CN113490595A - Laminated film, adhesive tape, and adhesive body - Google Patents
Laminated film, adhesive tape, and adhesive body Download PDFInfo
- Publication number
- CN113490595A CN113490595A CN202080016925.9A CN202080016925A CN113490595A CN 113490595 A CN113490595 A CN 113490595A CN 202080016925 A CN202080016925 A CN 202080016925A CN 113490595 A CN113490595 A CN 113490595A
- Authority
- CN
- China
- Prior art keywords
- adhesive
- adhesive tape
- pressure
- sensitive adhesive
- styrene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 175
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 110
- 239000000853 adhesive Substances 0.000 title claims abstract description 105
- 239000010408 film Substances 0.000 title description 2
- 239000010410 layer Substances 0.000 claims abstract description 160
- 239000012790 adhesive layer Substances 0.000 claims abstract description 62
- 239000000463 material Substances 0.000 claims abstract description 42
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 205
- 239000000945 filler Substances 0.000 claims description 65
- 239000005001 laminate film Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 description 122
- 239000011347 resin Substances 0.000 description 122
- 229920001577 copolymer Polymers 0.000 description 104
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 66
- 239000002245 particle Substances 0.000 description 64
- 238000000034 method Methods 0.000 description 46
- 239000003208 petroleum Substances 0.000 description 36
- 239000000758 substrate Substances 0.000 description 31
- -1 aromatic vinyl compound Chemical class 0.000 description 26
- 229920001400 block copolymer Polymers 0.000 description 22
- 238000004519 manufacturing process Methods 0.000 description 19
- 229920002554 vinyl polymer Polymers 0.000 description 19
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 18
- 239000000126 substance Substances 0.000 description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 239000000203 mixture Substances 0.000 description 15
- 229920003048 styrene butadiene rubber Polymers 0.000 description 14
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000003431 cross linking reagent Substances 0.000 description 11
- 229920001971 elastomer Polymers 0.000 description 11
- 239000005060 rubber Substances 0.000 description 11
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 10
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 10
- 239000004793 Polystyrene Substances 0.000 description 10
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 10
- 239000011230 binding agent Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 238000001035 drying Methods 0.000 description 10
- 229920002223 polystyrene Polymers 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 10
- 238000009826 distribution Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000011256 inorganic filler Substances 0.000 description 7
- 229910003475 inorganic filler Inorganic materials 0.000 description 7
- 229920000058 polyacrylate Polymers 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 239000004743 Polypropylene Substances 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 6
- 229920000359 diblock copolymer Polymers 0.000 description 6
- 238000005227 gel permeation chromatography Methods 0.000 description 6
- 230000001771 impaired effect Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000003381 stabilizer Substances 0.000 description 6
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 6
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 5
- VNWOJVJCRAHBJJ-UHFFFAOYSA-N 2-pentylcyclopentan-1-one Chemical compound CCCCCC1CCCC1=O VNWOJVJCRAHBJJ-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Natural products CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 229920006243 acrylic copolymer Polymers 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 3
- 125000000129 anionic group Chemical group 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000010550 living polymerization reaction Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920006280 packaging film Polymers 0.000 description 3
- 239000012785 packaging film Substances 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 238000000790 scattering method Methods 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 150000003505 terpenes Chemical class 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000001023 inorganic pigment Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- 239000012860 organic pigment Substances 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001083 polybutene Polymers 0.000 description 2
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- 229920006249 styrenic copolymer Polymers 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
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- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920000428 triblock copolymer Polymers 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- IVORCBKUUYGUOL-UHFFFAOYSA-N 1-ethynyl-2,4-dimethoxybenzene Chemical compound COC1=CC=C(C#C)C(OC)=C1 IVORCBKUUYGUOL-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- ZVYGIPWYVVJFRW-UHFFFAOYSA-N 3-methylbutyl prop-2-enoate Chemical compound CC(C)CCOC(=O)C=C ZVYGIPWYVVJFRW-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- CUXGDKOCSSIRKK-UHFFFAOYSA-N 7-methyloctyl prop-2-enoate Chemical compound CC(C)CCCCCCOC(=O)C=C CUXGDKOCSSIRKK-UHFFFAOYSA-N 0.000 description 1
- COCLLEMEIJQBAG-UHFFFAOYSA-N 8-methylnonyl 2-methylprop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C(C)=C COCLLEMEIJQBAG-UHFFFAOYSA-N 0.000 description 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 1
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- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
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- 229910052684 Cerium Inorganic materials 0.000 description 1
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- 244000043261 Hevea brasiliensis Species 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
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- 239000004952 Polyamide Substances 0.000 description 1
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- 239000004113 Sepiolite Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
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- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000007664 blowing Methods 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- UGGQKDBXXFIWJD-UHFFFAOYSA-N calcium;dihydroxy(oxo)silane;hydrate Chemical compound O.[Ca].O[Si](O)=O UGGQKDBXXFIWJD-UHFFFAOYSA-N 0.000 description 1
- HHSPVTKDOHQBKF-UHFFFAOYSA-J calcium;magnesium;dicarbonate Chemical compound [Mg+2].[Ca+2].[O-]C([O-])=O.[O-]C([O-])=O HHSPVTKDOHQBKF-UHFFFAOYSA-J 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- PWZFXELTLAQOKC-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide;tetrahydrate Chemical compound O.O.O.O.[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O PWZFXELTLAQOKC-UHFFFAOYSA-A 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 229930004069 diterpene Natural products 0.000 description 1
- 150000004141 diterpene derivatives Chemical class 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005630 polypropylene random copolymer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010734 process oil Substances 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052624 sepiolite Inorganic materials 0.000 description 1
- 235000019355 sepiolite Nutrition 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- PZRXQXJGIQEYOG-UHFFFAOYSA-N zinc;oxido(oxo)borane Chemical compound [Zn+2].[O-]B=O.[O-]B=O PZRXQXJGIQEYOG-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/14—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a face layer formed of separate pieces of material which are juxtaposed side-by-side
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention aims to provide a laminated film, wherein, even when an adhesive tape is peeled off at an angle relative to an attaching surface, the load on the adhesive tape can be reduced and the adhesive tape can be prevented from being torn. The laminated film of the present invention is characterized by comprising a base material layer and adhesive layers on both sides of the base material layer, and having a non-adhesive portion on at least one surface of the laminated film, wherein the adhesive layer is not present, and the base material layer has an elongation at break of 200 to 3000% and a breaking strength of 1.5 to 80 MPa.
Description
Technical Field
The invention relates to a laminated film, an adhesive tape and an adhesive body.
Background
Since an adhesive tape has excellent workability and high adhesion reliability, IT is widely used as a joining means for component fixing, temporary fixing of components, labeling of product information, and the like in various industrial fields such as OA equipment, IT and home electric appliances, and automobiles (for example, patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2001-89726
Disclosure of Invention
However, in recent years, from the viewpoint of environmental protection, there has been an increasing demand for recycling and reusing used products in various industrial fields such as home appliances and automobiles. When recycling and reusing various products, the used products are detached and the respective members in the products are removed, but when removing the respective members, an operation of fixing the members and peeling off the adhesive tape used for the label is required. However, the adhesive tape is provided at each position in the product, and it is desired to reduce the work cost by enabling easier removal.
Specifically, in various products with recent high performance, components are mounted at high density. In the above product, when each member is fixed to a housing, another member, or the like (hereinafter, simply referred to as a housing), as shown in fig. 6, an adhesive tape 22 is provided between the housing 21 and the member 20. However, as described above, when the product is removed for recycling or the like, the adhesive tape 22 needs to be pulled at the handle portion thereof to remove the member 20, and the adhesive tape may not be removed in the related art.
More specifically, in a device in which components are mounted at high density, for example, components attached using an adhesive tape having a rubber base material are adjacent to each other, and other components are also mounted on the frame. In addition, in order to peel the adhesive tape away from the other members, the handle portion of the adhesive tape is pulled in a direction of a large angle (for example, 60 ° or more) with respect to the attachment surface and peeled off. In addition, since the adhesive tape cannot be easily removed in this way, it becomes a factor of increasing the operation cost.
The present invention has been made in view of the above problems, and an object of the present invention is to provide a laminated film, an adhesive tape, and an adhesive body, in which even when the adhesive tape is peeled off at an angle to an attachment surface as described above, a load on the adhesive tape can be reduced and tearing can be prevented.
The present inventors have conducted intensive studies to solve the above problems of the prior art, and as a result, have obtained the following findings, and have completed the invention of the present application: as shown in fig. 6, when the member 20 is fixed to the frame 21 or the like using the adhesive tape 22, when the adhesive tape 22 is peeled from the member 20 at an angle to the attachment surface, a large force is applied to a portion of the adhesive tape 22 attached near the corner 23 of the member 20 at the start of the elongation of the adhesive tape 22, and if a portion of the outer surface of the adhesive tape 22 in contact with the portion near the corner 23 of the member 20 smoothly elongates at the start of the elongation of the adhesive tape, the load on the adhesive tape 22 can be reduced.
That is, the invention of the present application is as follows.
A laminate film comprising a base material layer and adhesive layers on both sides of the base material layer,
a non-adhesive part on at least one side surface of the laminated film without the adhesive layer,
the elongation at break of the substrate layer is 200-3000%, and the breaking strength is 1.5-80 MPa.
The laminated film according to the above [ 1 ], wherein the adhesive of the adhesive layer contains a filler.
[ 3 ] an adhesive tape comprising a base layer and adhesive layers on both sides of the base layer,
the adhesive tape has a non-adhesive part on at least one surface of 1 end part side of the adhesive tape,
the elongation at break of the substrate layer is 200-3000%, and the breaking strength is 1.5-80 MPa.
The adhesive tape according to the above [ 4 ] or [ 3 ], wherein the length of the non-adhesive part measured in the longitudinal direction of the adhesive tape is 0.5 to 100 mm.
The adhesive tape according to [ 3 ] or [ 4 ], wherein the adhesive of the adhesive layer contains a filler.
[ 6 ] an adhesive body comprising the pressure-sensitive adhesive tape according to any one of [ 3 ] to [ 5 ], a first adherend attached to one surface of the pressure-sensitive adhesive tape, and a second adherend attached to the other surface of the pressure-sensitive adhesive tape,
the portion of the pressure-sensitive adhesive tape on the end portion side of the adhesive-free portion is located outside a first adhesion surface of a first adherend to which the pressure-sensitive adhesive tape is adhered,
the corner defining the first attaching surface is positioned on the adhesive-free part.
The invention provides a laminated film, an adhesive tape and an adhesive body, wherein the load on the adhesive tape can be reduced and the adhesive tape can be prevented from being torn even when the adhesive tape is peeled off at an angle relative to an attaching surface.
Drawings
Fig. 1 is a plan view showing a laminated film according to an embodiment of the present invention.
Fig. 2 is a plan view showing a modification of the laminated film of fig. 1.
Fig. 3 is a perspective view showing a pressure-sensitive adhesive tape according to an embodiment of the present invention.
Fig. 4 is a perspective view showing a modification of the pressure-sensitive adhesive tape shown in fig. 3.
Fig. 5 is a sectional view of the pressure-sensitive adhesive tape of fig. 3 showing a state in which an adherend is attached using the tape.
Fig. 6 is a diagram showing a state in which a component is attached to a housing using a conventional adhesive tape.
Detailed Description
Hereinafter, an embodiment of the present invention (hereinafter, referred to as "the present embodiment") will be described in detail with reference to the drawings, but the present invention is not limited to the embodiment.
Laminated film
As shown in fig. 1, the laminate film 1 of the present embodiment is characterized by comprising a base material layer and adhesive layers 4 on both sides of the base material layer, and having a non-adhesive portion 2 on at least one surface of the laminate film 1, in which the adhesive layer 4 is not present, and by having a breaking elongation of the base material layer of 200 to 3000% and a breaking strength of 1.5 to 80 MPa.
