CN113497839B - Electronic equipment - Google Patents
Electronic equipment Download PDFInfo
- Publication number
- CN113497839B CN113497839B CN202010259903.7A CN202010259903A CN113497839B CN 113497839 B CN113497839 B CN 113497839B CN 202010259903 A CN202010259903 A CN 202010259903A CN 113497839 B CN113497839 B CN 113497839B
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- China
- Prior art keywords
- temperature sensor
- electronic device
- circuit board
- sensor module
- light
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- 239000011889 copper foil Substances 0.000 claims description 9
- 239000006260 foam Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 230000000903 blocking effect Effects 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 3
- 230000036760 body temperature Effects 0.000 abstract description 24
- 230000000694 effects Effects 0.000 description 12
- 238000001514 detection method Methods 0.000 description 9
- 241001465754 Metazoa Species 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses an electronic device, comprising: a housing (100); the display module (200), the display module (200) is set up in the body (100), and form the inner chamber (110) between body (100) and the display module (200), the display module (200) includes light-transmitting layer (210) and light-blocking layer (220), light-transmitting layer (210) and light-blocking layer (220) set up in turn in the direction towards inner chamber (110), light-blocking layer (220) has offered light trap (221); the circuit board (300), the circuit board (300) is set up in the inner chamber (110); the temperature sensor module is arranged in the inner cavity (110), is electrically connected with the circuit board (300), and is arranged opposite to the light hole (221). The problem that the current body temperature detector has the convenience relatively poor is solved to above-mentioned scheme.
Description
Technical Field
The present invention relates to the field of communications devices, and in particular, to an electronic device.
Background
With the continuous progress of technology, electronic devices are increasingly used, and electronic devices such as mobile phones and tablet computers play an increasing role in work, life, entertainment and the like of people.
In general, a user is not in a habit of carrying a body temperature detector, so that the user is difficult to measure the body temperature at any time, and meanwhile, the body temperature detector commonly used in the prior art is poor in portability, so that the user is difficult to carry the body temperature detector, and when the user needs to measure the body temperature, the user needs to specially carry out the body temperature measurement at a specific place, so that the body temperature measurement is very inconvenient.
Disclosure of Invention
The invention discloses electronic equipment which can solve the problem of poor convenience of the existing body temperature detector.
In order to solve the technical problems, the invention is realized as follows:
An electronic device, comprising:
A housing;
The display module is arranged on the shell, an inner cavity is formed between the display module and the shell, the display module comprises a light-transmitting layer and a light-blocking layer, the light-transmitting layer and the light-blocking layer are sequentially arranged in the direction facing the inner cavity, and the light-blocking layer is provided with a light-transmitting hole;
the circuit board is arranged in the inner cavity;
The temperature sensor module is arranged in the inner cavity, is electrically connected with the circuit board and is arranged opposite to the light hole.
The technical scheme adopted by the invention can achieve the following beneficial effects:
In the electronic equipment disclosed by the embodiment of the invention, the temperature sensor module is electrically connected with the circuit board, and the temperature sensor module can sense infrared light outside the electronic equipment, so that an object to be detected outside the electronic equipment can be sensed by the temperature sensor module, the temperature of the object to be detected is detected by the temperature sensor module, and the electronic equipment can detect the temperature of the object to be detected outside the electronic equipment. Meanwhile, a user generally carries the electronic equipment with him, when the user needs to detect the body temperature, the user can complete the detection of the body temperature only by using the electronic equipment, so that inconvenience caused by the fact that the user needs to specially detect the body temperature at a specific place when the user needs to detect the body temperature is avoided, the user is facilitated to detect the body temperature, and the problem that the convenience of the current body temperature detection is poor is finally solved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments or the background art of the present invention, the following description will briefly explain the drawings required to be used in the embodiments or the background art, and it will be obvious to those skilled in the art that other drawings can be obtained according to these drawings without inventive effort.
