CN113539061A - Induction component and electronic device - Google Patents
Induction component and electronic device Download PDFInfo
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- CN113539061A CN113539061A CN202010315364.4A CN202010315364A CN113539061A CN 113539061 A CN113539061 A CN 113539061A CN 202010315364 A CN202010315364 A CN 202010315364A CN 113539061 A CN113539061 A CN 113539061A
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Abstract
The application discloses response subassembly and electron device. The induction component comprises a display module, an induction module, an auxiliary material layer and a transparent adhesive layer. The display module comprises a display surface and a bottom surface which are opposite to each other. The induction module is arranged on one side of the bottom surface, and a gap is formed between the induction module and the bottom surface. The auxiliary material layer is arranged on one side of the bottom surface, the auxiliary material layer is provided with a light through opening, and the sensing module receives light rays penetrating through the light through opening. The transparent adhesive layer is arranged between the induction module and the display module and used for filling the gap. According to the induction assembly and the electronic device, the transparent adhesive layer is used for filling the gap between the induction module and the display module, so that light reflection of the display module-air interface and the air-induction module interface is avoided, and the shadow degree of the induction module is reduced. Even when the display module assembly receives light irradiation, the user can not see the shadow that the response module produced yet, is favorable to improving user's viewing experience.
Description
Technical Field
The present disclosure relates to consumer electronics technologies, and particularly to a sensing assembly and an electronic device.
Background
Optical fingerprint technique is gradually popularized under the screen, all is provided with the optical fingerprint identification module of placing under the screen on most cell-phones to realize fingerprint identification function under the screen. When optics fingerprint identification module was placed under the screen, need set up the window that corresponds with optics fingerprint identification module on the auxiliary material layer of display screen below usually to make the light that is reflected by the finger can be received by optics fingerprint identification module. However, this mode of windowing can make the screen receive light irradiation, and the position that corresponds with the optical fingerprint identification module on the screen shows an obvious shadow, influences user's visual experience.
Disclosure of Invention
The embodiment of the application provides a sensing assembly and an electronic device.
The sensing assembly of this application embodiment includes display module assembly, response module assembly, auxiliary material layer and transparent adhesive layer. The display module comprises a display surface and a bottom surface which are opposite to each other. The induction module is arranged on one side where the bottom surface is located, and a gap is formed between the induction module and the bottom surface. The auxiliary material layer is arranged on one side where the bottom surface is located, the auxiliary material layer is provided with a light through opening, and the sensing module receives light rays penetrating through the light through opening. The transparent adhesive layer is arranged between the induction module and the display module and used for filling the gap.
The sensing assembly of this application embodiment includes display module assembly, response module assembly and auxiliary material layer. The display module comprises a display surface and a bottom surface which are opposite to each other. The induction module is arranged on one side where the bottom surface is located, and a gap is formed between the induction module and the bottom surface. The auxiliary material layer is arranged on one side where the bottom surface is located, the auxiliary material layer is provided with a light through port, the induction module receives light rays penetrating through the light through port, and the color number of the color of the part, close to one side of the display module, of the auxiliary material layer is located between 5C and 11C of cold ash.
The electronic device of the embodiment of the application comprises a shell and an induction component. The sensing assembly is coupled to the housing. The induction component comprises a display module, an induction module, an auxiliary material layer and a transparent adhesive layer. The display module comprises a display surface and a bottom surface which are opposite to each other. The induction module is arranged on one side where the bottom surface is located, and a gap is formed between the induction module and the bottom surface. The auxiliary material layer is arranged on one side where the bottom surface is located, the auxiliary material layer is provided with a light through opening, and the sensing module receives light rays penetrating through the light through opening. The transparent adhesive layer is arranged between the induction module and the display module and used for filling the gap.
The electronic device of the embodiment of the application comprises a shell and an induction component. The sensing assembly is coupled to the housing. The sensing assembly comprises a display module, a sensing module and an auxiliary material layer. The display module comprises a display surface and a bottom surface which are opposite to each other. The induction module is arranged on one side where the bottom surface is located, and a gap is formed between the induction module and the bottom surface. The auxiliary material layer is arranged on one side where the bottom surface is located, the auxiliary material layer is provided with a light through port, the induction module receives light rays penetrating through the light through port, and the color number of the color of the part, close to one side of the display module, of the auxiliary material layer is located between 5C and 11C of cold ash.
According to the induction assembly and the electronic device, the transparent adhesive layer is used for filling the gap between the induction module and the display module, so that light reflection of the display module-air interface and the air-induction module interface is avoided, and the shadow degree of the induction module is reduced. Even when the display module assembly receives light irradiation, the user can not see the shadow that the response module produced yet, is favorable to improving user's viewing experience.
Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of an inductive component according to certain embodiments of the present application;
FIG. 2 is a schematic structural diagram of an inductive component according to certain embodiments of the present application;
FIG. 3 is a schematic structural diagram of an inductive component according to certain embodiments of the present application;
FIG. 4 is a schematic structural diagram of an inductive component according to certain embodiments of the present application;
FIG. 5 is a schematic structural diagram of an inductive component according to certain embodiments of the present application;
FIG. 6 is a schematic structural diagram of an inductive component according to certain embodiments of the present application;
fig. 7 is a schematic structural diagram of an electronic device according to some embodiments of the present application.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the embodiments of the present application.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1, an embodiment of the present application provides a sensing assembly 100. The sensing assembly 100 includes a display module 10, a sensing module 20, an auxiliary material layer 30 and a transparent adhesive layer 50. The display module 10 includes a display surface 101 and a bottom surface 102 opposite to each other. The sensing module 20 is disposed on a side of the bottom surface 102, and has a gap with the bottom surface 102. The auxiliary material layer 30 is disposed on the side of the bottom surface 102. The auxiliary material layer 30 is provided with a light through opening 301. The sensing module 20 receives the light passing through the light-passing opening 301. The transparent adhesive layer 50 is disposed between the sensing module 20 and the display module 10 for filling the gap.
The sensing assembly 100 of the embodiment of the present application utilizes the transparent adhesive layer 50 to fill the gap between the sensing module 20 and the display module 10, so as to avoid the light reflection at the interface between the display module 10 and the air and the interface between the air and the sensing module 20, and reduce the shadow degree of the sensing module 20. Even when the display module 10 is irradiated by light, the user can not see the shadow generated by the sensing module 20, which is beneficial to improving the viewing experience of the user.
Referring to fig. 3, an embodiment of the present application provides a sensing assembly 100. The sensing assembly 100 includes a display module 10, a sensing module 20 and an auxiliary material layer 30. The display module 10 includes a display surface 101 and a bottom surface 102 opposite to each other. The sensing module 20 is disposed on a side of the bottom surface 102, and has a gap with the bottom surface 102. The auxiliary material layer 30 is disposed on the side of the bottom surface 102. The auxiliary material layer 30 is provided with a light through opening 301. The sensing module 20 receives the light passing through the light-passing opening 301. The color numbers of the colors of the portions of the auxiliary material layer 30 near the side of the display module 10 are located between the cold ashes 5C-11C.
The sensing assembly 100 of the embodiment of the application changes the color of the part of the auxiliary material layer 30 close to the side of the display module 10, so that the degree of the shadow of the auxiliary material layer 20 is consistent with the degree of the shadow of the sensing module 20. When the user watches display module assembly 10, what saw simultaneously is that the shadow of auxiliary material layer 20 and response module 20's shadow, because the shadow degree of the two is unanimous, so, when the user watched display module assembly 10, what saw was that a is complete shadow region agrees with completely with the size of display surface 101, and at this moment, the user can not discover the existence of shadow, and it is better to watch experience.
In the related art, the sensing assembly may include a display module, a sensing module, and an auxiliary material layer. The induction module and the auxiliary material layer are arranged on one side of the bottom surface of the display module, a gap exists between the induction module and the display module, and air exists in the gap. The auxiliary material layer is provided with a light through opening, and the sensing module can receive light rays passing through the light through opening. Because light has great light reflection volume at these two interfaces of display module assembly-air and air-response module for the shadow degree of response module is higher, and when the user watched the display module assembly, the region that the auxiliary material layer corresponds was brighter, and the region that the response module corresponds is darker, so, the user can see the shadow region that corresponds with the response module in the display module assembly, and it is relatively poor to see the sense.
For the above reasons, the present application provides the sensing assembly 100 of various embodiments shown in fig. 1 to 6.
Fig. 1 is a schematic structural diagram of an inductive component 100 according to an embodiment. As shown in fig. 1, the sensing assembly 100 includes a display module 10, a sensing module 20, an auxiliary material layer 30, a transparent adhesive layer 50 and a sealing member 40.
The display module 10 includes a display surface 101 and a bottom surface 102 opposite to each other. The display surface 101 faces the user, and the display surface 101 is used for displaying images. The display module 10 may be a flexible screen. As shown in fig. 1, the display module 10 includes a Cover Glass (CG)11, an Optically Clear Adhesive (OCA)12, a Polarizer (POL)13, a light emitting layer (Panel)14, and a substrate (U-film) 15. The cover glass 11, the optically transparent adhesive 12, the polarizer 13, the light emitting layer 14, and the substrate 15 are sequentially disposed in a direction in which the display surface 101 faces the bottom surface 102.