According to the laminated film 1 of the present embodiment, even when the pressure-sensitive adhesive tape obtained from the laminated film 1 is peeled off at an angle with respect to the sticking surface, the load on the pressure-sensitive adhesive tape can be reduced and the pressure-sensitive adhesive tape can be prevented from being torn. Specifically, when the laminated film 1 is cut so as to have the adhesive-free portions 2 on the surface of 1 end portion side of the pressure-sensitive adhesive tape, and then an adherend such as a component is fixed to, for example, a frame or the like using the obtained pressure-sensitive adhesive tape, as shown in fig. 5, the component or the like is attached so that the corners (corners defining the surface to which the pressure-sensitive adhesive tape is attached) of the component or the like are positioned on the adhesive-free portions 2. After the fixing, even if the adhesive tape is peeled off at an angle with respect to the sticking surface when the adhesive tape is peeled off to remove the component from the housing, the adhesive-free portion 2 of the adhesive tape smoothly stretches at the position where the adhesive tape starts to stretch, and thus the load on the adhesive tape can be reduced to prevent the adhesive tape from being torn.
Here, in the present embodiment, the laminated film 1 is a film for manufacturing an adhesive tape as shown in fig. 1, and specifically, for example, as shown by a broken line 3 in the figure, the laminated film 1 is cut so that the adhesive-free portion 2 is present on the surface of 1 end portion side of the adhesive tape, whereby a plurality of adhesive tapes can be manufactured.
The shape and size of the adhesive-free portion 2 on the surface of the laminated film 1 in a plan view of the laminated film 1 may vary depending on the shape and size of the pressure-sensitive adhesive tape produced from the laminated film 1, and the like, and is not particularly limited and may be set arbitrarily.
On the other hand, the adhesive-free portion 2 may have any shape, and preferably has a length of at least 0.5mm measured in one direction (TD direction in the example of fig. 1) and a length of at least 0.5mm measured in a direction orthogonal to the one direction (MD direction in the example of fig. 1). More preferably, the length of the non-adhesive portion 2 measured in one direction is at least 3mm, and the length measured in a direction orthogonal to the one direction is at least 3 mm.
By making the adhesive-free portion 2 have the above size, a desired adhesive tape can be produced using the laminated film 1 of the present embodiment.
The adhesive-free portion 2 of the laminated film 1 having a length in one direction of 0.5mm or more and a length in a direction orthogonal to the one direction of 0.5mm or more is preferably such that the adhesive layer 4 is present substantially over the entire surface in a range of at least 30mm adjacent to each other in the one direction. Accordingly, even if the adhesive tape obtained by laminating the film 1 is provided with the adhesive-free portion 2, the adhesive force of the adhesive tape can be easily ensured. Here, "substantially over the entire surface" means that even if a part other than the adhesive layer 4 is slightly scattered in a range of a length of at least 30mm adjacent to the non-adhesive portion 2 in one direction, the adhesive force is considered to be the same as a whole. More preferably, within this range, the adhesive layer 4 is present over the entire surface.
In the present embodiment, as shown in fig. 1, the adhesive-free portion 2 may be provided in plural on the surface of the laminate film 1. For example, when there are a plurality of adhesive-free portions 2 in a plan view of the laminate film 1, each adhesive-free portion 2 may be extended in the MD direction as shown in fig. 1, or each adhesive-free portion 2 may be extended in the TD direction although not shown, or each adhesive-free portion 2 may be extended in a direction inclined with respect to the MD direction or the TD direction. As shown in fig. 1, when the adhesive-free portion 2 is formed to extend on the surface of the laminated film 1, the laminated film 1 is cut at a position indicated by a broken line 3 in fig. 1 so that the adhesive-free portion 2 is not located on the center side but on the end side of the adhesive tape as shown in fig. 1, thereby manufacturing a plurality of desired adhesive tapes. In the example of fig. 1, the pressure-sensitive adhesive layer 4 is present in a portion closer to the end portion than the adhesive-free portion 2 in a range of 1 pressure-sensitive adhesive tape, and the pressure-sensitive adhesive layer 4 is also present in a portion closer to the end portion of the pressure-sensitive adhesive tape obtained by cutting the range. By widening the width of the adhesive-free portion 2, for example, the adhesive layer 4 may be absent in a portion on the end portion side of the adhesive tape obtained by cutting the laminated film 1.
In the present embodiment, as shown in fig. 2, when the laminated film 1 is viewed in a plan view, the adhesive-free portion 2 on the surface of the laminated film 1 is formed in a sea-like shape and the pressure-sensitive adhesive layer 4 is formed in an island-like shape, and thus the adhesive-free portion 2 and the pressure-sensitive adhesive layer 4 may be formed in a sea-like shape (conversely, the adhesive-free portion 2 may be formed in an island-like shape and the pressure-sensitive adhesive layer 4 may be formed in a sea-like shape). When the adhesive layer 4 of the laminated film 1 is formed in an island shape, for example, by cutting the laminated film 1 at a position indicated by a broken line 3 in fig. 2, an adhesive tape having a plurality of (3 or more in the drawing) end portions can be obtained.
Note that, in the example shown in fig. 1, a rectangular adhesive tape is manufactured from the laminated film 1, and in the example shown in fig. 2, an adhesive tape having 3 or more end portions is manufactured from the laminated film 1, but the shape, size, and the like of the adhesive tape manufactured from the laminated film 1 can be arbitrarily set.
In the laminated film 1 of the present embodiment, the adhesive-free portion 2 is formed on one surface of the laminated film 1 in the illustrated example, and may be formed on the other surface so that the adhesive-free portion 2 on one surface and the adhesive-free portion 2 on the other surface of the laminated film 1 overlap each other in a plan view, and more preferably are formed at the same position.
In the present embodiment, the adhesive-free portion 2 refers to a portion where the pressure-sensitive adhesive layer 4 forming the surface of the laminated film 1 is not formed. The adhesive-free portion 2 may be a portion where the base material layer of the laminate film 1 is exposed, but the adhesive is allowed to be present in a thickness of 10% or less of the thickness of the adhesive layer.
Here, the base layer and the pressure-sensitive adhesive layer 4 constituting the laminated film 1 will be described below.
A substrate layer
The laminated film 1 of the present embodiment has a base layer 13 as a carrier of a pressure-sensitive adhesive layer 14, as shown in a pressure-sensitive adhesive tape 11 obtained from the laminated film of fig. 5.
The substrate layer of the laminate film 1 in the present embodiment has an elongation at break of 200 to 3000% and a breaking strength of 1.5 to 80 MPa.
The material of the base layer in the present embodiment is not particularly limited as long as the base layer 13 has the above-described elongation at break and breaking strength, and for example, preferably contains a vinyl aromatic block copolymer (a). As the vinyl aromatic block copolymer (a) which is a material usable for the base layer, 1 or 2 or more kinds of copolymers selected from block copolymers of an aromatic vinyl compound and a conjugated diene compound can be used, and a styrene-based copolymer in which the aromatic vinyl compound is styrene is preferable. Further, as the conjugated diene compound, isoprene, butadiene, ethylenebutylene, and ethylenepropylene are preferable. Among them, the block copolymer (a) is preferably 1 or 2 or more copolymers selected from diblock copolymers such as styrene-isoprene copolymer, styrene-butadiene copolymer, styrene-ethylenebutylene copolymer and styrene-ethylenepropylene copolymer, triblock copolymers such as styrene-isoprene-styrene copolymer and styrene-butadiene-styrene copolymer, more preferably 1 or 2 or more copolymers selected from styrene-isoprene copolymer, styrene-butadiene copolymer, styrene-ethylenebutylene copolymer, styrene-isoprene-styrene copolymer, styrene-butadiene-styrene copolymer and styrene-ethylenebutylene copolymer, particularly preferably styrene-isoprene copolymer, styrene-butadiene copolymer, styrene-ethylenebutylene copolymer, Styrene-isoprene-styrene copolymers.
The proportion of the vinyl aromatic block copolymer (a) contained in the material of the base layer in the present embodiment is preferably 50 to 100% by mass, more preferably 60 to 100% by mass, even more preferably 65 to 100% by mass, and even more preferably 70 to 100% by mass, assuming that the material is 100% by mass. When the amount is within this range, a styrenic copolymer having excellent elongation at break and stress at break can be obtained. In addition, in the material of the base layer in the present embodiment, various thermoplastic resins such as polyolefin and polycarbonate may be used in addition to the vinyl aromatic block copolymer (a), and one or more kinds may be used.
The styrene copolymer is preferably a styrene copolymer having a structural unit represented by the following chemical formula (1) in a range of 13 to 60% by mass, more preferably a styrene copolymer having a structural unit represented by the following chemical formula (1) in a range of 15 to 50% by mass, even more preferably a styrene copolymer having a structural unit represented by the following chemical formula (1) in a range of 16 to 45% by mass, and even more preferably a styrene copolymer having a structural unit represented by the following chemical formula (1) in a range of 17 to 35% by mass, based on the total mass of the styrene-isoprene copolymer and the styrene-isoprene-styrene copolymer. This makes it easy to obtain elongation at break and stress at break in appropriate ranges.
[ chemical formula 1 ]
As the styrene-based copolymer, a styrene-based copolymer containing 2 or more kinds of copolymers different in structure is used, and a styrene-based copolymer containing a styrene-isoprene copolymer and a styrene-isoprene-styrene copolymer in combination can be used.
The styrene-based copolymer is preferably a styrene-based copolymer containing the styrene-isoprene copolymer in a range of 0 to 80% by mass, more preferably a styrene-isoprene copolymer containing the styrene-isoprene copolymer in a range of 0 to 70% by mass, even more preferably a styrene-isoprene copolymer containing the styrene-isoprene copolymer in a range of 0 to 50% by mass, and even more preferably a styrene-isoprene copolymer containing the styrene-isoprene copolymer in a range of 0 to 30% by mass, based on the total mass of the styrene-isoprene copolymer and the styrene-isoprene-styrene copolymer. By setting the above range, it is possible to achieve both thermal durability and excellent elongation at break and breaking stress.
The styrene-isoprene copolymer is preferably a styrene-isoprene copolymer having a weight average molecular weight (SC-8020 manufactured by Tosoh corporation, high molecular weight column TSKgelGMHHR-H, solvent: tetrahydrofuran) in the range of 1 to 80 ten thousand, more preferably 3 to 50 ten thousand, and still more preferably 5 to 30 ten thousand, as measured in terms of standard polystyrene by Gel Permeation Chromatography (GPC). By setting the above range, it is possible to secure fluidity under heating and compatibility when diluted with a solvent, and therefore, it is more preferable to obtain an adhesive tape having good workability in the production process and thermal durability.
The styrene-based copolymer may be a copolymer having a single structure such as a linear structure, a branched structure or a multi-branched structure, or a mixture of copolymers having different structures. The styrenic copolymer having a rich linear structure provides the laminate film 1 of the present embodiment with excellent elongation at break. On the other hand, a styrene-based copolymer has a branched structure or a multi-branched structure, and a structure in which a styrene block is arranged at a molecular terminal can have a quasi-crosslinked structure, and can impart an excellent cohesive force. Therefore, it is preferable to use a mixture of these components according to the required mechanical properties.
The method for producing the styrene-isoprene-styrene copolymer is not particularly limited, and conventionally known production methods can be applied. Examples include: a method of successively polymerizing a styrene block and an isoprene block by an anionic living polymerization method, and a method of producing a block copolymer having living active terminals and then reacting the block copolymer with a coupling agent to couple the block copolymer.
The method for producing the styrene-isoprene copolymer is not particularly limited, and conventionally known production methods can be applied. Examples include: a method of successively polymerizing a styrene block and an isoprene block by an anionic living polymerization method.
The method for producing the mixture of the styrene-isoprene copolymer and the styrene-isoprene-styrene copolymer is not particularly limited, and conventionally known production methods can be applied. Examples include: a method of using the styrene-isoprene copolymer produced above and a styrene-isoprene-styrene copolymer in combination. Alternatively, they may be simultaneously produced as a mixture in one polymerization step. In a more specific embodiment, in the anionic living polymerization method, first, a styrene monomer is polymerized in a polymerization solvent using an anionic polymerization initiator to form a polystyrene block having living active terminals. Next, isoprene is polymerized from the living active terminal of the polystyrene block to obtain a styrene-isoprene diblock copolymer having a living active terminal. Next, a third step of reacting a portion of the living active-ended styrene-isoprene diblock copolymer with a coupling agent to form a coupled styrene-isoprene-styrene block copolymer. Fourthly, the remaining portion of the styrene-isoprene diblock copolymer having the living active end is deactivated by a polymerization terminator to form a styrene-isoprene diblock copolymer.
