CN113506795A - Electrostatic protection structure and display module - Google Patents
Electrostatic protection structure and display module Download PDFInfo
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- CN113506795A CN113506795A CN202110575969.1A CN202110575969A CN113506795A CN 113506795 A CN113506795 A CN 113506795A CN 202110575969 A CN202110575969 A CN 202110575969A CN 113506795 A CN113506795 A CN 113506795A
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- protection structure
- insulating layer
- electrostatic protection
- display module
- electrostatic
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- 238000001179 sorption measurement Methods 0.000 claims abstract description 18
- 238000005452 bending Methods 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000011889 copper foil Substances 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 238000007373 indentation Methods 0.000 claims 1
- 230000003068 static effect Effects 0.000 abstract description 16
- 238000010521 absorption reaction Methods 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 7
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000005728 strengthening Methods 0.000 abstract 2
- 230000005611 electricity Effects 0.000 description 11
- 238000004806 packaging method and process Methods 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/02—Carrying-off electrostatic charges by means of earthing connections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
Abstract
The embodiment of the application provides an electrostatic protection structure and display module assembly, electrostatic protection structure is including the first insulation layer that stacks gradually, the conducting layer, and the second insulating layer, electrostatic protection structure includes interconnect's cover portion and extension, wherein, the extension includes electrostatic adsorption additional strengthening, electrostatic adsorption additional strengthening is including running through the first insulation layer, the conducting layer, and the passageway of second insulating layer, expose the conducting layer through the passageway, increase the area of the electrostatic absorption face of conducting layer, promote the electrostatic adsorption ability of conducting layer, and then improve display module assembly's electrostatic protection ability, reduce the negative effects that static caused display module assembly, avoid display module assembly to produce the ghost, the uneven scheduling display problem of splash screen and colourity, and promote product quality.
Description
Technical Field
The application relates to the technical field of display equipment, in particular to an electrostatic protection structure and a display module.
Background
With the increasing refresh rate of the display screen of the electronic device, the transmission rate of the signal is faster and faster, and more scenes capable of generating static electricity on the electronic device are provided, so that the potential harm to the electronic device is larger and larger. When static electricity occurs, if the static electricity is not released or eliminated in time, discharge may be generated due to direct contact or induction, which generates an electrostatic discharge (esd) effect, thereby causing electrostatic damage to the electronic device. For example, static electricity may be generated during the manufacturing process of the display panel, the ESD test or the touch operation of the user, and if the static electricity is not released or eliminated in time, the components in the display panel are damaged, and the problems of image sticking, screen flashing, color unevenness and the like of the display panel are easily caused, thereby affecting the product quality.
Disclosure of Invention
In order to overcome the technical problems mentioned in the above technical background, embodiments of the present application provide an electrostatic protection structure, which includes a first insulating layer, a conductive layer, and a second insulating layer, which are sequentially stacked; the electrostatic protection structure comprises a covering part and an extending part which are connected with each other, wherein the covering part is used for covering the electronic element, the extending part comprises a channel penetrating through the first insulating layer, the conducting layer and the second insulating layer, the conducting layer comprises an electrostatic adsorption surface, and at least part of the electrostatic adsorption surface is exposed from the channel.
In a possible implementation manner, the channel includes at least one notch which penetrates through the first insulating layer, the conductive layer and the second insulating layer and is opened from one side of the extending portion far away from the covering portion.
In a possible implementation, the extension further includes a protrusion located between two adjacent notches.
In a possible implementation manner, the shape of the protrusion includes at least one of a rectangle, a triangle and an arc, and preferably, the protrusion is an arc.
In a possible implementation manner, the extension portion is provided with at least one through hole penetrating through the first insulating layer, the conductive layer, and the second insulating layer, and the conductive layer is exposed from a cut surface of the through hole.
In a possible implementation manner, the shape of the through hole includes at least one of a circle, an ellipse, a strip, a rectangle, a diamond and a regular polygon.
In a possible implementation manner, orthographic projections of the first insulating layer, the conductive layer and the second insulating layer on a plane where the first insulating layer is located coincide with each other.