The sensing module 20 is disposed on a side of the bottom surface 102, and has a gap with the bottom surface 102. The sensing module 20 may be any light sensing device that can be placed under the screen, such as an optical fingerprint recognition module, a proximity sensor, a light sensor, an imaging module, etc., without limitation. The sensing module 20 includes a sensing element 21 and a circuit board 22. The circuit board 22 includes a first surface 221 and a second surface 222 opposite to each other, and the sensing element 21 is disposed on the first surface 221 of the circuit board 20 and located between the display module 10 and the circuit board 22. The first projection of the sensing element 21 on the circuit board 22 is located in the first surface 221 of the circuit board 22, so that the portion of the circuit board 22 not in contact with the sensing element 21 can be used for routing the wires for connecting the sensing element 21 and the circuit board 22, and the sensing element 21 and the circuit board 22 are electrically connected.
The auxiliary material layer 30 is disposed on the side of the bottom surface 102. The auxiliary material layer 30 is provided with a light through opening 301. The sensing module 20 receives the light passing through the light-passing opening 301. The area of the second projection of the light-passing port 301 on the circuit board 22 is greater than or equal to the area of the first projection of the sensing element 21 on the circuit board 22, and is smaller than the area of the first surface 221 of the circuit board 22. Specifically, the auxiliary material layer 30 includes a double-sided adhesive layer (EMBO)31, a FOAM adhesive layer (FOAM)32, a graphite layer 33, and a copper foil layer (Cu) 34. Along the luminous direction of display module assembly 10, copper foil layer 34, graphite layer 33, bubble celloidin layer 32 and two-sided glue film 31 set gradually, and two-sided glue film 31 is located between display module assembly 10 and the bubble celloidin layer 32. The double-sided adhesive layer 31 may be used to adhere other auxiliary materials to the bottom surface 102 of the display module 10, and may also be used to protect the bottom surface 102 of the display module 10 from abrasion. The foam rubber layer 32 can play a role in buffering and protection. The graphite layer 33 may be used for heat dissipation of the display module 10. The copper foil layer 34 may be used to shield interference between the display module 10 and the rest of the electronic devices. The light-passing opening 301 penetrates through the double-sided adhesive layer 31 and the foam adhesive layer 32. The area of the second projection of the light-passing port 301 on the circuit board 22 is greater than or equal to the area of the first projection of the sensing element 21 on the circuit board 22, and is smaller than the area of the first surface 221 of the circuit board 22. Like this, the cross-sectional area of logical light mouth 301 is greater than the area of sensing element 21's first face 211, and double-sided adhesive layer 31 and bubble celloidin layer 32 can not produce the sheltering from to sensing element 21, guarantee that sensing element 21 can receive more light. The graphite layer 33 and the copper foil layer 34 in the auxiliary material layer 30 are provided with avoiding openings 302, and the light through opening 301 also penetrates through the graphite layer 33 and the copper foil layer 34 in the auxiliary material layer 30. The space formed by the graphite layer 33 and the copper foil layer 34 is formed by the avoidance port 302 and the light transmission port 301. The avoidance ports 302 are distributed around the sensing module 20. The area of the third projection of the avoiding opening 302 on the circuit board 22 is greater than or equal to the area of the first surface 221 of the circuit board 22. In this way, the graphite layer 33 and the copper foil layer 32 do not shield the sensor element 21 and the space above the circuit board 22, and other elements having a predetermined height can be disposed at positions of the circuit board 22 not in contact with the sensor element 21.
The transparent adhesive layer 50 is disposed between the sensing module 20 and the display module 10 for filling a gap between the sensing module 20 and the display module 10. The side of the light-transmitting opening 301 is in contact with the transparent adhesive layer 50, that is, the side of the double-sided adhesive layer 31 and the side of the foam adhesive layer 32 close to the light-transmitting opening 301 are in contact with the transparent adhesive layer 50. Specifically, the transparent adhesive layer 50 includes two opposite surfaces, one of which is in contact with the first surface 211 of the sensing element 21, and the other of which is in contact with the bottom surface 102 of the display module 10. The cross-sectional dimension of the transparent adhesive layer 50 is the same as the cross-sectional dimension of the light-transmitting opening 301, and the side surfaces of the double-sided adhesive layer 31 and the bubble-side adhesive layer 32 close to the light-transmitting opening 301 are in contact with the transparent adhesive layer 50 to completely seal the light-transmitting opening 301. The transmittance of the transparent adhesive layer 50 is greater than or equal to 85%, for example, the transmittance of the transparent adhesive layer 50 may be 85%, 87%, 88.8%, 89.5%, 90%, 93%, 96%, 99%, 100%, etc. The refractive index of the transparent adhesive layer 50 is between 1.4 and 1.7, for example, the refractive index of the transparent adhesive layer 50 may be 1.4, 1.45, 1.5, 1.53, 1.6, 1.64, 1.69, 1.7, etc. Illustratively, the transparent adhesive layer 50 may be OCA optical adhesive, although the material of the transparent adhesive layer 50 is not limited thereto.