Fig. 1, fig. 4, and fig. 5 are schematic views respectively illustrating a part of a structure of an electronic device according to an embodiment of the present invention;
FIG. 2 is a partial cross-sectional view of an electronic device according to an embodiment of the present invention;
Fig. 3 is another partial cross-sectional view of an electronic device according to an embodiment of the present invention.
Reference numerals illustrate:
100-shell, 110-inner cavity;
200-display module, 210-light-transmitting layer, 220-light-blocking layer, 221-light-transmitting hole, 222-foam layer and 223-copper foil layer;
300-a circuit board;
400-a first bracket and 410-a limiting part;
500-a second bracket, 510-a first mounting groove;
600-cushioning member;
700-temperature sensor;
800-backing plate;
910-flexible circuit board, 920-board-to-board connector.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to specific embodiments of the present invention and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The technical scheme disclosed by each embodiment of the invention is described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to 5, an embodiment of the present invention discloses an electronic device, which includes a housing 100, a display module 200, a circuit board 300, and a temperature sensor module.
The housing 100 is an outer peripheral component of the electronic device, and the housing 100 can provide a mounting location for other components of the electronic device.
The display module 200 is disposed on the housing 100, and an inner cavity 110 is formed between the display module 200 and the housing 100, and other components in the electronic device may be disposed in the inner cavity 110. The display module 200 includes a light-transmitting layer 210 and a light-blocking layer 220, the light-transmitting layer 210 and the light-blocking layer 220 are sequentially disposed in a direction towards the inner cavity 110, and the light-blocking layer 220 is provided with a light hole 221.
The circuit board 300 is disposed in the inner cavity 110, and the circuit board 300 may be a main board of an electronic device, or may be a sub-board of the electronic device, and the circuit board 300 may also be a circuit board separately electrically connected to the temperature sensor module in the electronic device, which is not limited in the embodiment of the present invention.
The temperature sensor module can detect the temperature of an object to be detected outside the electronic equipment, the object to be detected can be a human body, an animal or an object, the temperature of the object to be detected is the body temperature of the human body when the object to be detected is the human body, the temperature of the object to be detected is the body temperature of the animal when the object to be detected is the animal, and the temperature of the object to be detected is the temperature of the object when the object to be detected is not the human body or the animal. Taking a human body as an example, the body temperature of the human body is about 36.5 ℃, the wavelength of infrared light radiated by the human body through heat is about 6-12 um, and the temperature sensor module can sense the infrared light radiated by the human body, so that the body temperature of the human body is detected.
The temperature sensor module is disposed in the inner cavity 110, and is electrically connected to the circuit board 300, and the temperature sensor module is disposed opposite to the light hole 221, so that the infrared light emitted by the human body, animal or object waiting to be detected through the thermal radiation can pass through the light-transmitting layer 210 and pass through the light hole 221 to irradiate on the temperature sensor module, and the temperature sensor module can sense the infrared light, so that the temperature sensor module detects the temperature of the object to be detected. The light hole 221 can prevent that the light blocking layer 220 from influencing the effect of the temperature sensor module to sense infrared light, optionally, the side wall of the light hole 221 can be obliquely arranged, and the inclination angle of the light hole 221 can be greater than or equal to the emission angle of the temperature sensor module, so that the effect of preventing the light blocking layer 220 from influencing the effect of the temperature sensor module to sense infrared light can be greatly prevented, and the detection effect of the temperature sensor module is better.
Further, the display module 200 may be electrically connected to the circuit board 300, in this case, after the temperature sensor module senses the infrared light radiated by the object to be detected, the temperature sensor module converts the infrared light into a digital signal through a digital sampling technology, then, the temperature sensor module transmits the digital signal to the circuit board 300, and the circuit board 300 converts the digital signal into a display signal and transmits the display signal to the display module 200, so that the temperature of the object to be detected is displayed on the display module 200, and further, a user can conveniently use the electronic device to detect the body temperature.