-tackifying resins-
In the present embodiment, a tackifier resin may be used for the base layer in order to improve adhesion to the pressure-sensitive adhesive layer 4 and improve heat resistance. Among them, a tackifier resin having a softening point of 80 ℃ or higher can be preferably used, and the softening point is more preferably 90 ℃ or higher, still more preferably 100 ℃ or higher, and still more preferably 110 ℃ or higher. The softening point is a value measured by the method (dry bulb method) defined in JISK 2207.
As the above-mentioned tackifier resin, for example, a tackifier resin which is solid at normal temperature (23 ℃) is preferably used, and petroleum resins such as C5 series petroleum resin, C5/C9 series petroleum resin, alicyclic series petroleum resin and the like can be used.
The petroleum resin is easily compatible with a styrene-isoprene block copolymer or a polyisoprene structure constituting the styrene-isoprene block-styrene copolymer, and as a result, the initial adhesion and thermal durability of the pressure-sensitive adhesive tape can be further improved.
As the C5-based petroleum resin, an aliphatic petroleum resin may be used, and examples thereof include Escorez1202, 1304, 1401 (manufactured by Toyobo chemical contract Co., Ltd.), WINGTACK 95 (manufactured by Goodyear Tire and Rubber Company), Quintone K100, R100, F100 (manufactured by ZEON corporation, Japan), Piccotac95, Piccopal100 (manufactured by Rika Hercules), and the like.
The C5-series/C9-series petroleum resin may be a copolymer of the C5-series petroleum resin and a C9-series petroleum resin, and examples thereof include Escorez 2101 (manufactured by TONEX), Quintone G115 (manufactured by ZEON, japan), and Hercotac 1149 (manufactured by Rika Hercules).
The alicyclic petroleum resin can be obtained by hydrogenating the C9 petroleum resin, and examples thereof include Escorez 5300 (manufactured by TONEX), Alcon P-100 (manufactured by Iskawa chemical industry), REGALITE R101 (manufactured by Rika Fine Tech), and the like.
Examples of the tackifier resin include, in addition to the C5-based petroleum resin, the C5-based/C9-based petroleum resin, and the alicyclic petroleum resin, a polymerized rosin-based resin, a C9-based petroleum resin, a terpene-based resin, a rosin-based resin, a terpene-phenolic resin, a styrene resin, a coumarone-indene resin, a xylene resin, and a phenolic resin.
Among these, the C5-based petroleum resin and the polymerized rosin-based resin are preferably used in combination as the tackifier resin in view of achieving both of further excellent initial adhesiveness and thermal durability.
The tackifier resin is used preferably in a range of 0 to 100% by mass, more preferably in a range of 0 to 70% by mass, even more preferably in a range of 0 to 50% by mass, and even more preferably in a range of 0 to 30% by mass, based on the total amount of the styrene-isoprene copolymer and the styrene-isoprene-styrene copolymer. When the amount is within the above range, the interface adhesion between the pressure-sensitive adhesive layer 4 and the base material layer is improved, and the excellent elongation at break and thermal durability of the pressure-sensitive adhesive tape are easily achieved.
Other components- -
In the present embodiment, the resin base material may contain, as necessary, additives such as other polymer components, crosslinking agents, antioxidants, ultraviolet absorbers, fillers, polymerization inhibitors, surface control agents, antistatic agents, antifoaming agents, viscosity control agents, light-resistant stabilizers, weather-resistant stabilizers, heat-resistant stabilizers, antioxidants, leveling agents, organic pigments, inorganic pigments, pigment dispersants, silica beads, and organic beads, as long as the properties are not impaired; inorganic fillers such as silica, alumina, titania, zirconia, and antimony pentoxide.
Characteristics of the substrate layer-
The thickness of the base material is preferably 10 to 2490 μm, more preferably 30 to 300 μm, still more preferably 60 to 200 μm, and still more preferably 70 to 150 μm. When the thickness of the substrate is in the above range, the pressure-sensitive adhesive tape can easily follow the strain of the adherend, can easily obtain high adhesive strength, and the stress required for peeling the pressure-sensitive adhesive tape while stretching the tape does not become excessively large, which is preferable.
The substrate layer has an elongation at break of 200 to 3000%, preferably 650 to 2800%, more preferably 700 to 2700%, and still more preferably 750 to 2600%. When the elongation at break of the base layer is not less than the lower limit of the above range, even when the pressure-sensitive adhesive tape is strongly adhered to an adherend, the stress for stretching the pressure-sensitive adhesive tape when the pressure-sensitive adhesive tape is peeled is not excessively increased, and the pressure-sensitive adhesive tape is not excessively elongated in the peeling step and can be easily peeled. Further, it is preferable that the elongation at break of the base layer is not more than the upper limit of the above range, because the stretching distance of the pressure-sensitive adhesive tape when the pressure-sensitive adhesive tape is peeled is not excessively long, and the operation can be performed in a small space.
The substrate layer has a breaking strength of 1.5 to 80MPa, preferably 2.0 to 60MPa, more preferably 2.5 to 50MPa, and still more preferably 3.0 to 40 MPa. When the breaking strength of the base layer is not less than the lower limit of the above range, the adhesive tape can be prevented from being torn even when the adhesive tape is pulled and peeled, and the load for extending the adhesive tape does not become excessive, so that the peeling operation by peeling becomes easy. The force required to stretch and deform the adhesive tape also depends on the thickness of the adhesive tape. For example, when an adhesive tape having a large thickness and a high breaking strength is to be pulled and peeled, the adhesive tape cannot be pulled sufficiently and cannot be peeled.
The stress at 25% elongation of the base material layer is preferably 0.15 to 10.0MPa, more preferably 0.25 to 7.0MPa, even more preferably 0.35 to 5.0MPa, and even more preferably 0.45 to 2.0 MPa. When the stress at 25% elongation of the pressure-sensitive adhesive tape is in the above range, the pressure-sensitive adhesive tape can have an adhesive strength suitable for the pressure-sensitive adhesive tape, and can be relatively easily peeled even in the peeling step. If the amount is less than the above range, the pressure-sensitive adhesive tape may be peeled off when a load is generated in the shearing direction of the pressure-sensitive adhesive tape while fixing hard adherends to each other. When the amount of the adhesive tape is more than the above range, the force required to stretch the adhesive tape becomes excessively large in the step of peeling the adhesive tape.
The stress at 50% elongation of the base material layer is preferably 0.15 to 10.5MPa, more preferably 0.25 to 7.5MPa, even more preferably 0.35 to 5.0MPa, and even more preferably 0.5 to 2.5 MPa. When the stress at 50% elongation of the pressure-sensitive adhesive tape is in the above range, the pressure-sensitive adhesive tape can have an adhesive strength suitable for the pressure-sensitive adhesive tape, and can be relatively easily peeled even in the peeling step. If the amount is less than the above range, the pressure-sensitive adhesive tape may be peeled off when a load is generated in the shearing direction of the pressure-sensitive adhesive tape while fixing hard adherends to each other. When the amount of the adhesive tape is more than the above range, the force required to stretch the adhesive tape becomes excessively large in the step of peeling the adhesive tape.
The stress at 50% elongation of the base material layer is preferably 100 to 160%, more preferably 103 to 150%, further preferably 105 to 140%, and further preferably 110 to 130% of the stress at 25% elongation.
When the stress at which the adhesive tape is elongated by 50% is in the above range with respect to the stress at which the adhesive tape is elongated by 25%, the stress required for the peeling of the adhesive tape can be stabilized.
The storage modulus E' (23 ℃) of the substrate layer is preferably 1.0X 104～1.0×108Pa, more preferably 5.0X 104～5.0×107Pa, more preferably 1.0X 105～1.0×107Pa, more preferably 3.0X 105～7.0×106Pa. When the breaking point stress of the base material layer is in the above range, it is easy to follow strain of an adherend and the like, excellent adhesive strength is easily obtained, and dimensional stability of the pressure-sensitive adhesive tape is also ensured, so that suitable adhesion workability can be obtained.
As the base material layer, in order to further improve adhesion to the pressure-sensitive adhesive layer 4, a base material layer provided with an undercoat layer, a base material layer subjected to surface treatment such as surface roughening treatment by sandblasting, solvent treatment, or the like, corona discharge treatment, chromic acid treatment, flame treatment, hot air treatment, ozone treatment, ultraviolet irradiation treatment, or oxidation treatment, may be used.
Examples of the method for producing the substrate layer include a casting method by extrusion molding, a uniaxial stretching method, a sequential secondary stretching method, a simultaneous biaxial stretching method, an inflation method, a tube method, a rolling method, a solution method, and the like. Among them, a casting method by extrusion molding, a manufacturing method by a uniaxial stretching method, a sequential secondary stretching method, a simultaneous biaxial stretching method, an inflation method, and a tube method can be preferably used, and the mechanical strength required for the laminated film 1 of the present embodiment may be selected.
The substrate layer may have a single-layer structure, 2-layer structure, 3-layer structure, or a multilayer structure of at least these layers. In the case of a multilayer structure, it is preferable that at least 1 layer is a layer having the above resin composition, since necessary mechanical properties can be easily exhibited. Further, for example, a substrate layer having a 3-layer structure can be obtained by co-extruding a thermoplastic resin such as polypropylene and the styrene-isoprene-styrene copolymer. The base layer may be used as a suitable structure in the laminate film 1 of the present embodiment, for example, when the laminate film is to have appropriate dimensional stability and rigidity.
Adhesive layer
In the present embodiment, the pressure-sensitive adhesive of the pressure-sensitive adhesive layer 4 is not particularly limited, and a pressure-sensitive adhesive having good adhesion to the base material layer can be used, and examples thereof include acrylic pressure-sensitive adhesives, urethane pressure-sensitive adhesives, rubber pressure-sensitive adhesives, silicone pressure-sensitive adhesives, and the like. In the present embodiment, a water-dispersible emulsion-type adhesive may be used as the adhesive of the adhesive layer 4.
In the present embodiment, an acrylic pressure-sensitive adhesive is preferable from the viewpoint of easily obtaining a strong adhesive force.
-acrylic binder-
The acrylic adhesive is not particularly limited, and includes, for example, at least 1 acrylic polymer containing an alkyl (meth) acrylate monomer as a monomer unit. Examples of the alkyl (meth) acrylate monomer include, but are not particularly limited to, alkyl (meth) acrylates having 2 to 14 carbon atoms in the alkyl group, and examples thereof include ethyl acrylate, propyl acrylate, butyl acrylate, isobutyl acrylate, isoamyl acrylate, hexyl acrylate, octyl acrylate, 2-ethylhexyl acrylate, isooctyl acrylate, isononyl acrylate, isodecyl acrylate, butyl methacrylate, hexyl methacrylate, isodecyl methacrylate, and lauryl methacrylate.
In the present specification, "alkyl (meth) acrylate" means alkyl acrylate or alkyl methacrylate.
In the acrylic polymer, it is preferable to copolymerize an acrylate having a polar group such as a hydroxyl group, a carboxyl group, an amino group, etc. in a side chain thereof with another vinyl monomer in an amount of 0.1 to 15 mass%. Further, it is preferable to copolymerize acrylic acid units in the range of 2 to 10 mass% because of excellent adhesion.
Thus, the structural units derived from the monomer serve as crosslinking points in the acrylic polymer, and the hardness of the adhesive component can be adjusted to exhibit a target adhesive force.
The acrylic polymer can be obtained by copolymerization using a solution polymerization method, a bulk polymerization method, a suspension polymerization method, an emulsion polymerization method, an ultraviolet irradiation method, or an electron beam irradiation method. The weight average molecular weight of the acrylic polymer is preferably 40 to 140 ten thousand, more preferably 60 to 120 ten thousand, in order to achieve both coatability and adhesive properties. The weight average molecular weight is based on standard polystyrene conversion of Gel Permeation Chromatography (GPC). As the measurement conditions, TSKgel GMHXL [ manufactured by Tosoh Co ], a column temperature of 40 ℃ and a flow rate of tetrahydrofuran as an eluent were 1.0 mL/min, and TSK standard polystyrene was used as standard polystyrene.