Taking the transparent adhesive layer 50 as an OCA optical adhesive as an example, since the refractive index of the OCA optical adhesive is about 1.48, the substrate 15 is usually made of PET (Polyethylene terephthalate) and has a refractive index of about 1.65, the surface (the first surface 211) of the sensing element 21 facing the display module 10 is usually made of glass and has a refractive index of about 1.5, and the refractive index of air is 1.0. Then, for the sensing component without the transparent adhesive layer 50, the reflectivity R1 'of the substrate-air interface is (1.65-1.0) ^2/(1.65+1.0) ^2 ≈ 0.06, and the reflectivity R2' of the air-sensing element interface is (1.0-1.5) ^2/(1.0+1.5) ^2 ^ 0.04; for the sensor assembly 100 shown in fig. 1, the reflectivity R1 at the interface between the substrate 15 and the transparent adhesive layer 50 is (1.65-1.48) ^2/(1.65+1.48) ^2 ≈ 0.003, and the reflectivity R2 at the interface between the transparent adhesive layer 50 and the sensor element 21 is (1.48-1.5) ^2/(1.48+1.5) ^2 ≈ 0.000045. Comparing R1 and R1 ', and R2 and R2', it can be seen that R1 is much smaller than R1 ', and R2 is much smaller than R2'. That is, compared with the sensing assembly without the transparent adhesive layer 50, in the sensing assembly 100 shown in fig. 1, the reflectivity of the light at the interface between the substrate 15 and the transparent adhesive layer 50 and the reflectivity of the light at the interface between the transparent adhesive layer 50 and the sensing element 21 are both smaller, so that the light reflection is reduced, and the shadow degree of the sensing module 21 is reduced.
In addition, the cross-sectional area of the light-passing opening of the sensing assembly without the transparent adhesive layer 50 is generally larger than the area of the first surface of the circuit board, and the cross-sectional area of the light-passing opening 301 in fig. 1 is smaller than the area of the first surface 221 of the circuit board 22, that is, the light-passing opening 301 in fig. 1 is smaller than the light-passing opening of the sensing assembly without the transparent adhesive layer 50. Because the area of the cross section of the light-passing opening 301 in fig. 1 is smaller than the area of the first surface 221 of the circuit board 22, the double-sided adhesive layer 31 and the foam adhesive layer 32 can partially or even completely cover the area of the circuit board 22 not in contact with the sensing element 21 (also called a non-sensing area, the area where the sensing element 21 is located is a sensing area), and thus, the double-sided adhesive layer 31 and the foam adhesive layer 32 can be used for improving the dark shadow of the non-sensing area, and the transparent adhesive layer 50 is mainly used for improving the dark shadow of the sensing area, and the two are mutually matched, i.e., the dark shadow generated by the whole sensing module 20 can be eliminated, so that the viewing experience of a user is better.
The seal 40 is disposed on the circuit board 22. The sealing member 40 includes two opposite sides, one of which is in contact with the first surface 221 of the circuit board 22, and the other side away from the circuit board 22 is in contact with the lower surface 321 of the foam rubber layer 32. The sealing member 40 is located between the transparent adhesive layer 50 and the graphite layer 33, and between the transparent adhesive layer 50 and the copper foil layer 34, in other words, the sealing member 40 is received in the relief opening 302. In one example, the side of the graphite layer 33 adjacent to the escape opening 302 and the side of the copper foil layer 34 adjacent to the escape opening 302 are both in contact with the sealing member 40; in another example, at least one of a side surface of the graphite layer 33 adjacent to the escape opening 302 and a side surface of the copper foil layer 34 adjacent to the escape opening 302 is spaced apart from the sealing member 40. As an example, the sealing member 40 may be a sealing foam, of course, the material of the sealing member 40 is not limited thereto. The sealing member 40 can seal the sensing element 21, so as to prevent impurities such as dust, moisture, etc. from entering the sensing element 21 and affecting the sensing effect of the sensing element 21.
In other examples, for the sensing element 100 of the embodiment shown in fig. 1, the avoidance opening 301 may be formed in the foam rubber layer 32, the graphite layer 33, and the copper foil layer 34. At this time, the side surface of the double-sided adhesive layer 31 close to the light-passing opening 301 contacts with the transparent adhesive layer 50, and the sealing member 40 is located between the foam adhesive layer 32 and the transparent adhesive layer 50, between the graphite layer 33 and the transparent adhesive layer 50, and between the copper foil layer 34 and the transparent adhesive layer 50. The side of the sealing member 40 away from the circuit board 22 is in contact with the lower surface 311 of the double-sided adhesive layer 31.
In summary, the sensing assembly 100 of the present embodiment utilizes the transparent adhesive layer 50 to fill the gap between the sensing module 20 and the display module 10, so as to avoid light reflection at the interface between the display module 10 and the air-sensing module 20 and reduce the degree of shading of the sensing module 20. Even when the display module 10 is irradiated by light, the user can not see the shadow generated by the sensing module 20, which is beneficial to improving the viewing experience of the user. In addition, the size of the through-hole 301 that auxiliary material layer 30 was seted up reduces, and the side that is close to logical light mouth 301 one side of auxiliary material layer 50 contacts with transparent adhesive layer 50, so, auxiliary material layer 30 and transparent adhesive layer 50 mutually support, and auxiliary material layer 50 mainly used reduces the regional shadow of non-response, and transparent adhesive layer 50 mainly used reduces the regional shadow of response to realize the elimination of the holistic shadow of response module 20.