In the electronic device disclosed by the embodiment of the invention, the temperature sensor module is electrically connected with the circuit board 300, and the temperature sensor module can sense infrared light outside the electronic device, so that an object to be detected outside the electronic device can be sensed by the temperature sensor module, the temperature sensor module can detect the temperature of the object to be detected, and the electronic device can detect the temperature of the object to be detected outside the electronic device. Meanwhile, a user generally carries the electronic equipment with him, when the user needs to detect the body temperature, the user can complete the detection of the body temperature only by using the electronic equipment, so that inconvenience caused by the fact that the user needs to specially detect the body temperature at a specific place when the user needs to detect the body temperature is avoided, the user is facilitated to detect the body temperature, and the problem that the convenience of the current body temperature detection is poor is finally solved.
In an alternative embodiment, the electronic device may further include a first bracket 400, the first bracket 400 may be disposed in the housing 100 by welding or bonding, etc., and the temperature sensor module may be disposed in the first bracket 400. The first bracket 400 can provide a mounting foundation for the temperature sensor module, so that the temperature sensor module can be more firmly arranged in the inner cavity 110, and meanwhile, the first bracket 400 can better protect the temperature sensor module, so as to prevent other components in the inner cavity 110 from causing adverse effects on the temperature sensor module, thereby improving the reliability of the temperature sensor module.
Further, the housing 100 may be provided with a second bracket 500, where the second bracket 500 may be a middle frame of the electronic device, and the second bracket 500 may provide a mounting base for other components of the electronic device, and at the same time, at least a portion of the temperature sensor module may be clamped between the first bracket 400 and the second bracket 500, so that the mounting of the temperature sensor module is more secure, and further the reliability of the temperature sensor module is better. In this case, the temperature sensor module is not required to be connected to the first bracket 400 by a fixing manner such as welding or bonding, and only at least part of the temperature sensor module is required to be clamped between the first bracket 400 and the second bracket 500, thereby facilitating the installation and fixing of the temperature sensor module.
In an alternative embodiment, a side of the second bracket 500 facing the display module 200 may be provided with a first mounting groove 510, and the temperature sensor module may be at least partially disposed in the first mounting groove 510. In this case, the first mounting groove 510 can provide a mounting base for the temperature sensor module, so that the temperature sensor module can be assembled conveniently, and the groove wall of the first mounting groove 510 can also limit the movement of the temperature sensor module, so that the temperature sensor module can be located at the mounting position more firmly. Meanwhile, since the temperature sensor module is at least partially located in the first mounting groove 510, the temperature sensor module disposed in the inner cavity 110 has a smaller influence on the thickness of the electronic device, thereby being beneficial to the design of the electronic device with light weight and thinness.
In order to further improve the mounting reliability of the temperature sensor module, the first bracket 400 may be provided with a limiting portion 410, and the limiting portion 410 may be in limiting engagement with a side edge of the temperature sensor module. In this case, at least a portion of the temperature sensor module may be clamped between the limiting portion 410 and the second bracket 500, and the limiting portion 410 may prevent the temperature sensor module from moving laterally, so as to prevent the temperature sensor module from affecting other components of the electronic device.
Further, in an alternative embodiment, the electronic device may further include a buffer 600, and the buffer 600 may be disposed between the limit portion 410 and a side edge of the temperature sensor module. Because the buffer member 600 has elastic properties, in the process of using the electronic device by the user, the buffer member 600 enables the temperature sensor module to generate a certain buffer displacement, so that collision between the limiting part 410 and the temperature sensor module caused by vibration of the electronic device can be prevented, and damage to the temperature sensor module can be prevented.
Of course, the buffer member 600 may also play a role of connection, and specifically, the limit portion 410 and the side edge of the temperature sensor module may be connected through the buffer member 600, so that the installation reliability of the temperature sensor module may be better improved. The buffer member 600 may be a plastic member, and the buffer member 600 may also be other components with elastic properties, which is not limited in the embodiment of the present invention.