The application still provides a display module assembly, display module assembly includes that this application provides the electrostatic protection structure.
In one possible implementation manner, the display module further includes:
the flexible display panel comprises a display area, a bending area and a binding area, wherein the bending area is positioned between the display area and the binding area, and the bending area drives the binding area to be turned over to the back of the flexible display panel;
an electronic component located on a back side of the flexible display panel and bound to the binding region;
the covering part of the electrostatic protection structure covers the electronic element of the binding region, and the extending part extends from the binding region to the direction of the bending region.
In a possible implementation manner, the display module further includes a grounding copper foil located on a side of the flexible display panel away from the display surface, the electrostatic protection structure further includes a grounding portion extending from the covering portion to a direction away from the bending region, and the grounding portion is electrically contacted with the grounding copper foil.
The embodiment of the application provides an electrostatic protection structure and display module assembly, electrostatic protection structure is including the first insulating layer, conducting layer and the second insulating layer that stack gradually, electrostatic protection structure includes cover portion and extension, and wherein, the extension is including the passageway that runs through first insulating layer, conducting layer and second insulating layer, and the conducting layer includes the electrostatic adsorption face, and the electrostatic adsorption face is at least partly exposed from the passageway. So, expose the conducting layer through the passageway, increase the area that the conducting layer is used for adsorbing the static adsorption surface of static, promote the static adsorption efficiency of conducting layer, and then improve display module assembly's electrostatic protection ability, reduce the negative effects that static caused display module assembly, avoid display module assembly to produce ghost, splash screen and the uneven scheduling display problem of colourity to promote the product quality.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1a to fig. 1c are schematic views of an electrostatic protection structure according to an embodiment of the present disclosure;
fig. 2 is a schematic diagram of a through hole of an esd protection structure according to an embodiment of the present disclosure;
fig. 3 is a second schematic view of a through hole of an esd protection structure according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;
fig. 5 is a second schematic structural diagram of a display module according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The structure of the embodiments of the application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like refer to orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally laid out when applying products, and are only used for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
It should be noted that, in case of conflict, different features in the embodiments of the present application may be combined with each other.
In general, a display module is required to include electronic elements such as an Integrated Circuit (IC) chip and a Flexible Printed Circuit (FPC). In some packaging schemes of the display module, a cop (chip On pi) packaging mode is adopted, the IC chip and the FPC are arranged at positions where the flexible display panel is not covered by the cover plate, and a part of the flexible display panel, where the IC chip is arranged, and the part of the flexible display panel and the FPC are bent to the back surface, so that a binding area where the IC chip and the FPC are arranged does not occupy a space On one side of a display surface of a screen, and the screen occupation ratio is improved. In such a packaging manner, the IC chip and the FPC are generally covered with a cover tape (cover tape) with an electromagnetic shielding layer to achieve insulation and electromagnetic shielding.
The inventor researches and discovers that in the packaging mode, because the cover tape usually adopts a three-layer structure of insulating layer-conducting layer-insulating layer, and the conducting layer is connected with a grounding circuit (such as a grounding copper foil), the cover tape can provide electromagnetic shielding and simultaneously has certain static electricity absorbing capacity, and can reduce the negative effect of static electricity on the display module.
However, since the design that the conductive layer is retracted relative to the insulating layer or the design that the conductive layer and the insulating layer are flush is often adopted on the side of the edge sealing tape close to the COP packaging screen at the curling position, the conductive layer cannot be exposed or the exposed area in the cross section direction perpendicular to the cover tape is small, so that the electrostatic adsorption effect of the conductive layer is poor.
In view of this, the present embodiment provides an electrostatic protection structure and a display module, which improve the structure of the partial position of the cover tape, so that the cover tape can be used as the electrostatic protection structure and enhance the electrostatic absorption effect, and the following explains the scheme provided by the present embodiment in detail.