In order to further increase the cohesive force of the adhesive, a crosslinking agent is preferably added. Examples of the crosslinking agent include an isocyanate crosslinking agent, an epoxy crosslinking agent, and a chelate crosslinking agent. Particularly, when the pressure-sensitive adhesive layer 4 is provided, an isocyanate-based crosslinking agent or an epoxy-based crosslinking agent is preferably used. The amount of the crosslinking agent to be added is preferably adjusted so that the gel fraction of the pressure-sensitive adhesive layer 4 becomes 25 to 80%. The gel fraction is more preferably 30 to 70%. Among them, 35 to 60% is most preferable. If the gel fraction is 25% or more, the adhesive has a moderate cohesive force, and therefore, the offset is not easily generated in the keystroke test. On the other hand, if the gel fraction is 80% or less, the adhesive does not become too hard, and the adhesive strength to an adherend such as a substrate is good. The gel fraction was measured by immersing the cured composition of the pressure-sensitive adhesive layer 4 in toluene and measuring the dried mass of the insoluble component remaining after leaving for 24 hours, and was expressed as a percentage of the original mass.
-rubber-based adhesive-
The rubber-based adhesive contains 1 or 2 or more kinds of rubber-based polymers such as natural rubber and modified products thereof, synthetic rubber-based polymers, and vinyl aromatic block copolymers (B).
The rubber-based adhesive preferably contains a vinyl aromatic block copolymer (B). Among them, 1 or 2 or more kinds of copolymers selected from block copolymers of aromatic vinyl compounds and conjugated diene compounds can be used, and styrene-based copolymers in which the aromatic vinyl compound is styrene are preferable. Further, as the conjugated diene compound, isoprene, butadiene, ethylenebutylene, and ethylenepropylene are preferable. Among them, the block copolymer (B) is preferably 1 or 2 or more copolymers selected from diblock copolymers such as styrene-isoprene copolymer, styrene-butadiene copolymer, styrene-ethylenebutylene copolymer and styrene-ethylenepropylene copolymer, triblock copolymers such as styrene-isoprene-styrene copolymer and styrene-butadiene-styrene copolymer, more preferably 1 or 2 or more copolymers selected from styrene-isoprene copolymer, styrene-butadiene copolymer, styrene-ethylenebutylene copolymer, styrene-isoprene-styrene copolymer and styrene-butadiene-styrene copolymer, and particularly preferably 1 or 2 or more copolymers selected from styrene-isoprene copolymer, styrene-butadiene-styrene copolymer, styrene-ethylene-butylene copolymer, styrene-isoprene-styrene copolymer, styrene-butadiene-styrene copolymer, styrene-isoprene copolymer, styrene-butadiene copolymer, styrene-ethylene-butadiene copolymer, styrene-isoprene copolymer, styrene-butadiene copolymer, styrene-butadiene copolymer, styrene-butadiene copolymer, styrene-styrene copolymer, styrene-butadiene copolymer, styrene-butadiene copolymer, styrene-butadiene copolymer, styrene-butadiene copolymer, or a copolymer, styrene-butadiene copolymer, styrene copolymer, or a copolymer, and a copolymer, 1 or more than 2 of styrene-isoprene-styrene copolymers.
The vinyl aromatic block copolymer is preferably a vinyl aromatic block copolymer having a structural unit represented by the following chemical formula (2) in a range of 10 to 80% by mass, more preferably a vinyl aromatic block copolymer having a structural unit represented by the following chemical formula (2) in a range of 12 to 60% by mass, still more preferably a vinyl aromatic block copolymer having a structural unit represented by the following chemical formula (2) in a range of 15 to 40% by mass, and still more preferably a vinyl aromatic block copolymer having a structural unit represented by the following chemical formula (2) in a range of 17 to 35% by mass, based on the total mass of the styrene-isoprene copolymer and the styrene-isoprene-styrene copolymer. This can provide excellent adhesiveness and heat resistance.
[ chemical formula 2 ]
As the vinyl aromatic block copolymer, a vinyl aromatic block copolymer containing 2 or more kinds of copolymers different in structure can be used, and a vinyl aromatic block copolymer containing a styrene-isoprene copolymer and a styrene-isoprene-styrene copolymer in combination can be used.
The styrene-based resin is preferably a resin containing the styrene-isoprene copolymer in a range of 0 to 80% by mass, more preferably a resin containing the styrene-isoprene copolymer in a range of 0 to 77% by mass, particularly preferably a resin containing the styrene-isoprene copolymer in a range of 0 to 75% by mass, and even more preferably a resin containing the styrene-isoprene copolymer in a range of 0 to 70% by mass, based on the total mass of the styrene-isoprene copolymer and the styrene-isoprene-styrene copolymer. By setting the above range, the excellent adhesive performance and the heat durability of the laminated film 1 of the present embodiment can be achieved at the same time.
The styrene-isoprene copolymer is preferably a styrene-isoprene copolymer having a weight average molecular weight (SC-8020 manufactured by Tosoh corporation, high molecular weight column TSKgelGMHHR-H, solvent: tetrahydrofuran) in the range of 1 to 80 ten thousand, more preferably 3 to 50 ten thousand, and still more preferably 5 to 30 ten thousand, as measured in terms of standard polystyrene by Gel Permeation Chromatography (GPC). By setting the above range, the fluidity under heating and the compatibility at the time of solvent dilution can be secured, and therefore, the workability in the production process is good, and it is more preferable to obtain the laminated film 1 having thermal durability.
The styrene-based copolymer may be a copolymer having a single structure such as a linear structure, a branched structure or a multi-branched structure, or a mixture of copolymers having different structures. When a styrene resin having a rich linear structure is used for the pressure-sensitive adhesive layer 4, excellent adhesion performance is imparted to the laminated film 1 of the present embodiment. On the other hand, a structure having a branched structure or a multi-branched structure and having a styrene block disposed at a molecular terminal can have a quasi-crosslinked structure, and can impart excellent cohesive force, and therefore, can impart high holding force. The styrene-based copolymer is preferably used in combination according to the required characteristics.
The method for producing the styrene-isoprene-styrene copolymer is not particularly limited, and conventionally known production methods can be applied, and the styrene-isoprene-styrene copolymer can be produced by the same method as described for the base layer.
-tackifying resins-
In the present embodiment, it is preferable to add a tackifier resin in order to improve the adhesive strength of the pressure-sensitive adhesive layer 4. Examples of the tackifier resin to be added to the pressure-sensitive adhesive layer 4 of the laminate film 1 of the present embodiment include rosin resins such as rosin and esterified products of rosin; terpene resins such as diterpene polymers and α -pinene-phenol copolymers; petroleum resins such as aliphatic (C5 series) and aromatic (C9 series); and styrene resins, phenol resins, xylene resins, and the like. In addition, an acrylic resin other than the acrylic copolymer may be added as a tackifier resin.
When the binder resin is an acrylic polymer, the amount of the tackifier resin added is preferably 10 to 60 parts by mass per 100 parts by mass of the acrylic polymer. When importance is attached to the adhesiveness, it is most preferable to add 20 to 50 parts by mass. When the binder resin is a rubber-based resin, it is preferable to add 80 to 150 parts by mass of a tackifier resin to 100 parts by mass of the rubber-based resin. In general, when the binder resin is a silicone resin, no tackifier resin is added.
When the adhesive contains the vinyl aromatic block copolymer (B), a tackifier resin having a softening point of 80 ℃ or higher is preferably used as the tackifier resin that can be contained in the adhesive. Thus, an adhesive and an adhesive tape having excellent initial adhesiveness and thermal durability can be obtained. The softening point is a value measured by the method (dry bulb method) defined in JISK 2207.
As the tackifier resin, for example, a tackifier resin which is solid at normal temperature (23 ℃) is preferably used, and petroleum resins such as C5 series petroleum resin, C5/C9 series petroleum resin, alicyclic series petroleum resin and the like can be used. The petroleum resin is easily compatible with the polyisoprene structure constituting the styrene resin, and as a result, the initial adhesion and thermal durability of the adhesive and the pressure-sensitive adhesive tape can be further improved.
As the C5-based petroleum resin, an aliphatic petroleum resin may be used, and examples thereof include Escorez1202, 1304, 1401 (manufactured by Toyobo chemical contract Co., Ltd.), WINGTACK 95 (manufactured by Goodyear Tire and Rubber Company), Quintone K100, R100, F100 (manufactured by ZEON corporation, Japan), Piccotac95, Piccopal100 (manufactured by Rika Hercules), and the like.
The C5-series/C9-series petroleum resin may be a copolymer of the C5-series petroleum resin and the C9-series petroleum resin, and examples thereof include Escorez 2101 (manufactured by TONEX), Quintone G115 (manufactured by ZEON, japan), and Hercotac 1149 (manufactured by Rika Hercules).
The alicyclic petroleum resin may be obtained by hydrogenating the C9 petroleum resin, and examples thereof include Escorez 5300 (manufactured by TONEX), Alcon P-100 (manufactured by Iskawa chemical industry), REGALITE R101 (manufactured by Rika Fine Tech), and the like.
Examples of the tackifier resin having a softening point of 80 ℃ or higher include polymerized rosin resin, C9 petroleum resin, terpene resin, rosin resin, terpene-phenol resin, styrene resin, coumarone-indene resin, xylene resin, and phenol resin, in addition to the C5 petroleum resin, C5/C9 petroleum resin, and alicyclic petroleum resin.
Among them, the above-mentioned C5-based petroleum resin and polymerized rosin-based resin are preferably used in combination from the viewpoint of achieving both of further excellent initial adhesiveness and thermal durability as the tackifier resin having a softening point of 80 ℃ or higher.
The tackifier resin having a softening point of 80 ℃ or higher is preferably used in a range of 3 to 100 mass%, more preferably 5 to 80 mass%, based on the total amount of the styrene resin, and is more preferably used in a range of 5 to 80 mass% in order to obtain an adhesive agent and an adhesive tape which are excellent in both adhesiveness and thermal durability.
In order to obtain the adhesiveness and initial adhesiveness in a constant temperature environment, a tackifier resin having a softening point of-5 ℃ or lower may be used in combination with the tackifier resin having a softening point of 80 ℃ or higher. The above-mentioned flow point is a value measured by a method in accordance with the method defined in JISK 2269.
As the above-mentioned tackifier resin having a softening point of-5 ℃ or lower, a tackifier resin which is liquid at room temperature is preferably used. The tackifier resin that is liquid at room temperature is preferably selected from known ones.
As the tackifier resin having a softening point of-5 ℃ or lower, for example, process oil, polyester, liquid rubber such as polybutene, or the like can be used, and among them, polybutene is preferably used from the viewpoint of further excellent initial adhesiveness.
The above-mentioned tackifier resin having a softening point of-5 ℃ or lower is preferably used in a range of 0 to 40% by mass, more preferably 0 to 30% by mass, based on the total amount of the above-mentioned tackifier resin.
The tackifier resin having a softening point of-5 ℃ or lower is preferably used in a range of 0 to 40% by mass, and in a range of 0 to 30% by mass, based on the total amount of the styrene resin, and can improve initial adhesion to achieve good adhesion and sufficient thermal durability.
The mass ratio of the tackifier resin having a softening point of 80 ℃ or higher to the tackifier resin having a softening point of-5 ℃ or lower is preferably in the range of 5 to 50, and more preferably in the range of 10 to 30 in terms of obtaining an adhesive or a pressure-sensitive adhesive tape which has both excellent initial adhesiveness and excellent holding power.
The styrene resin and the tackifier resin are preferably used in combination in a mass ratio of [ styrene resin/tackifier resin ] of 0.5 to 10.0, and in a range of 0.6 to 9.0, so that initial adhesion can be improved and excellent thermal durability can be obtained. The above-mentioned mass ratio [ styrene-based resin/tackifier resin ] is preferably greater than 1, for example, in terms of preventing separation (repulsion resistance) due to repulsion of the pressure-sensitive adhesive tape when the pressure-sensitive adhesive tape is stuck to a curved surface portion of an adherend.
-filler particles- -
In the present embodiment, the adhesive of the adhesive layer 4 preferably contains filler particles.
When the adhesive contains filler particles, the filler particles are exposed from the adhesive layer 4 when the stretched adhesive sheet is stretched, and the adhesive area between the adhesive layer 4 and an adherend is reduced, so that the stretched adhesive sheet can be easily peeled off even when the stretching direction of the adhesive sheet is at a high angle such as a vertical direction (also referred to as a "90 ° direction") with respect to the bonding surface of an object to be bonded (hereinafter also referred to as an "adherend").
The type of the filler particles is not particularly limited, and may be appropriately selected within a range not impairing the effects of the present invention, and may be inorganic filler particles or organic filler particles. These may be used alone in 1 kind, or may be used in combination of 2 or more kinds.