Fig. 2 is a schematic structural diagram of another embodiment of the sensing assembly 100. As shown in fig. 2, the sensing assembly 100 includes a display module 10, a sensing module 20, an auxiliary material layer 30, a transparent adhesive layer 50 and a sealing member 40. The inductive element 100 shown in fig. 2 has substantially the same structure as the inductive element 100 shown in fig. 1. The difference is mainly as follows: the display module 10 is a hard screen, such as an OLED hard screen. Only one double-sided adhesive layer 31 is provided in the auxiliary material layer 30. The double-sided adhesive layer 31 is disposed on the side of the bottom surface 102 of the display module 10. The light-through opening 301 formed in the auxiliary material layer 30 is the light-through opening 301 formed in the double-sided adhesive layer 31, and the light-through opening 301 penetrates through the double-sided adhesive layer 31. The side of the double-sided adhesive layer 31 near the light-transmitting opening 301 is in contact with the transparent adhesive layer 50. The sealing member 40 is disposed on the circuit board 22, and a surface of the sealing member 40 away from the circuit board 22 contacts with the lower surface 311 of the double-sided adhesive layer 31. Similar to the sensing device 100 shown in fig. 1, the sensing device 100 shown in fig. 2 utilizes the transparent adhesive layer 50 to fill the gap between the sensing module 20 and the display module 10, so as to avoid light reflection at the interface between the display module 10 and the air-sensing module 20 and reduce the degree of shading of the sensing module 20. In addition, the size of the through hole 301 that double-sided adhesive layer 31 was seted up reduces, and the side that is close to logical light mouth 301 one side of double-sided adhesive layer 31 contacts with the transparent adhesive layer 50, and like this, double-sided adhesive layer 31 and transparent adhesive layer 50 mutually support, and double-sided adhesive layer 31 mainly used reduces the regional shadow of non-response, and transparent adhesive layer 50 mainly used reduces the regional shadow of response to realize the elimination of the holistic shadow of response module 20.
Fig. 3 is a schematic structural diagram of a sensing assembly 100 according to another embodiment. As shown in fig. 3, the sensing assembly 100 includes a display module 10, a sensing module 20, an auxiliary material layer 30 and a sealing member 40.
The display module 10 includes a display surface 101 and a bottom surface 102 opposite to each other. The display surface 101 faces the user, and the display surface 101 is used for displaying images. The display module 10 may be a flexible screen. As shown in fig. 3, the display module 10 includes a Cover Glass (CG)11, an Optically Clear Adhesive (OCA)12, a Polarizer (POL)13, a light emitting layer (Panel)14, and a substrate (U-film) 15. The cover glass 11, the optically transparent adhesive 12, the polarizer 13, the light emitting layer 14, and the substrate 15 are sequentially disposed in a direction in which the display surface 101 faces the bottom surface 102.
The sensing module 20 is disposed on a side of the bottom surface 102, and has a gap with the bottom surface 102. The sensing module 20 may be any light sensing device that can be placed under the screen, such as an optical fingerprint recognition module, a proximity sensor, a light sensor, an imaging module, etc., without limitation. The sensing module 20 includes a sensing element 21 and a circuit board 22. The sensing element 21 is disposed on the circuit board 20 and located between the display module 10 and the circuit board 22. The first projection of the sensing element 21 on the circuit board 22 is located in the first surface 221 of the circuit board 22, so that the portion of the circuit board 22 not in contact with the sensing element 21 can be used for routing the wires for connecting the sensing element 21 and the circuit board 22, and the sensing element 21 and the circuit board 22 are electrically connected.