Referring to fig. 1a to 1c, the present embodiment provides an esd protection structure, which may include a cover tape having a three-layer structure, and the esd protection structure may include a first insulating layer 311, a conductive layer 312, and a second insulating layer 313 stacked in sequence. The esd protection structure may include a covering portion 321 and an extending portion 322 connected to each other. The covering portion 321 is used for covering the electronic element 110, and one side of the covering portion 321 extends outwards to form an extending portion 322.
In the present embodiment, a side surface of the extension 322 on a side away from the covering portion 321 is exposed to form the electrostatic absorption surface 3121. In this way, the conductive layer 312 can absorb static electricity through at least the static electricity absorbing surface 3121, and the absorbed static electricity can be conducted along the conductive layer 312 to a ground circuit connected to the conductive layer 312 for discharging.
So, through the conducting layer 312 who exposes the front cover sticky tape, can regard as electrostatic protection structure with the front cover sticky tape, under the condition that does not change display module assembly overall structure by a wide margin, can improve display module assembly's electrostatic protection ability.
Further, in order to enhance the electrostatic absorption capability of the electrostatic protection structure, in the embodiment, the extension portion 322 includes a channel penetrating through the first insulating layer 311, the conductive layer 312, and the second insulating layer 313, so that the electrostatic absorption surface 3121 included in the conductive layer 311 further includes an exposed surface at least partially exposed from the channel. Based on this, the conductive layer 312 exposed from the section formed by the via can enhance electrostatic adsorption capability, thereby forming an electrostatic adsorption enhancing structure.
In one possible implementation, referring to fig. 1a to 1c again, the channel may include at least one notch 324 formed through the first insulating layer 311, the conductive layer 312, and the second insulating layer 313 on a side of the extension 322 away from the covering portion 321. Optionally, in this embodiment, there may be a plurality of notches 324, and the plurality of notches 324 may be arranged along one side of the extension portion 322 away from the covering portion 321, and may be arranged regularly or irregularly.
In this way, by forming the notch 324 in the extension portion 322, the extension length of the electrostatic absorption surface 3121 of the conductive layer 312 can be increased without changing the thickness of the conductive layer 312 in the electrostatic protection structure, and the total area of the electrostatic absorption surface 3121 of the conductive layer 312 is further enlarged, thereby improving the electrostatic absorption capability of the electrostatic protection structure.
Alternatively, in order to avoid the first insulating layer 311 and the second insulating layer 313 from blocking the electrostatic absorption surface 3121 of the conductive layer 312, in the present embodiment, orthographic projections of the first insulating layer 311, the conductive layer 312, and the second insulating layer 313 on a plane on which the first insulating layer 311 is located coincide with each other. For example, in the present embodiment, one side of the esd protection structure may be cut entirely so that the cut surfaces of the first insulating layer 311, the conductive layer 312, and the second insulating layer 313 are flush. Thus, the entire fabrication of the electrostatic protection structure is facilitated, and the first insulating layer 311 and the second insulating layer 313 do not block the electrostatic absorption surface 3121 of the conductive layer 312.
In some possible implementations, projections 325 are formed on both sides of the notch 324. In the case where the plurality of notches 324 is provided, a protrusion 325 is formed between two adjacent notches 324. The protrusion 325 extends toward the inflection region 102, and the shape of the protrusion 325 includes at least one of a rectangle, a triangle, and an arc. In this embodiment, the shape of the protrusion 325 may refer to an orthographic projection shape of the protrusion 325 on a plane where the first insulating layer 311 is located. Illustratively, the orthographic projection of the side of the extension portion 322 away from the covering portion 321 on the plane of the first insulating layer 311 may be a continuous wave fold line, and the wave fold line may be a rectangular wave fold line, a triangular wave fold line or an arc wave shape.
Alternatively, in order to minimize the tip discharge that may be generated at the protrusion 325, in this embodiment, a side of the protrusion 325 away from the covering portion 321 may be provided in an arc shape.