Specific examples of the inorganic filler particles include aluminum hydroxide, magnesium hydroxide, aluminum oxide, silicon oxide, magnesium oxide, zinc oxide, titanium oxide, zirconium oxide, iron oxide, silicon carbide, boron nitride, aluminum nitride, titanium nitride, silicon nitride, titanium boride, carbon, nickel, copper, aluminum, titanium, gold, silver, zirconium hydroxide, basic magnesium carbonate, dolomite, hydrotalcite, calcium hydroxide, barium hydroxide, tin oxide, hydrates of tin oxide, borax, zinc borate, zinc metaborate, barium metaborate, zinc carbonate, magnesium carbonate-calcium, calcium carbonate, barium carbonate, molybdenum oxide, antimony oxide, red phosphorus, mica, clay, kaolin, talc, zeolite, wollastonite, montmorillonite, silica (quartz, fumed silica, precipitated silica, anhydrous silicic acid, fused silica, crystalline silica, ultrafine amorphous silica, etc.), inorganic filler particles, and inorganic filler particles, Potassium titanate, magnesium sulfate, sepiolite, xonotlite, aluminum borate, barium sulfate, barium titanate, zirconium oxide, cerium, tin, indium, carbon, sulfur, tellurium (テリウム), molybdenum, strontium, chromium, barium, lead, tin oxide, indium oxide, diamond, magnesium, platinum, zinc, manganese, stainless steel, and the like. Among them, aluminum hydroxide, nickel and the like are preferable.
In addition, the inorganic filler may be subjected to surface treatment such as silane coupling treatment or stearic acid treatment in order to improve dispersibility in the binder.
Specific examples of the organic filler particles include polystyrene fillers, benzoguanamine fillers, polyethylene fillers, polypropylene fillers, silicone fillers, urea-formalin fillers, styrene/methacrylic acid copolymers, silicone fillers, fluorine fillers, acrylic fillers, polycarbonate fillers, polyurethane fillers, polyamide fillers, epoxy resin fillers, and thermosetting resin hollow fillers.
The shape of the filler particles is not particularly limited, and may be appropriately selected depending on the purpose, and may be a regular shape or an irregular shape. Specific examples of the shape of the filler particles include polygonal, cubic, elliptical, spherical, needle-like, flat, scaly and the like. The filler particles having the above-mentioned shape may be used alone in 1 kind, or may be used in combination in 2 or more kinds. Further, the filler particles may be aggregated in the above-described shape. Among them, the shape of the filler particles is preferably an elliptical shape, a spherical shape, or a polygonal shape. If the filler particles have an elliptical, spherical or polygonal shape, the pressure-sensitive adhesive layer 4 slides well against the adherend when the pressure-sensitive adhesive sheet is stretched, and even if the stretching direction of the pressure-sensitive adhesive sheet is 90 ° to the adherend surface of the adherend, the adhesive sheet can be easily peeled off by stretching.
Particle size distribution (D) as filler particles90/D10) The amount of the filler is not particularly limited, and may be suitably selected according to the purpose, but is preferably 2.5 to 20, more preferably 2.5 to 15, and still more preferably 2.5 to 5 from the viewpoint of impact resistance. If the particle size distribution (D) of the filler particles90/D10) Within the above preferred range, the pressure-sensitive adhesive sheet can be easily peeled off by elongation even when the elongation direction of the pressure-sensitive adhesive sheet is 90 ° to the adherend surface, and is less likely to be torn even when the thickness of the substrate of the pressure-sensitive adhesive sheet is small, and is excellent in impact resistance, shear adhesion, and tear adhesion. On the other hand, if the particle size distribution (D) of the filler particles90/D10) When the elongation direction of the pressure-sensitive adhesive sheet is less than 2.5, the elongation peelability in the 90 ° direction with respect to the adherend surface of the pressure-sensitive adhesive sheet may be impaired, and when it exceeds 20, the pressure-sensitive adhesive properties such as impact resistance, shear adhesion, and split adhesion may be impaired.
Particle size distribution (D) of the filler particles90/D10) For example byThe particle size of the filler particles was measured by a measuring instrument (Microtrac) using a laser diffraction scattering method, and converted into a particle size distribution.
The volume average particle diameter of the filler particles is not particularly limited and may be appropriately selected according to the purpose, and is preferably 3 to 25 μm, more preferably 5 to 20 μm, and still more preferably 5 to 14 μm. When the volume average particle diameter of the filler particles is within the above-described preferred range, the pressure-sensitive adhesive sheet can be easily peeled off by elongation even when the direction of elongation of the pressure-sensitive adhesive sheet is 90 ° to the adherend surface, and the pressure-sensitive adhesive sheet is less likely to be torn even when the thickness of the substrate is small, and is excellent in impact resistance, shear adhesion and fracture adhesion. On the other hand, if the volume average particle diameter of the filler particles is less than 3 μm, it may be difficult to perform elongation peeling when the elongation direction of the pressure-sensitive adhesive sheet is in a 90 ° direction with respect to the adherend surface, and if it exceeds 25 μm, the adhesive properties such as impact resistance, shear adhesion, and fracture adhesion may be impaired.
The volume average particle diameter of the filler particles can be measured, for example, by using a measuring instrument (Microtrac) using a laser diffraction scattering method.
The ratio of the volume average particle diameter of the filler particles to the average thickness of the pressure-sensitive adhesive layer 4 described later is not particularly limited and may be appropriately selected depending on the purpose, and the ratio of the volume average particle diameter of the filler particles to the average thickness of the pressure-sensitive adhesive layer 4, which is expressed by [ volume average particle diameter of the filler particles/average thickness of the pressure-sensitive adhesive layer ], is preferably 5/100 or more, more preferably 5/100 to 95/100, still more preferably 10/100 to 75/100, and particularly preferably 20/100 to 60/100. If the ratio is within the preferred range, even if the elongation direction of the pressure-sensitive adhesive sheet is 90 ° to the adherend surface, the pressure-sensitive adhesive sheet can be easily peeled off by elongation, and even if the thickness of the substrate of the pressure-sensitive adhesive sheet is small, the pressure-sensitive adhesive sheet is not easily torn. Further, if the ratio is within the above-described particularly preferable range, even if the elongation direction of the pressure-sensitive adhesive sheet is 90 ° to the adherend surface, the pressure-sensitive adhesive sheet can be easily peeled off by elongation, and even if the thickness of the substrate of the pressure-sensitive adhesive sheet is small, the pressure-sensitive adhesive sheet is not easily torn, and is advantageous in that the pressure-sensitive adhesive sheet is more excellent in adhesive properties such as impact resistance, shear adhesion, and split adhesion. On the other hand, if the ratio is less than 5/100, the elongation peeling property of the pressure-sensitive adhesive sheet in the case where the elongation direction is 90 ° to the adherend surface is impaired, and if it exceeds 95/100, the adhesive properties such as impact resistance, shear adhesion, and split adhesion are impaired.
The content of the filler particles in the adhesive layer 4 is preferably 9 to 50 mass%, more preferably 13 to 34 mass%, and still more preferably 17 to 30 mass% with respect to 100 mass% of the adhesive. If the content of the filler particles is less than 9% by mass relative to 100% by mass of the pressure-sensitive adhesive, elongation peeling cannot be performed when the direction of elongation of the pressure-sensitive adhesive sheet is 90 ° to the surface to be adhered of the adherend, and further, tearing of the pressure-sensitive adhesive sheet occurs, and the pressure-sensitive adhesive sheet cannot be peeled without being elongated. If the content of the filler particles relative to 100% by mass of the adhesive exceeds 50% by mass, the adhesive sheet may not stretch, the adhesive composition may remain on an adherend, impact resistance may deteriorate, and shear adhesion and fracture adhesion may deteriorate. On the other hand, if the content of the filler particles is 9 to 50% by mass relative to 100% by mass of the pressure-sensitive adhesive, even if the elongation direction of the pressure-sensitive adhesive sheet is 90 ° relative to the sticking surface of the adherend, the pressure-sensitive adhesive sheet can be easily peeled by elongation, and even if the thickness of the substrate of the pressure-sensitive adhesive sheet is thin, the pressure-sensitive adhesive sheet is not easily torn, and is excellent in impact resistance, shear adhesion, and fracture adhesion.
The content of the above filler particles in the adhesive layer 4 may be appropriately adjusted at the time of preparing the adhesive.
The volume ratio of the filler particles to the volume of the entire adhesive layer 4 is 4% to 40%, preferably 5% to 30%, more preferably 5% to 20%, and still more preferably 5% to 15%. If the volume ratio of the filler particles is less than 4%, the adhesive sheet cannot be peeled off by elongation when the elongation direction of the adhesive sheet is oriented at 90 ° to the adherend surface of the adherend, and further, the adhesive sheet tears, and the adhesive sheet cannot be peeled off without being elongated. If the volume ratio of the filler particles exceeds 40%, the pressure-sensitive adhesive sheet may not be stretched, the pressure-sensitive adhesive remains on an adherend, impact resistance may deteriorate, and shear adhesion and fracture adhesion may deteriorate. On the other hand, if the volume ratio of the filler particles is 4% to 40%, even if the elongation direction of the pressure-sensitive adhesive sheet is 90 ° to the surface to be adhered of the adherend, the pressure-sensitive adhesive sheet can be easily peeled off by elongation, and even if the thickness of the substrate of the pressure-sensitive adhesive sheet is thin, the pressure-sensitive adhesive sheet is not easily torn, and is excellent in impact resistance, shear adhesion, and split adhesion.
The volume ratio of the filler particles to the pressure-sensitive adhesive layer 4 can be calculated from the following formulas (1) to (3).
Adhesive resin＊1Mass A (g)/binder resin of＊1Density A (g/cm)3) Binder resin＊1Volume A (cm) of3) The formula (1)
Mass of filler particles B (g)/density of filler particles B (g/cm)3) Volume B (cm) of filler particles3) The type (2)
Volume B (cm) of filler particles3) /(adhesive resin)＊1Volume A (cm) of3) + volume B (cm) of filler particles3)100 (%) of filler particles, formula (3)
In the above formulas (1) and (3),＊1the binder resin shown may contain other components as necessary.
The density is a value measured according to JIS Z8804.
Other components- -
In the present embodiment, other known and conventional additives may be added as needed. Specifically, as additives for adhesives, additives including other polymer components, crosslinking agents, anti-aging agents, ultraviolet absorbers, fillers, polymerization inhibitors, surface control agents, antistatic agents, antifoaming agents, viscosity control agents, light-resistant stabilizers, weather-resistant stabilizers, heat-resistant stabilizers, antioxidants, leveling agents, organic pigments, inorganic pigments, pigment dispersants, plasticizers, softening agents, flame retardants, metal deactivators, organic beads, and the like can be used as needed within a range that does not impair the properties; inorganic fillers such as silica, alumina, titania, zirconia, and antimony pentoxide.
The characteristics of the adhesive layer- -
In the present embodiment, the loss tangent of the dynamic viscoelastic spectrum at a frequency of 1Hz of the adhesive is preferably 0.5 to 0.8 at 70 ℃. More preferably 0.55 to 0.75. When the amount is 0.5 or more, the peeling resistance is excellent, and when the amount is 0.8 or less, the bleeding of the adhesive in the printed portion at high temperature is likely to be reduced.
The thickness of the pressure-sensitive adhesive layer 4 is not particularly limited, but is preferably 5 to 100. mu.m, more preferably 5 to 75 μm, and still more preferably 10 to 60 μm. Within this range, both adhesiveness and thinning of the tape can be easily achieved.
The stress at 50% elongation of the pressure-sensitive adhesive layer 4 of the multilayer film of the present embodiment is 0.05 to 10.5MPa, more preferably 0.07 to 7.5MPa, still more preferably 0.1 to 5.5MPa, and yet more preferably 0.15 to 3.5 MPa. When the stress at 50% elongation of the pressure-sensitive adhesive layer 4 is in the above range, excellent adhesiveness and releasability of the pressure-sensitive adhesive tape can be obtained. That is, the pressure-sensitive adhesive tape can easily follow strain or the like of an adherend, can easily obtain excellent adhesive strength, and can suppress the pressure-sensitive adhesive layer 4 from remaining on the adherend in the step of peeling the pressure-sensitive adhesive tape.
