122 and the second sub-layer 124 may also be silicon dioxide and niobium pentoxide (Nb 2O5), respectively, wherein the refractive index of the niobium pentoxide is about 2.5-3. In some embodiments, the material for the first sub-layer 122 having a relatively low refractive index may include an optical coating dielectric material for making a low refractive index, such as Magnesium fluoride (MgF 2) or calcium fluoride (CaF 2), but the invention is not limited thereto. The material for the second sub-layer 124 having a relatively high refractive index may include a material suitable for fabricating a high refractive index optical coating dielectric, such as Zinc selenide (ZnSe), Silicon Nitride (Si 3N4), Tantalum pentoxide (Ta 2O5), but the invention is not limited thereto. Specifically, the first sub-layer 122 and the second sub-layer 124 are transparent and transparent materials, and the first sub-layer 122 has a smaller refractive index than the second sub-layer 124. The first sub-layer 122 and the second sub-layer 124 comprising the dielectric material may be formed by sputtering or evaporation.
In some embodiments, the material of the first sub-layer 122 and the second sub-layer 124 may be a semiconductor material, such as Gallium Arsenide (GaAs) or Aluminum Arsenide (AlAs), but the invention is not limited thereto, as long as the material is transparent and can transmit light. The first sublayer 122 and the second sublayer 124 comprising semiconductor material may be formed epitaxially.
In the embodiment, the pixel array 110 includes an active device composed of a gate 112, a dielectric layer 114, a channel layer 116, a source/drain 118, and the like, but the invention is not limited thereto, and one active device is illustrated in fig. 1.
Fig. 2 is a cross-sectional view of the display device 100 of fig. 1 during a manufacturing process. As shown in fig. 2, in particular, when manufacturing the display device 100, the flexible substrate 130 is formed on a glass substrate 200. Next, after the pixel array 110 is formed on the flexible substrate 130, the laser L is used to weaken the adhesive force between the flexible substrate 130 and the glass substrate 200, so as to separate the flexible substrate 130 from the glass substrate 200.
As shown in fig. 2, in some embodiments, the flexible substrate 130 may have defects, such as bubbles or foreign materials, exemplified by the aperture OP. When the flexible substrate 130 is to be separated from the glass substrate 200, the laser L may penetrate through the aperture OP and irradiate the pixel array 110. Therefore, the optical shielding layer 120 with high reflectivity can prevent the laser L from irradiating the pixel array 110 to damage the pixel array 110, thereby improving the yield of the display device 100.
In the present embodiment, the wavelength of the laser L is 308 nm, but the invention is not limited thereto. In some embodiments, the thicknesses of the first sub-layer 122 and the second sub-layer 124 of the optical shielding layer 120 conform to the design of 1/4 optical wavelength thickness (optical wavelength thickness), which is a quarter of the wavelength of the laser light L divided by the refractive index. By such a design, the optical shielding layer 120 having a high reflectance with respect to a specific wavelength can be formed.
Further, as shown in fig. 1, by disposing the first sub-layer 122 having a lower refractive index between the second sub-layer 124 having a higher refractive index and the flexible substrate 130. When there is an aperture OP in the flexible substrate 130, the difference between the refractive index of the air (refractive index 1.0) in the aperture OP and the refractive index of the first sub-layer 122 is large, and thus the effect of reflecting the laser light L is also obtained. Therefore, in the embodiment shown in fig. 1, in addition to the interface 126 being capable of reflecting the laser L, the interface between the first sub-layer 122 and the air in the aperture OP is also capable of reflecting the laser L, so as to prevent the laser L from irradiating the pixel array 110 and damaging the pixel array 110, thereby improving the yield of the display device 100.
In some embodiments, the perpendicular projection of the optical shielding layer 120 on the flexible substrate 130 overlaps the perpendicular projection of the entire pixel array 110 on the flexible substrate 130. In other words, the range of the optical shielding layer 120 is equal to or greater than the range of the entire pixel array 110, so as to ensure that the laser L does not damage the pixel array 110.