In an alternative embodiment, the first bracket 400 may be a ring-shaped structure. In this case, the structure of the limiting portion 410 is an annular structure, so that the limiting portion 410 can be in limiting fit with the whole side edge of the temperature sensor module, and the temperature sensor module can be better clamped between the limiting portion 410 and the second bracket 500, so that the mounting reliability of the temperature sensor module is better. Based on this, the buffer member 600 may be disposed between the limiting portion 410 and the side edge of the temperature sensor module, and the buffer member 600 may also be an annular structural member, so as to prevent collision between the limiting portion 410 and the temperature sensor module due to vibration of the electronic device, and further prevent damage to the temperature sensor module.
Further, when installing, the temperature sensor module can be set up relatively with the avoidance hole that the first support 400 of annular structure encloses to prevent that the first support 400 of annular structure from influencing the detection effect of temperature sensor module. Of course, optionally, the inner wall of the avoidance hole may be obliquely disposed, and the inclination angle of the inner wall of the avoidance hole may be greater than or equal to the emission angle of the temperature sensor module, so that the influence of the first support 400 of the annular structure on the detection effect of the temperature sensor module is less.
In an embodiment of the present invention, the temperature sensor module may include a temperature sensor 700 and a pad 800, the pad 800 may be disposed in the housing 100, and the temperature sensor 700 may be disposed on a surface of the pad 800 facing the light hole 221. In this case, the pad 800 not only provides a mounting base for the temperature sensor 700, but the pad 800 also can pad up the temperature sensor 700 so that the temperature sensor 700 can function better. Alternatively, the temperature sensor 700 may be disposed on the surface of the pad 800 facing the light hole 221 through a surface assembly technology, so that the temperature sensor 700 is firmly installed.
Alternatively, the pad 800 may be provided with a second mounting groove, the temperature sensor 700 may be provided at the groove bottom of the second mounting groove, and the temperature sensor 700 may be non-coplanar with the notch of the second mounting groove. In this case, the second mounting groove can provide a mounting base for the temperature sensor 700, thereby facilitating assembly of the temperature sensor 700; of course, the second mounting groove can also prevent the temperature sensor 700 from affecting the thickness of the electronic device, thereby facilitating the light and thin design of the electronic device.
Further, the groove wall of the second mounting groove may be an annular groove wall, where the temperature sensor 700 is mounted in the second mounting groove, the annular groove wall can better limit the temperature sensor 700, so as to prevent the temperature sensor 700 from generating lateral displacement, thereby making the mounting of the temperature sensor 700 more secure.
In an alternative embodiment, in the case that the thickness of the temperature sensor 700 is smaller than the depth of the second mounting groove, the annular groove wall may be obliquely disposed, and the inclination angle of the annular side wall may be greater than or equal to the emission angle of the temperature sensor 700, so as to prevent the annular groove wall of the second mounting groove from affecting the detection effect of the temperature sensor 700, so that the temperature sensor 700 can better sense the infrared light radiated by the object to be detected, and further the temperature of the object to be detected by the temperature sensor 700 is more accurate.
In an alternative embodiment, in the case where the thickness of the temperature sensor 700 is greater than the depth of the second mounting groove, the protrusion of the temperature sensor 700 may be located outside the second mounting groove, and the photosensitive module of the temperature sensor 700 may be disposed at the protrusion. The method can enhance the photosensitive effect of the photosensitive module, so that the temperature of the object to be detected by the temperature sensor 700 is more accurate.
Further, the side wall of the protruding portion can be obliquely arranged, and the side wall is provided with a certain inclination angle, so that the assembly is more convenient.
In the embodiment of the present invention, the temperature sensor module is electrically connected to the circuit board 300, and optionally, the electronic device may further include a flexible circuit board 910, and the temperature sensor 700 and the circuit board 300 may be electrically connected through the flexible circuit board 910. The flexible circuit board 910 can be flexibly arranged according to the specific space layout inside the electronic device, so that the design difficulty of a designer can be reduced. Meanwhile, the flexible circuit board 910 has advantages of high wiring density, light weight, and thin thickness.