The auxiliary material layer 30 is disposed on the side of the bottom surface 102. The auxiliary material layer 30 is provided with a light through opening 301. The sensing module 20 receives the light passing through the light-passing opening 301. The area of the second projection of the light admission port 301 on the circuit board 22 is greater than or equal to the area of the first surface 221 of the circuit board 22. The color number of the color of the part of the auxiliary material layer 30 close to one side of the display module 10 is located between the cold ashes 5C to 11C. Specifically, the auxiliary material layer 30 includes a double-sided adhesive layer (EMBO)31, a FOAM adhesive layer (FOAM)32, a graphite layer 33, and a copper foil layer (Cu) 34. Along the luminous direction of display module assembly 10, copper foil layer 34, graphite layer 33, bubble celloidin layer 32 and two-sided glue film 31 set gradually, and two-sided glue film 31 is located between display module assembly 10 and the bubble celloidin layer 32. The double-sided adhesive layer 31 may be used to adhere other auxiliary materials to the bottom surface 102 of the display module 10, and may also be used to protect the bottom surface 102 of the display module 10 from abrasion. The foam rubber layer 32 can play a role in buffering and protection. The graphite layer 33 may be used for heat dissipation of the display module 10. The copper foil layer 34 may be used to shield interference between the display module 10 and the rest of the electronic devices. The double-sided adhesive layer 31, the foam adhesive layer 32, the graphite layer 33 and the copper foil layer 34 are provided with a light through opening 301, that is, the light through opening 301 penetrates through the double-sided adhesive layer 31, the foam adhesive layer 32, the graphite layer 33 and the copper foil layer 34. The area of the second projection of the light-passing port 301 on the circuit board 22 is greater than or equal to the area of the first surface 221 of the circuit board 22 of the sensing element 21. Therefore, the light-passing port 301 does not shield the sensing element 21, and the sensing element 21 can receive more light rays; meanwhile, the light-passing port 301 does not shield the space above the circuit board 22, and other components with a certain height can be arranged at the position of the circuit board 22 not in contact with the sensing component 21.
The auxiliary material layer 30 is a double-sided adhesive layer 31 on a side close to the display module 10. The color number of the color of the double-sided adhesive layer 31 is located between the cold ashes 5C to 11C, for example, the color number of the double-sided adhesive layer 31 may be the cold ashes 5C, 6C, 7C, 8C, 9C, 10C, 11C, or the like. According to experimental verification, the lighter the color of the part (i.e., the double-sided adhesive layer 31) of the auxiliary material layer 30 close to the side of the display module 10 is, the more obvious the dark shadow corresponding to the auxiliary material layer 30 is. When the color of the double-sided adhesive layer 31 is gray, the degree of the shadow generated by the auxiliary material layer 30 is about 4 grades (the larger the number is, the more obvious the shadow is); when the color of the double-sided adhesive layer 31 is black, the degree of the shadow generated by the auxiliary material layer 30 is about 0 level. Because there is air in the space between the induction module 20 and the display module 10, the degree of the shadow generated by the induction module 20 is about 3 grades, therefore, the color of the double-sided adhesive layer 31 can be changed into the color in a certain color range between gray and black, so that the degree of the shadow generated by the auxiliary material layer 30 is substantially equal to the degree of the shadow generated by the induction module 20. Thus, when the user watches the display module 10, the user sees a complete shadow area completely matched with the size of the display surface 101, and at the moment, the user cannot find the existence of the shadow, so that the user watching experience is better.
The seal 40 is disposed on the circuit board 22. The sealing member 40 includes two opposite surfaces, one of which is in contact with the first surface 221 of the circuit board 22, and the other of which is away from the circuit board 22 and is in contact with the bottom surface 102 of the display module 10. The side surface of the double-sided adhesive layer 31 close to the light through opening 301 can be in contact with the sealing element 40; alternatively, the side surface of the two-sided adhesive layer 31 on the side close to the light transmission opening 301 may have a gap with the sealing member 40, and is not limited herein. As an example, the sealing member 40 may be a sealing foam, of course, the material of the sealing member 40 is not limited thereto. The sealing member 40 can seal the sensing element 21, so as to prevent impurities such as dust, moisture, etc. from entering the sensing element 21 and affecting the sensing effect of the sensing element 21. Further, in order to avoid the problem that the sealing member 40 generates a dark shadow after the sealing member 40 is provided, the color number of the color of the sealing member 40 may be set to be located between the cold ashes 5C to 11C, for example, the color number of the sealing member 40 may be the cold ash 5C, the cold ash 6C, the cold ash 7C, the cold ash 8C, the cold ash 9C, the cold ash 10C, the cold ash 11C, or the like. So, the degree of the shadow that sealing member 40 produced and the degree of the shadow that auxiliary material layer 30 produced and the degree of the shadow that response module 20 produced are roughly equal, so, when the user watches display module assembly 10, what saw is that a is complete shadow region that agrees with the size of display surface 101 completely, and at this moment, the user can not discover the existence of shadow, and the user watches experience better.
In summary, the sensing assembly 100 of the present embodiment does not need to change the size of the light-passing opening 301 formed in the auxiliary material layer 30, but directly changes the color of the portion of the auxiliary material layer 30 close to the display module 10, so that the degree of the shadow of the auxiliary material layer 20 is consistent with the degree of the shadow of the sensing module 20. When the user watches display module assembly 10, what saw simultaneously is that the shadow of auxiliary material layer 20 and response module 20's shadow, because the shadow degree of the two is unanimous, so, when the user watched display module assembly 10, what saw was that a is complete shadow region agrees with completely with the size of display surface 101, and at this moment, the user can not discover the existence of shadow, and the user watches experience better.