In some embodiments, the optical shielding layer 120 covers the entire flexible substrate 130. In other words, the width of the optical shielding layer 120 is greater than or equal to the width of the flexible substrate 130. Therefore, if a defect occurs in the range of the flexible substrate 130 that may be irradiated by the laser L, the optical shielding layer 120 above can be ensured to reflect the laser L, so as to avoid damaging the pixel array 110.
In some embodiments, the optical shielding layer 120 directly contacts the flexible substrate 130. For example, as described above, the first sub-layer 122 and the second sub-layer 124 can be achieved by sputtering a dielectric material or depositing a semiconductor material on the flexible substrate 130. In this way, the optical shielding layer 120 and the flexible substrate 130 can be regarded as high-reflectivity substrates.
Fig. 3 is a cross-sectional view of a display device 100a according to another embodiment of the invention. The display device 100a is substantially the same as the display device 100, except that the display device 100a further has a water-vapor blocking layer 140 and another flexible substrate 150.
The water and air blocking layer 140 is located between the pixel array 110 and the optical shielding layer 120. Specifically, the water-blocking air layer 140 is used to block external moisture from entering the pixel array 110, and the water-blocking air layer 140 cannot reflect or block the laser L. In other words, by disposing the optical shielding layer 120 on the side of the water-vapor blocking layer 140 opposite to the pixel array 110, the water-vapor blocking layer 140 and the pixel array 110 can be protected at the same time. In some embodiments, the optical shielding layer 120 covers the entire lower surface 142 of the water and air blocking layer 140. In other words, the perpendicular projection of optical shielding layer 120 on flexible substrate 130 overlaps the perpendicular projection of the entire water-gas resistant layer 140 on flexible substrate 130. That is, the range of the optical shielding layer 120 is required to be greater than or equal to the range of the entire water-gas blocking layer 140. In this way, the optical shielding layer 120 can protect the entire water blocking layer 140 to prevent the laser L from irradiating the pixel array 110.
The flexible substrate 150 is located on a side of the optical shielding layer 120 opposite to the flexible substrate 130. The flexible substrate 130 and the flexible substrate 150 are respectively located at two opposite sides of the optical shielding layer 120. In other words, the flexible substrates 130 and 150 are staggered with the two optical shielding layers 120. The perpendicular projection of the optical shielding layer 120 on the flexible substrate 130 overlaps the perpendicular projection of the entire flexible substrate 150 on the flexible substrate 150. The perpendicular projection of optical shielding layer 120 on flexible substrate 130 overlaps the perpendicular projection of the entire water-gas blocking layer 140 on flexible substrate 130. In other words, the range of the optical shielding layer 120 is equal to or greater than the range of the entire flexible substrate 150 and the range of the entire water-gas blocking layer 140. In this way, the optical shielding layer 120 can protect the entire flexible substrate 130 and the entire water/gas blocking layer 140, so as to prevent the pixel array 110 from being damaged by the laser L irradiated onto the pixel array 110, thereby increasing the yield of the display device 100 a.
Fig. 4 is a cross-sectional view of a display device 100b according to another embodiment of the invention. The display device 100b is substantially the same as the display device 100a of fig. 3, except that the display device 100b further has another optical shielding layer 120 located between the flexible substrate 130 and the pixel array 110. It should be understood that the water-gas blocking layer 140 shown in fig. 3 may also be provided in the present embodiment, for example, between the pixel array 110 and the optical shielding layer 120, and the optical shielding layer 120 covers the entire lower surface of the water-gas blocking layer. As described above, the combination of the optical shielding layer 120 and the flexible substrate 130 can be regarded as a substrate having a high refractive index. Specifically, in order to provide flexibility to the display device 100b, the thickness of the flexible substrate 130 is generally designed to be 35 to 45 μm. However, when a display device with higher mechanical properties is required to be designed, the composite structure of the optical shielding layer 120 and the flexible substrate 130 (or the flexible substrate 150) is required to be repeatedly stacked. Thus, the overall mechanical properties of the display device 100b can be improved, and the effect of reflecting the laser light L can be enhanced without increasing the complexity of the manufacturing process.