In another possible implementation manner, referring to fig. 2, the channel may further include at least one through hole 326 formed on the extension portion 322 and penetrating through the first insulating layer 311, the conductive layer 312, and the second insulating layer 313, wherein the conductive layer 312 is exposed from a cut surface of the through hole 326. Optionally, in this embodiment, the shape of the through hole 326 includes at least one of a circle, an ellipse, a rectangle, a diamond, and a regular polygon. Optionally, referring to fig. 3, in the present embodiment, the through hole 326 may also be a long strip-shaped through hole. In the present embodiment, the shape of the through-hole 326 may refer to a cross-sectional shape of the through-hole.
Thus, as shown in fig. 2 and fig. 3, by forming the through hole 326, the electrostatic absorption surface 3121 of the conductive layer 312 on the extension portion 322 further includes a tangent plane portion exposed from the position of the through hole 326, so that the area of the electrostatic absorption surface 3121 of the conductive layer 312 on the extension portion 322 can also be increased, thereby improving the electrostatic absorption capability of the electrostatic protection structure, and providing better electrostatic protection for the display module. Meanwhile, since the corresponding position of the extension 322 has no electronic component, the through hole 326 on the extension 322 does not affect the insulating performance of the esd protection structure.
Referring to fig. 4, fig. 4 is a schematic view of a display module according to the present embodiment, which may include a flexible display panel 100, an electronic element 110, and an electrostatic protection structure 300 according to the present embodiment.
In this embodiment, the flexible display panel 100 may be an OLED flexible display panel, and the flexible display panel 100 may include a display region 101, a bending region 102, and a binding region 103. The display area 101 is an area to be attached to a cover plate of a display device, and one surface of the display area for attaching to the cover plate is a display surface for displaying an image. The bonding region 103 is a region for disposing the electronic component 110, and the electronic component 110 may include an IC chip, an FPC, and the like. The bending region 102 drives the binding region 103 to be folded to the back of the flexible display panel 100. For example, in the process of packaging the display module, the bonding region 103 is bent to a side of the display region 101 away from the cover plate, and the bending angle is generally greater than 180 degrees, so as to form a bending region 102 connected between the bonding region 103 and the display region 101. Illustratively, the flexible display panel 100 is bent to have a substantially U-shaped structure, thereby defining a display area 101, a bending area 102 and a binding area 103.
Referring to fig. 5, in some possible implementations, a first insulating layer 311 is disposed on a side of the esd protection structure 300 attached to the bonding region 103, and a second insulating layer 313 is disposed on a side away from the bonding region 103. The electronic component 110 may include a first electronic component 110A entirely located at the binding region 103 and a second electronic component 110B partially located at the binding region. Illustratively, the first electronic element 110A may include an IC chip, and the second electronic element 110B may include an FPC.
The display module provided by this embodiment may further include a grounding copper foil 400 located on a side of the flexible display panel 100 away from the display surface, the first portion of the second electronic element 110B may be located in the bonding region 103, and the second portion of the second electronic element 110B may extend from the first portion to a direction away from the bonding region 103 and extend to a surface of the grounding copper foil 400 away from the display region 101.
The electrostatic protection structure 300 extends to a direction away from the bonding region 103 to cover the second electronic element 110B, and continues to extend to form a grounding portion 323 to contact the grounding copper foil 400. In a portion of the grounding portion 323 contacting the grounding copper foil 400, at least a portion of the first insulating layer 311 is removed so that the conductive layer 312 can electrically contact the grounding copper foil 400.
It should be noted that fig. 1a to 1c only show the covering portion 321 and the extending portion 322 of the electrostatic protection structure 300, and the structure related to the grounding portion 323 shown in fig. 5 is not shown in fig. 1a to 1 c.