The storage modulus G' (23 ℃) of the pressure-sensitive adhesive layer 4 of the laminate film 1 of the present embodiment is 1.0X 105～1.0×107Pa, preferably 1.0X 105～8.0×106Pa, more preferably 1.0X 105～5.0×106Pa, more preferably 1.0X 105～4.0×106Pa, most preferably 1.0X 105～3.0×106Pa. By setting the storage modulus G' (23 ℃) of the pressure-sensitive adhesive layer 4 to the above range, excellent adhesiveness and releasability of the pressure-sensitive adhesive tape can be obtained, and particularly, even after use in a high-temperature and high-humidity environment, the pressure-sensitive adhesive layer 4 can be prevented from remaining on an adherend in a step of releasing the pressure-sensitive adhesive tape.
The thickness of the adhesive layer 4 is preferably 1/2 to 1/500, more preferably 1/3 to 1/300, still more preferably 1/5 to 1/200, and still more preferably 1/10 to 1/50, relative to the thickness of the base material layer. When the thickness ratio of the pressure-sensitive adhesive layer 4 to the base layer of the pressure-sensitive adhesive tape is in the above range, excellent adhesiveness and releasability of the pressure-sensitive adhesive tape can be obtained. In the laminated film 1 of the present embodiment, since the cohesive force of the pressure-sensitive adhesive layer 4 is lower than that of the base material layer, when the pressure-sensitive adhesive layer 4 is thicker than the above range, only the pressure-sensitive adhesive layer 4 may remain on the adherend in the step of peeling the pressure-sensitive adhesive tape. In addition, when the pressure-sensitive adhesive layer 4 is thinner than the above range, there is a possibility that the pressure-sensitive adhesive layer 4 cannot follow the surface of the adherend when the surface of the adherend has irregularities or the like, and the adhesive strength may be significantly reduced.
The pressure-sensitive adhesive layer 4 used in the laminate film 1 of the present embodiment preferably has a stress at break point of 0.5 to 25.0MPa, more preferably 0.8 to 20.0MPa, even more preferably 1.0 to 17.0MPa, and even more preferably 1.2 to 15.0 MPa. When the stress at the breaking point of the pressure-sensitive adhesive layer 4 is in the above range, excellent adhesiveness can be exhibited, and when the laminated film 1 of the present embodiment is subjected to stretch peeling, the pressure-sensitive adhesive component is less likely to remain on the adherend, which is preferable.
Method for producing laminated film
The laminated film 1 of the present embodiment is not particularly limited, and can be produced by a known method, for example. Specifically, the laminate film 1 is formed with adhesive layers on both surfaces of a release film (release liner) by applying an adhesive to the surface of the release film and drying the adhesive (that is, 2 pieces of release film with an adhesive formed thereon are produced). In this case, when the pressure-sensitive adhesive layer is formed on the surface of at least one release film, for example, a portion not coated with the pressure-sensitive adhesive is formed on the release film by a gravure printing method, a die coating method, or a comma coating method, and the adhesive-free portion 2 is formed in the pressure-sensitive adhesive layer. Next, the pressure-sensitive adhesive layer having the release film is bonded to both surfaces of the prepared base material layer, and a laminated film 1 is obtained by applying pressure or the like as necessary.
In the laminated film 1 of the present embodiment, as described in the above-described manufacturing method, a release film may be laminated to protect the pressure-sensitive adhesive layer 4. The release film is not particularly limited, and for example, a release film obtained by subjecting at least one surface or both surfaces of a base material layer such as a synthetic resin film of polyethylene, polypropylene, or a polyester film, paper, a nonwoven fabric, cloth, a foamed sheet, a metal foil, or a laminate thereof to a release treatment such as a silicone treatment, a long-chain alkyl treatment, or a fluorine treatment for improving releasability from an adhesive can be used.
Characteristics of the laminated film
The total thickness of the laminated film 1 of the present embodiment is preferably 50 to 3000 μm, more preferably 70 to 500 μm, and still more preferably 100 to 300 μm.
The adhesive strength of the laminated film 1 of the present embodiment measured by the method described in the examples described later is preferably 1 to 50N/20mm, more preferably 10 to 30N/20mm, and still more preferably 15 to 25N/20 mm. By setting the above range, both the tearability and the adhesiveness of the tape at the time of detachment can be easily achieved.
Adhesive tape
As shown in fig. 3 and 5, the pressure-sensitive adhesive tape 11 of the present embodiment includes a base layer 13 and pressure-sensitive adhesive layers 14 positioned on both surfaces of the base layer 13. The adhesive tape 11 has a non-adhesive part 12 on at least one surface of 1 end part side of the adhesive tape 11, in which the adhesive layer 14 is not present, and the base layer 13 has an elongation at break of 200 to 3000% and a breaking strength of 1.5 to 80 MPa. The adhesive tape 11 of the present embodiment has the above-described configuration, and thus, even when the adhesive tape 11 is peeled off at an angle to the attachment surface, the load on the adhesive tape 11 can be reduced and tearing can be prevented.
Here, the shape of the adhesive tape 11 of the present embodiment may be any shape depending on the object to which the adhesive tape 11 is attached, and for example, as shown in fig. 3, the shape is preferably a shape having 2 or more end portions. Specifically, the adhesive tape 11 has rectangular portions constituting 1 end portion of the adhesive tape 11 in the number of end portions of the adhesive tape 11, one side of each rectangular portion is directed to the center side of the adhesive tape 11, and the other side (the side to be the end portion) of each rectangular portion is directed to the outside of the adhesive tape 11, whereby the adhesive tape 11 can be formed into a shape having 2 or more end portions. More specifically, in the case where the end portion of the adhesive tape 11 is 2, one sides of the 2 rectangular portions are connected to each other so that the 2 rectangular portions are continuous, and as shown in fig. 3, the entire portion is linear (in this case, the entire portion is also rectangular). When the number of the end portions is 3 or more, the rectangular portions are connected to each other at one side thereof toward the central portion of the adhesive tape 11, and the other side thereof is extended (widened) outward from the central portion, whereby a Y-shape (fig. 4) or the like can be formed, for example. The rectangular portion of the adhesive tape 11 need not be strictly rectangular, but may be curved as long as the entire portion is long in one direction. The adhesive tape 11 may be bent or folded as a whole. Further, the width of the adhesive tape 11 may vary in the longitudinal direction.
In the present embodiment, as shown in fig. 3, the adhesive tape 11 has the adhesive-free portion 12 on at least one surface of 1 end portion side of the adhesive tape 11. Specifically, the illustrated adhesive tape 11 has 2 end portions, and the adhesive-free portion 12 is formed in a portion near (on the center side of) 1 of the end portions. The specific distance from the end of the adhesive-free portion 12 can be set arbitrarily according to the object to which the tape 11 is to be applied. By forming the adhesive-free portion 12 so as to be separated from one end, the end portion side can be used as a handle portion when the adhesive tape 11 is peeled. In the illustrated example, the non-adhesive portion 12 is provided near one of the ends, but the non-adhesive portion 12 may be provided near some of the ends or near all of the ends.
In the adhesive tape 11 of the present embodiment, the adhesive-free portion 12 is formed on the surface of the adhesive tape 11 so as to cross from one end (edge) to the other end (edge) in the width direction (direction orthogonal to the longitudinal direction). The adhesive-free portion 12 is formed on one surface of the pressure-sensitive adhesive tape 11 in the illustrated example, but may be formed on the other surface in the vicinity of the end portion in the same manner, and is preferably formed so that the adhesive-free portion 12 on one surface overlaps the adhesive-free portion 12 on the other surface in a plan view of the pressure-sensitive adhesive tape 11, and more preferably formed in the same range.
Here, the operation and effect of the pressure-sensitive adhesive tape 11 of the present embodiment will be described.
Conventionally, in a device for mounting components at high density, other members are mounted on a frame body adjacent to a component to be attached using an adhesive tape. In order to peel the adhesive tape away from the other member, the handle portion of the adhesive tape is pulled and peeled at an angle to the sticking surface, and the adhesive tape may be torn by applying a load.
In contrast, when the adhesive tape 11 of the present embodiment is used to fix a component to a frame or the like, the adhesive tape 11 is attached so that the adhesive-free portion 12 of the adhesive tape 11 (particularly, the end portion side of the adhesive tape 11 in the adhesive-free portion 12) is positioned at a portion of the attachment surface of the component adjacent to a corner defining the attachment surface, and thus when the adhesive tape 11 is peeled from the component at an angle with respect to the attachment surface, the adhesive-free portion 12 can alleviate a large force applied to the portion of the adhesive tape 11 in the vicinity of the corner attached to the component (corresponding to the adhesive-free portion 12) at which the elongation starts. Therefore, the load on the pressure-sensitive adhesive tape 11 can be reduced to prevent tearing.
In the adhesive tape 1 of the present embodiment, the adhesive-free portion 12 may be the same as the adhesive-free portion 2 of the laminated film 1 according to the above-described embodiment of the present invention. The size of the adhesive-free part 12 in the adhesive tape can be set arbitrarily, and the length of the adhesive-free part 12 measured in the longitudinal direction is preferably 0.5 to 100mm, more preferably 1 to 50mm, and further preferably 10 to 30 mm. By setting the length to 0.5mm or more, the adhesive-free portion 12 can be easily attached to the corner of the member, and the load on the adhesive tape 11 can be reduced and tearing can be effectively prevented even if the handle portion of the adhesive tape 11 is pulled at the angle when the adhesive tape 11 is peeled.
Further, when the handle portion with the angle-stretch adhesive tape 11 is pulled, the portion of the adhesive tape 11 which is adhered to the corner of the member is applied with a larger force by the start of the elongation when the stretching of the adhesive tape 11 is started, and therefore the length of the adhesive-free portion 12 may be long enough to be easily peeled off when the elongation of the adhesive tape 11 is started. Further, the adhesive property of the adhesive tape 11 can be easily maintained by setting the length of the adhesive-free portion 12 measured in the longitudinal direction to 100mm or less. By setting the length to 100mm or less, the adhesive-free portion 12 does not become excessively large, and the influence on the adhesiveness of the adhesive tape 11 can be suppressed.
In the adhesive tape 11 of the present embodiment, as described above, the end portion of the adhesive tape 11, specifically, the end portion side of the adhesive tape 11 from the adhesive-free portion 12 can be used as a handle portion, and in the handle portion, as described below, the film 15 can be bonded to the surface of the adhesive tape 11 (without a release treatment) or the adhesive layer 14 can be omitted. In the case where the pressure-sensitive adhesive layer 14 is not formed in the grip portion, as in the case of the adhesive-free portion 12, the length of the adhesive-free portion 12 measured in the longitudinal direction may be a length obtained by adding the length of the grip portion.
Examples of the material of the film 15 include cellophane, polyethylene, polypropylene, nylon, polystyrene, polyimide, polyester, and tetrafluoroethylene. Among them, a polyester film which is inexpensive and excellent in processability and tetrafluoroethylene which is excellent in slidability are preferable.
The width of the adhesive tape 11 can be set arbitrarily, and particularly, the length of the end of the adhesive tape 11 where the adhesive-free portion 12 is formed, measured in the width direction, is preferably 0.5 to 100mm, and more preferably 10 to 50 mm.
By setting the length to 0.5 to 100mm, the adhesive tape 11 can be easily used while ensuring its adhesiveness.
The length of the entire adhesive tape 11 can be arbitrarily set according to the object to which the tape is to be attached.
The adhesive tape 11 may have the same configuration except for the adhesive-free portion 12, and specifically, the adhesive layer, the base layer, and the like may be the same as those of the laminated film.
Method for producing adhesive tape
The adhesive tape 11 of the present embodiment is not particularly limited, and can be produced by a known method, for example. Specifically, the adhesive tape 11 is first manufactured as the above-described laminated film. Then, the laminated film is cut into a desired shape, whereby the adhesive tape 11 can be obtained.
In the formation of the adhesive-free portion of the adhesive tape, the adhesive layer can be removed from the laminated film or the adhesive tape having the adhesive layer on the entire surface thereof to form the adhesive-free portion in a desired shape and size.
The characteristics of the adhesive tape
The total thickness and the adhesive strength of the adhesive tape 11 of the present embodiment may be the same as those of the laminated film described above.