Typically, the flexible circuit board 910 and the circuit board 300 may be directly soldered to each other, but this is complicated and inconvenient to operate when the flexible circuit board 910 needs to be replaced due to damage. Based on this, in an alternative embodiment, the flexible circuit board 910 may be electrically connected to the circuit board 300 through a board-to-board connector 920. The board-to-board connector 920 is more reliable in connection, and can enable the flexible circuit board 910 to be detachably connected with the circuit board 300, so that the replacement operation of the flexible circuit board 910 is simple, and the maintainability of the electronic device is improved.
In order to enable the flexible circuit board 910 to avoid other components inside the electronic device, specifically, the flexible circuit board 910 may have a bending section, where the bending section is formed by bending a part of the structure of the flexible circuit board 910, so that the flexible circuit board 910 can avoid other components inside the electronic device. Of course, the shape of the flexible circuit board 910 may be flexibly selected according to the specific spatial layout inside the electronic device, so that the flexible circuit board 910 can better avoid the components inside the electronic device, thereby reducing the stacking difficulty of the components inside the electronic device.
Further, the flexible circuit board 910 may at least include a first flexible section, a second flexible section and a third flexible section, where the second flexible section is a bending section, and the first flexible section, the second flexible section and the third flexible section are sequentially connected, so that the flexible circuit board 910 is of a bending structure, so that the flexible circuit board 910 can avoid other components inside the electronic device. Meanwhile, in the case that the flexible circuit board 910 is electrically connected with the circuit board 300 through the board-to-board connector 920, the length of the flexible circuit board 910 is long, so that an installer can conveniently control the connection or separation of the board-to-board connector 920 and the circuit board 300, and the situation that the board-to-board connector 920 is difficult to be connected or separated from the circuit board 300 due to the fact that the length of the flexible circuit board 910 is short, which is caused by the pulling action of the flexible circuit board 910, is avoided, and the mountability of the electronic device is improved.
In an embodiment of the present invention, the electronic device may further include a light guide cover, where the light guide cover may be disposed in the inner cavity 110, and the light guide cover may be covered on the temperature sensor module. Under such a situation, when the infrared rays emitted by the object to be detected are irradiated on the light guide cover, the light guide cover enables the infrared rays to be uniformly irradiated on the photosensitive module of the temperature sensor 700, so that the photosensitive effect of the photosensitive module is better, and the temperature of the object to be detected by the temperature sensor 700 is more accurate.
In the embodiment disclosed by the invention, the light blocking layer 220 may include a foam layer 222 and a copper foil layer 223, where the foam layer 222 and the copper foil layer 223 are sequentially disposed in a direction towards the inner cavity 110, and the foam layer 222 and the copper foil layer 223 can play roles of electromagnetic shielding, antistatic and the like. In order to prevent the foam layer 222 and the copper foil layer 223 from affecting the photosensitive effect of the temperature sensor module, the foam layer 222 and the copper foil layer 223 can be provided with the light holes 221, so that the infrared rays emitted by the object to be detected can pass through the light holes 221 to irradiate onto the temperature sensor module, and the detection effect of the temperature sensor module is better.
The electronic device disclosed by the embodiment of the invention can be a smart phone, a tablet personal computer, an electronic book reader, wearable devices (such as a smart watch, smart glasses and the like), an electronic game machine and the like, and the embodiment of the invention is not limited to the specific type of the electronic device.
The foregoing embodiments of the present invention mainly describe differences between the embodiments, and as long as there is no contradiction between different optimization features of the embodiments, the embodiments may be combined to form a better embodiment, and in view of brevity of line text, no further description is provided herein.
The foregoing is merely exemplary of the present invention and is not intended to limit the present invention. Various modifications and variations of the present invention will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are to be included in the scope of the claims of the present invention.