FIG. 5 is a cross-sectional view of a display device 100c according to yet another embodiment of the invention. The display device 100c is substantially the same as the display device 100 of fig. 1, except that the optical shielding layer 120a of the display device 100c has a plurality of first sub-layers 122 and a plurality of second sub-layers 124, and the first sub-layers 122 and the second sub-layers 124 are arranged alternately. The refractive index of the first sublayer 122 is less than the refractive index of the second sublayer 124. In other words, the optical shielding layer 120a can be regarded as a structure formed by stacking the optical shielding layers 120 in four sets of the display device 100. Specifically, the larger the difference in refractive index between the first sublayer 122 and the second sublayer 124, the better the reflection effect, and the more the number of layers of the optical shielding layer 120a, the better the reflection effect. As mentioned above, the interface between two layers of materials with different refractive indices can have better reflection effect. Therefore, in the embodiment shown in fig. 5, the laser light L can be reflected for multiple times when passing through seven interfaces 126 with large refractive index difference and the interfaces between the apertures of the flexible substrate 150 and the first sub-layers 122, thereby improving the reflection effect of the optical shielding layer 120 a. In this way, the laser L can be prevented from irradiating the pixel array 110 to damage the pixel array 110, thereby increasing the yield of the display device 100 c. The above parameters, such as refractive index, thickness, laser wavelength, number of stacked layers, etc., can be adjusted according to the actual requirements, and the invention is not limited thereto.
In summary, in the display device of the present invention, the optical shielding layer with a high refractive index is disposed between the pixel array and the flexible substrate, so that damage to the pixel array caused by laser light due to a defect of the flexible substrate when the flexible substrate is separated from the glass substrate by laser light can be avoided.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (10)
1. A display device, comprising:
an array of pixels;
at least one flexible substrate located below the pixel array; and
at least one optical shielding layer located between the flexible substrate and the pixel array, the optical shielding layer comprising a first sub-layer and a second sub-layer, wherein the first sub-layer is located between the second sub-layer and the flexible substrate, and the refractive index of the first sub-layer is different from the refractive index of the second sub-layer.
2. The display device of claim 1, wherein a perpendicular projection of the optical shielding layer on the flexible substrate overlaps a perpendicular projection of the entire pixel array on the flexible substrate.
3. The display device of claim 1, wherein the optical shielding layer covers the entire flexible substrate.
4. The display device of claim 1, wherein the optical shielding layer directly contacts the flexible substrate.
5. The display device of claim 1, wherein the display device further comprises:
and the water and gas blocking layer is positioned between the pixel array and the optical shielding layer, and the optical shielding layer covers the whole lower surface of the water and gas blocking layer.
6. The display device of claim 5, wherein a perpendicular projection of the optical obscuring layer on the flexible substrate overlaps a perpendicular projection of the entire water-gas resistant layer on the flexible substrate.
7. The display device according to claim 1, wherein the number of the flexible substrates is two, the display device further comprising:
and the water and gas blocking layer is positioned between the pixel array and one of the two flexible substrates, and the two flexible substrates are respectively positioned at two opposite sides of the optical shielding layer.
8. The display device of claim 7, wherein a perpendicular projection of the optical masking layer on the other of the flexible substrates overlaps a perpendicular projection of the entire flexible substrate between the water and air blocking layer and the optical masking layer on the other of the flexible substrates.
9. The display device of claim 7, wherein a perpendicular projection of the optical shielding layer on the other of the flexible substrates overlaps a perpendicular projection of the entire water-and-air blocking layer on the other of the flexible substrates.
10. The display device of claim 1, wherein the optical shielding layer comprises a plurality of first sub-layers and a plurality of second sub-layers, and the plurality of first sub-layers and the plurality of second sub-layers are staggered.
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| CN202010234792.4A CN113540118A (en) | 2020-03-30 | 2020-03-30 | Display device |
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| CN202010234792.4A CN113540118A (en) | 2020-03-30 | 2020-03-30 | Display device |
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Application publication date: 20211022 |