Adhesive body
As shown in fig. 5, the adhesive body of the present embodiment includes: the pressure-sensitive adhesive tape 11 according to the embodiment of the present invention described above, the first adherend 16 attached to one surface of the pressure-sensitive adhesive tape 11, and the second adherend 17 attached to the other surface of the pressure-sensitive adhesive tape 11. In the pressure-sensitive adhesive tape 11 of the adhesive body of the present embodiment, a portion on the end portion side of the adhesive-free portion 12 is positioned outside the first sticking surface of the first adherend 16 to which the pressure-sensitive adhesive tape 11 is stuck, and the corner 18 defining the first sticking surface is positioned on the adhesive-free portion 12.
According to the adhesive body of the present embodiment, when the pressure-sensitive adhesive tape 11 is peeled off at an angle with respect to the attachment surface in order to remove the first adherend 16 from the second adherend 17, the load on the pressure-sensitive adhesive tape 11 can be reduced, and therefore, the tearing of the pressure-sensitive adhesive tape 11 can be prevented.
Here, the first adherend 16 and the second adherend 17 are not particularly limited, and examples thereof include those used in various industrial fields such as OA equipment, IT and home electric appliances, and automobiles, and in the case where the second adherend 17 is a frame body of the above-mentioned product, and the first adherend 16 is a component incorporated in the above-mentioned product such as a battery, an electronic component, or a structural component, the first adherend 16 and the second adherend 17 can be fixed or temporarily fixed by the pressure-sensitive adhesive tape 11. Alternatively, for example, the first adherend 16 may be a label on which product information and the like are displayed, and the second adherend 17 may be a display portion on which the label is displayed.
In the adhesive body of the present embodiment, the portion of the pressure-sensitive adhesive tape 11 on the end portion side of the adhesive-free portion 12 is positioned outside the first sticking surface of the first adherend 16 to which the pressure-sensitive adhesive tape 11 is stuck. As shown in fig. 5, a portion of the pressure-sensitive adhesive tape 11 on the end portion side of the adhesive-free portion 12 is a portion which is not sandwiched between the first adhering surface of the first adherend 16 and the second adhering surface of the second adherend 17 to which the pressure-sensitive adhesive tape 11 is adhered, and can be used as a handle portion when the pressure-sensitive adhesive tape 11 is peeled.
As shown in fig. 5, in the adhesive body of the present embodiment, the corner 18 defining the first sticking surface is positioned on the adhesive-free portion 12. Specifically, in the illustrated example, the corner 18 defining the first adhesion surface is located on the boundary between the adhesive-free portion 12 and the portion on the end portion side of the adhesive tape 11 (the end portion on the end portion side of the adhesive tape 11 in the adhesive-free portion 12).
However, in the present embodiment, it is not necessary that the boundary exactly coincides with the corner 18 as in the illustrated example, and the corner 18 may be located closer to the adhesive-free portion 12 than the boundary (the adhesive-free portion 12 of the pressure-sensitive adhesive tape 11 may be located on the side surface of the first adherend 16). In the case where the corner 18 is located closer to the adhesive-free portion 12 than the boundary, the distance between the corner 18 and the boundary between the adhesive-free portion 12 and the pressure-sensitive adhesive layer 14 on the side opposite to the end portion side (in other words, the length of the overlap of the first adhering surface of the first adherend 16 and the adhesive-free portion 12 in plan view) is preferably 1mm or more, from the viewpoint of sufficiently obtaining the effect of preventing the adhesive tape 11 from tearing by the adhesive-free portion 12.
Here, in the method of assembling the adhesive body of the present embodiment, first, the pressure-sensitive adhesive tape 11 is attached to the first attaching surface of the first adherend 16. At this time, the first adhesion surface is adhered so that the corner 18 defining the first adhesion surface is positioned in the adhesive-free portion 12. Next, the first adherend 16 is bonded to the second adherend 17, whereby assembly can be performed.
Alternatively, instead of the above method, first, the pressure-sensitive adhesive tape 11 is attached to the second attachment surface of the second adherend 17. At this time, the adhesive-free portion 12 is attached so as to be positioned on the second attachment surface defining the corner 18 of the first attachment surface. Next, the first adherend 16 is bonded to the second adherend 17 so that the corner 18 of the first bonding surface of the first adherend 16 is positioned in the adhesive-free portion 12 of the pressure-sensitive adhesive tape 11, whereby assembly can be performed.
In the method of detaching the adhesive body according to the present embodiment, the adhesive tape 11 is peeled off by stretching a portion of the adhesive tape 11 on the end portion side of the adhesive-free portion 12 (a portion disposed along the side surface of the first adherend 16 in fig. 5) at an angle of 60 ° or more with respect to the sticking surface, and the first adherend 16 is detached from the second adherend 17. In the case where the angle of the portion on the end portion side of the stretch adhesive tape 11 is 75 ° or more with respect to the sticking surface, the adhesive tape 11 of the present embodiment can be more preferably used.
The embodiments of the present invention have been described above with reference to the drawings, but the pressure-sensitive adhesive tape and the adhesive body of the present invention are not limited to the above examples, and modifications may be appropriately made.
[ examples ] A method for producing a compound
The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to the following examples.
< method of measurement and evaluation >
The adhesive tapes obtained in the examples and comparative examples were measured and evaluated by the following methods.
(1) Elongation at break of substrate layer
The breaking elongation of the pressure-sensitive adhesive tape was measured by punching the pressure-sensitive adhesive tape into a dumbbell shape having a reticle length of 20mm and a width of 10mm, swelling the pressure-sensitive adhesive with a solvent such as ethyl acetate, alcohol, or toluene, scraping off with a spatula (spatula) or the like to obtain only a substrate layer of the pressure-sensitive adhesive tape, further drying the solvent with a dryer, and then stretching the substrate layer in the longitudinal direction at a stretching speed of 300mm/min under a measurement atmosphere of 23 ℃ and 50% RH using a Tensilon tensile tester.
(2) Fracture strength of substrate layer
The breaking strength of the base layer was measured by punching the adhesive tape into a dumbbell shape having a reticle length of 20mm and a width of 10mm, swelling the adhesive with a solvent such as ethyl acetate, alcohol, or toluene, scraping off with a spatula or the like to obtain only the base layer of the adhesive tape, further drying the solvent with a dryer, and then stretching the base layer in the longitudinal direction at a stretching speed of 300mm/min under a measurement atmosphere of 23 ℃ and 50% RH using a Tensilon tensile tester.
(3) Adhesion of adhesive layer
One pressure-sensitive adhesive surface of the pressure-sensitive adhesive tape was backed with a polyester film (thickness: 25 μm), and the size was 20mm × 100mm, to obtain a tape sample. A stainless steel plate was placed on the other adhesive surface of the tape sample, and the tape sample was applied to the other adhesive surface 1 time with a 2kg roller and then left to stand at 23 ℃ and 50% RH for 1 hour. Then, the film was peeled at a peeling speed of 300mm/min in a 180 ℃ direction, and the adhesive force (N/20mm) at this time was measured.
(4) Thickness of substrate layer and adhesive layer
After the pressure-sensitive adhesive tape was immersed in liquid nitrogen for 1 minute, the tape was folded and cut in liquid nitrogen with a pair of tweezers, with the width direction of the tape being a fold line, and cut sections for observing the cut surfaces in the thickness direction of the tape were produced. After the cut surface was returned to normal temperature in a dryer, the cut surface was observed using an electron microscope (Miniscope (registered trademark) TM3030Plus, manufactured by Hitachi High-Technologies Co., Ltd.) by fixing the cut surface to a sample stage so that an electron beam is incident perpendicularly to the cut surface. The thicknesses of the base material layer and the pressure-sensitive adhesive layer in the pressure-sensitive adhesive tape at 10 spots were measured on the basis of the scale of an electron microscope, and the arithmetic average thereof was taken as the thickness of each layer. The thickness of the base layer and the adhesive layer is a length measured from one surface of each layer to the other surface thereof in the lamination direction.
(5) Peelability of
After a first adherend described later was fixed to a second adherend described later using the pressure-sensitive adhesive tape having a length of 120mm × a width of 20mm obtained in examples and comparative examples, the ease of peeling of the pressure-sensitive adhesive tape was evaluated. Specifically, an adhesive tape having a length of 120mm × a width of 20mm was prepared, and the adhesive tape was attached to a stainless steel plate as a second adherend in a state where a portion having a length of 20mm on the tip side was exposed as a handle portion. Next, the first adherend is attached to the pressure-sensitive adhesive tape so that the longitudinal direction of the pressure-sensitive adhesive tape is oriented in the longitudinal direction of the first adherend, and the corner of the first attachment surface of the first adherend is located at the boundary between the grip portion and the adhesive-free portion of the pressure-sensitive adhesive tape. Further, after 1 time of reciprocal pressure-bonding with a 5kg load roller, the sheet was left at 23 ℃ for 1 hour or at 85 ℃ for 500 hours, and then, the grip portion was gripped, and the sheet was pulled out in a direction of 90 ° with respect to the first adhesion surface of the first adherend (a direction perpendicular to the tape surface). The adhesive tapes of examples and comparative examples were fixed and left at 23 ℃ for 1 hour, and fixed and left at 85 ℃ for 500 hours, and 10 test pieces were evaluated for the possibility of peeling without tearing. In the case of the pressure-sensitive adhesive tape having no adhesive part formed on the surface (comparative example 1), it was fixed to a stainless steel plate by the same method as in example 1 and the like.
Very good: 10 out of 10 can be peeled off.
Good: 7-9 of the 10 can be peeled off.
And (delta): 1-6 of the 10 can be peeled off.
X: 1 out of 10 could not be peeled off.
(6) Adhesion Property
After a first adherend (38g) described later was fixed using the pressure-sensitive adhesive tape having a length of 120mm × a width of 20mm obtained in examples and comparative examples, adhesiveness of the pressure-sensitive adhesive tape was evaluated. Specifically, an adhesive tape having a length of 120mm × a width of 20mm was prepared, and the adhesive tape was attached to a stainless steel plate (thickness 1.5mm, length 150mm, width 50mm, weight 85g) with a portion having a length of 20mm on the tip side exposed as a handle portion. After 1 hour, the bonded test piece was allowed to freely fall from a height of 1.5m onto a concrete slab at 23 ℃ to evaluate whether or not the first adherend was detached from the second adherend.
The dropping manner is such that a stainless steel plane is dropped on a concrete slab.
Very good: none of 10 out of 10 peeled off.
Good: 8-9 of the 10 are not peeled.
X: peeling 1-7 of 10.
Next, the materials used in examples and comparative examples are as follows.
[ first adherend ]
The first adherend used a battery obtained by the following method.
First, a battery packaging film for packaging a battery was obtained by the following method. A resin film a was produced by extruding a polyethylene terephthalate resin and nylon 6 by a T-die method to produce a coextruded film, biaxially stretching the film in MD and TD by a sequential stretching method, and then heat treating the film at 200 ℃. The draw ratio was set to 3.4 times in the flow direction (MD) and 3.8 times in the width direction (TD). The laminated structure of the resin film A was polyethylene terephthalate (5 μm)/nylon 6(20 μm).
Next, the glass transition temperature of 0 ℃ and the weight average molecular weight of 20X 10 were used3Polyol compound having a hydroxyl equivalent of 1.2 per molAn aromatic isocyanate containing Tolylene Diisocyanate (TDI) as a main component and Trimethylolpropane (TMP) adduct as a main component, wherein the molar ratio of the aromatic isocyanate to the Tolylene Diisocyanate (TDI) is 1: 3, and an aluminum foil of 20 μm (8021 type, tensile breaking strength 100MPa, tensile breaking elongation 10%, 0.2% proof stress 70MPa) was laminated with the resin film a. The thickness of the adhesive was 3 μm. The polyethylene terephthalate resin layer is positioned on the opposite side of the base material layer from the sealant layer.
Further, a 2-layer coextruded film composed of an adhesive layer and a sealant layer was prepared by coextruding an acid-modified polypropylene resin (unsaturated carboxylic acid graft-modified random polypropylene obtained by graft modification with an unsaturated carboxylic acid) constituting the adhesive layer and a polypropylene (random copolymer) constituting the sealant layer. Next, the adhesive layer of the 2-layer co-extruded film prepared above was stacked so as to be in contact with the metal layer of the laminate composed of the base layer (resin film a)/adhesive layer (urethane resin adhesive)/metal layer (aluminum foil) prepared above, and the laminate was heated to 120 ℃ and thermally laminated to obtain a laminate in which the base layer/adhesive layer/metal layer/adhesive layer/sealant layer were sequentially stacked. The obtained laminate was once cooled, heated to 180 ℃ and maintained at this temperature for 1 minute, and subjected to heat treatment, thereby obtaining a battery packaging film.