Claims (11)
1. An electronic device, comprising:
a housing (100);
The display module (200), the display module (200) set up in casing (100), just display module (200) with form inner chamber (110) between casing (100), display module (200) include printing opacity layer (210) and light blocking layer (220), printing opacity layer (210) with light blocking layer (220) are in the orientation of being in proper order set up in inner chamber (110), light blocking layer (220) have seted up light trap (221);
-a circuit board (300), the circuit board (300) being arranged in the cavity (110);
The temperature sensor module is arranged in the inner cavity (110), is electrically connected with the circuit board (300), and is arranged opposite to the light hole (221);
the temperature sensor module comprises a temperature sensor (700) and a base plate (800), wherein the base plate (800) is arranged in the shell (100), and the temperature sensor (700) is arranged on the surface of the base plate (800) facing the light holes (221);
The base plate (800) is provided with a second mounting groove, the temperature sensor (700) is arranged at the bottom of the second mounting groove, and the temperature sensor (700) is not coplanar with the notch of the second mounting groove;
the groove wall of the second installation groove is an annular groove wall;
in the case that the thickness of the temperature sensor (700) is smaller than the depth of the second mounting groove, the annular groove wall is obliquely arranged, and the inclination angle of the annular side wall is larger than or equal to the emission angle of the temperature sensor (700);
When the thickness of the temperature sensor (700) is larger than the depth of the second mounting groove, the protruding part of the temperature sensor (700) is positioned outside the second mounting groove, and the photosensitive module of the temperature sensor (700) is arranged on the protruding part;
The side walls of the light holes (221) are obliquely arranged, and the inclination angle of the light holes (221) is larger than or equal to the emission angle of the temperature sensor (700).
2. The electronic device of claim 1, further comprising a first bracket (400), the first bracket (400) being disposed within the housing (100), the temperature sensor module being disposed in the first bracket (400).
3. The electronic device according to claim 2, characterized in that the housing (100) is provided with a second bracket (500), at least part of the temperature sensor module being clamped between the first bracket (400) and the second bracket (500).
4. An electronic device according to claim 3, wherein a first mounting groove (510) is provided on a side of the second bracket (500) facing the display module (200), and the temperature sensor module is at least partially disposed in the first mounting groove (510).
5. An electronic device according to claim 3, characterized in that the first bracket (400) is provided with a limit part (410), the limit part (410) being in limit fit with a side edge of the temperature sensor module.
6. The electronic device of claim 5, further comprising a buffer (600), the buffer (600) being disposed between the limit portion (410) and a side edge of the temperature sensor module.
7. The electronic device of claim 5, wherein the first bracket (400) is a ring-shaped structure.
8. The electronic device of claim 1, further comprising a flexible circuit board (910), wherein the temperature sensor module is electrically connected to the circuit board (300) through the flexible circuit board (910).
9. The electronic device of claim 8, wherein the flexible circuit board (910) is electrically connected to the circuit board (300) through a board-to-board connector (920).
10. The electronic device of claim 1, further comprising a light guide cover disposed in the interior cavity (110), and wherein the light guide cover is disposed in the temperature sensor module.
11. The electronic device according to claim 1, wherein the light blocking layer (220) comprises a foam layer (222) and a copper foil layer (223), the foam layer (222) and the copper foil layer (223) are sequentially arranged in a direction towards the inner cavity (110), and the light holes (221) are formed in the foam layer (222) and the copper foil layer (223).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010259903.7A CN113497839B (en) | 2020-04-03 | 2020-04-03 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010259903.7A CN113497839B (en) | 2020-04-03 | 2020-04-03 | Electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113497839A CN113497839A (en) | 2021-10-12 |
| CN113497839B true CN113497839B (en) | 2024-06-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010259903.7A Active CN113497839B (en) | 2020-04-03 | 2020-04-03 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113497839B (en) |
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