Fig. 4 is a schematic structural diagram of a sensing assembly 100 according to another embodiment. As shown in fig. 4, the sensing assembly 100 includes a display module 10, a sensing module 20, an auxiliary material layer 30 and a sealing member 40. The inductive element 100 shown in fig. 4 has substantially the same structure as the inductive element 100 shown in fig. 3. The difference is mainly as follows: the display module 10 is a hard screen, such as an OLED hard screen. Only one double-sided adhesive layer 31 is provided in the auxiliary material layer 30. The double-sided adhesive layer 31 is disposed on the side of the bottom surface 102 of the display module 10. The light-through opening 301 formed in the auxiliary material layer 30 is the light-through opening 301 formed in the double-sided adhesive layer 31.
Fig. 5 is a schematic structural diagram of a sensing assembly 100 according to yet another embodiment. As shown in fig. 5, the sensing assembly 100 includes a display module 10, a sensing module 20, an auxiliary material layer 30 and a sealing member 40. The inductive element 100 shown in fig. 5 has substantially the same structure as the inductive element 100 shown in fig. 3. The difference is mainly as follows: in the sensing assembly 100 shown in fig. 5, the auxiliary material layer 30 is provided with an avoiding opening 302 in addition to the light-passing opening 301. The double-sided adhesive layer 31, the foam adhesive layer 32, the graphite layer 33 and the copper foil layer 34 are provided with a light through opening 301, that is, the light through opening 301 penetrates through the double-sided adhesive layer 31, the foam adhesive layer 32, the graphite layer 33 and the copper foil layer 34, and the area of the second projection of the light through opening 301 on the circuit board 22 is smaller than the area of the first surface 221 of the circuit board 22. The foam adhesive layer 32, the graphite layer 33 and the copper foil layer 34 are also provided with an avoidance port 302, and the space formed by the foam adhesive layer 32, the graphite layer 33 and the copper foil layer 34 is formed by a light through port 301 and an avoidance port 302 which are arranged on the foam adhesive layer. The sealing member 40 is disposed on the circuit board 22, one surface of the sealing member 40 away from the circuit board 22 contacts with the lower surface 311 of the double-sided adhesive layer 31, and a side surface of the sealing member 40 close to the sensing element 21 and a side surface of the double-sided adhesive layer 31 close to the light-passing opening 301 are located in the same plane, where the color of the sealing member 40 may be any color. Comparing fig. 3 and 5, the sensing assembly 100 shown in fig. 3 solves the problem of the shadow generated by the sealing member 40 by changing the color of the sealing member 40, and the sensing assembly 100 shown in fig. 5 solves the problem of the shadow generated by the sealing member 40 by reducing the size of the light passing opening 301.
Fig. 6 is a schematic structural diagram of a sensing assembly 100 according to yet another embodiment. As shown in fig. 6, the sensing assembly 100 includes a display module 10, a sensing module 20, an auxiliary material layer 30 and a sealing member 40. The inductive element 100 shown in fig. 6 has substantially the same structure as the inductive element 100 shown in fig. 4. The difference is mainly as follows: in the sensing assembly 100 shown in fig. 6, the area of the second projection of the light-passing port 301 formed in the double-sided adhesive layer 31 on the circuit board 22 is smaller than the area of the first surface 221 of the circuit board 22. The sealing member 40 is disposed on the circuit board 22, one surface of the sealing member 40 away from the circuit board 22 contacts with the lower surface 311 of the double-sided adhesive layer 31, and a side surface of the sealing member 40 close to the sensing element 21 and a side surface of the double-sided adhesive layer 31 close to the light-passing opening 301 are located in the same plane, where the color of the sealing member 40 may be any color. Comparing fig. 4 and 6, the sensing assembly 100 shown in fig. 4 solves the problem of the shadow generated by the sealing member 40 by changing the color of the sealing member 40, and the sensing assembly 100 shown in fig. 6 solves the problem of the shadow generated by the sealing member 40 by reducing the size of the light passing opening 301.
Referring to fig. 7, the present application further provides an electronic device 300. The electronic device 300 includes a housing 200 and the sensing assembly 100 according to any of the above embodiments. The sensing assembly 100 is combined with the housing 200, for example, the sensing assembly 100 is mounted on the housing 200. The electronic device 300 may be a mobile phone, a tablet computer, a notebook computer, an intelligent wearable device (such as an intelligent bracelet, an intelligent watch, an intelligent glasses, an intelligent helmet, etc.), a head display device, a virtual reality device, etc., without limitation.