Next, the obtained battery packaging film is cut into a predetermined shape, and battery elements such as a positive electrode, a negative electrode, and an electrolyte are packaged. The packed battery had a flat plate shape with a thickness of 5mm, a length of 100mm and a width of 50 mm. The mass of the obtained battery was 38 g.
[ second adherend ]
As the second adherend, a stainless steel plate having a thickness of 1.5mm, a length of 150mm, a width of 50mm and a weight of 85g was used.
[ substrate layer ]
Substrate layer S-1:
as the resin composition of the base layer, a mixture of a styrene-isoprene copolymer and a styrene-isoprene-styrene copolymer (hereinafter, sometimes referred to as "SIS") was used, and the structural unit derived from styrene represented by the following chemical formula (1) was 25 mass%, and the proportion of the styrene-isoprene copolymer to the total amount of the resin composition (1) was 17 mass%. Next, toluene was added to the obtained resin composition, and the resulting mixture was stirred so as to be uniform, and applied to a release liner (FILM BYNA 75E-0010GT, manufactured by tenison industries, ltd., same shall apply hereinafter) with an applicator so that the thickness after drying became 50 μm, and dried at 60 ℃ for 5 minutes, thereby producing a base layer S-1. The thickness of the resulting base layer was 50 μm, the elongation at break was 1150%, and the breaking strength was 18.6 MPa.
[ chemical formula 3 ]
Substrate layer S-2:
the base layer S-2 was prepared in the same manner as the base layer S-1 except that an ester-based urethane compound (mobilon film MF100T, manufactured by Nisshinbo Textile) was used as the resin composition of the base layer and the thickness after drying was 100 μm. The thickness of the substrate layer S-2 was 100. mu.m, the elongation at break was 720%, and the breaking strength was 33.0 MPa.
Substrate layer S-3:
polyethylene terephthalate (manufactured by Toray corporation, Lumiror S10#25) was used for the production of a film. The thickness was 25 μm, the elongation at break was 160%, and the breaking strength was 230 MPa.
[ adhesive layer ]
Adhesive layer a-1:
the adhesive of the adhesive layer is manufactured in the following manner. In a reaction vessel equipped with a stirrer, a reflux condenser, a nitrogen inlet tube, a thermometer and a dropping funnel, 75.94 parts by mass of n-butyl acrylate, 5 parts by mass of 2-ethylhexyl acrylate, 15 parts by mass of cyclohexyl acrylate, 4 parts by mass of acrylic acid, 0.06 part by mass of 4-hydroxybutyl acrylate and 200 parts by mass of ethyl acetate were charged, and the temperature was raised to 65 ℃ while blowing nitrogen gas under stirring to obtain a mixture (1). Subsequently, 4 parts by mass (solid content: 2.5% by mass) of a 2, 2' -azobisisobutyronitrile solution previously dissolved in ethyl acetate was added to the obtained mixture (1), and the mixture was maintained at 65 ℃ for 10 hours under stirring to obtain a mixture (2). Then, the mixture (2) was diluted with 98 parts by mass of ethyl acetate and filtered through a 200-mesh metal mesh to obtain an acrylic copolymer solution (1) having a mass average molecular weight of 160 ten thousand (in terms of polystyrene). Next, 5 parts by mass of a polymerized rosin ester-based tackifier resin (D-125, seikagawa chemical industries co., ltd.) and 15 parts by mass of a petroleum-based tackifier resin (FTR (registered trademark) 6125, manufactured by mitsui chemical corporation) were mixed and stirred with 100 parts by mass of the acrylic copolymer solution (1), and ethyl acetate was added thereto, thereby obtaining a resin solution (1) of a pressure-sensitive adhesive having a solid content of 31 mass%. Then, 1.3 parts by mass of a crosslinking agent (trimethylolpropane adduct of toluene diisocyanate, having an isocyanate group content of 7% by mass and a nonvolatile component of 40% by mass) was added to 100 parts by mass of the binder resin solution (1), and the mixture was stirred and mixed until uniform, and then filtered through a 100 mesh wire gauze to obtain a binder resin having a solid content of 31.1% by mass.
Next, filler 1 (aluminum hydroxide, BW153, manufactured by Nippon light Metal Co., Ltd., volume average particle diameter: 18 μm, particle size distribution (D) was added to 100 parts by mass of the solid content of the obtained binder resin (1)90/D10): 12.3)30 parts by mass to obtain adhesive (1).
The particle size distribution (D) of the filler particles90/D10) The particle size of the filler particles is measured by a measuring instrument (Microtrac) using a laser diffraction scattering method and converted into a particle size distribution.
Then, the pressure-sensitive adhesive layer A-1 was prepared by applying the pressure-sensitive adhesive (1) to a release liner (FILM BYNA 75E-0010GT, manufactured by Tanshen industries, Ltd., the same applies hereinafter) by a stripe coating method using a die coater so that the thickness after drying became 50 μm, and drying at 80 ℃ for 3 minutes. At this time, as shown in FIG. 1, a non-adhesive part having a width of 10mm was produced without applying an adhesive.
Adhesive layer a-2:
an adhesive layer a-2 was produced in the same manner as the adhesive layer a-1 except that the width of the non-adhesive portion was set to 5 mm.
Adhesive layer a-3:
the pressure-sensitive adhesive layer a-3 was produced in the same manner as the pressure-sensitive adhesive layer a-1 except that the pressure-sensitive adhesive (1) was applied to a release liner with an applicator so that the thickness after drying became 25 μm.
Adhesive layer a-4:
adhesive (2) was obtained in the same manner as in adhesive (1) except that adhesive 1 contained no filler, and then adhesive layer a-4 was prepared in the same manner as in adhesive layer a-1.
Adhesive layer a-5:
the pressure-sensitive adhesive layer a-3 was produced in the same manner as the pressure-sensitive adhesive layer a-1 except that the pressure-sensitive adhesive (1) was applied to a release liner with an applicator so that the thickness after drying became 10 μm.
Adhesive layer a-6:
the adhesive (1) was applied to a release liner with an applicator so that the thickness after drying became 50 μm, and dried at 80 ℃ for 3 minutes to prepare an adhesive layer a-6 as an adhesive layer having no adhesive portion.
Next, examples and comparative examples will be described.
[ examples 1 to 6, comparative examples 1 and 2 ]
The pressure-sensitive adhesive layer and the base layer thus prepared were used in combination as shown in table 1, to prepare a rectangular pressure-sensitive adhesive tape as shown in fig. 3. Specifically, the release liner of the base material layer was peeled off, and then the pressure-sensitive adhesive layers formed on the release liner were bonded to both surfaces of the base material layer, and laminated under pressure of 0.2MPa to prepare the pressure-sensitive adhesive tape. The obtained adhesive tape had a total thickness of 200 μm, a length of 120mm, a width of 20mm, and a length of a grip portion at an end of the adhesive tape (a length measured in a longitudinal direction of the adhesive tape) of 20 mm.
The above evaluation was performed on each of the obtained adhesive tapes, and the results are shown in table 1.
[ TABLE 1 ]
As shown in table 1, the pressure-sensitive adhesive tapes of examples 1 to 6 having an adhesive-free portion on at least one surface of 1 end portion side of the pressure-sensitive adhesive tape, a substrate layer having an elongation at break of 200 to 3000%, and a breaking strength of 1.5 to 80MPa can reduce a load on the pressure-sensitive adhesive tape and prevent tearing even when the pressure-sensitive adhesive tape is peeled off at an angle to the sticking surface. Further, as is clear from comparison of examples 1 and 4, the adhesive of the adhesive layer contains a filler, and the adhesive tape can be more easily peeled.
On the other hand, as shown in table 1, in the adhesive tape of comparative example 1 having no adhesive part, when the adhesive tape was peeled off at an angle to the sticking surface, the load at the time of starting the elongation of the adhesive tape was large, and the adhesive tape was torn. In addition, in the pressure-sensitive adhesive tape of comparative example 2 in which the elongation at break and the strength at break of the base layer were out of the predetermined ranges, when the pressure-sensitive adhesive tape was peeled off at an angle to the sticking surface, the pressure-sensitive adhesive tape did not stretch, and the load was concentrated in a part thereof, and thus the tape was torn.
Industrial applicability
According to the present invention, a laminated film, an adhesive tape, and an adhesive body can be provided, in which even when the adhesive tape is peeled off at an angle to an attachment surface, a load on the adhesive tape can be reduced and tearing can be prevented.
Description of the reference numerals
1: laminated film
2: glue-free part
3: dotted line
4: adhesive layer
11: adhesive tape
12: glue-free part
13: substrate layer
14: adhesive layer
15: film
16: first adherend
17: second adherend
18: corner
20: battery with a battery cell
21: frame body
22: adhesive tape
23: and (4) an angle.
Claims (6)
1. A laminated film comprising a base material layer and adhesive layers on both surfaces of the base material layer,
having a glue-free portion on at least one side surface of the laminate film in which the adhesive layer is not present,
the elongation at break of the base material layer is 200-3000%, and the breaking strength is 1.5-80 MPa.
2. The laminate film according to claim 1, wherein,
the adhesive of the adhesive layer contains a filler.
3. An adhesive tape comprising a base material layer and adhesive layers on both surfaces of the base material layer,
having a non-adhesive portion on at least one side surface of 1 end portion side of the adhesive tape where the adhesive layer is not present,
the elongation at break of the base material layer is 200-3000%, and the breaking strength is 1.5-80 MPa.
4. The adhesive tape according to claim 3,
the length of the adhesive-free part measured along the longitudinal direction of the adhesive tape is 0.5mm to 100 mm.
5. The adhesive tape according to claim 3 or 4,
the adhesive of the adhesive layer contains a filler.
6. An adhesive body, comprising:
the adhesive tape according to any one of claims 3 to 5,
A first adherend attached to one surface of the adhesive tape, and
a second adherend attached to the other side surface of the adhesive tape,
a portion of the pressure-sensitive adhesive tape on an end portion side with respect to the adhesive-free portion is located outside a first sticking surface of a first adherend to which the pressure-sensitive adhesive tape is stuck,
and the angle for defining the first attaching surface is positioned on the glue-free part.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-039054 | 2019-03-04 | ||
| JP2019039054 | 2019-03-04 | ||
| PCT/JP2020/006759 WO2020179465A1 (en) | 2019-03-04 | 2020-02-20 | Lamination film, adhesive tape, and adhesion body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113490595A true CN113490595A (en) | 2021-10-08 |
Family
ID=72338551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080016925.9A Pending CN113490595A (en) | 2019-03-04 | 2020-02-20 | Laminated film, adhesive tape, and adhesive body |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6933305B2 (en) |
| KR (1) | KR20210135230A (en) |
| CN (1) | CN113490595A (en) |
| WO (1) | WO2020179465A1 (en) |
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2020
- 2020-02-20 KR KR1020217026979A patent/KR20210135230A/en unknown
- 2020-02-20 CN CN202080016925.9A patent/CN113490595A/en active Pending
- 2020-02-20 JP JP2020537035A patent/JP6933305B2/en active Active
- 2020-02-20 WO PCT/JP2020/006759 patent/WO2020179465A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1454247A (en) * | 2000-07-06 | 2003-11-05 | 3M创新有限公司 | Stretch releasing pressure sensitive adhesive tapes and articles |
| CN2933856Y (en) * | 2005-09-16 | 2007-08-15 | 3M创新有限公司 | Pad supplementary pasting structure |
| JP2017226757A (en) * | 2016-06-22 | 2017-12-28 | Dic株式会社 | Adhesive tape, manufacturing method thereof, article, and portable electronic terminal |
| CN109790435A (en) * | 2016-09-30 | 2019-05-21 | 德莎欧洲股份公司 | Can heat cure adhesive and the adhesive strip that is produced from it |
| CN207618737U (en) * | 2017-12-20 | 2018-07-17 | 佳利士江苏新材料科技有限公司 | A kind of crosscutting edge is without glue and paper self-adhesive tape easy to use |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6933305B2 (en) | 2021-09-08 |
| JPWO2020179465A1 (en) | 2021-03-25 |
| KR20210135230A (en) | 2021-11-12 |
| WO2020179465A1 (en) | 2020-09-10 |
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