To sum up, the esd protection structure 300 and the display module provided in the embodiment of the present application, the esd protection structure 300 includes a first insulating layer 311, a conductive layer 312, and a second insulating layer 313 stacked in sequence, the esd protection structure 300 defines a covering portion 321 covering the electronic component 110 in the bonding region 103 and an extending portion 322 extending from the covering portion 321 to the bending region 102, wherein the extending portion 322 includes an electrostatic adsorption enhancing structure, the electrostatic adsorption enhancing structure includes a channel penetrating through the first insulating layer 311, the conductive layer 312, and the second insulating layer 313, the conductive layer 312 is exposed through the channel, the area of the electrostatic adsorption surface 3121 of the conductive layer 312 is increased, the electrostatic adsorption capability of the conductive layer 312 is improved, the electrostatic protection capability of the display module is further improved, negative effects of static electricity on the display module are reduced, and display problems such as image sticking, flicker, uneven chromaticity and the like of the display module are avoided, and improve the product quality.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The electrostatic protection structure is characterized by comprising a first insulating layer, a conducting layer and a second insulating layer which are sequentially stacked; the electrostatic protection structure comprises a covering part and an extending part which are connected with each other, wherein the covering part is used for covering the electronic element, the extending part comprises a channel penetrating through the first insulating layer, the conducting layer and the second insulating layer, the conducting layer comprises an electrostatic adsorption surface, and at least part of the electrostatic adsorption surface is exposed from the channel.
2. The ESD structure of claim 1 wherein the channel comprises at least one opening through the first, conductive, and second insulating layers from a side of the extension portion away from the cover portion.
3. The electrostatic protection structure of claim 2, wherein said extension further comprises a protrusion located between two adjacent indentations.
4. The electrostatic protection structure according to claim 3, wherein the shape of the protrusion comprises at least one of a rectangle, a triangle, and an arc, preferably, the protrusion is an arc.
5. The ESD structure of claim 1, wherein the extension portion has at least one via hole passing through the first insulating layer, the conductive layer, and the second insulating layer, and the conductive layer is exposed from a cut surface of the via hole.
6. The electrostatic protection structure according to claim 5, wherein the shape of the through hole comprises at least one of a circle, an ellipse, a bar, a rectangle, a diamond, and a regular polygon.
7. The electrostatic protection structure according to any one of claims 1 to 6, wherein orthographic projections of the first insulating layer, the conductive layer, and the second insulating layer on a plane of the first insulating layer coincide with each other.
8. A display module comprising the electrostatic protection structure of any one of claims 1 to 7.
9. The display module of claim 8, further comprising:
the flexible display panel comprises a display area, a bending area and a binding area, wherein the bending area is positioned between the display area and the binding area, and the bending area drives the binding area to be turned over to the back of the flexible display panel;
an electronic component located on a back side of the flexible display panel and bound to the binding region;
the covering part of the electrostatic protection structure covers the electronic element of the binding region, and the extending part extends from the binding region to the direction of the bending region.
10. The display module assembly of claim 9, wherein the display module assembly further comprises a grounding copper foil disposed on a side of the flexible display panel away from the display surface, and the electrostatic protection structure further comprises a grounding portion extending from the covering portion in a direction away from the bending portion, wherein the grounding portion is electrically contacted with the grounding copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110575969.1A CN113506795A (en) | 2021-05-26 | 2021-05-26 | Electrostatic protection structure and display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110575969.1A CN113506795A (en) | 2021-05-26 | 2021-05-26 | Electrostatic protection structure and display module |
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| Publication Number | Publication Date |
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| CN113506795A true CN113506795A (en) | 2021-10-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110575969.1A Pending CN113506795A (en) | 2021-05-26 | 2021-05-26 | Electrostatic protection structure and display module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114262580A (en) * | 2021-12-30 | 2022-04-01 | 昆山国显光电有限公司 | Composite adhesive tape and display module |
| WO2023225790A1 (en) * | 2022-05-23 | 2023-11-30 | 京东方科技集团股份有限公司 | Flexible circuit board and display module |
-
2021
- 2021-05-26 CN CN202110575969.1A patent/CN113506795A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114262580A (en) * | 2021-12-30 | 2022-04-01 | 昆山国显光电有限公司 | Composite adhesive tape and display module |
| CN114262580B (en) * | 2021-12-30 | 2023-11-21 | 昆山国显光电有限公司 | Composite adhesive tape and display module |
| WO2023225790A1 (en) * | 2022-05-23 | 2023-11-30 | 京东方科技集团股份有限公司 | Flexible circuit board and display module |
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