In the electronic device 300 of the embodiment of the present invention, the transparent adhesive layer 50 is used to fill the gap between the sensing module 20 and the display module 10, so as to avoid light reflection at the interface between the display module 10 and the air-sensing module 20 and reduce the degree of the dark shadow of the sensing module 20. Even when the display module 10 is irradiated by light, the user can not see the shadow generated by the sensing module 20, which is beneficial to improving the viewing experience of the user. Alternatively, the electronic device 300 of the embodiment of the application changes the color of the part of the auxiliary material layer 30 close to the display module 10, so that the degree of the shadow of the auxiliary material layer 20 is consistent with the degree of the shadow of the sensing module 20. When the user watches display module assembly 10, what saw simultaneously is that the shadow of auxiliary material layer 20 and response module 20's shadow, because the shadow degree of the two is unanimous, so, when the user watched display module assembly 10, what saw was that a is complete shadow region agrees with completely with the size of display surface 101, and at this moment, the user can not discover the existence of shadow, and the user watches experience better.
In the description herein, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.
Although embodiments of the present application have been shown and described above, it is to be understood that the above embodiments are exemplary and not to be construed as limiting the present application, and that changes, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.
Claims (12)
1. An inductive component, comprising:
the display module comprises a display surface and a bottom surface which are opposite to each other;
the induction module is arranged on one side of the bottom surface, and a gap is formed between the induction module and the bottom surface;
the auxiliary material layer is arranged on one side of the bottom surface, the auxiliary material layer is provided with a light through port, and the sensing module receives light rays penetrating through the light through port; and
the transparent adhesive layer is arranged between the induction module and the display module and used for filling the gap.
2. The sensing assembly of claim 1, wherein the sensing module comprises a circuit board and a sensing element, the sensing element is disposed on the circuit board and located between the display module and the circuit board, the circuit board comprises a first surface and a second surface opposite to each other, the sensing element is disposed on the first surface, and a first projection of the sensing element on the circuit board is located in the first surface of the circuit board.
3. The sensing assembly according to claim 2, wherein the area of the second projection of the light-passing opening on the circuit board is greater than or equal to the area of the first projection and smaller than the area of the first surface of the circuit board, and the side surface of the light-passing opening is in contact with the transparent adhesive layer.
4. The sensing assembly of claim 3, wherein the auxiliary material layer comprises a double-sided adhesive layer, and the light-passing opening penetrates through the double-sided adhesive layer;
the sensing assembly further comprises a sealing element, the sealing element is arranged on the circuit board, and one surface, far away from the circuit board, of the sealing element is in contact with the lower surface of the double-sided adhesive layer.
5. The sensing assembly according to claim 3, wherein the auxiliary material layer comprises a double-sided adhesive layer and a foam adhesive layer, the double-sided adhesive layer is located between the display module and the foam adhesive layer, and the light-passing opening penetrates through the double-sided adhesive layer and the foam adhesive layer;
the sensing assembly further comprises a sealing element, the sealing element is arranged on the circuit board, and the sealing element is far away from one surface of the circuit board and contacted with the lower surface of the foam adhesive layer.
6. The sensing assembly of claim 5, wherein the auxiliary material layer further comprises a graphite layer and a copper foil layer, the graphite layer, the foam adhesive layer and the double-sided adhesive layer are sequentially disposed along a light emitting direction of the display module, and the sealing member is located between the transparent adhesive layer and the graphite layer and between the transparent adhesive layer and the copper foil layer.
7. The inductive component of any of claims 1 to 6, wherein the transparency of the transparent adhesive layer is greater than or equal to 85%.
8. The inductive component of any of claims 1 to 6, wherein the refractive index of the transparent adhesive layer is between 1.4 and 1.7.
9. An inductive component, comprising:
the display module comprises a display surface and a bottom surface which are opposite to each other;
the induction module is arranged on one side of the bottom surface, and a gap is formed between the induction module and the bottom surface; and
the auxiliary material layer is arranged on one side of the bottom surface, the light through port is formed in the auxiliary material layer, the sensing module receives light rays penetrating through the light through port, and the color number of the color of the part, close to one side of the display module, of the auxiliary material layer is located between 5C and 11C of cold ash.
10. The sensing assembly of claim 9, wherein the auxiliary layer comprises a double-sided adhesive layer, and the light-passing opening penetrates through the double-sided adhesive layer;
the induction module comprises a circuit board, the induction assembly further comprises a sealing piece, the sealing piece is arranged on the circuit board, one surface, far away from the circuit board, of the sealing piece is in contact with the bottom surface, and the color number of the color of the sealing piece is located between 5C and 11C of the cold ash.
11. The sensing assembly of claim 9, wherein the auxiliary layer comprises a double-sided adhesive layer, and the light-passing opening penetrates through the double-sided adhesive layer;
the response module includes the circuit board, the response subassembly still includes the sealing member, the sealing member sets up on the circuit board, just keeping away from of sealing member the one side of circuit board with double-sided adhesive layer's lower surface contact.
12. An electronic device, comprising:
a housing; and
the inductive component of any one of claims 1-11, wherein the inductive component is coupled to the housing.
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| CN202010315364.4A CN113539061B (en) | 2020-04-21 | 2020-04-21 | Induction component and electronic device |
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| CN202010315364.4A CN113539061B (en) | 2020-04-21 | 2020-04-21 | Induction component and electronic device |
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